Multi-working-condition composite thermal control device of radar electronic system

Abstract

The invention belongs to the technical field of thermal control management, particularly relates to a multi-working-condition composite thermal control device of a radar electronic system, and aims to solve the problem that the time for dismounting and replacing auxiliary heat dissipation is long. The device comprises an A / D sampling array, a heat transfer assembly, an energy storage assembly and a heat exchange assembly. The heat transfer assembly is mounted on the A / D sampling array and comprises an upper cover, a lower cover, an upper liquid absorption core and a lower liquid absorption core; a gap is formed between the upper cover and the lower cover through supporting columns, the edges of the upper cover and the lower cover are connected, and a cavity is formed between the upper cover and the lower cover; the cavity is filled with a liquid working medium; the energy storage assembly comprises a sleeve for clamping the A / D sampling array, the sleeve is hollow, and the sleeve is filled with a phase change core body; the heat exchange assembly comprises a cavity flow channel, an inlet pipe and an outlet pipe. Repeated dismounting and mounting of the device can be avoided, the cost of general assembly debugging is reduced, lightweight design of the device is achieved, and the heat dissipation capacity and reliability of the system are improved.

Description

Technical Field

[0001] The present invention belongs to the technical field of thermal control management, and specifically relates to a multi-operating-condition composite thermal control device for a radar electronic system, which can be applied to the temperature control field of multi-operating-condition electronic equipment of a spacecraft. Background Art

[0002] With the increasing density of electronic equipment components in spacecraft and the need for diversified working modes, the working environment of aerospace electronic products is becoming more and more complex, which brings more new thermal control problems. Aerospace radar electronic systems have many working modes and high heat flux density. Different complex and redundant cooling systems need to be built during the single-machine test and system joint debugging stages to help the equipment dissipate heat. During the assembly test and flight test stages, the auxiliary cooling system needs to be removed to solve the short-term high heat flux problem through heat conduction of structural parts. This kind of radar electronic system production process and product characteristics cause problems such as redundant peripheral equipment of radar electronic systems, complex testing processes, and increased costs, which cannot meet the development trend of miniaturization, lightweight, low cost, and high reliability of spacecraft. Summary of the invention

[0003] In order to solve the above-mentioned problem in the prior art, namely, the problem of long time required for dismantling and replacing auxiliary heat dissipation, the present invention provides a multi-condition composite thermal control device for a radar electronic system, which realizes structural thermal control integration through temperature averaging plates, phase change energy storage materials, and fluid circuit integration technology, avoids repeated disassembly and assembly of the device, reduces the cost of assembly and commissioning, realizes a lightweight design of the device, and improves the heat dissipation capacity and reliability of the system.

[0004] The present application discloses a multi-condition composite thermal control device for a radar electronic system, which adopts the following technical solutions:

[0005] A multi-operating-condition composite thermal control device for a radar electronic system, comprising an A / D sampling array, a heat transfer component, an energy storage component, and a heat exchange component;

[0006] The heat transfer component is installed on the A / D sampling array, and the heat transfer component includes an upper cover, a lower cover, an upper liquid wick, and a lower liquid wick; a gap is formed between the upper cover and the lower cover through a support column, and the upper cover and the lower cover are connected at the edge to form a cavity between the upper cover and the lower cover; the cavity is filled with a liquid working medium; the liquid working medium is converted into a gaseous working medium by heat;

[0007] The energy storage component includes a sleeve that clamps the A / D sampling array, the interior of the sleeve is hollow, and the interior of the sleeve is filled with a phase change core; the phase change core absorbs heat, and the initial temperature of the phase change core absorbing heat is higher than the temperature when the liquid working medium is converted into a gaseous working medium;

[0008] The heat exchange component includes a cavity flow channel, an inlet pipe, and an outlet pipe; the cavity flow channel is opened on the sleeve, and the opening position is located on the inner wall of the sleeve facing the A / D sampling array, and the openings on both sides are respectively connected to the inlet pipe and the outlet pipe, and the inlet pipe and the outlet pipe are connected through the cavity flow channel; the inlet pipe and the outlet pipe are detachably connected to the sleeve; the cavity flow channel is filled with coolant.

[0009] By adopting the above technical scheme, the thermal control device realizes structural thermal control integration through the temperature equalizing plate of the heat transfer component, the phase change energy storage material of the energy storage component, and the fluid circuit integration technology of the heat exchange component. Through the combination of the heat transfer component, the energy storage component, and the heat exchange component, it realizes the three-in-one function in three working conditions: single-machine testing, system coordination, and in-orbit flight.

