High-resolution photosensitive resin composition for 3D printing, preparation method and application

Abstract

The invention relates to the technical field of additive manufacturing materials, in particular to a high-resolution photosensitive resin composition for 3D printing and a preparation method and application thereof. The photosensitive resin composition is prepared from the following raw materials in parts by weight: 30 to 70 parts of polyurethane acrylate oligomer, 40 to 60 parts of reactive diluent, 1 to 6 parts of photoinitiator, 0.1 to 1 part of defoaming agent, 0.1 to 1 part of flatting agent, 0.05 to 2 parts of UV absorbent and 0.1 to 3 parts of nano color paste. Based on the photosensitive resin composition provided by the invention, a high-resolution three-dimensional molded product can be obtained under the condition that the hardness, the printing speed and the efficiency of the product are not influenced, and the transverse hole and the vertical hole are both not more than 0.5 mm. The resin composition has wide application prospects in the fields of aerospace, automobiles, precise instruments, jewelry design and manufacturing, artistic sculpture creation, orthodontic appliances, surgical guide plates, even customized production of skeleton implants and the like.

Description

Technical Field

[0001] The present invention relates to the technical field of additive manufacturing materials, and in particular to a high-resolution photosensitive resin composition for 3D printing, a preparation method and applications thereof. Background Art

[0002] 3D printing technology has made great breakthroughs in the fields of industry and personal manufacturing. Among them, Digital Light Processing (DLP) photocuring technology, as a high-precision and high-speed 3D printing method, is gradually becoming the preferred solution in many fields such as precision parts manufacturing, prototype design, jewelry casting and biomedicine. DLP photocuring 3D printing technology is an additive manufacturing method based on photopolymerization reaction. It uses a high-resolution DLP projector to project ultraviolet light onto a printing platform containing photosensitive resin, and solidifies the resin layer by layer according to the three-dimensional model generated by the computer, stacking layer by layer to finally build a solid model.

[0003] Compared with the CAD / CAM cutting system, which has serious waste of raw materials and has shortcomings such as tool wear and dust pollution, DLP 3D printing technology can solidify an entire layer of resin through a single exposure, greatly improving printing speed and efficiency.

[0004] 3D printing technology is widely used in the following major fields: aerospace, automobiles, precision instruments, jewelry design and manufacturing, creation of artistic sculptures, dental braces, surgical guides, and even customized production of bone implants.

[0005] The main problem with photosensitive resin compositions for 3D printing is that in order to improve the hardness, printing speed and efficiency of products, multifunctional polyurethane acrylate oligomers and multifunctional active diluents need to be added, and the amount of photoinitiator used is increased, which leads to a significant reduction in the resolution of three-dimensional molded products. In the prior art, the resolution will be significantly reduced (horizontal and vertical holes are greater than 0.7mm) while ensuring the hardness and printing efficiency of the product; although reducing the amount of photoinitiator used will improve the resolution to a certain extent, the hardness, printing speed and efficiency of the product will be significantly reduced.

[0006] How to improve the hardness, printing speed and efficiency of products while ensuring that the three-dimensional molded products have good resolution is a problem that needs to be solved urgently. Summary of the invention

[0007] In response to the above-mentioned problems existing in the prior art, the applicant of the present invention provides a high-resolution photosensitive resin composition for 3D printing. The three-dimensional molded products prepared based on the resin composition can greatly improve the resolution of the three-dimensional imaging products while ensuring the hardness of the products and the printing efficiency.

[0008] A first aspect of the present application is to provide a high-resolution photosensitive resin composition for 3D printing.

[0009] The specific technical solutions are as follows:

[0010] A high-resolution photosensitive resin composition for 3D printing, comprising the following raw materials in parts by weight:

[0011]

[0012] Furthermore, the polyurethane acrylate oligomer includes one or more of an aliphatic structure polyurethane acrylate oligomer and an aromatic structure polyurethane acrylate oligomer.

