Vacuum adsorption device and wafer processing equipment
By using multiple sub-suction cups and angle adjustment components in the vacuum adsorption device to adapt to the wafer surface of different shapes, the problem of difficulty in adsorption of warped wafers is solved, and stable adsorption and processing of wafers with larger warpings is achieved.
Patent Information
- Application Number
- CN202411318452.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-09-20
- Publication Date
- 2024-12-20
AI Technical Summary
The prior art is difficult to effectively adsorb and fix wafers with large warpings. The electrostatic suction cup is prone to wafer breakage when complex back films or temperature changes, and the vacuum suction cup has insufficient adsorption capacity.
A vacuum adsorption device is designed, including a base, a plurality of sub-suction cups and an angle adjustment assembly. The sub-suction cup has an adjustable adsorption surface, and the angle of the sub-suction cup is adjusted by a magnet drive so that it can adapt to wafer surfaces of different shapes, and Adsorption is performed by forming a negative pressure through the vacuum assembly.
This device can effectively adsorb wafers with large warping and reduce their warping during processing, improve the wafer fixation ability and avoid the risk of wafer breakage.
Smart Images
Figure CN119170552A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the field of wafer processing technology, and in particular to a vacuum adsorption device and wafer processing equipment. Background Art
[0002] In the wafer processing process, in order to meet the process requirements of wafers with different deformations, it is usually necessary to use an adsorption chuck to adsorb and fix the wafer. Common adsorption chucks include electrostatic chucks and vacuum chucks. Although the electrostatic chuck has a large wafer warpage processing capability, with the complexity of the film type on the back of the wafer or the change of process temperature, it may be difficult to remove the adsorption, which may easily lead to wafer breakage. The vacuum chuck cannot meet the adsorption requirements for wafers with larger warpage. Summary of the invention
[0003] The purpose of the present application is to provide a vacuum adsorption device and wafer processing equipment to address the deficiencies in the above-mentioned prior art, which have a strong adsorption capacity for large-warped parts to be fixed.
[0004] To achieve the above purpose, the technical solution adopted in the embodiment of the present application is as follows:
[0005] According to one aspect of an embodiment of the present application, a vacuum adsorption device is provided, comprising: a base, a vacuum suction cup arranged on the base, and an angle adjustment assembly, wherein the vacuum suction cup comprises a plurality of sub-suction cups, each of which has a first surface and a second surface relative to the first surface, and the first surface is used to adsorb a part to be fixed, and the angle adjustment assembly is used to drive the plurality of sub-suction cups to rotate relative to the base to adjust the angle of the sub-suction cups, and the first surface is provided with adsorption holes, which are used to communicate with the vacuum assembly, and the first surfaces of the plurality of sub-suction cups can be located in the same plane under the drive of the angle adjustment assembly.
[0006] Optionally, the angle adjustment component includes multiple first magnets and multiple second magnets, the multiple first magnets are respectively arranged on the multiple sub-suckers, the multiple second magnets are respectively located on one side of the second surface of the multiple sub-suckers and correspond one-to-one with the multiple first magnets, and the second magnets are used to attract or repel the first magnets to adjust the angle of the sub-sucker.
[0007] Optionally, the first magnet is a permanent magnet, the second magnet is an electromagnet, and the second magnet is used to be connected to a power source.
[0008] Optionally, the side of the vacuum suction cup facing the second magnet is divided into multiple adsorption areas, and the vacuum adsorption device also includes multiple pressure sensors, which correspond one-to-one to the multiple adsorption areas. The pressure sensors are used to detect the suction pressure of the sub-suction cup in the adsorption area corresponding to it.
[0009] Optionally, the magnetic pole direction of the first magnet is parallel to the first surface.
[0010] Optionally, the vacuum suction cup formed by multiple sub-suction cups is circular.
[0011] Optionally, the sub-sucker is made of porous ceramic.
[0012] Optionally, a vacuum component is also included, and the suction end of the vacuum component is connected to the adsorption hole on the sub-suction cup.
