Method and device for efficiently comparing Map after sorting

Abstract

The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to a method and device for efficient comparison of Map after sorting, and the method comprises the following steps: 1, placing a wafer Casstte on a loadport feeding platform, so that a mechanical arm can correctly take the wafer; 2, the sorted wafers are transmitted to a photographing system through a mechanical arm, and high-definition images of the wafers are collected; 3, preprocessing the image through computer software so as to improve the comparison precision and speed; step 4, automatically extracting key features in the wafer image by using a deep learning algorithm; and step 5, matching the extracted features with an expected wafer pattern, finding out an unmatched region, and generating a map document and a visual pattern, the structure is reasonable, in the use process, the advanced artificial intelligence technology is utilized, the efficiency and accuracy of wafer Map comparison are remarkably improved, and the method is suitable for large-scale popularization and application. And powerful support is provided for defect detection and quality control in the semiconductor manufacturing process.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a method and device for efficient comparison of maps after sorting. Background Art

[0002] In the semiconductor manufacturing process, wafer map comparison is one of the key links. It compares the actual pattern of the wafer with the expected pattern to find and mark any mismatches or anomalies.

[0003] Due to the complexity of wafer maps, manual alignment methods face challenges in efficiency and accuracy. Traditional manual alignment methods are time-consuming and error-prone, and cannot meet the needs of large-scale production.

[0004] Based on the above problems, developing an efficient artificial wafer Map comparison method is of great significance to improving semiconductor manufacturing efficiency and product quality. Summary of the invention

[0005] The purpose of this section is to summarize some aspects of the embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and the invention title of this application to avoid blurring the purpose of this section, the specification abstract and the invention title, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0006] In view of the problems existing in the prior art, the present invention is proposed.

[0007] Therefore, the purpose of the present invention is to provide a method and device for efficient comparison of maps after sorting. During use, advanced artificial intelligence technology is used to significantly improve the efficiency and accuracy of wafer map comparison, providing strong support for defect detection and quality control in the semiconductor manufacturing process.

[0008] To solve the above technical problems, according to one aspect of the present invention, the present invention provides the following technical solutions:

[0009] A method and device for efficient comparison of maps after sorting, comprising the following steps:

[0010] Step 1: Place the wafer Casstte on the loadport platform so that the robot arm can pick up the wafer correctly;

[0011] Step 2: The sorted wafers are transferred to the camera system through a robotic arm to collect high-definition images of the wafers;

[0012] Step 3: Preprocess the image through computer software to improve the comparison accuracy and speed;

[0013] Step 4: Use deep learning algorithms to automatically extract key features from wafer images;

[0014] Step 5: Match the extracted features with the expected wafer pattern, find the mismatched areas, and generate a map document and visual pattern;

[0015] Step 6: Import the map generated by the sorting equipment into the software system and generate a visual pattern at the same time;

[0016] Step 7: Compare the two maps and use the algorithm to determine whether a map shift has occurred. The results are presented to the human comparer in a visual manner to quickly locate and identify anomalies and conduct secondary confirmation.

[0017] As a preferred solution of the method and device for efficient comparison of maps after sorting described in the present invention, in step 3, image preprocessing includes noise removal, image enhancement and normalization.

[0018] As a preferred solution of the method and device for efficient comparison of maps after sorting described in the present invention, it is applicable to any one of the methods for efficient comparison of maps after sorting described above.

[0019] As a preferred solution of the method and device for efficient comparison of maps after sorting described in the present invention, it includes a frame, a loading platform, a robotic arm, a camera system and a computer image processing system, a loading platform is arranged on one side of the frame, a robotic arm is arranged on one side of the top of the frame, a camera system and a computer image processing system are arranged on the other side of the top of the frame, and the camera system and the computer image processing system are electrically connected.

[0020] As a preferred solution of the method and device for efficient comparison of maps after sorting described in the present invention, the photographing system uses an industrial camera.

[0021] Compared with the prior art, the present invention has the following beneficial effects:

[0022] The introduction of artificial intelligence technology has greatly improved the efficiency and accuracy of wafer map comparison; manual comparison personnel only need to focus on the comparison results, while the tedious comparison process can be automatically completed by the system;

[0023] In addition, this method can be optimized and adjusted according to actual needs and has good flexibility and scalability. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below in combination with the accompanying drawings and detailed embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0025] Figure 1 It is the work flow chart of the present invention;

[0026] Figure 2 It is a schematic diagram of the structure of the present invention.

