Chuck assembly with pressure ring and probe station

Abstract

The present application provides a chuck assembly and a probe station with a pressure ring. The chuck assembly includes a housing, a light-transmitting bearing plate, a light source, and a pressure ring. The housing is surrounded to form a receiving space. The light-transmitting bearing plate is arranged in the receiving space. The light-transmitting bearing plate has a bearing surface for carrying a wafer to be tested. The light source is arranged in the receiving space and is arranged on the side of the light-transmitting bearing plate away from the bearing surface. The light source is used to emit light, and the light emitted by the light source is projected to the wafer to be tested through the light-transmitting bearing plate. The pressure ring is fixed to the end face of the housing, and the pressure ring is used to hold the wafer to be tested to fix the wafer to be tested on the bearing surface. When it is necessary to carry and fix the wafer to be tested, the wafer to be tested is first placed on the bearing surface, and then the pressure ring is fixed to the housing and holds the wafer to be tested. The pressure ring can apply downward pressure to the wafer to be tested, and the wafer to be tested is pressed tightly onto the bearing surface. The wafer to be tested can be firmly fixed to the bearing surface, thereby improving the fixing performance of the chuck assembly to the wafer to be tested and reducing the probability of the wafer to be tested falling and being damaged.

Description

Technical Field

[0001] The present application belongs to the field of wafer detection technology, and specifically relates to a chuck assembly with a pressure ring and a probe station. Background Art

[0002] Probe stations are widely used in the semiconductor industry, optoelectronics industry, integrated circuit and packaging testing. In the probe station, the chuck assembly is used to carry and fix the wafer to be tested so as to facilitate the testing of the wafer to be tested. For wafers to be tested that require a special test environment, such as photosensitive chips, they need to be tested under a lighting environment. However, when the warping of the wafer to be tested is severe, it is not easy to fix the wafer to be tested on the chuck assembly, causing the wafer to be tested to fall and be damaged. Summary of the invention

[0003] In view of this, the first aspect of the present application provides a chuck assembly with a pressure ring, the chuck assembly comprising:

[0004] A shell is enclosed to form a receiving space;

[0005] A light-transmitting carrier plate is disposed in the receiving space, and the light-transmitting carrier plate has a carrying surface for carrying the wafer to be tested;

[0006] A light source is disposed in the receiving space and on a side of the light-transmitting carrier plate away from the carrier surface, the light source is used to emit light, and the light emitted by the light source passes through the light-transmitting carrier plate to the wafer to be tested; and

[0007] A pressure ring is fixed to the end surface of the shell, and the pressure ring is used to hold the wafer to be tested so as to fix the wafer to be tested on the carrying surface.

[0008] Wherein, a first vacuum groove is provided on the surface of the pressure ring facing the shell, and the first vacuum groove is used to form a negative pressure environment so that the pressure ring is fixed to the shell;

[0009] The inner circumference of the pressure ring is provided with a receiving groove, which is closer to the wafer to be tested than the first vacuum groove. The receiving groove is used to receive the edge of the wafer to be tested so that the edge of the wafer to be tested is clamped between the pressure ring and the shell.

[0010] The chuck assembly further comprises a mounting member disposed on the outer peripheral side of the housing, the mounting member is detachably connected to the pressure ring, the pressure ring is further provided with a first air hole connected to the first vacuum groove, the mounting member is provided with a second air hole, and the second air hole is connected to the first air hole;

[0011] The chuck assembly further includes a suction member for sucking gas in the first vacuum groove, and the suction member is connected to the first air hole and / or the second air hole.

[0012] The extension directions of the first air hole and the second air hole are perpendicular to each other, and there are two suction pieces, one of which is connected to the end of the first air hole away from the first vacuum groove, and the other suction piece is connected to the end of the second air hole away from the first air hole.

[0013] Wherein, a second vacuum groove is provided on the end surface of the shell, the second vacuum groove is adjacent to the light-transmitting supporting plate and is arranged corresponding to the edge of the wafer to be tested, and the second vacuum groove is used to form a negative pressure environment and adsorb and fix the wafer to be tested.

[0014] A first positioning groove is provided on the surface of the pressure ring facing the shell, and a second positioning groove is provided on the end surface of the shell. The first positioning groove corresponds to the second positioning groove, and both the first positioning groove and the second positioning groove are used to accommodate positioning pins.

[0015] Wherein, the chuck assembly further comprises a vacuum sensor and a controller which are electrically connected, the vacuum sensor is used to obtain a first vacuum degree of the first vacuum groove, and the controller is used to adjust a suction parameter of a suction member connected to the first vacuum groove;

[0016] When the first vacuum degree is less than a preset vacuum degree, the controller adjusts a suction parameter of the suction member sucking the first vacuum groove to increase the first vacuum degree to a second vacuum degree greater than or equal to the preset vacuum degree.

[0017] Wherein, the first vacuum groove includes a first sub-groove arranged on one side of the pressure ring, and a second sub-groove arranged on the other side of the pressure ring, and the first sub-groove is arranged opposite to the second sub-groove; the chuck assembly also includes a pressure sensor and a controller electrically connected, the pressure sensor is used to obtain the pressure value of the pressure ring on the wafer to be tested, the pressure value includes a first pressure value of one side of the pressure ring on the wafer to be tested, and a second pressure value of the other side of the pressure ring on the wafer to be tested, and the controller is used to adjust the suction parameters of the suction member connecting the first sub-groove and the second sub-groove;

[0018] When the absolute value of the difference between the first pressure value and the second pressure value is not within a preset range, the controller adjusts the suction parameters of the suction member to suck the first sub-groove and / or the second sub-groove to compensate for the pressure value of the pressure ring on the wafer to be tested, and adjusts the first pressure value and / or the second pressure value so that the absolute value of the difference between the first pressure value and the second pressure value is within a preset range.

[0019] When the absolute value of the difference between the first pressure value and the second pressure value is not within a preset range, the controller satisfies the following conditions:

[0020] If the first pressure value is greater than the second pressure value, the controller adjusts the suction parameters of the suction member on the second sub-groove to increase the second pressure value, so that the absolute value of the difference between the first pressure value and the second pressure value is within a preset range;

[0021] And / or, if the first pressure value is less than the second pressure value, the controller adjusts the suction parameters of the suction member on the first sub-groove to increase the first pressure value, so that the absolute value of the difference between the first pressure value and the second pressure value is within a preset range.

[0022] A second aspect of the present application provides a probe station, which includes a chuck assembly and a detection probe as provided in the first aspect of the present application, wherein the detection probe is used to detect the wafer to be tested on the chuck assembly.

