Linear cutting equipment and cutting line position compensation device and cutting method thereof

Abstract

The invention relates to the technical field of photovoltaics, in particular to linear cutting equipment, a cutting line position compensation device of the linear cutting equipment and a cutting method. The cutting line position compensation device is applied to the wire cutting equipment, the wire cutting equipment comprises cutting lines, the cutting lines are arranged into a cutting line net, the cutting line net comprises a cutting area used for making contact with a to-be-cut body and a non-cutting area located on the periphery of the cutting area, and the cutting line position compensation device comprises at least one magnetic part and a control unit. The magnetic part is arranged in the non-cutting area; the control unit can control the magnetic force of the magnetic part to the cutting line, so that the cutting line is subjected to position compensation under the action of the magnetic force. The magnetic force generated by the magnetic part is controlled through the control unit, so that the cutting line is finely adjusted under the action of the magnetic force to perform position compensation, the cutting line is ensured to be always kept at the preset target position, the edge distance range is reduced, the product machining precision, stability and efficiency are improved, and the production cost is reduced.

Description

Technical Field

[0001] The present application relates to the field of photovoltaic technology, and in particular to a wire cutting device and a cutting line position compensation device and a cutting method. Background Art

[0002] Wire cutting is a common process in silicon rod machining. Usually, the feeding direction of the silicon rod and the conveying direction of the cutting wire are at a certain angle. During the feeding process of the silicon rod, the cutting wire is sheared. Especially when the feeding speed of the silicon rod is fast, it is easy to cause the cutting wire to deflect in the groove, thereby deviating from the preset target position (such as Figure 1 ); resulting in an increase in the margin range of the silicon rod (margin range: the difference between the maximum and minimum values ​​of the silicon rod margin size).

[0003] As the margin difference increases, the stability of the cutting line in the silicon rod processing position decreases, making it difficult to accurately control the surface flatness of the silicon rod during the cutting process, and thus the defective rate of the product increases. In addition, the increase in the margin difference will also affect the subsequent processing of the silicon rod. For example, the processing allowance required for polishing the surface of the silicon rod will increase accordingly, which will increase the process time and reduce the production efficiency of the product.

[0004] Therefore, in view of this, the present invention is proposed. Summary of the invention

[0005] In view of the above-mentioned technical problems, the purpose of this application is to propose a wire cutting device and a cutting wire position compensation device and a cutting method to solve the technical problem of increased margin difference caused by the deflection of the cutting wire in the wire groove in the wire cutting process existing in the prior art.

[0006] In a first aspect of the present application, a cutting line position compensation device is provided, which is applied to a wire cutting device. The wire cutting device includes a cutting line, and the cutting line is arranged into a cutting line network. The cutting line network includes a cutting area for contacting a body to be cut, and a non-cutting area located around the cutting area. The cutting line position compensation device includes at least one magnetic member and a control unit. The magnetic member is arranged in the non-cutting area. The control unit can control the magnetic force of the magnetic member on the cutting line so that the cutting line can be positionally compensated under the action of the magnetic force.

[0007] In a further solution of the present application, there are two non-cutting areas, and the two non-cutting areas are arranged opposite to each other; at least one magnetic component is arranged corresponding to each non-cutting area, and the two magnetic components are symmetrically arranged relative to the cutting area.

[0008] In a further solution of the present application, there are four non-cutting areas, and the four non-cutting areas are arranged at intervals around the cutting area; at least one magnetic part is arranged corresponding to each non-cutting area, and the magnetic parts opposite to each other are symmetrically arranged relative to the cutting area.

[0009] In a further solution of the present application, the cutting line position compensation device also includes a moving mechanism, and the magnetic part is arranged on the moving mechanism; the control unit is electrically connected to the moving mechanism, and the moving mechanism is configured to drive the magnetic part to move closer to or away from the cutting line along the feed direction of the cutting line to adjust the magnetic force of the magnetic part on the cutting line.

[0010] In a further solution of the present application, the moving mechanism can also drive the magnetic member and the cutting line to move closer to or away from the cutting area on the same horizontal plane.

[0011] The second aspect of the present application also provides a wire cutting device, including the cutting line position compensation device as described above, and also including: a roller group, the periphery of the roller group is connected to the cutting wire, and the cutting wire is arranged into a cutting wire network.

[0012] In a further embodiment of the present application, the roller group includes a first roller body and a second roller body arranged in pairs; the first roller body includes a first cross-cutting disc and a second cross-cutting disc, and the first cross-cutting disc and the second cross-cutting disc are respectively connected with first cutting lines parallel to each other; the second roller body includes a first vertical-cutting disc and a second vertical-cutting disc, and the first vertical-cutting disc and the second vertical-cutting disc are respectively connected with second cutting lines parallel to each other; wherein the first cutting lines and the second cutting lines are arranged vertically and cross-sectionally to form a cutting line network; the magnetic parts are respectively arranged between the first cutting lines and between the second cutting lines, so as to enable the first cutting lines and the second cutting lines to be positionally compensated in a direction in which they approach each other.

