Wafer unloading device and wafer unloading method

Abstract

The invention discloses a wafer unloading device and method, and relates to the technical field of wafer packaging and unloading, the wafer unloading device comprises a machine table, the middle part of the machine table is provided with a mounting groove, the middle part of the mounting groove is rotatably provided with a limiting assembly used for limiting a wafer, the limiting assembly comprises an upper pressing ring and a lower pressing ring which are arranged in parallel, and the upper pressing ring and the lower pressing ring are arranged in parallel. The top of the upper pressing ring is provided with a plurality of adjusting assemblies used for adjusting the distance between the upper pressing ring and the lower pressing ring. A sliding groove is formed in one side of the upper pressing ring, the inner wall of the sliding groove is slidably connected with a pushing block, and the bottom of the pushing block is slidably connected with a wafer unloading push rod; according to the wafer unloading and pushing assembly, the winding motor is used for driving the winding disc to rotate, the traction rope is loosened, and by controlling the rotating speed of the winding motor, the movement of the driving block and the control over the wafer pushing speed of the wafer unloading push rod are achieved, so that high-speed contact impact between the wafer unloading push rod and the wafer and damage to the wafer are avoided.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer packaging unloading, and in particular to a wafer unloading device and a wafer unloading method. Background Art

[0002] In the whole wafer packaging process, a blue film is pasted on the back of the whole wafer. The blue film needs to be processed later, and the blue film is expanded by using a tensioning and expanding film device. The basic structure of the existing tensioning and expanding film device includes a limit ring for limiting the position of the wafer and a tensioning component for tensioning the blue film. After the expansion is completed, the wafer needs to be unloaded by a wafer unloading device. The existing automatic wafer unloading device includes a mechanical arm and a driving component for driving the mechanical arm to move in translation and up and down. Please refer to Figure 8 When unloading the wafer, the driving component drives the robot arm to move horizontally to the notch on the limit ring, and then drives the robot arm to descend and reset horizontally. In this way, the robot arm passes through the notch during movement and pushes the wafer out of the limit ring to complete the unloading operation.

[0003] However, with this method of unloading, the robot arm needs to perform multiple translation and lifting movements during movement, and the overall unloading operation takes a long time (about 20 seconds). In addition, the start and stop positions and movement timing of the robot arm need to be frequently detected and controlled during the unloading process, and the probability of failure causing wafer damage is high. Summary of the invention

[0004] The object of the present invention is to provide a wafer unloading device and unloading method to solve the problem that the unloading device of the prior art proposed in the above background technology is divided into multiple stages of translational movements, resulting in a long operation time and high failure rate.

[0005] To achieve the above object, the present invention provides the following technical solutions:

[0006] A wafer unloading device comprises a machine platform, a mounting groove is provided in the middle of the machine platform, a limiting assembly for limiting the position of a wafer is rotatably installed in the middle of the mounting groove, the limiting assembly comprises an upper pressure ring and a lower pressure ring arranged in parallel, and a plurality of adjusting assemblies for adjusting the distance between the upper pressure ring and the lower pressure ring are arranged on the top of the upper pressure ring;

[0007] A slide groove is provided on one side of the upper pressure ring, a push block is slidably connected to the inner wall of the slide groove, a sheet unloading push rod is slidably connected to the bottom of the push block, a push groove is provided at the top of the lower pressure ring at a position corresponding to the slide groove, and a sheet unloading push assembly for driving the push block to translate is arranged above the push block.

[0008] As a further solution of the present invention: a through groove is provided on the other side of the upper pressure ring, and servo motors are fixedly installed at both ends of the inner wall of the through groove, and the output end of the servo motor is fixedly connected to a pushing arc plate, and the bottoms of the two pushing arc plates are fixedly connected to limiting rods, and limiting holes are provided at the top of the lower pressure ring and at the positions corresponding to the limiting rods.