[0013] Optionally, a power supply is also included, which is connected to the second magnet and is used to change the magnetic pole direction and magnetic field strength of the second magnet.
[0014] Another aspect of an embodiment of the present application provides a wafer processing equipment, comprising a vacuum adsorption device as described in any of the above items.
[0015] The beneficial effects of this application include:
[0016] The present application provides a vacuum suction device, comprising: a base, a vacuum suction cup arranged on the base, and an angle adjustment component, wherein the vacuum suction cup comprises a plurality of sub-suction cups, the sub-suction cups having a first surface and a second surface relative to each other, the first surface being used to adsorb the part to be fixed, the angle adjustment component being used to drive the plurality of sub-suction cups to rotate relative to the base to adjust the angle of the sub-suction cups, the first surface being provided with an adsorption hole, the adsorption hole being used to communicate with the vacuum component, and the first surfaces of the plurality of sub-suction cups being able to be located in the same plane under the drive of the angle adjustment component. The vacuum suction device divides the vacuum suction cup into a plurality of independent sub-suction cups, and adjusts the angle of each sub-suction cup respectively through the angle adjustment component, so that the adsorption surface of the vacuum suction cup can present a plurality of curved surfaces in various forms, rather than a single plane. When adsorbing the part to be fixed, the vacuum suction cup can be adaptively adjusted according to the shape of the lower surface of the part to be fixed, so as to better match the lower surface of the part to be fixed, so as to have a stronger adsorption capacity for the part to be fixed with a larger warping. In addition, after adsorbing the part to be fixed, by adjusting the angles of the plurality of sub-suction cups again, the warping of the part to be fixed during the processing process can also be reduced. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0018] Figure 1 One of the schematic diagrams of the working process of the vacuum adsorption device provided in the embodiment of the present application;
[0019] Figure 2 A schematic diagram of the structure of a vacuum suction cup in a vacuum adsorption device provided in an embodiment of the present application;
[0020] Figure 3 The second schematic diagram of the working process of the vacuum adsorption device provided in the embodiment of the present application;
[0021] Figure 4 The third schematic diagram of the working process of the vacuum adsorption device provided in the embodiment of the present application.
[0022] Icon: 100 - vacuum adsorption device; 110 - vacuum suction cup; 111 - sub-suction cup; 1111 - first surface; 1112 - second surface; 120 - angle adjustment component; 121 - first magnet; 122 - second magnet; 130 - vacuum component; 200 - part to be fixed. DETAILED DESCRIPTION
[0023] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.
[0024] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents selected embodiments of the present application. It should be noted that, in the absence of conflict, the various features in the embodiments of the present application can be combined with each other, and the combined embodiments are still within the scope of protection of the present application.
[0025] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.
[0026] In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the product of the application is usually placed when in use. They are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.
[0027] In the description of this application, it should also be noted that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0028] In one aspect of the embodiment of the present application, please refer to Figure 1 and Figure 2 , a vacuum adsorption device 100 is provided, which is used to adsorb a sheet-shaped part to be fixed 200, and is particularly used to adsorb a wafer with a large warp. The vacuum adsorption device 100 includes: a base (not shown in the figure), a vacuum suction cup 110 arranged on the base, and an angle adjustment component 120. The vacuum suction cup 110 includes a plurality of sub-suction cups 111, each of which has a first surface 1111 and a second surface 1112 opposite to each other, wherein the first surface 1111 is used to adsorb the part to be fixed 200, and the second surface 1112 faces away from the part to be fixed 200. Please refer to Figure 3 The angle adjustment component 120 is used to drive the multiple sub-suction cups 111 to rotate relative to the base, so as to adjust the angles of the multiple sub-suction cups 111, so that the first surfaces 1111 of the multiple sub-suction cups 111 can be as close as possible to the surface of the part to be fixed 200, so as to adapt to the part to be fixed 200 with a larger warping. The first surface 1111 of the sub-suction cup 111 is provided with a suction hole (not shown in the figure), and the suction hole is used to communicate with the vacuum component 130. Under the action of the vacuum component 130, a negative pressure is formed in the suction hole, so that the part to be fixed 200 is adsorbed on the first surface 1111. Please refer to Figure 4 Driven by the angle adjustment component 120, the first surfaces 1111 of the plurality of sub-suction cups 111 can be located in the same plane under the drive of the angle adjustment component 120, so that after the part to be fixed 200 is adsorbed, the warping of the part to be fixed 200 is reduced.
