Optical design integrated with photonics

Abstract

The invention relates to optical design of integrated photonics. An optical assembly includes a plurality of laser integrated circuits operable to output a similar number of optical or laser signals. The lightwave circuit is placed to receive an optical signal or a laser signal, and is operable to phase shift the optical signal or the laser signal, combine the phase shifted optical signal or laser signal, and output the phase shifted and combined optical signal or laser signal. The lens is positioned to receive, focus and output the phase shifted and combined optical or laser signal output by the lightwave circuit to the core of the fiber optic cable.

Description

Technical Field

[0001] The present disclosure describes a new optical design for integrated photonics, and more specifically a new transmit optical subassembly (TOSA). Background Art

[0002] Current TOSA designs based on free space optics include multiple different parts or components that are difficult to assemble. Therefore, current TOSA designs are both time-consuming and costly to produce. An example TOSA design is disclosed in CN 112946838A.

[0003] An exemplary TOSA design today includes a hard physical connection between a laser (e.g., a laser chip or laser integrated circuit) mounted on or coupled to a support carrier or substrate made of glass and a waveguide formed on or formed in or supported by the support carrier or substrate. Metal containers for isolators and lenses are coupled or connected to the support carrier or substrate. One or more wire bonds electrically connecting the laser (e.g., a laser chip or laser integrated circuit) to one or more conductors on the support carrier or substrate need to be long enough to account for expected mechanical changes, but not too long to degrade RF performance.

[0004] Current exemplary TOSA designs are relatively large and difficult to fit into current housings. In addition, the supporting carrier or substrate made of glass is insufficient in that glass is not a good thermal conductor. Summary of the invention

[0005] An optical assembly is disclosed herein, including a laser unit, the laser unit including a first laser integrated circuit operable to output a first optical signal or laser signal and a second laser integrated circuit for outputting a second optical signal or laser signal. The lightwave unit includes a lightwave circuit positioned to receive the first optical signal and the second optical signal. The lightwave circuit includes a device for generating a phase shift between the first optical signal and the second optical signal, a device for combining the phase-shifted first optical signal and the second optical signal, and a device for outputting the phase-shifted and combined first optical signal and the second optical signal. Finally, the optical assembly includes an optical unit, the optical unit including a lens for focusing the phase-shifted and combined first optical signal and the second optical signal output by the device for outputting the phase-shifted and combined first optical signal and the second optical signal, and for outputting the focused and phase-shifted combined first optical signal and the second optical signal to the core of an optical fiber cable that is not part of the optical assembly.

[0006] The present invention also discloses an optical assembly, including a plurality of laser integrated circuits operable to output a plurality of similar optical or laser signals. The lightwave circuit is positioned to receive the plurality of optical or laser signals, and the lightwave circuit is operable to phase-shift the plurality of optical or laser signals, combine the phase-shifted plurality of optical or laser signals, and output the phase-shifted and combined plurality of optical or laser signals. The lens is positioned to receive, focus, and output the phase-shifted and combined plurality of optical or laser signals output by the lightwave circuit to the core of the optical fiber cable. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] Figure 1 is a perspective view of a non-limiting example TOSA according to the principles of the present disclosure, including, from left to right, a laser unit, a lightwave unit (shown partially transparent), and an optical unit coupled to a fiber optic cable;

[0008] Figure 2 is along Figure 1 The cross-sectional view obtained along the II-II line in FIG.

[0009] Figure 3 yes Figure 2 The winning bid is Figure 3 Magnified view of the feature shown in the box;

[0010] Figure 4 Can be used in direct modulation mode Figure 1 An example electrical schematic diagram of a signal source and a laser integrated circuit for a laser unit shown in;

[0011] Figure 5 It is available for external modulation mode Figure 1 An example electrical schematic diagram of a signal source, laser integrated circuit and modulator of a laser unit shown in;

[0012] Figure 6 yes Figure 1 An example lightwave circuit for the lightwave unit shown; and

[0013] Figure 7 yes Figure 1 Another example lightwave circuit of a lightwave unit is shown. DETAILED DESCRIPTION

[0014] Various non-limiting examples are now described with reference to the drawings, wherein like reference numerals correspond to identical or functionally equivalent elements.

