Black photosensitive resin composition, black partition wall using same, display device, and method for producing partition wall

Abstract

Provided are a black photosensitive resin composition, a black partition wall manufactured using the black photosensitive resin composition, a display device including the black partition wall, and a method of manufacturing the black partition wall, the black photosensitive resin composition including: (A) a binder resin; (B) a black colorant comprising lactam black; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; and (E) a solvent, wherein an optical density (OD) per 1 [mu] m is greater than or equal to about 1.5.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority and benefits of Korean Patent Application No. 10-2023-0082163 filed in the Korean Intellectual Property Office on June 26, 2023 and Korean Patent Application No. 10-2024-0068608 filed in the Korean Intellectual Property Office on May 27, 2024, the entire contents of which are incorporated herein by reference. Technical Field

[0003] The present specification relates to a black photosensitive resin composition, a black partition wall using the black photosensitive resin composition, a display device, and a method for manufacturing the black partition wall. Background Art

[0004] Recently, there is an increasing interest in self-luminous (emissive) micro organic light emitting diode (OLED) display panels for use in virtual reality (VR) devices, augmented reality (AR) devices, and mixed reality (MR) devices.

[0005] In a micro OLED display panel having pixels about 10 times smaller than a general OLED display panel, it is difficult to accurately form red (R) / green (G) / blue (B) light emitting layers by using a conventional fine metal mask (FMM) technology, and therefore a color filter is applied to the micro OLED display panel.

[0006] The color filter applied to the micro OLED display panel is made of a photosensitive organic material in which particles dispersed in a form have a wide bandwidth transmission spectrum for each RGB, and has the disadvantages of low color reproducibility (color gamut) and the occurrence of minute light leakage.

[0007] As an alternative for improving the low color gamut, a color filter made of an inorganic material can be considered, but has a narrow bandwidth transmission spectrum for each RGB, and thus has a high color gamut but still has the disadvantage of excessive light leakage. Therefore, it is necessary to study a technology that can completely block light leakage while providing high color reproducibility.

[0008] On the other hand, the photosensitive resin composition is a basic material for manufacturing color filters, liquid crystal display materials, display devices (such as organic light emitting diodes and the like), display elements (such as display device panel materials and the like). For example, color filters such as color liquid crystal displays and the like require a photosensitive resin layer (such as a black partition wall at the boundary between coloring layers such as red, green, blue and the like) in order to enhance display contrast or color development effect, and such a photosensitive resin layer is mainly formed of a black photosensitive resin composition.

[0009] However, if a conventionally known black photosensitive resin composition is used to form a cured layer (such as a black partition wall and the like), the curing (baking) process is generally performed at a high temperature of more than about 150° C. Therefore, if the cured layer is directly formed on a display device, there is a problem of deteriorating internal elements of the display device.

[0010] Therefore, research and development are underway to develop a black photosensitive resin composition for micro OLEDs that can be cured at low temperatures, completely block light leakage, and achieve ultra-high resolution patterns. Summary of the invention

[0011] Some embodiments provide a black photosensitive resin composition having high optical density, curable at low temperature, and capable of realizing an ultra-high resolution pattern of 2 μm or less.

[0012] Some embodiments provide a black partition wall manufactured using a photosensitive resin composition.

[0013] Some embodiments provide a display device including a black partition wall.

[0014] Some embodiments provide a method of manufacturing a black partition wall.

[0015] Some embodiments provide a black photosensitive resin composition, comprising: (A) a binder resin; (B) a black colorant comprising lactam black; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; and (E) a solvent, wherein the optical density (OD) per 1 μm is greater than or equal to about 1.5.

[0016] The black colorant may be included in an amount of about 60 wt % to about 80 wt % based on the total amount of the black photosensitive resin composition.

[0017] The black colorant may be comprised of lactam black mill base.

[0018] The black photosensitive resin composition may have an optical density (OD) per 1 μm of greater than or equal to about 2.0.

[0019] The black photosensitive resin composition may be curable at a temperature of less than or equal to about 100°C.

[0020] The binder resin may include an acrylic binder resin.

[0021] The acrylic binder resin may have a double bond equivalent weight of greater than or equal to about 340 g / mol.

