Magnetic sensor device

Abstract

The invention provides a magnetic sensor device which can properly fix a sensor substrate on a support substrate and has stable output performance. A magnetic sensor device (1) is provided with a support substrate (2) and a sensor substrate (10) fixed to the support substrate (2). The sensor substrate (10) has: a first surface (10B) facing the support substrate (2); and a second surface (10A) located on the opposite side of the first surface (10B), a functional film (20) including a plurality of magnetic detection elements (E) is provided on the second surface (10A), a hole portion (11) is formed in the first surface (10B), an outline (O11) of the hole portion (11) includes at least one corner portion (C1, C2, C3...), and each of the plurality of magnetic detection elements (E) is disposed such that, in a plan view when viewed along a surface perpendicular direction (Z) from the second surface (10A) toward the first surface (10B), the first surface (10A) and the second surface (10A) are perpendicular to each other. ), and does not overlap with any one of the at least one corner (C1, C2, C3,...).

Description

Technical Field

[0001] The invention relates to a magnetic sensor device. Background Art

[0002] A magnetic sensor device is known, which is configured by bonding a sensor chip having a magnetic detection element disposed on a sensor substrate to a support substrate using an adhesive. For example, Patent Document 1 discloses a magnetic sensor device, which is obtained by separately preparing a first chip and a second chip including a magnetic sensor for generating a detection signal, and a support body including an application-specific integrated circuit (ASIC) for processing the detection signal, and bonding the first chip and the second chip to the support body using an adhesive.

[0003] In such a magnetic sensor device, it is preferable to apply the adhesive so that it slightly overflows from the bonding surface of the sensor substrate. When the amount of adhesive applied is insufficient, it is easy to peel off from the part where the adhesive is not applied, which may cause the bonding strength to decrease. When the amount of adhesive applied is excessive, the adhesive overflowing from the sensor substrate adheres to the surface electrode of the ASIC, etc., which may reduce the connection reliability.

[0004] If a bottom hole or a through hole is formed on the bonding surface of the sensor substrate, the amount of adhesive overflowing from the sensor chip will not easily change due to surface tension even if the coating amount changes. Since the adhesive layer becomes thicker, the bonding strength is also improved. Patent document 2 discloses the following technology: In a semiconductor device that is not a magnetic sensor device but has a semiconductor element mounted on a support body through an adhesive layer, a recess is formed on the back side of the semiconductor element facing the support substrate.

[0005] Prior art literature

[0006] Patent Literature

[0007] Patent Document 1: Japanese Patent Application Publication No. 2023-10557

[0008] Patent Document 2: Japanese Patent Application Publication No. 2010-205893 Summary of the invention

[0009] The technical problem that the invention is intended to solve

[0010] However, the magnetic sensor device is different from the semiconductor device described in Patent Document 2, and has a magnetic detection element made of magnetic material. When an external force is applied to the magnetic material, the response to the magnetic field changes due to the inverse magnetostrictive effect. In particular, the tunnel magnetoresistance effect element has an excellent output performance with a relatively large MR, but on the other hand, the output performance is easily changed by external force. In addition, when a bottom hole or a through hole is formed on the sensor substrate, because the thickness of the sensor substrate changes locally, the thermal deformation of the sensor substrate when it expands or contracts due to temperature changes becomes uneven, and there is a problem of thermal stress acting on the magnetic detection element.

[0011] The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a magnetic sensor device that can appropriately fix a sensor substrate to a support substrate and has stable output performance.

[0012] Technical means for solving technical problems

[0013] A magnetic sensor device according to one embodiment of the present invention comprises: a support substrate and a sensor substrate fixed to the support substrate. The sensor substrate has a first surface facing the support substrate and a second surface located on the opposite side of the first surface, a functional film including a plurality of magnetic detection elements is provided on the second surface, a hole portion is formed on the first surface, the contour of the hole portion includes at least one corner portion, and each of the plurality of magnetic detection elements is arranged so as not to overlap with any of the at least one corner portion in a top view when viewed along a direction perpendicular to the surface from the second surface toward the first surface. The hole portion may be a bottomed hole recessed from the first surface toward the second surface, or may be a through hole penetrating from the first surface to the second surface.

[0014] A magnetic sensor device according to another embodiment of the present disclosure includes a support substrate and a sensor substrate fixed to the support substrate. The sensor substrate includes a first surface facing the support substrate and a second surface located on the opposite side of the first surface, a functional film including a plurality of magnetic detection elements is provided on the second surface, and a hole portion is formed on the first surface, and the contour of the hole portion is a circle excluding corners.

[0015] According to these methods, since a hole portion is formed in the sensor substrate, the amount of adhesive overflowing from the lower surface of the sensor substrate is not likely to change even if the amount of adhesive applied changes, compared to a case where no hole portion is formed. The adhesive layer becomes thicker and the bonding strength is also improved. Therefore, the sensor substrate can be properly bonded to the supporting substrate. In a top view, the position overlapping with the corner of the outline of the hole portion is susceptible to thermal stress. According to these methods, since each of the multiple magnetic detection elements does not overlap with any of the corners, a magnetic sensor device that is not easily affected by thermal stress and has stable output performance can be provided.

[0016] In the above aspect, the sensor substrate may be fixed to the support substrate using an adhesive, and the hole may be filled with the adhesive.

[0017] According to this aspect, the sensor substrate can be appropriately fixed to the support substrate using the adhesive.

[0018] In the above aspect, each of the plurality of magnetic detection elements may be arranged so as not to overlap with the outline in a plan view.

[0019] The position that overlaps with the outline of the hole portion other than the corner is slightly more susceptible to thermal stress than the position that does not overlap with the outline, although it is not a position that overlaps with the corner. According to this method, since each of the plurality of magnetic detection elements not only does not overlap with the corner but also does not overlap with any of the outlines, it is less susceptible to thermal stress and the output performance is stable.

[0020] In the above-mentioned manner, a part of the plurality of magnetic detection elements may be arranged inside the outline in the top view, and the remaining part of the plurality of magnetic detection elements may be arranged outside the outline in the top view. Alternatively, all of the plurality of magnetic detection elements may be arranged inside the outline in the top view. Alternatively, all of the plurality of magnetic detection elements may be arranged outside the outline in the top view.

[0021] According to these aspects, the magnetic detection elements can be arranged across the inside and outside of the outline, can be arranged only inside the outline, and can be arranged only outside the outline. There are few restrictions on the arrangement of the magnetic detection elements, and the degree of freedom of design is excellent.

[0022] In the above aspect, each of the plurality of magnetic detection elements may be arranged at an interval of 1 μm or more from the contour in a direction perpendicular to the plane.

