An anti-interference infrared detection chip packaging structure

Abstract

The present invention relates to the field of microelectronic packaging technology, and specifically to an anti-interference infrared detection chip packaging structure, comprising a tube shell and a cutting component, wherein the tube shell is connected to an exhaust pipe, and a sealing component is slidably provided inside the exhaust pipe, wherein the sealing component comprises a connecting plate, and two or more partition groups are provided on the connecting plate along the front-to-back direction, and each partition group comprises a partition baffle and a sealing platform, and the partition baffle is sealingly slidably connected to the inner wall of the exhaust pipe, and the sealing platform is located in front of the partition baffle, and there is a gap between the sealing platform and the inner wall of the exhaust pipe, and a sealing groove is provided behind the sealing platform and close to the connecting plate; the cutting component is used to cut and flatten a specific position of the exhaust pipe, and when the exhaust pipe is cut and flattened, the sealing component is pushed to move backward as a whole, so that the end of the exhaust pipe can be inserted into the sealing groove, so that the sealing platform and the end of the exhaust pipe form a seal, and multiple sealing can reduce costs.

Description

Technical Field

[0001] The invention relates to the technical field of microelectronic packaging, and in particular to an anti-interference infrared detection chip packaging structure. Background Art

[0002] Anti-interference infrared detection chips need to work in a vacuum environment. Usually, the chip and other components are vacuum-encapsulated in a tube shell. An oxygen-free copper tube is usually welded on the side wall of the tube shell to connect the inside and outside of the tube shell cavity. During the packaging process, vacuum exhaust is performed through the oxygen-free copper tube, and finally the oxygen-free copper tube is cold-pressed and sheared with a special shearing tool to form a closed and independent high-vacuum device.

[0003] The patent document with announcement number CN102522343B discloses a micro-device vacuum packaging exhaust device and method, which eliminates the exhaust pipe welded on the side wall of the tube shell and instead opens a hole at the bottom of the tube shell for vacuum exhaust, and uses solder with a hollow cylindrical structure for airtight sealing. However, since the chip and other components themselves release a small amount of gas, and there is still a risk of leakage in the welding seal, the vacuum effect of the chip packaging structure cannot be guaranteed. Summary of the invention

[0004] Based on this, it is necessary to provide an anti-interference infrared detection chip packaging structure to address the technical problem that the current vacuum packaging exhaust device cannot ensure the vacuum effect.

[0005] The above purpose is achieved through the following technical solutions:

[0006] An anti-interference infrared detection chip packaging structure, comprising a tube shell and a cutting component, the tube shell is connected to an exhaust pipe, a sealing component is slidably provided inside the exhaust pipe, the sealing component comprises a connecting plate, two or more partition groups are provided on the connecting plate in the front-to-back direction, each partition group comprises a partition baffle and a sealing platform, the partition baffles of the same group are arranged at intervals with the sealing platform, the partition baffle is sealingly slidably connected to the inner wall of the exhaust pipe, and the partition baffle is an elastic plate that can shrink along the radial direction of the exhaust pipe; the sealing platform is located in front of the partition baffle, there is a gap between the sealing platform and the inner wall of the exhaust pipe, and a sealing groove is provided behind the sealing platform and close to the connecting plate;

[0007] The cutting assembly is used to cut and flatten a specific position of the exhaust pipe, and the specific position is located between the partition baffle of each partition group and the sealing platform; when the exhaust pipe is cut and flattened, the sealing assembly is pushed to move backward as a whole, so that the end of the exhaust pipe can be inserted into the sealing groove, thereby forming a seal between the sealing platform and the end of the exhaust pipe.

[0008] Furthermore, the cross-section of the partition baffle is V-shaped, and the V-shaped opening of the partition baffle faces forward.

[0009] Furthermore, the sealing platform is conical, and has a conical surface and a bottom surface, the conical surface is arranged forward, and the sealing groove is arranged on the bottom surface.

[0010] Furthermore, the bottom surface is a conical surface, and the bottom surface is tilted backward from a position away from the connecting plate to a position close to the connecting plate, and the end of the exhaust pipe can slide sealingly along the bottom surface.

[0011] Furthermore, the cutting assembly includes two cutting plates, and the sides of the cutting plates are provided with protrusions, and the protrusions can press the sealing platform along the radial direction of the exhaust pipe to make the rear end of the sealing platform fold.

