Back lining material, back lining assembly, transducer, ultrasonic probe and preparation method

Abstract

According to the backing material, the backing assembly, the transducer, the ultrasonic probe and the preparation method, the backing material comprises the heat-conducting silica gel foam and the rubber condensate, the heat-conducting silica gel foam is provided with the multiple hole structures, and the hole structures of the heat-conducting silica gel foam are filled with part of the rubber condensate; at least part of the surface of the heat-conducting silica gel foam is wrapped with the remaining cured rubber. The heat-conducting silica gel foam can improve the heat-conducting property of the backing material, and the cured rubber filled in the pore structure of the heat-conducting silica gel foam and the cured rubber wrapped on at least part of the surface of the heat-conducting silica gel foam can improve the sound attenuation property of the backing material. Meanwhile, the acoustic impedance of the backing material is reduced by the heat-conducting silica gel foam and the cured rubber, so that the sensitivity of the ultrasonic probe comprising the backing material is improved. Therefore, the backing material has relatively high sound attenuation and heat conduction performance, also has relatively low impedance, and can be used for a transducer with curvature.

Description

Technical Field

[0001] The present invention relates to the technical field of transducers, and in particular to a backing material, a backing assembly, a transducer, an ultrasonic probe and a preparation method. Background Art

[0002] A transducer is a signal converter that converts electrical signals into ultrasonic waves, and can also convert received ultrasonic reverse signals into electrical signals. It is widely used in the field of ultrasonic diagnosis. The transducer chip generates heat during the signal conversion process, causing the transducer temperature to rise. The temperature rise affects the performance and life of the transducer. Therefore, effectively dissipating the heat generated by the chip in the transducer is one of the key factors in maintaining the performance and life of the transducer.

[0003] The backing component, which accounts for a relatively large volume in the transducer, is one of the main ways for the transducer to dissipate heat. At present, among the methods for improving the thermal conductivity of the backing component, adding thermally conductive fillers during the preparation of the backing component is a simple and convenient operation method. However, the thermal conductivity can only be effectively improved when the volume content of the filler accounts for a large proportion, which in turn causes the material density and hardness to increase. The method of adding thermally conductive fillers to improve the thermal conductivity of the backing component leads to an increase in the impedance of the transducer backing component, a decrease in flexibility, and an increase in hardness. For a transducer with a certain curvature, the increased hardness of the backing component makes the preparation of the transducer more difficult, and the increased impedance leads to a decrease in the sensitivity of the transducer.

[0004] Therefore, how to provide a backing assembly suitable for a transducer with curvature is a problem that needs to be solved urgently. Summary of the invention

[0005] Based on this, it is necessary to provide a backing material, a backing assembly, a transducer, an ultrasonic probe and a preparation method suitable for a transducer with a curvature radius.

[0006] An embodiment provides a backing material, comprising a thermally conductive silicone foam and a rubber solidified material, wherein the thermally conductive silicone foam has a plurality of pore structures, a portion of the rubber solidified material is filled in the pore structure of the thermally conductive silicone foam, and the remaining rubber solidified material is wrapped on at least a portion of the surface of the thermally conductive silicone foam.

[0007] In some embodiments, the volume ratio of the thermally conductive silicone foam to the rubber solidification material is 1:(1.75-1.8).

[0008] In some embodiments, the porosity of the thermally conductive silicone foam is 55%-65%; and / or

[0009] The pore structure of the thermally conductive silicone foam has a pore size of 2 mm to 9 mm.

[0010] In some embodiments, the rubber cured product is formed by reacting rubber or a rubber derivative with a curing agent;

[0011] Optionally, the mass ratio of the rubber or the rubber derivative to the curing agent is (9-11):1;

[0012] Optionally, the rubber includes one or more of natural rubber, styrene-butadiene rubber, chloroprene rubber, ethylene-propylene rubber, fluororubber, nitrile rubber, silicone rubber and polyurethane rubber;

[0013] Optionally, the rubber derivative is formed by grafting the rubber with at least one of epoxy, hydroxyl and carboxyl groups;

[0014] Optionally, the curing agent includes one or more of peroxide, sulfur, metal oxide, thiol and amine compounds.

[0015] In some embodiments, the backing material further comprises an auxiliary agent, wherein the auxiliary agent comprises one or more of a defoaming agent and a silane coupling agent, and the auxiliary agent is dispersed in the rubber cured product;

[0016] Optionally, the defoamer includes one or more of a silicon-based defoamer, a mineral oil defoamer, and an alcohol defoamer;

[0017] Optionally, the silane coupling agent includes one or more of an aminosilane coupling agent, an epoxysilane coupling agent, a vinylsilane coupling agent, and a methacryloxysilane coupling agent;

[0018] Optionally, the mass ratio of the defoaming agent to the rubber solidified material is (0.03-0.06):11;

[0019] Optionally, the mass ratio of the silane coupling agent to the rubber cured product is (0.03-0.06):11.

[0020] An embodiment provides a method for preparing a backing material, comprising the following steps:

[0021] The backing material is prepared by infiltrating the thermally conductive silicone foam with a liquid containing rubber and a curing agent and then curing the foam; or

[0022] The backing material is prepared by infiltrating the thermally conductive silicone foam with a liquid containing a rubber derivative and a curing agent and then performing a curing treatment;

[0023] The backing material includes thermally conductive silicone foam and rubber curing material, wherein the thermally conductive silicone foam has a plurality of pore structures, part of the rubber curing material is filled in the pore structure of the thermally conductive silicone foam, and the remaining rubber curing material is wrapped on at least part of the surface of the thermally conductive silicone foam.

[0024] In some embodiments, the mass ratio of the rubber or the rubber derivative to the curing agent is (9-11):1.

[0025] In some embodiments, the curing treatment is performed at a temperature of 80° C.-100° C. and for a time of 4 h-5 h.

[0026] An embodiment provides a backing assembly, which is formed by the above-mentioned backing material or the backing material prepared by the above-mentioned preparation method.

[0027] An embodiment provides a method for preparing a backing assembly, the method comprising: cutting the backing material described above based on a target size or using the backing material prepared by the method for preparing the backing material described above to prepare the backing assembly.

[0028] An embodiment provides a transducer, comprising the above-mentioned backing assembly or a backing assembly prepared by the above-mentioned method for preparing the backing assembly.

[0029] In some embodiments, the transducer includes one or more of a convex array transducer and a circular array transducer.

[0030] An ultrasonic probe provided by one embodiment includes the above-mentioned transducer.