[0023] According to this aspect, since each of the plurality of magnetic detection elements is located at least 1 μm away from the contour, it is less likely to be affected by thermal stress.

[0024] In the above aspect, the plurality of magnetic detection elements may include at least one first magnetic detection element arranged so as to overlap with the outline in a plan view along a surface perpendicular direction from the second surface toward the first surface.

[0025] According to this method, the first magnetic detection element can be arranged in a manner overlapping with the outline of the hole. The position overlapping with the outline of the hole other than the corner is slightly more susceptible to thermal stress than the position not overlapping with the outline, but the influence of thermal stress is sufficiently small compared with the position overlapping with the corner, so a magnetic sensor device with stable output performance can be provided. Compared with the case where the entire outline of the hole needs to be avoided, there are fewer restrictions on the arrangement of the magnetic detection elements, and the degree of freedom of design is excellent.

[0026] In the above-mentioned manner, the plurality of magnetic detection elements may further include: a plurality of second magnetic detection elements arranged in a manner not overlapping with the outline in the top view, a portion of the plurality of second magnetic detection elements being arranged inside the outline in the top view, and the remaining portion of the plurality of second magnetic detection elements being arranged outside the outline in the top view. Alternatively, all of at least one second magnetic detection element may be arranged inside the outline in the top view. Alternatively, all of at least one second magnetic detection element may be arranged outside the outline in the top view.

[0027] According to these methods, the first magnetic detection element overlapping the contour and the second magnetic detection element not overlapping the contour are mixed, and the second magnetic detection element can be arranged across the inside and outside of the contour, the second magnetic detection element can be arranged only on the inside of the contour, and the second magnetic detection element can be arranged only on the outside of the contour. There are few restrictions on the arrangement of the magnetic detection elements, and the degree of freedom of design is excellent.

[0028] In the above aspect, the plurality of magnetic detection elements may be arranged at a distance of 1 μm or more from all of the at least one corner portion in an in-plane direction perpendicular to the plane-perpendicular direction.

[0029] According to this aspect, since each of the plurality of magnetic detection elements is located at least 1 μm away from the corner, it is less likely to be affected by thermal stress.

[0030] In the above aspect, the hole portion may be a bottomed hole recessed from the first surface toward the second surface, and a depth of the bottomed hole in a surface perpendicular direction may be less than or equal to half of a plate thickness of the sensor substrate.

[0031] The deeper the hole portion, the greater the difference in plate thickness between the hole portion and the portion outside the hole portion, and the magnetic detection element is easily affected by thermal stress when the sensor substrate expands or contracts due to temperature changes. According to this embodiment, since the difference between the hole portion and the portion outside the hole portion is less than half of the plate thickness, it is possible to provide a magnetic sensor device in which the influence of thermal stress is not likely to become too large and the output performance is stable.

[0032] In the above aspect, a wiring layer may be further provided in a layer farther from the support substrate than the functional film in a plane perpendicular direction, and each of the plurality of magnetic detection elements may be arranged inside an outline of the wiring layer in a plan view.

[0033] When the magnetic detection element is arranged inside the outline of the wiring layer, the magnetic detection element is less susceptible to thermal stress than when there is no wiring layer.

[0034] In the above aspect, the hole may have an inner surface inclined with respect to a surface perpendicular direction, and each of the plurality of magnetic detection elements may not overlap with the inner surface in a plan view.

[0035] The position overlapping the inclined inner surface is easily affected by thermal stress. According to this aspect, since each of the plurality of magnetic detection elements does not overlap the inclined inner surface, it is possible to provide a magnetic sensor device that is not easily affected by thermal stress and has stable output performance.

[0036] In the above embodiment, the angle sensor may include a magnetic sensor device, the magnetic compass may include a magnetic sensor device, the current sensor may include a magnetic sensor device, and the autofocus mechanism and / or optical shake correction mechanism of the camera module may include a magnetic sensor device.

[0037] According to these aspects, the magnetic sensor device can be used for various purposes.

[0038] Effects of the Invention

[0039] According to the present invention, it is possible to provide a magnetic sensor device in which a sensor substrate can be appropriately fixed to a support substrate and output performance is stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 It is a perspective view showing a magnetic sensor device according to one embodiment.

[0041] Figure 2 It indicates schematically Figure 1 A cross-sectional view of an example of the internal structure of the magnetic sensor device shown.

[0042] Figure 3 Yes Description Figure 1 A perspective view of the manufacturing process of the magnetic sensor device shown.

[0043] Figure 4 This is a diagram showing an example of a magnetic sensor device configured as an angle sensor.

[0044] Figure 5 This is a plan view showing an example of a magnetic sensor device configured as a magnetic compass.

[0045] Figure 6 FIG. 1 is a diagram showing an example of a magnetic sensor device used as a part of a current sensor.

[0046] Figure 7 Yes means Figure 6 The circuit structure of the current sensor is shown in the figure.

[0047] Figure 8 This is a perspective view showing an example of a magnetic sensor device used as a part of an autofocus mechanism and an optical shake correction mechanism of a camera module.

[0048] Fig. 9 Yes means Figure 8A cross-sectional view of the internal structure of the camera assembly is shown.

[0049] Fig. 10A This is a top view of a simulated model in which a quadrilateral hole is formed, viewed from a direction perpendicular to the surface.

[0050] Fig. 10B This is a top view of a simulated model in which a quadrilateral hole with rounded corners is formed, as viewed from a direction perpendicular to the surface.

[0051] Fig. 10C This is a top view of a simulated model in which a circular hole is formed, as viewed from a direction perpendicular to the surface.

[0052] Fig. 10D This is a top view of a simulated model including a wiring layer as viewed from a direction perpendicular to the surface.

[0053] Fig. 10E This is a top view of a simulated model having an inclined inner surface as viewed from a direction perpendicular to the surface.

[0054] Fig.11 This is a cross-sectional view of the simulated model when viewed along the XY plane that is perpendicular to the surface.

[0055] Fig.12 and Fig.13 It means in Fig. 10A and Fig.11 A graph of the simulated angular errors for each position is shown.

[0056] Fig.14 It means in Fig. 10A , Fig. 10B and Fig. 10C A graph of the simulated angular errors for each position is shown.

[0057] Fig.15 It means in Fig. 10A , Fig. 10B and Fig. 10C The positions shown are Fig. 10D Graph showing the angular error obtained by simulation of a model with wiring layers shown.

[0058] Fig.16 It means in Fig. 10E A graph of the simulated angular errors at various positions shown.