[0022] The black photosensitive resin composition may include, based on the total amount of the black photosensitive resin composition: about 1 wt % to about 10 wt % of the (A) binder resin; about 60 wt % to about 80 wt % of the (B) black colorant; about 0.5 wt % to about 5 wt % of the (C) photopolymerizable monomer; about 0.1 wt % to about 3 wt % of the (D) photopolymerization initiator; and the balance of the (E) solvent.

[0023] The black photosensitive resin composition may further include the following additives: malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a surfactant, a polymerization inhibitor, or a combination thereof.

[0024] Some embodiments provide black partition walls manufactured using the black photosensitive resin composition.

[0025] Some embodiments provide a display device including the black partition wall.

[0026] The display device may be a micro OLED display device, which includes an OLED substrate deposited on a silicon wafer, an inorganic layer stacked on the OLED substrate, an adhesive protective layer stacked on the inorganic layer, and a color filter layer, wherein the color filter layer is stacked on the adhesive protective layer and converts white light generated from the OLED substrate into light of multiple colors, wherein the color filter layer includes a red filter, a green filter, and a blue filter, and the black partition wall is located between each color filter.

[0027] The display device may be a micro OLED display device further including a micro lens array located on the adhesive protection layer and surrounding the color filter layer and the black partition wall.

[0028] The adhesive protection layer may have a thickness of less than or equal to about 1 μm.

[0029] The color filter layer may have a thickness of about 1.1 μm to about 1.6 μm.

[0030] The black partition wall may have a thickness of about 0.5 μm to about 1.2 μm.

[0031] The inorganic layer may have a thickness of less than or equal to about 2 μm.

[0032] Some embodiments provide a method of manufacturing a black partition wall, the method comprising: coating the black photosensitive resin composition; performing prebaking at a temperature of less than or equal to about 100° C. after the coating; and exposing to i-line and performing development after the prebaking.

[0033] Other embodiments of the invention are included in the detailed description that follows.

[0034] The micro OLED display device including the black partition wall formed by curing the black photosensitive resin composition containing lactam black according to the embodiment at low temperature exhibits excellent light leakage blocking ability and realizes ultra-high resolution pattern, and thus can be applied to VR (virtual reality) devices, AR (augmented reality) devices and MR (mixed reality) devices that have recently begun to be released on the market. In other words, some embodiments provide a black photosensitive resin composition for forming a black partition wall that can be cured at low temperature and has excellent chemical resistance, and specifically, provide a black photosensitive resin composition having high reliability and patterning ability by pre-baking at a temperature of about 100° C. or less and performing photocuring (i-line exposure) alone, the black photosensitive resin composition is different from the traditional black material in that: the black photosensitive resin composition has the characteristic of curing at a low temperature of about 100° C. or less, realizes an ultra-high resolution pattern of about 2 μm or less, and has an optical density ( / μm) of about 1.5 or more, and specifically about 2.0 or more. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 is a schematic diagram showing the structure of a micro OLED display device according to some embodiments. DETAILED DESCRIPTION

[0036] Embodiments of the present invention are described in detail below. However, these embodiments are exemplary, the present invention is not limited thereto, and the present invention is defined by the scope of the claims.

[0037] As used herein, when a specific definition is not otherwise provided, “alkyl” refers to a C1 to C20 alkyl group, “alkenyl” refers to a C2 to C20 alkenyl group, “cycloalkenyl” refers to a C3 to C20 cycloalkenyl group, “heterocycloalkenyl” refers to a C3 to C20 heterocycloalkenyl group, “aryl” refers to a C6 to C20 aryl group, “arylalkyl” refers to a C6 to C20 arylalkyl group, “alkylene” refers to a C1 to C20 alkylene group, “arylene” refers to a C6 to C20 arylene group, “alkylarylene” refers to a C6 to C20 alkylarylene group, “heteroarylene” refers to a C3 to C20 heteroarylene group, and “alkyleneoxy” refers to a C1 to C20 alkyleneoxy group.

