Wafer clamping mechanism and wafer post-processing device

Abstract

The invention discloses a wafer clamping mechanism and a wafer post-processing device. The wafer clamping mechanism comprises a turntable, a clamping mechanism and a clamping mechanism, the clamping jaw assembly is arranged in the circumferential direction of the rotating disc so as to clamp a wafer to be processed; and the jacking part is arranged below the rotating disc and used for intermittently jacking a jacking rod of the clamping jaw assembly, and the jacking rod can abut against a guide shaft of the clamping jaw assembly, so that the guide shaft and clamping jaws on the guide shaft rotate along the axis, and the working state of the clamping jaw assembly is changed.

Description

Technical Field

[0001] The present invention belongs to the technical field of wafer post-processing, and in particular, relates to a wafer clamping mechanism and a wafer post-processing device. Background Art

[0002] Chemical Mechanical Polishing (CMP) is one of the five core processes in the wafer manufacturing process. It is an ultra-precision surface processing technology for global flattening. Wafers that have completed chemical mechanical polishing need to be cleaned, dried, and other post-processing to avoid contamination of semiconductor devices by trace ions and metal particles, and to ensure the performance and pass rate of semiconductor devices.

[0003] Wafer post-processing generally uses horizontal cleaning technology. Specifically, the wafer is placed on a clamping mechanism and rotated at a certain speed; at the same time, a certain flow of cleaning liquid is sprayed on the wafer to clean the wafer surface. After the wafer is cleaned, the wafer is rotated at high speed to peel off the water film on the wafer surface and dry the wafer.

[0004] Whether cleaning or drying the wafer, the wafer needs to be reliably clamped. The existing clamping mechanism usually includes a chuck, a clamping claw assembly and a lifting mechanism. The clamping claw assembly is arranged on the chuck, and the lifting mechanism abuts against the bottom of the clamping claw assembly to indirectly act on the elastic member of the clamping claw assembly, so that the clamping claw is in a closed state to clamp the wafer. The above clamping mechanism has the following problems:

[0005] 1) When the claw assembly is opened, the lifting mechanism always acts on the chuck through the claw assembly, and the chuck will be deformed by force, causing the claw assembly in the clamping state to change and resulting in the failure of the manipulator interaction;

[0006] 2) To prevent the chuck from being deformed too much, the designed chuck is too heavy, which affects the flexibility of the clamping mechanism;

[0007] 3) The claw assembly moves frequently, and the claw shaft and the mounting hole on it wear and produce debris, which will affect the post-processing effect of the wafer;

[0008] 4) The vertical positions corresponding to the open and closed states of the claw assembly are the same, which is not conducive to the application of different post-processing processes. Summary of the invention

[0009] The embodiments of the present invention provide a wafer clamping mechanism and a wafer post-processing device, aiming to solve at least one of the technical problems existing in the prior art.

[0010] A first aspect of an embodiment of the present invention provides a wafer clamping mechanism, comprising:

[0011] Turntable;

[0012] A claw assembly is arranged along the circumference of the turntable to clamp the wafer to be processed;

[0013] The lifting member is arranged below the turntable and is used for intermittently lifting the lifting rod of the claw assembly. The lifting rod can abut against the guide shaft of the claw assembly, so that the guide shaft and the claw thereon rotate along the axis to change the working state of the claw assembly.

[0014] In some embodiments, the claw assembly further includes a guide sleeve, which is sleeved on the outer peripheral side of the push rod; after the lifting member is separated from the push rod, the guide sleeve can maintain the position of the guide shaft and the claw.

[0015] In some embodiments, the claw assembly also includes a base connected to the turntable; the base is provided with a vertical hole to allow a gap to be placed to place the guide shaft.

[0016] In some embodiments, the guide sleeve is disposed below the base, and the push rod is slidably disposed in the guide sleeve and is located below the guide shaft.

[0017] In some embodiments, a guide surface is provided inside the guide sleeve, and the lifting push rod can make the guide shaft rotate along the guide surface to change the position of the claw.

[0018] In some embodiments, the guide sleeve is configured with a vertical step hole, and the guide surface is formed on the step surface of the step hole.

[0019] In some embodiments, the guide surface is a plane or a curved surface with a gradually changing height along the circumferential direction.

[0020] In some embodiments, the number of the guide surfaces is at least two, and they are spaced apart in the circumferential direction.

[0021] In some embodiments, spacing grooves are provided between the guide surfaces, and the spacing grooves are provided through-through in the vertical direction.

[0022] In some embodiments, the spacing groove includes a first spacing groove and a second spacing groove, which are respectively located at the ends of the guide surface; the radial width of the first spacing groove is greater than the radial width of the second spacing groove.