[0012] Furthermore, sealant is applied between the end of the exhaust pipe and the sealing platform.

[0013] Furthermore, the sealing platform is provided with an air hole at a position close to the inner wall of the exhaust pipe.

[0014] Furthermore, a stop ring is provided at the rear end of the connecting plate, an annular step is provided on the inner wall of the exhaust pipe, and the stop ring is engaged with the annular step.

[0015] Furthermore, the partition baffle, the sealing platform and the connecting plate are integrally formed.

[0016] Furthermore, the partition baffle of the partition group located in the front is arranged in contact with the sealing platform of the partition group located in the rear.

[0017] The beneficial effects of the present invention are:

[0018] The anti-interference infrared detection chip packaging structure provided by the present invention, the negative pressure suction device vacuumizes the inside of the tube shell through the exhaust pipe, and during the suction process, multiple partition baffles will contract radially, so that the gas can smoothly pass through the partition baffles and the sealing platform. When the inside of the tube shell becomes negative pressure, the partition baffles are elastically reset to achieve sliding sealing with the inner wall of the exhaust pipe. At this time, the end of the exhaust pipe is cut off by using a cutting assembly, and then the sealing assembly is pushed to slide backward as a whole, so that the end of the exhaust pipe will enter the sealing groove of the sealing platform, so that the sealing platform forms a seal with the end of the exhaust pipe. Since there are more than two partition groups, when the sealing of the front partition group fails or the gas released in the tube shell is no longer negative pressure, the seal can be re-formed at the rear partition group; thus, the anti-interference infrared detection chip packaging structure can form a seal multiple times, reduce costs, and ensure the vacuum effect in the tube shell.

[0019] Secondly, when the seal between the sealing platform and the end of the exhaust pipe fails, external gas will enter the exhaust pipe, causing positive pressure between the sealing platform and the partition baffle. Since the rear side of the partition baffle is at negative pressure, the sealing assembly as a whole tends to move backward, so that the sealing platform can press the end of the exhaust pipe and slow down the entry of external gas. At the same time, the partition baffle will expand radially, making the partition baffle more closely contact with the inner wall of the exhaust pipe, reducing the backward flow of gas and ensuring the sealing effect.

[0020] Third, a protrusion is provided on the cutting plate, which can squeeze the sealing platform along the radial direction of the exhaust pipe, so that the rear end of the sealing platform is retracted, so that the sealing platform can be pressed tightly against the end of the exhaust pipe to avoid air leakage at the end of the exhaust pipe and further improve the sealing effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A schematic diagram of the three-dimensional structure of an anti-interference infrared detection chip packaging structure provided by an embodiment of the present invention;

[0022] Figure 2 A top view of an anti-interference infrared detection chip packaging structure provided by an embodiment of the present invention;

[0023] Figure 3 for Figure 2 Middle AA section view;

[0024] Figure 4 for Figure 3 The enlarged image at point I in the middle;

[0025] Figure 5 A schematic structural diagram of a sealing component in an anti-interference infrared detection chip packaging structure provided by an embodiment of the present invention;

[0026] Figure 6 A cross-sectional view of an exhaust pipe and a sealing component in an anti-interference infrared detection chip packaging structure provided by an embodiment of the present invention;

[0027] Figure 7 A schematic diagram of an initial working state of an anti-interference infrared detection chip packaging structure provided by an embodiment of the present invention;

[0028] Figure 8 A schematic diagram of a second working state of an anti-interference infrared detection chip packaging structure provided by an embodiment of the present invention;

[0029] Fig. 9 A schematic diagram of a third working state of an anti-interference infrared detection chip packaging structure provided by an embodiment of the present invention;

[0030] Fig.10 A schematic structural diagram of a cut-off component in an anti-interference infrared detection chip packaging structure provided by an embodiment of the present invention;

[0031] Fig.11 A diagram showing the state of the exhaust pipe end being cut and flattened in the anti-interference infrared detection chip packaging structure provided in one embodiment of the present invention.

[0032] in:

[0033] 100, tube shell; 210, exhaust pipe; 212, first closed section; 213, second closed section; 220, connecting plate; 230, partition baffle; 240, sealing platform; 250, sealing groove; 260, air vent; 270, sealant; 280, stop ring; 310, cutting plate; 320, protrusion. DETAILED DESCRIPTION

[0034] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below through embodiments and in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0035] The serial numbers assigned to the components herein, such as "first", "second", etc., are only used to distinguish the objects described and do not have any order or technical meaning. The "connection" and "coupling" mentioned in this application, unless otherwise specified, include direct and indirect connections (couplings). In the description of the present invention, it should be understood that the orientation or position relationship indicated by the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", etc. are based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention.