[0013] In some embodiments, the polyurethane acrylate oligomer is a mixture of a first oligomer and a second oligomer; the first oligomer is a polyurethane acrylate oligomer with a functionality ≤ 3; the second oligomer is a polyurethane acrylate oligomer with a functionality ≥ 4; preferably, the ratio of the first oligomer to the second oligomer is 2:1-3:1.

[0014] In some preferred embodiments of the present invention, the polyurethane acrylate oligomer may be one or more of CN 8881NS, CN 9001NS, CN 8887NS, CN 8888NS, CN 9021NS, CN9167, CN9782, CN 959, CN964NS, CN980NS, CN981NS, CN983NS, CN9245, CN989NS, CN8000NS, CN9010NS, and CN9013NS produced by Sartomer.

[0015] Furthermore, the reactive diluent includes one or more of a monofunctional (meth)acrylate monomer and a difunctional or multifunctional (meth)acrylate monomer.

[0016] Furthermore, the reactive diluent is a mixture of a first reactive diluent and a second reactive diluent;

[0017] The first reactive diluent is a monofunctional (meth)acrylate monomer or a difunctional (meth)acrylate monomer;

[0018] The second reactive diluent is a multifunctional (meth)acrylate monomer with a functionality of ≥3; preferably, the ratio of the first reactive diluent to the second reactive diluent is 7:1-3:1.

[0019] In some embodiments, the active diluent specifically includes: n-butyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, deca-(meth)acrylate, lauryl (meth)acrylate, lauryl (meth)acrylate, tetrahydrofuran (meth)acrylate, benzyl (meth)acrylate, 2-phenoxyethyl (meth)acrylate, hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, ethoxyethoxyethyl acrylate and other (meth)acrylates, isobornyl (meth)acrylate, cyclotrimethylolpropane methylal (meth)acrylate, acryloyl morpholine One or more of (meth)acrylates (acrylamides) such as methacrylate, N,N-dimethylacrylamide, 1,6-hexanediol di(meth)acrylate, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, polyethylene glycol di(meth)acrylate, pentaerythritol tri(meth)acrylate, trimethylolpropane tri(meth)acrylate, ethoxylated trimethylolpropane tri(meth)acrylate, propoxylated trimethylolpropane tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, and dipentaerythritol hexa(meth)acrylate.

[0020] In some preferred embodiments of the present invention, the reactive diluent may be one or more of isobornyl (meth)acrylate, acryloylmorpholine, dipropylene glycol di(meth)acrylate, tripropylene glycol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, and dipentaerythritol hexa(meth)acrylate.

[0021] In some embodiments, the photoinitiator includes an α-hydroxyketone photoinitiator and an acylphosphine oxide photoinitiator; preferably one or more of Ciba's Darocur 1173 photoinitiator, Ciba's Darocur MBF photoinitiator, BASF's Irgacure 184 photoinitiator, BASF's Irgacure 2959 photoinitiator, BASF's Irgacure 907 photoinitiator, BASF's Irgacure 369 photoinitiator, BASF's Irgacure TEPO photoinitiator, BASF's Irgacure TPO photoinitiator, and BASF's Irgacure 819 photoinitiator.

[0022] In some more preferred embodiments, the photoinitiator may be one or more of BASF Irgacure 907 photoinitiator, BASF Irgacure 369 photoinitiator, BASF Irgacure TEPO photoinitiator, BASF Irgacure TPO photoinitiator, and BASF Irgacure 819 photoinitiator.

[0023] In some embodiments, the defoaming agent includes one or more of a silicone defoaming agent, a polymer defoaming agent and a mineral oil defoaming agent; preferably, the defoaming agent specifically includes one or more of BYK017, BYK018, BYK019, BYK021, BYK022, BYK023, BYK024, BYK025, BYK026, BYK044, BYK065, BYK066, BYK077, BYK088, BYK094, BYK011, BYK012, BYK015, BYK016, BYK055, BYK057, BYK035, BYK037, BYK038, and BYK039.