[0023] In some embodiments, a shaft shoulder is disposed below the guide shaft, and a stepped shaft is provided below the shaft shoulder; a positioning block is disposed on the outer peripheral side of the guide shaft, and the positioning block extends from the shaft shoulder along the stepped shaft.

[0024] In some embodiments, the positioning block matches the shape and size of the spacing groove, so that the positioning block can slide in the spacing groove.

[0025] In some embodiments, the lower end surface of the positioning block is a plane or a curved surface, and the contour of the lower end surface matches the guide surface.

[0026] In some embodiments, a sliding block is disposed on the outer peripheral side of the push rod, and the sliding block is disposed in the spacing groove.

[0027] In some embodiments, a concave-convex surface is disposed above the push rod, and a high point of the concave-convex surface abuts against a positioning block of the guide shaft.

[0028] In some embodiments, the claw assembly also includes a spring, which is sleeved on the outside of the guide shaft; one end of the spring abuts against the base, and the other end of the spring abuts against the shoulder of the guide shaft.

[0029] In some embodiments, the guide surface is configured with a sliding groove, and the sliding groove is arranged to penetrate along the vertical direction.

[0030] In some embodiments, the sliding block is disposed in the sliding groove, and its size and setting position match the size and setting position of the sliding groove.

[0031] In some embodiments, the jaw assembly further comprises an end cover which is detachably connected below the guide sleeve to limit the position of the ejector rod.

[0032] In some embodiments, the claw is connected to the top of the guide shaft through a wedge pin structure.

[0033] In some embodiments, the clamping claw is a rod-shaped structure, and a cone that is narrow at the top and wide at the bottom is configured on the upper part to pre-position the wafer to be clamped.

[0034] In some embodiments, an ejector pin is vertically arranged above the base, the ejector pin is close to the inner side of the turntable, and the top surface of the ejector pin corresponds to the outer side surface of the frustum.

[0035] In some embodiments, the clamping claw also includes a clamping head, which is located above the frustum; the clamping head includes a semi-cylindrical portion, a semi-frustum portion and an arc-shaped top, the semi-cylindrical portion is horizontally connected to the semi-frustum portion, and the arc-shaped top is located above the semi-cylindrical portion and the semi-frustum portion, and the three are formed in one piece.

[0036] In some embodiments, the guide shaft and the claw thereon rotate 180° along the axis to switch the working state of the claw assembly.

[0037] A second aspect of an embodiment of the present invention provides a wafer post-processing device, comprising:

[0038] Box;

[0039] The wafer clamping mechanism described above is arranged inside the box, and a driving mechanism is arranged below the wafer clamping mechanism to drive the clamped wafer to rotate around the axis;

[0040] The post-processing module is arranged above the wafer clamping mechanism to perform a post-processing process on the rotating wafer.

[0041] The beneficial effects of the present invention include:

[0042] a. The lifting member of the wafer clamping mechanism does not need to always abut against the claw assembly to maintain the open state of the claw assembly, which effectively reduces the force of the lifting member on the turntable and avoids excessive deformation of the turntable that affects the stability of wafer clamping;

[0043] b. When the claw assembly is maintained in the open state, the deformation of the turntable is minimal, which is conducive to reducing the deadweight of the turntable and improving the flexibility of the wafer clamping mechanism;

[0044] c. The lifting member abuts against the lower end of the ejector rod to drive the guide shaft to move upward, and the rebound of the spring can make the guide shaft slide along the guide surface of the guide sleeve to drive the guide shaft to rotate, so as to change the position of the claw connected to the guide shaft;

[0045] d. The guide shaft and the claws thereon can rotate 180° along the axis to switch the working state of the claw assembly;

[0046] e. The slider of the ejector rod is set in the spacing groove of the guide sleeve, and the two are precisely matched to avoid sudden changes in the guide shaft and the claws during the rotation process, which may affect the stability of wafer clamping;

[0047] f. The lower end surface of the positioning block is a flat surface or a curved surface, which fits tightly with the guide surface of the guide sleeve to ensure the smooth rotation of the guide shaft;

[0048] g. The jaws are provided with a clamping head, the contour of which is a smooth curved surface, so as to guide the waste liquid toward the outside of the turntable;

[0049] h. The claw is equipped with a frustum, which cooperates with the ejector pin of the base to achieve the pre-positioning of the wafer, which is conducive to the stable interaction of the wafer;

[0050] i. When the claw assembly is opened and closed, the vertical positions of the guide shaft and the claws thereon are different to adapt to different wafer post-processing processes; the claw height corresponding to the claw assembly in the open state is greater than the claw height corresponding to the closed state, so as to realize high-position wafer taking and low-position clamping of the wafer clamping mechanism, which is conducive to better arrangement of the wafer post-processing process;