[0059] Figures 17 to 20 These are plan views showing first to fourth examples in which all magnetic detection elements are arranged so as not to overlap with the contour of the hole.

[0060] Figure 21 to Figure 23These are plan views showing fifth to seventh examples in which the first magnetic detection element is arranged so as to overlap with the outline of the hole except for the corners, and the second magnetic detection element is arranged so as not to overlap with the outline of the hole.

[0061] Fig.24 It is a plan view showing an eighth example in which the magnetic detection element is arranged inside the outline of the wiring layer.

[0062] Fig.25 This is a cross-sectional view showing a ninth example in which the magnetic detection element is arranged so as not to overlap with the inclined inner surface.

[0063] Explanation of symbols

[0064] 1... magnetic sensor device, 2... supporting substrate, 2A... upper surface, 2B... lower surface, 2E... electrode, 3... sensor chip, 3A... upper surface, 3E... electrode, 3X... first sensor chip, 3Y... second sensor chip, 3Z... third sensor chip, 4... wiring layer, 5... sealing resin, 6... electrode, 6P... through hole, 10... sensor substrate, 10A... second surface (upper surface), 10B... first surface (lower surface), 11... hole portion (bottomed hole or through hole), 11 C...inner surface of hole (inner wall surface), 11D...bottom surface of hole, 20...functional film, 30...magnetic detection element array, 31 to 38...first to eighth magnetic detection element arrays, 40...through-hole conductor, 40P...through hole, 41...first wiring layer, 42...second wiring layer, 51 to 53...resin layer, 200...camera module, 210...image sensor, 220...lens, 230...driving device, 231...first coil, 232...second coil, 233...first magnet, 24 1... first holding member, 242... second holding member, 243... second magnet, 244... metal wire, 250... housing, 300... magnet, 400... current sensor, 410... bus bar, 420... coil, 430... feedback circuit, 440... current detector, A... output port, AD... adhesive, B... output port, C1, C2, C3, C4... corner, D... depth of hole, DR... reference direction, E... magnetic detection element, E1... first magnetic detection element, E2 …the second magnetic detection element, Itg…current, L1…the first layer, L2…the second layer, MF…magnetic field, MF1…the first magnetic field, MF2…the second magnetic field, O…the center axis, O4…the outline of the wiring layer, O11…the outline of the hole, P, Q…the position, S…the magnetic field detection value, T…the thickness of the sensor substrate, U, V…the direction of shaking, W…wiring, X…the left-right direction (an example of the direction within the plane), Y…the front-back direction (another example of the direction within the plane), Z…the direction perpendicular to the plane, θ…the angle. DETAILED DESCRIPTION

[0065] The preferred embodiment will be described with reference to the accompanying drawings. In the drawings, the parts with the same reference numerals have the same or similar structure. One of the characteristics of the magnetic sensor device 1 according to one embodiment of the present invention is that a hole 11 is formed in the sensor substrate 10. Figures 17 to 24As shown, in the top view when observing along the plane perpendicular direction Z, the multiple magnetic detection elements E are each arranged in a manner that does not overlap with the corners C1, C2, C3, etc. of the outline O11 of the hole portion 11. The outline O11 of the hole portion 11 may be a polygon such as a quadrilateral including multiple corners C1, C2, C3, etc., or may be a circle that does not include the corners C1, C2, C3, etc. The corners C1, C2, C3, etc. may be, for example, in other words, vertices C1, C2, C3, etc. where the curvature takes a maximum value. The outline O11 of the hole portion 11 may also be a combination of the vertex C1 and a curve such as a teardrop shape. For example, in an arc with a constant curvature sandwiched by two straight lines such as a fillet, the corners C1, C2, C3, etc. may be the midpoints of the arc (refer to Fig. 10B ).

[0066] A magnetic sensor device 1 according to a positional embodiment of the present invention comprises: a supporting substrate 2; and a sensor substrate 10 fixed to the supporting substrate 2 by an adhesive AD, the sensor substrate 10 having: a first surface 10B facing the supporting substrate 2; and a second surface 10A located on the opposite side to the first surface 10B, a functional film 20 including a plurality of magnetic detection elements E is provided on the second surface 10A, the adhesive AD is filled in a hole portion 11, the hole portion 11 is formed as a bottomed hole recessed from the first surface 10B toward the second surface 10A or a through hole penetrating from the first surface 10B to the second surface 10A, a contour O11 of the hole portion 11 includes at least one vertex C1, C2, C3, ... having a maximum curvature, and each of the plurality of magnetic detection elements E is arranged in a manner not to overlap with any of at least one vertex C1, C2, C3, ... in a top view when viewed along a surface perpendicular direction Z from the second surface 10A toward the first surface 10B. The magnetic sensor device 1 of another embodiment of the present invention is configured such that the contour O11 of the hole 11 is a circle that does not include vertices C1, C2, C3, etc. where the curvature has a local maximum. The magnetic sensor device 1 of the present invention has a special technical feature that is the same as or corresponds to the following point: regardless of whether the contour O11 of the hole 11 is a polygon or a circle, the magnetic detection element E is arranged in a manner that does not overlap with the vertices C1, C2, C3, etc. where the curvature has a local maximum. Figure 1 to Figure 25 , each structure is described in detail.

[0067] Figure 1 1 is a perspective view showing a magnetic sensor device 1 according to an embodiment. In the example shown in the figure, the magnetic sensor device 1 includes a support substrate 2, a sensor chip 3, a wiring layer 4, a sealing resin 5, an electrode 6, etc. One magnetic sensor device 1 may include a plurality of sensor chips 3.

[0068] like Figure 1As shown in FIG. 1 , the support substrate 2 is formed in a flat plate shape having an upper surface 2A and a lower surface 2B located on the opposite side of the upper surface 2A. In the following description, the thickness direction of the support substrate 2 is referred to as a plane vertical direction Z or an up-down direction Z, the direction from the lower surface 2B toward the upper surface 2A is referred to as an upward direction, and the direction from the upper surface 2A toward the lower surface 2B is referred to as a downward direction. The upper surface 2A extends parallel to the XY plane orthogonal to the plane vertical direction Z.

[0069] Figure 2 It indicates schematically Figure 1 1 is a cross-sectional view of an example of the internal structure of the magnetic sensor device 1 shown in FIG. In the example shown in the figure, the support substrate 2 is an ASIC (Application Specific Integrated Circuit), and the electrode 2E electrically connected to the wiring layer 4 is provided on the upper surface 2A. The support substrate 2 is not limited to an ASIC, and may also be a silicon substrate or a sapphire substrate. It may also be an interposer substrate (interposer) in which only wiring is formed without including an integrated circuit on these substrates.