[0038] As used herein, when a specific definition is not otherwise provided, “substituted” means that at least one hydrogen of the compound is replaced by a substituent selected from the group consisting of a halogen atom (F, Cl, Br or I), a hydroxyl group, a C1 to C20 alkoxy group, a nitro group, a cyano group, an amine group, an imino group, an azido group, an amidino group, a hydrazine group, a hydrazone group, a carbonyl group, a carbamoyl group, a thiol group, an ester group, an ether group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphate group or a salt thereof, a C1 to C20 alkyl group, a C2 to C20 alkenyl group, a C2 to C20 alkynyl group, a C6 to C20 aryl group, a C3 to C20 cycloalkyl group, a C3 to C20 cycloalkenyl group, a C3 to C20 cycloalkynyl group, a C2 to C20 heterocycloalkyl group, a C2 to C20 heterocycloalkenyl group, a C2 to C20 heterocycloalkynyl group, a C3 to C20 heteroaryl group, or a combination thereof.

[0039] As used herein, when a specific definition is not otherwise provided, "hetero" means including at least one heteroatom of N, O, S and P in a chemical formula.

[0040] As used herein, when a specific definition is not otherwise provided, “(meth)acrylate” refers to both “acrylate” and “methacrylate”, and “(meth)acrylic acid” refers to both “acrylic acid” and “methacrylic acid”.

[0041] As used herein, when no definition is otherwise provided, the term "combination" refers to mixing or copolymerization. In addition, "copolymerization" refers to block copolymerization to random copolymerization, and "copolymer" refers to block copolymer to random copolymer.

[0042] In the chemical formulae in the present specification, unless a specific definition is otherwise provided, when a chemical bond is not drawn where it should be given, a hydrogen bond is made at the position.

[0043] As used herein, when a definition is not otherwise provided, "*" refers to a connecting moiety between the same atom or different atoms or chemical formulas.

[0044] According to some embodiments, a black photosensitive resin composition includes: (A) a binder resin; (B) a black colorant including lactam black; (C) a photopolymerizable monomer; (D) a photopolymerization initiator; and (E) a solvent, wherein an optical density (OD) per 1 μm is greater than or equal to about 1.5.

[0045] Conventional color photoresists are negative photosensitive liquid materials that realize color patterns of red, green, and blue, and technological development has been progressing in the direction of gradually modifying the composition of the liquid material. For example, attempts have been made to improve color purity by modifying the type or content of a pigment dispersion as a coloring material that realizes a color pattern, to improve patterning capability by modifying the composition of a binder resin or a photopolymerization initiator, or to improve coating properties and color uniformity by using other additives such as a leveling agent.

[0046] The photosensitive resin composition according to the embodiment is a black photosensitive resin composition capable of forming black partition walls arranged between red filters, green filters and blue filters. It is designed to achieve high color reproducibility, realize high-resolution pixels, prevent light leakage, and form ultra-high-resolution patterns, so that it is optimal for VR (virtual reality), AR (augmented reality) and MR (mixed reality) displays as the next generation of displays, and also utilizes low temperature and separate photocuring to ensure high reliability and patterning capabilities, which is very advantageous in terms of process.

[0047] In the following, each component is described in detail.

[0048] (A) Binder resin

[0049] The binder resin may include an acrylic binder resin.

[0050] The acrylic binder resin is a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and is a resin including at least one acrylic acid repeating unit.

[0051] The first ethylenically unsaturated monomer is an ethylenically unsaturated monomer including at least one carboxyl group. Examples of the monomer include acrylic acid, methacrylic acid, maleic acid, itaconic acid, fumaric acid, or a combination thereof.

[0052] The first ethylenically unsaturated monomer may be included in an amount of about 5 wt % to about 50 wt %, for example, about 10 wt % to about 40 wt %, based on the total amount of the acrylic binder resin.

[0053] Examples of the second ethylenically unsaturated monomer may include: aromatic vinyl compounds such as styrene, α-methylstyrene, vinyltoluene, vinylbenzyl methyl ether, etc.; unsaturated carboxylic acid ester compounds such as methyl (meth)acrylate, ethyl (meth)acrylate, butyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, benzyl (meth)acrylate, cyclohexyl (meth)acrylate, phenyl (meth)acrylate, etc.; unsaturated carboxylic acid aminoalkyl ester compounds such as 2-aminoethyl (meth)acrylate, 2-dimethylaminoethyl (meth)acrylate, etc.; carboxylic acid vinyl ester compounds such as vinyl acetate, vinyl benzoate, etc.; unsaturated carboxylic acid glycidyl ester compounds such as glycidyl (meth)acrylate, etc.; vinyl cyanide compounds such as (meth)acrylonitrile, etc.; unsaturated amide compounds such as (meth)acrylamide, etc.; and the like, and the compounds may be used alone or in the form of a mixture of two or more.