[0031] An ultrasonic imaging device provided in one embodiment includes the ultrasonic probe mentioned above.

[0032] In the backing material provided above, the thermally conductive silicone foam can improve the thermal conductivity of the backing material, and the rubber cured material filled in the pore structure of the thermally conductive silicone foam and the rubber cured material wrapped on at least part of the surface of the thermally conductive silicone foam can increase the acoustic attenuation performance of the backing material. At the same time, the thermally conductive silicone foam and the rubber cured material reduce the acoustic impedance of the backing material, thereby improving the sensitivity of the ultrasonic probe containing the backing material. In addition, the hardness of the backing material is reduced, the flexibility is good, it can be applied to transducers with different curvatures, and the processing technology is simple. In summary, the backing material has high acoustic attenuation and thermal conductivity, and at the same time has low impedance, and can be used for transducers with curvature. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions in the embodiments of the present application and to more completely understand the present application and its beneficial effects, the following is a brief introduction to the drawings required for the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present application, and those skilled in the art can obtain other drawings based on these drawings without creative work.

[0034] Figure 1 A schematic diagram of using a backing material for a transducer is provided in accordance with one embodiment. DETAILED DESCRIPTION

[0035] For ease of understanding of the present invention, the present invention will be described more fully below with reference to embodiment.Preferred embodiments of the present invention are given below.But the present invention can be implemented in many different forms and is not limited to the embodiments described herein.On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0036] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0037] The terms "and / or", "or / and", and "and / or" used herein include any one of two or more related listed items, and also include any and all combinations of the related listed items, wherein the any and all combinations include any combination of two related listed items, any more related listed items, or all related listed items. It should be noted that when at least three items are connected by at least two conjunctions selected from "and / or", "or / and", and "and / or", it should be understood that in the present application, the technical solution undoubtedly includes technical solutions connected by "logical and", and also undoubtedly includes technical solutions connected by "logical or".

[0038] In the present application, the technical features described in an open manner include closed technical solutions composed of the listed features, and also include open technical solutions containing the listed features.

[0039] In this application, when it comes to numerical ranges, unless otherwise specified, the above numerical ranges are deemed to be continuous and include the minimum and maximum values ​​of the range, as well as each value between such minimum and maximum values. Further, when a range refers to an integer, each integer between the minimum and maximum values ​​of the range is included. In addition, when multiple ranges are provided to describe features or characteristics, the ranges can be merged. In other words, unless otherwise specified, all ranges disclosed herein should be understood to include any and all subranges included therein.

[0040] Only some numerical ranges are specifically disclosed herein. However, any lower limit can be combined with any upper limit to form an unspecified range; and any lower limit can be combined with other lower limits to form an unspecified range, and likewise any upper limit can be combined with any other upper limit to form an unspecified range. In addition, each separately disclosed point or single value can itself be combined as a lower limit or upper limit with any other point or single value or with other lower limits or upper limits to form an unspecified range.

[0041] The temperature parameters in this application, unless otherwise specified, allow both constant temperature treatment and treatment within a certain temperature range. The constant temperature treatment allows the temperature to fluctuate within the accuracy range controlled by the instrument. Fluctuations within the range of ±5°C, ±4°C, ±3°C, ±2°C, and ±1°C are allowed.

[0042] In this application, unless otherwise specified, the size, particle size, and diameter generally refer to the average value. In this application, "particle size" and "particle size" have the same definition, both representing the average particle size of a sphere or a spheroid.

[0043] Herein, the “suitable” mentioned in “suitable combination”, “suitable method”, “any suitable method”, etc., shall be based on the ability to implement the technical solution of this application, solve the technical problems of this application, and achieve the expected technical effects of this application.

[0044] In the present application, "further", "further", "particularly" and the like are used for descriptive purposes to indicate differences in content, but should not be construed as limiting the scope of protection of the present application.

[0045] In this application, "optionally", "optional", and "optional" mean optional or dispensable, that is, any one of the two parallel schemes of "yes" or "no". If multiple "options" appear in a technical solution, unless otherwise specified and there is no contradiction or mutual restriction, each "optional" is independent.

[0046] In the description of the application, "plurality" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0047] If there is no special description, all embodiments and optional embodiments of the present application can be combined with each other to form a new technical solution. If there is no special description, all technical features and optional technical features of the present application can be combined with each other to form a new technical solution.

[0048] The chip of the transducer generates heat during the signal conversion process, causing the temperature of the transducer to rise. The temperature rise affects the performance and life of the transducer. Therefore, effectively dissipating the heat generated by the chip in the transducer is one of the key factors in maintaining the performance and life of the transducer. The backing component, which accounts for a large volume of the transducer, is one of the main ways for the transducer to dissipate heat. At present, among the methods for improving the thermal conductivity of the backing component, adding thermally conductive fillers during the preparation process of the backing component is a simple and convenient operation method.

[0049] For example, in the related art, a thermally conductive graphite block is used to composite cylindrical acoustic damping materials to achieve high acoustic attenuation and high thermal conductivity of the backing material. The specific implementation scheme is: a cylindrical hole-shaped opening inclined relative to the Z-axis direction is set at the rear of the transducer stack, and the acoustic damping material is filled in the cylindrical opening, so that the acoustic reverberation in this direction encounters the acoustic damping material for acoustic attenuation, and the graphite around the hole transfers the heat to the rear of the probe. The limitations of this method are: (1) The hardness of graphite is relatively large, and the backing block can only be used on acoustic heads without curvature. This backing material cannot be used on common convex array, ring array and other acoustic heads; (2) The thermal conductivity of the graphite block is as high as 150W / mK-200W / mK, while the thermal conductivity of the acoustic damping composite material is generally around 0.2 W / mK, and the thickness interval between the graphite and the acoustic damping material is relatively large, all of which lead to a large interface thermal resistance between the two materials, resulting in heat accumulation at the interface.

[0050] The researchers of this application found that rubber is a polymer material with low sound velocity, low impedance and high sound attenuation characteristics. The sound attenuation performance of rubber materials is closely related to their internal structure and physical properties. Generally speaking, the more complex the molecular structure and the greater the internal friction of the rubber material, the better its sound attenuation performance. Depending on the type and molecular weight of the rubber, the sound attenuation at 2.25MHz can reach 30 dB / cm-50 dB / cm, while the sound attenuation of traditional bisphenol epoxy resin at 2.25MHz is only 5 dB / cm-15 dB / cm; the acoustic impedance of common rubber is 1.1 MRayl-1.7 MRayl, while the acoustic impedance of common epoxy resin is 2.5 MRayl-4.2 MRayl. From this, the researchers can determine that the use of different types and molecular weights of rubber, curing agent and thermal conductive silicone foam for co-infiltration can not only improve the thermal conductivity of the transducer backing assembly, but also improve the sensitivity of the transducer, which is a method to optimize the performance of transducers with a certain curvature. Therefore, the present application uses thermally conductive silicone foam as a template and potting rubber solidification as a backing component material to be suitable for transducers with different curvatures.