[0023] The present application provides a chuck assembly and a probe station, wherein the chuck assembly is composed of a shell, a light-transmitting bearing plate, a light source, and a pressure ring. When it is necessary to carry and fix the wafer to be tested, the wafer to be tested is first placed on the bearing surface, and then the pressure ring is fixed to the shell and against the wafer to be tested. The pressure ring can apply downward pressure to the wafer to be tested, thereby pressing the wafer to be tested tightly onto the bearing surface, and can firmly fix the wafer to be tested on the bearing surface, thereby improving the fixing performance of the chuck assembly on the wafer to be tested and reducing the probability of the wafer to be tested falling and being damaged.

[0024] In addition, during detection, the light source passes through the light-transmitting carrier plate, and the light from the light source is irradiated onto the wafer to be tested placed on the carrier surface. By setting the light source on the chuck assembly, the backlight structure that needs to be additionally set up in the related technology is omitted, thereby simplifying the structure of the probe station and reducing the preparation cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the implementation modes of the present application, the drawings required for use in the implementation modes of the present application will be described below.

[0026] Figure 1 A schematic structural diagram of a chuck assembly provided in one embodiment of the present application.

[0027] Figure 2 This is a schematic diagram of the structure in which the pressure ring provided in one embodiment of the present application is not fixed to the shell.

[0028] Figure 3 A schematic diagram of the structure of a pressure ring provided in one embodiment of the present application.

[0029] Figure 4 A top view of a chuck assembly provided in accordance with one embodiment of the present application.

[0030] Figure 5 for Figure 4A cross-sectional view of the chuck assembly along section line AA.

[0031] Figure 6 for Figure 5 A partial enlarged view of .

[0032] Figure 7 for Figure 4 A cross-sectional view of the chuck assembly along section line BB.

[0033] Figure 8 for Figure 7 A partial enlarged view of .

[0034] Fig. 9 for Figure 4 A cross-sectional view of the chuck assembly along section line CC.

[0035] Fig.10 for Fig. 9 A partial enlarged view of .

[0036] Fig.11 A schematic structural diagram of a pressure ring provided in another embodiment of the present application.

[0037] Explanation of reference numerals: chuck assembly 1, shell 10, second vacuum groove 101, second positioning groove 102, light-transmitting bearing plate 11, bearing surface 111, light source 12, pressure ring 13, first sub-ring 13a, second sub-ring 13b, connecting rod 13c, first vacuum groove 131, first sub-groove 1311, second sub-groove 1312, accommodating groove 132, first air hole 133, first positioning groove 134, card groove 135, pressing portion 136, connecting portion 137, mounting member 14, second air hole 141, suction member 15, positioning pin 16, support plate 17, wafer 2 to be tested. DETAILED DESCRIPTION

[0038] The following are preferred implementations of the present application. It should be noted that, for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application, and these improvements and modifications are also considered to be within the scope of protection of the present application.

[0039] Unless otherwise specified or there is a contradiction, the terms and phrases used in this application have the following meanings:

[0040] In this application, "first", "second", etc. are used only for descriptive purposes and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features.

[0041] In this application, "one or several" refers to any one, any two or more of the listed items. Among them, "several" refers to any two or more of the listed items.

[0042] In the present application, it is necessary to understand that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0043] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated. It can be mechanically connected or electrically connected. It can be directly connected or indirectly connected through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0044] Please refer to Figure 1-Figure 5 The present embodiment provides a chuck assembly 1 with a pressure ring 13, and the chuck assembly 1 includes a shell 10, a light-transmitting carrier plate 11, a light source 12, and a pressure ring 13. The shell 10 is surrounded to form a receiving space. The light-transmitting carrier plate 11 is arranged in the receiving space, and the light-transmitting carrier plate 11 has a carrying surface 111 for carrying the wafer 2 to be tested. The light source 12 is arranged in the receiving space and on the side of the light-transmitting carrier plate 11 away from the carrying surface 111, and the light source 12 is used to emit light, and the light emitted by the light source 12 is transmitted through the light-transmitting carrier plate 11 to the wafer 2 to be tested. The pressure ring 13 is fixed to the end face of the shell 10, and the pressure ring 13 is used to abut the wafer 2 to be tested so as to fix the wafer 2 to be tested on the carrying surface 111.

[0045] The chuck assembly 1 is composed of a shell 10, a light-transmitting carrier plate 11, a light source 12, and a pressure ring 13. The chuck assembly 1 is used to carry and fix the wafer 2 to be tested, so as to facilitate the detection of the wafer 2 to be tested. In addition, the chuck assembly 1 is also used to provide light so that the wafer 2 to be tested can be tested under a lighting environment. Optionally, the chuck assembly 1 also includes a support plate 17, which is fixed to the inner cavity wall of the accommodating space and is arranged on the side of the light source 12 away from the light-transmitting carrier plate 11, and the support plate 17 is used to support the light source 12. The chuck assembly 1 can be applied to testing in the semiconductor field, optoelectronic field, integrated circuit field, and packaging field. The components of the chuck assembly 1 are specifically introduced below.

[0046] The shell 10 is used to fix and support other components of the chuck assembly 1. For example, the shell 10 is annular and is surrounded to form a receiving space. The shell 10 is arranged around the light-transmitting carrier plate 11. The shell 10 and the light-transmitting carrier plate 11 can be fixed by bonding, threading, snap-fit ​​connection, etc., and the present application does not limit this. Optionally, the material of the shell 10 is Invar 4J36 (a low-expansion iron-nickel alloy). In other embodiments, the material of the shell 10 can also be other metals or polymer materials, and the present application does not limit this.

[0047] The light-transmitting carrier plate 11 is used to carry and support the wafer 2 to be tested. The light-transmitting carrier plate 11 has a carrying surface 111. When the wafer 2 to be tested needs to be carried and fixed, the wafer 2 to be tested is first placed on the carrying surface 111 so that at least part of the wafer 2 to be tested abuts against the carrying surface 111. The light-transmitting carrier plate 11 is light-transmitting, and the light emitted by the light source 12 can pass through the light-transmitting carrier plate 11 and reach the wafer 2 to be tested placed on the carrying surface 111. Optionally, the transmittance of the light-transmitting carrier plate 11 is greater than or equal to 90%. The shape of the light-transmitting carrier plate 11 matches the cavity shape of the accommodating space. For example, the shape of the light-transmitting carrier plate 11 can be circular, quasi-circular, elliptical, quasi-elliptical, etc., and the present application does not limit this.

[0048] The light source 12 is used to emit light to detect the wafer 2 to be tested. The light source 12 is arranged on the side of the light-transmitting carrier plate 11 away from the carrier surface 111. The light source 12 is fixed to the housing 10, and the light source 12 and the housing 10 can be fixed by bonding, threading, snap-on connection, etc., which are not limited in this application. The light source 12 includes but is not limited to a surface light source or a point light source. Preferably, the light source 12 is a surface light source, so that the light emitted by the light source 12 can illuminate the entire wafer 2 to be tested, so that the light brightness difference between any position, any adjacent position, or any different position of the wafer 2 to be tested is small, so as to improve the detection effect of the wafer 2 to be tested. Optionally, the light source 12 is used to emit visible light, the operating voltage of the light source 12 is 5V-24V, and the output power of the light source 12 is 10w-60w.