[0027] In the figure, L01 is the loading platform, L02 is the robotic arm, L03 is the camera system, and L04 is the computer image processing system. DETAILED DESCRIPTION

[0028] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0029] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein, and those skilled in the art may make similar generalizations without violating the connotation of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0030] Secondly, the present invention is described in detail with reference to schematic diagrams. When describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0031] In order to make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0032] The present invention provides the following technical solutions: a method and device for efficient comparison of maps after sorting, which, during use, utilizes advanced artificial intelligence technology to significantly improve the efficiency and accuracy of wafer map comparison, and provides strong support for defect detection and quality control in the semiconductor manufacturing process;

[0033] Example 1

[0034] like Figure 1 As shown:

[0035] A method for efficient alignment of sorted maps, comprising:

[0036] S01: Place the wafer Casstte on the loadport platform so that the arm can pick up the wafer correctly.

[0037] S02: The robotic arm transfers the sorted wafers to the camera system to collect high-definition images of the wafers.

[0038] S03: Computer software pre-processes the image, including noise removal, image enhancement and normalization, to improve the comparison accuracy and speed.

[0039] S04: Use deep learning algorithms to automatically extract key features from wafer images.

[0040] S05: Match the extracted features with the expected wafer pattern, find the mismatched areas, and generate a map document and visual pattern.

[0041] S06: Import the map generated by the equipment after sorting into the software system and generate a visual pattern at the same time.

[0042] S07: Compare the two maps and use the algorithm to determine whether a map shift has occurred. The results are presented to the human comparer in a visual manner to quickly locate and identify anomalies and conduct secondary confirmation.

[0043] Example 2

[0044] A device for efficient comparison of maps after sorting, comprising a frame, a loading platform L01, a robotic arm L02, a camera system L03 and a computer image processing system L04, wherein the loading platform L01 is arranged on one side of the frame, the robotic arm L02 is arranged on one side of the top of the frame, the camera system L03 and the computer image processing system L04 are arranged on the other side of the top of the frame, and the camera system L03 and the computer image processing system L04 are electrically connected, and the camera system L03 uses an industrial camera.

[0045] Working principle: The introduction of artificial intelligence technology has greatly improved the efficiency and accuracy of wafer map comparison; manual comparers only need to focus on the comparison results, while the tedious comparison process can be automatically completed by the system; in addition, this method can also be optimized and adjusted according to actual needs, with good flexibility and scalability.

[0046] Although the present invention has been described above with reference to the embodiments, various modifications may be made thereto and parts thereof may be replaced by equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the various features in the embodiments disclosed in the present invention may be used in combination with each other in any manner, and the fact that these combinations are not exhaustively described in this specification is only for the sake of omitting space and saving resources. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A method for efficient comparison of maps after sorting, characterized by: The steps include: Step 1: Place the wafer Casstte on the loadport platform so that the robot arm can pick up the wafer correctly; Step 2: The sorted wafers are transferred to the camera system through a robotic arm to collect high-definition images of the wafers; Step 3: Preprocess the image through computer software to improve the comparison accuracy and speed; Step 4: Use deep learning algorithms to automatically extract key features from wafer images; Step 5: Match the extracted features with the expected wafer pattern, find the mismatched areas, and generate a map document and visual pattern; Step 6: Import the map generated by the sorting equipment into the software system and generate a visual pattern at the same time; Step 7: Compare the two maps and use the algorithm to determine whether a map shift has occurred. The results are presented to the human comparer in a visual manner to quickly locate and identify anomalies and conduct secondary confirmation.

2. A method for efficient comparison of maps after sorting according to claim 1, characterized in that: In step 3, image preprocessing includes noise removal, image enhancement and normalization.

3. A device for efficient comparison of maps after sorting, characterized by: A method for efficient comparison of maps after sorting applicable to any one of claims 1-2.

4. The device for efficient comparison of maps after sorting according to claim 3, characterized in that: The invention comprises a frame, a loading platform (L01), a robotic arm (L02), a camera system (L03) and a computer image processing system (L04); the loading platform (L01) is arranged on one side of the frame, the robotic arm (L02) is arranged on one side of the top of the frame, the camera system (L03) and the computer image processing system (L04) are arranged on the other side of the top of the frame, and the camera system (L03) and the computer image processing system (L04) are electrically connected.

5. The device for efficient comparison of maps after sorting according to claim 1, characterized in that: The photographing system (L03) uses an industrial camera.

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