[0010] During the single-machine test phase, the operating conditions are long startup time, multiple test scenarios, and high heat density. Under this condition, a combination of a heat transfer component and a heat exchange component is selected. The heat is conducted to the cavity flow channel through the heat transfer component, and then the coolant in the heat exchange component takes the heat away. The temperature is controlled below the phase change point of the phase change core in the energy storage component, so that the phase change core does not participate in the work.

[0011] During the system joint debugging stage, the operating conditions are heat flow coupling between equipment, short startup time, high frequency, rising heat flux density index, weak driving ability of small flow fluid, large resistance of coolant in cavity flow channel, low heat exchange efficiency, and the combination of heat transfer components and heat exchange groups can no longer meet the needs. It is chosen to combine heat transfer components, heat exchange components, and energy storage components. First, use energy storage materials to store a large amount of heat, and then use fluid circuits to dissipate the heat and enter the next thermal cycle. At this time, the system temperature is controlled above the phase change point of the energy storage component.

[0012] During the on-orbit flight phase, the operating conditions are near-vacuum environment, short-term high heat flow, and one-time use. In addition, the quality characteristics are relatively sensitive during the on-orbit flight phase, and the heat exchange component must be removed. Under this condition, the heat transfer component and the energy storage component are combined, and the heat generated by the device is transferred to the energy storage component through the heat transfer component. After the temperature reaches the phase change point, a large amount of heat is stored. Due to the short flight time, the phase change core has not released heat yet, and the flight mission has ended, thereby achieving thermal control in orbit.

[0013] Optionally, the A / D sampling array is composed of a plurality of A / D sampling components stacked and arranged, and the heat transfer component is installed between adjacent A / D sampling components.

[0014] Optionally, the heat transfer component further includes a liquid filling pipe, and the liquid filling pipe is connected to the cavity formed between the upper cover and the lower cover.

[0015] Optionally, the sleeve includes a first sub-cylinder and a second sub-cylinder, and the first sub-cylinder and the second sub-cylinder are connected together by docking.

[0016] Optionally, a groove is opened on the outer wall of the sleeve, and a sleeve cover plate is buckled on the groove. The sleeve cover plate and the sleeve are fixedly connected by laser brazing. After the sleeve cover plate and the sleeve are connected together, the groove forms a hollow inside the sleeve.

[0017] Optionally, a filling hole is formed through the sleeve, and the filling hole is connected to the interior of the sleeve.

[0018] Optionally, the phase change core is formed by mixing nano-skeleton material, phase change molecules and thermal conductive powder;

[0019] The nano-skeleton material is expanded graphite, the phase change molecules are inorganic salts, paraffin wax, and polyols, and the thermal conductive powder is aluminum powder.

[0020] Optionally, the cavity flow channel is arranged on the sleeve in an S-shaped bend.

[0021] Optionally, the cavity flow channel is opened on the inner wall of the sleeve facing the A / D sampling array, and a flow channel cover is installed on the inner wall of the sleeve. The flow channel cover is sealed and welded to the inner wall of the sleeve by laser welding to cover the cavity flow channel.

[0022] Optionally, the liquid working fluid is pure water.

[0023] Beneficial effects of the present invention: The present invention realizes structural thermal control integration through temperature averaging plates, phase change energy storage materials, and fluid circuit integration technology. Compared with traditional thermal control equipment, it does not need to build different complex and redundant heat dissipation systems to help the equipment dissipate heat, and can avoid repeated disassembly and assembly of the device. Through the optimization design of the three links of heat transfer, heat storage, and heat exchange, the thermal resistance between modules is reduced, local hot spots are eliminated, and the heat transfer efficiency is improved. At the same time, according to different working conditions, the components are combined and matched to achieve three uses in one. Therefore, the use of the present invention has the advantages of low cost, high heat transfer efficiency, light weight, and high degree of freedom. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Other features, objects and advantages of the present application will become more apparent by reading the detailed description of non-limiting embodiments made with reference to the following drawings:

[0025] Figure 1 It is a schematic diagram of an explosion of a multi-condition composite thermal control device of a radar electronic system in this embodiment;

[0026] Figure 2 Schematic diagram of the explosion of the heat transfer component, energy storage component and heat exchange component in this embodiment;

[0027] Figure 3 Schematic diagram of the structure of the A / D sampling component in this embodiment;

[0028] Figure 4 is a schematic structural diagram of the heat transfer component in this embodiment;

[0029] Figure 5 is a working principle diagram of the heat transfer component in this embodiment;

[0030] Figure 6 Schematic diagram of the structure of the energy storage component in this embodiment;

[0031] Figure 7 Schematic diagram of the structure of the heat exchange component in this embodiment.