[0036] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0037] like Figures 1 to 11As shown, an anti-interference infrared detection chip packaging structure provided by an embodiment of the present invention includes a tube shell 100, the tube shell 100 is connected to an exhaust pipe 210, and a sealing component is slidably provided inside the exhaust pipe 210, and the sealing component includes a connecting plate 220, and more than two partition groups are provided on the connecting plate 220 along the front-to-back direction, each partition group includes a partition baffle 230 and a sealing platform 240, and the partition baffles 230 and the sealing platform 240 of the same group are arranged at intervals, the partition baffles 230 are sealingly and slidably connected to the inner wall of the exhaust pipe 210, and the partition baffles 230 are elastic plates, which can shrink along the radial direction of the exhaust pipe 210 when the exhaust pipe 210 is evacuated; the sealing platform 240 is located in front of the partition baffle 230, and there is a gap between the sealing platform 240 and the inner wall of the exhaust pipe 210, and a sealing groove 250 is provided behind the sealing platform 240 and close to the connecting plate 220.

[0038] The anti-interference infrared detection chip packaging structure also includes a cutting component, which is used to cut and flatten a specific position of the exhaust pipe 210, and the specific position is located between the partition baffle 230 of each partition group and the sealing platform 240; when the exhaust pipe 210 is cut and flattened, the sealing component is pushed to move backward as a whole, so that the end of the exhaust pipe 210 can be inserted into the sealing groove 250, so that the sealing platform 240 and the end of the exhaust pipe 210 form a seal. The exhaust pipe 210 is an oxygen-free copper tube.

[0039] In one embodiment, the cross section of the partition baffle 230 is V-shaped, and the V-shaped opening of the partition baffle 230 faces forward. In this embodiment, the partition baffle 230 is two obliquely arranged baffles. In other embodiments, the partition baffle 230 is a conical baffle.

[0040] In one embodiment, the sealing platform 240 is conical, and has a conical surface and a bottom surface. The conical surface is arranged forward, and the sealing groove 250 is arranged on the bottom surface.

[0041] In one embodiment, the bottom surface is a conical surface, and the bottom surface is tilted backward from a position away from the connecting plate 220 to a position close to the connecting plate 220, and the end of the exhaust pipe 210 can slide along the bottom surface in a sealed manner. Figure 4 In the embodiment, the angle α between the bottom surface and the inner wall of the exhaust pipe 210 is less than 90 degrees. In this way, after the end of the exhaust pipe 210 is cut off, the end of the exhaust pipe 210 will be pressed against the bottom surface to prevent external gas from entering the exhaust pipe 210. At the same time, the end of the exhaust pipe 210 will push the sealing platform 240 to slide forward, leaving space for the subsequent backward movement of the sealing platform 240.

[0042] In one embodiment, the cutting assembly includes two cutting plates 310, such as Fig.10As shown, a protrusion 320 is provided on the side of the cutting plate 310, and the protrusion 320 can squeeze the sealing platform 240 along the radial direction of the exhaust pipe 210, so that the rear end of the sealing platform 240 is retracted, so that the sealing platform 240 can be pressed tightly against the end of the exhaust pipe 210 to avoid air leakage at the end of the exhaust pipe 210, thereby further improving the sealing effect.

[0043] In one embodiment, a sealant 270 is applied between the end of the exhaust pipe 210 and the sealing platform 240. Fig.11 As shown, after the end of the exhaust pipe 210 is cut and flattened, it has a first closed section 212 and a second closed section 213. The first closed section 212 is located at both ends of the exhaust pipe 210, thereby pressing the two ends of the exhaust pipe 210 tightly. The second closed section 213 is located in the middle position of the exhaust pipe 210, and the second closed section 213 has an opening, and the connecting plate 220 is located in the opening.

[0044] In one embodiment, the sealing platform 240 is provided with a vent hole 260 near the inner wall of the exhaust pipe 210. In other embodiments, the diameter of the sealing platform 240 is smaller than the diameter of the exhaust pipe 210, so that gas flow is achieved through the gap between the sealing platform 240 and the inner wall of the exhaust pipe 210.