[0070] The sensor chip 3 is fixed to the upper surface 2A of the support substrate 2 by an adhesive AD. Figure 2 As shown, the sensor chip 3 includes a sensor substrate 10, at least one magnetic detection element array 30 for generating a detection signal, a functional film 20 surrounding the magnetic detection element array 30, etc. The functional film 20 can be made of silicon dioxide (SiO 2 ) as the main component, or an inorganic film with silicon dioxide as the main component and an inorganic film with aluminum oxide (Al 2 O 3 ) as a laminated film of an inorganic film as the main component.

[0071] The sensor substrate 10 is, for example, a silicon substrate, and is disposed between the upper surface 2A of the support substrate 2 and the functional film 20. The sensor substrate 10 has: a first surface (lower surface) 10B facing the support substrate 2; and a second surface 10A located on the opposite side of the first surface 10B. The functional film 20 including the magnetic detection element array 30 is provided on the second surface 10A. A hole portion 11 that can be filled with an adhesive AD is formed on the first surface 10B of the sensor substrate 10. The hole portion 11 can be a bottomed hole that is recessed from the first surface 10B of the sensor substrate 10 toward the second surface 10A, or a through hole that passes from the first surface 10B to the second surface 10A.

[0072] Each magnetic detection element array 30 is composed of a plurality of magnetic detection elements E (such as Fig.17An example of the magnetic detection element E is a TMR (Tunnel magnetoresistance effect) element. The magnetic detection element E is not limited to a TMR element, but may be a GMR (Giant magnetoresistance effect) element, or an AMR (Anisotropic magnetoresistance effect) element, or a Hall element or other types of magnetic detection elements. Compared with other types of MR elements, the TMR element has a smaller bonding area, which can miniaturize the sensor chip 3, and a larger MR ratio, which can increase the output of the sensor chip 3, and is therefore particularly suitable for the magnetic detection element E.

[0073] The magnetic detection element array 30 is arranged on the upper surface 2A side of the support substrate 2 and is formed on the first layer L1 on the upper surface 2A side of the support substrate 2. The wiring layer 4 is arranged on the upper surface 2A side of the support substrate 2 and is formed on the second layer L2 different from the first layer L1. The second layer L2 is located at a position farther from the support substrate 2 than the first layer L1.

[0074] The wiring layer 4 extends parallel to the upper surface 2A of the support substrate 2, and electrically connects the electrode 2E of the support substrate 2 and the electrode 3E provided on the upper surface 3A of the sensor chip 3 via a plurality of through-hole conductors 40 extending in the plane-perpendicular direction Z. The wiring layer 4 is arranged so as to partially overlap the sensor substrate 10 in the plane-perpendicular direction Z.

[0075] The sealing resin 5 is disposed on the upper surface 2A side of the support substrate 2, and covers the sensor chip 3 and the wiring layer 4. The sealing resin 5 is formed by a plurality of resin layers 51, 52, 53 (such as Figure 3 The wiring layer 4 is, for example, a copper plated layer provided on the upper surface of the resin layers 51 and 52. The electrode 6 is, for example, a solder ball or a copper column, electrically connected to the wiring layer 4, and exposed from the sealing resin 5.

[0076] Figure 3 It is used to illustrate Figure 1 The manufacturing process of the magnetic sensor device 1 is shown in FIG. Figure 3 As shown in FIG. 2A , an adhesive AD (such as Figure 2 At this time, if the amount of adhesive AD applied is insufficient, peeling easily occurs starting from the portion where the adhesive is not applied, and if the amount of adhesive AD applied is excessive, the adhesive overflowing from the sensor chip 3 adheres to the electrode 2E on the upper surface 2A of the support substrate 2. Therefore, it is preferable to apply the adhesive AD in a manner that it slightly overflows from the lower surface of the sensor chip 3.

[0077] like Figure 3 As shown in FIG. 1B, a resin layer (first resin layer) 51 is formed to cover the sensor chip 3 and the upper surface 2A of the support substrate 2, and openings are formed at the positions of the electrodes 2E and 3E (as shown in FIG. 10) to form through-hole conductors 40 ( Figure 2 As shown in FIG. Figure 3 As shown in (C), a seed layer is formed by sputtering or the like, and the through-hole conductors 40 and the first wiring layer 41 are formed by electroplating. Figure 3 The process shown in (C) can be either a subtractive process or an additive process.

[0078] like Figure 3 As shown in (D), a resin layer (second resin layer) 52 is formed to cover the through-hole conductor 40, the first wiring layer 41, and the resin layer 51, and a through hole 40P for the through-hole conductor 40 is opened. Figure 3 As shown in (E), using Figure 3 (C) The same process is used to form the through-hole conductor 40 and the second wiring layer 42. Figure 3 As shown in (F), a resin layer (third resin layer) 53 is formed to cover the through-hole conductor 40, the second wiring layer 42, and the resin layer 52, and a through hole 6P for the electrode 6 is formed by opening. Figure 3 As shown in (G), solder or the like is filled in the through hole 6P to form the electrode 6. Figure 3 The processes shown in (A) to (G) can electrically connect the support substrate 2 and the sensor chip 3 prepared separately to obtain Figure 1 The magnetic sensor device 1 is shown.

[0079] Figure 4 1 is a diagram showing an example of a magnetic sensor device 1 configured as an angle sensor that generates a detection value corresponding to the angle of a detection object. In the example shown in the figure, the magnetic sensor device 1 is configured as an angle sensor that detects the angle of a magnet 300 that can rotate about the central axis O of a cylinder as a rotation axis. In the example shown in the figure, the X direction, the Y direction, and the Z direction are orthogonal to each other, and the central axis O is parallel to the Z direction.

[0080] The magnetic sensor device 1 detects a first component in a direction parallel to the X direction of the magnetic field component MF applied to the magnetic sensor device 1 as the magnetic field generated by the magnet 300, and generates a first detection signal indicating the intensity of the first component, and detects a second component in a direction parallel to the Y direction of the magnetic field generated by the magnet 300, and generates a second detection signal indicating the intensity of the second component. The processor (not shown) calculates an angle θ formed by the magnetic field generated by the magnet 300 with respect to the reference direction DR by calculating the arc tangent of the ratio of the first detection signal to the second detection signal.

[0081] Figure 5 FIG. 1 is a diagram showing an example of a magnetic sensor device 1 configured to generate a detection value corresponding to an angle of the earth's magnetism. Figure 5 As shown, the magnetic sensor device 1 includes three sensor chips 3 (first to third sensor chips 3X, 3Y, and 3Z), and the first to third sensor chips 3X, 3Y, and 3Z respectively detect components of the external magnetic field in three directions orthogonal to each other.