[0029] A sub-sucker 111 may have a plurality of adsorption holes, and the plurality of adsorption holes are dispersedly distributed on the sub-sucker 111, so as to better adsorb the part to be fixed 200. The adsorption holes on the sub-sucker 111 may be obtained by processing, or may be holes provided by the material used to prepare the sub-sucker 111. For example, the material of the sub-sucker 111 is porous ceramic. The porous ceramic material has a plurality of through holes, which can be used as adsorption holes of the sub-sucker 111. Selecting porous ceramic as the processing material of the sub-sucker 111 can make the processing of the sub-sucker 111 simpler.
[0030] The shapes and sizes of the plurality of sub-suckers 111 may be slightly different according to different distribution areas. There may be a gap between two adjacent sub-suckers 111 , and the gap is used to provide space for the rotation of a single sub-sucker 111 .
[0031] The multiple sub-sucker 111 does not interfere with each other during the process of adjusting the angle. The angle adjustment component 120 can adjust the angles of the multiple sub-sucker 111 separately, but it is not limited to the angle adjustment component 120 to adjust the angles of the multiple sub-sucker 111 at the same time. If an individual sub-sucker 111 can fit well with the to-be-fixed part 200 in the initial state, there is no need to adjust the initial angle of the sub-sucker 111.
[0032] The process of the vacuum adsorption device 100 adsorbing the fixed part 200 is as follows: Figure 1 As shown, the part to be fixed 200 is placed on the vacuum suction cup 110. At this time, the first surfaces 1111 of the plurality of sub-suction cups 111 are all facing the part to be fixed 200, but have a certain angle with the lower surface of the part to be fixed 200. Figure 3 As shown, the vacuum assembly 130 and the angle adjustment assembly 120 are turned on, and the angle adjustment assembly 120 adjusts the angles of the plurality of sub-suction cups 111 respectively, so that the plurality of sub-suction cups 111 are as close as possible to the surface of the part to be fixed 200 corresponding to its position, thereby adsorbing the part to be fixed 200. Figure 4 As shown, the angle adjustment component 120 adjusts the angles of the multiple sub-suction cups 111 again so that the first surfaces 1111 of the multiple sub-suction cups 111 are located in the same plane. During this process, the sub-suction cups 111 adsorb the part to be fixed 200, so that the part to be fixed 200 is deformed following the sub-suction cups 111, thereby changing from a warped state to a flat state. Figure 1 , Figure 3 and Figure 4 The figure shows the process of the vacuum adsorption device 100 adsorbing the part 200 to be fixed with its edge warped upward. It can be understood that the vacuum adsorption device 100 can adsorb the part 200 to be fixed with any warping shape, such as the part 200 to be fixed with its edge warped downward, the part 200 to be fixed with wavy warping, etc.
[0033] The vacuum suction device 100 divides the vacuum suction cup 110 into a plurality of independent sub-suction cups 111, and adjusts the angle of each sub-suction cup 111 through the angle adjustment component 120, so that the suction surface of the vacuum suction cup 110 can present a variety of curved surfaces, rather than a single plane. When adsorbing the part 200 to be fixed, it can be adaptively adjusted according to the shape of the lower surface of the part 200 to be fixed, so as to better match the lower surface of the part 200 to be fixed, so as to have a stronger adsorption capacity for the part 200 to be fixed with a larger warping. In addition, after adsorbing the part 200 to be fixed, by adjusting the angles of the plurality of sub-suction cups 111 again, the warping of the part 200 to be fixed during the processing process can also be reduced.