[0015] For the purpose of the following description, terms such as "end", "upper", "lower", "right", "left", "vertical", "horizontal", "top", "bottom", "lateral", "longitudinal" and their derivatives shall be related to the examples of orientation in the accompanying drawings. However, it should be understood that the examples may adopt various alternative variations and step sequences unless expressly specified to the contrary. It should also be understood that the specific examples shown in the drawings and described in the following specification are merely illustrative examples or aspects of the present disclosure. Therefore, the specific examples or aspects disclosed herein are not to be construed as limiting.

[0016] In addition, as adopted herein, all numbers used in the specification and claims to represent dimensions, physical properties, processing parameters, ingredient quantities, reaction conditions, etc. should be understood to be modified by the term "about" or "approximately" in all cases. Therefore, unless otherwise indicated, the numerical values ​​set forth in the following specification and claims can vary according to the desired characteristics sought to be obtained by the present disclosure. At least, each numerical value should at least be interpreted according to the number of reported significant figures and by applying the commonly used rounding method. In addition, all ranges disclosed herein should be understood to include the starting and ending range values ​​and any and all sub-ranges contained therein. For example, the stated range "1 to 10" should be deemed to include any and all sub-ranges between the minimum value 1 and the maximum value 10 (inclusive); that is, all sub-ranges starting with a minimum value of 1 or greater and ending with a maximum value of 10 or less, for example, 1 to 3.3, 4.7 to 7.5, 5.5 to 10, etc. "One" or "one" refers to one or more.

[0017] As used herein, "coupled", "coupling" and similar terms refer to two or more elements that are joined, linked, fastened, connected, communicated or otherwise associated (e.g., mechanically, electrically, fluidically, optically and electromagnetically) with each other. In various examples, these elements can be directly or indirectly associated. As an example, element A can be directly associated with element B. As another example, element A can be indirectly associated with element B, such as through another element C. It should be understood that not all associations between the various elements disclosed must be represented. Therefore, there may also be couplings different from those depicted in the figure.

[0018] As used herein, when used with a list of items, the phrase "at least one of" means that different combinations of one or more of the listed items may be used and only one of each item in the list may be required. For example, "at least one of item A, item B, and item C" may include, but is not limited to, item A or item A and item B. This example may also include item A, item B, and item C, or item B and item C. In other examples, "at least one of" may be, for example, but not limited to, two items A, one item B, and ten items C; four items B and seven items C; and other suitable combinations.

[0019] refer to Figures 1 to 3 In some non-limiting embodiments or examples, an optical assembly A according to the principles of the present disclosure may include a laser unit 2, a light wave unit 4 and an optical unit 6, all mounted on an optional bracket or base B (as shown by the dotted line in the figure).

[0020] In an example, the laser unit 2 may include a plurality of side or edge emitting laser integrated circuits (ICs) or chips 8 (hereinafter referred to as "laser ICs"), which may directly provide or output modulated optical or laser signals to the light wave unit 4 in a direct modulation mode or they may indirectly provide or output optical or laser signals to the light wave unit 4 through a modulator 18 of the laser unit 2 in an external modulation mode. In an example, the laser unit 2 may be as follows Figure 1 Four laser ICs 8-1 to 8-4 are shown included. However, this is not to be construed in a limiting sense, as it is contemplated that the laser unit 2 may include any number of laser ICs 8 deemed appropriate and / or desirable for a particular application. For example, the laser unit 2 may include 2, 8, 16, 32, 48, 64, or more laser ICs 8.

[0021] exist Figure 1 In the example shown, the laser ICs 8-1 to 8-4 may be mounted on or to a carrier substrate unit including the carrier substrates 10-1 to 10-4 in any suitable and / or desired manner, which may also have other optional electronic components mounted thereon or thereto that support the operation of the laser ICs 8-1 to 8-4, such as one or more capacitors (not shown) and / or signal sources 14-1 to 14-4. In another example (not shown), all of the laser ICs 8-1 to 8-4 and other optional electronic components that support the operation of each laser integrated circuit 8-1 to 8-4 may be mounted on a carrier substrate unit that includes a single carrier substrate 10. Of course, other combinations of laser units 2 that include carrier substrate units that include two or more carrier substrates 10, each of which supports portions of two or more laser ICs 8 and other optional electronic components that support the operation of each laser integrated circuit 8-1 to 8-4, are contemplated.

[0022] In an example, each carrier substrate 10 may be made of any suitable and / or desired electrically insulating material, such as a ceramic (e.g., AlN) or a conventional printed circuit board material, which may include conductive traces or lines, such as copper traces or lines, to connect components mounted on the carrier substrate 10 to each other and / or to external signals and / or power supplies required for operation of the laser integrated circuit 8 mounted to or on the carrier substrate 10.

