Transversely placed capacitor packaging assembly and assembling method thereof
By designing the horizontal placement capacitor packaging component, the bearing part and positioning part of the capacitor bearing structure ensure that the conductive pins are electrically connected without bending, solving the connection problem of winding capacitors in space-constrained environments , realizes the electrical connection capability of horizontal settings.
Patent Information
- Application Number
- CN202310735574.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-06-20
- Publication Date
- 2024-12-20
AI Technical Summary
The existing winding capacitors cannot adapt to highly space-constrained environments when set up upright, resulting in the conductive pins being unable to be electrically connected to the circuit board without bending.
A transverse placement capacitor packaging assembly is designed, including a winding capacitor packaging structure and a capacitor bearing structure. The bearing part of the capacitor bearing structure penetrates the circuit substrate, and the position is restricted by a plurality of positioning parts to ensure the first conductive pin The second conductive pin extends horizontally from the package assembly without bending, enabling an electrical connection.
It is realized that when the transverse setting, the conductive pin can be electrically connected to the circuit substrate without bending, and is suitable for environments with high space limitations.
Smart Images
Figure CN119170415A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to a capacitor packaging component and an assembling method thereof, in particular to a horizontally placed capacitor packaging component and an assembling method thereof. Background Art
[0002] Capacitors have been widely used as basic components in consumer home appliances, computer motherboards, power supplies, communication products, and automobiles. Their main functions include filtering, bypassing, rectification, coupling, decoupling, phase shifting, etc. They are one of the indispensable components in electronic products. The existing winding capacitors can only be set upright on the circuit substrate without bending the conductive pins. However, the upright winding capacitors cannot be used in highly space-constrained environments. Summary of the invention
[0003] The problem to be solved by the present invention is to provide a horizontally placed capacitor packaging component and an assembly method thereof in view of the shortcomings of the prior art, so that when the horizontally placed capacitor packaging component is configured to be horizontally set on a circuit substrate, the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin can be electrically connected to the circuit substrate without bending.
[0004] In order to solve the above-mentioned problems, one of the technical means adopted by the present invention is to provide a horizontally placed capacitor packaging component, which is configured to be horizontally arranged on a circuit substrate, and the horizontally placed capacitor packaging component includes a wound capacitor packaging structure and a capacitor bearing structure. The wound capacitor packaging structure includes a wound component, a conductive component and a packaging component, the wound component includes a wound positive electrode conductive foil, a wound negative electrode conductive foil and two wound separators, the conductive component includes a first conductive pin electrically contacting the wound positive electrode conductive foil and a second conductive pin electrically contacting the wound negative electrode conductive foil, and the wound component is coated inside the packaging component. The capacitor bearing structure includes a bearing portion configured to bear the wound capacitor packaging structure and a plurality of positioning portions extending outward from the bearing portion. Wherein, one of the two wound isolation sheets is arranged between the wound positive electrode conductive foil and the wound negative electrode conductive foil, and one of the wound positive electrode conductive foil and the wound negative electrode conductive foil is arranged between the two wound isolation sheets; wherein, the first conductive pin includes a first embedded portion accommodated inside the packaging component and a first exposed portion exposed outside the packaging component, and the second conductive pin includes a second embedded portion accommodated inside the packaging component and a second exposed portion exposed outside the packaging component; wherein, when the capacitor supporting structure is configured to be arranged on a circuit substrate, the supporting portion of the capacitor supporting structure is configured to penetrate the circuit substrate, and a plurality of positioning portions of the capacitor supporting structure are configured to be arranged on the circuit substrate for limiting the position of the capacitor supporting structure relative to the circuit substrate; wherein, when the wound capacitor packaging structure is configured to be arranged laterally on the capacitor supporting structure, the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin extend horizontally from the packaging component without bending and are electrically connected to the circuit substrate.
[0005] In order to solve the above-mentioned problems, another technical means adopted by the present invention is to provide a horizontally placed capacitor packaging component, which includes a winding capacitor packaging structure and a capacitor bearing structure. The winding capacitor packaging structure includes a winding component, a conductive component and a packaging component, the conductive component includes a first conductive pin electrically contacting the winding component and a second conductive pin electrically contacting the winding component, and the winding component is coated inside the packaging component. The capacitor bearing structure includes a bearing portion configured to carry the winding capacitor packaging structure and a plurality of positioning portions extending outward from the bearing portion. The first conductive pin includes a first embedded portion accommodated inside the packaging component and a first exposed portion exposed outside the packaging component, and the second conductive pin includes a second embedded portion accommodated inside the packaging component and a second exposed portion exposed outside the packaging component; the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin extend horizontally from the packaging component without bending.
