Heat dissipation device for electronic component, power converter and vehicle

Abstract

The present disclosure relates to a heat dissipation device for an electronic component connected to a printed circuit board, the heat dissipation device comprising: a heat dissipation part arranged on a first side of the printed circuit board to which the electronic component is connected; a pressing member disposed on a second side of the printed circuit board opposite to the first side, passing through the printed circuit board, and contacting the electronic component; and a pressing plate arranged such that the pressing member is located between the pressing plate and the printed circuit board, the pressing plate being connected to the fixing structure to apply a pressure toward the heat dissipation member to the electronic component through the pressing member. The invention further provides a power converter comprising the heat dissipation device and a vehicle comprising the power converter.

Description

Technical Field

[0001] The present disclosure relates to a heat dissipation device for electronic components, and in particular to a heat dissipation device for electronic components used in an AC-DC converter or a DC-AC converter or a DC-DC converter equipped in a vehicle, ensuring good thermal contact between the heat dissipation device and the electronic components. Background Art

[0002] The operating temperature of electronic components directly affects their own reliability. For example, in the power conversion circuit of an AC-DC converter or a DC-AC converter or a DC-DC converter, power semiconductor devices play an important role, and their working state directly affects the reliability of the entire device. During use, power semiconductor devices consume part of their energy and convert it into heat, causing the power semiconductor devices to heat up and the junction temperature to rise. When the junction temperature exceeds the safety threshold, the current will increase sharply and even cause the transistor to burn out. Therefore, it is necessary to use a heat sink to quickly release the heat to the surrounding environment to reduce the operating temperature of the electronic components. To ensure the stable operation of the heat sink, it is necessary to maintain good thermal contact between the heat sink and the electronic components.

[0003] It is known in the prior art to dissipate heat from electronic components by dissipating heat from a printed circuit board. Specifically, the exposed metal pads of the electronic components are mounted to the copper-clad area on one side of the printed circuit board, and the other side of the printed circuit board is mounted to the heat dissipation component, so that the heat of the electronic components is transmitted through the printed circuit board. This heat dissipation design requires trimming a large amount of space on the printed circuit board to place the electronic components, which reduces the area on the printed circuit board for current to pass through and increases the ineffective area of ​​the printed circuit board. If the area occupied by the printed circuit board is large, the electronic components need to be placed on the edge of the printed circuit board, which limits the freedom of the printed circuit board layout and cannot meet the diverse needs of customers. Summary of the invention

[0004] The purpose of the present disclosure is to provide a heat dissipation device for electronic components, thereby at least overcoming the above-mentioned defects of the prior art. The heat dissipation device allows for a higher degree of design freedom in the layout of a printed circuit board, which is conducive to the reasonable arrangement of electronic components in the printed circuit board according to different design requirements. Moreover, the heat dissipation device provided by the present disclosure occupies less space on the printed circuit board, and only a few small holes need to be drilled on the printed circuit board for the pressing component to pass through, which saves space on the printed circuit board and improves the utilization rate of the printed circuit board.

[0005] At least one embodiment of the present disclosure provides a heat dissipation device for an electronic component, wherein the electronic component is connected to a printed circuit board, and the heat dissipation device includes: a heat dissipation component, which is arranged on a first side of the printed circuit board to which the electronic component is connected; a pressing component, which is arranged on a second side of the printed circuit board opposite to the first side, and passes through the printed circuit board to contact the electronic component; a pressing plate, which is arranged so that the pressing component is located between the pressing plate and the printed circuit board, and the pressing plate is connected to a fixed structure so as to apply pressure to the electronic component toward the heat dissipation component through the pressing component.

[0006] In the heat dissipation device provided in at least one embodiment of the present disclosure, the pressing component includes at least one elastic element and an element bracket, and at least one cavity is provided in the element bracket to accommodate the elastic element.