[0024] In some more preferred embodiments of the present invention, the defoaming agent may be one or more of BYK022, BYK044, and BYK066.

[0025] Furthermore, the leveling agent includes one or more of organic silicon compounds and acrylic compounds.

[0026] In some embodiments, the leveling agent specifically includes: one or more of BYK300, BYK302, BYK306, BYK307, BYK310, BYK313, BYK320, BYK322, BYK323, BYK326, BYK327, BYK330, BYK331, BYK332, BYK333, BYK342, BYK345, BYK346, BYK347, BYK348, and BYK349.

[0027] In some preferred embodiments of the present invention, the leveling agent may be one or more of BYK330, BYK331, BYK332, etc.

[0028] Furthermore, the UV absorber includes one or more of a benzophenone ultraviolet absorber, a triazine ultraviolet absorber, a benzotriazole ultraviolet absorber, and anthracene ultraviolet absorber.

[0029] In some embodiments, the UV absorber specifically includes one or more of UV-P, UV 400, UV405, UV460, UV 928, UV531, UVS1101, UV1130, UVS1331, UV326, UV328, UV329, UV360, and UV234. In some preferred embodiments of the present invention, the UV absorber is an anthracene ultraviolet absorber, specifically UVS1331 or UVS1101.

[0030] Further, the nano color paste includes one or more of nano silicon dioxide, nano zirconium oxide, nano aluminum oxide, and carbon nanotubes;

[0031] In some preferred embodiments of the present invention, the nano-color paste is nano-silicon dioxide.

[0032] The second aspect of the present invention is to provide a method for preparing the high-resolution photosensitive resin composition for 3D printing as described above, comprising the following steps: 30-70 parts of polyurethane acrylate oligomer, 40-60 parts of active diluent, 1-6 parts of photoinitiator, 0.1-1 parts of defoamer, 0.1-1 parts of leveling agent, 0.05-2 parts of UV absorber, and 0.1-3 parts of nano-color paste are mixed, stirred and dispersed evenly, and then stored in a dark place.

[0033] Furthermore, the dispersion method adopts a high-speed disperser; further, the rotation speed of the disperser is 500-2500rpm, and the dispersion time is 20-60 minutes.

[0034] The third aspect of the present invention is to provide a method for preparing a three-dimensional molded product, the preparation method being based on the photosensitive resin composition described above;

[0035] The preparation method comprises the following steps:

[0036] S1: Pour the photosensitive resin composition evenly into the trough of a commercially available 3D printing device (405 nm light source);

[0037] S2: Construct 3D printing model and parameters and start printing;

[0038] S3: After printing, take out the molded product and place it in ethanol for cleaning for 0.5-5 minutes, and then use a 405nm light source to post-cure for 1-5 minutes.

[0039] Furthermore, the resolution of the three-dimensional formed product is ≤0.5 mm.

[0040] In one embodiment, the curing light source is ultraviolet light with a wavelength of 405 nm;

[0041] In some embodiments, the preparation of a three-dimensional molded product includes the following steps: pouring the photosensitive resin composition evenly into a material tank of a commercially available 3D printing device (405nm light source); constructing a 3D printing model and parameters and starting printing; after printing, taking out the molded product and placing it in ethanol for cleaning for 3 minutes, and then post-curing it with a 405nm light source for 3 minutes.

[0042] In some embodiments, printing parameters include: layer thickness 50 um, exposure time 2.5 s.

[0043] The fourth aspect of the present invention is the application of the photosensitive resin composition in the fields of aerospace, automobiles, precision instruments, jewelry design and manufacturing, creation of artistic sculptures, customized production of dental braces, surgical guides and bone implants.