[0034] Optionally, the vacuum suction cup 110 composed of a plurality of sub-suction cups 111 is circular.
[0035] Such an arrangement can be adapted to a circular part 200 to be fixed, such as a wafer.
[0036] It should be noted that, in the above-mentioned embodiment, the structure of the angle adjustment component 120 is not limited, as long as it can adjust the angle of the sub-suction cup 111.
[0037] Optionally, the angle adjustment component 120 includes multiple first magnets 121 and multiple second magnets 122, the multiple first magnets 121 are respectively arranged on the multiple sub-sucker 111, and the multiple second magnets 122 are respectively located on one side of the second surface 1112 of the multiple sub-sucker 111 and correspond one by one to the multiple first magnets 121. The second magnets 122 are used to attract or repel the first magnets 121 to adjust the angle of the sub-sucker 111.
[0038] The number of the first magnets 121 and the second magnets 122 is equal to the number of the sub-sucker 111. A first magnet 121 is provided on each sub-sucker 111, and a second magnet 122 is correspondingly provided on the side of each first magnet 121. The second magnets 122 and the first magnets 121 repel each other and attract each other because of like charges. This causes the first magnet 121 to change its angle, thereby driving the sub-sucker 111 fixed relatively to the first magnet 121 to change its angle.
[0039] It can be understood that at least one of the first magnet 121 and the second magnet 122 should be able to adjust the magnetic pole direction, which refers to the direction from the N pole to the S pole. And at least one of the first magnet 121 and the second magnet 122 should be able to adjust the magnetic field strength, so as to achieve the adjustment of different angles of the sub-chuck 111.
[0040] Preferably, the magnetic pole direction of the first magnet 121 is parallel to the first surface 1111. With such an arrangement, the angle of the sub-sucker 111 can be adjusted more conveniently.
[0041] Optionally, the first magnet 121 is a permanent magnet, the second magnet 122 is an electromagnet, and the second magnet 122 is used to connect to a power source.
[0042] The magnetic pole direction and magnetic field strength of the first magnet 121 remain unchanged. The second magnet 122 can change its magnetic pole direction according to the direction of the current passed, for example, from the left N pole and the right S pole to the left S pole and the right N pole, thereby switching between repulsion and attraction with the first magnet 121. The second magnet 122 can also change its magnetic field strength according to the magnitude of the current passed, thereby adjusting the repulsion and attraction between the first magnet 121 and the first magnet 121, so that the first magnet 121 changes different angles.
[0043] Preferably, the first magnet 121 is disposed inside the sub-chuck 111 to save space.
[0044] Optionally, the side of the vacuum suction cup 110 facing the second magnet 122 is divided into multiple adsorption areas, and the vacuum adsorption device 100 also includes multiple pressure sensors (not shown in the figure), and the multiple pressure sensors correspond one-to-one to the multiple adsorption areas. The pressure sensors are used to detect the suction pressure of the sub-suction cup 111 in the adsorption area corresponding to it.
[0045] The side of the vacuum suction cup 110 is divided into multiple adsorption areas, each of which corresponds to at least one sub-suction cup 111. The pressure sensor is used to detect the suction pressure of all sub-suction cups 111 in the adsorption area corresponding to it. If the sub-suction cup 111 has a high degree of adaptability to the part to be fixed 200, the part to be fixed 200 will block the adsorption holes on the sub-suction cup 111 to a large extent, and the suction pressure that the pressure sensor can detect is relatively small. If the sub-suction cup 111 has a low degree of adaptability to the part to be fixed 200, the part to be fixed 200 will block the adsorption holes on the sub-suction cup 111 to a small extent, and the suction pressure that the pressure sensor can detect is relatively large. Therefore, according to the suction pressure detected by the pressure sensor, the degree of adaptability between the sub-suction cup 111 and the part to be fixed 200 in the adsorption area corresponding to the pressure sensor can be judged, and the angle of the sub-suction cup 111 can be adjusted according to the degree of adaptability.