[0013] The present application also finally provides a wire cutting method, which requires the use of the wire cutting equipment as described above. The wire cutting method includes the following steps: controlling the cutting wire to cut the silicon rod at a preset feed speed; obtaining the real-time deformation of the cutting line relative to the target position during the cutting process; adjusting the magnetic force of the magnetic part on the cutting line according to the real-time deformation, so that the cutting line can be compensated to the target position.

[0014] In a further solution of the present application, controlling the cutting line to cut the silicon rod at a preset feeding speed includes: controlling the feeding speed to gradually increase and then gradually decrease along the feeding direction.

[0015] In a further solution of the present application, the real-time deformation amount of the cutting line relative to the target position is obtained during the cutting process, including: determining the real-time deformation amount according to the current feed speed and the mapping relationship between the preset feed speed and the corresponding deformation amount.

[0016] In a further scheme of the present application, the magnitude of the magnetic force of the magnetic component on the cutting line is controlled according to the real-time deformation amount, including: when the real-time deformation amount is less than a preset first threshold value, the magnitude of the magnetic force of the magnetic component on the cutting line is controlled to be a first magnetic force; when the real-time deformation amount is between the first threshold value and a preset second threshold value, the magnitude of the magnetic force of the magnetic component on the cutting line is controlled to be a second magnetic force; when the real-time deformation amount is greater than a third threshold value, the magnitude of the magnetic force of the magnetic component on the cutting line is controlled to be a third magnetic force.

[0017] In a further embodiment of the present application, the magnitude of the magnetic force exerted by the magnetic element on the cutting line is controlled, including: controlling the magnitude of the current input to the magnetic element to control the magnitude of the magnetic force exerted by the magnetic element on the cutting line; and / or controlling the relative position of the magnetic element and the cutting line to control the magnitude of the magnetic force exerted by the magnetic element on the cutting line.

[0018] In a further scheme of the present application, the magnitude of the magnetic force of the magnetic component on the cutting line is controlled according to the real-time deformation amount, including: inputting the real-time deformation amount control into a preset linear equation to obtain a target value of the magnetic force magnitude, wherein the linear equation is a positive linear relationship between the real-time deformation amount and the magnetic force; controlling the magnitude of the magnetic force of the magnetic component to switch to the target value.

[0019] In summary, the present application provides a cutting line position compensation device that can be applied to wire cutting equipment. The cutting line position compensation device includes at least one magnetic part and a control unit. The wire cutting equipment includes a cutting wire network composed of cutting wires. The magnetic part is arranged in a non-cutting area of ​​the cutting wire network to avoid interfering with the cutting operation in the cutting area. The control unit controls the magnitude of the magnetic force generated by the magnetic part, so that the cutting line is fine-tuned under the action of the magnetic force for position compensation, thereby ensuring that the cutting line always remains in a preset target position, so as to reduce the margin range, improve product processing accuracy, stability and efficiency, and reduce production costs.

[0020] Other features and advantages of the embodiments of the present invention will be described in the following specific implementation examples. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the specific implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1 A schematic diagram of the prior art cutting line provided in this application deviating from the target position during the cutting process;

[0023] Figure 2A schematic structural diagram of a cutting line position compensation device and a wire cutting device used therein provided in Embodiment 1 of the present invention;

[0024] Figure 3 A module diagram of a cutting line position compensation device provided in Embodiment 1 of the present invention;

[0025] Figure 4 A top view of a cutting line position compensation device and a wire cutting device used therein provided in Embodiment 1 of the present invention;

[0026] Figure 5 A top view of another cutting line position compensation device and a wire cutting device used therein provided in the first embodiment of the present invention;

[0027] Figure 6 A top view of a wire cutting device provided in Embodiment 2 of the present invention;

[0028] Figure 7 This is a flow chart of the wire cutting method provided in the third embodiment of the present invention;

[0029] Figure 8 A flowchart of step S30 in the wire cutting method provided in the third embodiment of the present invention; and

[0030] Fig. 9 This is another flow chart of step S30 in the wire cutting method provided in the third embodiment of the present invention.

[0031] The reference numerals are described as follows:

[0032] 100. Cutting line position compensation device;

[0033] 11. Magnetic component; 12. Control unit; 13. Moving mechanism;

[0034] 200. Wire cutting equipment;

[0035] 20, roller assembly; 20a, first roller; 201, first transverse cutting disc; 202, second transverse cutting disc; 20b, second roller; 203, first vertical cutting disc; 204, second vertical cutting disc;

[0036] 21, cutting line; 211, first cutting line; 212, second cutting line;

[0037] 22, cutting wire mesh; 22a, cutting area; 22b, non-cutting area; DETAILED DESCRIPTION

[0038] The terms "second direction", "first direction", "third direction", "inside", "outside" and the like that appear below to indicate orientation or positional relationships, unless otherwise specified, are to be understood as being based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0039] In addition, if there is a feature defined as "first" or "second", it is only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Features defined as "first" or "second" may explicitly or implicitly include at least one of the defined features. If there is a description of "plurality", the general meaning is to include at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0040] In this application, unless otherwise clearly specified and limited, the terms such as "installed", "connected", "connected", "fixed" and so on should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection, it can be a direct connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0041] In the description of this specification, if the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" appear, it means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, unless they are contradictory.

