Method and apparatus for post-processing of packaged integrated circuits

Abstract

The present invention relates to an apparatus for post-processing a packaged integrated circuit, comprising: a transmission line extending from an input position to an output position along at least one post-processing apparatus for post-processing the packaged integrated circuit; at least one first carrier independently movable across the transmission line, equipped for moving the packaged integrated circuit across the transmission line between a first receiving position on the transmission line and a first release position on the transmission line; at least one second carrier independently movable across the transmission line, equipped for moving the packaged integrated circuit across the transmission line between a second receiving position on the transmission line and a second release position on the transmission line, where the first release position and the second receiving position at least substantially coincide; at least one completion device at the level of the first release position and selected from the group consisting of: a stamping or trimming device for shortening the integrated circuit terminal pins, a bending device for bending the integrated circuit terminal pins, or a stamping device for removing the integrated circuit lead frame; and at least one transfer device for removing the packaged integrated circuit from the first carrier at a first release position, passing the packaged circuit through the first post-processing device, and distributing the packaged integrated circuit to the second carrier at a second receiving position.

Description

Technical Field

[0001] The present invention relates to a method and apparatus for post-processing of packaged integrated circuits (ICs). Integrated circuits in this context mean electronic circuits that generally include silicon chips. Such chips are manufactured on so-called wafers, where they are cut out and the external electrical contacts located thereon are connected to terminal pins, which are currently kept together because they are collectively interconnected in a frame. After the electrical connections between the external electrical contacts and the terminal pins are made, a housing is fitted around the chip and the electrical connections to protect them. Next, the integrated circuits need to be post-processed. For example, such post-processing involves removing the interconnections between the pins, bending the pins (in most cases) and removing the integrated circuits from their surrounding frame for the purpose of the manufacturing process. This frame is called a lead frame, and this frame generally includes several integrated circuits, generally even a (quasi) unlimited number of integrated circuits, so that the integrated circuits can be routed along further post-processing steps according to the interconnections determined by the frame. Thus, all integrated circuits generally follow the same path along the various post-processing steps in the same order and at the same processing speed or rhythm. The processing rhythm here refers to a step-by-step throughput, in which all integrated circuits move one position further when one of the circuits has completed a certain post-processing step. An example of such a system is given by US patent publication US5494149A, where all integrated circuits follow the same path along the various post-processing steps in the same order and at the same processing speed or rhythm. As a result, it does not have at least one transfer device for removing the packaged integrated circuits from the first carrier at a first transfer position, feeding the packaged circuits through the first post-processing device, feeding the packaged integrated circuits at a second receiving position and transferring them to the second carrier. The same is true for Korean patent publication KR20030063837A1. Background Art

[0002] This has the disadvantage, among other things, that the throughput is determined by the post-processing step of the longest duration and that there is no flexibility to vary the post-processing steps to which the individual integrated circuits are subjected and the movements they carry out during the process, since they are restricted relative to one another by the fact that the integrated circuits are mechanically coupled to one another. Moreover, the number of movements and therefore post-processing operations that the integrated circuits can undergo is limited by the fixed mutual orientation imposed by the interlocking of the multiple integrated circuits. When the integrated circuits include power electronics, i.e. electronic devices intended to conduct large currents (several amperes or more) or to handle large voltages (tens of volts), the circuits, their housings and their connections are correspondingly larger and, in addition to the disadvantages of the prior art already mentioned, their post-processing also becomes a more complex matter, which cannot be carried out with existing devices and working methods or cannot be carried out without other disadvantages. Such integrated circuits may also be referred to hereinafter as "components".

[0003] Larger circuits not only have larger housings, but also thicker and longer connecting pins, which can also result in additional height increases if they have to be bent.

[0004] Thus, another disadvantage of existing methods and apparatus for post-processing of packaged integrated circuits is that, where the integrated circuits to be post-processed are mostly in a continuous post-processing apparatus, the ability to perform monitoring and inspection is hampered by the overall structure. Summary of the invention

[0005] It is therefore an object of the present invention to provide an apparatus and method for post-processing of packaged integrated circuits, in particular packaged integrated circuits of power electronic devices, such as those used in electric vehicles.