[0009] As a further solution of the present invention: the film unloading pushing assembly includes a cover plate, a partition plate is fixedly installed on the middle part of the inner wall of the cover plate, a winding motor is fixedly installed above the partition plate, the output end of the winding motor is fixedly connected to the winding disk, the outer wall of the winding disk is wrapped with a traction rope, one end of the traction rope passes through the partition plate and is fixedly connected to a driving block, a pushing spring is fixedly connected between the driving block and the partition plate, and the bottom of the driving block is fixedly connected to the pushing block.

[0010] As a further solution of the present invention: a plurality of positioning rods are fixedly connected to the top of the lower pressure ring, a plurality of positioning holes are opened in the middle of the upper pressure ring, a plurality of positioning rods are slidably connected to the plurality of positioning holes, a bottom edge of the lower pressure ring is fixedly connected to a driving gear ring, a driving motor is provided on one side of the driving gear ring, a driving gear is fixedly connected to the output end of the driving motor, and the driving gear is meshingly connected to the driving gear ring.

[0011] As a further solution of the present invention: the edge of the lower pressure ring is rotatably connected to the edge of the inner wall of the mounting groove, a plurality of blowing pipes are fixedly connected to the bottom of the mounting groove, one end of each of the blowing pipes is fixedly connected to the output end of an external air pump, a plurality of blowing ports are opened in the middle of the lower pressure ring, and the inner walls of each of the blowing ports are inclined toward the direction of the upper pressure ring groove.

[0012] As a further solution of the present invention: the adjustment component includes a mounting sleeve, an electromagnet is fixedly mounted on the top of the inner wall of the mounting sleeve, a reset spring is fixedly connected between the top of the movable plate and the electromagnet, a movable plate is slidably connected to the bottom of the inner wall of the mounting sleeve, the bottom of the movable plate is fixedly connected to the top of the positioning rod, and the output end of the electromagnet is arranged corresponding to the movable plate.

[0013] As a further solution of the present invention: a hot air component is arranged above the limiting component, and the hot air component includes a hot air hood, and a avoidance groove is provided on the side of the bottom of the hot air hood corresponding to the pushing arc plate; a plurality of air supply ports are provided on the inner wall of the hot air hood, and an air supply component is provided on the inner walls of the plurality of air supply ports, an air inlet cavity is provided at the bottom of the air supply cavity, and an electric heating net is fixedly installed on the middle part of the inner wall of the air inlet cavity.

[0014] As a further solution of the present invention: the air supply assembly includes a direction adjustment frame, a direction adjustment motor is fixedly installed on one side of the inner wall of the air supply outlet, the output end of the direction adjustment motor is fixedly connected to the direction adjustment frame, and is used to drive the direction adjustment frame to rotate to adjust the air supply direction, the direction adjustment frame is rotatably installed in the air supply outlet, a fan is fixedly installed in the middle of the direction adjustment frame, an air inlet is opened on one side of the direction adjustment frame close to the air inlet cavity, a hot air outlet is opened on the other side of the direction adjustment frame, and the electric heating network is horizontally arranged.

[0015] As a further solution of the present invention: an accessory mounting frame is fixedly connected to the other side of the top of the machine platform, and a detection camera is slidably mounted on one side of the top of the accessory mounting frame.

[0016] A wafer unloading method comprises the following steps:

[0017] Step 1: Drive the upper pressure ring to lift and disengage from the wafer, and make the limiting rod disengage from the limiting hole;

[0018] Step 2: Send out air flow through the air blowing port on the lower pressure ring to reduce the friction resistance between the wafer and the lower pressure ring;

[0019] Step 3: The servo motor starts to drive the push guard plate to flip open, so as to avoid the influence of the limit rod on the wafer unloading operation;

[0020] Step 4: The wafer unloading push assembly pushes the wafer unloading push rod to move, pushes the wafer out, and completes the wafer unloading operation.