[0042] like Figures 2 to 4 In the first embodiment of the present invention, a cutting line position compensation device 100 is first provided, which is applied to a wire cutting device 200. The wire cutting device 200 includes a roller group 20 and a cutting line 21 connected to the roller group 20, wherein the cutting line 21 is arranged into a cutting line network 22, and the cutting line network 22 includes a cutting area 22a for contacting a body to be cut, and a non-cutting area 22b located around the cutting area.

[0043] Those skilled in the art will know that the cutting area 22a refers to the area that is in direct contact with the body to be cut and performs the cutting operation. This area is a key part to achieve the desired cutting morphology. The non-cutting area 22b refers to the area located around the cutting area, which does not directly participate in the cutting operation, but exists as an auxiliary area to maintain the stability of the cutting area 22a. It should be noted that the cutting line 21 is usually in a moving state of continuous wire feeding in the cutting state. Therefore, the "cutting area" in the embodiment of the present invention cannot be understood as the area where the cutting line network is in dynamic contact with the body to be cut. The "cutting area" and "non-cutting area" only refer to specific areas in the cutting line network and do not change with the movement of the cutting line.

[0044] Based on a general inventive concept of an embodiment of the present invention, the cutting line position compensation device 100 includes at least one magnetic member 11 and a control unit 12. The control unit 12 can control the magnitude and / or direction of the magnetic force of the magnetic member 11 on the cutting line 21 so that the cutting line 21 can be position compensated under the action of the magnetic force.

[0045] It can be understood that the function of the magnetic part 11 is to generate an adjustable magnetic field. The cutting line 21 can be made of magnetizable material, such as a steel wire coated with diamond powder. The magnetic part 11 can exert magnetic force on the cutting line 21, so that the cutting line 21 can be fine-tuned in the direction of approaching the magnetic part 11 under the action of the magnetic force, thereby returning to the expected target position, ensuring the cutting position accuracy to reduce the margin error.

[0046] Furthermore, the magnetic member 11 is disposed in the non-cutting area 22b to ensure that it does not interfere with the cutting operation in the cutting area 22a.

[0047] The control unit 12 serves as an electronic controller and is responsible for adjusting the magnitude and / or direction of the magnetic field generated by the magnetic member 11 so that the position compensation can respond and adjust in real time to adapt to different cutting states and optimize the cutting effect.

[0048] Taking the silicon rod as an example, the cutting wire 21 of different types of wire cutting equipment 200 is arranged differently, and the arrangement of the corresponding magnetic parts 11 is also different, as follows:

[0049] In an alternative solution, Figure 4 There are two non-cutting areas 22b, and the two non-cutting areas 22b are arranged opposite to each other; each non-cutting area 22b is correspondingly provided with at least one magnetic member 11, and the magnetic members 11 in different non-cutting areas 22b are symmetrically arranged relative to the cutting area 22a.

[0050] Since each non-cutting area 22b has its corresponding magnetic member 11, and the magnetic member 11 is symmetrical with respect to the cutting area 22a, it can ensure that the non-cutting area 22b is subjected to balanced force, thereby preventing the cutting line 21 in one of the non-cutting areas 22b from tilting and affecting the flatness of the cutting surface.

[0051] In a preferred embodiment, the magnetic member 11 is configured to be a long strip and extends along the wire feeding direction of the cutting line 21 (the "wire feeding direction" in this application can be understood as the direction from the non-cutting area 22b to the cutting area 22a, the same below) so that the magnetic force applied to the cutting line 21 is more dispersed, and the cutting line 21 can be more evenly affected by the magnetic force, which helps to maintain the straightness of the cutting line 21 during the cutting process and avoid bending and twisting caused by stress concentration at its local position.

[0052] In some embodiments, there may be multiple magnetic parts 11, and multiple magnetic parts 11 may be arranged in sequence at equal intervals in the non-cutting area 22b along the wire feeding direction of the cutting line 21, and each magnetic part 11 may independently apply a certain degree of magnetic force to the cutting line, thereby achieving higher control accuracy. By precisely adjusting the magnetic force of each magnetic part 11, stress concentration of the cutting line 21 in the wire feeding direction can be avoided, so that the force of the entire cutting line 21 is more balanced as a whole; and the setting of multiple magnetic parts 11 can reduce the impact on the stability of the cutting line 21 caused by damage or demagnetization of a single magnetic part 11. And redundancy can be increased to ensure that even if there is a problem with some magnetic parts 11, the overall functionality of the cutting line position compensation device 100 can still be maintained.

[0053] In an alternative solution, Figure 5 There are four non-cutting areas 22b, and the four non-cutting areas 22b are arranged at intervals around the cutting area 22a; each non-cutting area 22b is correspondingly provided with at least one magnetic member 11, and the magnetic members 11 opposite to each other are symmetrically arranged relative to the cutting area 22a.