[0044] The beneficial effects of this application are at least:

[0045] The present invention optimizes the formula of the 3D printing resin composition. The three-dimensional molded product prepared based on the high-resolution photosensitive resin composition for 3D printing provided by the present invention has high resolution (both the horizontal hole and the vertical hole do not exceed 0.5 mm); at the same time, it has high hardness (Shore hardness ≥ 80HD, tensile strength ≥ 40Mpa); and has an efficient printing speed (exposure time 2.5s); it is suitable for aerospace, automobile, precision instrument, jewelry design and manufacturing, creation of art sculptures, dental braces, surgical guides, and even customized production of bone implants. DETAILED DESCRIPTION

[0046] The technical solutions in the embodiments of the present invention are described clearly and completely below. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0047] Performance testing method:

[0048] Hardness test: refer to GB / T 2411-2008 "Determination of indentation hardness (Shore hardness) of plastics and hard rubber using a hardness tester" to perform hardness tests on the samples prepared in the examples and comparative examples;

[0049] Tensile strength test: refer to GB / T 1040-92 "Test method for tensile properties of plastics" to conduct tensile strength test on the samples prepared in the examples and comparative examples;

[0050] Resolution test method: pour the photosensitive resin composition into a commercially available 3D printing device; construct a 3D printing model and parameters and print (the printing model must include vertical and horizontal holes of 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, and 1.0mm; printing parameters: layer thickness 50um, exposure time 2.5S); test the minimum aperture that can achieve a clear and complete printing effect.

[0051] The present invention is described in detail below. The raw materials and the amounts of raw materials used in each example are shown in Table 1.

[0052] Table 1: Allocation ratio of each group in the embodiment

[0053]

[0054]

[0055] * 1 DPGDA: dipropylene glycol diacrylate;* 2 PETTA: Pentaerythritol tetraacrylate

[0056] Example 1

[0057] A method for preparing a three-dimensional molded product of a high-resolution photosensitive resin composition for 3D printing, the preparation method comprising the following steps:

[0058] 35 parts of difunctional polyurethane acrylate oligomer CN983NS, 15 parts of nonafunctional polyurethane acrylate oligomer CN9013NS, 40 parts of difunctional reactive diluent DPGDA, 10 parts of tetrafunctional reactive diluent PETTA, 3 parts of photoinitiator TPO, 0.25 parts of defoamer BYK066, 0.25 parts of leveling agent BYK332, 0.1 parts of UV absorber UVS1331, and 0.2 parts of nano-silica color paste were mixed, and then stirred and dispersed at a speed of 1500 rpm for 40 minutes using a high-speed disperser; the high-resolution photosensitive resin composition for 3D printing was prepared.

[0059] The method for preparing a three-dimensional formed product comprises the following steps:

[0060] S11: Pour the photosensitive resin composition evenly into a material tank of a commercially available 3D printing device (405 nm light source);

[0061] S12: Build a 3D printing model and parameters and start printing (the printing model needs to include vertical and horizontal holes of 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, and 1.0mm; printing parameters: layer thickness 50um, exposure time 2.5S);

[0062] S13: After printing is completed, the molded product is taken out and placed in ethanol for cleaning for 3 minutes, and then cured for 3 minutes using a 405nm light source.

[0063] Example 2

[0064] A method for preparing a three-dimensional molded product of a high-resolution photosensitive resin composition for 3D printing, the preparation method comprising the following steps:

[0065] 35 parts of difunctional polyurethane acrylate oligomer CN983NS, 15 parts of nonafunctional polyurethane acrylate oligomer CN9013NS, 40 parts of difunctional reactive diluent DPGDA, 10 parts of tetrafunctional reactive diluent PETTA, 3 parts of photoinitiator TPO, 0.25 parts of defoamer BYK066, 0.25 parts of leveling agent BYK332, 0.2 parts of UV absorber UVS1331, and 0.2 parts of nano-silica color paste were mixed, and then stirred and dispersed at a speed of 1500 rpm for 40 minutes using a high-speed disperser; the high-resolution photosensitive resin composition for 3D printing was prepared.