[0023] Combination Figure 4 And continue to refer to Figures 1 to 3 In an example, each of the laser ICs 8-1 to 8-4 can be used in a direct modulation mode, where a separate modulated electrical signal M1 to M4 can be provided from the signal source 14-1 to 14-4 to the corresponding laser IC 8-1 to 8-4 via an electrical conductor (such as, for example, leads 16-1 to 16-4). The data modulated on the electrical signal M1 to M4 can be provided to each signal source 14-1 to 14-4 by a controller 17, which in the example described herein can be disposed off-board or external to the carrier substrate 10-1 to 10-4 and can be coupled to the signal source 14-1 to 14-4 in any suitable and / or desired manner. When used in a direct modulation mode, each laser integrated circuit 8 can directly provide or output its modulated optical signal or laser signal O to the lightwave unit 4.

[0024] Although Figures 1 to 3 Signal sources 14-1 to 14-4 are shown disposed on carrier substrates 10-1 to 10-4, but this is not to be construed in a limiting sense, as it is conceivable that the signal sources 14-1 to 14-4 may not be included in or mounted on the carrier substrates 10-1 to 10-4, but rather the signal sources 14-1 to 14-4 may be disposed off-board or external to the carrier substrates 10-1 to 10-4 and may be electrically connected to the carrier substrates 10-1 to 10-4 and / or the laser ICs 8-1 to 8-4 in any suitable and / or desired manner.

[0025] Combination Figure 5 And continue to refer to Figures 1 to 3 In another example, each laser IC 8-1 to 8-4 can be used in an external modulation mode, in which the laser ICs 8-1 to 8-4 output different constant wavelength optical signals or laser signals L1 to L4 to the modulators 18-1 to 18-4, respectively. In response to the modulation electrical signals M1 to M4 provided from the controller 17 to the modulators 18-1 to 18-4, the modulators 18-1 to 18-4 can modulate the optical signals or laser signals L1 to L4 output by the corresponding laser ICs 8-1 to 8-4, and then directly provide or output the modulated optical signals or laser signals O1 to O4 to the light wave unit 4.

[0026] The lightwave unit 4 may include optional monitor photodiodes (MPDs) 24-1 to 24-4 placed or arranged on the top surface of the lightwave unit 4 for detecting scattered portions of the modulated light signals or laser signals O1 to O4 input into the lightwave unit 4 by the modulators 18-1 to 18-4 and converting them into corresponding electrical signals, which may be provided as feedback to the controller 17 for controlling the modulated electrical signals M1 to M4, for example, for stability and consistency, the modulated electrical signals M1 to M4 being provided to the modulators 18-1 to 18-4 in a manner known in the art. In an example, the optional monitor photodiodes (MPDs) 24-1 to 24-4 may include devices for detecting portions of the modulated light signals or laser signals O1 to O4 in an input optical waveguide of a lightwave circuit (described below) input to the lightwave unit 4.

[0027] exist Figure 5 In the example shown, each laser integrated circuit 8-1 to 8-4 and its corresponding modulator 18-1 to 18-4 may be integrated on the same die mounted on the carrier substrate 10, as shown in FIG. Figures 1 to 3 In another example (not shown), each modulator 18-1 to 18-4 may be a separate integrated circuit that may be optically coupled to its corresponding laser integrated circuit 8-1 to 8-4 in a manner known in the art, such as via an optical waveguide formed on the carrier substrate 10-1 to 10-4.

[0028] In an example, each example controller 17 described herein may include one or more processors, persistent / static and / or dynamic computer memory (e.g., but not limited to, RAM, ROM, EPROM, EEPROM, etc.) for storing volatile and non-volatile computer readable program code, the volatile and non-volatile computer readable program code being used to control the modulated electrical signals M1 to M4 with or without feedback, for example, to achieve stability and consistency.

[0029] Continue to refer Figures 1 to 3 In an example, the laser unit 2 may further include one or more optional spacers 12 that may support the laser IC 8 at a suitable height for use with the light wave unit 4 in the manner described below. The optional spacers 12 may be omitted if a substrate unit including one or more substrates 10 may support the laser IC 8 and / or the modulator 18 (if provided) at a suitable height for use with the light wave unit 4 in the manner described below without the use of the optional spacers 12.

