Free-form surface complex micro-nano structure coupling light beam in-situ preparation device and method

Abstract

The invention belongs to the technical field of precise non-traditional machining, discloses a free-form surface complex micro-nano structure coupling light beam in-situ preparation device and method, and solves the problems of single machining structure, low efficiency, many defects and poor finished product quality when a microstructure is machined by conventional laser at present. The device comprises a control module, a laser module, a CCD (Charge Coupled Device) monitoring module, a multi-axis numerical control module and a supporting module, the supporting module supports the control module, the laser module, the CCD monitoring module and the multi-axis numerical control module. The control module controls the laser module and the multi-axis numerical control module, and surface information of a workpiece to be machined is monitored through the CCD monitoring module. According to the invention, nanosecond laser and femtosecond laser are coupled together through an optical element to form a light beam coupling cavity, so that in-situ processing of a multistage micro-nano structure is realized; and the two laser beams are combined with a multi-axis numerical control system, so that machining of the free-form surface is realized, repeated clamping of the workpiece is avoided, and the machining efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of precision special processing technology, and in particular to a device and method for in-situ preparation of free-form surface complex micro-nano structure coupled light beams. Background Art

[0002] With the rapid development of high-precision fields such as aerospace, medical equipment, weapons industry, and microelectronics industry, the demand for multi-level complex micro-nano structures is increasing, especially large-area complex micro-nano structures, which is difficult to achieve with traditional mechanical processing methods.

[0003] At present, the processing of large-area microstructures has disadvantages such as single size and small coverage area. How to achieve efficient and high-quality processing of large-area complex multi-level micro-nano structures on free complex surfaces is a problem that needs to be solved urgently.

[0004] As a special processing method, laser processing has the advantages of no contact, no cutting force, and small heat impact, and has significant advantages in the field of complex micro-nano structure processing. Lasers can be divided into continuous lasers, long pulse lasers, short pulse lasers, and ultrashort pulse lasers according to the laser pulse width. Under continuous laser and long pulse laser processing, the temperature of the material surface is high and has an obvious heat-affected layer, but its processing efficiency is high; under short pulse laser processing, the heat-affected layer on the material surface is small, and its processing efficiency is also high; under the action of ultrashort pulse laser, the surface temperature of the material is low during processing, so there is almost no heat-affected zone on the surface, but its processing efficiency is low. At present, there is a nanofemtosecond dual-band laser micro-hole processing method and device (CN117001184A), but the structure it processes is single and it fails to realize multi-level structure processing; a dual-beam ultrafast laser high-efficiency micro-nano processing method and device (CN 116604191 A) can only process on a plane and fails to realize the processing of a free-form surface, and it only uses ultrafast laser for processing, which has the problem of low processing efficiency.

[0005] In summary, when conventional laser processing is used to process microstructures, there are still problems such as single structure, low efficiency, many defects, and poor quality of finished products. Therefore, there is an urgent need for an efficient preparation method for complex micro-nano structures that can realize both planes and free-form surfaces. Summary of the invention

[0006] The purpose of the present invention is to provide a device and method for in-situ preparation of free-form surface complex micro-nanostructure coupled light beams, so as to solve the problems of single processing structure, low efficiency, many defects and poor quality of finished products in the current conventional laser processing of microstructures.

[0007] To achieve this object, the present invention adopts the following technical solutions:

[0008] A free-form surface complex micro-nano structure coupled light beam in-situ preparation device, the device comprises: a control module, a laser module, a CCD monitoring module, a multi-axis numerical control module and a support module; the support module respectively supports the control module, the laser module, the CCD monitoring module and the multi-axis numerical control module; the control module respectively controls the laser module and the multi-axis numerical control module, and monitors the surface information of the workpiece to be processed through the CCD monitoring module.

[0009] Preferably, the laser module comprises: a nanosecond laser, a femtosecond laser, an attenuator, a dichroic mirror, an axicon mirror, a focusing lens and a two-dimensional galvanometer; the laser light emitted by the nanosecond laser and / or femtosecond laser respectively passes through the dichroic mirror, the attenuator, the focusing lens and / or the two-dimensional galvanometer mirror, the axicon mirror, and the focusing lens to act on the surface of the workpiece to realize the processing of free-form surface multi-level complex micro-nano structures; the control module can simultaneously control the processing parameters, positions and angles of various components of the laser module to realize the focusing processing of the laser.

[0010] Preferably, the attenuator, the dichroic mirror, the axicon mirror, the focusing lens and the two-dimensional galvanometer are coupled in a beam coupling cavity.