[0006] In order to solve the above-mentioned problem, another technical means adopted by the present invention is to provide an assembly method of a horizontally placed capacitor packaging component, the assembly method of the horizontally placed capacitor packaging component includes: setting a winding capacitor packaging structure and a capacitor bearing structure on a circuit substrate, a bearing portion of the capacitor bearing structure passes through the circuit substrate, and multiple positioning portions of the capacitor bearing structure are set on the circuit substrate; and electrically connecting the winding capacitor packaging structure to the circuit substrate. Wherein, the winding capacitor packaging structure includes a winding component, a conductive component and a packaging component, the conductive component includes a first conductive pin electrically contacting the winding component and a second conductive pin electrically contacting the winding component, and the winding component is coated inside the packaging component; wherein the bearing portion of the capacitor bearing structure is configured to carry the winding capacitor packaging structure, and multiple positioning portions of the capacitor bearing structure extend outward from the bearing portion; wherein a first exposed portion of the first conductive pin and a second exposed portion of the second conductive pin extend horizontally from the packaging component without bending and are electrically connected to the circuit substrate.
[0007] In one feasible or preferred embodiment, the step of arranging the wound capacitor packaging structure and the capacitor supporting structure on the circuit substrate further includes: arranging the wound capacitor packaging structure laterally on the capacitor supporting structure; and arranging the capacitor supporting structure carrying the wound capacitor packaging structure on the circuit substrate.
[0008] In one feasible or preferred embodiment, the step of arranging the wound capacitor packaging structure and the capacitor supporting structure on the circuit substrate further includes: arranging the capacitor supporting structure on the circuit substrate; and, arranging the wound capacitor packaging structure laterally on the capacitor supporting structure.
[0009] In one feasible or preferred embodiment, the packaging component includes a packaging shell configured to accommodate a winding component and a bottom closing structure arranged inside the packaging shell and cooperating with the packaging shell, and the packaging component is completely covered by the packaging shell and the bottom closing structure.
[0010] In one feasible or preferred embodiment, the carrying portion of the capacitor carrying structure has a containing space, and a portion of the packaging component of the wound capacitor packaging structure is contained in the containing space of the carrying portion.
[0011] In one feasible or preferred embodiment, the supporting portion of the capacitor supporting structure has a plurality of heat dissipation openings for partially exposing an outer surface of a packaging shell of a packaging component of the wound capacitor packaging structure.
[0012] In one feasible or preferred embodiment, when the capacitor supporting structure is configured to be disposed on a circuit substrate, a plurality of positioning portions of the capacitor supporting structure are configured to be disposed on an upper surface or a lower surface of the circuit substrate.
[0013] In one feasible or preferred embodiment, when the capacitor supporting structure is configured to be set on a circuit substrate, multiple positioning portions of the capacitor supporting structure are configured to be fixed on multiple positioning areas of the circuit substrate respectively, and each of the multiple positioning areas is a recessed area or a plane area.
[0014] In one feasible or preferred embodiment, when the capacitor supporting structure is configured to be set on a circuit substrate, the supporting portion of the capacitor supporting structure is configured to pass through a long strip opening of the circuit substrate, and the multiple positioning portions of the capacitor supporting structure are arranged along two long sides or two short sides of the long strip opening of the circuit substrate, and the multiple positioning portions of the capacitor supporting structure are separated from each other and correspond to each other or are connected to each other to form a single positioning portion.
[0015] In one feasible or preferred embodiment, when the wound capacitor packaging structure is configured to be laterally disposed on the capacitor supporting structure, a first flat area of the first exposed portion of the first conductive pin and a second flat area of the second exposed portion of the second conductive pin electrically contact a first welding area and a second welding area of the circuit substrate, respectively.
[0016] One of the beneficial effects of the present invention is that the present invention provides a horizontally placed capacitor packaging component, which can be configured to be horizontally arranged on a circuit substrate through the technical solutions of "the capacitor supporting structure includes a supporting portion configured to support a wound capacitor packaging structure and a plurality of positioning portions extending outward from the supporting portion" and "the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin extend horizontally from the packaging component without bending", so that when the horizontally placed capacitor packaging component is configured to be horizontally arranged on a circuit substrate, the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin can be electrically connected to the circuit substrate horizontally without bending.