[0045] In one embodiment, a stop ring 280 is provided at the rear end of the connecting plate 220, and an annular step is provided on the inner wall of the exhaust pipe 210, and the stop ring 280 is engaged with the annular step. The stop ring 280 and the annular step can prevent the sealing component from entering the bend of the exhaust pipe 210.

[0046] In one embodiment, the partition baffle 230 , the sealing platform 240 and the connecting plate 220 are integrally formed and are all made of elastic metal materials. In other embodiments, the partition baffle 230 and the sealing platform 240 are both mounted on the connecting plate 220 .

[0047] In one embodiment, the partition baffle 230 of the front partition group is arranged in contact with the sealing platform 240 of the rear partition group. After the partition baffle 230 and the sealing platform 240 are arranged in contact, it is easier to cut in the middle, so that the sealing assembly can be made into different lengths. In other embodiments, there is a certain distance between the partition baffle 230 of the front partition group and the sealing platform 240 of the rear partition group.

[0048] In combination with the above embodiments, the use principle and working process of the anti-interference infrared detection chip packaging structure provided by the embodiment of the present invention are as follows:

[0049] First, insert the sealing assembly into the exhaust pipe 210, and make the stop ring 280 cooperate with the annular step in the exhaust pipe 210 to achieve the positioning of the sealing assembly. Then connect the exhaust pipe 210 to a negative pressure exhaust device (not shown in the figure, belonging to the prior art) to evacuate the inside of the tube shell 100. Figures 7 to 9 As shown, during the suction process, multiple partition baffles 230 will radially contract, so that the gas can smoothly pass through the partition baffles 230 and the air holes 260 of the sealing platform 240. When the pressure inside the tube shell 100 becomes negative, both sides of the partition baffle 230 are negative pressure, and the partition baffle 230 will elastically reset to achieve a sliding seal with the inner wall of the exhaust pipe 210. At this time, the end of the exhaust pipe 210 is cut off by using a cutting assembly, and the end of the exhaust pipe 210 will slide along the bottom surface of the sealing platform 240 to seal the connecting plate 220 until the cutting assembly presses the end of the exhaust pipe 210 against the connecting plate 220. Since the bottom surface of the sealing platform 240 is a conical surface, the end of the exhaust pipe 210 will push the sealing platform 240 to move forward as a whole during this process, providing the sealing platform 240 with a subsequent The sealing assembly is pushed to slide backward as a whole, so that the end of the exhaust pipe 210 enters the sealing groove 250 of the sealing platform 240, so that the sealing platform 240 forms a seal on the end opening of the exhaust pipe 210, and then the cutting assembly is further pressed against the end of the exhaust pipe 210. Since the cutting plate 310 is provided with a protrusion 320, the protrusion 320 can squeeze the sealing platform 240 along the radial direction of the exhaust pipe 210, so that the rear end of the sealing platform 240 is contracted, and then the sealing groove 250 is reduced and pressed against the end of the exhaust pipe 210 to avoid leakage at the end of the exhaust pipe 210. Finally, the sealant 270 is applied to the contact position between the sealing platform 240 and the end of the exhaust pipe 210. When the seal between the sealing platform 240 and the end of the exhaust pipe 210 fails, external gas will enter the exhaust pipe 210, thereby causing positive pressure between the sealing platform 240 and the partition baffle 230. Since the rear side of the partition baffle 230 is at negative pressure, the sealing assembly as a whole tends to move backward, so that the sealing platform 240 can press the end of the exhaust pipe 210 to slow down the entry of external gas. At the same time, the partition baffle 230 will expand radially, so that the partition baffle 230 is in closer contact with the inner wall of the exhaust pipe 210, reducing the backward flow of gas and ensuring the sealing effect of the tube shell 100.