[0066] The method for preparing a three-dimensional formed product comprises the following steps:

[0067] S11: Pour the photosensitive resin composition evenly into a material tank of a commercially available 3D printing device (405 nm light source);

[0068] S12: Build a 3D printing model and parameters and start printing (the printing model needs to include vertical and horizontal holes of 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, and 1.0mm; printing parameters: layer thickness 50um, exposure time 2.5S);

[0069] S13: After printing is completed, the molded product is taken out and placed in ethanol for cleaning for 3 minutes, and then cured for 3 minutes using a 405nm light source.

[0070] Example 3

[0071] A method for preparing a three-dimensional molded product of a high-resolution photosensitive resin composition for 3D printing, the preparation method comprising the following steps:

[0072] 40 parts of difunctional polyurethane acrylate oligomer CN983NS, 20 parts of nonafunctional polyurethane acrylate oligomer CN9013NS, 35 parts of difunctional reactive diluent DPGDA, 5 parts of tetrafunctional reactive diluent PETTA, 3 parts of photoinitiator TPO, 0.25 parts of defoamer BYK066, 0.25 parts of leveling agent BYK332, 0.15 parts of UV absorber UVS1331, and 0.2 parts of nano-silica color paste were mixed, and then stirred and dispersed at a speed of 1500 rpm for 40 minutes using a high-speed disperser; the high-resolution photosensitive resin composition for 3D printing was prepared.

[0073] The method for preparing a three-dimensional formed product comprises the following steps:

[0074] S11: Pour the photosensitive resin composition evenly into a material tank of a commercially available 3D printing device (405 nm light source);

[0075] S12: Build a 3D printing model and parameters and start printing (the printing model needs to include vertical and horizontal holes of 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, and 1.0mm; printing parameters: layer thickness 50um, exposure time 2.5S);

[0076] S13: After printing is completed, the molded product is taken out and placed in ethanol for cleaning for 3 minutes, and then cured for 3 minutes using a 405nm light source.

[0077] Example 4

[0078] A method for preparing a three-dimensional molded product of a high-resolution photosensitive resin composition for 3D printing, the preparation method comprising the following steps:

[0079] 30 parts of difunctional polyurethane acrylate oligomer CN983NS, 10 parts of nonafunctional polyurethane acrylate oligomer CN9013NS, 45 parts of difunctional reactive diluent DPGDA, 15 parts of tetrafunctional reactive diluent PETTA, 3 parts of photoinitiator TPO, 0.25 parts of defoamer BYK066, 0.25 parts of leveling agent BYK332, 0.15 parts of UV absorber UVS1331, and 0.2 parts of nano-silica color paste were mixed, and then stirred and dispersed at a speed of 1500 rpm for 40 minutes using a high-speed disperser; the high-resolution photosensitive resin composition for 3D printing was prepared.

[0080] The method for preparing a three-dimensional formed product comprises the following steps:

[0081] S11: Pour the photosensitive resin composition evenly into a material tank of a commercially available 3D printing device (405 nm light source);

[0082] S12: Build a 3D printing model and parameters and start printing (the printing model needs to include vertical and horizontal holes of 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, and 1.0mm; printing parameters: layer thickness 50um, exposure time 2.5S);

[0083] S13: After printing is completed, the molded product is taken out and placed in ethanol for cleaning for 3 minutes, and then cured for 3 minutes using a 405nm light source.

[0084] Comparative Example 1

[0085] A method for preparing a three-dimensional molded product of a high-resolution photosensitive resin composition for 3D printing, the preparation method comprising the following steps:

[0086] 50 parts of difunctional polyurethane acrylate oligomer CN983NS, 50 parts of difunctional reactive diluent DPGDA, 3 parts of photoinitiator TPO, and 0.2 parts of nano-silica color paste were mixed, and then stirred and dispersed at a speed of 1500 rpm for 40 minutes using a high-speed disperser to obtain the high-resolution photosensitive resin composition for 3D printing.