[0051] j. The claw and the guide shaft adopt a split structure to avoid the claw being worn out and scrapped as a whole; at the same time, the claw and the guide shaft are connected by a wedge pin structure to effectively ensure the accuracy of the claw fixing position;

[0052] k. The step portion in the guide sleeve is formed independently of the main body of the guide sleeve, and the step portion is made of a material with average wear resistance, while the guide shaft is made of a material with strong wear resistance, so as to selectively wear the step portion of the guide sleeve, thereby avoiding excessive wear and frequent replacement of the positioning block of the guide shaft, so as to improve the convenience of using the wafer clamping mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0053] The advantages of the present invention will become clearer and easier to understand through the detailed description made in conjunction with the following drawings, which are only schematic and do not limit the scope of protection of the present invention, wherein:

[0054] Figure 1 is a schematic diagram of a wafer clamping mechanism provided by an embodiment of the present invention;

[0055] Figure 2 is a schematic diagram of a claw assembly provided by an embodiment of the present invention;

[0056] Figure 3 is a cross-sectional view of a guide sleeve provided by one embodiment of the present invention;

[0057] Figure 4 is a schematic diagram of a guide sleeve provided by an embodiment of the present invention from another viewing angle;

[0058] Figure 5 is a schematic diagram of a guide shaft provided by an embodiment of the present invention;

[0059] Figure 6 yes Figure 5 A schematic diagram of another perspective of the middle guide shaft;

[0060] Figure 7 is a schematic diagram of a push rod provided by an embodiment of the present invention;

[0061] Figure 8 yes Figure 7 A cross-sectional view of the middle push rod;

[0062] Fig. 9 is a schematic diagram of the interaction between the ejector rod and the guide shaft provided by one embodiment of the present invention;

[0063] Fig.10 is a schematic diagram of a guide shaft connected to a claw provided by an embodiment of the present invention;

[0064] Fig.11 is a schematic diagram of a clamping claw provided by an embodiment of the present invention;

[0065] Fig.12 It is a schematic diagram of a wafer post-processing device provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0066] The technical scheme of the present invention is described in detail below in conjunction with specific embodiments and their accompanying drawings. The embodiments recorded herein are specific embodiments of the present invention, which are used to illustrate the concept of the present invention; these descriptions are explanatory and exemplary and should not be construed as limitations on the embodiments of the present invention and the scope of protection of the present invention. In addition to the embodiments recorded herein, those skilled in the art can also adopt other obvious technical solutions based on the contents disclosed in the claims of this application and its specification, including technical solutions that adopt any obvious replacements and modifications to the embodiments recorded herein.

[0067] The drawings of this specification are schematic diagrams, which assist in explaining the concept of the present invention and schematically show the shapes of various parts and their mutual relationships. It should be understood that in order to clearly show the structures of various components of the embodiments of the present invention, the drawings are not drawn according to the same scale, and the same reference numerals are used to represent the same parts in the drawings.

[0068] In the present invention, wafer (W) is also called substrate, and its meaning and practical function are equivalent. The term "including" and similar terms should be understood as open inclusion, that is, "including but not limited to". The term "based on" should be understood as "based at least in part on". The term "one embodiment" or "the embodiment" should be understood as "at least one embodiment". The terms "first", "second", etc. can refer to different or the same objects, and are only used to distinguish the objects referred to, without implying a specific spatial order, time order, order of importance, etc. of the objects referred to. In some embodiments, values, processes, selected items, determined items, equipment, devices, means, components, assemblies, etc. are referred to as "best", "lowest", "highest", "minimum", "maximum", etc. It should be understood that such descriptions are intended to indicate that a selection can be made from a number of available functional options, and such selections do not need to be better, lower, higher, smaller, larger, or otherwise preferred than other options in other aspects or all aspects.

[0069] Figure 1 is a schematic diagram of a wafer clamping mechanism 100 provided in one embodiment of the present invention. A wafer clamping mechanism 100 includes:

[0070] The turntable 10 is a disk-shaped structure, and a driving mechanism (not shown) is disposed below the turntable 10 to drive the turntable 10 to rotate;

[0071] A claw assembly 20 is arranged along the circumference of the turntable 10 to clamp the wafer W to be processed;

[0072] The lifting member 30 is disposed below the turntable 10 and can be located directly below the claw assembly 20 to intermittently lift the top rod 21 of the claw assembly 20 to change the working state of the claw assembly 20. That is, the claw assembly 20 can be switched between an open state and a closed state to release and clamp the wafer W to be processed.

[0073] In the present invention, the driving mechanism can drive the wafer clamped by the claw assembly 20 to rotate synchronously with the turntable 10, so as to efficiently clean the particles remaining on the surface of the wafer.