[0006] To this end, the present invention proposes an apparatus for post-processing a packaged integrated circuit, comprising: a transmission line extending from an input position to an output position along at least one post-processing apparatus for post-processing a packaged integrated circuit; at least one first carrier, which can be moved across the transmission line independently of a second carrier, the first carrier being arranged to move the packaged integrated circuit across the transmission line between a first receiving position on the transmission line and a first releasing position on the transmission line; at least one second carrier, which can be moved across the transmission line independently of the first carrier, the second carrier being arranged to move the packaged integrated circuit across the transmission line between a second receiving position on the transmission line and a second releasing position on the transmission line. movement, wherein preferably, the first release position and the second receiving position at least substantially coincide; wherein the first release position and the second receiving position at least substantially coincide; at least one finishing device, which is at the level of the first release position and is selected from the group comprising: a punching or trimming device for shortening the connection pins of the integrated circuit, a bending device for bending the connection pins of the integrated circuit, or a punching device for removing the lead frame of the integrated circuit; and at least one transfer device, which is used to remove the packaged integrated circuit from the first carrier at the first release position, pass the packaged circuit through the first post-processing device, and release the packaged integrated circuit to the second carrier at the second receiving position.

[0007] In the case of devices according to the prior art where packaged integrated circuits are carried on a carrier for continuous or incremental transport past or through a finishing device (whether or not on a lead frame together), the device according to the invention provides the possibility of moving the first carrier and the second carrier at different speeds and torques by shuttling the first carrier and the second carrier (i.e. reciprocating motion), wherein the integrated circuits are removed from the first carrier by the transfer device for the purpose of a post-processing step and are placed on the second carrier after undergoing the post-processing step. The first carrier and the second carrier are independent of each other so that they can each operate at an optimal speed, for example, one of the carriers can move continuously and the other carrier can move incrementally. As a result, there are fewer delays in the process. In addition, this construction makes the length and / or number of post-processing steps in the facility unlimited and allows the carriers to return to their respective receiving positions. Moreover, the device according to the invention enables certain packaged integrated circuits to skip certain post-processing steps (if those packaged integrated circuits do not require those post-processing steps), thereby increasing the average throughput speed.

[0008] In a preferred embodiment, the first carrier and the second carrier are arranged for moving one packaged integrated circuit at a time. To this end, the first carrier and the second carrier are sized to match the size of the integrated circuit to be moved. The device according to the invention is (thereby) also arranged for piece-by-piece feeding and post-processing of packaged integrated circuits.

[0009] Preferably, the first carrier shuttles or commutes between a first receiving position on the transmission line and a first release position on the transmission line, or is configured to shuttle or commutes between a first receiving position on the transmission line and a first release position on the transmission line, and further preferably, the second carrier shuttles or commutes between a second receiving position on the transmission line and a second release position on the transmission line, or is configured to shuttle or commutes between a second receiving position on the transmission line and a second release position on the transmission line. That is, the first carrier moves back and forth, crossing the transmission line in the opposite direction from the first release position to the receiving release position when the packaged electronic circuit has been taken by the transfer device. Preferably, the second carrier moves along the transmission line in the opposite direction from the second release position back to the second receiving position. In the case of mentioning commutation in the present application, it should also be understood as "arranged to commutate", and commutation can be referred to as shuttling.

[0010] When several different finishing steps are to be performed, the device according to the invention further comprises at least one third carrier, which can be moved on the transmission line independently of the first carrier and the second carrier, for moving the packaged integrated circuit on the transmission line between a third receiving position on the transmission line and a third release position on the transmission line, wherein the second release position and the third receiving position at least substantially coincide. A second finishing device, which is at the level of the second receiving position and is selected from the group consisting of: a punching or trimming device for shortening the connection pins of the integrated circuit, a bending device for bending the connection pins of the integrated circuit, or a punching device for removing the lead frame of the integrated circuit; a second transfer device, which is used to take the packaged integrated circuit from the second carrier at the second release position, pass the packaged circuit through a second post-processing device, and transfer the packaged integrated circuit to the third carrier at the third receiving position. Wherein, the second post-processing device can preferably be different from the first post-processing device. When more than two post-processing devices are required, the device according to the invention can be further extended in a similar manner to include a fourth carrier and a third post-processing device according to the invention.