[0017] One of the beneficial effects of the present invention is that the present invention provides a method for assembling a horizontally placed capacitor packaging component, which can be achieved through the technical solutions of "arranging a winding capacitor packaging structure and a capacitor supporting structure on a circuit substrate, a supporting portion of the capacitor supporting structure passing through the circuit substrate, and multiple positioning portions of the capacitor supporting structure being arranged on the circuit substrate" and "electrically connecting the winding capacitor packaging structure to the circuit substrate", so that when the horizontally placed capacitor packaging component is configured to be arranged horizontally on the circuit substrate, the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin can be electrically connected to the circuit substrate horizontally without bending.
[0018] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings provided are only for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a three-dimensional schematic diagram of the cooperation between the wound component and the conductive component provided by the present invention (before the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin are flattened).
[0020] Figure 2 It is a three-dimensional exploded schematic diagram of the horizontally placed capacitor packaging assembly provided by the present invention.
[0021] Figure 3 It is a three-dimensional assembly schematic diagram of the horizontally placed capacitor packaging assembly provided by the present invention.
[0022] Figure 4 It is a top view schematic diagram of the horizontally placed capacitor packaging assembly provided by the present invention.
[0023] Figure 5 for Figure 4 Schematic cross-sectional view of the VV section line.
[0024] Figure 6 for Figure 4 Schematic cross-sectional view of section line VI-VI.
[0025] Figure 7 A three-dimensional schematic diagram of another capacitor supporting structure used in the horizontally placed capacitor packaging assembly provided by the present invention.
[0026] Figure 8 The present invention is a flowchart of an assembly method of a horizontally placed capacitor packaging assembly.
[0027] Fig. 9 It is a schematic diagram of step S1002 of the method for assembling a horizontally placed capacitor package assembly provided by the present invention.
[0028] Fig.10 It is a schematic diagram of step S1006 of the method for assembling a horizontally placed capacitor package assembly provided by the present invention. DETAILED DESCRIPTION
[0029] The following is an explanation of the implementation methods of the "horizontally placed capacitor packaging component and its assembly method" disclosed in the present invention through specific embodiments. Those skilled in the art can understand the advantages and effects of the present invention from the contents disclosed in this specification. The present invention can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the present invention. In addition, it should be stated in advance that the drawings of the present invention are only simple schematic illustrations and are not depicted according to actual dimensions. The following embodiments will further explain the relevant technical contents of the present invention in detail, but the disclosed contents are not intended to limit the scope of protection of the present invention. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.
[0030] [First embodiment]
[0031] See also Figures 1 to 6 As shown, the first embodiment of the present invention provides a horizontally placed capacitor packaging component S, which is configured to be horizontally arranged on a circuit substrate P, and the horizontally placed capacitor packaging component S includes a winding capacitor packaging structure 1 and a capacitor supporting structure 2.
[0032] First, cooperate Figure 1 and Figure 2As shown, the wound capacitor packaging structure 1 includes a wound component 11, a conductive component 12 and a packaging component 13. More specifically, the wound component 11 includes a wound positive electrode conductive foil 111, a wound negative electrode conductive foil 112 and two wound separators 113, and the conductive component 12 includes a first conductive pin 121 electrically contacting the wound positive electrode conductive foil 111 and a second conductive pin 122 electrically contacting the wound negative electrode conductive foil 112 ( Figure 1 The first conductive pin 121 and the second conductive pin 122 are not flattened yet, and the wound component 11 is wrapped inside the packaging component 13 .
[0033] For example, with Figure 1 and Figure 2 As shown, the wound positive electrode conductive foil 111 and the wound negative electrode conductive foil 112 can be conductive foils made of any conductive material, and the wound separator 113 can be a separator paper or paper foil with conductive polymer attached by impregnation. In addition, one of the two wound separators 113 is arranged between the wound positive electrode conductive foil 111 and the wound negative electrode conductive foil 112, and one of the wound positive electrode conductive foil 111 and the wound negative electrode conductive foil 112 is arranged between the two wound separators 113 (for example, Figure 1 The wound positive electrode conductive foil 111 is shown to be disposed between two wound separators 113. In addition, the first conductive pin 121 includes a first buried portion 1211 accommodated inside the packaging component 13 and a first exposed portion 1212 exposed outside the packaging component 13. Figure 2 A portion of the first exposed portion 1212 is shown to be flattened), and the second conductive pin 122 includes a second buried portion 1221 accommodated in the package component 13 and a second exposed portion 1222 exposed outside the package component 13 ( Figure 2 A portion of the second exposed portion 1222 is shown to be flattened. In addition, the packaging component 13 includes a packaging shell 131 (e.g., an aluminum shell or a shell of any material) configured to accommodate the roll-up component 11 and a bottom end closed structure 132 (e.g., insulating rubber particles that can be surrounded and squeezed by the packaging shell 131) disposed inside the packaging shell 131 and cooperating with the packaging shell 131, and the packaging component 13 can be completely covered by the packaging shell 131 and the bottom end closed structure 132. However, the above example is only one feasible embodiment and is not intended to limit the present invention.