[0007] In the heat dissipation device provided in at least one embodiment of the present disclosure, at least one protrusion is formed at the bottom of the cavity toward the printed circuit board, the protrusion passes through the printed circuit board and contacts the electronic component, and the shape of the cavity matches the shape of the elastic element.

[0008] In the heat dissipation device provided in at least one embodiment of the present disclosure, the pressure plate includes a first positioning structure for cooperating with a second positioning structure of the component bracket.

[0009] In the heat dissipation device provided in at least one embodiment of the present disclosure, the first positioning structure includes a receiving portion in the pressure plate, and the second positioning structure includes a protrusion arranged on the element bracket and extending toward the pressure plate, and at least a portion of the protrusion is constructed to be received in the receiving portion of the pressure plate.

[0010] In the heat dissipation device provided by at least one embodiment of the present disclosure, the protrusion includes a hook-shaped portion, and the hook-shaped portion passes through the receiving portion and abuts against the pressing plate.

[0011] In the heat dissipation device provided by at least one embodiment of the present disclosure, the fixing structure is a part of the heat dissipation component or a part of the printed circuit board.

[0012] In the heat dissipation device provided by at least one embodiment of the present disclosure, the pressure plate is connected to the fixing structure by fasteners.

[0013] In the heat dissipation device provided in at least one embodiment of the present disclosure, the elastic element includes a spring.

[0014] In the heat dissipation device provided in at least one embodiment of the present disclosure, the pressure plate includes a side wall extending toward the electronic component to form a cavity with the bottom of the pressure plate to accommodate at least a portion of the pressing component, and the outer side surface of the component bracket includes a protrusion to fit tightly with the inner surface of the side wall.

[0015] At least one embodiment of the present disclosure provides a heat dissipation device further comprising an electrical insulation sheet, which is arranged between the heat dissipation component and the electronic element.

[0016] In the heat dissipation device provided in at least one embodiment of the present disclosure, the electronic component includes a MOSFET.

[0017] Another embodiment of the present disclosure further provides a power converter, which is an AC-DC converter or a DC-AC converter or a DC-DC converter, and the power converter includes the heat dissipation device provided by at least one embodiment of the present disclosure.

[0018] In another embodiment of the present disclosure, a power converter is provided, wherein the power converter has a housing, and wherein the fixing structure is a part of the housing, or the fixing structure is a part of a heat dissipation component and the heat dissipation component is connected to the housing.

[0019] Yet another embodiment of the present disclosure provides a vehicle, which includes the power converter provided by at least one embodiment of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings without creative work. The following drawings are not deliberately scaled according to the actual size, and the focus is on illustrating the main purpose of the present disclosure.

[0021] Figure 1 A cross-sectional view of a heat dissipation device for electronic components provided according to at least one embodiment of the present disclosure;

[0022] Figure 2 A schematic diagram of the structure of a pressing component provided according to at least one embodiment of the present disclosure;

[0023] Figure 3 A schematic structural diagram of a heat dissipation device for electronic components provided according to at least one embodiment of the present disclosure;

[0024] Figure 4 A schematic diagram of installing a heat dissipation device and an electronic component according to at least one embodiment of the present disclosure;

[0025] Figure 5 A schematic diagram of the installation of another heat dissipation device and electronic components provided according to at least one embodiment of the present disclosure.

[0026] Throughout the drawings, the same or similar components are indicated by the same reference numerals. DETAILED DESCRIPTION

[0027] In order to make the objectives, technical solutions and advantages of the embodiments of the present disclosure more clear, the technical solutions of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure.

[0028] Unless otherwise defined, the technical terms or scientific terms used herein shall have the usual meanings understood by ordinary technicians in the field to which the present disclosure belongs. Similar words such as "one", "an" or "the" used in the patent application specification and claims of the present disclosure do not indicate a quantitative limitation, but rather indicate the presence of at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect.

[0029] For the convenience of description, the drawings of the present disclosure simplify or omit components commonly used in the art, such as external connection lines and other components not related to the description of the present disclosure. These omitted or simplified components do not affect the understanding of the content of the present disclosure by those skilled in the art.