[0021] Compared with the prior art, the invention has the following beneficial effects: the unloading and pushing assembly of the invention utilizes the winding motor to drive the winding disk to rotate, and the traction rope is loosened, so that the driving block is pushed and moved under the action of the pushing spring, and the pushing block and the unloading push rod are driven to move, and the overall unloading and pushing action is simple, and the unloading speed is fast; at the same time, the invention controls the releasing speed of the traction rope by controlling the rotation speed of the winding motor, and then controls the movement of the driving block and the wafer pushing speed of the unloading push rod, so as to avoid the unloading push rod contacting and impacting the wafer at a high speed during unloading, and causing impact damage to the wafer;

[0022] The limiting assembly of the present invention is formed by two limiting rods and the inner side of each positioning rod to form a placement area for placing wafers, so as to ensure the stability of the wafer position after clamping and limiting. By setting a rotatable pushing arc plate and pushing it to flip open when unloading the wafer, the limiting rod avoids the unloading operation;

[0023] The present invention arranges a plurality of air blowing ports on the lower pressure ring and arranges the inner walls of the air blowing ports at an angle, uses the air blowing ports to supply air to the bottom of the wafer, assists the wafer in moving in the unloading direction, and reduces friction damage between the wafer and the lower pressure ring during the unloading process. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 A perspective view of the present invention;

[0025] Figure 2 is a cross-sectional view of the hot air assembly of the present invention;

[0026] Figure 3 is a cross-sectional view of the limiting assembly of the present invention;

[0027] Figure 4 It is a structural schematic diagram of the upper pressure ring of the present invention;

[0028] Figure 5 It is a structural schematic diagram of the lower pressure ring of the present invention;

[0029] Figure 6 is a cross-sectional view of the adjustment assembly of the present invention;

[0030] Figure 7 It is a cross-sectional view of the sheet unloading and pushing assembly of the present invention;

[0031] Figure 8 This is a schematic diagram of the operating principle of the existing film unloading method.

[0032] In the figure: 1, machine; 101, tensioning device; 2, limit assembly; 201, upper pressure ring; 202, positioning hole; 203, push arc plate; 204, servo motor; 205, limit rod; 206, lower pressure ring; 207, positioning rod; 208, limit hole; 209, blowing port; 210, pushing groove; 211, pushing block; 212, unloading push rod; 213, driving gear ring; 214, driving gear; 215, blowing pipe; 3, hot air assembly; 301, hot air hood; 302 , air inlet chamber; 303, electric heating net; 304, adjustment frame; 305, fan; 306, air inlet; 307, hot air outlet; 4, accessory mounting frame; 5, adjustment component; 501, mounting sleeve; 502, electromagnet; 503, reset spring; 504, movable plate; 6, film unloading and pushing component; 601, cover plate; 602, partition plate; 603, take-up reel; 604, drive block; 605, traction rope; 7, detection camera; 8, drive component; 9, mechanical arm; 10, notch. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] See also Figure 1-Figure 6In an embodiment of the present invention, a wafer unloading device includes a platform 1, and a mounting groove is provided in the middle of the platform 1. Figure 3 A limiting assembly 2 for limiting the position of the wafer is rotatably installed in the middle of the mounting groove. The limiting assembly 2 includes an upper pressure ring 201 and a lower pressure ring 206 arranged in parallel. A plurality of adjusting assemblies 5 for adjusting the distance between the upper pressure ring 201 and the lower pressure ring 206 are arranged on the top of the upper pressure ring 201. The upper pressure ring 201 is driven by the adjusting assembly 5 to move downward and approach the lower pressure ring 206, so as to achieve the clamping and limiting of the wafer;

[0035] In order to ensure the stability of the position of the upper pressure ring 201 during the movement, a plurality of positioning rods 207 are fixedly connected to the top of the lower pressure ring 206, and a plurality of positioning holes 202 are opened in the middle of the upper pressure ring 201, and a plurality of positioning rods 207 are slidably connected to a plurality of positioning holes 202;