[0051] One or more embodiments of the present application provide a backing material, which includes thermally conductive silicone foam and rubber curing material. The thermally conductive silicone foam has a plurality of pore structures, part of the rubber curing material is filled in the pore structure of the thermally conductive silicone foam, and the remaining rubber curing material is wrapped on at least part of the surface of the thermally conductive silicone foam.

[0052] It should be noted that thermally conductive silicone foam is a silicone foam material with thermal conductivity. As a non-limiting example, the thermally conductive silicone foam contains high thermal conductivity fillers such as aluminum oxide, boron nitride, etc. These fillers are evenly distributed in the silicone matrix, giving it excellent thermal conductivity. The thermal conductivity coefficient is usually around 0.5W / (m·K)-5W / (m·K), which can effectively conduct heat away from the heat source.

[0053] The surface and the interior of the thermally conductive silicone foam both have a pore structure. As a possible implementation, the pore structure of the thermally conductive silicone foam is a through-pore structure.

[0054] It is understandable that the part of the rubber solidified material wrapped on the surface of the thermally conductive silicone foam forms a thin film on the surface of the thermally conductive silicone foam, which can be continuous or discontinuous.

[0055] In the backing material provided by the present application, the thermally conductive silicone foam can improve the thermal conductivity of the backing material, and the rubber cured material filled in the pore structure of the thermally conductive silicone foam and the rubber cured material wrapped on at least part of the surface of the thermally conductive silicone foam can increase the acoustic attenuation performance of the backing material. At the same time, the thermally conductive silicone foam and the rubber cured material reduce the acoustic impedance of the backing material, thereby improving the sensitivity of the ultrasonic probe containing the backing material. In addition, the hardness of the backing material is reduced, the flexibility is good, it can be applied to transducers with different curvatures, and the processing technology is simple. In summary, the backing material has high acoustic attenuation and thermal conductivity, and at the same time has low impedance, and can be used for transducers with curvature.

[0056] In addition, the backing material of the thermally conductive silicone foam impregnated rubber cured product provided in the present application is used for a transducer. Compared with the "foam material-epoxy" material combination used for a transducer, the acoustic impedance value is reduced from 3.05 MRayl of the "foam material-epoxy" material to 1.5 MRayl, and the impedance difference with the chip is increased, so that more energy is reflected to the front of the transducer; the acoustic attenuation is increased from 16 dB / cm at 2.25 MHz to 45 dB / cm; the hardness is reduced from 61 D to 42 D, so the backing material of the thermally conductive silicone foam impregnated rubber cured product provided in the present application is suitable for ultrasonic transducers with curvature.

[0057] In some embodiments, the volume ratio of the thermally conductive silicone foam to the rubber solidification material is 1:(1.75-1.8); for example, it may be, but is not limited to, 1:1.75, 1:1.76, 1:1.77, 1:1.78, 1:1.79, 1:1.8, or a range between any two of the above volume ratios. When the volume ratio of the thermally conductive silicone foam to the rubber solidification material is within the above range, it is beneficial for the rubber solidification material to completely infiltrate the pore structure of the thermally conductive silicone foam and form a continuous or discontinuous film on the surface of the thermally conductive silicone foam.

[0058] As a possible implementation, the porosity of the thermally conductive silicone foam is 55%-65%; for example, it may be, but is not limited to, 55%, 56%, 57%, 58%, 59%, 60%, 61%, 62%, 63%, 64%, 65%, or a range between any two of the above porosities, etc. When the porosity of the thermally conductive silicone foam is within the above range, it is beneficial to both the heat transfer of the backing material and the improvement of the sound attenuation performance of the backing material.

[0059] In some embodiments, the pore structure of the thermally conductive silicone foam has a pore size of 2 mm to 9 mm; for example, it may be, but is not limited to, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, 5 mm, 5.5 mm, 6 mm, 6.5 mm, 7 mm, 7.5 mm, 8 mm, 8.5 mm, 9 mm, or a range between any two of the above pore sizes. When the pore size of the pore structure of the thermally conductive silicone foam is within the above range, it is beneficial to improve the fluidity and wettability of the rubber cured product during the preparation of the backing material, and to improve the mechanical properties of the backing material after molding.

[0060] As a possible implementation, the rubber cured product is formed by reacting rubber or a rubber derivative with a curing agent.

[0061] In some optional embodiments, the mass ratio of rubber or rubber derivative to curing agent is (9-11):1; for example, it can be but not limited to 9:1, 9.1:1, 9.2:1, 9.3:1, 9.4:1, 9.5:1, 9.6:1, 9.7:1, 9.8:1, 9.9:1, 10:1, 10.1:1, 10.2:1, 10.3:1, 10.4:1, 10.5:1, 10.6:1, 10.7:1, 10.8:1, 10.9:1, 11:1 or a range between any two of the above ratios. When the mass ratio of rubber or rubber derivative to curing agent is within the above range, it is beneficial for both rubber or rubber derivative and curing agent to react fully.

[0062] In some embodiments thereof, the rubber includes one or more of natural rubber, styrene-butadiene rubber, chloroprene rubber, ethylene-propylene rubber, fluororubber, nitrile rubber, silicone rubber and polyurethane rubber.

[0063] In some exemplary embodiments, the rubber derivative is formed by grafting rubber with at least one of an epoxy group, a hydroxyl group, and a carboxyl group.

[0064] As a possible implementation, the curing agent includes one or more of peroxide, sulfur, metal oxide, thiol and amine compounds.

[0065] In some embodiments, the backing material further includes an auxiliary agent, wherein the auxiliary agent includes one or more of a defoaming agent and a silane coupling agent, and the auxiliary agent is dispersed in the rubber cured product.

[0066] In some optional embodiments, the defoaming agent includes one or more of a silicon-based defoaming agent, a mineral oil defoaming agent, and an alcohol defoaming agent.

[0067] As non-limiting examples, silicon-based defoamers may include one or more of polysiloxane (silicone oil), silicone resin, and silicon dioxide. Mineral oil defoamers may include one or more of mineral oil, fatty acid esters, and metal soaps. Alcohol defoamers may include one or more of fatty alcohols, ethylene glycol, and propylene glycol.