[0049] Optionally, the light source 12 is spaced apart from the light-transmitting carrier plate 11, and a spacing H1 between the light source 12 and the light-transmitting carrier plate 11 satisfies: 5mm≤H1≤15mm, and specific examples of the spacing H1 include 5mm, 6mm, 7mm, 8mm, 9mm, 10mm, 11mm, 12mm, 13mm, 14mm, 15mm, etc. By controlling the spacing between the light source 12 and the light-transmitting carrier plate 11, it is possible to avoid problems such as refraction and scattering of the light emitted by the light source 12, and it is also possible to ensure that the light emitted by the light source 12 to the wafer 2 to be tested is more uniform.

[0050] Optionally, the light source 12 is spaced apart from the light-transmitting carrier plate 11, and the light source 12 and the light-transmitting carrier plate 11 are surrounded to form a transmission space, and the inner cavity wall of the receiving space is provided with a suction hole, and the suction hole is connected to the transmission space; the chuck assembly 1 also includes a suction piece 15 connected to the suction hole, and the suction piece 15 is used to suck the gas in the transmission space. When it is necessary to detect the wafer 2 to be tested, the suction piece 15 is used to suck the gas in the transmission space, reduce the gas between the light source 12 and the light-transmitting carrier plate 11, make the transmission space reach a vacuum-like state, further reduce the refraction of light, and improve the detection effect of the wafer 2 to be tested.

[0051] The pressure ring 13 is used to fix the wafer. The pressure ring 13 is detachably connected to the shell 10. The pressure ring 13 and the shell 10 can be fixed by bonding, threading, snap-fitting, etc., and the present application does not limit this. When it is necessary to carry and fix the wafer 2 to be tested, the wafer 2 to be tested is first placed on the carrying surface 111, and then the pressure ring 13 is fixed to the shell 10 and supports the wafer 2 to be tested. The shape of the pressure ring 13 is annular. The shape of the pressure ring 13 matches the shape of the wafer 2 to be tested, and the shape of the pressure ring 13 matches the shape of the shell 10.

[0052] Optionally, a pressing portion 136 is convexly provided on the outer peripheral side of the pressure ring 13, and the pressing portion 136 is used to press the pressure ring 13 using the pressing portion 136. The pressing portion 136 and the pressure ring 13 are an integrated structural member. When the pressure ring 13 needs to be fixed to the housing 10, or the pressure ring 13 needs to be pressed against the wafer 2 to be tested, the user can manually press down the pressing portion 136 to apply downward pressure to the pressure ring 13, thereby improving the connection performance between the pressure ring 13 and the housing 10, and improving the fixing performance of the pressure ring 13 on the wafer 2 to be tested.

[0053] Specifically, by arranging a pressure ring 13 on the chuck assembly 1, the pressure ring 13 applies downward pressure to the wafer 2 to be tested, thereby pressing the wafer 2 to be tested tightly onto the carrying surface 111, and the wafer 2 to be tested can be firmly fixed to the carrying surface 111, thereby improving the fixing performance of the chuck assembly 1 on the wafer 2 to be tested and reducing the probability of the wafer 2 to be tested falling and being damaged.

[0054] In addition, during detection, the light source 12 passes through the light-transmitting supporting plate 11, and the light from the light source 12 is radiated onto the wafer 2 to be tested placed on the supporting surface 111. By arranging the light source 12 on the chuck assembly 1, the backlight structure that needs to be additionally arranged in the related technology is omitted, thereby simplifying the structure of the probe station and reducing the preparation cost.

[0055] Please refer to Figure 1-Figure 6 In one embodiment, a first vacuum groove 131 is provided on a surface of the pressure ring 13 facing the shell 10 , and the first vacuum groove 131 is used to form a negative pressure environment so that the pressure ring 13 is fixed to the shell 10 .

[0056] The gas in the first vacuum groove 131 can be sucked to form a negative pressure environment in the first vacuum groove 131. Optionally, the shape of the first vacuum groove 131 matches the shape of the pressure ring 13. Optionally, the shape of the first vacuum groove 131 can be annular, semi-annular, circular, rectangular, etc., and the present application does not limit this. Among them, when the first vacuum groove 131 is an annular groove, the radial dimension of the first vacuum groove 131 is greater than the radial dimension of the wafer 2 to be tested, so as to ensure that the first vacuum groove 131 is set corresponding to the end face of the shell 10.

[0057] Optionally, the number of the first vacuum grooves 131 is one or more, and the present application does not limit this. Optionally, the first vacuum grooves 131 extend along the circumferential direction of the pressure ring 13. Optionally, the first vacuum grooves 131 are arranged around the pressure ring 13. Optionally, when the number of the first vacuum grooves 131 is multiple, the multiple first vacuum grooves 131 are arranged at intervals along the circumferential direction of the pressure ring 13.

[0058] When the pressure ring 13 is fixed to the shell 10, the pressure ring 13 abuts against the end face of the shell 10, and by sucking the gas between the first vacuum groove 131 and the end face of the shell 10, the first vacuum groove 131 forms a negative pressure environment, thereby improving the fixing performance of the pressure ring 13 to the shell 10, avoiding the pressure ring 13 from moving in the horizontal direction, and further increasing the downward pressure of the pressure ring 13 on the wafer 2 to be tested, further making the wafer 2 to be tested close to the supporting surface 111, further improving the fixing performance of the chuck assembly 1 on the wafer 2 to be tested, and further reducing the probability of the wafer 2 to be tested falling and being damaged.

[0059] Optionally, the first vacuum groove 131 is spaced apart from the wafer 2 to be tested, and the spacing H2 between the first vacuum groove 131 and the wafer 2 to be tested satisfies: 2mm≤H2≤5mm, and the spacing H2 can be specifically exemplified as 2mm, 3mm, 4mm, 5mm, etc. By limiting the spacing between the first vacuum groove 131 and the wafer 2 to be tested, it can be ensured that the first vacuum groove 131 can cooperate with the end face of the shell 10 to ensure that a negative pressure environment is formed in the first vacuum groove 131, and it can also be ensured that after the first vacuum groove 131 forms a negative pressure environment, the downward pressure of the pressure ring 13 on the wafer 2 to be tested can be increased, so that the wafer 2 to be tested is tightly attached to the supporting surface 111.

[0060] The inner circumference of the pressure ring 13 is provided with a receiving groove 132 . The receiving groove 132 is closer to the wafer 2 to be tested than the first vacuum groove 131 . The receiving groove 132 is used to accommodate the edge of the wafer 2 to be tested so that the edge of the wafer 2 to be tested is clamped between the pressure ring 13 and the shell 10 .