[0082] Figure 6 1 is a diagram showing an example of a magnetic sensor device 1 used as a part of a current sensor 400 that generates a detection value corresponding to a current value of a detection object. In the example shown in the figure, the current sensor 400 is configured to detect the value of the current Itg flowing through the bus bar 410. A magnetic field MF is generated around the bus bar 410 by the current Itg. The current sensor 400 is arranged at a position where the magnetic field MF is applied, and the position is located near the bus bar 410.

[0083] Figure 7 Yes means Figure 6 FIG. 1 is a diagram showing a circuit structure of a current sensor 400 shown in FIG. 1 . In the example shown in the figure, the current sensor 400 is configured as a magnetic field balance type current sensor. The current sensor 400 further includes a coil 420 in addition to the magnetic sensor device 1. The coil 420 is used to generate a second magnetic field MF2 that cancels the first magnetic field MF1 of the magnetic field MF. The magnetic sensor device 1 detects a residual magnetic field between the first magnetic field MF1 and the second magnetic field MF2, and generates a magnetic field detection value S corresponding to the strength of the magnetic field.

[0084] The current sensor 400 further includes a feedback circuit 430, a current detector 440, and the like. The feedback circuit 430 flows a feedback current for generating a second magnetic field MF2 in the coil 420 based on the magnetic field detection value S. The current detector 440 detects the value of the feedback current flowing in the coil 420. The current detector 440 is, for example, a resistor inserted in the current path of the feedback current. In this case, the potential difference between the two ends of the resistor is equivalent to the detection value of the feedback current. Since the detection value of the feedback current is proportional to the value of the current Itg of the bus bar 410, the value of the current Itg can be detected based on the detection value of the feedback current.

[0085] The magnetic sensor device 1 of the present invention can be mounted on electronic equipment such as information equipment and used as a magnetic compass for detecting geomagnetism, can also be used as a part of the autofocus mechanism or optical shake correction mechanism of a camera component, can also be used as an angle sensor for detecting the angle formed by the magnetic field generated by a magnet relative to a reference direction, and can also be used as a part of a current sensor for detecting the value of the current flowing through a bus bar.

[0086] Figure 81 is a perspective view showing an example of the magnetic sensor device 1 used as a part of the autofocus mechanism and the optical shake correction mechanism of the camera module 200 . Fig. 9 Yes means Figure 8 2 is a cross-sectional view of the internal structure of the camera module 200. The autofocus mechanism and the optical shake correction mechanism of the camera module 200 include a drive device 230 for moving the lens 220, and the drive device 230 is controlled based on the position information of the lens 220 detected by the plurality of magnetic sensor devices 1.

[0087] Specifically, the autofocus mechanism detects the state of the subject being in focus using an image sensor, an autofocus sensor, etc., and moves the lens relative to the image sensor in the Z direction. The optical shake correction mechanism detects shake using a gyro sensor, etc., and moves the lens relative to the image sensor in the U direction and / or V direction.

[0088] Figure 8 The camera assembly 200 shown includes: an image sensor 210 such as a CMOS, a lens 220 aligned with respect to the image sensor 210, a first holding member 241 capable of moving in the U direction and the V direction relative to the image sensor 210, a second holding member 242 capable of moving in the Z direction relative to the first holding member 241, a plurality of elastically deformable metal wires 244 supporting the first holding member 241 and the second holding member 242, a driving device 230 for moving the first holding member 241 and the second holding member 242, and a housing 250 for housing these components.

[0089] The autofocus mechanism and optical shake correction mechanism of the camera assembly 200 include, in addition to the drive device 230 and the plurality of magnetic sensor devices 1, a processor for controlling the drive device 230, an autofocus sensor for detecting a state where the subject is in focus, and a gyro sensor for detecting shake, etc. The processor, autofocus sensor, gyro sensor, etc., which are not shown, are arranged outside the housing.

[0090] The lens 220 is fixed inside the second holding member 242 formed in a cylindrical shape. The second holding member 242 is housed in the first holding member 241 formed in a box shape for each lens 220. At least one second magnet 243 is fixed to the second holding member 242 so that at least one magnetic sensor device 1 detects position information of the second holding member 242.

[0091] The driving device 230 includes a plurality of first coils 231, a plurality of second coils 232, a plurality of first magnets 233, etc. The plurality of first coils 231 are fixed to the housing 250. The plurality of second coils 232 are fixed to the second holding member 242. The plurality of first magnets 233 are fixed to the first holding member 241. Each of the plurality of first coils 231 is opposite to the corresponding first magnet 233. Each of the plurality of second coils 232 is opposite to the corresponding first magnet 233.

[0092] In the case of the automatic focusing mechanism, when a current flows through any second coil 232 according to an instruction from the processor, the second holding member 242 fixed to the second coil 232 moves in the Z direction due to the interaction between the magnetic field generated from the first magnet 233 and the magnetic field generated from the second coil 232. At least one magnetic sensor device 1 generates a detection signal based on a synthetic magnetic field obtained by synthesizing the magnetic field generated from at least one second magnet 243 fixed to the second holding member 242 and the magnetic field generated from the first magnet 233 fixed to the first holding member 241, and sends it to the processor. The processor detects the position information of the lens 220 in the Z direction based on the detection signal, and controls the driving device 230 to focus on the subject.

[0093] In the case of the optical shake correction mechanism, when a current flows in any of the first coils 231 according to an instruction from the processor, the first holding member 241 fixed to the first magnet 233 moves in the U direction and / or the V direction due to the interaction between the magnetic field generated from the first magnet 233 and the magnetic field generated from the first coil 231. Each of the plurality of magnetic sensor devices 1 generates a detection signal based on the position of the corresponding first magnet 233 and sends it to the processor. The processor detects the position information of the lens 220 in the U direction and the V direction based on the detection signal, and controls the drive device 230 to correct the shake.

[0094] Next, refer to Figure 10A to Figure 25 The magnetic sensor device 1 of the present invention will be described in detail. Fig. 10A This is a plan view of a simulated model in which a hole 11 having a quadrilateral outline O11 is formed on the first surface 10B of the sensor substrate 10 as viewed from the surface perpendicular direction Z, and shows positions P and Q plotted on the upper surface 3A of the sensor chip 3 .