[0068] In some exemplary embodiments, the silane coupling agent includes one or more of an aminosilane coupling agent, an epoxysilane coupling agent, an ethylsilane coupling agent, and a methacryloxysilane coupling agent.

[0069] As a non-limiting example, the aminosilane coupling agent may include γ-aminopropyltriethoxysilane (APTES). The epoxysilane coupling agent may include γ-glycidyloxypropyltrimethoxysilane (GPTMS) and / or γ-(2,3-epoxypropyloxy)propyltrimethoxysilane (KH560), etc. The vinylsilane coupling agent may include vinyltriethoxysilane (VTES). The methacryloxysilane coupling agent may include γ-methacryloxypropyltrimethoxysilane (MPS).

[0070] In some optional embodiments, the mass ratio of the defoaming agent to the rubber solid is (0.03-0.06):11; for example, it can be but not limited to 0.03:11, 0.04:11, 0.05:11, 0.06:11 or a range between any two of the above ratios.

[0071] In some exemplary embodiments, the mass ratio of the silane coupling agent to the rubber curing material is (0.03-0.06):11; for example, it can be but not limited to 0.03:11, 0.04:11, 0.05:11, 0.06:11 or a range between any two of the above ratios.

[0072] As a possible implementation, the acoustic impedance of the backing material is 1.2MRayl-1.8MRayl, for example, but not limited to, 1.2MRayl, 1.3MRayl, 1.4MRayl, 1.5MRayl, 1.6MRayl, 1.7MRayl, 1.8MRayl or a range between any two of the above acoustic impedances.

[0073] In some embodiments, the hardness of the backing material is 20D-45D, for example, but not limited to 20D, 22D, 24D, 26D, 28D, 30D, 32D, 34D, 36D, 38D, 40D, 42D, 44D, 45D or a range between any two of the above hardnesses.

[0074] In some embodiments, the density of the backing material is 0.85 g / cm 3 -1.5g / cm 3 ; For example, it can be but not limited to 0.85g / cm 3 , 0.9g / cm 3 , 0.95g / cm 3 , 1.0g / cm 3 , 1.05g / cm 3 , 1.1g / cm 3 , 1.15g / cm 3 , 1.2g / cm 3 , 1.25g / cm 3 , 1.3g / cm 3 , 1.35g / cm 3 , 1.4g / cm 3 , 1.45g / cm 3 , 1.5g / cm 3 Or the range between any two of the above densities, etc.

[0075] In some embodiments, the sound attenuation of the backing material is 30dB / cm-55dB / cm; for example, it can be but is not limited to 30dB / cm, 35dB / cm, 40dB / cm, 45dB / cm, 50dB / cm, 55dB / cm or a range between any two of the above sound attenuations, etc.

[0076] In some embodiments, the sound velocity of the backing material is 900m / s-1200m / s; for example, it can be but not limited to 900m / s, 950m / s, 1000m / s, 1050m / s, 1100m / s, 1150m / s, 1200m / s or a range between any two of the above sound velocities.

[0077] In some embodiments, the thermal conductivity of the backing material is 1.5W / (m·k)-3W / (m·k); for example, it can be but not limited to 1.5W / (m·k), 1.8W / (m·k), 2W / (m·k), 2.2W / (m·k), 2.4W / (m·k), 2.6W / (m·k), 2.8W / (m·k), 3W / (m·k) or a range between any two of the above thermal conductivities, etc.

[0078] One or more embodiments of the present application provide a method for preparing a backing material, which can be used to prepare the above-mentioned backing material. The preparation method comprises the following steps: using a liquid containing rubber and a curing agent to infiltrate a thermally conductive silicone foam and then perform a curing treatment to prepare the backing material; or using a liquid containing a rubber derivative and a curing agent to infiltrate a thermally conductive silicone foam and then perform a curing treatment to prepare the backing material;

[0079] The backing material includes thermal conductive silicone foam and rubber curing material. The thermal conductive silicone foam has a plurality of pore structures. Part of the rubber curing material fills the pore structure of the thermal conductive silicone foam, and the remaining rubber curing material wraps at least a part of the surface of the thermal conductive silicone foam.

[0080] In the prepared backing material, the composition, structure and properties of the thermal conductive silicone foam and the rubber cured product are as described above and will not be repeated in the method.

[0081] The preparation method of the backing material provided in the present application has a simple process, and the prepared backing material has a wide range of applications and can be applied to transducers with different curvatures.

[0082] In some embodiments, the mass ratio of rubber or rubber curing material to curing agent is (9-11):1; for example, it can be but not limited to 9:1, 9.1:1, 9.2:1, 9.3:1, 9.4:1, 9.5:1, 9.6:1, 9.7:1, 9.8:1, 9.9:1, 10:1, 10.1:1, 10.2:1, 10.3:1, 10.4:1, 10.5:1, 10.6:1, 10.7:1, 10.8:1, 10.9:1, 11:1 or a range between any two of the above ratios.

[0083] As a possible implementation, the curing treatment temperature is 80°C-100°C; for example, it can be but not limited to 80°C, 82°C, 84°C, 86°C, 88°C, 90°C, 92°C, 94°C, 96°C, 98°C, 100°C or a range between any two of the above temperatures.

[0084] In some optional embodiments, the curing treatment time is 4h-5h; for example, it can be but not limited to 4h, 4.2h, 4.4h, 4.6h, 4.8h, 5h or a range between any two of the above times.

[0085] It should be noted that the temperature and time of the curing treatment can be combined in any appropriate manner, and both can be selected from any temperature and time of the curing treatment described in this document.

[0086] In some embodiments, the feed solution further includes an auxiliary agent, which includes a defoamer and a silane coupling agent. The specific types of the defoamer and the silane coupling agent are as described above, and will not be repeated in the method.

[0087] As a non-limiting example, the method for preparing the backing material includes the following steps: using a liquid containing rubber, a curing agent, a defoaming agent and a silane coupling agent to infiltrate the thermal conductive silicone foam and then perform a curing treatment to prepare the backing material.

[0088] As a non-limiting example, the method for preparing the backing material includes the following steps: using a liquid containing a rubber derivative, a curing agent, a defoaming agent, and a silane coupling agent to infiltrate a thermally conductive silicone foam and then perform a curing treatment to prepare the backing material. In some optional embodiments, the backing material includes a thermally conductive silicone foam, a rubber curing material, and an additive, the thermally conductive silicone foam has a plurality of pore structures, part of the rubber curing material is filled in the pore structure of the thermally conductive silicone foam, the remaining rubber curing material is wrapped on at least a portion of the surface of the thermally conductive silicone foam, and the additive is dispersed in the rubber curing material.