[0074] Furthermore, the push rod 21 can abut against the guide shaft 22 ( Figure 2 As shown), the guide shaft 22 and the claw 23 thereon rotate along the axis to change the working state of the claw assembly 20.

[0075] Figure 2 In the illustrated embodiment, the claw assembly 20 further includes a guide sleeve 24, which is a cylindrical structure and is sleeved on the outer peripheral side of the ejector rod 21. After the lifting member 30 is separated from the ejector rod 21, the guide sleeve 24 can maintain the position of the guide shaft 22 and the claw 23. Such a configuration can prevent the lifting member 30 from always acting on the turntable 10 through the ejector rod 21 to cause the turntable 10 to deform, prevent the turntable 10 from being deformed due to excessive deformation, and thus solve the problem of interaction failure between the robot and the wafer clamping mechanism 100.

[0076] Furthermore, the claw assembly 20 further includes a base 25, which is connected to the turntable 10. The base 25 is provided with a vertical hole, such as Figure 2 As shown, the guide shaft 22 is spaced in the vertical hole of the base 25 so that the guide shaft 22 can move up and down along the axis of the vertical hole and rotate around the axis by a certain angle.

[0077] In the present invention, the guide sleeve 24 is disposed below the base 25 , and the push rod 21 is slidably disposed in the guide sleeve 24 and located below the guide shaft 22 , so that the upper end of the push rod 21 can abut against the lower end of the guide shaft 22 .

[0078] Furthermore, a guide surface 24a is provided inside the guide sleeve 24. Figure 3 As shown, the lifted jack 21 can make the guide shaft 22 rotate along the guide surface 24 a to change the posture of the claw 23 .

[0079] Figure 3 In the illustrated embodiment, the guide sleeve 24 is provided with a vertical step hole 24b, and the guide surface 24a is formed on the step surface of the step hole 24b.

[0080] The guide surface 24 a is a plane or a curved surface with a gradually changing height along the circumferential direction, so as to guide the guide shaft 22 to rotate along the guide surface 24 a by a certain angle, thereby changing the position and posture of the guide shaft 22 and its upper claw 23 .

[0081] In the present invention, the number of the guide surfaces 24a is at least two, and they are spaced apart in the circumferential direction. Figure 4 It is a schematic diagram of the guide sleeve 24 observed from top to bottom, wherein there are two guide surfaces 24a, and the two guide surfaces 24a are spaced apart in the circumferential direction to cooperate with the rotation of the guide shaft 22 to change the posture of the claw 23.

[0082] Figure 4 In the embodiment, a spacing groove 24c is provided between the guide surfaces 24a, wherein the spacing groove 24c is provided through in the vertical direction to cooperate with the positioning block 22c of the guide shaft 22 mentioned below to complete the change of the vertical position of the claw 23.

[0083] Further, the spacing groove 24c includes a first spacing groove 24c-1 and a second spacing groove 24c-2, which are respectively located at the ends of the guide surface 24a. The radial width of the first spacing groove 24c-1 is greater than the radial width of the second spacing groove 24c-2. Here, the "radial width" refers to the depth dimension of the spacing groove 24c along the radial direction.

[0084] Figure 5 2 is a schematic diagram of a guide shaft 22 provided in an embodiment of the present invention. The guide shaft 22 is a rod-shaped structure, and a shaft shoulder 22a is disposed below the guide shaft 22; a stepped shaft 22b is disposed below the shaft shoulder 22a. Here, the lower part of the guide shaft 22 refers to the lower part of the guide shaft 22 in the working state (i.e., the positioning block 22c is disposed downward).

[0085] Furthermore, a positioning block 22 c is disposed on the outer peripheral side of the guide shaft 22 , and the positioning block 22 c is extended from the shaft shoulder 22 a along the length direction of the stepped shaft 22 b .

[0086] Two positioning blocks 22c are disposed on the outer circumference of the guide shaft 22, namely a first positioning block 22c-1 and a second positioning block 22c-2. Figure 6 The circumferential position corresponding to the positioning block 22c of the guide shaft 22 matches the circumferential position corresponding to the spacing groove 24c of the guide sleeve 24 to coordinately complete the adjustment of the position and posture of the guide shaft 22.

[0087] It should be noted that the positioning block 22c matches the shape and size of the spacing groove 24c, so that the positioning block 22c can slide into the spacing groove 24c and move along the length direction of the spacing groove 24c. Specifically, the first positioning block 22c-1 matches the first spacing groove 24c-1, and the second positioning block 22c-2 matches the second spacing groove 24c-2.