[0054] It can be understood that at this time, the cutting lines 21 are arranged to cross each other in the cutting area 22a to enclose the desired cutting shape; specifically, by adjusting the position and angle of the spacing intersection of the cutting lines 21, the silicon rod can be cut regularly, such as rectangular or square cutting. At least one magnetic member 11 is correspondingly arranged in each non-cutting area 22b, so that the cutting line 21 can be fine-tuned in the direction of approaching or moving away from the magnetic member 11 under the magnetic force of the magnetic member 11, thereby realizing the position compensation of the cutting line 21.

[0055] Similarly, the magnetic member 11 may be in the shape of a long strip extending along the feeding direction of the cutting line 21, or a plurality of magnetic members 11 may be arranged in sequence at equal intervals along the feeding direction of the cutting line 21 to avoid excessive concentration of magnetic force on the cutting line 21.

[0056] In an optional manner, the cutting line position compensation device 100 also includes a moving mechanism 13, and the magnetic member 11 is connected to the moving mechanism 13; the control unit 12 is electrically connected to the moving mechanism 13, and the moving mechanism 13 is configured to be able to drive the magnetic member 11 to move closer to or away from the cutting line 21 along the feeding direction of the cutting line 21, so as to adjust the magnetic force of the magnetic member 11 on the cutting line 21.

[0057] For reference Figure 2 , the wire cutting device 200 drives the cutting wire 21 to cut the silicon rod along a given feeding direction while continuously feeding the wire. In simple terms, the roller group 20 of the wire cutting device 200 is responsible for providing the power for continuous wire feeding to ensure that the cutting wire 21 moves continuously at high speed; at the same time, the wire cutting device 200 itself also moves at the same time, so that the cutting wire 21 cuts the silicon rod along a predetermined feeding direction, and the feeding direction is usually along the length direction of the silicon rod, so as to achieve precise processing and cutting of the silicon rod. During the cutting process, the control unit 12 controls the moving mechanism 13 to drive the magnetic part 11 to move along the feeding direction according to demand (for example, Figure 2 The magnetic element 11 is moved from position A to position B in the feeding direction, thereby approaching or moving away from the cutting line 21, and the magnitude of the magnetic force is changed by the distance between the magnetic element 11 and the cutting line 21. Specifically, when the magnetic element 11 approaches the cutting line 21 along the feeding direction, the magnetic force on the cutting line 21 increases, and conversely, when the magnetic element 11 moves away from the cutting line 21, the magnetic force on the cutting line 21 decreases.

[0058] Optionally, the moving mechanism 13 can also drive the magnetic member 11 and the cutting line 21 to move closer to or away from the cutting area 22a on the same horizontal plane (for example, Figure 2 position B to position C).

[0059] It is understood that when the magnetic member 11 and the cutting line 21 move closer to or away from the cutting area 22a on the same horizontal plane, the position of the cutting line 21 subjected to the magnetic force changes, that is, the force area of ​​the cutting line 21 subjected to the magnetic force changes. Specifically, when the magnetic member 11 is close to the cutting area 22a, the position of the magnetic force on the cutting line 21 will be closer to the cutting area 22a, and it can also help maintain the stability and accuracy of the cutting line 21, reduce the torque during the cutting process and the cumulative error caused by the offset of the cutting line 21 in the non-cutting area 22b, so that the position compensation of the cutting line 21 is more accurate.

[0060] In an optional manner, the moving mechanism 13 may adopt a linear guide rail, a ball screw or a connecting rod structure, and the magnetic member 11 is connected to the moving mechanism 13 and fixed to move along a preset motion trajectory.

[0061] Furthermore, the mobile mechanism 13 can be adaptively configured according to the available space of the wire cutting device 200, and can be set up independently or connected to the roller group 20 of the wire cutting device 200. When the mobile mechanism 13 is set up independently, it can be operated as an independent mechanism, which is suitable for situations where rapid replacement or adjustment is required. It can be deployed and reconfigured more quickly, and it is convenient to replace or update a single component. Alternatively, the mobile mechanism 13 can be connected to the roller group 20 of the wire cutting device 200 to better utilize the equipment space and make it more compact; at the same time, the mobile mechanism 13 and the roller group 20 move synchronously, and the stability and guidance of the wire cutting device 200 can be used to improve the consistency of movement and reduce the relative position error, thereby further improving the stability and accuracy of the mobile mechanism 13.

[0062] In one embodiment, the magnetic member 11 is an electromagnetic coil, the control unit 12 is a current controller, the electromagnetic coil is electrically connected to the current controller, and the current controller can adjust the current input to the electromagnetic coil to control the magnetic force of the magnetic member 11 on the cutting line 21. When the cutting line position compensation device 100 includes a moving mechanism 13, the magnetic member 11 can also be a permanent magnet.