[0095] like Fig. 10AAs shown, the position directly above the corner C1 of the square hole 11 with a size of 280 μm in the X-axis direction and the Y-axis direction is set as P=0, and the position is moved 10 μm in the X-axis direction and the Y-axis direction, respectively, and plotted as P=1, 2, 3, ... 14. For example, P=14 is at a position 140 μm away from P=0 in the X-axis direction and the Y-axis direction, respectively. Similarly, the position directly above the corner C1 is set as Q=0, and the position is moved 10 μm in the X-axis direction, respectively, and plotted as Q=1, 2, 3, ... 14.

[0096] Fig. 10B 1 is a top view of a simulated model of a hole 11 having a rounded quadrilateral outline O11 formed on the first surface 10B of the sensor substrate 10 when viewed from the plane vertical direction Z, and shows a position P plotted on the upper surface 3A of the sensor chip 3. Fig. 10B As shown, the position directly above the corner C1 of the square hole 11 with a radius of 200 μm and a radius of 340 μm in the X-axis direction and the Y-axis direction is assumed to be P=0, and it is moved successively by 10 μm in the X-axis direction and the Y-axis direction, respectively, and is plotted as P=1, 2, 3, ... 14.

[0097] Fig. 10C 1 is a top view of a simulated model in which a circular hole 11 is formed on the first surface 10B of the sensor substrate 10 when viewed from the plane perpendicular direction Z, and shows the position P plotted on the upper surface 3A of the sensor chip 3. Fig. 10C As shown, the position directly above the contour O11 of the circular hole 11 with a diameter of 400 μm is assumed to be P=0, and the positions are successively moved by 10 μm in the X-axis direction and the Y-axis direction, and are plotted as P=1, 2, 3, ..., 14.

[0098] Fig. 10D It is observed from the vertical direction Z Fig. 10A The model shown also includes a top view of a simulated model of a wiring layer 4 having a square shape of 100 μm in the X-axis direction and the Y-axis direction. The wiring layer 4 is arranged so that its center is at the position of P=0. Fig.15 In the simulation results, Fig. 10D same, Fig. 10B and Fig. 10C The model shown also includes a wiring layer 4 having a square shape of 100 μm in the X-axis direction and the Y-axis direction, which is arranged so as to be centered at the position of P=0.

[0099] Fig. 10E 1 is a top view of a simulated model having an inner surface 11C inclined relative to the plane vertical direction Z when viewed from the plane vertical direction Z, and shows the position P plotted on the upper surface 3A of the sensor chip 3. Fig. 10EAs shown, the simulation model is a square hole 11 with a size of 400 μm in the X-axis direction and the Y-axis direction. Fig.11 The deepest center depth D shown is 15 μm, and there is no bottom surface 10D. Instead, the inner surface 11C is formed into an inclined surface or a step shape. In the simulation model, a hole 11 is added in a manner overlapping the hole 11. Fig. 10D The wiring layer 4 shown is plotted as P=1, 2, 3, ... 14, with the position directly below the center of the wiring layer 4 being 0.1 μm is moved successively in the X-axis direction and the Y-axis direction respectively.

[0100] Fig.11 It is a cross-sectional view when the simulated model is observed along the XY plane orthogonal to the plane vertical direction Z. Among them, the contour O11 of the hole portion 11 is the contour of the bottom surface 11D of the hole portion 11, which is defined by the boundary between the bottom surface 11D and the inner surface 11C. A rounded corner may also be formed at the boundary between the bottom surface 11D and the inner surface 11C. In this case, if the bottom surface 11D is flat and the depth D from the first surface 10B to the bottom surface 11D is approximately constant, the position where the depth D starts to decrease is the boundary between the bottom surface 11D and the inner surface 11C.

[0101] In the following Figure 12 to Figure 16 In the simulation results of , the thickness T from the first surface 10B to the second surface 10A of the sensor substrate 10 is 15 μm, and the thickness of the functional film 20 is also 15 μm. Fig.15 In the simulation results of , the distance from upper surface 3A of sensor chip 3 to the lower surface of wiring layer 4 is 5 μm.

[0102] Fig.12 It means in Fig. 10A The position P shown in Fig.11 The simulated angular error diagram at each depth D is shown. Fig. 10A The position P shown changes in 15 modes from 0 to 14, making Fig.11 The depth D from the first surface 10B of the sensor substrate 10 to the bottom surface 11D of the hole 11 is changed in four modes of 0 μm, 5 μm, 7.5 μm, and 15 μm, and the simulation results of the angular error when a predetermined stress value is applied to the magnetic sensor device 1 are plotted on the vertical axis.

[0103] When the depth D is less than 15 μm, the hole 11 is formed as a bottomed hole that is recessed from the first surface 10B toward the second surface 10A of the sensor substrate 10. When the depth D is 15 μm, the hole 11 is formed as a through hole that passes from the first surface to the second surface. Even if the hole 11 is a through hole, the magnetic detection element E is fixed by the functional film 20 surrounding the magnetic detection element E.

[0104] like Fig.12As shown, the closer to P = 0, the larger the angle error becomes. When the magnetic detection element E is located directly above the corner C1, it is easily affected by the thermal stress from the sensor substrate 10. In the in-plane direction orthogonal to the plane vertical direction Z, it is preferred that the magnetic detection elements E are each configured so that the corners C1 to C4 are spaced at intervals of 10 μm or more.

[0105] The deeper the depth D of the hole 11 , the larger the angle error becomes. The depth D of the hole 11 is preferably equal to or less than half of the thickness T=30 μm of the sensor substrate 10 .

[0106] Fig.13 It means in Fig. 10A The position Q shown in Fig.11 The angle error diagram simulated at each depth D shown in FIG. Fig. 10A The position Q shown changes in 14 modes from 1 to 14, making Fig.11 The depth D of the hole 11 shown is changed in four patterns of 0 μm, 5 μm, 7.5 μm, and 15 μm, and the simulation results of the angle error when a predetermined stress value is applied to the magnetic sensor device 1 are plotted on the vertical axis.

[0107] like Fig.13 As shown, the closer to Q = 0 (with Fig.12 The angle error becomes larger as the angle increases. When the magnetic detection element E is located directly above the corner C1, it is easily affected by the thermal stress from the sensor substrate 10. Whether it is P that is separated from the contour O11 of the hole 11 or Q that moves on the contour O11 of the hole 11, the tendency that the angle error becomes larger as it approaches the corner C1 is common.

[0108] Fig.14 The depth D of the hole 11 is fixed at 15 μm. Fig. 10A , Fig. 10B and Fig. 10C The position P shown in φ is changed in 15 patterns from 0 to 14 to simulate the angular error obtained when a predetermined stress value is applied to the magnetic sensor device 1 .