[0030] Figure 1 A heat dissipation device for an electronic component 1 according to the present disclosure is shown. The electronic component 1 is a circuit component of an electronic device. In some embodiments, the electronic device is, for example, an on-board AC-DC converter or a DC-AC converter or a DC-DC converter, which are often accompanied by a large amount of heat generated by high current during operation. However, it should be understood that the heat dissipation device according to the present disclosure can also be applied to other industrial fields including consumer electronics, household appliances, engineering machinery, electrical equipment, etc.

[0031] like Figure 1 As shown, at least one electronic component 1 is electrically connected to the printed circuit board 3, for example, via pins. Figure 1 In the embodiment, the number of electronic components 1 is, for example, 4. The electronic component 1 is, for example, a power semiconductor device, such as a MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), which consumes a portion of energy during use and converts it into a large amount of heat, causing the electronic component 1 to heat up and the junction temperature to rise. To this end, at least one electronic component 1 is equipped with a heat dissipation device, as described in detail below.

[0032] The heat dissipation device includes a heat dissipation component 20, also called a heat sink, which is arranged on the first side of the printed circuit board 3 connected to the electronic component 1. Different from the heat dissipation through the printed circuit board in the prior art, in the embodiment of the present disclosure, the heat dissipation of the electronic component is not carried out by bonding to the printed circuit board. Specifically, one side of the electronic component 1 is mounted on the printed circuit board 3, and the other side exposes the lead frame of the electronic component 1 and is bonded to the heat dissipation component 20. The heat dissipation component 20 can exchange heat with the electronic component 1 and absorb the heat generated by the electronic component 1 during operation, thereby reducing the temperature of the electronic component 1. In some embodiments, the heat dissipation component 20 is formed as a shell ( Figure 1 In some other embodiments, the heat dissipation component 20 is a separate component from the housing.

[0033] The heat dissipation device may include an electrical insulation sheet 10 disposed between the heat dissipation member 20 and the electronic component 1 to facilitate heat exchange between the heat dissipation member 20 and the electronic component 1 .

[0034] like Figure 1 As shown, the heat dissipation device further includes a pressing component 30 and a pressing plate 40, wherein the pressing component 30 is arranged on a second side of the printed circuit board 3 opposite to the first side, and passes through the printed circuit board 3 to contact the electronic component 1. The pressing plate 40 is arranged so that the pressing component 30 is located between the pressing plate 40 and the printed circuit board 3, and the pressing plate 40 is connected to the fixing structure so as to apply pressure toward the heat dissipation component to the electronic component 1 through the pressing component 30.

[0035] Figure 2 A schematic structural diagram of a pressing component 30 provided in at least one embodiment of the present disclosure is shown.

[0036] like Figure 2 As shown, the pressing component 30 includes at least one elastic element 50 and an element support 60. Figure 2 In the embodiment, the number of the elastic elements 50 is, for example, 4, corresponding to the number of the electronic components 1, that is, each elastic element 50 corresponds to one electronic component 1. The component holder 60 is provided with at least one (for example, 4) cavity to accommodate the elastic element 50, and the bottom of the cavity forms at least one (for example, 4) protrusions 70 toward the printed circuit board 3, and the protrusions 70 pass through the printed circuit board 3 and contact the electronic component 1 to apply pressure to the electronic component 1 toward the heat dissipation component 20.

[0037] According to the configuration disclosed herein, it is possible to avoid directly applying rigid force to the electronic component, and prevent the electronic component from being damaged by local concentrated strain. In addition, since the pressure plate is connected to the fixed structure, the elastic element can still apply sufficient elastic force to the electronic component 1 over time, thereby forming a stable and reliable thermal contact between the electronic component and the heat dissipation component.

[0038] Using the component holder 60 has the following advantages: first, the component holder 60 can even out the force applied by the elastic element 50 to the electronic component 1 ; second, the component holder 60 is made of insulating material, which can play a role in insulation between the electronic component 1 and the elastic element 50 .