[0063] Based on the above, the present invention provides several specific implementation modes:

[0064] In a specific embodiment, the magnetic member 11 is a permanent magnet; the magnetic member 11 is connected to the moving mechanism 13, and the moving mechanism 13 drives the magnetic member 11 to move closer to or away from the cutting line 21 along the feeding direction of the cutting line 21; specifically, when the moving mechanism 13 drives the magnetic member 11 to move closer to the cutting line 21, the magnetic force on the cutting line 21 will increase. Due to the effect of the magnetic force, the cutting line 21 will produce displacement compensation to one side of the permanent magnet. This displacement compensation can be used to adjust the position of the cutting line 21 to achieve the purpose of accurately controlling the cutting process. By adjusting the parameters such as the stop position, the timing of movement and the movement speed of the magnetic member 11 driven by the moving mechanism 13, the effect of optimizing the magnetic force regulation can be achieved, and the accuracy of the displacement compensation can be further improved. On the contrary, when the moving mechanism 13 carries the magnetic member 11 away from the cutting line 21, the magnetic force on the cutting line 21 will decrease. As the magnetic force decreases, the cutting line 21 may gradually return to its original position. Optionally, the moving mechanism 13 can also drive the magnetic member 11 and the cutting line 21 to move closer to or away from the cutting area 22a on the same horizontal plane. Similarly, when the moving mechanism 13 drives the magnetic member 11 to approach the cutting area 22 a , the magnetic force exerted on the cutting area 22 a will increase, resulting in displacement compensation of the cutting area 22 a .

[0065] It can be understood that permanent magnets are not easily affected by external factors, such as temperature, humidity, etc., and therefore have higher stability and reliability; and since permanent magnets do not require external electrical energy to maintain the magnetic field, they can reduce energy consumption and operating costs.

[0066] In a specific embodiment, the magnetic member 11 adopts an electromagnetic coil, and the magnetic member 11 is fixed at a preset position on the path passed by the wire cutting device 200 in its feeding direction, that is, the position of the magnetic member 11 remains unchanged. When the wire cutting device 200 drives the cutting line 21 to move along the feeding direction, the control unit 12 can continuously adjust the current input to the magnetic member 11 according to the relative position relationship between the magnetic member 11 and the cutting line 21, thereby adjusting the magnetic force to achieve real-time position compensation for the cutting line.

[0067] In another specific embodiment, the magnetic member 11 adopts an electromagnetic coil, and the magnetic member 11 is fixedly connected to the roller group 20 of the wire cutting device 200, and moves synchronously with the wire cutting device 200 along the feed direction, that is, the relative position of the magnetic member 11 and the cutting line 21 remains unchanged. The control unit 12 can continuously adjust the current input to the magnetic member 11 according to the deformation and other dimensions of the cutting line 21, thereby adjusting the magnetic force to achieve real-time position compensation of the cutting line.

[0068] In another specific embodiment, the magnetic member 11 adopts an electromagnetic coil or a permanent magnet, and the magnetic member 11 is connected to the moving mechanism 13. The moving mechanism 13 drives the magnetic member 11 to move closer to or away from the cutting line 21 along the feeding direction of the cutting line 21, or at the same time, the magnetic force can be adjusted by controlling the current input to the magnetic member 11; optionally, the moving mechanism 13 can also drive the magnetic member 11 and the cutting line 21 to move closer to or away from the cutting area 22a on the same horizontal plane.

[0069] In summary, the present application provides a cutting line position compensation device 100 that can be applied to a wire cutting device 200. The cutting line position compensation device 100 includes at least one magnetic component 11 and a control unit 12. The wire cutting device 200 includes a cutting line network 22 composed of cutting lines 21. The magnetic component 11 is set in a non-cutting area 22b of the cutting line network 22. The control unit controls the magnitude of the magnetic force generated by the magnetic component 11, so that the cutting line 21 is fine-tuned under the action of the magnetic force for position compensation, thereby ensuring that the cutting line 21 always remains at a preset target position, so as to reduce the margin range, improve product processing accuracy, stability and efficiency, and reduce production costs.

[0070] Furthermore, those skilled in the art should understand that if all or part of the sub-modules involved in the various products of the cutting line position compensation device 100 provided in the embodiments of the present invention are combined and replaced through embodiments such as fusion, simple change, mutual transformation, etc., such as the components are placed and moved, or a wire cutting device is designed; or a detachable design; or the product constituted by them is set as one, such as an integrated design; all the combined components can form a device / apparatus / system with specific functions, and using such a device / apparatus / system to replace the corresponding components of the present invention also falls within the protection scope of the present invention.

[0071] like Figure 6 The second embodiment of the present invention also provides a specific wire cutting device 200, including the cutting line position compensation device 100 as described above, and also including: a roller group 20, the periphery of the roller group 20 is connected with a cutting line 21, and the cutting line 21 is arranged into a cutting line network 22.

[0072] In a further embodiment of the present application, the roller group 20 includes a first roller 20a and a second roller 20b arranged in pairs; the first roller 20a includes a first cross-cutting disc 201 and a second cross-cutting disc 202, and the first cross-cutting disc 201 and the second cross-cutting disc 202 are respectively connected with first cutting lines 211 parallel to each other; the second roller 20b includes a first vertical-cutting disc 203 and a second vertical-cutting disc 204, and the first vertical-cutting disc 203 and the second vertical-cutting disc 204 are respectively connected with second cutting lines 212 parallel to each other; wherein the first cutting lines 211 and the second cutting lines 212 are arranged vertically and crosswise to form a cutting line network 22; the magnetic parts 11 are respectively arranged between the first cutting lines 211 and between the second cutting lines 212, so as to enable the first cutting lines 211 and the second cutting lines 212 to perform position compensation in a direction of approaching each other.