[0034] Furthermore, cooperation Figure 2 and Figure 3As shown, the capacitor bearing structure 2 (or capacitor supporting structure, capacitor supporting structure) includes a bearing portion 21 (or supporting portion, supporting portion) configured to bear the wound capacitor packaging structure 1 and a plurality of positioning portions 22 extending outward from the bearing portion 21. For example, the bearing portion 21 of the capacitor bearing structure 2 has a receiving space 21001 in a semi-arc shape or any shape that conforms to the packaging shell 131, and a portion of the packaging component 13 of the wound capacitor packaging structure 1 can be received in the receiving space 21001 of the bearing portion 21. In addition, the packaging shell 131 of the packaging component 13 of the wound capacitor packaging structure 1 has an outer surface 13100, and most of the outer surface 13100 of the packaging shell 131 will be exposed outside the capacitor bearing structure 2, which will be beneficial to the heat dissipation of the wound capacitor packaging structure 1. It is worth noting that, since the wound capacitor packaging structure 1 can obtain a predetermined strength of bearing and support through the use of the capacitor bearing structure 2, the anti-vibration effect of the wound capacitor packaging structure 1 can be improved (or in other words, the first conductive pin 121 and the second exposed portion 1222 of the wound capacitor packaging structure 1 are not easily separated from the electrical connection relationship with the circuit substrate P due to external vibration). However, the above example is only one feasible embodiment and is not intended to limit the present invention.
[0035] Furthermore, with Figure 3 , Figure 4 and Figure 6 As shown, when the capacitor supporting structure 2 is configured to be disposed on the circuit substrate P, the supporting portion 21 of the capacitor supporting structure 2 can be configured to penetrate the circuit substrate P, and the plurality of positioning portions 22 of the capacitor supporting structure 2 can be configured to be disposed on the circuit substrate P to limit the position of the capacitor supporting structure 2 relative to the circuit substrate P. However, the above example is only one feasible embodiment and is not intended to limit the present invention.
[0036] Furthermore, with Figure 3 , Figure 4 and Figure 5As shown, when the wound capacitor package structure 1 is configured to be laterally disposed on the capacitor support structure 2, the first exposed portion 1212 of the first conductive pin 121 and the second exposed portion 1222 of the second conductive pin 122 can extend horizontally from the package component 13 without bending and be laterally electrically connected to the circuit substrate P. It is worth noting that since the first exposed portion 1212 of the first conductive pin 121 and the second exposed portion 1222 of the second conductive pin 122 do not need to be bent when electrically connected to the circuit substrate P, the wound capacitor package structure 1 can provide electrical characteristics that meet market requirements (or customer requirements). However, the above example is only one feasible embodiment and is not intended to limit the present invention.
[0037] Furthermore, with Figure 3 , Figure 4 and Figure 6 As shown, when the capacitor supporting structure 2 is configured to be disposed on the circuit substrate P, the plurality of positioning portions 22 of the capacitor supporting structure 2 can be configured to be disposed on an upper surface or a lower surface of the circuit substrate P. In other words, according to different usage requirements, the user can selectively dispose the horizontally placed capacitor package assembly S horizontally on the upper surface or the lower surface of the circuit substrate P. However, the above example is only one feasible embodiment and is not intended to limit the present invention.
[0038] Furthermore, with Figure 2 , Figure 3 and Figure 6 As shown, when the capacitor supporting structure 2 is configured to be disposed on the circuit substrate P, the plurality of positioning portions 22 of the capacitor supporting structure 2 can be configured to be fixed on the plurality of positioning areas P101 of the circuit substrate P, respectively, and each of the plurality of positioning areas P101 can be a recessed area (such as Figure 2 As shown, the present invention is explained by taking each of the multiple positioning areas P101 as an example, which can be a recessed area) or a plane area (for example, it can be an area flush with the upper surface of the circuit substrate P). For example, when the multiple positioning portions 22 of the capacitor supporting structure 2 are configured to be fixed respectively in the multiple recessed areas (i.e., multiple positioning areas P101) of the circuit substrate P, the position of the capacitor supporting structure 2 relative to the circuit substrate P can be limited by the mutual cooperation of the "positioning portion 22 and the recessed area (i.e., multiple positioning areas P101)". However, the above example is only one feasible embodiment and is not intended to limit the present invention.