[0030] exist Figure 1In the example shown, the laser unit 2 includes a spacer unit, the spacer unit including four spacers 12-1 to 12-4, the four spacers supporting carrier substrates 10-1 to 10-4, which in turn support laser ICs 8-1 to 8-4, modulators 18-1 to 18-4 (if provided), and signal sources 14-1 to 14-4 (if provided). Of course, other combinations of laser units 2 including spacer units can be envisioned, the spacer unit including one or more spacers 12, each spacer supporting one or more carrier substrates 10, which in turn support one or more laser ICs 8, one or more modulators 14 (if provided), and one or more signal sources 14 (if provided). Accordingly, the number of spacers 12 including the spacer unit and / or the number of substrates 10 including the substrate unit for supporting any number of laser ICs 8, modulators 18 (if provided), and signal sources 14 (if provided) will not be interpreted in a limiting sense.

[0031] In an example, each pad 12 may be made of any suitable and / or desired electrically insulating material, such as a ceramic like AlN. In an example, it is contemplated that the support and any electrical connection functions provided by the one or more carrier substrates 10 in the manner described above may alternatively be provided by the top surface of the one or more pads 12, and thus the one or more carrier substrates 10 may be omitted.

[0032] The lightwave unit 4 may include a lightwave circuit 20 formed on, in or supported by a substrate 22 (eg, a semiconductor substrate), which may be positioned to receive the optical signal or laser signals O1 to O4 output by the laser unit 2 .

[0033] exist Figure 6 In the example shown, the lightwave circuit 20 may include a 4×1 arrayed waveguide grating (AWG) 30 including an input coupler 32 that may couple optical or laser signals O1 to O4 of different wavelengths provided on, in or to input optical waveguides 26-1 to 26-4 from the laser unit 2 to an array of optical waveguides 34-1 to 34-4 in a manner known in the art, the optical waveguides 34-1 to 34-4 having different physical lengths and thus imparting different phase shifts at the exits of the optical waveguides 34-1 to 34-4 to the output coupler 36. The optical or laser signals O1 to O4 may be provided directly to the input optical waveguides 26-1 to 26-4 by the laser ICs 8-1 to 8-4 (in direct modulation mode) or via the modulators 18-1 to 18-4 (in external modulation mode). The output coupler 36 may combine the phase-shifted optical or laser signals O1 to O4 of different wavelengths into a single optical or laser signal S which is output to the optical unit 6 via the output optical waveguide 38 in a manner known in the art.

[0034] In the example of the lightwave circuit 20 including the AWG 30, the input coupler 32 and the bundle or array of optical fibers 34-1 to 34-4 may include a device for generating a phase shift between the optical signals or laser signals O1 to O4, the output coupler 36 may include a device for combining the phase-shifted optical signals or laser signals O1 to O4 into the optical signal or laser signal S, and the output optical waveguide 38 may include a device for outputting the phase-shifted and combined optical signals or laser signals O1 to O4 combined on the optical signal or laser signal S to the optical unit 6.

[0035] exist Figure 7 In another example shown, the lightwave circuit 20 may include a 4×1 Mach-Zehnder interferometer (MZI) 40 including a first 2×1 MZI 42, a second 2×1 MZI 44, and a third 2×1 MZI 46, which may be used to combine optical signals or laser signals O1 to O4 having different wavelengths provided on, in, or to the input optical waveguides 26-1 to 26-4 from the laser unit 2 into a single optical signal or laser signal S output to the optical unit 6 via the output optical waveguide 38. More specifically, the first MZI 42 may be optically coupled to receive the optical signals or laser signals O1 to O2 from the laser unit 2 via the input optical waveguides 26-1 and 26-2. The first MZI 42 may be operable to phase shift the different wavelength optical or laser signals O1 to O2 and combine the phase shifted different wavelength optical or laser signals O1 to O2 into a single optical or laser signal O5 output on the optical waveguide 26 - 5 .

[0036] The second MZI 44 may be optically coupled to receive optical signals or laser signals O3 to O4 from the laser unit 2 via the input optical waveguides 26-3 and 26-4. The second MZI 42 may be operable to phase shift the different wavelength optical signals or laser signals O3 to O4 and combine the phase shifted different wavelength optical signals or laser signals O3 to O4 into a single optical signal or laser signal O6 output on the optical waveguide 26-6.

[0037] The third MZI 46 may be optically coupled to receive optical signals or laser signals O5 to O6 from the corresponding first MZI 42 and second MZI 44 via optical waveguides 26-5 to 26-6. The third MZI 44 may be operable to phase shift the optical signals or laser signals O5 to O6 and combine the phase-shifted optical signals or laser signals O5 to O6 of different wavelengths into a single optical signal or laser signal S output to the optical unit 6 via the output optical waveguide 38.