[0087] The method for preparing a three-dimensional formed product comprises the following steps:

[0088] S11: Pour the photosensitive resin composition evenly into a material tank of a commercially available 3D printing device (405 nm light source);

[0089] S12: Build a 3D printing model and parameters and start printing (the printing model needs to include vertical and horizontal holes of 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, and 1.0mm; printing parameters: layer thickness 50um, exposure time 2.5S);

[0090] S13: After printing is completed, the molded product is taken out and placed in ethanol for cleaning for 3 minutes, and then cured for 3 minutes using a 405nm light source.

[0091] Comparative Example 2

[0092] A method for preparing a three-dimensional molded product of a high-resolution photosensitive resin composition for 3D printing, the preparation method comprising the following steps:

[0093] 35 parts of difunctional polyurethane acrylate oligomer CN983NS, 15 parts of nonafunctional polyurethane acrylate oligomer CN9013NS, 40 parts of difunctional reactive diluent DPGDA, 10 parts of tetrafunctional reactive diluent PETTA, 3 parts of photoinitiator TPO, and 0.2 parts of nano-silica color paste were mixed, and then stirred and dispersed at a speed of 1500 rpm for 40 minutes using a high-speed disperser; the high-resolution photosensitive resin composition for 3D printing was obtained.

[0094] The method for preparing a three-dimensional formed product comprises the following steps:

[0095] S11: Pour the photosensitive resin composition evenly into a material tank of a commercially available 3D printing device (405 nm light source);

[0096] S12: Build a 3D printing model and parameters and start printing (the printing model needs to include vertical and horizontal holes of 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, and 1.0mm; printing parameters: layer thickness 50um, exposure time 2.5S);

[0097] S13: After printing, take out the molded product and place it in ethanol for cleaning for 3 minutes, and then cure it with a 405nm light source for 3 minutes. Performance test results:

[0098] The three-dimensional formed products obtained in Examples 1 to 4 of the present invention and Comparative Examples 1 to 2 were tested for hardness, tensile strength, resolution and printing effect. The test results are shown in Table 2.

[0099] Table 2

[0100]

[0101] From the test results in Table 2, we can see that:

[0102] The three-dimensional molded products prepared in Examples 1 to 4 of the present invention have both high resolution (both the horizontal holes and the vertical holes are no more than 0.5 mm) and high hardness (Shore hardness ≧80HD, tensile strength ≧40Mpa); among them, the resolution of the vertical holes in Examples 2 and 3 can reach 0.4 mm, the Shore hardness of Example 4 can reach 89HD, and the tensile strength can reach 56.7Mpa. At the same time, it has an efficient printing speed (exposure time 2.5s), and is suitable for aerospace, automobiles, precision instruments, jewelry design and manufacturing, creation of artistic sculptures, dental braces, surgical guides, and even customized production of bone implants.

[0103] However, the performance of the three-dimensional molded products prepared in Comparative Examples 1-2 cannot fully meet the requirements. Among them, the three-dimensional molded product prepared in Comparative Example 1 has a relatively high resolution, but low hardness and tensile strength, and the printed product has a slight shedding abnormality. The reason is that the reactivity of the difunctional polyurethane acrylate oligomer and the difunctional reactive diluent is weak, and the crosslinking density during the reaction is low, resulting in the overall performance not meeting the requirements. The three-dimensional molded product prepared in Comparative Example 2 has high hardness and efficient printing speed, but the resolution is significantly reduced. The reason is that the addition of multifunctional polyurethane acrylate oligomers and multifunctional reactive diluents causes the reaction speed to be too fast and affects the resolution.