[0032] Explanation of the reference numerals: 1. A / D sampling array; 13. Frame upper cover; 14. Frame; 15. Circuit board; 16. Frame lower cover; 2. Heat transfer component; 17. Upper cover; 18. Lower cover; 19. Upper liquid wick; 20. Lower liquid wick; 21. Liquid filling tube; 3. Energy storage component; 31. Sleeve; 311. First sub-cylinder; 312. Second sub-cylinder; 32. Groove; 33. Sleeve cover; 34. Filling hole; 35. Phase change core; 4. Heat exchange component; 41. Cavity flow channel; 42. Inlet pipe; 43. Outlet pipe; 44. Flow channel cover. DETAILED DESCRIPTION

[0033] The present application will be further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant invention, rather than to limit the invention. It is also necessary to explain that, for ease of description, only the parts related to the relevant invention are shown in the accompanying drawings.

[0034] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0035] The present invention provides a multi-mode composite thermal control device for a radar electronic system, referring to Figure 1 , Figure 2 The multi-condition composite thermal control device of the radar electronic system includes an A / D sampling array 1, a heat transfer component 2, an energy storage component 3, and a heat exchange component 4. The thermal control device realizes the three functions of single-machine testing, system joint debugging, and on-orbit flight through the combination of the heat transfer component 2, the energy storage component 3, and the heat exchange component 4.

[0036] In the single-machine test phase, the operating conditions are long startup time, multiple test scenarios, and high heat density. Under this condition, the heat transfer component 2 and the heat exchange component 4 are selected to be combined. The heat is transferred to the heat exchange component 4 through the heat transfer component 2. The coolant in the heat exchange component 4 takes away the heat, and the temperature is controlled below the phase change point of the energy storage component 3. The phase change material does not participate in the work; in the system joint debugging phase, the operating conditions are heat flow coupling between devices, short startup time, high frequency, rising heat flux density index, weak driving ability of small flow fluid circuit, large resistance of coolant in the pipeline, low heat exchange efficiency, and the combination of heat transfer component 2 and heat exchange group can no longer meet the needs. It is selected to combine heat transfer component 2, heat exchange component 4, and energy storage component 3. First, a large amount of heat is stored in the energy storage material, and then the fluid circuit is used to dissipate the heat to enter the next thermal cycle. At this time, the system temperature is controlled above the phase change point of the energy storage component 3; in the on-orbit flight stage, the operating conditions are near-vacuum environment, short-term large heat flow, and one-time use. In addition, the quality characteristics of the on-orbit flight stage are relatively sensitive, and the fluid circuit heat dissipation component must be removed. Under this condition, the heat transfer component 2 and the energy storage component 3 are combined, and the heat generated by the device is transferred to the energy storage component 3 through the heat transfer component 2. After the temperature reaches the phase change point, a large amount of heat is stored. Due to the short flight time, the phase change material has not released heat, and the flight mission has ended, thereby achieving heat control in orbit.

[0037] The A / D sampling array 1 is composed of a plurality of A / D sampling elements stacked and arranged. Figure 3 The A / D sampling piece includes a frame upper cover plate 13, a frame 14, a circuit board 15, and a frame lower cover plate 16, wherein the circuit board 15 is fixed in the frame 14 by fasteners, and the frame upper cover plate 13 and the frame lower cover plate 16 are in contact with the heat source surface of the circuit board 15 through a designed boss. In this embodiment, 10 A / D sampling pieces are provided.

[0038] Adjacent A / D sampling components are fitted, embraced and fixed by positioning blocks to form a digital processing module.

[0039] Reference Figure 4 , Figure 5 The heat transfer component 2 is integrated on the frame upper cover plate 13 and the frame lower cover plate 16 of the A / D sampling array 1. The heat transfer component 2 includes an upper cover 17, a lower cover 18, an upper liquid wick 19, a lower liquid wick 20, and a liquid filling tube 21.