[0036] See also Figure 6 The adjusting component 5 includes a mounting sleeve 501, an electromagnet 502 is fixedly mounted on the top of the inner wall of the mounting sleeve 501, a return spring 503 is fixedly connected between the top of the movable plate 504 and the electromagnet 502, a movable plate 504 is slidably connected to the bottom of the inner wall of the mounting sleeve 501, the bottom of the movable plate 504 is fixedly connected to the top of the positioning rod 207, and the output end of the electromagnet 502 is arranged corresponding to the movable plate 504. In a natural state, the return spring 503 lifts and pushes the movable plate 504 to move downward, and then pushes the positioning rod 207 out, so that the upper pressure ring 201 is separated from the lower pressure ring 206. When it is necessary to limit and clamp the wafer, the electromagnet 502 is started to attract and drive the movable plate 504 close to the electromagnet 502, compress the return spring 503 and drive the movable plate 504 and the positioning rod 207 to lift, so that the upper pressure ring 201 moves downward and close to the lower pressure ring 206, and the wafer is clamped and limited.

[0037] See also Figure 3 The bottom edge of the lower pressure ring 206 is fixedly connected with a driving gear ring 213, and a driving motor is arranged on one side of the driving gear ring 213. The output end of the driving motor is fixedly connected with a driving gear 214, and the driving gear 214 is meshed with the driving gear ring 213. The lower pressure ring 206 is driven to rotate through the driving motor and other structures, and then the limiting assembly 2 is driven to rotate as a whole, so as to realize the rotation of the wafer, and facilitate the tensioning operation of the wafer blue film by cooperating with the tensioning assembly.

[0038] The two sides of the limit assembly 2 are respectively set as the loading station and the unloading and pushing station, please refer to Figure 4A through groove is provided on the side of the upper pressure ring 201 close to the loading station, and servo motors 204 are fixedly installed at both ends of the inner wall of the through groove. A push arc plate 203 is fixedly connected to the output end of the servo motor 204, and the bottoms of the two push arc plates 203 are fixedly connected to limit rods 205. Limit holes 208 are provided at the top of the lower pressure ring 206 and at positions corresponding to the limit rods 205; the two limit rods 205 and the inner sides of the positioning rods 207 enclose a placement area for placing wafers, and the size of the placement area is consistent with the size of the wafer, so as to ensure that the wafer position is stable after clamping and limiting, and by setting a rotatable push arc plate 203 and pushing it to flip open when unloading the wafer, the limit rod 205 avoids the unloading operation.

[0039] See also Figure 3 A slide groove is provided on the side of the upper pressing ring 201 near the unloading and pushing station, a pushing block 211 is slidably connected to the inner wall of the slide groove, and a unloading push rod 212 is slidably connected to the bottom of the pushing block 211, see Figure 5 A pushing groove 210 is provided at the top of the lower pressure ring 206 at a position corresponding to the slide groove, and a wafer unloading pushing assembly 6 for driving the pushing block 211 to translate is provided above the pushing block 211. The wafer unloading pushing assembly 6 drives the wafer unloading push rod 212 to move and push the wafer out.

[0040] See also Figure 7 In order to ensure the stability of the wafer pushing speed, the wafer unloading pushing component 6 includes a cover plate 601, a partition plate 602 is fixedly installed in the middle of the inner wall of the cover plate 601, a winding motor is fixedly installed above the partition plate 602, the output end of the winding motor is fixedly connected to a winding disk 603, the outer wall of the winding disk 603 is wound with a traction rope 605, one end of the traction rope 605 passes through the partition plate 602 and is fixedly connected to a driving block 604, a pushing spring is fixedly connected between the driving block 604 and the partition plate 602, and the bottom of the driving block 604 is connected to the pushing spring. Block 211 is fixedly connected. When unloading the film, the winding motor drives the winding disk 603 to rotate, and the traction rope 605 is loosened, so that the driving block 604 is pushed and moved under the action of the pushing spring, driving the pushing block 211 and the unloading push rod 212 to move. By controlling the rotation speed of the winding motor, the release speed of the traction rope 605 is controlled, and then the movement of the driving block 604 and the wafer pushing speed of the unloading push rod 212 are controlled, so as to avoid damage to the wafer caused by the high-speed contact impact between the unloading push rod 212 and the wafer.