[0038] The first MZI 42 may include an input coupler 48-1, which may couple optical signals or laser signals O1 to O2 having different wavelengths provided on, in or to the input optical waveguides 26-1 to 26-2 from the laser unit 2 to an array (e.g., pair) of optical waveguides 50-1 to 50-2 in a manner known in the art, the optical waveguides 50-1 to 50-2 having different physical lengths and thus applying different phase shifts at the exits of the optical waveguides 50-1 to 50-2 to the output coupler 52-1. The output coupler 52-1 may combine the phase-shifted optical signals or laser signals O1 to O2 of different wavelengths into an optical signal or laser signal O5 output to the input optical coupler 48-3 of the third MZI 46 via the optical waveguide 26-5 in a manner known in the art.

[0039] In a manner similar to the first MZI 42, the second MZI 44 may include an input coupler 48-2 that may couple optical signals or laser signals O3 to O4 having different wavelengths provided on, in, or to the input optical waveguides 26-3 to 26-4 from the laser unit 2 to an array (e.g., pair) of optical waveguides 50-3 to 50-4 having different physical lengths and thus applying different phase shifts at the exits of the optical waveguides 50-3 to 50-4 to the output coupler 52-2 in a manner known in the art. The output coupler 52-2 may combine the phase-shifted optical signals or laser signals O3 to O4 of different wavelengths into an optical signal or laser signal O6 that is output to the input optical coupler 48-3 of the third MZI 46 via the optical waveguide 26-6 in a manner known in the art.

[0040] The input coupler 48-3 of the third MZI 46 can couple the optical signals or laser signals O5 to O6 provided on, in or to the optical waveguides 26-5 to 26-6 to an array (e.g., pair) of optical waveguides 50-5 to 50-6 in a manner known in the art, the optical waveguides 50-5 to 50-6 having different physical lengths and thus applying different phase shifts at the exits of the optical waveguides 50-5 to 50-6 to the output coupler 52-3. The output coupler 52-3 can combine the phase-shifted optical signals or laser signals O5 to O6 into a single optical signal or laser signal S output to the optical unit 6 via the output optical waveguide 38 in a manner known in the art. In this example, the single optical signal or laser signal S can include a combination of the phase-shifted optical signals or laser signals O1 to O4.

[0041] In the example of the lightwave circuit 20 including the 4×1 MZI 40, the bundle or array of input couplers 48-1 to 48-3 and optical fibers 50-1 to 50-6 may include a device for generating a phase shift between the optical signals or laser signals O1 to O4, the output couplers 52-1 to 52-3 may include a device for combining the phase-shifted optical signals or laser signals O1 to O4, and the output optical waveguide 38 may include a device for outputting the phase-shifted optical signals or laser signals O1 to O4 combined on the optical signal or laser signal S to the optical unit 6.

[0042] The exemplary lightwave circuit 20 including the AWG 30 or MZI 40 described above is strictly for illustrative purposes and is not to be construed in a limiting sense, as it is contemplated that the lightwave circuit 20 may include any suitable and / or desired circuit or circuitry selected by one of ordinary skill in the art for a particular application of the optical assembly described herein. Therefore, the description herein of the lightwave circuit 20 including the AWG 30 or MZI 40 is not to be construed in a limiting sense.

[0043] In an example, it is contemplated that the lightwave circuit 20 may be formed on or in the top surface of the semiconductor substrate 22 by conventional semiconductor manufacturing techniques. In another example, the lightwave circuit 20 may be formed on or in a separate substrate that may be attached, bonded, or affixed to or on the top surface of the semiconductor substrate 22 in any suitable and / or desired manner. The top surface of the lightwave circuit 20 may include a protective passivation layer.

[0044] Continue to refer Figures 1 to 3 In an example, the lightwave unit 4 may include an optional bottom or base substrate 53, such as a base semiconductor substrate. The semiconductor substrate 22 may be placed or disposed on a top surface of the optional base semiconductor substrate 53 and may be attached, bonded or pasted thereon or attached, bonded or pasted thereto. As desired, the optional base semiconductor substrate 53 may be used to support the lightwave circuit 20 at a suitable height relative to the laser unit 2 so as to be used to receive the optical signal or laser signal O output by the laser IC 8 (and the modulator 18 of the laser unit 2, if provided) in the manner described above.