[0011] The device of the present invention can also be cascaded with similar or identical devices. That is, the transmission lines of two (or more) devices are placed adjacent to each other and in line, and then post-processed on the same lead frame and / or components, or constructed therefrom.

[0012] The device according to the invention may further comprise a feed device, in particular a gripper movable by means of a robot arm, for gripping the integrated circuits to be machined at a feed position and feeding them from the housing to be machined to the device. The use of such a robot arm may make it possible to remove the integrated circuits from a rack or other type of feed holder after completion. Furthermore, the device may comprise an output device for outputting the finished packaged integrated circuits from the device at an output position.

[0013] In another embodiment, a product carrier tray attached to or integrally combined with at least one of the carriers includes a product carrier tray provided with spacers for carrying packaged integrated circuits away from the carrier surface so that they can be grasped on at least one side at the top and bottom for input, output or transfer.

[0014] The first carrier, the second carrier or the further carrier may further be arranged for carrying a packaged integrated circuit to its lead frame.

[0015] In another embodiment, the installation according to the invention can be arranged for sorting out stamping or trimming scrap. These stamping or trimming scraps are mostly copper or otherwise consist of recyclable conductor material connections or (lead) frame parts.

[0016] In order to achieve sufficiently fast and accurate positioning of the integrated circuits, the transmission line may include a linear motor. More specifically, the transmission line is formed by its common stator, and each carrier present comprises its translator, which can be moved relative to its stator independently of the translators of the other carriers. In this way, the carriers can be controlled and positioned independently.

[0017] Generally speaking, the present invention also relates to a method for post-processing a packaged integrated circuit, which comprises: moving the packaged integrated circuit on a first carrier between a first receiving position and a first release position; removing the packaged integrated circuit from the first carrier at the first release position; performing at least one post-processing device on the packaged circuit, the post-processing device being selected from the following group consisting of: a stamping or trimming device for shortening the connection pins of the integrated circuit, a bending device for bending the connection pins of the integrated circuit, or a stamping device for removing the lead frame of the integrated circuit; allocating the packaged integrated circuit to a second carrier at a second receiving position; moving the packaged integrated circuit between the second receiving position and the second release position using an independently movable second carrier, wherein the first release position and the second receiving position at least substantially overlap, and at least one post-processing device being selected from the following group consisting of: shortening the connection pins of the integrated circuit, bending the connection pins of the integrated circuit, or removing the lead frame of the integrated circuit.

[0018] Another object of the present invention is to provide an apparatus and method for post-processing of packaged integrated circuits, especially packaged integrated circuits of power electronic devices (such as packaged integrated circuits for electric vehicles).

[0019] To this end, the present invention proposes a device for post-processing of packaged integrated circuits, comprising: a transmission line, which extends from an input position along at least one post-processing device for post-processing the packaged integrated circuit in a supply direction to an output position, so as to move the packaged integrated circuit across the transmission line; at least one post-processing device, which is selected from the following group: a punching or trimming device for shortening the integrated circuit connection pins, a bending device for bending the integrated circuit connection pins, or a punching device for removing the lead frame from the integrated circuit; at least one transfer device, which is used to remove the packaged integrated circuit from the transmission line and supply it to the at least one post-processing device along a direction having a directional component transverse to the transmission direction (in particular, parallel to the surface of the transmission device), take out the post-processed packaged integrated circuit from the packaged integrated circuit from the at least one post-processing device, and return the post-processed packaged integrated circuit to the transmission line, wherein at least one post-processing device is located outside the transmission line (for example, adjacent to the transmission line or above the transmission line, but not on the transmission line or in the transmission line).

[0020] Since at least one post-processing device is located outside the transmission line, the transmission line has no or at least fewer restrictions on input height, post-processing speed and issues such as orientation of the supplied packaged integrated circuits. Removing the packaged integrated circuits from the transmission line provides the possibility to use any post-processing device and allows asynchronous (step or non-step) supply of packaged integrated circuits if more than one post-processing device is used.