[0088] Furthermore, the lower end face of the positioning block 22c is a plane or a curved surface, and the contour of its lower end face matches the guide surface 24a, so that the positioning block 22c of the guide shaft 22 fits tightly against the guide surface 24a of the guide sleeve 24 to ensure the smooth rotation of the guide shaft 22 and prevent the claws 23 on the upper part of the guide shaft 22 from suddenly changing and crushing the wafer.

[0089] Figure 7 It is a schematic diagram of a push rod 21 provided in one embodiment of the present invention. A slider 21a is arranged on the outer peripheral side of the push rod 21. The arrangement of the slider 21a matches the arrangement of the spacing groove 24c in the guide sleeve 24, so that the push rod 21 can be inserted into the guide sleeve 24 from bottom to top, and the slider 21a slides up and down in the spacing groove 24c.

[0090] Furthermore, the top rod 21 is a cylindrical structure with one end sealed, and a placement hole 21b is arranged on it. Figure 8 As shown, the stepped shaft 22b of the guide shaft 22 is inserted into the placement hole 21b of the push rod 21 so that the positioning block 22c abuts against the guide surface 24a.

[0091] In the present invention, a concave-convex surface 21c is disposed above the push rod 21. The number of the concave-convex surfaces 21c is multiple and is continuously arranged along the circumferential direction of the push rod 21. The high point of the concave-convex surface 21c abuts against the positioning block 22c of the guide shaft 22. That is, when the push rod 21 lifts the guide shaft 22, the high point of the concave-convex surface 21c abuts against the positioning block 22c of the guide shaft 22.

[0092] Figure 2 In the illustrated embodiment, the claw assembly 20 further includes a spring 26, which is sleeved on the outer side of the guide shaft 22. Specifically, one end of the spring 26 abuts against the base 25, and the other end abuts against the shoulder 22b of the guide shaft 22, so that the spring 26 is limited between the guide sleeve 24 and the base 25 for telescopic deformation.

[0093] Furthermore, the claw assembly 20 also includes an end cover 27, such as Figure 2 As shown, the end cover 27 is detachably connected to the bottom of the guide sleeve 24 to limit the position of the ejector rod 21.

[0094] Specifically, a through hole is provided at the center of the end cover 27, and the diameter of the through hole is slightly larger than the outer diameter of the lower section of the push rod 21 and smaller than the outer diameter of the upper section of the push rod 21, so that the through hole of the end cover 27 can support the push rod 21, thereby preventing the push rod 21 from slipping out of the guide sleeve 24. At the same time, the lower section of the push rod 21 is slidably connected to the through hole of the end cover 27 to ensure that the push rod 21 moves smoothly in the vertical direction, so as to drive the rotation of the guide shaft 22 and switch the position of the claw 23.

[0095] Figure 2In the illustrated embodiment, the slider 21 a of the push rod 21 is disposed in the spacing groove 24 c of the guide sleeve 24 to ensure that the push rod 21 moves in the vertical direction.

[0096] Furthermore, the guide surface 24a is provided with a slide groove 24d, which is arranged to penetrate in the vertical direction. The slider 21a on the top rod 21 is arranged in the slide groove 24d, and the size and setting position of the slider 21a match the size and setting position of the slide groove 24d to ensure that the top rod 21 moves in the vertical direction.

[0097] It should be noted that Figure 7 In the embodiment, there are four sliders 21a; Figure 4 In the illustrated spacing groove 24c and the sliding groove 24d in the guide sleeve 24. It is understandable that if the number of the sliding blocks 21a on the push rod 21 is a pair and is evenly distributed in the circumferential direction, the guide sleeve 24 may not be provided with the sliding groove 24d.

[0098] When the claw assembly 20 switches the working state, the positioning block 22c of the guide shaft 22 abuts against the guide surface 24a of the guide sleeve 24, and the contact parts of the two components will wear each other, which will cause the guide shaft 22 and / or the guide sleeve 24 to be excessively worn and scrapped.

[0099] Therefore, in some embodiments, the guide sleeve 24 can be designed with a split structure. Specifically, the step portion (molded component of the guide surface 24a) located in the guide sleeve 24 is formed independently of the main body of the guide sleeve 24, and the step portion is made of a material with average wear resistance, while the guide shaft 22 is made of a material with strong wear resistance, so as to selectively wear the step portion of the guide sleeve 24 to avoid excessive wear and frequent replacement of the positioning block 22c of the guide shaft 22, so as to improve the convenience of use of the wafer clamping mechanism 100. For example, the step portion of the guide sleeve 24 is made of polytetrafluoroethylene, and the guide shaft 22 is made of polyphenylene sulfide. The step portion can be assembled to the main body of the guide sleeve 24 based on the principle of thermal expansion and contraction, so as to avoid the use of glue in traditional assembly and prevent the influence of new pollution sources on wafer post-processing.