[0045] In an example, the lightwave unit 4 may include an optional cover or top layer or substrate 54, such as a top semiconductor substrate, which is placed or disposed on the top surface of the lightwave circuit 20 (e.g., on top of the passivation layer) and may be attached, bonded, or glued thereon or thereto. The top semiconductor substrate 54 may serve as a protective cover layer for the lightwave circuit 20 and / or for dissipating heat generated in the lightwave circuit 20 in response to the propagation of the optical signal or laser signal O from the laser unit 2 through the elements of the lightwave circuit 20 (e.g., waveguides and couplers).

[0046] The top semiconductor substrate 54 may be of any size and may cover any portion or all of the top surface of the lightwave circuit 20 as deemed appropriate and / or desired. In an example, when the top semiconductor substrate 54 is present on top of the lightwave circuit 20, such as Figure 1 and Figure 2 As shown, the top semiconductor substrate 54 may cover only a portion of the top surface of the lightwave circuit 20. For example, Figure 1 and Figure 2 As shown, the top semiconductor substrate 54 may cover only a portion of the top surface of the lightwave circuit 20 that is near or adjacent to the optical unit 6, for example, to optionally help avoid, prevent or reduce ambient light from entering the input aperture 60 of the optical unit 6. In another example, where the lightwave unit 4 includes an optional monitor photodiode 24 mounted on the top surface of the lightwave circuit 20, the top semiconductor substrate 54 may cover only a portion of the top surface of the lightwave circuit 20 that is spaced apart from the monitor photodiode 24, such as Figure 1 and Figure 2 However, the fact that the top semiconductor substrate 54 covers only a portion of the top surface of the lightwave circuit 20 is not to be construed in a limiting sense, as it is contemplated that when the monitor photodiode 24 is not present on the top surface of the lightwave circuit 20, the top semiconductor substrate 54 may cover all or a substantially all of the top surface of the lightwave circuit 20. In examples, the amount of the top surface of the lightwave circuit 20 covered by the top semiconductor substrate 54 and / or the location of the top semiconductor substrate 54 on the top surface of the lightwave circuit 20 may be preferentially selected to optimize the removal of heat generated in the lightwave circuit 20 in response to the propagation of the optical signal from the laser unit 2 or the laser signal O through the elements of the lightwave circuit 20.

[0047] exist Figure 3 In the example best shown in FIG. 1 , the semiconductor substrate 22 may include a cantilever portion 62 extending toward the laser IC 8 and (if present) the modulator 18 of the laser unit 2, with a gap or space 64 defined below the cantilever portion 62 between a side 66 of the semiconductor substrate 22 on which the lightwave circuit 20 is formed or supports the lightwave circuit 20 and a side 68 and / or 70 of one or more substrates 10 and / or pads 12 of the laser unit 2. In an example, a distal end 72 of the cantilever portion 62 and a side of the laser IC 8 or (if present) the modulator 18 of the laser unit 2 may be separated from each other by an air gap or space 74.

[0048] In an example, the length or distance of gap or space 64 may be between 20 μm and 100 μm, and the length or distance of gap or space 74 may be between 3 μm and 10 μm. In an example, the top-to-bottom thickness or height 76 of cantilever portion 62 may be no greater than, and desirably less than, the top-to-bottom thickness or height 78 of laser IC 8 and / or (if present) modulator 18 of laser unit 2. In an example, height 76 may be less than 80 μm.

[0049] In an example, an adhesive 78 (e.g., epoxy) can be disposed in the gap or space 64 to secure the semiconductor substrate 22 in a fixed position relative to the one or more carrier substrates 10 and / or the one or more spacers 12. More specifically, the adhesive 78 can secure the length or distance of the air gap or space 74 between the distal end 72 of the cantilever portion 62 and the side of the laser IC 8 or (when present) the modulator 18 of the laser unit 2 that faces the distal end 72 of the cantilever portion 62.

[0050] In examples, the gap or space 64 below the cantilever portion 62 can be formed in any suitable and / or desired manner. In one example, the gap or space 64 can be formed by extending along the edge of the semiconductor substrate 22 and, if provided, the edge of the optional base semiconductor substrate 53 in an upward direction (e.g., Figures 1 to 3 The cantilever portion 62 is formed by running or moving a rotating cutting or wafer saw blade (in an orientation) and stopping its movement before the cutting saw blade reaches the top surface of the semiconductor substrate 22, thereby forming a cantilever portion 62 with a gap or space 64 below.