[0021] Since the finishing is carried out outside the transmission line, no requirements need to be imposed on the post-processing facilities regarding being able to fit within the limits of the transmission line. Moreover, if there are several finishing facilities, it is easier to skip one post-processing facility. Furthermore, the transmission line is not obstructed by the finishing device placed on it and is therefore not limited in height by the finishing device, as is common according to the prior art. Another advantage is that the cuts or chips that occur during the finishing operation are not produced above the feeding device, so they can be processed better and more efficiently, preferably for recycling.

[0022] Preferably, at least one transfer device is arranged to move at least a certain distance with the transmission line during removal of the packaged integrated circuits from the transmission line and / or during return of the packaged integrated circuits to the transmission line. This eliminates the need to match the speed of the transmission line to the finishing speed of the finishing device or to step through while having to match the speed to the slowest finishing device.

[0023] At least one transfer device may further be arranged to invert the product before feeding it to the finishing device; and / or after feeding it to the finishing device; and / or between removing the packaged integrated circuit from the transmission line and returning the finished packaged integrated circuit to the transmission line. This allows for more complex post-processing operations, such as bending connection pins in two different (opposite) directions, or post-processing the packaged integrated circuit on multiple sides.

[0024] In another embodiment, the device according to the invention comprises at least one optical inspection device, such as a camera, positioned so that it can view integrated circuits moving across the transmission line and / or integrated circuits to be supplied to and / or received from a finished device.

[0025] To this end, at least one inspection device can preferably be positioned so that it can view locations through which the integrated circuit passes before or after (and preferably both before and after) a post-processing step, in particular at a location above the transmission line at the level of at least one post-processing device.

[0026] By viewing the integrated circuit before and after the post-processing steps, it is possible to see whether each post-processing step (or a part thereof) has carried out the post-processing in the manner intended. This position offers the possibility to perform a visual inspection of the integrated circuit both before and after the post-processing steps, when the integrated circuit is taken off the transport line by the transfer device and also returned to the same position there.

[0027] For this purpose, the inspection device may preferably be positioned above the transport device, at a location where the transfer device removes the integrated circuits from the transport line, and / or where the transfer device supplies the integrated circuits to at least one post-processing device, and / or where the transfer device retrieves the integrated circuits from at least one post-processing device, and / or where the transfer device returns the integrated circuits to the transport line.

[0028] In another embodiment, at least one finishing device comprises a pressure device equipped with a servomotor to supply power to the pressure device. The use of a servomotor has the advantage over the usual mostly pneumatically powered pressure devices that its operation is simpler and more precise, and the electrical power supply is easier to reprocess than a pneumatic device.

[0029] In another embodiment, the device includes sensors for measuring the current and / or voltage through and across the servomotor, respectively. The ammeter and / or voltmeter are relatively easy to fit, do not necessarily need to be fitted in close proximity to the respective servomotor, and can provide very accurate measurements. The combination of an ammeter and a voltmeter allows the instantaneous power to be determined.

[0030] These measurements are particularly useful if the device is equipped with a protection device arranged to compare the measured current and / or voltage values ​​through or across the servomotor with expected current and / or voltage values ​​and to take safety measures, such as stopping the movement, when the difference between the measured current and / or voltage values ​​and the expected current and / or voltage values ​​exceeds a threshold value. Deviations in current or voltage from expected values ​​usually indicate an anomaly during the post-processing process, such as a jam due to an integrated circuit or more precisely the lack of an integrated circuit.

[0031] In a preferred embodiment, the device according to this embodiment of the invention is also provided with at least one first carrier that can be moved independently across the transmission line, which is arranged to move the packaged integrated circuit across the transmission line between a first receiving position on the transmission line and a first release position on the transmission line; at least one second carrier that can be moved independently across the transmission line and is arranged to move the packaged integrated circuit across the transmission line between a second receiving position on the transmission line and a second release position on the transmission line, wherein the first release position and the second pick-up position at least substantially coincide; and at least one finishing device, which is at the level of the first release position.