[0100] Combine the following Figure 2 , Figure 4 and Fig. 9 Briefly describe the process of switching the working state of the claw assembly 20:

[0101] Initially, the first positioning block 22c-1 of the guide shaft 22 is located in the first spacing groove 24c-1 of the guide sleeve 24, the second positioning block 22c-2 is located in the second spacing groove 24c-2, and the claw 23 on the guide shaft 22 is in a low position. At this time, the claw assembly 20 is in a closed state;

[0102] The lifting member 30 abuts against the lower end of the push rod 21, and the push rod 21 moves vertically, and the spring 26 sleeved on the guide shaft 22 is in a compressed state; when the lower end of the first positioning block 22c-1 moves to the top of the first spacing groove 24c-1, the first positioning block 22c-1 is disengaged from the first spacing groove 24c-1, and the spring 26 rebounds, so that the first positioning block 22c-1 slides on the concave-convex surface 21c at the top of the push rod 21, and at the same time, the positioning block 22c of the guide shaft 22 slides along the guide surface 24a of the guide sleeve 24, thereby driving the guide shaft 22 to rotate along its axis;

[0103] When the first positioning block 22c-1 of the guide shaft 22 slides along the guide surface 24a of the guide sleeve 24 to the end of a guide surface 24a, the first positioning block 22c-1 moves to the second spacing groove 24c-2. At this time, the guide shaft 22 and the claw 23 thereon rotate 180°, the claw 23 is in a high position, and the claw assembly 20 is in an open state; at this time, the semi-cylindrical portion 23b-1 of the claw 23 is set toward the inner side of the turntable 10.

[0104] Since the radial width of the second spacing groove 24c-2 is smaller than the radial width of the first spacing groove 24c-1, the first positioning block 22c-1 of the guide shaft 22 stops at this position, thereby maintaining the position state of the guide shaft 22, so that the claw assembly 20 is in an open state.

[0105] Next, after the wafer to be processed is placed on the claw assembly 20 of the wafer clamping mechanism 100, the lifting member 30 abuts against the lower end of the ejector rod 21 again, the ejector rod 21 moves vertically, and the spring 26 sleeved on the guide shaft 22 continues to be compressed;

[0106] The rebound spring 26 causes the first positioning block 22c-1 to slide on the concave-convex surface 21c at the top of the push rod 21. At the same time, the positioning block 22c of the guide shaft 22 slides along the other guide surface 24a of the guide sleeve 24, thereby driving the guide shaft 22 to rotate along its axis.

[0107] When the first positioning block 22c-1 of the guide shaft 22 slides along the guide surface 24a of the guide sleeve 24 to the end of the other guide surface 24a, the first positioning block 22c-1 moves to the first spacing groove 24c-1; at this time, the guide shaft 22 and the claw 23 thereon rotate 180°, and the push rod 21 slides down along the spacing groove 24c to the initial position, the claw 23 is in a low position, and the claw assembly 20 is in a closed state; at this time, the semi-conical portion 23b-2 of the claw 23 is set toward the inner side of the turntable 10.

[0108] In the present invention, the claw 23 is connected to the upper part of the guide shaft 22 through a wedge pin structure, such as Fig.10Specifically, a wedge block is provided at the lower end of the clamping claw 23, and a wedge groove is provided at the upper end of the guide shaft 22, and the wedge block is matched with the wedge groove; the wedge block of the clamping claw 23 is clamped in the wedge groove of the guide shaft 22, and the two are connected as a whole through a pin shaft.

[0109] The clamping claw 23 and the guide shaft 22 adopt a split structure, and the clamping claw 23 is connected to the guide shaft 22 by a wedge pin structure, so as to facilitate the regular replacement of the worn clamping claw 23 and avoid the clamping claw 23 and the guide shaft 22 being integrally formed and scrapped as a whole.

[0110] Fig.11 In the figure, the clamping claw 23 is a rod-shaped structure, and a cone 23a which is narrow at the top and wide at the bottom is arranged on the upper part thereof to pre-position the wafer to be clamped.

[0111] Furthermore, the clamping claw 23 also includes a clamping head 23b, which is located above the cone 23a, and the two are integrally formed; the clamping head 23b includes a semi-cylindrical portion 23b-1, a semi-conical portion 23b-2 and an arc-shaped top 23b-3, wherein the semi-cylindrical portion 23b-1 is horizontally connected with the semi-conical portion 23b-2, and the arc-shaped top 23b-3 is located above the semi-cylindrical portion 23b-1 and the semi-conical portion 23b-2, and the three are integrally formed. That is, the outer contour of the clamping head 23b is a smooth surface, so that the waste liquid can slide off the surface of the clamping claw 23 to avoid the adhesion of particulate matter. That is, the waste liquid formed by the post-processing of the wafer can fly away toward the outside along the smooth surface of the clamping head 23b under the action of centrifugal force, so as to avoid the waste liquid from cleaning the surface of the clamping head 23b and contaminating the surface of the wafer.