[0104] In summary, the present invention controls the reaction rate of the system at the microscopic level by adding a UV absorber, and compounding a suitable leveling agent and a defoaming agent to ensure that the photosensitive resin composition maintains rapid leveling and bubble-free conditions during the printing process, thereby achieving a high-resolution (both horizontal and vertical holes do not exceed 0.5 mm) three-dimensional molded product without affecting the hardness, printing speed and efficiency of the product.

[0105] Although the present invention has been disclosed as above in the form of a preferred embodiment, it is not intended to limit the present invention. Anyone familiar with this technology can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be based on the definition of the claims.

Claims

1. A photosensitive resin composition for 3D printing, characterized in that: The invention comprises the following raw materials in parts by weight:

2. The photosensitive resin composition for 3D printing according to claim 1, characterized in that: The urethane acrylate oligomer includes one or more of an aliphatic structure urethane acrylate oligomer and an aromatic structure urethane acrylate oligomer.

3. The photosensitive resin composition for 3D printing according to claim 1, characterized in that: The polyurethane acrylate oligomer is a mixture of a first oligomer and a second oligomer; The first oligomer is a polyurethane acrylate oligomer with a functionality of ≤3; the second oligomer is a polyurethane acrylate oligomer with a functionality of ≥4; The ratio of the first oligomer to the second oligomer is 2:1-3:

1.

4. The photosensitive resin composition for 3D printing according to claim 1, characterized in that: The active diluent is a mixture of a first active diluent and a second active diluent; The first reactive diluent is a monofunctional (meth)acrylate monomer or a difunctional (meth)acrylate monomer; The second reactive diluent is a multifunctional (meth)acrylate monomer having a functionality ≥ 3; The ratio of the first reactive diluent to the second reactive diluent is 7:1-3:

1.

5. The photosensitive resin composition for 3D printing according to claim 1, characterized in that: The photoinitiator includes α-hydroxy ketone photoinitiator and acylphosphine oxide photoinitiator; And / or, the defoamer includes one or more of an organosilicon defoamer, a polymer defoamer and a mineral oil defoamer; And / or, the leveling agent includes one or more of an organosilicon compound and an acrylic compound.

6. The photosensitive resin composition for 3D printing according to claim 1, characterized in that: The UV absorber includes one or more of a benzophenone type UV absorber, a triazine type UV absorber, a benzotriazole type UV absorber, and anthracene type UV absorber.

7. The photosensitive resin composition for 3D printing according to claim 1, characterized in that: The nano color paste includes one or more of nano silicon dioxide, nano zirconium oxide, nano aluminum oxide, and carbon nanotubes.

8. The method for preparing a high-resolution photosensitive resin composition for 3D printing according to any one of claims 1 to 7, characterized in that: The steps include: Mix 30-70 parts of polyurethane acrylate oligomer, 40-60 parts of active diluent, 1-6 parts of photoinitiator, 0.1-1 parts of defoamer, 0.1-1 parts of leveling agent, 0.05-2 parts of UV absorber and 0.1-3 parts of nano color paste, stir and disperse evenly, then store in a dark place.

9. A method for preparing a three-dimensional formed product, characterized in that: A photosensitive resin composition according to any one of claims 1 to 7 or a photosensitive resin composition prepared by the preparation method according to claim 8; The preparation method comprises the following steps: S1: Pour the photosensitive resin composition evenly into a material tank of a commercially available 3D printing device; S2: Construct 3D printing model and parameters and start printing; S3: After printing, take out the molded product and place it in ethanol for cleaning for 0.5-5 minutes, and then post-cure it with a 405nm light source for 1-5 minutes; The resolution of the three-dimensional formed product is ≤0.5 mm.

10. Use of the photosensitive resin composition according to any one of claims 1 to 7, characterized in that: It is used in aerospace, automobile, precision instrument, jewelry design and manufacturing, art sculpture creation, dental braces, surgical guides and customized production of bone implants.

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