[0109] like Fig.14 As shown, there is a tendency for the angle error to increase in the order of the model in which the contour O11 of the hole 11 is a quadrilateral with rounded corners, a circular model, and a quadrilateral model. In any model, the closer to P=0, the larger the angle error. When the magnetic detection element E is located directly above the corner C1, it is easily affected by the thermal stress from the sensor substrate 10.

[0110] Fig.15 The depth D of the hole 11 is fixed at 15 μm and the Fig. 10DThe wiring layer 4 shown in FIG. Fig. 10A , Fig. 10B and Fig. 10C The position P shown is changed in 15 patterns from 0 to 14 to simulate the angle error obtained when a predetermined stress value is applied to the magnetic sensor device 1 .

[0111] Will Fig.14 and Fig.15 Compared with the simulation results, the contour O11 of the hole 11 is a quadrilateral, a quadrilateral with rounded corners, and a circle. There is a tendency that the angle error of the model with the wiring layer 4 is smaller than the angle error of the model without the wiring layer 4 at positions P=0 to 3 located inside the contour O4 of the wiring layer 4. In other words, it can be expected that the sensor substrate 10 is not easily affected by thermal stress. However, in the case of the quadrilateral model, the angle error of the model with the wiring layer 4 is larger than the angle error of the model without the wiring layer 4 at positions P=4 to 6 near the contour O4 of the wiring layer 4.

[0112] Fig.16 Show Fig. 10E P shown is changed in 15 patterns ranging from 0 to 14, thereby simulating the angle error obtained when a predetermined stress value is applied to the magnetic sensor device 1. Fig.15 and Fig.16 Compared with the simulation results, the model in which the inner surface 11C is inclined relative to the plane vertical direction Z and the model in which the inner surface 11C is formed in a step shape both have larger angle errors than the model in which the inner surface 11C is not inclined. That is, there is a tendency to be easily affected by the thermal stress from the sensor substrate 10.

[0113] Reference Figures 17 to 25 , the preferred examples of the present invention are described. Figure 12 to Figure 15 As described above, the closer to the corners C1 to C4 , the larger the angular error. When the magnetic detection element E is located right above the corners C1 to C4 , it is easily affected by the thermal stress from the sensor substrate 10 . Figures 17 to 20 1 to 4 are top views showing the first to fourth examples in which all magnetic detection elements are arranged so as not to overlap with the outline of the hole portion. All magnetic detection elements E are arranged so as not to overlap with the outline O11 of the hole portion 11. In the first to fourth examples, each of the plurality of magnetic detection elements E does not overlap with any corners C1 to C4 of the outline O11 of the hole portion 11 in the top view, so the magnetic detection elements E are not easily affected by the thermal stress from the sensor substrate 10.

[0114] exist Fig.17In the first example shown, in the top view, a portion of the plurality of magnetic detection elements E is arranged inside the outline O11 of the hole 11, and the other portion of the plurality of magnetic detection elements E is arranged outside the outline O11 of the hole 11. Fig.17 In the first example shown, the magnetic detection element is arranged inside and outside the outline O11.

[0115] You can also Fig.18 As in the second example shown in FIG. 1 , the hole portion 11 is arranged across a plurality of bridge circuits. Figures 17 to 24 In the example shown, the magnetic sensor device 1 includes first to fourth magnetic detection element arrays 31, 32, 33, and 34, and two parallel circuits constitute a first bridge circuit. Fig.18 In the second example shown, the magnetic sensor device 1 further includes fifth to eighth magnetic detection element arrays 35 , 36 , 37 , and 38 , and a second bridge circuit is formed by two parallel circuits.

[0116] The first magnetic detection element array 31 and the second magnetic detection element array 32 are connected in series with the output port A sandwiched therebetween to form a parallel circuit of the first bridge circuit, and the third magnetic detection element array 33 and the fourth magnetic detection element array 34 are connected in series with the output port B sandwiched therebetween to form another parallel circuit of the first bridge circuit. Similarly, the fifth magnetic detection element array 35 and the sixth magnetic detection element array 36 are connected in series with the output port A sandwiched therebetween to form a parallel circuit of the second bridge circuit, and the seventh magnetic detection element array 37 and the eighth magnetic detection element array 38 are connected in series with the output port B sandwiched therebetween to form another parallel circuit of the second bridge circuit. The output ports A and B are connected to a galvanometer or the like. Fig.18 In the second example shown, similarly to the first example, the magnetic detection element is arranged so as to straddle the inside and outside of the outline O11.

[0117] The magnetic sensor device 1 of the present invention can be Fig.19 As in the third example shown in the figure, all of the plurality of magnetic detection elements E are arranged inside the outline O11 in the plan view, or as in the example Fig. 20 As in the fourth example shown, all of the plurality of magnetic detection elements E are arranged outside the outline O11 in a plan view. The magnetic sensor device 1 of the present disclosure has few restrictions on the arrangement of the magnetic detection elements E and is excellent in the degree of freedom of design.

[0118] Figure 21 to Figure 23, are top views showing the fifth to seventh examples in which the first magnetic detection element E1 is arranged so as to overlap with the outline O11 of the hole 11 except for the corners C1 to C4, and the second magnetic detection element E2 is arranged so as not to overlap with the outline O11 of the hole 11. Although the positions overlapping with the outline O11 of the hole 11 except for the corners C1 to C4 are slightly more susceptible to thermal stress than the positions not overlapping with the outline O11, the influence of thermal stress is sufficiently small compared with the positions overlapping with the corners C1 to C4. In the fifth to seventh examples, in the top view, each of the plurality of magnetic detection elements E does not overlap with any of the corners C1 to C4 of the outline O11 of the hole 11. Therefore, the magnetic detection elements E (the first magnetic detection element E1 and the second magnetic detection element E2) are not easily affected by the thermal stress from the sensor substrate 10.

[0119] In the magnetic sensor device 1 of the present disclosure, it is possible to Fig.21 As in the fifth example shown in the figure, the second magnetic detection element E2 which does not overlap with the outline O11 of the hole 11 is arranged to extend inside and outside the outline O11 in the plan view, or as in the example Fig. 22 As in the sixth example shown in the figure, the entire second magnetic detection element E2 is arranged inside the outline O11 in the plan view, or as in the example Fig.23 As in the seventh example shown, all of the second magnetic detection elements E2 are arranged outside the outline in a plan view. The magnetic sensor device 1 of the present disclosure has few restrictions on the arrangement of the magnetic detection elements E and is excellent in the degree of freedom of design.