[0054] Specific examples of the acrylic binder resin may be (meth)acrylic acid / benzyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene copolymer, (meth)acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer, and the like, but are not limited thereto, and the acrylic resins may be used alone or in the form of a mixture of two or more thereof.

[0055] The acrylic binder resin may have a weight average molecular weight of about 3,000 g / mol to about 20,000 g / mol and a double bond equivalent weight of about 340 g / mol or more. If the weight average molecular weight and the double bond equivalent weight of the acrylic binder resin are within the above ranges, excellent pattern forming properties may be achieved, and the resulting film may have excellent mechanical and thermal properties.

[0056] The binder resin may also include an epoxy-based binder resin.

[0057] The binder resin may improve heat resistance by further including an epoxy-based binder resin. The epoxy-based binder resin may include, for example, phenol novolac epoxy resin, tetramethyl biphenyl epoxy resin, bisphenol A epoxy resin, bisphenol F epoxy resin, alicyclic epoxy resin, or a combination thereof, but is not limited thereto.

[0058] Furthermore, the binder resin including the epoxy-based binder resin ensures dispersion stability of a colorant such as a pigment, which will be described later, and helps to form pixels having a desired resolution during a development process.

[0059] The epoxy-based binder resin may be included in an amount of about 1 wt % to about 10 wt %, for example, about 5 wt % to about 10 wt %, based on the total amount of the binder resin. If the epoxy-based binder resin is included within the above range, the residual film rate and chemical resistance may be greatly improved.

[0060] The epoxy-based binder resin may have an epoxy equivalent weight of about 150 g / eq to about 200 g / eq. If the binder resin includes an epoxy-based binder resin having an epoxy equivalent weight within the above range, it has a beneficial effect in improving the curability of the formed pattern and fixing the colorant in the structure in which the pattern is formed.

[0061] The binder resin can be dissolved in a solvent described later in a solid form to form a photosensitive resin composition. In this case, the binder resin in a solid form can be contained in an amount of about 0.1 wt % to about 30 wt %, for example, about 20 wt % to about 30 wt %, based on the total amount of the binder resin solution dissolved in the solvent.

[0062] In addition, the binder resin may be included in an amount of about 0.1 wt % to about 20 wt %, specifically about 0.5 wt % to about 15 wt %, for example, about 1 wt % to about 10 wt %, based on the total amount of the photosensitive resin composition. If the binder resin is included within the above range, excellent sensitivity, developability, resolution and linearity of the pattern can be obtained.

[0063] (B) Black colorant

[0064] The black colorant included in the photosensitive resin composition according to an embodiment may include lactam black to improve light blocking properties, and thus easily realize a black color.

[0065] In general, in order to improve the light blocking property, carbon black is widely used alone as a black colorant, but when carbon black is used alone, excellent optical density can be obtained, but other properties (such as electrical properties and the like) other than optical density may be deteriorated. In particular, if carbon black is used alone, low-temperature curing and high-resolution pattern formation cannot be achieved due to the reduction of transmittance in the ultraviolet (UV) region, resulting in inability to be applied to micro OLED displays, which are next-generation displays applied to VR (virtual reality) devices, AR (augmented reality) devices, and MR (mixed reality) devices.

[0066] Therefore, attempts have been made to use an organic black pigment (e.g., color mixing, etc. (e.g., RGB black, etc.)) as a black colorant, which can relatively slightly deteriorate light blocking properties compared to the case of using carbon black alone, but have sufficient light blocking performance, and at the same time improve other characteristics such as electrical characteristics and the like. However, such attempts have very low optical density, and even if better than the case of using carbon black alone, the transmittance in the UV region is still low, forming an inferior pattern, and thus there may be difficulties when applied to micro OLED displays as next-generation displays.

[0067] This tendency is also the same as the case where the photosensitive resin composition further contains carbon black and an organic black pigment as a black colorant.