[0051] like Figure 1 and Figure 2 As shown, the bottom surface 56 of the semiconductor substrate 22 and the top surface 58 of the optional base semiconductor substrate 53 can have the same size or substantially the same size, so that a gap or space 64 can extend between the bottom surface of the cantilever portion 62 to the bottom surface 59 of the optional base semiconductor substrate 53. Adhesive 78 can also be disposed in a portion of the gap or space 64 between the opposing surfaces of the one or more spacers 12 and the optional base semiconductor substrate 53.

[0052] Continue to refer Figure 1 ,in particular Figure 2 , the optical unit 6 may include a housing 80 having a first end 81, wherein a lens 82 (e.g., a polyetherimide (PEI) lens) is supported in an input hole 60 formed in the housing 80 of the optical unit 6 in a path of an optical signal or laser signal S output by the lightwave circuit 4. The housing 80, including a space or distance between the lens 82 and an optical isolator 84 (described below), may also be formed of PEI.

[0053] The lens 82 focuses the optical signal or laser signal S and outputs the focused optical signal or laser signal S to the optical isolator 84. In a manner known in the art, the optical isolator 84 allows the optical signal or laser signal S to be transmitted to the optical fiber 88 of the optical fiber pigtail assembly 90 of the optical unit 6, but completely or partially blocks the reflection of the optical signal or laser signal S output by the optical fiber 88 to the lens 82. The optical fiber pigtail assembly 90 having the optical fiber 88 is supported at the second end 91 of the housing 80, aligned with the optical signal or laser signal S output by the lens 82 and the optical isolator 84.

[0054] The optical fiber 88 may be part of a fiber optic cable 94 that is not itself part of the optical assembly, and the fiber optic cable 94 includes a cladding 96 that surrounds and protects the optical fiber 88 outside of the fiber pigtail assembly 90. Figure 2 In the example shown, the cladding 96 may be removed from the portion of the optical fiber 88 within the fiber optic pigtail assembly 90. A protective coating 98, such as formed of epoxy, may surround the cladding 96 near or adjacent to where the optical fiber 88 enters the fiber optic pigtail assembly 90 to prevent dust and other unwanted particles or contaminants from entering the inner bore 100 of the fiber optic pigtail assembly 90 in which the optical fiber 88 is disposed.

[0055] Although the present disclosure has been described in detail based on what is currently considered to be the most practical and preferred embodiments for the purpose of illustration, it should be understood that the detailed description is only for this purpose and the present disclosure is not limited to the disclosed embodiments, but rather the present disclosure is intended to cover modifications and equivalent arrangements within the spirit and scope of the appended claims. For example, it should be understood that the present disclosure contemplates that, to the extent possible, one or more features of any embodiment can be combined with one or more features of any other embodiment.

Claims

1. An optical component, comprising: a laser unit comprising a first laser integrated circuit operable to output a first optical signal or a laser signal and a second laser integrated circuit operable to output a second optical signal or a laser signal; A lightwave unit, comprising a lightwave circuit arranged to receive the first optical signal and the second optical signal, the lightwave circuit comprising: means for generating a phase shift between said first optical signal and said second optical signal, means for combining the phase-shifted first and second optical signals, and means for outputting a phase-shifted combined first optical signal and a second optical signal; as well as An optical unit includes a lens for focusing a phase-shifted combined first optical signal and a second optical signal output by a device for outputting a phase-shifted combined first optical signal and a second optical signal, and for outputting the focused phase-shifted combined first optical signal and the second optical signal to a core of an optical fiber cable that is not part of the optical assembly.

2. The optical component of claim 1, wherein the means for outputting the phase-shifted combined first and second optical signals is an optical waveguide.

3. The optical assembly of claim 1, wherein the optical unit comprises an optical isolator located between the lens and the core of the fiber optic cable in the path of the focused, phase-shifted combined first and second optical signals.

4. The optical assembly of claim 1, wherein the lightwave unit comprises a substrate on which the lightwave circuit is formed or supported, the substrate being located atop a base substrate.

5. The optical assembly of claim 4, wherein the lightwave unit comprises a cover substrate located atop at least a portion of the substrate on which the lightwave circuit is formed or supported.