[0039] For example, in some embodiments of the present disclosure, the elastic element 50 is a spring, which is made of metal material, for example.

[0040] The price of ordinary springs is low, and there is no need to develop special spring forming molds, which saves costs. In addition, the springs have good mechanical strength and can well meet the fatigue strength requirements of motor vehicles.

[0041] It should be noted that the spring is only an example, and the elastic element 50 may also be a spring sheet, etc. The present disclosure does not limit the elastic element 50.

[0042] For example, in some embodiments of the present disclosure, the shape of the cavity matches the shape of the elastic element 50. For example, the cavity is a cylinder, and the cross section of the protrusion 70 is a circle.

[0043] It should be noted that the shapes of the above cavity and protrusion are merely examples. The cavity is designed to be cylindrical and the cross-section of the protrusion is circular in order to adapt to the shape of the elastic element, and the present disclosure does not impose any limitation on this.

[0044] In the present disclosure, the protrusion 70 passes through the printed circuit board 3 to apply pressure to the electronic component 1, thereby applying pressure to the heat dissipation component 20. Since the cross-section of the protrusion 70 is circular, only a few circular through holes need to be drilled on the printed circuit board 3 for the protrusion 70 to pass through, which saves space on the printed circuit board 3 and improves the utilization rate of the printed circuit board 3.

[0045] like Figure 2 As shown, the element support 60 also has 6 trapezoidal protrusions and 2 bullet-shaped protrusions, which will be Figure 3 Detailed description is given in .

[0046] like Figure 2 As shown, the outer side surface of the element bracket 60 includes a plurality of vertical protrusions 62 , and the present disclosure does not limit the shape and number of the vertical protrusions.

[0047] For example, in some embodiments of the present disclosure, the pressing plate 40 includes a first positioning structure 41, which is used to cooperate with the second positioning structure 61 of the component bracket 60. As a result, the elastic element 50 can be held in place and compressed between the pressing plate 40 and the electronic component 1, thereby applying a stable elastic force to the electronic component 1, thereby ensuring good thermal contact between the electronic component 1 and the heat dissipation component 20. In addition, the cooperation of the first positioning structure 41 and the second positioning structure 61 also makes it easier to assemble the elastic element 50 and the pressing plate 40.

[0048] For example, Figure 3 As shown, the first positioning structure 41 includes a receiving portion in the pressing plate 40, and the second positioning structure 61 includes a protrusion arranged on the element support 60 and facing the pressing plate 40, and at least a part of the protrusion is configured to be received in the receiving portion of the pressing plate 40. The second positioning structure 61 may include a trapezoidal protrusion or a bullet-shaped protrusion or both. The trapezoidal protrusion includes a hook-shaped portion, which passes through the receiving portion and abuts against the pressing plate 40, thereby playing a fixing role. The bullet-shaped protrusion can cooperate with the receiving portion of the pressing plate 40 to play a positioning role. As a result, the position of the elastic element 50 can be maintained relative to the pressing plate 40. Since the pressing plate 40 is fixed relative to the housing or the heat dissipation component 20, the elastic element 50 is not easy to move relative to the heat dissipation component 20, so that a stable force can be applied to the electronic component 1.

[0049] For example, Figure 3 As shown, the pressing plate 40 may include a side wall 42 extending toward the electronic component 1 to form a cavity with the bottom of the pressing plate 40 to accommodate at least a portion of the pressing component 30. The specific structure of the side wall 42 can also be referred to Figure 4 and Figure 5 .

[0050] The side wall 42 of the pressing plate 40 can fit tightly with the vertical protrusion 62 on the outer side of the element bracket 60, thereby preventing the element bracket 60 from shaking.

[0051] For example, in some embodiments of the present disclosure, the pressing plate 40 is made of metal, such as 301 stainless steel.