[0041] See also Figure 5The edge of the lower pressure ring 206 is rotatably connected to the edge of the inner wall of the mounting groove, and a plurality of blowing pipes 215 are fixedly connected to the bottom of the mounting groove, and one end of the plurality of blowing pipes 215 is fixedly connected to the output end of the external air pump. A plurality of blowing ports 209 are opened in the middle of the lower pressure ring 206, and the inner walls of the plurality of blowing ports 209 are inclined toward the direction of the through groove of the upper pressure ring 201, and air is supplied to the bottom of the wafer through the blowing ports 209 to reduce the friction between the wafer and the lower pressure ring 206 during the unloading process.

[0042] See also Figure 1 and Figure 2 A hot air component 3 is arranged above the limiting component 2, and the hot air component 3 includes a hot air hood 301. A avoidance groove is provided on the side of the bottom of the hot air hood 301 corresponding to the pushing arc plate 203, which is used to facilitate the feeding and unloading operations of the wafers; a plurality of air supply ports are provided on the inner wall of the hot air hood 301, and air supply components are provided on the inner walls of the plurality of air supply ports, and an air inlet cavity 302 is provided at the bottom of the air supply port, and an electric heating net 303 is fixedly installed on the middle part of the inner wall of the air inlet cavity 302. By arranging the hot air hood 301 above the limiting component 2 and arranging a plurality of air supply components in a ring inside the hot air hood 301, uniform and stable hot air delivery to the area where the wafers are located is achieved.

[0043] See also Figure 2 In order to improve the temperature uniformity of the hot air delivered by the air supply component, the air supply component includes a direction adjustment frame 304, which is rotatably installed in the air supply port, and a direction adjustment motor is fixedly installed on one side of the inner wall of the air supply port. The output end of the direction adjustment motor is fixedly connected to the direction adjustment frame 304, which is used to drive the direction adjustment frame 304 to rotate and adjust the air supply direction. A fan 305 is fixedly installed in the middle of the direction adjustment frame 304, and an air inlet 306 is provided on one side of the direction adjustment frame 304 close to the air inlet cavity 302, and a hot air outlet 307 is provided on the other side of the direction adjustment frame 304. When the hot air outlet 307 is horizontal, the position of the air inlet 306 is toward the side of the middle of the electric heating net 303 close to the hot air hood 301, and when the hot air outlet 307 is tilted toward the hot air hood 30 1, the position of the air inlet 306 is toward the side of the outside of the hot air hood 301 of the electric heating net 303, and the electric heating net 303 is horizontally arranged, so that during the rotation, the distance between the air inlet 306 and the electric heating net 303 changes, so that the inlet air temperature changes, and then the air supply temperature is adjusted, that is, when the air supply distance is longer (the hot air outlet 307 is horizontal, and the distance for the hot air to reach the wafer is long), the inlet air temperature is higher (the air inlet 306 is close to the electric heating net 303), and when the air supply distance is short (the hot air outlet 307 is downward, and the distance for the hot air to reach the wafer is short), the inlet air temperature is lower (the air inlet 306 is far away from the electric heating net 303), so that the hot air temperature received by the entire wafer is balanced.

[0044] See also Figure 1An accessory mounting frame 4 is fixedly connected to the other side of the top of the machine 1, and a detection camera 7 is slidably installed on one side of the top of the accessory mounting frame 4. The detection camera 7 is set to detect the unloading status of the wafer. When the wafer unloading fails, manual auxiliary unloading operation is performed.

[0045] See also Figure 8 In the existing wafer unloading method, when unloading, the driving assembly 8 drives the mechanical arm 9 to move and translate to the notch 10 on the limit ring, and then drives the mechanical arm 9 to descend and translate and reset, so that the mechanical arm 9 moves through the notch 10 during the movement of the mechanical arm 9, and the wafer is pushed out of the limit ring to complete the wafer unloading operation.