[0068] Therefore, the inventors have confirmed that the above problems can be solved by using lactam black instead of traditional black colorants (such as carbon black or organic black pigments), and then the present invention is completed. Specifically, in the black photosensitive resin composition according to the embodiment, the black colorant containing lactam black can be included in an amount of about 60 wt % to about 80 wt %, for example, about 60 wt % to about 70 wt %, based on the total amount of the black photosensitive resin composition. Herein, since the optical density (OD) can be very easily controlled to be greater than or equal to about 1.5 per 1 μm, and specifically greater than or equal to about 2.0 per 1 μm, and in addition, the transmittance in the UV region can be prevented from decreasing, and in addition, low temperature curing and high-resolution pattern formation of about 2 μm or less than 2 μm are facilitated, the black photosensitive resin composition according to the embodiment can be applied to micro OLED displays as next-generation displays without difficulty.

[0069] For example, the black colorant may be comprised of lactam black millbase.

[0070] The lactam black mill base may include solid lactam black, a dispersant, and a solvent described later. Specifically, the lactam black may be used by surface-treating the lactam black with a dispersant in advance, or the dispersant may be added together with the lactam black when preparing the composition. The solid content of the lactam black may be included in an amount of about 5 wt % to about 40 wt %, for example, about 8 wt % to about 30 wt %, based on the total amount of the lactam black mill base.

[0071] The dispersant may be a nonionic dispersant, an anionic dispersant, a cationic dispersant and the like. Specific examples of the dispersant may be polyalkylene glycol and its ester, polyoxyalkylene, polyol ester alkylene oxide addition product, alcohol alkylene oxide addition product, sulfonic acid ester, sulfonic acid salt, carboxylic acid ester, carboxylic acid salt, alkylamide alkylene oxide addition product, alkylamine and the like, and the dispersant may be used alone or in the form of a mixture of two or more thereof.

[0072] Commercially available examples of dispersants may include: DISPERBYK-101, DISPERBYK-130, DISPERBYK-140, DISPERBYK-160, DISPERBYK-161, DISPERBYK-162, DISPERBYK-163, DISPERBYK-164, DISPERBYK-165, DISPERBYK-166, DISPERBYK-170, DISPERBYK-171, DISPERBYK-182, DISPERBYK-2000, DISPERBYK-2001 and similar materials made by BYK Co., Ltd.; Co.); Solsperse 5000, Solsperse 12000, Solsperse 13240, Solsperse 13940, Solsperse 17000, Solsperse 20000, Solsperse 24000GR, Solsperse 27000, Solsperse 28000 and similar materials made by AstraZeneka Co.; or PB711 or PB821 made by Ajinomoto Inc.

[0073] The dispersant may be included in an amount of about 0.1 wt % to about 15 wt % based on the total amount of the black photosensitive resin composition. If the dispersant is included within the above range, the composition has excellent dispersibility, and thus when a black partition wall is manufactured, stability, developability, and patterning capability are excellent.

[0074] Lactam black can also be used after pretreatment with a water-soluble inorganic salt and a wetting agent. When lactam black is used after pretreatment, the average particle size of lactam black can be fine.

[0075] The pretreatment may be performed by kneading lactam black with a water-soluble inorganic salt and a wetting agent, and then filtering and washing the kneaded lactam black.

[0076] Kneading may be performed at a temperature of about 40° C. to about 100° C., and filtering and washing may be performed by filtering the lactam black after washing away the inorganic salt with water or the like.

[0077] Examples of water-soluble inorganic salts may be sodium chloride, potassium chloride and similar materials, but are not limited thereto. The wetting agent allows the pigment to be uniformly mixed with the water-soluble inorganic salt and crushed. Examples of wetting agents include: alkylene glycol monoalkyl ethers, such as ethylene glycol monoethyl ether, propylene glycol monomethyl ether, diethylene glycol monomethyl ether, etc.; and alcohols, such as ethanol, isopropanol, butanol, hexanol, cyclohexanol, ethylene glycol, diethylene glycol, polyethylene glycol, glycerol polyethylene glycol, etc. The materials may be used alone or in the form of a mixture of two or more thereof.

[0078] The kneaded lactam black may have an average particle size of about 5 nm to about 200 nm, for example, about 5 nm to about 150 nm. If the average particle size of lactam black is within the above range, the stability of the lactam black mill base is improved, and there is no concern about deterioration of pixel resolution.

[0079] In addition to lactam black, the black colorant may also include an organic black pigment (eg, a color mixture such as the aforementioned carbon black and / or RGB black).

[0080] (C) Photopolymerizable monomer

[0081] The photopolymerizable monomer in the black photosensitive resin composition according to some embodiments may be a single compound or a mixture of two different compounds.