[0011] Preferably, it also includes: a shutter, a beam expander and a reflector; the laser emitted by the nanosecond laser and / or femtosecond laser passes through the shutter and the beam expander respectively, and changes the optical path through the reflector to enter the beam coupling cavity.

[0012] Preferably, the CCD monitoring module includes a dichroic mirror, a focusing lens and a CCD camera; the laser module generates a reflection signal during the processing, which passes through the dichroic mirror and then through the focusing lens to form an image on the CCD camera, thereby realizing in-situ monitoring of the processing process.

[0013] Preferably, the support module comprises: an optical platform, an optical breadboard and a gantry; the gantry is installed on the optical platform, and the optical breadboard is fixed to the upper surface of the gantry.

[0014] Preferably, the multi-axis CNC module includes: an X-axis slide, a Y-axis slide, a Z-axis slide, an X-axis turntable and a Z-axis turntable; the X-axis slide is fixed on the optical platform, the Z-axis slide is fixed on the X-axis slide, the Y-axis slide is fixed on the Z-axis slide, the X-axis turntable is installed on the Y-axis slide, and the Z-axis turntable is installed on the X-axis turntable.

[0015] Preferably, it also includes: a shell and a dust removal module; the shell is arranged outside the device; the dust removal module has an air inlet and a dust suction port respectively installed on the shell.

[0016] A method for in-situ preparation of free-form surface complex micro-nanostructure coupled light beams, the method comprising the following steps:

[0017] Open the control module, clamp the workpiece on the Z-axis turntable, and then use the CCD camera and the X-axis slide, Y-axis slide, Z-axis slide, X-axis turntable and Z-axis turntable to adjust the position of the workpiece and complete focusing;

[0018] The control module is used to adjust the laser parameters of the nanosecond laser to determine the processing path of the workpiece microstructure. The control module simultaneously controls the switch of the nanosecond laser and the movement of the X-axis slide, the Y-axis slide, the Z-axis slide, the X-axis turntable, and the Z-axis turntable. The nanosecond laser is used to quickly prepare the microstructure of the workpiece free-form surface, and the nanosecond laser is turned off after the preparation is completed.

[0019] The control module adjusts the laser parameters of the femtosecond laser to complete the focusing of the femtosecond laser and plan the processing path. The control module simultaneously controls the femtosecond laser, the two-dimensional galvanometer and the focusing lens group, and realizes the automatic focusing of the femtosecond laser through the feedback of the CCD monitoring module to complete the processing of the array nanoscale multi-level structure on the microstructure, and then turns off the femtosecond laser;

[0020] The optical devices and dust removal device are turned off, the workpiece is removed, the multi-axis mobile platform is restored to its initial position, and the control system is turned off, thus realizing the in-situ preparation method of coupled light beams for free-form surface complex micro-nanostructures.

[0021] Preferably, the nanosecond laser and the femtosecond laser can realize staggered simultaneous processing of multi-level micro-nano structures in an array.

[0022] Beneficial effects of the present invention:

[0023] 1. A method for in-situ preparation of free-form surface complex micro-nanostructures coupled with light beams is proposed to achieve efficient and high-quality processing of complex multi-level micro-nanostructures on free-form surfaces. First, the first-level microstructure is quickly prepared using a high-power nanosecond laser, and then the secondary nanoscale structure is prepared using the "cold processing" effect of the femtosecond laser, thereby achieving efficient and high-quality processing of complex micro-nanostructures. An axicon mirror is also added to the femtosecond laser to shape the beam, so that it is shaped from a Gaussian beam to a Bessel beam, realizing the processing of large aspect ratio holes, thereby achieving efficient and high-quality in-situ processing of complex multi-level micro-nanostructures.

[0024] 2. Realize in-situ preparation of free-form surface multi-level structures through coupled beams. Nanosecond laser and femtosecond laser are coupled together through optical elements to form a beam coupling cavity to realize in-situ processing of multi-level microstructures; and the two laser beams are combined with a multi-axis CNC module. Through the linkage between the multi-axis CNC module and each lens in the laser module, free-form surface processing is realized, avoiding multiple clamping of the workpiece and improving processing efficiency.

[0025] 3. The present invention can perform both separate processing with nanosecond laser and femtosecond laser, and can also realize simultaneous processing with both. When processing multi-level micro-nano structures of arrays, nanosecond laser and femtosecond laser can work simultaneously. While the femtosecond laser processes the multi-level structure on the microstructure formed by the nanosecond laser, the nanosecond laser processes another new microstructure with a dislocation.