[0061] The accommodating groove 132 passes through the inner peripheral side surface of the pressure ring 13 and the surface of the pressure ring 13 facing the shell 10. Optionally, the height of the accommodating groove 132 is equal to the thickness of the wafer 2 to be tested. Optionally, the accommodating groove 132 is an annular groove, and the radial dimension of the accommodating groove 132 is greater than or equal to the radial dimension of the wafer 2 to be tested. When the pressure ring 13 is fixed to the end face of the shell 10, the groove wall of the accommodating groove 132 of the pressure ring 13 abuts against the edge of the wafer 2 to be tested, so that the edge of the wafer 2 to be tested is clamped between the pressure ring 13 and the shell 10. Specifically, the surface of the wafer 2 to be tested facing the light-transmitting carrier plate 11 abuts against the bearing surface 111, and the surface of the wafer 2 to be tested away from the light-transmitting carrier plate 11 abuts against the groove wall of the accommodating groove 132. Furthermore, the side of the wafer 2 to be tested also abuts against the groove wall of the accommodating groove 132.

[0062] In summary, this embodiment increases the contact area between the pressure ring 13 and the wafer 2 to be tested by setting a receiving groove 132 on the pressure ring 13, thereby improving the fixing effect of the pressure ring 13 on the wafer 2 to be tested. The receiving groove 132 can also play a role in limiting and positioning the wafer 2 to be tested, thereby limiting the position of the wafer 2 to be tested on the chuck assembly 1, so as to improve the detection effect of the wafer 2 to be tested.

[0063] The accommodating groove 132 and the first vacuum groove 131 can cooperate with each other. The steps of fixing the wafer 2 to be tested on the chuck assembly 1 are introduced in detail below: first, the wafer 2 to be tested is placed on the supporting surface 111 of the light-transmitting supporting plate 11; then, the pressure ring 13 is fixed to the shell 10, so that the first vacuum groove 131 is arranged corresponding to the end face of the shell 10, so that the groove wall of the accommodating groove 132 is against the edge of the wafer 2 to be tested; then, the first vacuum groove 131 forms a negative pressure environment, so that the wafer 2 to be tested is firmly fixed on the chuck assembly 1.

[0064] Please refer to Figure 1-Figure 6 In one embodiment, the chuck assembly 1 also includes a mounting member 14 arranged on the outer peripheral side of the shell 10, and the mounting member 14 is detachably connected to the pressure ring 13. The pressure ring 13 is also provided with a first air hole 133 connected to the first vacuum groove 131. The mounting member 14 is provided with a second air hole 141, and the second air hole 141 is connected to the first air hole 133.

[0065] The chuck assembly 1 further includes a suction member 15 for sucking gas in the first vacuum groove 131 , and the suction member 15 is connected to the first air hole 133 and / or the second air hole 141 .

[0066] The mounting member 14 is used to connect the compression ring 13 and also to position the compression ring 13. The mounting member 14 is fixedly connected to the outer peripheral side of the housing 10. The mounting member 14 and the compression ring 13 can be fixed by bonding, threading, snap-fitting, etc., which are not limited in the present application. Preferably, the mounting member 14 is provided with a first mounting hole, and a connecting portion 137 is convexly provided on the outer peripheral side of the compression ring 13. The mounting member 14 and the connecting portion 137 are arranged correspondingly, and the connecting portion 137 is provided with a second mounting hole. The first mounting hole and the second mounting hole are both used to accommodate fasteners. The mounting member 14 and the compression ring 13 are connected by fasteners, and the fasteners include but are not limited to screws, bolts, studs, etc. The mounting member 14 cooperates with the connecting portion 137 to achieve a positioning effect, and the mounting member 14 and the compression ring 13 are further connected by fasteners to fix the compression ring 13 to the housing 10.

[0067] In the step of fixing the pressure ring 13 to the shell 10, first, the connecting portion 137 of the pressure ring 13 is made to correspond to the mounting member 14, so as to ensure that the pressure ring 13 is accurately placed on the shell 10. It should be noted that when the pressure ring 13 and the shell 10 are positioned, the first vacuum groove 131 is arranged corresponding to the end face of the shell 10, and the groove wall of the accommodating groove 132 abuts against the edge of the wafer 2 to be tested; then, the pressure ring 13 is connected to the mounting member 14 by fasteners, and the pressure ring 13 is preliminarily fixed on the shell 10. At this time, at least part of the pressure ring 13 is in surface contact with the end face of the shell 10; then, the first vacuum groove 131 is formed into a negative pressure environment, so that the wafer 2 to be tested is firmly fixed on the chuck assembly 1.

[0068] The first air hole 133 and the second air hole 141 can both be connected to the suction member 15, so that the suction member 15 can suck the gas in the first vacuum groove 131. The suction member 15 includes but is not limited to a suction tube, a suction pump, etc., and the present application does not limit this. For example, the suction member 15 is connected to the first air hole 133, and the second air hole 141 is in a sealed state. For another example, the suction member 15 is connected to the second air hole 141, and the second air hole 141 is connected to the first air hole 133, so that the suction member 15 is connected to the first vacuum groove 131. For another example, the suction member 15 is connected to both the first air hole 133 and the second air hole 141, so as to connect to the first vacuum groove 131.

[0069] In one embodiment, the extension directions of the first air hole 133 and the second air hole 141 are perpendicular to each other, and there are two suction pieces 15, one suction piece 15 is connected to the end of the first air hole 133 away from the first vacuum groove 131, and the other suction piece 15 is connected to the end of the second air hole 141 away from the first air hole 133.

[0070] One end of the first air hole 133 penetrates the outer circumference of the pressure ring 13 and is connected to the suction member 15, and the other end is connected to the first vacuum groove 131. One end of the second air hole 141 penetrates the surface of the mounting member 14 away from the pressure ring 13 and is connected to the suction member 15, and the other end is connected to the first air hole 133. In addition, the extension direction of the first air hole 133 is perpendicular to that of the second air hole 141, for example, the first air hole 133 extends in the horizontal direction, and the second air hole 141 extends in the vertical direction.

[0071] This embodiment limits the relationship between the extension directions of the first air hole 133 and the second air hole 141, and connects the suction piece 15 to both the first air hole 133 and the second air hole 141. This can not only speed up the formation of a negative pressure environment in the first vacuum groove 131, which is beneficial to the formation of a negative pressure environment, but also can suck gas in the horizontal and vertical directions, so that the two suction pieces 15 are more stable and reliable in the process of sucking the first vacuum groove 131.

[0072] Please refer to Figure 1-Figure 6 In one embodiment, a second vacuum groove 101 is provided on the end face of the shell 10. The second vacuum groove 101 is adjacent to the light-transmitting supporting plate 11 and is arranged corresponding to the edge of the wafer 2 to be tested. The second vacuum groove 101 is used to form a negative pressure environment and adsorb and fix the wafer 2 to be tested.