[0039] Furthermore, with Figure 2 , Figure 3 and Figure 4As shown, when the capacitor supporting structure 2 is configured to be disposed on the circuit substrate P, the supporting portion 21 of the capacitor supporting structure 2 can be configured to penetrate a long strip opening P102 of the circuit substrate P. It is worth noting that the plurality of positioning portions 22 of the capacitor supporting structure 2 can be disposed along the two long sides or the two short sides of the long strip opening P102 of the circuit substrate P (e.g. Figure 2 As shown, the present invention is described by taking the multiple positioning portions 22 as an example and arranged along the two long sides of the long strip opening P102 of the circuit substrate P, and the multiple positioning portions 22 of the capacitor supporting structure 2 can be "separated from each other and corresponding to each other" or "connected to each other to form a single positioning portion" (such as Figure 2 As shown, the present invention is described by taking a plurality of positioning portions 22 separated from each other and corresponding to each other as an example). However, the above example is only one feasible embodiment and is not intended to limit the present invention.
[0040] Furthermore, with Figure 2 , Figure 3 and Figure 5 As shown, when the wound capacitor package structure 1 is configured to be horizontally disposed on the capacitor supporting structure 2, a first flat area 12120 of the first exposed portion 1212 of the first conductive pin 121 and a second flat area 12220 of the second exposed portion 1222 of the second conductive pin 122 can be respectively electrically contacted with a first welding area P103 and a second welding area P104 of the circuit substrate P by welding. It is worth noting that the matching Figure 1 and Figure 2 As shown, Figure 2 The first flat area 12120 and the second flat area 12220 are formed by flattening Figure 1 The area formed by the first exposed portion 1212 and the second exposed portion 1222 is used to increase the soldering contact area between the first exposed portion 1212 of the first conductive pin 121 and the second exposed portion 1222 of the second conductive pin 122 and the first soldering area P103 and the second soldering area P104 of the circuit substrate P. However, the above example is only one feasible embodiment and is not intended to limit the present invention.
[0041] It is worth noting that Figure 7As shown, in another feasible embodiment, the carrying portion 21 of the capacitor carrying structure 2 has a plurality of heat dissipation openings 21002, which are used to partially expose the outer surface 13100 of the packaging shell 131 of the packaging component 13 of the wound-type capacitor packaging structure 1. In this way, in addition to dissipating heat through the exposed area that is not shielded by the carrying portion 21 of the capacitor carrying structure 2, the wound-type capacitor packaging structure 1 can also dissipate heat through the plurality of heat dissipation openings 21002 of the carrying portion 21. However, the above example is only one feasible embodiment and is not intended to limit the present invention.
[0042] [Second embodiment]
[0043] See also Figure 3 , Figure 8 , Fig. 9 and Fig.10 As shown, the second embodiment of the present invention provides an assembly method for a horizontally placed capacitor packaging component S, and the assembly method for the horizontally placed capacitor packaging component S includes: first, a wound capacitor packaging structure 1 and a capacitor bearing structure 2 are arranged on a circuit substrate P, a bearing portion 21 of the capacitor bearing structure 2 penetrates the circuit substrate P, and a plurality of positioning portions 22 of the capacitor bearing structure 2 are arranged on the circuit substrate P (step S100); then, the wound capacitor packaging structure 1 is electrically connected to the circuit substrate P by soldering or any conductive method (step S102). More specifically, the wound capacitor packaging structure 1 includes a wound component 11, a conductive component 12, and a packaging component 13, the conductive component 12 includes a first conductive pin 121 electrically contacting the wound component 11 and a second conductive pin 122 electrically contacting the wound component 11, and the wound component 11 is enclosed inside the packaging component 13. In addition, the carrying portion 21 of the capacitor carrying structure 2 is configured to carry the wound capacitor packaging structure 1, and a plurality of positioning portions 22 of the capacitor carrying structure 2 extend outward from the carrying portion 21. In addition, a first exposed portion 1212 of the first conductive pin 121 and a second exposed portion 1222 of the second conductive pin 122 extend horizontally from the packaging component 13 without bending and are electrically connected to the circuit substrate P.