[0032] The present invention also relates to a method for post-processing a packaged integrated circuit, which comprises: moving the packaged integrated circuit on a transmission line; removing the packaged integrated circuit from the transmission line; supplying the packaged integrated circuit to at least one post-processing device; performing at least one post-processing operation on the packaged integrated circuit, the post-processing operation being selected from the following group consisting of shortening the connection pins of the integrated circuit, bending the connection pins of the integrated circuit or removing the lead frame of the integrated circuit; and removing the post-processed non-integrated circuit from at least one post-processing device; and returning the post-processed non-integrated circuit to the transmission line; wherein supplying the non-integrated circuit to at least one post-processing device comprises supplying the post-processed non-integrated circuit to the post-processing device outside the transmission device.

[0033] The method may further comprise optically inspecting the packaged integrated circuit at a location where the integrated circuit passes, both before and after the post-processing step, in particular at a location above the transmission line at the level of at least one post-processing device.

[0034] In yet another embodiment, the method of operation includes comparing the measured current and / or voltage values ​​through or across the servo motor of the finishing device with the expected current and / or voltage values, and taking safety measures, such as stopping movement, when the difference between the measured current and / or voltage values ​​and the expected current and / or voltage values ​​exceeds a threshold. The invention will now be explained using the following figure, in which: BRIEF DESCRIPTION OF THE DRAWINGS

[0035] - Figure 1 A partially opened packaged integrated electronic circuit that can be post-processed is shown;

[0036] - Figure 2 A packaged integrated electronic circuit after post-processing is shown;

[0037] - Figure 3 A schematic diagram of a device according to the present invention is shown;

[0038] - Figure 4 A product carrier tray for carrying integrated electronic circuits is shown;

[0039] - Figure 5 shows a first detail of a device according to the invention; and

[0040] - Figure 6 A second detail of the device according to the invention is shown. DETAILED DESCRIPTION

[0041] Figure 1A packaged integrated electronic circuit 1 that can be post-processed is shown. The circuit comprises an electronic circuit 2 mounted on a wafer, which is connected to external terminal pins 5 by means of internal wiring 3 present in a housing 4. The external terminal pins are interconnected with connectors 6, which are used for mutual stability during the manufacturing process, but should be removed before use. The external connection pins 5 and the interconnects 6 are located on and within a lead frame 7, which is used for the manufacture and post-processing of the packaged integrated electronic circuit 1, but should be removed before use.

[0042] Figure 2 The packaged integrated electronic circuit is shown after it has been post-processed. The through-connectors 6 have been removed by punching (trimming), the lead frame has been removed and a portion of the connecting pins 5 has been bent (formed).

[0043] Figure 3 The device for post-processing of packaged integrated circuits according to the present invention is shown, which comprises: a transmission line (linear guide) 11, which extends from an input position 12 to an output position 16 along three post-processing devices 13, 14, 15 for post-processing of packaged integrated circuits; four independently movable carriers 17, 18, 19 across the transmission lines 11, 20, each carrier being arranged for moving the packaged integrated circuit across the transmission line 11 between a corresponding first receiving position (A, B', C, D') on the transmission line 11 and a first releasing position (B, C, D, E) on the transmission line 11, wherein the corresponding first releasing position and the second receiving position of the consecutive carriers at least substantially coincide (B-B', CC, D-D'). The post-processing device comprises a first punching or trimming device 13 for shortening the connection pins of the integrated circuit, a bending device 14 for bending the connection pins of the integrated circuit, and a punching device 15 for removing the lead frame of the integrated circuit. The device further comprises three transfer devices 20, 21, 22, each of which is used to take the packaged integrated circuit from the first carrier at a first release position (B, C, D), pass the packaged integrated circuit through the post-processing device, and release the packaged integrated circuit to the second carrier at a second receiving position (B', C, D'). The carriers 17, 18, 19, 20 each shuttle up and down along the track 23, 24, 25, 26 respectively. The device further comprises: a gripper 29 movable by a robot arm 27 for gripping the shell integrated circuit to be completed at the input position 12 and transferring it from the shell integrated circuit to be completed to the device; and an output device with a robot arm 28 for outputting the completed shell integrated circuit from the device 1 at the output position 16 by a gripper 30.