[0026] 4. Widely adaptable. The device can be used for processing workpieces of various materials and structures; at the same time, the device can also realize the processing of micro grooves, micro holes and multi-level structures on planes or free-form surfaces. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0028] Figure 1 It is a schematic diagram of the structure of the free-form surface complex micro-nano structure coupled light beam in-situ preparation device of the present invention;

[0029] Figure 2 It is a schematic diagram of the structure of the beam coupling cavity of the free-form surface complex micro-nano structure coupled beam in-situ preparation device of the present invention;

[0030] Figure 3 It is a light path diagram of the device for in-situ preparation of free-form surface complex micro-nanostructure coupled light beams of the present invention.

[0031] In the figure: 1. optical platform, 2. gantry, 3. optical breadboard, 4. housing, 5. beam coupling cavity, 6. dust removal module, 7. slide in the X-axis direction, 8. slide in the Z-axis direction, 9. slide in the Y-axis direction, 10. turntable around the X-axis, 11. turntable around the Z-axis, 12. nanosecond laser, 13. first shutter, 14. first beam expander, 15. first reflector, 16. femtosecond laser, 17. second shutter, 18. second beam expander, 19. first dichroic mirror, 20. second reflector, 21. first attenuator, 22. second attenuator, 23. second dichroic mirror, 24. first focusing lens, 25. air blowing, 26. two-dimensional galvanometer, 27. axicon, 28. focusing lens group, 29. LED light, 30. second focusing lens, 31. CCD camera. DETAILED DESCRIPTION

[0032] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the present invention, rather than to limit the present invention. It should also be noted that, for ease of description, only parts related to the present invention, rather than all structures, are shown in the accompanying drawings.

[0033] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0035] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplification of operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operate in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0036] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0037] The present invention provides a free-form surface complex micro-nano structure coupled light beam in-situ preparation device, the device comprises: a control module, a laser module, a CCD monitoring module, a multi-axis numerical control module and a support module; the support module respectively supports the control module, the laser module, the CCD monitoring module and the multi-axis numerical control module; the control module respectively controls the laser module and the multi-axis numerical control module, and monitors the reflection signal of the workpiece to be processed through the CCD monitoring module.

[0038] like Figure 1 As shown, the support module includes: an optical platform 1, a gantry 2 and an optical breadboard 3; the gantry 2 is installed on the optical platform 1, and the optical breadboard 3 is fixed on the upper surface of the gantry 2.

[0039] The multi-axis CNC module includes: an X-axis slide 7, a Z-axis slide 8, a Y-axis slide 9, an X-axis turntable 10 and a Z-axis turntable 11; the X-axis slide 7 is fixed on the optical platform 1, the Z-axis slide 8 is fixed on the X-axis slide 7, the Y-axis slide 9 is fixed on the Z-axis slide 8, the X-axis turntable 10 is installed on the Y-axis slide 9, the Z-axis turntable 11 is installed on the X-axis turntable 10, and the workpiece is installed on the table of the Z-axis turntable 11.

[0040] The laser module is arranged on the optical breadboard 3, wherein the laser module comprises: a nanosecond laser 12, a first shutter 13, a first beam expander 14, a first reflector 15, a femtosecond laser 16, a second shutter 17, a second beam expander 18, a first dichroic mirror 19, a second reflector 20, a first attenuator 21, a second attenuator 22, a first focusing lens 24, an air blower 25, a two-dimensional galvanometer 26, an axicon 27 and a focusing lens group 28; the laser light emitted by the nanosecond laser 12 passes through the opened first shutter 13, the beam quality is enhanced by the first beam expander 14, the propagation direction is changed by reflection through the first reflector 15, the propagation direction is changed by reflection through the first dichroic mirror 19, the propagation direction is changed by reflection through the second reflector 20, and then the laser light is processed on the surface of the workpiece by adjusting the laser intensity through the first attenuator 21 and focusing through the first focusing lens 24, and the air blower 25 blows air towards the laser processing position to blow away the debris remaining on the surface. The laser light emitted by the femtosecond laser 16 passes through the opened second shutter 17, and the beam quality is enhanced by the second beam expander 18. After being reflected by the first dichroic mirror 19 and the second reflector 20 to change the propagation direction, the laser intensity is adjusted by the second attenuator 22, and the laser light is shaped by the two-dimensional galvanometer 26 and then by the axicon 27, and then focused by a focusing lens group 28 to form a Bessel beam, and then the laser acts on the surface of the workpiece for processing.