[0089] In some exemplary embodiments, the ratio of the mass of the defoaming agent to the total mass of the rubber and the curing agent is (0.03-0.06):11; for example, it can be but not limited to 0.03:11, 0.04:11, 0.05:11, 0.06:11 or a range between any two of the above ratios.

[0090] In some exemplary embodiments, the ratio of the mass of the defoaming agent to the total mass of the rubber derivative and the curing agent is (0.03-0.06):11; for example, it can be but not limited to 0.03:11, 0.04:11, 0.05:11, 0.06:11 or a range between any two of the above ratios.

[0091] In some embodiments, the ratio of the mass of the silane coupling agent to the total mass of the rubber and the curing agent is (0.03-0.06):11; for example, it can be but not limited to 0.03:11, 0.04:11, 0.05:11, 0.06:11 or a range between any two of the above ratios.

[0092] In some embodiments, the ratio of the mass of the silane coupling agent to the total mass of the rubber derivative and the curing agent is (0.03-0.06):11; for example, it can be but not limited to 0.03:11, 0.04:11, 0.05:11, 0.06:11 or a range between any two of the above ratios.

[0093] One or more embodiments of the present application provide a backing assembly, which is formed by the above-mentioned backing material or the backing material prepared by the above-mentioned backing material preparation method. The backing assembly has high sound attenuation, low sound impedance and high thermal conductivity.

[0094] One or more embodiments of the present application provide a method for preparing a backing assembly, which can be used to prepare the above-mentioned backing assembly. The preparation method comprises: cutting the above-mentioned backing material based on a target size or using the backing material prepared by the above-mentioned backing assembly preparation method to prepare the backing assembly.

[0095] One or more embodiments of the present application provide a transducer, including the above-mentioned backing component or a backing component prepared by the above-mentioned method for preparing the backing component.

[0096] In some embodiments, the transducer includes one or more of a convex array transducer and a circular array transducer. The backing material has relatively low hardness and high flexibility, and is suitable for a transducer with curvature.

[0097] like Figure 1 As shown, as a non-limiting example, the backing material is used in a ring array transducer and a convex array transducer. The ring array transducer includes a stacked chip 1, a printed circuit board FPC 2 and a backing assembly 3. The backing material forming the backing assembly 3 includes a thermal conductive silicone foam 31 with a pore structure and a rubber cured material 32 filled in the pore structure of the thermal conductive silicone foam 31 and wrapped in the thermal conductive silicone foam 31.

[0098] One or more embodiments of the present application provide an ultrasound probe including the above-mentioned transducer.

[0099] One or more embodiments of the present application provide an ultrasonic imaging device, comprising the above-mentioned ultrasonic probe.

[0100] The technical scheme of the present invention is described in detail below in conjunction with specific embodiments. It should be understood that these embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention. The experimental methods for which specific conditions are not specified in the following embodiments are preferably referred to the guidance given in the present invention, and can also be carried out according to the experimental manual or conventional conditions in the art, or according to the conditions recommended by the manufacturer, or with reference to experimental methods known in the art.

[0101] In the following specific embodiments, the measured parameters of raw material components may have slight deviations within the range of weighing accuracy unless otherwise specified. For temperature and time parameters, acceptable deviations caused by instrument test accuracy or operation accuracy are allowed.

[0102] It should be noted that the peroxide curing agent used in the following embodiments and comparative examples is purchased from Wanqing Chemical, model Nouryon Trigonox 141; the epoxy resin curing agent is T21 curing agent purchased from Wanshun Chemical; the silicone-based defoaming agent is Dow AFE-1410, purchased from Defeng defoaming agent manufacturer; the model of silicone rubber and silicone rubber curing agent are both RTV-2, purchased from Hongye Technology; the model of polyurethane curing agent is HI100, purchased from BASF, which is an aliphatic isocyanate curing agent.

[0103] Example 1

[0104] At 25°C, 10g of natural rubber and 1g of peroxide curing agent were added to a plastic cup container, i.e., the mass ratio of rubber to curing agent n1 was 10:1, and after stirring for 2 minutes to mix evenly, 0.05g of silicon-based defoaming agent and 0.05g of silane coupling agent KH560 were added, and stirred for 2 minutes, and the thermal conductive silicone foam prepared in advance was poured in to make it completely infiltrated, and cured at 90°C for 4 hours to obtain the backing material of thermal conductive silicone foam-natural rubber cured product. Among them, the porosity of the thermal conductive silicone foam is 60%, the pore size of the pore structure of the thermal conductive silicone foam is 2.5mm, and the volume ratio n2 of the thermal conductive silicone foam and the natural rubber cured product is 1:1.75.

[0105] Example 2

[0106] At 25°C, 10g of chloroprene rubber and 1g of peroxide curing agent were added to a plastic cup container, i.e., the mass ratio of rubber to curing agent n1 was 10:1, and after stirring for 2 minutes to mix evenly, 0.05g of silicon-based defoamer and 0.05g of silane coupling agent KH560 were added, and stirred for 2 minutes, and the thermal conductive silicone foam prepared in advance was poured in to make it completely infiltrated, and cured at 90°C for 4 hours to obtain the backing material of thermal conductive silicone foam-chloroprene rubber cured product. Among them, the porosity of the thermal conductive silicone foam is 60%, the pore size of the pore structure of the thermal conductive silicone foam is 2.5mm, and the volume ratio n2 of the thermal conductive silicone foam and the chloroprene rubber cured product is 1:1.75.

[0107] Example 3

[0108] At 25°C, 10g of styrene-butadiene rubber and 1g of peroxide curing agent were added to a plastic cup container, i.e., the mass ratio of rubber to curing agent n1 was 10:1, and after stirring for 2 minutes to mix evenly, 0.05g of silicon-based defoaming agent and 0.05g of silane coupling agent KH560 were added, and stirred for 2 minutes, and the thermal conductive silicone foam prepared in advance was poured in to make it completely infiltrated, and cured at 90°C for 4 hours to obtain the backing material of thermal conductive silicone foam-styrene-butadiene rubber cured product. Among them, the porosity of the thermal conductive silicone foam is 60%, the pore size of the pore structure of the thermal conductive silicone foam is 2.5mm, and the volume ratio n2 of the thermal conductive silicone foam and the styrene-butadiene rubber cured product is 1:1.75.