[0044] Figure 4A product carrier tray 31 is shown attached to a carrier 17, the tray being provided with spacers 32, 33, 34, 35 for carrying a packaged integrated circuit 1 away from a carrier surface 36 so that it can be gripped on at least one side at the top and bottom 37, 38 for use with an input device, an output device or a transfer device (27, 29).

[0045] Figure 5 An apparatus 41 for post-processing a packaged integrated circuit 42 is shown, comprising: a transmission line 43, which extends along at least one post-processing device 44 for post-processing the packaged integrated circuit 42 and is arranged to move the packaged integrated circuit 42 across the transmission line 43 along a transmission direction S; and at least one finishing device 44, which is selected from the following group consisting of: a punching or trimming device for shortening the connection pins 46 of the integrated circuit 42, a bending device for bending the connection pins 6 of the integrated circuit, or a punching device for removing the lead frame 47 of the integrated circuit 42; and a transfer device 45, which is used to take out the packaged integrated circuit 42 from the transmission line 43 and supply the packaged integrated circuit 42 to at least one finishing device 44 along a direction having a directional component T perpendicular to the transmission direction S, take out the packaged integrated circuit 42 from at least one finishing device 44, and return the packaged integrated circuit 42 to the transmission line 43, wherein at least one finishing device 44 is located outside the transmission line 42, in this case adjacent to the transmission line 42.

[0046] The transport device 45 is arranged to move with the transmission line 43 along the direction S by at least a specified distance during removal of the packaged integrated circuit 42 from the transmission line 43 and / or during return of the packaged integrated circuit 42 to the transmission line 43 .

[0047] The device further comprises at least one optical inspection device 48 formed by a camera, which is positioned to view the integrated circuits 42 displaced across the transmission line 43, as well as the integrated circuits 42 to be supplied to the finishing device 45, and the circuits 42 received from the finishing device 45. In this way, one optical inspection device 48 can identify any faults during the various post-processing stages of the integrated circuits 42. This would not be possible if the post-processing device 44 was located at or above the throughput device 42, as is common in the prior art. The inspection device 48 is positioned above the throughput device 43, at the location where the transfer device 45 removes the integrated circuits 42 from the transmission line 43 and supplies the integrated circuits 42 to at least one post-processing device 44, at the location where the transfer device 45 retrieves the integrated circuits 42 from the post-processing device 44, and at the location where the transfer device 45 returns the integrated circuits 42 to the transmission line 43.

[0048] Figure 6A second schematic diagram shows a part of a device 41 according to the invention, in which it can be seen that the punched lead frames 49 produced during the finishing operation are discharged into a discharge device 50 located adjacent to the transport device 43 .

[0049] The examples given above serve only to illustrate the invention and do not in any way limit the scope of protection as defined in the following claims.

Claims

1. An apparatus for post-processing of packaged integrated circuits, comprising: a transmission line extending from an input location through at least one post-processing facility for post-processing of packaged integrated circuits to an output location, - at least one first carrier movable on said transport line, configured to: o moving the packaged integrated circuit on the transmission line between a first receiving position on the transmission line and a first releasing position on the transmission line; - at least one second carrier movable on said transport line, configured to: o moving the packaged integrated circuit across the transmission line between a second receiving position on the transmission line and a second releasing position on the transmission line; - at least one post-processing facility, at the level of said first release location, selected from the group consisting of: o punching or trimming means for shortening the connection pins of the integrated circuit, o bending means for bending connecting pins of the integrated circuit, or o a punching device for removing a lead frame from said integrated circuit; - at least one transfer device for: o removing the packaged integrated circuit from the first carrier at the first release location; o feeding the packaged circuits through the first post-processing device; and o transferring the packaged integrated circuit to the second carrier at the second receiving location; Features - The first carrier and the second carrier are movable independently of each other on the transport line.

2. The device according to claim 1, wherein: The first carrier and the second carrier are arranged for moving one packaged integrated circuit at a time.