[0040] A gap is opened between the upper cover 17 and the lower cover 18 by a support column, and the upper cover 17 and the lower cover 18 are connected at the edge, so that a cavity is formed between the upper cover 17 and the lower cover 18. The cavity is filled with liquid working medium. The filling pipe 21 is connected to the cavity and is used to fill the liquid working medium into the cavity. The upper cover 17 and the upper liquid wick 19 of the heat transfer component 2 are brazed and sintered, and the lower cover 18 and the lower liquid wick 20 are brazed and sintered. Then the upper cover 17, the lower cover 18, the support column, and the filling pipe 21 are brazed and sintered, and finally the working medium is filled, vacuumed, and sealed. The heat transfer component 2 is arranged between adjacent A / D sampling components. The working medium in the heat transfer component 2 is pure water.

[0041] The upper cover 17 of the heat transfer component 2 is the condensation surface, the lower cover 18 is the evaporation surface, the upper wick 19 is a sintered copper mesh, and the lower wick 20 is a sintered copper powder. After the copper powder is sintered, a microscopic structure of microneedle ribs appears; the upper wick 19 and the lower wick 20 form a composite wick structure, which can increase capillary force and reduce flow resistance.

[0042] The heat transfer component 2 is in contact with the heat source surface of the A / D sampling array 1 through the designed boss. The heat of the A / D sampling array 1 is transferred to the evaporation end of the heat transfer component 2. The liquid working medium inside the heat transfer component 2 absorbs the heat and becomes a gaseous working medium. The gaseous working medium diffuses from the high-pressure area to the low-pressure area. When it hits the inner wall with low temperature, it condenses into liquid and releases heat. Finally, the liquid working medium flows back to the evaporation end under the action of gravity and capillary force, thereby realizing the rapid transfer of heat from the A / D sampling array 1.

[0043] Reference Figure 2 , Figure 6 The energy storage assembly 3 includes a sleeve 31 that clamps the A / D sampling array 1. The shape of the inner wall of the sleeve 31 matches the edge shape of the A / D sampling array 1, so that the sleeve 31 can be sleeved on the A / D sampling array 1 and connected to the A / D sampling array 1. The sleeve 31 includes a first sub-tube 311 and a second sub-tube 312. The first sub-tube 311 and the second sub-tube 312 are connected together by docking, so that the sleeve 31 can be separated, which is convenient for installing the sleeve 31 on the A / D sampling array 1.

[0044] A groove 32 is provided on the outer wall of the sleeve 31, and a sleeve 31 cover plate is buckled on the groove 32. The sleeve 31 cover plate is fixedly connected to the sleeve 31 by laser brazing. After the sleeve 31 cover plate is connected to the sleeve 31, the groove 32 is hollow inside the sleeve 31. A filling hole 34 is provided through the sleeve 31, and the filling hole 34 is connected to the groove 32. The groove 32 is filled with a phase change core 35, which is formed by mixing nano-skeleton materials, phase change molecules, and thermal conductive powder. The phase change core 35 is filled through the filling hole 34, and the filling hole 34 is treated without a trace by stir friction welding. The phase change core 35 is composed of nano-skeleton material, phase change molecules, and thermal conductive powder, with a composition ratio of 10% to 30%, 50% to 80%, and 10% to 30%. The ratio is adjusted according to different mechanical strengths, thermal conductivity, and heat storage values. In this embodiment, it is 15%, 70%, and 15%.

[0045] The nano-skeleton material is expanded graphite, and there is a microporous structure on the surface, which can constrain the molten phase change material in the microporous structure, ensuring that the volume changes repeatedly during the phase change process without obvious structural damage and liquid leakage, so as to maintain the solid shape in the macroscopic sense; the phase change molecules are inorganic salts, paraffin, polyols, etc., which are prepared according to a certain proportion, and the thermal conductive powder is aluminum powder. The last three are filled through the filling hole 34, and vacuumized to form a phase change core 35, which has the characteristics of high enthalpy value, high thermal conductivity, low expansion, and no leakage. The phase change molecules are inorganic salts, paraffin, polyols, etc., which are prepared according to a certain proportion, and the proportions are 20% to 50%, 30% to 50%, and 20% to 50%. According to different expansion rates, the heat storage value is adjusted, which is 30%, 30%, and 40% in this embodiment.