6. The optical assembly of claim 1 , wherein the laser unit comprises a substrate unit, a spacer unit, or both supporting the first laser integrated circuit and the second laser integrated circuit, respective optical outputs of the first laser integrated circuit and the second laser integrated circuit being aligned with inputs of first and second input optical waveguides of the lightwave circuit, the first and second input optical waveguides being optically coupled to a means for generating a phase shift between the first and second optical signals.

7. The optical component of claim 6 , further comprising means for detecting portions of the first optical signal and the second optical signal traveling in the first input optical waveguide and the second input optical waveguide of the optical wave circuit and for outputting first and second electrical signals associated with the detected portions of the first optical signal and the second optical signal traveling in the first input optical waveguide and the second input optical waveguide.

8. The optical assembly of claim 6, wherein: The gasket unit includes a first gasket and a second gasket for the first laser integrated circuit and the second laser integrated circuit; The first laser integrated circuit is located on top of the first spacer; and The second laser integrated circuit is located on top of the second spacer.

9. The optical assembly of claim 1, wherein the lightwave circuit comprises: first and second input optical waveguides positioned to receive input optical signals output by the first and second laser integrated circuits and to provide the input optical signals to means for generating a phase shift between the first and second optical signals; as well as A first photodiode and a second photodiode are positioned to detect portions of an input optical signal traveling in the first input optical waveguide and the second input optical waveguide, and to output first and second electrical signals associated with the detected first and second input optical signals traveling in the first and second input optical waveguides.

10. The optical assembly of claim 1 , wherein the lightwave circuit is formed on or supported by a substrate, the substrate including a cantilever portion extending toward the first laser integrated circuit and the second laser integrated circuit, and defining a gap or space below the cantilever portion between a side of the substrate on which the lightwave circuit is formed or supported and a side of one or more substrates or pads or both supporting the laser units of the first laser integrated circuit and the second laser integrated circuit.

11. The optical assembly of claim 10, wherein a distal end of the cantilever portion and sides of the first and second laser integrated circuits are separated from each other by another gap or space.

12. The optical assembly of claim 10, wherein: the laser unit comprising a first modulator and a second modulator in a path of the first optical or laser signal and the second optical or laser signal output by the first laser integrated circuit and the second laser integrated circuit; and The distal end of the cantilever portion and the sides of the first and second modulators are separated from each other by another gap or space.

13. The optical assembly of claim 10, further comprising an adhesive disposed in the gap or space.

14. An optical component comprising: a plurality of laser integrated circuits operable to output a similar plurality of optical or laser signals; a lightwave circuit disposed to receive the plurality of optical or laser signals, the lightwave circuit being operable to phase shift the plurality of optical or laser signals, combine the phase-shifted plurality of optical or laser signals, and output the phase-shifted and combined plurality of optical or laser signals; as well as The lens is positioned to receive and focus the phase-shifted and combined multiple optical signals or laser signals output by the lightwave circuit and output them to the core of the optical fiber cable.

15. The optical assembly of claim 14, further comprising an optical isolator located between the lens and the core of the fiber optic cable in the path of the focused phase-shifted combined multiple optical or laser signals output by the lightwave circuit.

16. The optical assembly of claim 14, wherein: A plurality of laser integrated circuits are supported by a substrate unit, a spacer unit, or both; The lightwave circuit is formed on or supported by a substrate; and The lens is supported by the housing.

17. An optical component according to claim 16, wherein the lightwave circuit substrate includes a cantilever portion extending toward the plurality of laser integrated circuits and a gap or space below the cantilever portion, the gap or space being located between a side surface of the lightwave circuit substrate below the cantilever portion and a side surface of the substrate unit, the spacer unit, or both.

18. The optical assembly of claim 17, wherein the substrate unit, the spacer unit, or both include one or more substrates or spacers supporting the plurality of laser integrated circuits.

19. The optical assembly of claim 17, wherein a distal end of the cantilever portion and sides of the plurality of laser integrated circuits are separated from each other by another gap or space.

20. The optical assembly of claim 17, further comprising: a plurality of modulators located in the paths of the plurality of optical signals or laser signals output by the plurality of laser integrated circuits; as well as The distal end of the cantilever portion and the sides of the plurality of modulators are separated from each other by another gap or space.

21. The optical assembly of claim 17, further comprising an adhesive disposed in the gap or space.

22. The optical assembly of claim 16, further comprising at least one of the following: A lightwave circuit substrate formed on, supported by, or placed on top of a base substrate (bottom-bonded silicon); and A cover substrate (top bonded silicon) is placed on top of at least a portion of the lightwave circuit substrate.

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