[0046] This device is an auxiliary unloading device of the wafer tensioning and film expanding device, which is fixedly installed on the machine table 1 of the tensioning and film expanding device. When in use, firstly, the wafer is sent into the limit assembly 2 through the avoidance groove by an external loading device or manually, and then the servo motor 204 drives the push arc plate 203 to rotate, and the limit rod 205 is used to push the wafer to move into the limit assembly 2, and then the electromagnet 502 is started to attract and drive the movable plate 504 to approach the electromagnet 502, compress the reset spring 503 and drive the movable plate 504 and the positioning The rod 207 is lifted, so that the upper pressure ring 201 moves down and approaches the lower pressure ring 206, and the wafer is clamped and limited; the tensioning device 101 is lifted to drive the wafer blue film to lift and tighten, and then the drive motor is started to drive the drive gear ring 213 to rotate, thereby driving the lower pressure ring 206 and the upper pressure ring 201 to rotate as a whole, and then driving the wafer to rotate, and at the same time, each air supply component is started, and the heating of the electric heating net 303 and the rotation of the fan 305 are used to send hot air to the wafer from the hot air outlet 307, so that the blue film and the wafer are stably attached;

[0047] Wafer unloading is then performed, see Figure 7 The specific method is: first, the electromagnet 502 is turned off, and under the pushing action of the return spring 503, the upper pressure ring 201 is lifted and separated from the wafer, and the limiting rod 205 is separated from the limiting hole 208;

[0048] Then, the air flow is sent out by the air blowing pipe 215, and the air flow is sent out by the air blowing port 209 on the lower pressure ring 206, so as to reduce the friction resistance between the wafer and the lower pressure ring 206, and blow the wafer toward the unloading station; the servo motor 204 is started to drive the push guard plate to flip open, so as to avoid the influence of the limit rod 205 on the wafer unloading operation;

[0049] The winding motor starts to drive the winding disk 603 to rotate, release the traction rope 605, and the push spring pushes the driving block 604 and the pushing block 211 to move, thereby driving the unloading push rod 212 to move, push the wafer through the through slot and discharge it, completing the wafer unloading operation.

[0050] The above description is only a preferred embodiment of the present invention and does not limit the present invention in any form. Although the present invention has been disclosed as a preferred embodiment as above, it is not used to limit the present invention. Any technical personnel in this field can make some changes or modify the technical contents disclosed above into equivalent embodiments without departing from the scope of the technical solution of the present invention. However, any simple modification, equivalent change and modification made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention still fall within the scope of the technical solution of the present invention.

Claims

1. A wafer unloading device, characterized in that: The invention comprises a machine platform (1), wherein a mounting groove is provided in the middle of the machine platform (1), a limiting assembly (2) for limiting the position of a wafer is rotatably installed in the middle of the mounting groove, the limiting assembly (2) comprises an upper pressure ring (201) and a lower pressure ring (206) arranged in parallel, and a plurality of adjustment assemblies (5) for adjusting the distance between the upper pressure ring (201) and the lower pressure ring (206) are arranged on the top of the upper pressure ring (201); A slide groove is provided on one side of the upper pressure ring (201), a push block (211) is slidably connected to the inner wall of the slide groove, a film unloading push rod (212) is slidably connected to the bottom of the push block (211), a push groove (210) is provided at a position corresponding to the slide groove on the top of the lower pressure ring (206), and a film unloading push assembly (6) for driving the push block (211) to translate is arranged above the push block (211).

2. A wafer unloading device according to claim 1, characterized in that: The sheet unloading pushing assembly (6) comprises a cover plate (601), a partition plate (602) is fixedly installed in the middle of the inner wall of the cover plate (601), a winding motor is fixedly installed above the partition plate (602), the output end of the winding motor is fixedly connected to a winding disk (603), the outer wall of the winding disk (603) is wound with a traction rope (605), one end of the traction rope (605) passes through the partition plate (602) and is fixedly connected to a driving block (604), a pushing spring is fixedly connected between the driving block (604) and the partition plate (602), and the bottom of the driving block (604) is fixedly connected to the pushing block (211).