[0120] Fig.24 The magnetic detection element E is arranged inside the outline O4 of the wiring layer 4. Fig.17 The first example shown is a top view of the eighth example in which the wiring layer 4 is added. In the eighth example, as in the first example, each of the plurality of magnetic detection elements E does not overlap with any corners C1 to C4 of the outline O11 of the hole 11 in the top view. Therefore, the magnetic detection element E is not easily affected by the thermal stress from the sensor substrate 10. Fig.15 As described above, when the number of wiring layers 4 is increased, the angle error becomes smaller inside the outline O4 of the wiring layer 4. In the eighth example, it can be expected that the influence of thermal stress becomes smaller than in the first example.

[0121] Fig.25 2 is a cross-sectional view showing a ninth example in which the magnetic detection element is arranged so as not to overlap with the inclined inner surface. Fig.16As described above, when there is an inner surface 11C inclined with respect to the plane perpendicular direction Z, the position overlapping with the inner surface 11C in the top view tends to be easily affected by the thermal stress from the sensor substrate 10. In the ninth example, since each of the plurality of magnetic detection elements E does not overlap with the inclined inner surface 11C, the magnetic detection elements E are not easily affected by the thermal stress from the sensor substrate 10.

[0122] According to the magnetic sensor device 1 of the present disclosure constructed as described above, since the hole portion 11 is formed in the sensor substrate 10, even if the amount of adhesive AD applied changes, the amount of adhesive AD overflowing from the first surface 10B of the sensor substrate 10 is not likely to change compared to a case where the hole portion 11 is not formed. The adhesive layer becomes thicker and the bonding strength is also improved. Therefore, the sensor substrate 10 can be bonded to the support substrate 2 and properly fixed. In the top view, although the position overlapping with the corners C1 to C4 of the outline O11 of the hole portion 11 is easily affected by thermal stress, each of the multiple magnetic detection elements E does not overlap with any of the corners C1 to C4, and is therefore not easily affected by thermal stress. A magnetic sensor device 1 with stable output performance of a magnetic detection element array can be provided.

[0123] The above-described embodiments are embodiments described for easy understanding of the present invention and are not intended to limit the present invention. The various elements and their configurations, materials, conditions, shapes, and sizes of the embodiments are not limited to the illustrated methods and can be appropriately changed. In addition, the structures described in different embodiments can be partially replaced or combined with each other.

Claims

1. A magnetic sensor device, characterized in that: have: a support substrate; and a sensor substrate fixed to the support substrate, The sensor substrate has a first surface facing the support substrate and a second surface located on the opposite side of the first surface, and a functional film including a plurality of magnetic detection elements is provided on the second surface. A hole is formed on the first surface, The profile of the hole portion includes at least one corner, Each of the plurality of magnetic detection elements is arranged so as not to overlap with any of the at least one corner portion in a plan view when viewed along a surface perpendicular direction from the second surface toward the first surface.

2. The magnetic sensor device according to claim 1, wherein: The sensor substrate is fixed to the support substrate using an adhesive. The hole is filled with the adhesive.

3. The magnetic sensor device according to claim 1, wherein: Each of the plurality of magnetic detection elements is arranged so as not to overlap with the outline in the plan view.

4. The magnetic sensor device according to claim 3, characterized in that: A portion of the plurality of magnetic detection elements is arranged inside the outline in the plan view, and a remaining portion of the plurality of magnetic detection elements is arranged outside the outline in the plan view.

5. The magnetic sensor device according to claim 3, wherein: All of the plurality of magnetic detection elements are arranged inside the outline in the plan view.

6. The magnetic sensor device according to claim 3, characterized in that: All of the plurality of magnetic detection elements are arranged outside the outline in the plan view.

7. The magnetic sensor device according to claim 3, characterized in that: Each of the plurality of magnetic detection elements is arranged at a distance of 1 μm or more from the contour in a direction perpendicular to the plane.

8. The magnetic sensor device according to claim 1, wherein: The plurality of magnetic detection elements include at least one first magnetic detection element arranged so as to overlap with the outline in the plan view.

9. The magnetic sensor device according to claim 8, characterized in that: The plurality of magnetic detection elements further include: a plurality of second magnetic detection elements arranged so as not to overlap with the outline in the plan view; A portion of the plurality of second magnetic detection elements is arranged inside the outline in the plan view, and a remaining portion of the plurality of second magnetic detection elements is arranged outside the outline in the plan view.

10. The magnetic sensor device according to claim 8, wherein: The plurality of magnetic detection elements further include: at least one second magnetic detection element arranged so as not to overlap with the outline in the plan view; The at least one second magnetic detection element is entirely arranged inside the outline in the plan view.

11. The magnetic sensor device according to claim 8, wherein: The plurality of magnetic detection elements further include: at least one second magnetic detection element arranged so as not to overlap with the outline in the plan view; All of the at least one second magnetic detection element is arranged outside the outline in the plan view.

12. The magnetic sensor device according to claim 1, wherein: The plurality of magnetic detection elements are arranged at intervals of 1 μm or more from all of the at least one corner portion in an in-plane direction perpendicular to the plane-perpendicular direction.

13. The magnetic sensor device according to claim 1, wherein: The hole portion is a bottomed hole that is recessed from the first surface toward the second surface. The depth of the bottomed hole in the direction perpendicular to the surface is less than or equal to half of the thickness of the sensor substrate.

14. The magnetic sensor device according to claim 1, wherein: It further comprises: a wiring layer provided in a layer farther from the support substrate than the functional film in a direction perpendicular to the surface; Each of the plurality of magnetic detection elements is arranged inside the outline of the wiring layer in the plan view.

15. The magnetic sensor device according to claim 1, wherein: The hole portion has an inner surface inclined relative to a direction perpendicular to the surface, Each of the plurality of magnetic detection elements is arranged so as not to overlap with the inner surface in the plan view.

16. A magnetic sensor device, characterized in that: have: a support substrate; and a sensor substrate fixed to the support substrate, The sensor substrate has a first surface facing the support substrate and a second surface located on the opposite side of the first surface, and a functional film including a plurality of magnetic detection elements is provided on the second surface. A hole portion is formed on the first surface, the hole portion being a bottomed hole recessed from the first surface toward the second surface or a through hole penetrating from the first surface to the second surface, The outline of the hole portion is a circle excluding corners.

17. An angle sensor, characterized in that: A magnetic sensor device according to claim 1 or 16.

18. A magnetic compass, characterized in that: A magnetic sensor device according to claim 1 or 16.

19. A current sensor, characterized in that: A magnetic sensor device according to claim 1 or 16.

20. A camera assembly, characterized in that: include: A magnetic sensor device comprising an autofocus mechanism and / or an optical shake correction mechanism according to claim 1 or 16.

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