[0044] For example, with Figure 3 , Figure 8 and Fig. 9 As shown, the step S100 of placing the wound capacitor packaging structure 1 and the capacitor supporting structure 2 on the circuit substrate P further includes: first, Figure 8 and Fig. 9 As shown, the wound capacitor packaging structure 1 is horizontally arranged on the capacitor supporting structure 2 (step S1002); then, Figure 3 and Figure 8 As shown, the capacitor supporting structure 2 carrying the wound capacitor packaging structure 1 is disposed on the circuit substrate P (step S1004). However, the above example is only one feasible embodiment and is not intended to limit the present invention.
[0045] For example, with Figure 3 , Figure 8 and Fig.10 As shown, the step S100 of placing the wound capacitor packaging structure 1 and the capacitor supporting structure 2 on the circuit substrate P further includes: first, Figure 8 and Fig.10 As shown, the capacitor supporting structure 2 is set on the circuit substrate P (step S1006); then, Figure 3 and Figure 8 As shown, the wound capacitor packaging structure 1 is disposed transversely on the capacitor supporting structure 2 (step S1008). However, the above example is only one feasible embodiment and is not intended to limit the present invention.
[0046] [Beneficial Effects of Embodiments]
[0047] One of the beneficial effects of the present invention is that the present invention provides a horizontally placed capacitor packaging component S, which can be configured to be horizontally arranged on the circuit substrate P through the technical scheme of "the capacitor supporting structure 2 includes a supporting portion 21 configured to support the wound capacitor packaging structure 1 and a plurality of positioning portions 22 extending outward from the supporting portion 21" and "the first exposed portion 1212 of the first conductive pin 121 and the second exposed portion 1222 of the second conductive pin 122 extend horizontally from the packaging component 13 without bending". When the horizontally placed capacitor packaging component S is configured to be horizontally arranged on the circuit substrate P, the first exposed portion 1212 of the first conductive pin 121 and the second exposed portion 1222 of the second conductive pin 122 can be electrically connected to the circuit substrate P horizontally without bending.
[0048] One of the beneficial effects of the present invention is that the present invention provides an assembly method for a horizontally placed capacitor packaging component S, which can be achieved through the technical solutions of "arranging a winding capacitor packaging structure 1 and a capacitor supporting structure 2 on a circuit substrate P, a supporting portion 21 of the capacitor supporting structure 2 passing through the circuit substrate P, and multiple positioning portions 22 of the capacitor supporting structure 2 being arranged on the circuit substrate P" and "electrically connecting the winding capacitor packaging structure 1 to the circuit substrate P", so that when the horizontally placed capacitor packaging component S is configured to be arranged horizontally on the circuit substrate P, the first exposed portion 1212 of the first conductive pin 121 and the second exposed portion 1222 of the second conductive pin 122 can be electrically connected horizontally to the circuit substrate P without bending.
[0049] The contents disclosed above are only preferred feasible embodiments of the present invention, and are not intended to limit the protection scope of the claims of the present invention. Therefore, all equivalent technical changes made using the contents of the present invention description and drawings are included in the protection scope of the claims of the present invention.
Claims
1. A horizontally placed capacitor package assembly, wherein the horizontally placed capacitor package assembly is configured to be horizontally placed on a circuit substrate, characterized in that: The horizontally placed capacitor packaging assembly comprises: A wound capacitor packaging structure, the wound capacitor packaging structure comprising a wound component, a conductive component and a packaging component, the wound component comprising a wound positive electrode conductive foil, a wound negative electrode conductive foil and two wound separators, the conductive component comprising a first conductive pin electrically contacting the wound positive electrode conductive foil and a second conductive pin electrically contacting the wound negative electrode conductive foil, and the wound component is enclosed inside the packaging component; and A capacitor supporting structure, the capacitor supporting structure comprising a supporting portion configured to support the wound capacitor packaging structure and a plurality of positioning portions extending outwardly from the supporting portion; Wherein, one of the two wound separators is arranged between the wound positive electrode conductive foil and the wound negative electrode conductive foil, and one of the wound positive electrode conductive foil and the wound negative electrode conductive foil is arranged between the two wound separators; The first conductive pin includes a first buried portion accommodated in the package component and a first exposed portion exposed outside the package component, and the second conductive pin includes a second buried portion accommodated in the package component and a second exposed portion exposed outside the package component; Wherein, when the capacitor supporting structure is configured to be disposed on the circuit substrate, the supporting portion of the capacitor supporting structure is configured to penetrate the circuit substrate, and the plurality of positioning portions of the capacitor supporting structure are configured to be disposed on the circuit substrate to limit the position of the capacitor supporting structure relative to the circuit substrate; When the wound capacitor packaging structure is configured to be laterally disposed on the capacitor supporting structure, the first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin extend horizontally from the packaging component without bending and are electrically connected to the circuit substrate.