[0046] Reference Figure 2 , Figure 7 The heat exchange component 4 includes a cavity flow channel 41, an inlet pipe 42, and an outlet pipe 43. The cavity flow channel 41 is opened on the sleeve 31, and the opening position is located on the inner wall of the sleeve 31 facing the A / D sampling array 1. The openings on both sides are respectively connected to the inlet pipe 42 and the outlet pipe 43, and the inlet pipe 42 and the outlet pipe 43 are connected through the cavity flow channel 41. Moreover, the inlet pipe 42 and the outlet pipe 43 are detachably connected to the sleeve 31. The cavity flow channel 41 is arranged in an S-shaped bend on the sleeve 31. The driving pump drives the coolant from the coolant tank through the inlet pipe 42 to the cavity flow channel 41, and collects it into the cooling box through the outlet pipe 43, forming a fluid circulation, taking away the heat generated by the A / D sampling array 1, completing the heat collection in the cooling box, and finally performing convection heat exchange through the fan to dissipate the heat into the surrounding environment.

[0047] In this embodiment, the cavity flow channel 41 is opened on the inner wall of the sleeve 31 facing the A / D sampling array 1, and a flow channel cover plate 44 is installed on the inner wall of the sleeve 31. The flow channel cover plate 44 is sealed and welded to the inner wall of the sleeve 31 by laser welding, and covers the cavity flow channel 41 to form an internal flow channel of the sleeve 31, ensuring that the coolant flows in the cavity flow channel 41. The inlet pipe 42 and the outlet pipe 43 are connected to both sides of the sleeve 31.

[0048] The principle of the multi-condition composite thermal control device of the radar electronic system disclosed in the present application is: the thermal control device realizes structural thermal control integration through the temperature equalizing plate of the heat transfer component 2, the phase change energy storage material of the energy storage component 3, and the fluid circuit integration technology of the heat exchange component 4, and realizes the three-in-one use in three working conditions of single-machine testing, system joint debugging and on-orbit flight through the combination of the heat transfer component 2, the energy storage component 3, and the heat exchange component 4.

[0049] During the single-machine test phase, the operating conditions are long startup time, multiple test scenarios, and high heat density. Under this condition, the heat transfer component 2 and the heat exchange component 4 are selected to be combined. The heat is conducted to the cavity flow channel 41 through the heat transfer component 2, and then the heat is taken away by the coolant in the heat exchange component 4. The temperature is controlled below the phase change point of the phase change core 35 in the energy storage component 3, so that the phase change core 35 does not participate in the work.

[0050] During the system joint debugging stage, the operating conditions are heat flow coupling between devices, short startup time, high frequency, rising heat flux density index, weak driving ability of small flow fluid, large resistance of coolant in cavity flow channel 41, low heat exchange efficiency, and the combination of heat transfer component 2 and heat exchange group can no longer meet the needs. It is selected to combine heat transfer component 2, heat exchange component 4, and energy storage component 3. First, a large amount of heat is stored using energy storage materials, and then the heat is dissipated using the fluid circuit to enter the next thermal cycle. At this time, the system temperature is controlled above the phase change point of energy storage component 3.

[0051] During the on-orbit flight phase, the operating conditions are near-vacuum environment, short-term large heat flow, and one-time use. In addition, the quality characteristics are relatively sensitive during the on-orbit flight phase, and the heat exchange component 4 must be removed. Under this condition, the heat transfer component 2 and the energy storage component 3 are selected to be combined. The heat generated by the device is transferred to the energy storage component 3 through the heat transfer component 2. After the temperature reaches the phase change point, a large amount of heat is stored. Due to the short flight time, the phase change core 35 has not released heat yet, and the flight mission has ended, thereby achieving heat control in orbit.

[0052] The advantages of the present invention compared with the prior art are: the present invention realizes structural thermal control integration through temperature averaging plates, phase change energy storage materials, and fluid circuit integration technology. Compared with traditional thermal control equipment, it does not need to build different complex and redundant heat dissipation systems to help the equipment dissipate heat, and can avoid repeated disassembly and assembly of the device. Through the optimization design of the heat transfer component 2, the energy storage component 3, and the heat exchange component 43, the thermal resistance between modules is reduced, the local hot spots are eliminated, and the heat transfer efficiency is improved. At the same time, according to different working conditions, the components are combined and matched to achieve three uses in one. Therefore, the use of the present invention has the advantages of low cost, high heat transfer efficiency, light weight, and high degree of freedom.

