DAF film cold expanding device

Abstract

The invention relates to a DAF film cold expanding device which sequentially comprises a cold expanding bottom plate and a sealed heat preservation box from bottom to top, the cold expanding bottom plate is connected with the sealed heat preservation box above the cold expanding bottom plate through a plurality of supporting columns, and a steel ring guide plate, a cold expanding disc and a steel ring upper pressing plate are installed in the sealed heat preservation box; a servo motor installed at the bottom of a cold expanding bottom plate drives a lead screw lifting plate to move in the vertical direction through a lead screw jacking mechanism above the servo motor, the lead screw lifting plate penetrates through a sealed heat preservation box through a plurality of first lifting guide columns and then is connected with a cold expanding disc on the inner side, and at least one air cylinder jacking mechanism is installed on the cold expanding bottom plate. The air cylinder lifting plate above the air cylinder jacking mechanism is driven by the air cylinder jacking mechanism to move in the vertical direction, the air cylinder lifting plate penetrates through the sealed heat preservation box through a plurality of second lifting columns and then is connected with the steel ring guide plate on the inner side, and a steel ring upper pressing plate is installed in the sealed heat preservation box right above the steel ring guide plate. And compared with laser or cutter wheel cutting, the cost is saved, the technological process is simplified, and the efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field related to semiconductor wafer processing, and in particular to a DAF film cold expansion device. Background Art

[0002] With the development of the semiconductor industry, especially the miniaturization of grain size and the development of semiconductor packaging towards high integration and miniaturization, DAF film has become the preferred material for many high-demand packaging processes due to its excellent isolation performance, good thermal conductivity and corrosion resistance. The market demand for 3D stacking packaging of ultra-small and ultra-thin wafers continues to grow, and the market development prospects are broad.

[0003] In the application of DAF film, laser cutting or blade cutting is usually used to completely separate the wafer or chip attached with DAF film according to the predetermined line to obtain independent individuals. Because it is necessary to avoid quality problems such as burrs during the cutting process, and to ensure that the cut DAF film can meet the requirements of subsequent processes, this full-cut process requires high-precision equipment and strict process control, which is challenging, costly, and has a relatively low yield.

[0004] In view of the above-mentioned defects, the designers have actively carried out research and innovation in order to create a DAF membrane cold expansion device to make it more valuable for industrial use. Summary of the invention

[0005] In order to solve any of the above technical problems, the object of the present invention is to provide a DAF membrane cold expansion device.

[0006] To achieve the above object, the present invention adopts the following technical solution:

[0007] The DAF membrane cold expansion device includes a cold expansion bottom plate and a sealed insulation box from bottom to top. The cold expansion bottom plate is connected to the sealed insulation box above through a number of support columns. A steel ring guide plate, a cold expansion plate and a steel ring upper pressure plate are installed in the sealed insulation box.

[0008] The servo motor installed at the bottom of the cold expansion base plate drives the screw lifting plate to move in the vertical direction through the screw lifting mechanism above. The screw lifting plate passes through the sealed insulation box through several first lifting guide columns and is connected to the cold expansion plate inside. At least one cylinder lifting mechanism is installed on the cold expansion base plate. The cylinder lifting mechanism drives the cylinder lifting plate above to move in the vertical direction. The cylinder lifting plate passes through the sealed insulation box through several second lifting columns and is connected to the steel ring guide plate inside. A steel ring upper pressure plate is installed in the sealed insulation box directly above the steel ring guide plate.

[0009] As a further improvement of the present invention, a position adjustment component is installed on at least one of the left and right sides of the cold expansion bottom plate and on at least one of the front and rear sides of the cold expansion bottom plate. The position adjustment component consists of an adjustment bolt mounting seat and an adjustment bolt that can contact the inner cold expansion bottom plate.

[0010] As a further improvement of the present invention, a cold air inlet and a cold air outlet are installed at the rear end of the sealed insulation box.

[0011] As a further improvement of the present invention, a filter is installed inside the cold air inlet.

[0012] As a further improvement of the present invention, a sealing cover is installed on the top of the sealed insulation box.

[0013] As a further improvement of the present invention, air curtain mechanisms are installed at the top and bottom of the front end of the sealed thermal insulation box, and the air curtain mechanisms are composed of a plurality of air curtain blowing pipes.