[0073] The gas in the second vacuum tank 101 can be sucked to form a negative pressure environment in the second vacuum tank 101. Optionally, the shape of the second vacuum tank 101 matches the shape of the wafer 2 to be tested. Optionally, the shape of the second vacuum tank 101 can be annular, semi-annular, circular, rectangular, etc., and the present application does not limit this. Among them, when the second vacuum tank 101 is an annular groove, the radial dimension of the second vacuum tank 101 is smaller than the radial dimension of the wafer 2 to be tested, so as to ensure that the second vacuum tank 101 is set corresponding to the edge of the wafer 2 to be tested.

[0074] Optionally, the number of the second vacuum slots 101 is one or more, and the present application does not limit this. Optionally, the second vacuum slots 101 extend along the circumferential direction of the light-transmitting carrier plate 11. Optionally, the second vacuum slots 101 are arranged around the light-transmitting carrier plate 11. Optionally, when the number of the second vacuum slots 101 is multiple, the multiple second vacuum slots 101 are arranged at intervals along the circumferential direction of the light-transmitting carrier plate 11.

[0075] When the wafer 2 to be tested is placed on the carrying surface 111, the gas in the second vacuum groove 101 is sucked to form a negative pressure environment in the second vacuum groove 101, thereby improving the fixing performance of the shell 10 on the wafer 2 to be tested and preventing the wafer 2 to be tested from moving in the vertical direction, thereby further improving the fixing performance of the chuck assembly 1 on the wafer 2 to be tested and further reducing the probability of the wafer 2 to be tested falling and being damaged.

[0076] The second vacuum tank 101 can cooperate with the containing tank 132 and the first vacuum tank 131. Another step of fixing the wafer 2 to be tested on the chuck assembly 1 is described in detail below: first, the wafer 2 to be tested is placed on the bearing surface 111 of the light-transmitting bearing plate 11; then, the pressure ring 13 is fixed to the housing 10, so that the first vacuum tank 131 is arranged corresponding to the end surface of the housing 10, so that the groove wall of the containing tank 132 abuts against the edge of the wafer 2 to be tested; then, the first vacuum tank 131 forms a negative pressure environment, and the second vacuum tank 101 forms a negative pressure environment, so as to achieve the wafer 2 to be tested being firmly fixed on the chuck assembly 1. Among them, this embodiment does not limit the order of forming the negative pressure environment of the first vacuum tank 131 and the second vacuum tank 101. For example, the first vacuum tank 131 can form a negative pressure environment first, and the second vacuum tank 101 can form a negative pressure environment later. For another example, the second vacuum tank 101 can form a negative pressure environment first, and the first vacuum tank 131 can form a negative pressure environment later. For another example, the first vacuum chamber 131 and the second vacuum chamber 101 simultaneously form a negative pressure environment.

[0077] Please refer to Figure 1-Figure 8 In one embodiment, a first positioning groove 134 is provided on the surface of the pressure ring 13 facing the shell 10, and a second positioning groove 102 is provided on the end face of the shell 10. The first positioning groove 134 and the second positioning groove 102 correspond to each other, and the first positioning groove 134 and the second positioning groove 102 are both used to accommodate the positioning pin 16.

[0078] Optionally, the number of the first positioning groove 134 and the second positioning groove 102 is one or more, and the present application does not limit this. Optionally, when the number of the first positioning groove 134 is multiple, the multiple first positioning grooves 134 are spaced apart along the circumferential direction of the pressure ring 13. When the number of the second positioning groove 102 is multiple, the multiple second positioning grooves 102 are spaced apart along the circumferential direction of the housing 10. Optionally, the shapes of the first positioning groove 134 and the second positioning groove 102 can be annular, semi-annular, circular, rectangular, etc., and the present application does not limit this.

[0079] This embodiment provides a first positioning groove 134 on the pressure ring 13 and a second positioning groove 102 on the shell 10, which is not only conducive to the precise installation of the pressure ring 13 on the shell 10 and improves the reliability of the pressure ring 13, but also improves the connection performance between the pressure ring 13 and the shell 10, further improves the fixing performance of the chuck assembly 1 on the wafer 2 to be tested, and further reduces the probability of the wafer 2 to be tested falling and being damaged.

[0080] In one embodiment, the chuck assembly 1 further includes a vacuum sensor and a controller which are electrically connected, wherein the vacuum sensor is used to obtain a first vacuum degree of the first vacuum groove 131 , and the controller is used to adjust a suction parameter of a suction member 15 connected to the first vacuum groove 131 .

[0081] When the first vacuum degree is less than a preset vacuum degree, the controller adjusts the suction parameters of the suction member 15 sucking the first vacuum groove 131 to increase the first vacuum degree to a second vacuum degree greater than or equal to the preset vacuum degree.

[0082] The vacuum sensor is used to detect and obtain the vacuum degree of the first vacuum groove 131. The vacuum sensor can also be understood as a vacuum gauge or a vacuum meter. The controller is used to adjust the suction parameters of the suction member 15, and the suction parameters can be the suction rate of the suction member 15, the working pressure of the suction member 15, etc.

[0083] Specifically, when the first vacuum degree is less than the preset vacuum degree, it indicates that the wafer 2 to be tested is not firmly fixed on the carrying surface 111. Therefore, the controller adjusts the suction parameters of the suction member 15 sucking the first vacuum groove 131 to increase the first vacuum degree to the second vacuum degree. When the second vacuum degree is greater than or equal to the preset vacuum degree, it indicates that the wafer 2 to be tested is firmly fixed on the carrying surface 111.

[0084] This embodiment detects the vacuum degree of the first vacuum groove 131 and adjusts the suction member 15 to ensure that the wafer 2 to be tested is firmly fixed on the supporting surface 111, thereby improving the fixing performance of the chuck assembly 1 on the wafer 2 to be tested and reducing the probability of the wafer 2 to be tested falling and being damaged.

[0085] Optionally, please also refer to Figure 9-10 In one embodiment, the pressure ring 13 includes a first sub-ring 13a and a second sub-ring 13b, the first sub-ring 13a is arranged around the outer circumference of the second sub-ring 13b, the first sub-ring 13a and the second sub-ring 13b are both provided with the first vacuum groove 131 on the surface facing the shell 10, the inner circumference of the first sub-ring 13a is provided with a card groove 135 for accommodating the second sub-ring 13b, and the inner circumference of the second sub-ring 13b is provided with the accommodating groove 132.