2. The horizontally placed capacitor packaging assembly according to claim 1, characterized in that: in, The packaging component includes a packaging shell configured to accommodate the roll-up component and a bottom end closing structure disposed inside the packaging shell and cooperating with the packaging shell, and the packaging component is completely covered by the packaging shell and the bottom end closing structure; Wherein, the carrying portion of the capacitor carrying structure has a containing space, and a portion of the packaging component of the wound capacitor packaging structure is contained in the containing space of the carrying portion; The carrying portion of the capacitor carrying structure has a plurality of heat dissipation openings for partially exposing an outer surface of the packaging shell of the packaging component of the wound capacitor packaging structure.
3. The horizontally placed capacitor packaging assembly according to claim 1, characterized in that: in, When the capacitor supporting structure is configured to be disposed on the circuit substrate, the plurality of positioning portions of the capacitor supporting structure are configured to be disposed on an upper surface or a lower surface of the circuit substrate; Wherein, when the capacitor supporting structure is configured to be disposed on the circuit substrate, the plurality of positioning portions of the capacitor supporting structure are configured to be respectively fixed on a plurality of positioning areas of the circuit substrate, and each of the plurality of positioning areas is a recessed area or a plane area; Wherein, when the capacitor supporting structure is configured to be disposed on the circuit substrate, the supporting portion of the capacitor supporting structure is configured to penetrate a long strip-shaped opening of the circuit substrate, and the plurality of positioning portions of the capacitor supporting structure are disposed along two long sides or two short sides of the long strip-shaped opening of the circuit substrate, and the plurality of positioning portions of the capacitor supporting structure are separated from each other and correspond to each other or are connected to each other to form a single positioning portion; When the wound capacitor packaging structure is configured to be laterally disposed on the capacitor supporting structure, a first flat area of the first exposed portion of the first conductive pin and a second flat area of the second exposed portion of the second conductive pin electrically contact a first welding area and a second welding area of the circuit substrate, respectively.
4. A horizontally placed capacitor packaging assembly, characterized in that: The horizontally placed capacitor packaging assembly comprises: A wound capacitor packaging structure, the wound capacitor packaging structure comprising a wound component, a conductive component and a packaging component, the conductive component comprising a first conductive pin electrically contacting the wound component and a second conductive pin electrically contacting the wound component, and the wound component is enclosed inside the packaging component; and A capacitor supporting structure, the capacitor supporting structure comprising a supporting portion configured to support the wound capacitor packaging structure and a plurality of positioning portions extending outwardly from the supporting portion; The first conductive pin includes a first buried portion accommodated in the package component and a first exposed portion exposed outside the package component, and the second conductive pin includes a second buried portion accommodated in the package component and a second exposed portion exposed outside the package component; The first exposed portion of the first conductive pin and the second exposed portion of the second conductive pin extend horizontally from the packaging component without being bent.
5. The horizontally placed capacitor packaging assembly according to claim 4, characterized in that: in, The packaging component includes a packaging shell configured to accommodate the roll-up component and a bottom end closing structure disposed inside the packaging shell and cooperating with the packaging shell, and the packaging component is completely covered by the packaging shell and the bottom end closing structure; Wherein, the carrying portion of the capacitor carrying structure has a containing space, and a portion of the packaging component of the wound capacitor packaging structure is contained in the containing space of the carrying portion; The carrying portion of the capacitor carrying structure has a plurality of heat dissipation openings for partially exposing an outer surface of the packaging shell of the packaging component of the wound capacitor packaging structure.