[0041] In this embodiment, the first dichroic mirror 19, the second reflector 20, the first attenuator 21, the second attenuator 22, the first focusing lens 24, the two-dimensional galvanometer 26, the axicon 27 and the focusing lens group 28 are coupled to the beam coupling cavity 5. The emitted laser enters from the input port of the beam coupling cavity 5, passes through the above-mentioned optical elements, and is output from the output port of the coupling cavity, acting on the surface of the workpiece to realize efficient and high-quality processing of free-form surface multi-level complex micro-nano structures.

[0042] The control module controls the multi-axis CNC module to realize multi-axis linkage, and at the same time controls the processing parameters and angles of each component of the laser module to realize laser focusing processing. By controlling the position of the first focusing lens 24 and the focusing lens group 28, nanosecond laser and / or femtosecond laser processing of free-form surface multi-level complex micro-nano structures is realized.

[0043] The CCD monitoring module includes: a second dichroic mirror 23, an LED lamp 29, a second focusing lens 30 and a CCD camera 31; a reflection signal is generated during the laser module processing, which is reflected by the second dichroic mirror 23, enhanced by the LED lamp 29, and then imaged on the CCD camera through the second focusing lens 30, thereby realizing in-situ monitoring of the processing process.

[0044] In this embodiment, it also includes: a shell 4 and a dust removal module 6; the shell 4 is arranged outside the device; the dust removal module 6 has two air holes, an air inlet and an air outlet, and the two air holes are respectively installed on the shell 4 to form a stable airflow to achieve the purpose of dust removal.

[0045] A method for in-situ preparation of free-form surface complex micro-nanostructure coupled light beams, the method comprising the following steps:

[0046] Open the control module, clamp the workpiece on the Z-axis turntable 11, and then use the CCD camera 31 and the X-axis direction slide 7, the Z-axis direction slide 8, the Y-axis direction slide 9, the X-axis turntable 10 and the Z-axis turntable 11 to adjust the position of the workpiece and complete the focusing;

[0047] The control module is used to adjust the pulse energy, laser wavelength, pulse width and pulse period laser parameters of the nanosecond laser 12, and the real-time matching position of the first focusing lens 24 is set according to the processing path of the workpiece microstructure. The control module simultaneously controls the switch of the nanosecond laser 12 and the first shutter 13, as well as the movement of the X-axis slide 7, the Y-axis slide 9, the Z-axis slide 8, the X-axis turntable 10 and the Z-axis turntable 11, and the nanosecond laser is used to quickly prepare the microstructure of the workpiece free surface, and the nanosecond laser 12 is turned off after the preparation is completed;

[0048] The control module adjusts the pulse energy, laser wavelength, pulse width and pulse period laser parameters of the femtosecond laser 16 to complete the focusing of the femtosecond laser and plan the processing path. The control module simultaneously controls the switch of the femtosecond laser 16, the real-time matching positions of the two-dimensional galvanometer 26 and the focusing lens group 28, and realizes automatic focusing through the feedback of the CCD monitoring module to complete the processing of the nanoscale multi-level structure on the microstructure, and then turns off the femtosecond laser 16;

[0049] The optical devices and the dust removal module 6 are turned off, the workpiece is removed, the multi-axis numerical control module is restored to its initial position, and the control module is turned off, thereby realizing the in-situ preparation method of free-form surface complex micro-nanostructure coupled light beam.

[0050] Among them, the nanosecond laser 12 and the femtosecond laser 16 can process the workpiece at the same time. After the nanosecond laser is used to quickly prepare the microstructure on the free-form surface of the workpiece, the nanosecond laser is not turned off, only the first shutter 13 is turned off, and then the multi-axis numerical control module is controlled to move the processed microstructure to the femtosecond laser spot, and then the control module simultaneously controls the nanosecond laser 12, the multi-axis numerical control module, the femtosecond laser 16, the two-dimensional galvanometer 26 and the focusing lens group 28. While the femtosecond laser 16 processes the nanoscale multi-level structure on the processed microstructure, the nanosecond laser 12 processes the new microstructure at another place, thereby realizing the simultaneous processing of the nanosecond laser and the femtosecond laser.

[0051] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. For those skilled in the art, various obvious changes, readjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to list all the embodiments here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the claims of the present invention.

Claims

1. A device for in-situ preparation of free-form surface complex micro-nanostructure coupled light beams, characterized in that: The device comprises: a control module, a laser module, a CCD monitoring module, a multi-axis numerical control module and a supporting module; the supporting module respectively supports the control module, the laser module, the CCD monitoring module and the multi-axis numerical control module; the control module respectively controls the laser module and the multi-axis numerical control module, and monitors the surface information of the workpiece to be processed through the CCD monitoring module.