[0086] The first sub-ring 13a can be understood as an outer ring, and the second sub-ring 13b can be understood as an inner ring, and the second sub-ring 13b is arranged in the clamping groove 135. On the one hand, the first sub-ring 13a and the second sub-ring 13b are both provided with a first vacuum groove 131, thereby further preventing the pressure ring 13 from moving in the horizontal direction, and further improving the fixing performance of the pressure ring 13 to the housing 10. On the other hand, the second sub-ring 13b is arranged in the clamping groove 135 of the first sub-ring 13a, so the first sub-ring 13a has a downward pressure on the second sub-ring 13b, thereby improving the downward pressure of the second sub-ring 13b on the wafer 2 to be tested, thereby further improving the fixing performance of the pressure ring 13 on the wafer 2 to be tested.

[0087] Moreover, in the related art, since there may be defects such as protrusions or grooves on the surfaces of the pressure ring 13 and the shell 10, the degree of surface-to-surface contact between the pressure ring 13 and the shell 10 is poor, which in turn leads to a low vacuum degree of the negative pressure environment formed by the first vacuum groove 131, thereby reducing the connection performance between the pressure ring 13 and the shell 10. However, in this embodiment, by configuring the pressure ring 13 as a first sub-ring 13a and a second sub-ring 13b, and providing the first vacuum groove 131 on both sub-rings, the interference of defects on the vacuum degree of the negative pressure environment formed by the first vacuum groove 131 can be reduced, thereby improving the connection performance between the pressure ring 13 and the shell 10, improving the fixing performance of the chuck assembly 1 on the wafer 2 to be tested, and reducing the probability of the wafer 2 to be tested falling and being damaged.

[0088] The following is a detailed introduction to the steps of fixing the wafer 2 to be tested on the chuck assembly 1: first, place the wafer 2 to be tested on the carrying surface 111 of the light-transmitting carrying plate 11; then, fix the first sub-ring 13a and the second sub-ring 13b of the pressure ring 13 to the shell 10, so that the first vacuum grooves 131 of the first sub-ring 13a and the second sub-ring 13b are both arranged corresponding to the end surface of the shell 10, and the second sub-ring 13b is arranged in the clamping groove 135, so that the groove wall of the accommodating groove 132 abuts against the edge of the wafer 2 to be tested; then, the first vacuum grooves 131 of the first sub-ring 13a and the second sub-ring 13b form a negative pressure environment, so that the wafer 2 to be tested is firmly fixed on the chuck assembly 1.

[0089] Preferably, in one embodiment, the first vacuum groove 131 of the first sub-ring 13a can be made into a negative pressure environment first; then, the first vacuum groove 131 of the second sub-ring 13b can be made into a negative pressure environment. This operation can first improve the connection performance between the first sub-ring 13a and the housing 10, and fix the second sub-ring 13b in the card groove 135, reduce the gap between the first sub-ring 13a and the second sub-ring 13b, and form a relatively sealed space, which is conducive to the subsequent rapid formation of a negative pressure environment in the first vacuum groove 131 of the second sub-ring 13b.

[0090] Further optionally, in one embodiment, the first vacuum groove 131 of the first sub-ring 13a is an annular groove extending along the circumferential direction of the shell 10, and the first vacuum groove 131 of the second sub-ring 13b is a plurality of adjustment grooves spaced apart along the circumferential direction of the shell 10.

[0091] The annular groove of the first sub-ring 13a is arranged around the multiple adjustment grooves of the second sub-ring 13b, and the spacing between two adjacent adjustment grooves is equal. In this embodiment, by respectively arranging annular grooves and adjustment grooves on the first sub-ring 13a and the second sub-ring 13b, the annular groove of the first sub-ring 13a can be used to achieve the preliminary fixation of the pressure ring 13 on the housing 10, and the vacuum degree of the adjustment groove of the second sub-ring 13b can be fine-tuned to enable the second sub-ring 13b to better fix the wafer 2 to be tested with different degrees of warping.

[0092] The specific control process of the chuck assembly 1 is introduced below: the annular groove of the first sub-ring 13a can be made into a negative pressure environment first; then, the adjustment groove of the second sub-ring 13b can be made into a negative pressure environment. According to the different warping degrees of the wafer 2 to be tested, the vacuum degrees in the multiple adjustment grooves are adjusted, for example, the vacuum degrees in the multiple adjustment grooves are equal; for another example, the vacuum degrees in the multiple adjustment grooves are unequal; for another example, the vacuum degrees in some adjustment grooves are equal, and the vacuum degrees in other adjustment grooves are unequal.

[0093] Alternatively, please refer to Fig.10 In one embodiment, the first sub-ring 13a and the second sub-ring 13b are movably connected, and the second sub-ring 13b can move relative to the slot 135, so as to adjust the vertical distance between the slot wall of the accommodating slot 132 and the end face of the shell 10.

[0094] For example, the first sub-ring 13a and the second sub-ring 13b are movably connected through the connecting rod 13c, one end of the connecting rod 13c is provided with a slot 135 facing the surface of the second sub-ring 13b, and the other end is provided with a surface of the second sub-ring 13b away from the housing 10. Further optionally, the connecting rod 13c includes a first part, a second part, and a third part connected to each other, the width of the first part is greater than the second part, the width of the third part is greater than the second part, the first part is embedded in the first sub-ring 13a, and the third part is embedded in the second sub-ring 13b. The first sub-ring 13a has a movable groove, the first part is arranged in the movable groove, and the first part can move relative to the groove wall of the movable groove, so that the second sub-ring 13b moves relative to the slot 135.

[0095] Since the second sub-ring 13b can move up and down relative to the groove wall of the clamping groove 135, the vertical distance between the groove wall of the accommodating groove 132 and the end face of the housing 10 can be self-adjusted according to the different thicknesses of the wafers 2 to be tested, and can be adapted to a variety of different thicknesses of the wafers 2 to be tested, thereby improving the applicable range of the chuck assembly 1 and improving the reliability of the chuck assembly 1. In addition, since the first sub-ring 13a is connected to the second sub-ring 13b, the first sub-ring 13a and the second sub-ring 13b can be installed on the end face of the housing 10 together, reducing the difficulty of installing the pressure ring 13.

[0096] Optionally, in one embodiment, the vacuum sensor is further used to obtain the vacuum degree of the second vacuum groove 101 , and the controller is further used to adjust the suction parameters of the suction member 15 connected to the second vacuum groove 101 .

[0097] The specific control process of the chuck assembly 1 is introduced as follows: First, the wafer 2 to be tested is placed on the carrying surface 111, and the controller controls the suction member 15 to suck the second vacuum tank 101, so that the second vacuum tank 101 forms a negative pressure environment. Subsequently, the vacuum degree of the second vacuum tank 101 is detected. If the vacuum degree of the second vacuum tank 101 is greater than or equal to the preset vacuum degree, it indicates that the wafer 2 to be tested is firmly fixed on the second vacuum tank 101.