[0073] Specifically, the cutting wire mesh 22 includes a cutting area 22a and four non-cutting areas 22b. When the silicon rod needs to be cut, the silicon rod is conveyed to the cutting area 22a in a clamped state according to a preset feeding direction. The first roller body 20a and the second roller body 20b rotate at a predetermined speed to drive the first cutting wire 211 and the second cutting wire 212 to feed the wires. The magnetic parts 11 are respectively arranged in the four non-cutting areas 22b. Under the action of the magnetic parts, the cutting wires (i.e., the first cutting wire 211 and the second cutting wire 212) are positionally compensated in a direction of approaching each other. Therefore, both the first cutting wire 211 and the second cutting wire 212 can be maintained at the preset target position, thereby ensuring the cutting accuracy and quality, maintaining the flatness of the silicon rod surface, reducing the margin extremes, improving the product qualification rate and saving costs.

[0074] Optionally, the cutting area 22a of the cutting wire mesh 22 may be rectangular or square, which can be adaptively set according to the shape requirements of the silicon rods to be cut into square shapes.

[0075] In a further scheme of an embodiment of the present invention, the magnetic member 11 is arranged at the center position of the first cutting line 211 and the second cutting line 212 to achieve a symmetrical distribution of the magnetic force, that is, the parallel first cutting line 211 and the second cutting line 212 are subjected to equal magnetic forces, thereby ensuring that the compensation amounts on both sides are consistent and avoiding over-compensation of the cutting line 21 on one side.

[0076] Those skilled in the art will appreciate that the wire cutting device 200 is mainly used for squaring silicon rods. The magnetic member 11 between the first cutting line 211 and the second cutting line 212 ensures that the cutting line remains at a preset target position during the cutting process, thereby reducing the margin difference and achieving high-precision silicon rod cutting.

[0077] like Figure 7 The third embodiment of the present invention further provides a wire cutting method, which requires the use of the wire cutting device 200 as described above. The wire cutting method includes the following steps:

[0078] Step S10, controlling the cutting line to cut the silicon rod at a preset feeding speed;

[0079] Step S20, obtaining the real-time deformation amount of the cutting line relative to the target position during the cutting process;

[0080] Step S30: adjusting the magnetic force of the magnetic component on the cutting line according to the real-time deformation amount, so as to make the cutting line perform position compensation toward the target position.

[0081] It can be understood that by means of the preset feed speed, the cutting line is ensured to move on the silicon rod in the feed direction, the real-time deformation of the cutting line is detected during the cutting process, and then the magnetic force of the magnetic part on the cutting line is adjusted according to the real-time deformation data, so that the cutting line is compensated for the position toward the target position, which can keep the cutting line in the target position during the cutting process, thereby improving the cutting accuracy and reducing the margin deviation.

[0082] The “target position” is the ideal position of the desired cutting line, that is, when the cutting line is at the target position, it corresponds to the set margin required for cutting the silicon rod. By detecting the actual offset position of the cutting line, the real-time deformation amount is defined as the relative deviation between the current offset position and the target position (refer to Figure 1 △x in ).

[0083] In step S10, the feed speed may be kept constant and dynamically adjusted according to the cutting process.

[0084] In a preferred solution, controlling the cutting line to cut the silicon rod at a preset feeding speed includes: controlling the feeding speed to gradually increase and then gradually decrease along the feeding direction.

[0085] In a feasible solution, the feed speed may be increased and then decreased linearly, such as the feed speed gradually increases from an initial speed, the feed speed reaches a peak value and remains for a period of time, and then the feed speed gradually decreases.

[0086] In another embodiment, the feed speed may be changed in stages, with a different feed speed being used in each stage, such as setting the feed speed to different values ​​according to the feed displacement or feed time. For example, the feed speed is set to the first speed in the initial stage of cutting, and the feed speed is increased to the second speed in the middle stage of cutting. At the end of cutting, the feed speed is switched to the third speed, wherein the second speed is greater than the first speed and the third speed.

[0087] It can be understood that in the initial stage of cutting, using a lower feed speed can reduce the shear force and keep the cutting line straight, which can effectively reduce the instability of the cutting line caused by the shear force during the initial cutting and improve the cutting accuracy and stability; as the cutting proceeds, the middle section of the silicon rod is longer, and increasing the feed speed can significantly improve the cutting efficiency, shorten the overall cutting time, and improve the processing efficiency; when cutting to the rear section of the silicon rod, reducing the feed speed can reduce the wire bow and avoid wire breakage and edge collapse when the cutting wire is separated from the silicon rod, which can improve the cutting stability and extend the service life of the cutting wire. In summary, by controlling the feed speed to optimize the processing process, improve processing efficiency, reduce tool wear and energy consumption, and obtain better processing quality.

[0088] Furthermore, in order to obtain the real-time deformation of the cutting line relative to the target position during the cutting process, a sensor, such as a high-precision displacement sensor, can be set near the cutting line to detect in real time the relative deviation between the actual offset position of the cutting line and the target position, that is, the real-time deformation amount; in some embodiments, laser interferometry or machine vision can also be used to further improve the detection accuracy of the real-time deformation amount.