[0046] Preferably, the number of the pressure sensors is equal to the number of the sub-suction cups 111 and corresponds one to one, so that the angle of the sub-suction cups 111 can be adjusted more accurately.
[0047] Optionally, the vacuum adsorption device 100 further includes a vacuum component 130 , and an air suction end of the vacuum component 130 is connected to the adsorption hole on the sub-suction cup 111 .
[0048] The vacuum assembly 130 draws air to form negative pressure in the adsorption hole, so that the sub-suction cup 111 can adsorb the to-be-fixed part 200. For example, the vacuum assembly 130 includes a vacuum pump and an air extraction pipe connected to the vacuum pump, and the end of the air extraction pipe away from the vacuum pump is connected to the adsorption hole.
[0049] Optionally, the vacuum adsorption device 100 further includes a power supply, which is connected to the second magnet 122 , and is used to change the magnetic pole direction and magnetic field strength of the second magnet 122 .
[0050] The power supply can pass currents of opposite directions to the second magnet 122, thereby changing the magnetic pole direction of the second magnet 122. In addition, the power supply can also pass currents of different magnitudes to the second magnet 122, thereby changing the magnetic field strength of the second magnet 122.
[0051] This embodiment also provides a wafer processing equipment, including the vacuum adsorption device 100 as described in any one of the above items.
[0052] The wafer processing equipment includes the same structure and beneficial effects as the vacuum adsorption device 100 in the above-mentioned embodiment. The structure and beneficial effects of the vacuum adsorption device 100 have been described in detail in the above-mentioned embodiment, and will not be repeated here.
[0053] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims
1. A vacuum adsorption device, characterized in that: include: A base, a vacuum suction cup arranged on the base, and an angle adjustment component, the vacuum suction cup includes a plurality of sub-suction cups, the sub-suction cups have a first surface and a second surface relative to each other, the first surface is used to adsorb the part to be fixed, the angle adjustment component is used to drive the plurality of sub-suction cups to rotate relative to the base to adjust the angle of the sub-suction cups, the first surface is provided with adsorption holes, the adsorption holes are used to communicate with the vacuum component, and the first surfaces of the plurality of sub-suction cups can be located in the same plane under the drive of the angle adjustment component.
2. The vacuum adsorption device according to claim 1, characterized in that: The angle adjustment assembly includes multiple first magnets and multiple second magnets, the multiple first magnets are respectively arranged on the multiple sub-suckers, the multiple second magnets are respectively located on one side of the second surface of the multiple sub-suckers, and correspond one-to-one to the multiple first magnets, the second magnets are used to attract or repel the first magnets to adjust the angle of the sub-sucker.
3. The vacuum adsorption device according to claim 2, characterized in that: The first magnet is a permanent magnet, the second magnet is an electromagnet, and the second magnet is used to be connected to a power source.
4. The vacuum adsorption device according to claim 1, characterized in that: The vacuum suction cup is divided into a plurality of adsorption areas, and the vacuum adsorption device further includes a plurality of pressure sensors, the plurality of pressure sensors correspond one to one with the plurality of adsorption areas, and the pressure sensors are used to detect the suction pressure of the sub-suction cup in the adsorption area corresponding thereto.
5. The vacuum adsorption device according to claim 2, characterized in that: The magnetic pole direction of the first magnet is parallel to the first surface.
6. The vacuum adsorption device according to claim 1, characterized in that: The vacuum suction cup formed by a plurality of sub-suction cups is circular.
7. The vacuum adsorption device according to claim 1, characterized in that: The material of the sub-sucker is porous ceramic.
8. The vacuum adsorption device according to any one of claims 1 to 7, characterized in that: It also includes a vacuum component, and the suction end of the vacuum component is connected to the adsorption hole on the sub-suction cup.
9. The vacuum adsorption device according to claim 3, characterized in that: It also includes a power supply, which is connected to the second magnet and is used to change the magnetic pole direction and magnetic field strength of the second magnet.
10. A wafer processing equipment, characterized in that: It comprises the vacuum adsorption device as claimed in any one of claims 1 to 9.