[0052] In some embodiments, the fixing structure may be a part of the printed circuit board 3 , ie, the pressing plate 40 is connected to a part of the printed circuit board 3 .

[0053] In some embodiments, the fixing structure may be a part of a housing of the electronic device, ie, a part of the housing to which the pressure plate 40 is connected.

[0054] In some embodiments, the fixing structure may be part of the heat dissipation component 20 , and the heat dissipation component 20 may be connected to a housing of the electronic device, that is, the pressure plate 40 is connected to a part of the heat dissipation component 20 and the heat dissipation component 20 is connected to the housing.

[0055] The fixing structure is a part of the housing of the electronic device or the fixing structure is a part of the heat dissipation component, and the heat dissipation component can be connected to the housing of the electronic device. In both configurations, the pressure plate 40 is directly or indirectly fixed to the housing of the electronic device. This is particularly advantageous when the electronic device is a vehicle-mounted electronic device, such as a vehicle-mounted AC-DC converter or a DC-AC converter or a DC-DC converter. The operation of the vehicle is accompanied by vibrations of the vehicle-mounted electronic device, and this vibration may cause the thermal contact between the electronic component 1 and the heat dissipation component 20 to loosen, thereby weakening the heat dissipation effect. The pressure plate 40 is directly or indirectly fixed to the housing of the electronic device to make the positioning of the pressure plate more secure, thereby resisting the adverse effects of vibration on thermal contact.

[0056] The heat dissipation device provided by the present disclosure allows for a higher degree of freedom in the design of the printed circuit board layout. The present disclosure does not restrict electronic components to a specified position, which is conducive to the reasonable arrangement of electronic components in the printed circuit board according to different design requirements. Moreover, the present disclosure occupies less space on the printed circuit board, and only a few small holes need to be drilled on the printed circuit board for the pressing component to pass through, which saves space on the printed circuit board and improves the utilization rate of the printed circuit board.

[0057] Figure 4 and Figure 5 The following is a schematic diagram of the installation of the heat dissipation device and electronic components provided by the present invention. Figure 4 and Figure 5 As shown, in order from bottom to top, there are the heat dissipation component 20, the electrical insulation sheet 10, the electronic component 1, the pressing component 30 (including the elastic component 50 and the component bracket 60), and the pressing plate 40.

[0058] In some embodiments, the pressure plate 40 is fastened to a fixed structure. A substantially permanent connection (e.g., a welded connection, an adhesive, a riveted connection, etc.) or a removable connection using one or more fasteners (e.g., a screw, a bolt, a snap-fit ​​connection, etc.) may be used. Figure 4 As shown, the pressure plate 40 is fixed to the fixed structure by bolts 80, such as Figure 5 As shown, the pressing plate 40 is fixed to the fixing structure by means of screws 90 , and the force applied by the pressing component 30 to the electronic component 1 can be adjusted by adjusting the bolts 80 or the screws 90 .

[0059] At least one embodiment of the present disclosure further provides a power converter, the power converter including an AC-DC converter or a DC-AC converter or a DC-DC converter, the power converter including the heat dissipation device provided by at least one embodiment of the present disclosure.

[0060] For example, in a power converter provided in at least one embodiment of the present disclosure, the power converter has a housing, and wherein the fixing structure is a part of the housing, or the fixing structure is a part of the heat dissipation component 20 and the heat dissipation component 20 is connected to the housing.

[0061] At least one embodiment of the present disclosure further provides a vehicle, which includes a power converter provided by at least one embodiment of the present disclosure. The vehicle may be an electrified vehicle, such as a battery electric vehicle (BEV), a hybrid electric vehicle (HEV), a plug-in hybrid electric vehicle (PHEV), an extended range electric vehicle (Range extended EV), or a fuel cell vehicle (FCEV). The vehicle may also be a hydrogen energy vehicle.

[0062] Certain features, structures or characteristics in one or more embodiments of the present disclosure may be appropriately combined.