[0098] Then, the pressure ring 13 is fixed to the housing 10 and abuts against the wafer 2 to be tested, and the controller controls the suction member 15 to suck the first vacuum groove 131, so that the first vacuum groove 131 forms a negative pressure environment. Then, the vacuum degree of the first vacuum groove 131 is detected. If the vacuum degree of the first vacuum groove 131 is greater than or equal to the preset vacuum degree, it indicates that the pressure ring 13 is firmly fixed on the housing 10; if the vacuum degree of the first vacuum groove 131 is less than the preset vacuum degree, the suction member 15 of the first vacuum groove 131 and / or the second vacuum groove 101 is adjusted and controlled to directly or indirectly increase the vacuum degree of the first vacuum groove 131.

[0099] Subsequently, the vacuum degree of the first vacuum groove 131 is checked again. If the vacuum degree of the first vacuum groove 131 is still less than the preset vacuum degree, the first vacuum groove 131 of the second sub-ring 13b is adjusted to increase the vacuum degree of the first vacuum groove 131 of the second sub-ring 13b. It should be noted that if the vacuum degree of the first vacuum groove 131 is still less than the preset vacuum degree after the second inspection, it indicates that there may be defects such as preparation protrusions or grooves on the surfaces of the pressure ring 13 and the shell 10, resulting in a poor degree of surface-to-surface contact between the pressure ring 13 and the shell 10. It is necessary to further adjust the first vacuum groove 131 of the second sub-ring 13b to reduce the interference of defects on the adjustment of the vacuum degree, so as to improve the connection performance of the pressure ring 13 and the shell 10, improve the fixing performance of the chuck assembly 1 on the wafer 2 to be tested, and reduce the probability of the wafer 2 to be tested falling and being damaged.

[0100] Please refer to Fig.11 In one embodiment, the first vacuum groove 131 includes a first sub-groove 1311 disposed on one side of the pressure ring 13, and a second sub-groove 1312 disposed on the other side of the pressure ring 13, and the first sub-groove 1311 and the second sub-groove 1312 are disposed opposite to each other.

[0101] The first sub-groove 1311 and the second sub-groove 1312 are arranged at intervals, which can also be understood as that the first sub-groove 1311 is arranged on the left side of the pressure ring 13, and the second sub-groove 1312 is arranged on the right side of the pressure ring 13. The first sub-groove 1311 and the second sub-groove 1312 are respectively connected to the suction member 15, and the first sub-groove 1311 and the second sub-groove 1312 are both used to form a negative pressure environment.

[0102] In the related art, due to the different degrees of local warping of the wafer 2 to be tested, it is easy to be unable to maintain a horizontal position, resulting in that when the pressure ring 13 is used to support the wafer 2 to be tested, the pressure of the pressure ring 13 on the left and right sides of the wafer 2 to be tested is inconsistent, so that the wafer 2 to be tested can be fixed. However, the tilted setting of the wafer 2 to be tested is not conducive to subsequent testing, and reduces the accuracy of testing the wafer 2 to be tested.

[0103] The chuck assembly 1 also includes a pressure sensor and a controller that are electrically connected. The pressure sensor is used to obtain the pressure value of the pressure ring 13 on the wafer to be tested 2. The pressure value includes a first pressure value of the pressure ring 13 on the wafer to be tested 2 on one side, and a second pressure value of the pressure ring 13 on the wafer to be tested 2 on the other side. The controller is used to adjust the suction parameters of the suction piece 15 connecting the first sub-groove 1311 and the second sub-groove 1312.

[0104] When the absolute value of the difference between the first pressure value and the second pressure value is not within a preset range, the controller adjusts the suction parameters of the suction member 15 for sucking the first sub-groove 1311 and / or the second sub-groove 1312 to compensate for the pressure value of the pressure ring 13 on the wafer 2 to be tested, and adjusts the first pressure value and / or the second pressure value so that the absolute value of the difference between the first pressure value and the second pressure value is within a preset range.

[0105] The pressure sensor is used to detect and obtain the pressure value of the pressure ring 13 on the wafer 2 to be tested, and can obtain the first pressure value of the wafer 2 to be tested on one side of the pressure ring 13 and the second pressure value of the wafer 2 to be tested on the other side of the pressure ring 13. It can also be understood that the first pressure value corresponds to the pressure value of the wafer 2 to be tested on the left side of the pressure ring 13, and the second pressure value corresponds to the pressure value of the wafer 2 to be tested on the right side of the pressure ring 13. The controller is used to adjust the suction parameters of the suction member 15, and the suction parameters can be the suction rate of the suction member 15, the working pressure of the suction member 15, etc.

[0106] Specifically, when the absolute value of the difference between the first pressure value and the second pressure value is not within the preset range, it indicates that the first pressure value is significantly different from the second pressure value, and the tilt of the wafer 2 to be tested is more serious. Therefore, the controller adjusts the suction parameters of the suction member 15 to suck the first sub-groove 1311 and / or the second sub-groove 1312 to adjust the vacuum degree of the first sub-groove 1311 and change the first pressure value; and / or adjust the vacuum degree of the second sub-groove 1312 to change the second pressure value, so that the absolute value of the difference between the first pressure value and the second pressure value is within the preset range. When the absolute value of the difference between the first pressure value and the second pressure value is within the preset range, the pressures of the left and right sides of the pressure ring 13 on the wafer 2 to be tested are similar, indicating that the wafer 2 to be tested is kept or approximately kept horizontally placed.

[0107] This embodiment detects the first pressure value and the second pressure value to adjust the suction member 15 to ensure that the wafer 2 to be tested is kept or approximately kept horizontally placed, thereby improving the accuracy of detecting the wafer 2 to be tested.

[0108] Preferably, when the absolute value of the difference between the first pressure value and the second pressure value is not within a preset range, the controller satisfies the following conditions:

[0109] If the first pressure value is greater than the second pressure value, the controller adjusts the suction parameters of the suction member 15 on the second sub-groove 1312 to increase the second pressure value, so that the absolute value of the difference between the first pressure value and the second pressure value is within a preset range.

[0110] And / or, if the first pressure value is less than the second pressure value, the controller adjusts the suction parameters of the suction member 15 on the first sub-groove 1311 to increase the first pressure value, so that the absolute value of the difference between the first pressure value and the second pressure value is within a preset range.

[0111] In the above-mentioned embodiment, when adjusting the first pressure value and / or the second pressure value, it is more inclined to increase the first pressure value and / or the second pressure value. Compared with the adjustment method by reducing the pressure value, such adjustment is more conducive to improving the fixing performance of the pressure ring 13 on the wafer 2 to be tested, improving the fixing performance of the chuck assembly 1 on the wafer 2 to be tested, and reducing the probability of the wafer 2 to be tested falling and being damaged.

[0112] The present application also provides a probe station, which includes a chuck assembly and a detection probe as provided above in the present application, and the detection probe is used to detect the wafer to be tested on the chuck assembly.