[0082] If the photopolymerizable monomer is a mixture of two different compounds, one of the two compounds may be a compound including at least two functional groups represented by Chemical Formula 1.

[0083] [Chemical formula 1]

[0084]

[0085] In Chemical Formula 1,

[0086] R 6 is a hydrogen atom or a substituted or unsubstituted C1 to C10 alkyl group, and

[0087] L 8 is a single bond or a substituted or unsubstituted C1 to C10 alkylene group.

[0088] For example, the compound including at least two functional groups represented by Chemical Formula 1 may include 2 to 6 functional groups represented by Chemical Formula 1. In this case, sufficient polymerization occurs during exposure in a pattern forming process to form a pattern having excellent heat resistance, light resistance, and chemical resistance.

[0089] For example, the compound including at least two functional groups represented by Chemical Formula 1 may be a compound represented by Chemical Formula 2 or Chemical Formula 3.

[0090] [Chemical formula 2]

[0091]

[0092] [Chemical formula 3]

[0093]

[0094] In Chemical Formula 2 and Chemical Formula 3,

[0095] p, q, r and s are independently integers of 1 to 10.

[0096] When the photopolymerizable monomer is a mixture of two different compounds, the other of the two compounds may be a monofunctional or polyfunctional ester compound of (meth)acrylic acid having at least one ethylenically unsaturated double bond.

[0097] The monofunctional or polyfunctional (meth)acrylic acid ester compound having at least one ethylenically unsaturated double bond may be, for example, ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, bisphenol A di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate. acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol hexa(meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, bisphenol A epoxy (meth)acrylate, ethylene glycol monomethyl ether (meth)acrylate, trimethylolpropane tri(meth)acrylate, tri(meth)acryloyloxyethyl phosphate, novolac epoxy (meth)acrylate, or a combination thereof.

[0098] Commercially available products of monofunctional or polyfunctional ester compounds of (meth)acrylic acid having at least one ethylenically unsaturated double bond are as follows. Examples of monofunctional esters of (meth)acrylic acid may include: Aronix (Toagosei Chemistry Industry Co., Ltd.); KAYARAD (Nippon Kayaku Co., Ltd.); (Osaka Organic Chemical Ind., Ltd.) etc. Examples of difunctional esters of (meth)acrylic acid may include: Anix (Toa Synthetic Chemical Industry Co., Ltd.), Kayalade (Nippon Kayaku Co., Ltd.), V-335 (Osaka Organic Chemical Industry Co., Ltd.) etc. Examples of the trifunctional ester of (meth)acrylic acid may include: Anix (Toa Synthetic Chemical Industry Co., Ltd.), Kayalade (Nippon Kayaku Co., Ltd.), (Osaka YukiKayaku Kogyo Co. Ltd.), etc. The products may be used alone or in the form of a mixture of two or more.

[0099] The photopolymerizable monomer may be used after being treated with an acid anhydride to provide better developability.

[0100] The photopolymerizable monomer may be included in an amount of about 0.5 wt % to about 10 wt %, for example, about 0.5 wt % to about 5 wt %, for example, about 1 wt % to about 5 wt %, based on the total amount of the black photosensitive resin composition. If the photopolymerizable monomer is included within the above range, curing occurs sufficiently during exposure in the pattern forming process, resulting in excellent reliability of the pattern, excellent heat resistance, light resistance and chemical resistance, and excellent resolution and adhesion.

[0101] (D) Photopolymerization initiator

[0102] The black photosensitive resin composition according to some embodiments includes a photopolymerization initiator, which may include acetophenone compounds, benzophenone compounds, thioxanthone compounds, benzoin compounds, triazine compounds, oxime compounds, and the like.

[0103] Examples of acetophenone compounds may be 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, p-tert-butyltrichloroacetophenone, p-tert-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, and the like.

[0104] Examples of benzophenone compounds include benzophenone, benzoyl benzoate, benzoyl methyl benzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, and the like.

[0105] Examples of the thioxanthone compounds may include thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, and the like.

[0106] Examples of the benzoin-based compound include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, and the like.

[0107] Examples of triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, -triazine, 2-biphenyl-4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-phenylvinyl-s-triazine, 2-(naphthol-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphthol-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4-bis(trichloromethyl)-6-piperonyl-s-triazine, 2-4-bis(trichloromethyl)-6-(4-methoxyphenylvinyl)-s-triazine, etc.