[0053] The term "comprise" or any other similar term is intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus / device that includes a list of elements includes not only those elements but also other elements not expressly listed, or also includes elements inherent to such process, method, article, or apparatus / device.

[0054] So far, the technical solutions of the present invention have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present invention is obviously not limited to these specific embodiments. Without departing from the principle of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present invention.

Claims

1. A multi-condition composite thermal control device for a radar electronic system, characterized in that: It comprises an A / D sampling array (1), a heat transfer component (2), an energy storage component (3) and a heat exchange component (4); The heat transfer component (2) is mounted on the A / D sampling array (1), and comprises an upper cover (17), a lower cover (18), an upper liquid absorption core (19), and a lower liquid absorption core (20); a gap is formed between the upper cover (17) and the lower cover (18) through a support column, and the upper cover (17) and the lower cover (18) are connected at their edges to form a cavity between the upper cover (17) and the lower cover (18); the cavity is filled with a liquid working medium; the liquid working medium is converted into a gaseous working medium by heat; The energy storage component (3) comprises a sleeve (31) for clamping the A / D sampling array (1); the interior of the sleeve (31) is hollow, and the interior of the sleeve (31) is filled with a phase change core (35); the phase change core (35) absorbs heat, and the initial temperature of the phase change core (35) absorbing heat is higher than the temperature when the liquid working medium is converted into a gaseous working medium; The heat exchange component (4) comprises a cavity flow channel (41), an inlet pipe (42), and an outlet pipe (43); the cavity flow channel (41) is opened on the sleeve (31), and the opening position is located on the inner wall of the sleeve (31) facing the A / D sampling array (1), and the openings on both sides are respectively connected to the inlet pipe (42) and the outlet pipe (43), and the inlet pipe (42) and the outlet pipe (43) are connected through the cavity flow channel (41); the inlet pipe (42) and the outlet pipe (43) are detachably connected to the sleeve (31); and the cavity flow channel (41) is filled with cooling liquid.

2. The multi-mode composite thermal control device for radar electronic systems according to claim 1, characterized in that: The A / D sampling array (1) is composed of a plurality of A / D sampling components which are stacked and arranged, and the heat transfer component (2) is installed between adjacent A / D sampling components.

3. The multi-mode composite thermal control device of the radar electronic system according to claim 1, characterized in that: The heat transfer component (2) further comprises a liquid filling pipe (21), wherein the liquid filling pipe (21) is connected to a cavity formed between the upper cover (17) and the lower cover (18).

4. The multi-mode composite thermal control device for radar electronic systems according to claim 1, characterized in that: The sleeve (31) comprises a first sub-cylinder (311) and a second sub-cylinder (312), and the first sub-cylinder (311) and the second sub-cylinder (312) are connected together by docking.

5. The multi-mode composite thermal control device for radar electronic systems according to claim 1, characterized in that: The outer wall of the sleeve (31) is provided with a groove (32), and a sleeve (31) cover plate is buckled on the groove (32). The sleeve (31) cover plate and the sleeve (31) are fixedly connected by laser brazing. After the sleeve (31) cover plate and the sleeve (31) are connected together, the groove (32) forms a hollow inside the sleeve (31).

6. The multi-mode composite thermal control device for radar electronic systems according to claim 1, characterized in that: The sleeve (31) is provided with a filling hole (34) which is communicated with the interior of the sleeve (31).

7. The multi-mode composite thermal control device for radar electronic systems according to claim 1, characterized in that: The phase change core (35) is formed by mixing and preparing nano skeleton materials, phase change molecules and thermal conductive powder; The nano-skeleton material is expanded graphite, the phase change molecules are inorganic salts, paraffin wax, and polyols, and the thermal conductive powder is aluminum powder.

8. The multi-mode composite thermal control device for radar electronic systems according to claim 1, characterized in that: The cavity flow channel (41) is arranged on the sleeve (31) in an S-shaped bend.

9. The multi-mode composite thermal control device for radar electronic systems according to claim 1, characterized in that: The cavity flow channel (41) is opened on the inner wall of the sleeve (31) facing the A / D sampling array (1), and a flow channel cover plate (44) is installed on the inner wall of the sleeve (31). The flow channel cover plate (44) is sealed and welded to the inner wall of the sleeve (31) by laser welding, and covers the cavity flow channel (41).

10. The multi-mode composite thermal control device for radar electronic systems according to claim 1, characterized in that: The liquid working medium is pure water.

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