[0089] As a preferred solution of an embodiment of the present invention, obtaining the real-time deformation amount of the cutting line relative to the target position during the cutting process includes: determining the real-time deformation amount according to the current feed speed and the mapping relationship between the preset feed speed and the corresponding deformation amount.

[0090] Specifically, a database or mapping table is pre-established, which contains the corresponding cutting line shape variable data at different feed speeds in the current cutting scene; these data can be obtained through experiments or simulations. In the actual cutting process, the control unit obtains the current feed speed in real time, and quickly searches for the corresponding shape variable data in the database or mapping table according to the current feed speed as an estimated value of the real-time shape variable at the current feed speed. Compared with the method of directly obtaining the shape variable in real time, the method of pre-establishing a database or mapping table can adjust the magnetic force in advance before the deformation occurs to reduce the influence of the deformation, thereby avoiding the deformation of the cutting line as much as possible, and further improving the cutting quality and accuracy.

[0091] It can be understood that the “cutting scenario” includes the material properties and specifications of the silicon rod and the cutting wire, the type and pressure of the coolant, and the current environment, etc.

[0092] In a further solution of the present application, in step S30, the magnitude of the magnetic force of the magnetic member on the cutting line is controlled according to the real-time deformation amount, including:

[0093] Step S31, when the real-time deformation amount is less than a preset first threshold, controlling the magnetic force of the magnetic member on the cutting line to be a first magnetic force;

[0094] Step S32: when the real-time deformation amount is between the first threshold value and the preset second threshold value, controlling the magnetic force of the magnetic member on the cutting line to be the second magnetic force;

[0095] Step S33: When the real-time deformation amount is greater than a third threshold, the magnitude of the magnetic force exerted by the magnetic component on the cutting line is controlled to be a third magnetic force.

[0096] It can be understood that steps S31 to S33 divide the real-time deformation into different threshold ranges, and apply different magnetic force magnitudes to each threshold range, so as to dynamically adjust and control the deformation of the cutting line, which helps to improve the cutting accuracy and processing quality.

[0097] Specifically, the third magnetic force is greater than the first magnetic force and the second magnetic force. In the initial stage of cutting, the feed speed is slow and the real-time deformation is small. The magnetic force of the magnetic part on the cutting line is controlled to be the first magnetic force. When it is in the stage of cutting to the middle of the silicon rod, the feed speed is large. The magnetic force of the magnetic part on the cutting line is controlled to be the third magnetic force to control the cutting line to compensate to the target position. Finally, when cutting to the rear section of the silicon rod, the feed speed is relatively reduced. At this time, the magnetic force of the magnetic part on the cutting line is controlled to be the second magnetic force. According to different cutting stages, the magnetic force can be adjusted in real time to better control the deformation of the cutting line, so as to take into account the cutting quality while ensuring the processing efficiency.

[0098] Furthermore, the magnitude of the magnetic force exerted by the magnetic element on the cutting line can be controlled by controlling the magnitude of the current input to the magnetic element to control the magnitude of the magnetic force exerted by the magnetic element on the cutting line; and / or by controlling the relative position of the magnetic element and the cutting line to control the magnitude of the magnetic force exerted by the magnetic element on the cutting line. The specific method can be referred to in the above-mentioned embodiment 1, which will not be repeated here.

[0099] like Fig. 9 In another optional solution of the present application, the step S30 controls the magnetic force of the magnetic part on the cutting line according to the real-time deformation amount, including:

[0100] Step S31', inputting the real-time deformation amount into a preset linear equation to obtain a target value of the magnetic force, wherein the linear equation is a positive linear relationship between the real-time deformation amount and the magnetic force;

[0101] Step S32', controlling the magnetic force of the magnetic component to switch to a target value.

[0102] Specifically, a positive linear relationship between the real-time deformation variable (Δx) and the required magnetic force (F) is pre-fitted through experiments, such as: F=kΔx+b; wherein k is a coefficient and b is a corresponding intercept; then, when cutting, according to the actual real-time deformation variable, the real-time deformation variable Δx1 is used to calculate the target value F1 of the required magnetic force, and then the magnetic force of the magnetic part is adjusted to reach the target value F1.

[0103] It can be understood that the linear regulation adopted in step S31' to step S32' can better match the dynamic characteristics of the actual system, improve control accuracy and reduce errors by establishing a positive linear relationship between the deformation amount and the magnetic force. In addition, the linear regulation also has better compatibility and expansibility.

[0104] In summary, the wire cutting method provided in the third embodiment of the present invention detects the real-time deformation of the cutting line during the cutting process, and controls the magnetic force of the magnetic part on the cutting line according to the real-time deformation feedback, so as to ensure that the cutting line is closer to the target position, reduce the cutting error, improve the cutting accuracy and reduce the production cost.

[0105] The various technical features described above can be combined arbitrarily. Although all possible combinations of these technical features are not described, any combination of these technical features should be considered to be covered by this specification as long as there is no contradiction in such combination.