[0063] The above is an explanation of the present disclosure and should not be considered as a limitation thereof. Although several exemplary embodiments of the present disclosure are described, it will be readily appreciated by those skilled in the art that many modifications may be made to the exemplary embodiments without departing from the novel teachings and advantages of the present disclosure. Therefore, all such modifications are intended to be included within the scope of the present disclosure as defined in the claims. It should be understood that the above is an explanation of the present disclosure and the present disclosure should not be considered to be limited to the specific embodiments disclosed, and modifications to the disclosed embodiments and other embodiments are intended to be included within the scope of the present disclosure.

Claims

1. A heat dissipation device for an electronic component (1), wherein: The electronic component (1) is connected to a printed circuit board (3), and the heat dissipation device comprises: a heat dissipation component (20) arranged on a first side of the printed circuit board (3) to which the electronic component (1) is connected; A pressing component (30) arranged on a second side of the printed circuit board (3) opposite to the first side, and passing through the printed circuit board (3) to contact the electronic component (1); A pressure plate (40) is arranged such that the pressing component (30) is located between the pressure plate (40) and the printed circuit board (3), and the pressure plate (40) is connected to a fixed structure so as to apply pressure to the electronic component (1) toward the heat dissipation component (20) through the pressing component (30).

2. The heat dissipation device according to claim 1, wherein: The pressing component (30) comprises at least one elastic element (50) and an element support (60), and at least one cavity is provided in the element support (60) to accommodate the elastic element (50).

3. The heat dissipation device according to claim 2, wherein: At least one protrusion (70) is formed at the bottom of the cavity toward the printed circuit board (3); the protrusion (70) passes through the printed circuit board (3) and contacts the electronic component (1); and the shape of the cavity matches the shape of the elastic element (50).

4. The heat dissipation device according to claim 3, wherein: The pressing plate (40) comprises a first positioning structure (41) for cooperating with a second positioning structure (61) of the element support (60).

5. The heat dissipation device according to claim 4, wherein: The first positioning structure (41) includes a receiving portion in the pressure plate (40), and the second positioning structure (61) includes a protrusion arranged on the element support (60) and extending toward the pressure plate (40), and at least a portion of the protrusion is constructed to be received in the receiving portion of the pressure plate (40).

6. The heat dissipation device according to claim 5, wherein: The protrusion includes a hook-shaped portion, which passes through the receiving portion and abuts against the pressing plate (40).

7. The heat dissipation device according to any one of claims 1 to 6, wherein: The fixing structure is a part of the heat dissipation component (20) or a part of the printed circuit board (3).

8. The heat dissipation device according to any one of claims 1 to 6, wherein: The pressure plate (40) is connected to the fixed structure by fasteners.

9. The heat dissipation device according to any one of claims 2 to 6, wherein: The elastic element (50) comprises a spring.

10. The heat dissipation device according to any one of claims 2 to 6, wherein: The pressing plate (40) comprises a side wall (42) extending toward the electronic component (1) to form a cavity with the bottom of the pressing plate (40) so as to accommodate at least a portion of the pressing component (30). The outer side surface of the element support (60) includes a protrusion (62) so as to fit tightly with the inner surface of the side wall (42).

11. The heat dissipation device according to any one of claims 1 to 6, further comprising an electrical insulation sheet (10), wherein the electrical insulation sheet (10) is arranged between the heat dissipation component (20) and the electronic component (1).

12. The heat dissipation device according to any one of claims 1 to 6, wherein: The electronic component (1) is a MOSFET.

13. A power converter, wherein the power converter is an AC-DC converter, a DC-AC converter, or a DC-DC converter, and the power converter comprises the heat dissipation device according to any one of claims 1 to 12.

14. The power converter according to claim 13, wherein: The power converter has a housing, and wherein the fixing structure is a part of the housing, or the fixing structure is a part of the heat dissipation component (20) and the heat dissipation component (20) is connected to the housing.

15. A vehicle comprising a power converter as claimed in claim 13 or 14.

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