[0113] The probe station provided by the present application adopts the chuck assembly provided by the present application. When it is necessary to carry and fix the wafer to be tested, the wafer to be tested is first placed on the carrying surface, and then the pressure ring is fixed to the shell and against the wafer to be tested. The pressure ring can apply downward pressure to the wafer to be tested, thereby pressing the wafer to be tested tightly onto the carrying surface, and can firmly fix the wafer to be tested on the carrying surface, thereby improving the fixing performance of the chuck assembly on the wafer to be tested and reducing the probability of the wafer to be tested falling and being damaged.

[0114] In addition, during detection, the light source passes through the light-transmitting carrier plate, and the light from the light source is irradiated onto the wafer to be tested placed on the carrier surface. By setting the light source on the chuck assembly, the backlight structure that needs to be additionally set up in the related technology is omitted, thereby simplifying the structure of the probe station and reducing the preparation cost.

[0115] Mentioning "embodiment" and "implementation method" in this application means that the specific features, structures or characteristics described in conjunction with the embodiment may be included in at least one embodiment of the present application. The appearance of the phrases in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described in this application can be combined with other embodiments. In addition, it should also be understood that the features, structures or characteristics described in the various embodiments of the present application can be arbitrarily combined to form another embodiment that does not deviate from the spirit and scope of the technical solution of the present application, provided that there is no contradiction between them.

[0116] The above is part of the implementation methods of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications are also considered to be within the scope of protection of the present application.

Claims

1. A chuck assembly with a pressure ring, characterized in that: The chuck assembly comprises: A shell is enclosed to form a receiving space; A light-transmitting carrier plate is disposed in the receiving space, and the light-transmitting carrier plate has a carrying surface for carrying the wafer to be tested; A light source is disposed in the receiving space and on a side of the light-transmitting carrier plate away from the carrier surface, the light source is used to emit light, and the light emitted by the light source passes through the light-transmitting carrier plate to the wafer to be tested; and A pressure ring, fixed to the end surface of the housing, the pressure ring is used to hold the wafer to be tested so as to fix the wafer to be tested on the carrying surface; A first vacuum groove is provided on the surface of the pressure ring facing the shell, and the first vacuum groove is used to form a negative pressure environment so that the pressure ring is fixed to the shell; a receiving groove is provided on the inner circumference of the pressure ring, and the receiving groove is closer to the wafer to be tested than the first vacuum groove, and the receiving groove is used to receive the edge of the wafer to be tested, so that the edge of the wafer to be tested is sandwiched between the pressure ring and the shell; The pressure ring includes a first sub-ring and a second sub-ring, the first sub-ring is arranged around the outer circumference of the second sub-ring, the first vacuum groove is arranged on the surfaces of the first sub-ring and the second sub-ring facing the shell, the inner circumference of the first sub-ring is provided with a groove for accommodating the second sub-ring, the inner circumference of the second sub-ring is provided with the accommodating groove, the first sub-ring and the second sub-ring are movably connected, and the second sub-ring can move relative to the groove, so as to adjust the vertical distance between the groove wall of the accommodating groove and the end face of the shell.

2. The chuck assembly according to claim 1, wherein: The chuck assembly further comprises a mounting member disposed on the outer peripheral side of the housing, the mounting member is detachably connected to the pressure ring, the pressure ring is further provided with a first air hole connected to the first vacuum groove, the mounting member is provided with a second air hole connected to the first air hole; The chuck assembly further includes a suction member for sucking gas in the first vacuum groove, and the suction member is connected to the first air hole and / or the second air hole.

3. The chuck assembly according to claim 2, wherein: The extension directions of the first air hole and the second air hole are perpendicular to each other. There are two suction pieces, one of which is connected to the end of the first air hole away from the first vacuum groove, and the other suction piece is connected to the end of the second air hole away from the first air hole.

4. The chuck assembly according to claim 1, wherein: The end surface of the shell is provided with a second vacuum groove, the second vacuum groove is adjacent to the light-transmitting carrier plate and is arranged corresponding to the edge of the wafer to be tested, and the second vacuum groove is used to form a negative pressure environment and adsorb and fix the wafer to be tested.

5. The chuck assembly according to claim 1, wherein: A first positioning groove is provided on the surface of the pressure ring facing the shell, and a second positioning groove is provided on the end surface of the shell. The first positioning groove and the second positioning groove correspond to each other, and both the first positioning groove and the second positioning groove are used to accommodate a positioning pin.

6. The chuck assembly according to claim 1, wherein: The chuck assembly further includes a vacuum sensor and a controller electrically connected to each other, the vacuum sensor being used to obtain a first vacuum degree of the first vacuum groove, and the controller being used to adjust a suction parameter of a suction member connected to the first vacuum groove; When the first vacuum degree is less than a preset vacuum degree, the controller adjusts a suction parameter of the suction member sucking the first vacuum groove to increase the first vacuum degree to a second vacuum degree greater than or equal to the preset vacuum degree.

7. The chuck assembly according to claim 1, wherein: The first vacuum groove includes a first sub-groove provided on one side of the pressure ring, and a second sub-groove provided on the other side of the pressure ring, and the first sub-groove is arranged opposite to the second sub-groove; the chuck assembly also includes a pressure sensor and a controller electrically connected, the pressure sensor is used to obtain the pressure value of the pressure ring on the wafer to be tested, the pressure value includes a first pressure value of one side of the pressure ring on the wafer to be tested, and a second pressure value of the other side of the pressure ring on the wafer to be tested, and the controller is used to adjust the suction parameters of the suction member connecting the first sub-groove and the second sub-groove; When the absolute value of the difference between the first pressure value and the second pressure value is not within a preset range, the controller adjusts the suction parameters of the suction member to suck the first sub-groove and / or the second sub-groove to compensate for the pressure value of the pressure ring on the wafer to be tested, and adjusts the first pressure value and / or the second pressure value so that the absolute value of the difference between the first pressure value and the second pressure value is within a preset range.

8. The chuck assembly according to claim 7, wherein: When the absolute value of the difference between the first pressure value and the second pressure value is not within a preset range, the controller satisfies the following conditions: If the first pressure value is greater than the second pressure value, the controller adjusts the suction parameters of the suction member on the second sub-groove to increase the second pressure value, so that the absolute value of the difference between the first pressure value and the second pressure value is within a preset range; And / or, if the first pressure value is less than the second pressure value, the controller adjusts the suction parameters of the suction member on the first sub-groove to increase the first pressure value, so that the absolute value of the difference between the first pressure value and the second pressure value is within a preset range.

9. A probe station, characterized in that: The probe station comprises a chuck assembly and a detection probe as described in any one of claims 1 to 8, and the detection probe is used to detect the wafer to be tested on the chuck assembly.

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