[0109] Example 4

[0110] At 25°C, 10g of ethylene propylene rubber and 1g of peroxide curing agent were added to a plastic cup container, i.e., the mass ratio of rubber to curing agent n1 was 10:1. After stirring for 2 minutes to mix evenly, 0.05g of silicon-based defoamer and 0.05g of silane coupling agent KH560 were added, stirred for 2 minutes, and the thermal conductive silicone foam prepared in advance was poured in to completely infiltrate it. The backing material of thermal conductive silicone foam-ethylene propylene rubber curing material was cured at 90°C for 4 hours. Among them, the porosity of the thermal conductive silicone foam was 60%, the pore size of the pore structure of the thermal conductive silicone foam was 2.5mm, and the volume ratio n2 of the thermal conductive silicone foam and the ethylene propylene rubber curing material was 1:1.75.

[0111] Example 5

[0112] At 25°C, 10g of nitrile rubber and 1g of peroxide curing agent were added to a plastic cup container, i.e., the mass ratio of rubber to curing agent n1 was 10:1, and after stirring for 2 minutes to mix evenly, 0.05g of silicon-based defoamer and 0.05g of silane coupling agent KH560 were added, and stirred for 2 minutes, and the thermal conductive silicone foam prepared in advance was poured in to make it completely infiltrated, and cured at 90°C for 4 hours to obtain the backing material of thermal conductive silicone foam-nitrile rubber cured product. Among them, the porosity of the thermal conductive silicone foam is 60%, the pore size of the pore structure of the thermal conductive silicone foam is 2.5mm, and the volume ratio n2 of the thermal conductive silicone foam and the nitrile rubber cured product is 1:1.75.

[0113] Example 6

[0114] At 25°C, 10g of fluororubber and 1g of peroxide curing agent were added to a plastic cup container, i.e., the mass ratio of rubber to curing agent n1 was 10:1. After stirring for 2 minutes to mix evenly, 0.05g of silicone-based defoamer and 0.05g of silane coupling agent KH560 were added, stirred for 2 minutes, and the thermal conductive silicone foam prepared in advance was poured in to completely infiltrate it. The backing material of thermal conductive silicone foam-fluororubber cured product was obtained by curing at 90°C for 4 hours. Among them, the porosity of the thermal conductive silicone foam was 60%, the pore size of the pore structure of the thermal conductive silicone foam was 2.5mm, and the volume ratio n2 of the thermal conductive silicone foam and the fluororubber cured product was 1:1.75.

[0115] Example 7

[0116] At 25°C, 10g of silicone rubber and 1g of silicone rubber curing agent were added to a plastic cup container, i.e., the mass ratio of rubber to curing agent n1 was 10:1. After stirring for 2 minutes to mix evenly, 0.05g of silicone-based defoamer and 0.05g of silane coupling agent KH560 were added, stirred for 2 minutes, and the thermal conductive silicone foam prepared in advance was poured in to completely infiltrate it. The backing material of thermal conductive silicone foam-silicone rubber curing material was cured at 90°C for 4 hours. Among them, the porosity of the thermal conductive silicone foam was 60%, the pore size of the pore structure of the thermal conductive silicone foam was 2.5mm, and the volume ratio n2 of the thermal conductive silicone foam and the silicone rubber curing material was 1:1.75.

[0117] Example 8

[0118] At 25°C, 10g of polyurethane rubber and 1g of polyurethane curing agent were added to a plastic cup container, i.e., the mass ratio of rubber to curing agent n1 was 10:1. After stirring for 2 minutes to mix evenly, 0.05g of silicon-based defoamer and 0.05g of silane coupling agent KH560 were added, stirred for 2 minutes, and the thermal conductive silicone foam prepared in advance was poured in to completely infiltrate it. The backing material of thermal conductive silicone foam-polyurethane rubber curing material was obtained by curing at 90°C for 4 hours. Among them, the porosity of the thermal conductive silicone foam was 60%, the pore size of the pore structure of the thermal conductive silicone foam was 2.5mm, and the volume ratio n2 of the thermal conductive silicone foam and the polyurethane rubber curing material was 1:1.75.

[0119] Example 9

[0120] At 25°C, 10g of natural rubber and 1g of peroxide curing agent were added to a plastic cup container, i.e., the mass ratio of rubber to curing agent n1 was 10:1. After stirring for 2 minutes to mix evenly, 0.05g of silicon-based defoaming agent and 0.05g of silane coupling agent KH560 were added, stirred for 2 minutes, and the thermal conductive silicone foam prepared in advance was poured in to completely infiltrate it. The backing material of thermal conductive silicone foam-natural rubber cured product was cured at 90°C for 4 hours. Among them, the porosity of the thermal conductive silicone foam was 60%, the pore size of the pore structure of the thermal conductive silicone foam was 2.5mm, and the volume ratio n2 of the thermal conductive silicone foam and the natural rubber cured product was 1:1.77.

[0121] Example 10

[0122] At 25°C, 10g of natural rubber and 1g of peroxide curing agent were added to a plastic cup container, i.e., the mass ratio of rubber to curing agent n1 was 10:1, and after stirring for 2 minutes to mix evenly, 0.05g of silicon-based defoaming agent and 0.05g of silane coupling agent KH560 were added, and stirred for 2 minutes, and the thermal conductive silicone foam prepared in advance was poured in to make it completely wetted, and cured at 90°C for 4 hours to obtain the backing material of thermal conductive silicone foam-natural rubber cured product. Among them, the porosity of the thermal conductive silicone foam is 60%, the pore size of the pore structure of the thermal conductive silicone foam is 2.5mm, and the volume ratio n2 of the thermal conductive silicone foam and the natural rubber cured product is 1:1.8.

[0123] Embodiment 11

[0124] At 25°C, 10g of natural rubber and 1g of peroxide curing agent were added to a plastic cup container, i.e., the mass ratio of rubber to curing agent n1 was 10:1, and after stirring for 2 minutes to mix evenly, 0.05g of silicon-based defoaming agent and 0.05g of silane coupling agent KH560 were added, and stirred for 2 minutes, and the thermal conductive silicone foam prepared in advance was poured in to make it completely infiltrated, and cured at 90°C for 4 hours to obtain the backing material of thermal conductive silicone foam-natural rubber cured product. Among them, the porosity of the thermal conductive silicone foam is 60%, the pore size of the pore structure of the thermal conductive silicone foam is 2.5mm, and the volume ratio n2 of the thermal conductive silicone foam and the natural rubber cured product is 1:1.65.