[0014] As a further improvement of the present invention, a window is provided in the middle of the front end of the sealed insulation box, a gate is installed on the sealed insulation box below the window, and a gate lifting cylinder installed at the bottom of the sealed insulation box drives the upper gate to move in the vertical direction.

[0015] As a further improvement of the present invention, the cold expansion plate is located on the inner side of the steel ring guide plate.

[0016] As a further improvement of the present invention, the top of the upper pressing plate of the steel ring is connected to the upper inner cover through a plurality of connecting rods.

[0017] As a further improvement of the present invention, a plurality of dry gas dew removal mechanisms are installed at the bottom of the sealed heat preservation box, and the dry gas dew removal mechanisms are composed of a plurality of dry air blowing pipe groups.

[0018] By means of the above scheme, the present invention has at least the following advantages:

[0019] The present invention utilizes the characteristic of DAF film becoming brittle in a low-temperature environment, reaches a low-temperature environment in a special sealed insulation box through an air refrigerator, and then uses a screw lifting device to expand the wafer and DAF film, thereby realizing the separation of wafers or chips. Compared with the full-cut process, the stress generated by the DAF film that becomes brittle in a low-temperature environment during the expansion process is relatively small, which can reduce physical damage to the wafer, help maintain the integrity and performance of the wafer, and thus improve the yield.

[0020] The present invention utilizes a motor to drive a lead screw lifting mechanism, which can accurately control the wafer separation process and meet the requirements for high-precision and small-pitch separation of chips.

[0021] Compared with laser or cutter wheel cutting, the present invention has lower requirements on equipment precision, saves costs, simplifies the process flow and improves efficiency.

[0022] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present invention in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for use in the embodiments are briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present invention and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without creative work.

[0024] Figure 1 It is a structural schematic diagram of a DAF membrane cold expansion device of the present invention;

[0025] Figure 2 yes Figure 1 Side view of

[0026] Figure 3 yes Figure 1 Schematic diagram of the internal structure.

[0027] The meanings of the various reference numerals in the figures are as follows.

[0028] Cold expansion base plate 1, servo motor 2, screw lifting mechanism 3, screw lifting plate 4, position adjustment component 5, cylinder lifting mechanism 6, cylinder lifting plate 7, sealed insulation box 8, cold air inlet 9, cold air outlet 10, sealing cover 11, air curtain mechanism 12, window 13, gate lifting cylinder 14, gate 15, steel ring guide plate 16, cold expansion plate 17, steel ring upper pressure plate 18. DETAILED DESCRIPTION

[0029] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0030] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiment of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiment of the present invention. Obviously, the described embodiment is only a part of the embodiment of the present invention, rather than all the embodiments. The components of the embodiment of the present invention generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the present invention provided in the drawings is not intended to limit the scope of the invention claimed for protection, but merely represents the selected embodiment of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the present invention.

[0031] like Figure 1 to Figure 3 As shown, a DAF membrane cold expansion device includes a cold expansion bottom plate 1 and a sealed heat preservation box 8 from bottom to top. The cold expansion bottom plate 1 is connected to the sealed heat preservation box 8 above through a plurality of support columns. A steel ring guide plate 16, a cold expansion plate 17 and a steel ring upper pressure plate 18 are installed in the sealed heat preservation box 8. The cold expansion plate 17 is located on the inner side of the steel ring guide plate 16. A plurality of roller structures are evenly distributed along the circumferential direction on the outer edge of the cold expansion plate 17. The top of the steel ring upper pressure plate 18 is connected to the inner cover above through a plurality of connecting rods, and a sealing cover 11 is installed on the top of the sealed heat preservation box 8.

[0032] The servo motor 2 installed at the bottom of the cold expansion base plate 1 drives the screw lifting plate 4 to move in the vertical direction through the screw lifting mechanism 3 above. The screw lifting plate 4 passes through the sealed insulation box 8 through a number of first lifting guide columns and is connected to the inner cold expansion plate 17. At least one cylinder lifting mechanism 6 is installed on the cold expansion base plate 1. The cylinder lifting mechanism 6 drives the upper cylinder lifting plate 7 to move in the vertical direction. The cylinder lifting plate 7 passes through the sealed insulation box 8 through a number of second lifting columns and is connected to the inner steel ring guide plate 16. A steel ring upper pressure plate 18 is installed in the sealed insulation box 8 directly above the steel ring guide plate 16.