[0112] When the jaw assembly 20 is in a closed state, the outer contour of the semi-conical portion 23b-2 of the jaw 23 abuts against the edge of the wafer to clamp the wafer, that is, the semi-conical portion 23b-2 of the jaw 23 is arranged toward the inner side of the turntable 10; when the jaw assembly 20 is in an open state, the semi-conical portion 23b-2 of the jaw 23 is arranged away from the inner side of the turntable 10. Therefore, in the present invention, the guide shaft 22 and the jaw 23 thereon rotate 180° along the axis to switch the working state of the jaw assembly 20.

[0113] In order to achieve smooth interaction between the wafer and the wafer clamping mechanism 100 and ensure the pre-positioning of the wafer, in the present invention, a pin 28 is vertically arranged above the base 25. Figure 2 As shown, the ejector pin 28 is close to the inner side of the turntable 10, and the top surface of the ejector pin 28 is in contact with the inner side of the turntable 10. Fig.11 The outer side surfaces of the shown frustum 23a correspond.

[0114] That is, when the claw assembly 20 is in the open state, the external manipulator pre-places the wafer on the claw assembly 20, and the ejector pin 28 and the cone 23a of the claw 23 work together to horizontally support the wafer; when the claw 23 of the claw assembly 22 is closed to clamp the wafer, the guide shaft 22 drives the claw 23 to move downward a certain distance, so that the semi-cone portion 23b-2 of the claw 23 abuts against the edge of the wafer. At this time, there is a certain distance between the wafer and the top of the ejector pin 28 to avoid friction between the ejector pin 28 and the wafer surface during the wafer post-processing process and affect the wafer post-processing effect.

[0115] In the present invention, when the claw assembly 20 is opened and closed, the vertical positions of the guide shaft 22 and the claw 23 thereon are different to adapt to different wafer post-processing processes; the height of the claw 23 corresponding to the open state of the claw assembly 20 is greater than the height of the claw 23 corresponding to the closed state to achieve high-position wafer taking and low-position clamping, which is conducive to better arrangement of wafer post-processing processes.

[0116] It should be noted that when the claw assembly 20 switches working state, the guide shaft 22 needs to rotate and move up and down relative to the vertical hole of the base 25, that is, there is a clearance fit between the guide shaft 22 and the vertical hole. The size of the clearance is 0.1-0.3mm, so that the waste liquid forms a liquid film in the clearance, and the surface tension of the liquid film can prevent the liquid from flowing down along the clearance, thereby preventing the waste liquid from contaminating the internal structure of the claw assembly 20.

[0117] In addition, the present invention also provides a wafer post-processing device 1000, a schematic diagram of which is shown in FIG. Fig.12 As shown, the wafer post-processing device 1000 includes:

[0118] Box 200;

[0119] Figure 1 The wafer clamping mechanism 100 shown is disposed inside the box 200, and a driving mechanism is disposed below the wafer clamping mechanism 100 to drive the clamped wafer W to rotate around an axis;

[0120] The post-processing module 300 is disposed above the wafer clamping mechanism 100 to perform a post-processing process on the rotating wafer W.

[0121] Due to the configuration of the wafer clamping mechanism 100 , when the claw assembly 20 is in the open state, the lifting member 30 does not need to act on the turntable 10 all the time, so as to avoid excessive deformation of the turntable 10 and affect the stability of wafer clamping.

[0122] It should be noted that the wafer post-processing device 1000 also includes a protective cover, which is arranged on the outer peripheral side of the wafer clamping mechanism 100 to prevent the waste liquid thrown out by centrifugation from splashing on the inner wall of the box body 200. At the same time, a fan filter unit (FFU) is arranged above the box body 200 to supply clean gas from top to bottom toward the inside of the box body 200.

[0123] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A wafer clamping mechanism, characterized in that: include: Turntable; A claw assembly is arranged along the circumference of the turntable to clamp the wafer to be processed; The lifting member is arranged below the turntable and is used for intermittently lifting the lifting rod of the claw assembly. The lifting rod can abut against the guide shaft of the claw assembly, so that the guide shaft and the claw thereon rotate along the axis to change the working state of the claw assembly.

2. The wafer clamping mechanism according to claim 1, characterized in that: The clamping claw assembly also includes a guide sleeve, which is sleeved on the outer peripheral side of the push rod; after the lifting member is separated from the push rod, the guide sleeve can maintain the position of the guide shaft and the clamping claw.