[0125] Example 12

[0126] At 25°C, 10g of natural rubber and 1g of peroxide curing agent were added to a plastic cup container, i.e., the mass ratio of rubber to curing agent n1 was 10:1, and after stirring for 2 minutes to mix evenly, 0.05g of silicon-based defoaming agent and 0.05g of silane coupling agent KH560 were added, and stirred for 2 minutes, and the thermal conductive silicone foam prepared in advance was poured in to make it completely infiltrated, and cured at 90°C for 4 hours to obtain the backing material of thermal conductive silicone foam-natural rubber cured product. Among them, the porosity of the thermal conductive silicone foam is 60%, the pore size of the pore structure of the thermal conductive silicone foam is 2.5mm, and the volume ratio n2 of the thermal conductive silicone foam and the natural rubber cured product is 1:1.9.

[0127] Embodiment 13

[0128] At 25°C, 10g of natural rubber and 1g of peroxide curing agent were added to a plastic cup container, i.e., the mass ratio of rubber to curing agent n1 was 10:1, and after stirring for 2 minutes to mix evenly, 0.05g of silicon-based defoaming agent and 0.05g of silane coupling agent KH560 were added, and stirred for 2 minutes, and the thermal conductive silicone foam prepared in advance was poured in to make it completely infiltrated, and cured at 90°C for 4 hours to obtain the backing material of thermal conductive silicone foam-natural rubber cured product. Among them, the porosity of the thermal conductive silicone foam is 55%, the pore size of the pore structure of the thermal conductive silicone foam is 2.5mm, and the volume ratio n2 of the thermal conductive silicone foam and the natural rubber cured product is 1:1.75.

[0129] Embodiment 14

[0130] At 25°C, 10g of natural rubber and 1g of peroxide curing agent were added to a plastic cup container, i.e., the mass ratio of rubber to curing agent n1 was 10:1, and after stirring for 2 minutes to mix evenly, 0.05g of silicon-based defoaming agent and 0.05g of silane coupling agent KH560 were added, and stirred for 2 minutes, and the thermal conductive silicone foam prepared in advance was poured in to make it completely infiltrated, and cured at 90°C for 4 hours to obtain the backing material of thermal conductive silicone foam-natural rubber cured product. Among them, the porosity of the thermal conductive silicone foam is 65%, the pore size of the pore structure of the thermal conductive silicone foam is 2.5mm, and the volume ratio n2 of the thermal conductive silicone foam and the natural rubber cured product is 1:1.75.

[0131] Embodiment 15

[0132] At 25°C, 10g of natural rubber and 1g of peroxide curing agent were added to a plastic cup container, i.e., the mass ratio of rubber to curing agent n1 was 10:1, and after stirring for 2 minutes to mix evenly, 0.05g of silicon-based defoamer and 0.05g of silane coupling agent KH560 were added, and stirred for 2 minutes, and the thermal conductive silicone foam prepared in advance was poured in to make it completely infiltrated, and cured at 90°C for 4 hours to obtain the backing material of thermal conductive silicone foam-natural rubber cured product. Among them, the porosity of the thermal conductive silicone foam is 60%, the pore size of the pore structure of the thermal conductive silicone foam is 2mm, and the volume ratio n2 of the thermal conductive silicone foam and the natural rubber cured product is 1:1.75.

[0133] Example 16

[0134] At 25°C, 10g of natural rubber and 1g of peroxide curing agent were added to a plastic cup container, i.e., the mass ratio of rubber to curing agent n1 was 10:1. After stirring for 2 minutes to mix evenly, 0.05g of silicon-based defoamer and 0.05g of silane coupling agent KH560 were added, stirred for 2 minutes, and the thermal conductive silicone foam prepared in advance was poured in to completely infiltrate it. The backing material of thermal conductive silicone foam-natural rubber cured product was cured at 90°C for 4 hours. Among them, the porosity of the thermal conductive silicone foam was 60%, the pore size of the pore structure of the thermal conductive silicone foam was 9mm, and the volume ratio n2 of the thermal conductive silicone foam and the natural rubber cured product was 1:1.75.

[0135] Embodiment 17

[0136] At 25°C, 9g of natural rubber and 1g of peroxide curing agent were added to a plastic cup container, i.e., the mass ratio of rubber to curing agent n1 was 9:1. After stirring for 2 minutes to mix evenly, 0.05g of silicon-based defoaming agent and 0.05g of silane coupling agent KH560 were added, stirred for 2 minutes, and the thermal conductive silicone foam prepared in advance was poured in to completely infiltrate it. The backing material of thermal conductive silicone foam-natural rubber cured product was cured at 90°C for 4 hours. Among them, the porosity of the thermal conductive silicone foam was 60%, the pore size of the pore structure of the thermal conductive silicone foam was 2.5mm, and the volume ratio n2 of the thermal conductive silicone foam and the natural rubber cured product was 1:1.75.

[0137] Embodiment 18

[0138] At 25°C, 11g of natural rubber and 1g of peroxide curing agent were added to a plastic cup container, i.e., the mass ratio of rubber to curing agent n1 was 11:1. After stirring for 2 minutes to mix evenly, 0.05g of silicon-based defoamer and 0.05g of silane coupling agent KH560 were added, stirred for 2 minutes, and the thermal conductive silicone foam prepared in advance was poured in to completely infiltrate it. The backing material of thermal conductive silicone foam-natural rubber cured product was cured at 90°C for 4 hours. Among them, the porosity of the thermal conductive silicone foam was 60%, the pore size of the pore structure of the thermal conductive silicone foam was 2.5mm, and the volume ratio of the thermal conductive silicone foam to the natural rubber cured product was 1:1.75.

[0139] Comparative Example 1

[0140] At 25°C, add 10g of epoxy resin and 3g of epoxy resin curing agent into a plastic cup container, that is, the mass ratio of rubber to curing agent n1 is 10:3, stir for 2 minutes to mix evenly, add 0.05g of silicone defoamer, stir for 2 minutes, pour in the thermal conductive silicone foam prepared in advance to make it completely wet, and cure at 90°C for 4 hours to obtain the backing material of thermal conductive silicone foam-epoxy resin cured product. Among them, the porosity of the thermal conductive silicone foam is 60%, the pore size of the pore structure of the thermal conductive silicone foam is 2.5mm, and the volume ratio n2 of the thermal conductive silicone foam and the epoxy resin cured product is 1:1.75.