2. The free-form surface complex micro-nanostructure coupled light beam in-situ preparation device according to claim 1, characterized in that: The laser module comprises: a nanosecond laser, a femtosecond laser, an attenuator, a dichroic mirror, an axicon mirror, a focusing lens and a two-dimensional galvanometer mirror; the laser light emitted by the nanosecond laser and / or the femtosecond laser respectively passes through the dichroic mirror, the attenuator, the focusing lens and / or the two-dimensional galvanometer mirror, the axicon mirror and the focusing lens to act on the surface of the workpiece to realize the processing of free-form surface multi-level complex micro-nano structures; the control module can simultaneously control the processing parameters, positions and angles of various components of the laser module to realize the focusing processing of the laser.

3. The free-form surface complex micro-nanostructure coupled light beam in-situ preparation device according to claim 2, characterized in that: The attenuator, the dichroic mirror, the axicon mirror, the focusing lens and the two-dimensional galvanometer are coupled in a beam coupling cavity to realize in-situ processing of multi-level micro-nano structures.

4. The free-form surface complex micro-nanostructure coupled light beam in-situ preparation device according to claim 2, characterized in that: Also includes: Shutter, beam expander and reflector; the laser emitted by the nanosecond laser and / or femtosecond laser passes through the shutter and beam expander respectively, and changes the optical path through the reflector to enter the beam coupling cavity.

5. The free-form surface complex micro-nanostructure coupled light beam in-situ preparation device according to claim 1, characterized in that: The CCD monitoring module includes a dichroic mirror, a focusing lens and a CCD camera; the laser module generates a reflection signal during the processing, which passes through the dichroic mirror and then through the focusing lens to form an image on the CCD camera, thereby realizing in-situ monitoring of the processing process.

6. The free-form surface complex micro-nanostructure coupled light beam in-situ preparation device according to claim 1, characterized in that: The support module comprises: an optical platform, an optical breadboard and a gantry; the gantry is installed on the optical platform, and the optical breadboard is fixed on the upper surface of the gantry.

7. The free-form surface complex micro-nanostructure coupled light beam in-situ preparation device according to claim 1, characterized in that: The multi-axis CNC module includes: an X-axis slide, a Y-axis slide, a Z-axis slide, an X-axis turntable and a Z-axis turntable; the X-axis slide is fixed on the optical platform, the Z-axis slide is fixed on the X-axis slide, the Y-axis slide is fixed on the Z-axis slide, the X-axis turntable is installed on the Y-axis slide, and the Z-axis turntable is installed on the X-axis turntable.

8. The free-form surface complex micro-nanostructure coupled light beam in-situ preparation device according to claim 1, characterized in that: Also includes: A shell and a dust removal module; the shell is arranged outside the device; the dust removal module has an air inlet and a dust suction port respectively installed on the shell.

9. A method for in-situ preparation of free-form surface complex micro-nanostructure coupled light beams, according to the device for in-situ preparation of free-form surface complex micro-nanostructure coupled light beams according to any one of claims 1 to 8, characterized in that: The method comprises the following steps: Open the control module, clamp the workpiece on the Z-axis turntable, and then use the CCD camera and the X-axis slide, Y-axis slide, Z-axis slide, X-axis turntable and Z-axis turntable to adjust the position of the workpiece and complete focusing; The control module is used to adjust the laser parameters of the nanosecond laser to determine the processing path of the workpiece microstructure. The control module simultaneously controls the switch of the nanosecond laser and the movement of the X-axis slide, the Y-axis slide, the Z-axis slide, the X-axis turntable, and the Z-axis turntable. The nanosecond laser is used to quickly prepare the microstructure of the workpiece free-form surface, and the nanosecond laser is turned off after the preparation is completed. The control module adjusts the laser parameters of the femtosecond laser to complete the focusing of the femtosecond laser and plan the processing path. The control module simultaneously controls the femtosecond laser, the two-dimensional galvanometer and the focusing lens group, realizes automatic focusing through the feedback of the CCD monitoring module, completes the processing of the array nanoscale multi-level structure on the microstructure, and then turns off the femtosecond laser; The optical devices and dust removal device are turned off, the workpiece is removed, the multi-axis mobile platform is restored to its initial position, and the control system is turned off, thus realizing the in-situ preparation method of coupled light beams for free-form surface complex micro-nanostructures.

10. The method for in-situ preparation of free-form surface complex micro-nanostructure coupled light beam according to claim 9, characterized in that: The nanosecond laser and the femtosecond laser can realize staggered simultaneous processing of array multi-level micro-nano structures.

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