[0033] A position adjustment component 5 is installed on at least one of the left and right sides of the cold expansion base plate 1 and at least one of the front and rear sides of the cold expansion base plate 1. The position adjustment component 5 consists of an adjustment bolt mounting seat and an adjustment bolt that can contact the inner cold expansion base plate 1.

[0034] A cold air inlet 9 and a cold air outlet 10 are installed at the rear end of the sealed heat preservation box 8. A filter is installed inside the cold air inlet 9.

[0035] Air curtain mechanisms 12 are installed at the top and bottom of the front end of the sealed heat preservation box 8, and the air curtain mechanism 12 is composed of a plurality of air curtain blowing pipes.

[0036] A plurality of dry air dehumidification mechanisms are installed at the bottom of the sealed heat preservation box 8, and the dry air dehumidification mechanisms are composed of a plurality of dry air blowing pipe groups.

[0037] A window 13 is provided in the middle of the front end of the sealed insulation box 8, a gate 15 is installed on the sealed insulation box 8 below the window 13, and a gate lifting cylinder 14 installed at the bottom of the sealed insulation box 8 drives the upper gate 15 to move in the vertical direction.

[0038] Working principle and working process of the present invention:

[0039] In the initial state, the screw lifting mechanism 3 and the cylinder lifting mechanism 6 are both lowered to the lowest position, and the temperature in the sealed insulation box 8 is set (usually above -20°C and below 10°C). At this time, the gate is opened, and the feeding mechanism pushes the wafer with the steel ring to the steel ring guide plate 16, the gate 15 is closed, and the air curtain mechanism 12 starts blowing. The cylinder lifting mechanism 6 drives the steel ring guide plate 16 to move upward and fit with the steel ring upper pressure plate 18 to ensure that the steel ring is pressed tightly. At this time, under the protection of the sealed insulation box 8 and the sealing cover 11, the inside of the box is maintained at a constant low temperature, and the servo motor 2 drives the screw lifting mechanism 3 to move upward. When the cold expansion plate 17 contacts the bottom surface of the UV film, it continues to move upward. While the UV film is expanded, the wafer is evenly separated. Because the DAF film has the characteristic of being brittle in a low temperature environment, it will be separated together with the wafer. During the whole process, the dry gas dew removal mechanism continues to blow dry gas to prevent condensation from the metal parts at the bottom of the sealed insulation box 8.

[0040] The positional relationship and connection relationship between the components: the servo motor 2 is connected to the screw lifting mechanism 3 through a coupling (the bottom plate of the screw lifting mechanism can be fixed on a stationary and fixed table through fixings), the cylinder body of the cylinder lifting mechanism 6 is fixed on the bottom plate of the screw lifting mechanism 3, the piston rod is connected to the steel ring guide plate 16, the lower part of the sealed insulation box 8 is connected to the bottom plate of the screw lifting mechanism 3, the dry gas dew removal mechanism is fixed at the bottom, the gate 15 and the air curtain mechanism 12 are installed on the side, the steel ring upper pressure plate 18 is fixed inside the sealed insulation box 8, the top is connected to the sealing cover 11 with bolts, the cold air inlet 9 on the back is connected to the gas refrigerator, and the cold air outlet 10 is connected to the atmosphere.

[0041] The present invention provides a cold expansion device for DAF film in wafer-level packaging, the principle of which is to use the brittle property of DAF film in low temperature environment to achieve the simultaneous separation of single grains and DAF film after laser cutting. Specifically, a wafer with DAF film pasted on the bottom is pasted on a UV film with a steel ring. After laser cutting in the previous process, the wafer has been divided into grains, but the DAF film on the bottom has not been cut. At this time, the wafer with the steel ring is placed in the cold expansion equipment, and the corresponding temperature (usually above -20°C and below 10°C) is set to make the DAF film brittle, and then the wafer is expanded by lifting, and the DAF film pasted on the bottom of the wafer is separated to achieve the desired purpose.