6. The horizontally placed capacitor packaging assembly according to claim 4, characterized in that: in, The horizontally placed capacitor package assembly is configured to be horizontally arranged on a circuit substrate; Wherein, when the capacitor supporting structure is configured to be disposed on the circuit substrate, the plurality of positioning portions of the capacitor supporting structure are configured to be disposed on an upper surface or a lower surface of the circuit substrate; Wherein, when the capacitor supporting structure is configured to be disposed on the circuit substrate, the plurality of positioning portions of the capacitor supporting structure are configured to be respectively fixed on a plurality of positioning areas of the circuit substrate, and each of the plurality of positioning areas is a recessed area or a plane area; Wherein, when the capacitor supporting structure is configured to be disposed on the circuit substrate, the supporting portion of the capacitor supporting structure is configured to penetrate a long strip-shaped opening of the circuit substrate, and the plurality of positioning portions of the capacitor supporting structure are disposed along two long sides or two short sides of the long strip-shaped opening of the circuit substrate, and the plurality of positioning portions of the capacitor supporting structure are separated from each other and correspond to each other or are connected to each other to form a single positioning portion; When the wound capacitor packaging structure is configured to be laterally disposed on the capacitor supporting structure, a first flat area of the first exposed portion of the first conductive pin and a second flat area of the second exposed portion of the second conductive pin electrically contact a first welding area and a second welding area of the circuit substrate, respectively.
7. A method for assembling a horizontally placed capacitor packaging assembly, characterized in that: The assembly method of the horizontally placed capacitor packaging assembly comprises: Disposing a wound capacitor packaging structure and a capacitor supporting structure on a circuit substrate, wherein a supporting portion of the capacitor supporting structure penetrates through the circuit substrate, and a plurality of positioning portions of the capacitor supporting structure are disposed on the circuit substrate; and electrically connecting the wound capacitor packaging structure to the circuit substrate; The wound capacitor packaging structure includes a wound component, a conductive component and a packaging component, wherein the conductive component includes a first conductive pin electrically contacting the wound component and a second conductive pin electrically contacting the wound component, and the wound component is enclosed inside the packaging component; Wherein, the carrying portion of the capacitor carrying structure is configured to carry the wound capacitor packaging structure, and the plurality of positioning portions of the capacitor carrying structure extend outwardly from the carrying portion; A first exposed portion of the first conductive pin and a second exposed portion of the second conductive pin extend horizontally from the packaging component without bending and are electrically connected to the circuit substrate.
8. The method for assembling a horizontally placed capacitor package assembly according to claim 7, characterized in that: The step of arranging the wound capacitor packaging structure and the capacitor supporting structure on the circuit substrate further comprises: Disposing the wound capacitor packaging structure laterally on the capacitor supporting structure; and The capacitor supporting structure supporting the wound capacitor packaging structure is disposed on the circuit substrate.
9. The method for assembling a horizontally placed capacitor package assembly according to claim 7, characterized in that: The step of arranging the wound capacitor packaging structure and the capacitor supporting structure on the circuit substrate further comprises: Disposing the capacitor supporting structure on the circuit substrate; and The wound capacitor packaging structure is laterally arranged on the capacitor supporting structure.
10. The method for assembling a horizontally placed capacitor package assembly according to claim 7, characterized in that: in, The packaging component includes a packaging shell configured to accommodate the roll-up component and a bottom end closing structure disposed inside the packaging shell and cooperating with the packaging shell, and the packaging component is completely covered by the packaging shell and the bottom end closing structure; Wherein, the carrying portion of the capacitor carrying structure has a containing space, and a portion of the packaging component of the wound capacitor packaging structure is contained in the containing space of the carrying portion; Wherein, the carrying portion of the capacitor carrying structure has a plurality of heat dissipation openings for partially exposing an outer surface of the packaging shell of the packaging component of the wound capacitor packaging structure; Wherein, when the capacitor supporting structure is configured to be disposed on the circuit substrate, the plurality of positioning portions of the capacitor supporting structure are configured to be disposed on an upper surface or a lower surface of the circuit substrate; Wherein, when the capacitor supporting structure is configured to be disposed on the circuit substrate, the plurality of positioning portions of the capacitor supporting structure are configured to be respectively fixed on a plurality of positioning areas of the circuit substrate, and each of the plurality of positioning areas is a recessed area or a plane area; Wherein, when the capacitor supporting structure is configured to be disposed on the circuit substrate, the supporting portion of the capacitor supporting structure is configured to penetrate a long strip-shaped opening of the circuit substrate, and the plurality of positioning portions of the capacitor supporting structure are disposed along two long sides or two short sides of the long strip-shaped opening of the circuit substrate, and the plurality of positioning portions of the capacitor supporting structure are separated from each other and correspond to each other or are connected to each other to form a single positioning portion; When the wound capacitor packaging structure is configured to be laterally disposed on the capacitor supporting structure, a first flat area of the first exposed portion of the first conductive pin and a second flat area of the second exposed portion of the second conductive pin electrically contact a first welding area and a second welding area of the circuit substrate, respectively.