3. The wafer unloading device according to claim 1, characterized in that: The edge of the lower pressure ring (206) is rotatably connected to the edge of the inner wall of the installation groove, and a plurality of blowing pipes (215) are fixedly connected to the bottom of the installation groove. A plurality of blowing ports (209) are opened in the middle of the lower pressure ring (206), and the inner walls of the plurality of blowing ports (209) are all inclined.

4. The wafer unloading device according to claim 1, characterized in that: A through groove is provided on the other side of the upper pressure ring (201), and servo motors (204) are fixedly installed at both ends of the inner wall of the through groove. The output end of the servo motor (204) is fixedly connected to a push arc plate (203), and the bottoms of the two push arc plates (203) are fixedly connected to a limit rod (205). A limit hole (208) is provided at the top of the lower pressure ring (206) at a position corresponding to the limit rod (205).

5. The wafer unloading device according to claim 1, characterized in that: The top of the lower pressure ring (206) is fixedly connected to a plurality of positioning rods (207), the middle of the upper pressure ring (201) is provided with a plurality of positioning holes (202), the plurality of positioning rods (207) are slidably connected to the plurality of positioning holes (202), the bottom edge of the lower pressure ring (206) is fixedly connected to a driving gear ring (213), a driving motor is provided on one side of the driving gear ring (213), the output end of the driving motor is fixedly connected to a driving gear (214), and the driving gear (214) is meshingly connected to the driving gear ring (213).

6. The wafer unloading device according to claim 1, characterized in that: The adjustment component (5) comprises a mounting sleeve (501), an electromagnet (502) is fixedly mounted on the top of the inner wall of the mounting sleeve (501), a movable plate (504) is slidably connected to the bottom of the inner wall of the mounting sleeve (501), the bottom of the movable plate (504) is fixedly connected to the top of the positioning rod (207), and the output end of the electromagnet (502) is arranged corresponding to the movable plate (504).

7. The wafer unloading device according to claim 1, characterized in that: A hot air component (3) is arranged above the limiting component (2), and the hot air component (3) comprises a hot air hood (301). The inner wall of the hot air hood (301) is provided with a plurality of air supply ports, and the inner walls of the plurality of air supply ports are each provided with an air supply component. An air inlet cavity (302) is arranged at the bottom of the air supply port, and an electric heating net (303) is fixedly installed in the middle of the inner wall of the air inlet cavity (302).

8. The wafer unloading device according to claim 7, characterized in that: The air supply assembly comprises an adjustment frame (304), an adjustment motor is fixedly mounted on one side of the inner wall of the air supply port, a fan (305) is fixedly mounted in the middle of the adjustment frame (304), an air inlet (306) is provided on one side of the adjustment frame (304) close to the air inlet cavity (302), a hot air outlet (307) is provided on the other side of the adjustment frame (304), and the electric heating network (303) is arranged horizontally.

9. The wafer unloading device according to claim 1, characterized in that: An accessory mounting frame (4) is fixedly connected to the other side of the top of the machine platform (1), and a detection camera (7) is slidably mounted on one side of the top of the accessory mounting frame (4).

10. A wafer unloading method for a wafer unloading device according to any one of claims 1 to 9, characterized in that: The following steps are involved: Step 1: driving the upper pressure ring (201) to lift and disengage from the wafer, and causing the limiting rod (205) to disengage from the limiting hole (208); Step 2: Sending air flow through the air blowing port (209) on the lower pressure ring (206) to reduce the friction resistance between the wafer and the lower pressure ring (206); Step 3: The servo motor (204) is started to drive the push guard plate to flip open, so as to avoid the influence of the limit rod (205) on the wafer unloading operation; Step 4: The wafer unloading push assembly (6) pushes the wafer unloading push rod (212) to move, pushes the wafer out, and completes the wafer unloading operation.

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