[0106] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still adjust the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these adjustments or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A cutting line position compensation device, applied to a wire cutting device, wherein the wire cutting device comprises a cutting line, wherein the cutting line is arranged into a cutting line net, wherein the cutting line net comprises a cutting area for contacting a body to be cut, and a non-cutting area located around the cutting area, wherein: The cutting line position compensation device includes at least one magnetic component and a control unit. The magnetic component is arranged in the non-cutting area. The control unit can control the magnetic force of the magnetic component on the cutting line so that the cutting line can be position compensated under the action of the magnetic force.

2. The cutting line position compensation device according to claim 1, characterized in that: There are two non-cutting areas, which are arranged opposite to each other; at least one magnetic member is arranged corresponding to each non-cutting area, and the magnetic members are arranged symmetrically relative to the cutting area.

3. The wire cutting device according to claim 1, characterized in that: There are four non-cutting areas, and the four non-cutting areas are arranged at intervals around the cutting area; At least one magnetic member is disposed corresponding to each non-cutting area, and the magnetic members that are opposite to each other are symmetrically disposed relative to the cutting area.

4. The cutting line position compensation device according to any one of claims 1 to 3, characterized in that: The cutting line position compensation device further comprises a moving mechanism, and the magnetic member is arranged on the moving mechanism; The control unit is electrically connected to the moving mechanism, and the moving mechanism is configured to drive the magnetic member to move closer to or away from the cutting line along the feeding direction of the cutting line to adjust the magnetic force of the magnetic member on the cutting line.

5. The cutting line position compensation device according to claim 4, characterized in that: The moving mechanism can also drive the magnetic member and the cutting line to move closer to or away from the cutting area on the same horizontal plane.

6. A wire cutting device, characterized in that: It comprises the cutting line position compensation device as claimed in any one of claims 1 to 5, and further comprises: a roller group, the outer periphery of which is connected to the cutting line, and the cutting lines are arranged into a cutting line network.

7. The wire cutting device according to claim 6, characterized in that: The roller group includes a first roller and a second roller arranged in pairs; The first roller body comprises a first cross-cutting disc and a second cross-cutting disc, and the first cross-cutting disc and the second cross-cutting disc are respectively connected with first cutting lines parallel to each other; The second roller body comprises a first vertical cutting disc and a second vertical cutting disc, and the first vertical cutting disc and the second vertical cutting disc are respectively connected with second cutting lines parallel to each other; Wherein, the first cutting line and the second cutting line are arranged vertically and crosswise to form the cutting line network; The magnetic members are respectively arranged between the first cutting lines and between the second cutting lines, so as to enable the first cutting lines and the second cutting lines to perform position compensation in a direction of approaching each other.

8. A wire cutting method, which requires the use of the wire cutting device as described in any one of claims 6 to 7, characterized in that: The wire cutting method comprises: Controlling the cutting wire to cut the silicon rod at a preset feeding speed; Acquire the real-time deformation amount of the cutting line relative to the target position during the cutting process; The magnetic force of the magnetic component on the cutting line is adjusted according to the real-time deformation amount, so that the cutting line performs position compensation toward the target position.

9. The wire cutting method according to claim 8, characterized in that: The controlling the cutting line to cut the silicon rod at a preset feeding speed comprises: Along the feeding direction, the feeding speed is controlled to gradually increase and then gradually decrease.

10. The wire cutting method according to claim 9, characterized in that: Acquiring the real-time deformation amount of the cutting line relative to the target position during the cutting process includes: The real-time deformation amount is determined according to the current feeding speed and a preset mapping relationship between the feeding speed and the corresponding deformation amount.

11. The wire cutting method according to any one of claims 8 to 10, characterized in that: The controlling the magnitude of the magnetic force of the magnetic member on the cutting line according to the real-time deformation amount comprises: When the real-time deformation amount is less than a preset first threshold, controlling the magnetic force of the magnetic member on the cutting line to be a first magnetic force; When the real-time deformation amount is between the first threshold value and a preset second threshold value, controlling the magnetic force of the magnetic member on the cutting line to be a second magnetic force; When the real-time deformation amount is greater than the third threshold, the magnitude of the magnetic force exerted by the magnetic member on the cutting line is controlled to be a third magnetic force.

12. The wire cutting method according to any one of claims 8 to 10, characterized in that: The controlling the magnetic force of the magnetic member on the cutting line comprises: By controlling the magnitude of the current input to the magnetic member, the magnitude of the magnetic force exerted by the magnetic member on the cutting line is controlled; and / or The relative position of the magnetic element and the cutting line is controlled to control the magnitude of the magnetic force exerted by the magnetic element on the cutting line.

13. The wire cutting method according to any one of claims 8 to 10, characterized in that: The controlling the magnitude of the magnetic force of the magnetic member on the cutting line according to the real-time deformation amount comprises: Controlling the real-time deformation amount to be input into a preset linear equation to obtain a target value of the magnetic force, wherein the linear equation is a positive linear relationship between the real-time deformation amount and the magnetic force; The magnetic force of the magnetic member is controlled to switch to the target value.

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