[0141] Comparative Example 2

[0142] At 25°C, 10g of nitrile rubber and 1g of peroxide curing agent were added to a plastic cup container, i.e., the mass ratio of rubber to curing agent n1 was 10:1, and after stirring for 2 minutes to mix evenly, 0.05g of silicon-based defoamer and 0.05g of silane coupling agent KH560 were added, and stirred for 2 minutes, and the previously prepared thermal conductive carbon foam was poured in to make it completely wetted, and cured at 90°C for 4 hours to obtain the backing material of thermal conductive carbon foam-nitrile rubber cured product. Among them, the porosity of the thermal conductive carbon foam is 60%, the pore size of the pore structure of the thermal conductive carbon foam is 2.5mm, and the volume ratio n2 of the thermal conductive carbon foam and the nitrile rubber cured product is 1:1.75.

[0143] Comparative Example 3

[0144] At 25°C, 10g of nitrile rubber and 1g of peroxide curing agent were added to a plastic cup container, i.e., the mass ratio of rubber to curing agent n1 was 10:1, and after stirring for 2 minutes to mix evenly, 0.05g of silicon-based defoamer and 0.05g of silane coupling agent KH560 were added, and stirred for 2 minutes, and the previously prepared thermal conductive graphite foam was poured in to completely infiltrate it, and cured at 90°C for 4 hours to obtain a backing material of thermal conductive graphite foam-nitrile rubber cured product. Among them, the porosity of the thermal conductive graphite foam is 60%, the pore size of the pore structure of the thermal conductive graphite foam is 2.5mm, and the volume ratio n2 of the thermal conductive graphite foam and the nitrile rubber cured product is 1:1.75.

[0145] Some parameter settings of the above embodiments and comparative examples are shown in Table 1.

[0146] Table 1

[0147]

[0148] Among them, n1 in Table 1 represents the mass ratio of rubber and curing agent, n2 represents the volume ratio of skeleton and rubber cured body in the prepared backing material, porosity is the porosity of thermal conductive silicone foam, and pore size is the pore size of the pore structure of thermal conductive silicone foam.

[0149] The backing materials prepared in the above-mentioned embodiments and comparative examples were subjected to acoustic performance tests, and the sound velocity, acoustic impedance, density, acoustic attenuation and hardness of the backing materials were tested. The results are shown in Table 2.

[0150] Table 2

[0151]

[0152] From the comparison of the results of Examples 1-18 and Comparative Examples 1-3, it can be seen that the backing material provided in the present application uses thermally conductive silicone foam as a template and an encapsulated rubber solidifier. The backing assembly has lower hardness, sound velocity, acoustic impedance and density, and has higher sound attenuation and thermal conductivity, good flexibility, and can be applied to transducers with different curvatures.

[0153] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0154] The above-mentioned embodiments only express several implementation methods of the present invention, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the invention patent. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be based on the attached claims, and the description can be used to interpret the scope of the claims.

Claims

1. A backing material, characterized in that: It comprises a thermally conductive silicone foam and a rubber solidified material, wherein the thermally conductive silicone foam has a plurality of pore structures, a part of the rubber solidified material is filled in the pore structure of the thermally conductive silicone foam, and the remaining rubber solidified material is wrapped on at least a part of the surface of the thermally conductive silicone foam.

2. The backing material according to claim 1, characterized in that The volume ratio of the thermally conductive silicone foam to the rubber solidified material is 1:(1.75-1.8).

3. The backing material according to claim 1, characterized in that The porosity of the thermally conductive silicone foam is 55%-65%; and / or The pore structure of the thermally conductive silicone foam has a pore size of 2 mm to 9 mm.

4. The backing material according to claim 1, characterized in that The rubber cured product is formed by the reaction of rubber or rubber derivative and a curing agent; Optionally, the mass ratio of the rubber or the rubber derivative to the curing agent is (9-11):1; Optionally, the rubber includes one or more of natural rubber, styrene-butadiene rubber, chloroprene rubber, ethylene-propylene rubber, fluororubber, nitrile rubber, silicone rubber and polyurethane rubber; Optionally, the rubber derivative is formed by grafting the rubber with at least one of epoxy, hydroxyl and carboxyl groups; Optionally, the curing agent includes one or more of peroxide, sulfur, metal oxide, thiol and amine compounds.

5. The backing material according to any one of claims 1 to 4, characterized in that: The backing material further comprises an auxiliary agent, wherein the auxiliary agent comprises one or more of a defoaming agent and a silane coupling agent, and the auxiliary agent is dispersed in the rubber cured product; Optionally, the defoamer includes one or more of a silicon-based defoamer, a mineral oil defoamer, and an alcohol defoamer; Optionally, the silane coupling agent includes one or more of an aminosilane coupling agent, an epoxysilane coupling agent, a vinylsilane coupling agent, and a methacryloxysilane coupling agent; Optionally, the mass ratio of the defoaming agent to the rubber solidified material is (0.03-0.06):11; Optionally, the mass ratio of the silane coupling agent to the rubber cured product is (0.03-0.06):

11.

6. A method for preparing a backing material, characterized in that: The steps include: The backing material is prepared by infiltrating the thermally conductive silicone foam with a liquid containing rubber and a curing agent and then curing the foam; or The backing material is prepared by infiltrating the thermally conductive silicone foam with a liquid containing a rubber derivative and a curing agent and then performing a curing treatment; The backing material includes thermally conductive silicone foam and rubber curing material, wherein the thermally conductive silicone foam has a plurality of pore structures, part of the rubber curing material is filled in the pore structure of the thermally conductive silicone foam, and the remaining rubber curing material is wrapped on at least part of the surface of the thermally conductive silicone foam.

7. The preparation method according to claim 6, characterized in that: The mass ratio of the rubber or the rubber derivative to the curing agent is (9-11):

1.

8. The preparation method according to any one of claims 6 to 7, characterized in that: The curing treatment is carried out at a temperature of 80°C-100°C and for a time of 4h-5h.

9. A backing assembly, characterized in that: The backing material is formed by the backing material according to any one of claims 1 to 5 or the backing material prepared by the preparation method according to any one of claims 6 to 8.

10. A method for preparing a backing component, characterized in that: The preparation method comprises: cutting the backing material according to any one of claims 1 to 5 or the backing material prepared by the preparation method according to any one of claims 6 to 8 based on a target size to prepare the backing assembly.

11. A transducer, characterized in that: It comprises the backing component as claimed in claim 9 or the backing component prepared by the preparation method as claimed in claim 10.

12. The transducer according to claim 11, characterized in that The transducer includes one or more of a convex array transducer and a circular array transducer.

13. An ultrasonic probe, characterized in that: Comprising a transducer as claimed in any one of claims 11 to 12.

Images