3. The device according to claim 1 or claim 2, wherein: The first carrier is arranged to shuttle between a first receiving position on the transmission line and a first releasing position on the transmission line, and the second carrier is arranged to shuttle between a second receiving position on the transmission line and a second releasing position on the transmission line.

4. The device according to any one of the preceding claims, comprising: at least one third carrier movable across the transmission line independently of the first carrier and the second carrier for moving the packaged integrated circuit across the transmission line between a third receiving position on the transmission line and a third releasing position on the transmission line, wherein the second releasing position and the third receiving position at least substantially coincide; - a second post-treatment facility, which is at the level of said second release location and is selected from the group consisting of: o punching or trimming means for shortening the connection pins of the integrated circuit, o bending means for bending connecting pins of the integrated circuit, or o a punching device for removing a lead frame from said integrated circuit; - A second transfer device for: o removing the packaged integrated circuit from the second carrier at the second release position; o feeding the packaged circuit through the second post-processing device; as well as o transferring the packaged integrated circuit to the third carrier at the third receiving location.

5. A device according to any preceding claim, cascaded with similar or identical devices.

6. The device according to any of the preceding claims, comprising a feed device, which in particular comprises a gripper movable by means of a robot arm, for engaging the integrated circuit to be completed at the input position and feeding it to a device for post-processing of packaging the integrated circuit.

7. The apparatus according to any of the preceding claims, comprising output means for outputting finished packaged integrated circuits from the apparatus for post-processing of packaged integrated circuits at the output location.

8. The device according to claim 1 comprises a product carrier tray mounted on at least one of the carriers or provided integrally therewith, the tray being provided with spacers for carrying packaged integrated circuits at a distance from the surface of the carrier so that they can be gripped on at least one side at the top and the bottom for use in an input device, an output device or a transfer device.

9. The device according to claim 8, wherein: The carrier is arranged for carrying a packaged integrated circuit on a lead frame.

10. Apparatus according to any one of the preceding claims, equipped for sorting out stamping waste or trimming waste.

11. The device according to any one of the preceding claims, wherein: The transmission line includes a linear motor.

12. An apparatus for post-processing of packaged integrated circuits, comprising: a transmission line extending from an input location through at least one post-processing facility for post-processing of packaged integrated circuits to an output location for: - moving the packaged integrated circuit across the transmission line; - At least one finishing device selected from the group consisting of: o punching or trimming means for shortening the connection pins of the integrated circuit, o bending means for bending connecting pins of the integrated circuit, or o a punching device for removing a lead frame from said integrated circuit; - at least one transfer device for: o removing the packaged integrated circuit from the first carrier at the first release location; o feeding the packaged circuits through the first post-processing device; as well as o transferring the packaged integrated circuit to the second carrier at the second receiving location; Features - said at least one finishing device is located outside said transmission line and is therefore not on or in said transmission line.

13. The device according to claim 12, wherein: The at least one transfer device is arranged to move at least a distance along the transmission line during: o removing the packaged integrated circuit from the first carrier at the first release location; and / or o transferring the packaged integrated circuit to the second carrier at the second receiving location.

14. The device according to claim 12 or claim 13, wherein: The at least one transfer device is arranged to invert the product when: - before supplying said product to a post-processing facility; and / or - after the product has been supplied to a post-processing facility; and / or - Between: ο obtaining a packaged integrated circuit from the transmission line; and o Place the completed packaged integrated circuit back onto the transmission line.

15. A method for post-processing a packaged integrated circuit, comprising: - moving the packaged integrated circuit on the first carrier between a first receiving position and a first releasing position; - removing the packaged integrated circuit from the first carrier at the first release location; - post-processing the packaged integrated circuit by means of: o shortening the connection pins of the integrated circuit, o bending the connecting pins of the integrated circuit, or o removing a lead frame from the integrated circuit; o transferring the packaged integrated circuit to a second carrier at a second receiving location; - independently moving the packaged integrated circuit between the second receiving position and a second dispensing position, wherein the first releasing position and the second receiving position at least substantially coincide.

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