[0050] When the seal of the front partition group fails, for example, the sealant 270 leaks or the released gas in the tube shell 100 no longer maintains a negative pressure state, first remove the sealant 270, and then clamp the sealing platform 240 to drive the sealing component to slide forward along the exhaust pipe 210 as a whole, so that the partition baffle 230 and the adjacent sealing platform 240 at the rear will stretch the flattened end of the exhaust pipe 210 to restore the initial circular state, so that the gas in the tube shell 100 can flow out, and then the sealing component is inserted backward into the exhaust pipe 210 again, and cooperates with the annular step stop in the exhaust pipe 210, and the tube shell 100 is vacuumed again by the negative pressure exhaust device, and the exhaust pipe 210 corresponding to the adjacent rear partition group is cut off by the cutting component and pressed tightly in the connection. On the connecting plate 220, the end of the exhaust pipe 210 will push the sealing assembly forward as a whole again. When the end of the exhaust pipe 210 corresponds to the position of the sealing groove 250, the sealing assembly will be pushed to slide backward as a whole, so that the end of the exhaust pipe 210 will enter the sealing groove 250 of the adjacent rear sealing platform 240 again, and the end of the exhaust pipe 210 will be sealed again. Finally, the cutting assembly will press the end of the exhaust pipe 210 again, so that the rear end of the sealing platform 240 will be closed to press the end of the exhaust pipe 210 to prevent the end of the exhaust pipe 210 from leaking. Then, the excess sealing platform 240 and the partition baffle 230 will be cut off, and finally the sealing platform 240 and the end of the exhaust pipe 210 will be coated with sealant 270. Since multiple partition groups are provided, the anti-interference infrared detection chip packaging structure can form a seal multiple times, reduce costs, and ensure the vacuum effect in the tube shell 100.

[0051] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0052] The above-described embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the present invention. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the attached claims.

Claims

1. An anti-interference infrared detection chip packaging structure, characterized in that: It comprises a tube shell and a cutting assembly, the tube shell is connected to an exhaust pipe, a sealing assembly is slidably provided inside the exhaust pipe, the sealing assembly comprises a connecting plate, two or more partition groups are provided on the connecting plate in the front-to-back direction, each partition group comprises a partition baffle and a sealing platform, the partition baffles of the same group are arranged at intervals with the sealing platform, the partition baffle is sealingly slidably connected with the inner wall of the exhaust pipe, and the partition baffle is an elastic plate that can shrink along the radial direction of the exhaust pipe; the sealing platform is located in front of the partition baffle, there is a gap between the sealing platform and the inner wall of the exhaust pipe, and a sealing groove is provided behind the sealing platform and close to the connecting plate; The cutting assembly is used to cut and flatten a specific position of the exhaust pipe, and the specific position is located between the partition baffle and the sealing platform of each partition group; when the exhaust pipe is cut and flattened, the sealing assembly is pushed to move backward as a whole, so that the end of the exhaust pipe can be inserted into the sealing groove, so that the sealing platform and the end of the exhaust pipe form a seal, and the cutting assembly includes two cutting plates, and the side of the cutting plate is provided with a protrusion, and the protrusion can squeeze the sealing platform along the radial direction of the exhaust pipe, so that the rear end of the sealing platform is retracted.

2. The anti-interference infrared detection chip packaging structure according to claim 1 is characterized in that: The cross section of the partition baffle is V-shaped, and the V-shaped opening of the partition baffle faces forward.

3. The anti-interference infrared detection chip packaging structure according to claim 2 is characterized in that: The sealing platform is conical and has a conical surface and a bottom surface. The conical surface is arranged forward, and the sealing groove is arranged on the bottom surface.

4. The anti-interference infrared detection chip packaging structure according to claim 3 is characterized in that: The bottom surface is a conical surface, and the bottom surface is tilted backward from a position away from the connecting plate to a position close to the connecting plate, and the end of the exhaust pipe can slide along the bottom surface in a sealing manner.

5. The anti-interference infrared detection chip packaging structure according to claim 1 is characterized in that: Sealant is applied between the end of the exhaust pipe and the sealing platform.

6. The anti-interference infrared detection chip packaging structure according to claim 1 is characterized in that: The sealing platform is provided with an air hole at a position close to the inner wall of the exhaust pipe.

7. The anti-interference infrared detection chip packaging structure according to claim 1 is characterized in that: A stop ring is provided at the rear end of the connecting plate, and an annular step is provided on the inner wall of the exhaust pipe. The stop ring is stop-matched with the annular step.

8. The anti-interference infrared detection chip packaging structure according to claim 1 is characterized in that: The partition baffle, the sealing platform and the connecting plate are integrally formed.

9. The anti-interference infrared detection chip packaging structure according to claim 1, characterized in that: The partition baffle of the partition group located in the front is arranged in contact with the sealing platform of the partition group located in the rear.

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