[0042] Taking advantage of the characteristic of DAF film becoming brittle in low-temperature environment, a low-temperature environment is achieved in a special sealed insulation box through an air refrigerator, and then the wafer and DAF film are expanded with a screw lifting device to achieve the separation of wafers or chips. Compared with the full-cut process, the stress generated by the DAF film that becomes brittle in a low-temperature environment during the expansion process is relatively small, which can reduce the physical damage to the wafer, help maintain the integrity and performance of the wafer, and thus improve the yield.

[0043] The motor-driven screw lifting mechanism can accurately control the wafer separation process and meet the needs of high-precision and small-pitch separation of chips.

[0044] Compared with laser or wheel cutting, it reduces the requirements for equipment precision, saves costs, simplifies the process and improves efficiency.

[0045] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", etc. are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implying the number of technical features indicated. Thus, features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features. In the description of the present invention, unless otherwise specified, "multiple" means two or more.

[0046] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0047] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. It should be pointed out that a person skilled in the art can make several improvements and modifications without departing from the technical principles of the present invention, and these improvements and modifications should also be regarded as within the scope of protection of the present invention.

Claims

1. DAF membrane cold expansion device, characterized by: From bottom to top, it comprises a cold expansion bottom plate (1) and a sealed heat preservation box (8), wherein the cold expansion bottom plate (1) is connected to the sealed heat preservation box (8) above via a plurality of support columns, and a steel ring guide plate (16), a cold expansion plate (17) and a steel ring upper pressure plate (18) are installed in the sealed heat preservation box (8); The servo motor (2) installed at the bottom of the cold expansion base plate (1) drives the screw lifting plate (4) to move in the vertical direction through the screw lifting mechanism (3) above. The screw lifting plate (4) passes through the sealed insulation box (8) through a plurality of first lifting guide columns and is connected to the cold expansion plate (17) on the inside. At least one cylinder lifting mechanism (6) is installed on the cold expansion base plate (1). The cylinder lifting mechanism (6) drives the cylinder lifting plate (7) above to move in the vertical direction. The cylinder lifting plate (7) passes through the sealed insulation box (8) through a plurality of second lifting columns and is connected to the steel ring guide plate (16) on the inside. A steel ring upper pressure plate (18) is installed in the sealed insulation box (8) directly above the steel ring guide plate (16).

2. The DAF membrane cold expansion device according to claim 1, characterized in that: A position adjustment component (5) is installed on at least one of the left and right sides of the cold expansion bottom plate (1) and at least one of the front and rear sides of the cold expansion bottom plate (1), and the position adjustment component (5) is composed of an adjustment bolt mounting seat and an adjustment bolt that can contact the inner cold expansion bottom plate (1).

3. The DAF membrane cold expansion device according to claim 1, characterized in that: A cold air inlet (9) and a cold air outlet (10) are installed at the rear end of the sealed heat preservation box (8).

4. The DAF membrane cold expansion device according to claim 3, characterized in that: A filter is installed inside the cold air inlet (9).

5. The DAF membrane cold expansion device according to claim 1, characterized in that: A sealing cover (11) is installed on the top of the sealed heat-insulating box (8).

6. The DAF membrane cold expansion device according to claim 1, characterized in that: An air curtain mechanism (12) is installed at the top and bottom of the front end of the sealed heat preservation box (8), and the air curtain mechanism (12) is composed of a plurality of air curtain blowing pipes.

7. The DAF membrane cold expansion device according to claim 1, characterized in that: A window (13) is provided in the middle of the front end of the sealed heat-insulating box (8), a gate (15) is installed on the sealed heat-insulating box (8) below the window (13), and a gate lifting cylinder (14) installed at the bottom of the sealed heat-insulating box (8) drives the upper gate (15) to move in the vertical direction.

8. The DAF membrane cold expansion device according to claim 1, characterized in that: The cold expansion plate (17) is located on the inner side of the steel ring guide plate (16).

9. The DAF membrane cold expansion device according to claim 1, characterized in that: The top of the steel ring upper pressure plate (18) is connected to the upper inner cover via a plurality of connecting rods.

10. The DAF membrane cold expansion device according to claim 1, characterized in that: A plurality of dry air dehumidification mechanisms are installed at the bottom of the sealed heat preservation box (8), and the dry air dehumidification mechanisms are composed of a plurality of dry air blowing pipe groups.

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