3. The wafer clamping mechanism according to claim 2, characterized in that: The clamping claw assembly also includes a base connected to the turntable; the base is provided with a vertical hole to place the guide shaft with a gap.

4. The wafer clamping mechanism according to claim 3, characterized in that: The guide sleeve is arranged below the base, and the push rod is slidably arranged on the guide sleeve and is located below the guide shaft.

5. The wafer clamping mechanism according to claim 2, characterized in that: A guide surface is arranged inside the guide sleeve, and the lifting push rod can make the guide shaft rotate along the guide surface to change the position and posture of the clamping claw.

6. The wafer clamping mechanism according to claim 5, characterized in that: The guide sleeve is provided with a vertical step hole, and the guide surface is formed on the step surface of the step hole.

7. The wafer clamping mechanism according to claim 5, characterized in that: The guide surface is a plane or a curved surface with a gradually changing height along the circumferential direction.

8. The wafer clamping mechanism according to claim 7, characterized in that: The number of the guide surfaces is at least two, and the guide surfaces are spaced apart in the circumferential direction.

9. The wafer clamping mechanism according to claim 8, characterized in that: A spacing groove is arranged between the guide surfaces, and the spacing groove is arranged to penetrate along the vertical direction.

10. The wafer clamping mechanism according to claim 9, characterized in that: The spacing grooves include a first spacing groove and a second spacing groove, which are respectively located at the ends of the guide surface; the radial width of the first spacing groove is greater than the radial width of the second spacing groove.

11. The wafer clamping mechanism according to claim 10, wherein: A shaft shoulder is arranged below the guide shaft, and a stepped shaft is arranged below the shaft shoulder; a positioning block is arranged on the outer peripheral side of the guide shaft, and the positioning block is extended from the shaft shoulder along the stepped shaft.

12. The wafer clamping mechanism according to claim 11, characterized in that: The positioning block matches the shape and size of the spacing groove, so that the positioning block can slide in the spacing groove.

13. The wafer clamping mechanism according to claim 11, wherein: The lower end surface of the positioning block is a plane or a curved surface, and the contour of the lower end surface matches the guide surface.

14. The wafer clamping mechanism according to claim 11, characterized in that: A slider is disposed on the outer peripheral side of the ejector rod, and the slider is arranged in the spacing groove.

15. The wafer clamping mechanism according to claim 14, wherein: A concave-convex surface is arranged above the ejector pin, and a high point of the concave-convex surface abuts against a positioning block of the guide shaft.

16. The wafer clamping mechanism according to claim 11, wherein: The clamping claw assembly also includes a spring, which is sleeved on the outer side of the guide shaft; one end of the spring abuts against the base, and the other end of the spring abuts against the shoulder of the guide shaft.

17. The wafer clamping mechanism according to claim 14, wherein: The guide surface is provided with a sliding groove, and the sliding groove is arranged to penetrate along the vertical direction.

18. The wafer clamping mechanism according to claim 17, wherein: The sliding block is arranged in the sliding groove, and the size and the setting position of the sliding block match the size and the setting position of the sliding groove.

19. The wafer clamping mechanism according to claim 2, wherein: The clamping claw assembly also includes an end cover which is detachably connected below the guide sleeve to limit the position of the ejector rod.

20. The wafer clamping mechanism according to claim 1, wherein: The clamping claw is connected to the upper part of the guide shaft through a wedge pin structure.

21. The wafer clamping mechanism according to claim 3, characterized in that: The clamping claw is a rod-shaped structure, and a frustum that is narrow at the top and wide at the bottom is arranged on the upper part thereof to pre-position the wafer to be clamped.

22. The wafer clamping mechanism according to claim 21, wherein: An ejector pin is vertically arranged above the base, the ejector pin is close to the inner side of the rotating disk, and the top surface of the ejector pin corresponds to the outer side surface of the frustum.

23. The wafer clamping mechanism according to claim 21, wherein: The clamping claw also includes a clamping head, which is located above the frustum; the clamping head includes a semi-cylindrical portion, a semi-frustum portion and an arc-shaped top, the semi-cylindrical portion is horizontally connected to the semi-frustum portion, and the arc-shaped top is located above the semi-cylindrical portion and the semi-frustum portion, and the three are formed in one piece.

24. The wafer clamping mechanism according to claim 1, wherein: The guide shaft and the clamping claw thereon rotate 180 degrees along the axis to switch the working state of the clamping claw assembly.

25. A wafer post-processing device, characterized in that: include: Box; The wafer clamping mechanism according to any one of claims 1 to 24 is arranged inside the box, and a driving mechanism is arranged below the box to drive the clamped wafer to rotate around the axis; The post-processing module is arranged above the wafer clamping mechanism to perform a post-processing process on the rotating wafer.

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