[0108] Examples of oxime compounds may be O-acyl oxime compounds, 2-(O-benzoyl oxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyl oxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone, O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one, and the like. Specific examples of O-acyl oxime compounds may be 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 1-(4-phenylsulfanylphenyl)-butane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1-one oxime-O-acetate, 1-(4-phenylsulfanylphenyl)-butan-1-one oxime-O-acetate, and the like.

[0109] In addition to the above compounds, the photopolymerization initiator may be used together with, for example, carbazole compounds, diketone compounds, sulfonium borate compounds, diazo compounds, imidazole compounds, biimidazole compounds, and the like.

[0110] The photopolymerization initiator may be included in an amount of about 0.1 wt % to about 5 wt %, for example, about 0.1 wt % to about 3 wt %, based on the total amount of the black photosensitive resin composition. If the photopolymerization initiator is included within the above range, sufficient photopolymerization occurs during exposure in a pattern forming process for manufacturing a color filter, achieving excellent sensitivity and improved transmittance.

[0111] (E) Solvent

[0112] The solvent may be a material having compatibility with, but not reacting with, the pigment dispersion including the black colorant, the binder resin, the photopolymerizable monomer, and the photopolymerization initiator.

[0113] Examples of the solvent may include: alcohols such as methanol, ethanol, etc.; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methyl phenyl ether, tetrahydrofuran, etc.; glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol dimethyl ether, etc.; celulose acetates such as methyl celulose acetate, ethyl celulose acetate, diethyl celulose acetate, etc.; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol diethyl ether, etc.; propylene glycol alkyl ether acetates, For example, propylene glycol methyl ether acetate, propylene glycol propyl ether acetate, etc.; aromatic hydrocarbons, such as toluene, xylene, etc.; ketones, such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-pentyl ketone, 2-heptanone, etc.; saturated aliphatic monocarboxylic acid alkyl esters, such as ethyl acetate, n-butyl acetate, isobutyl acetate, etc.; lactic acid esters, such as methyl lactate, ethyl lactate, etc.; oxyacetic acid alkyl esters, such as methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, etc.; alkoxyacetic acid alkyl esters, such as methoxyacetic acid methyl ester, ethyl methoxypropionate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, etc.; alkyl 3-oxypropionate, such as methyl 3-oxypropionate, ethyl 3-oxypropionate, etc.; alkyl 3-alkoxypropionate, such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, etc.; alkyl 2-oxypropionate, such as methyl 2-oxypropionate, ethyl 2-oxypropionate, propyl 2-oxypropionate, etc.; alkyl 2-alkoxypropionate, such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, propyl 2-oxypropionate, etc. ethyl ester, ethyl 2-ethoxypropionate, methyl 2-ethoxypropionate, etc.; 2-oxy-2-methylpropionic acid esters, such as methyl 2-oxy-2-methylpropionate, ethyl 2-oxy-2-methylpropionate, etc.; monooxymonocarboxylic acid alkyl esters of 2-alkoxy-2-methylpropionic acid alkyl esters, such as methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate, etc.; esters, such as 2-hydroxyethyl propionate, 2-hydroxy-2-methylethyl propionate, hydroxyethyl acetate, 2-hydroxy-3-methylethyl butyrate, etc.; ketoesters, such as ethyl pyruvate, etc. In addition, high boiling point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, hexanoic acid, octanoic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, phenyl celulose acetate, etc. can also be used.

[0114] Taking into account the miscibility and reactivity, the following can be used: glycol ethers, such as ethylene glycol monoethyl ether, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, etc.; ethylene glycol alkyl ether acetates, such as ethyl celulose acetate, etc.; esters, such as 2-hydroxyethyl propionate, etc.; carbitols, such as diethylene glycol monomethyl ether, etc.; propylene glycol alkyl ether acetates, such as propylene glycol monomethyl ether acetate, propylene glycol propyl ether acetate, etc.

[0115] The solvent may be included in an amount of a balance, such as about 10 wt % to about 40 wt %, such as about 10 wt % to about 30 wt %, based on the total amount of the black photosensitive resin composition. If the solvent is included within the range, the black photosensitive resin composition may have an appropriate viscosity, and thus processability is improved during the production of the black partition wall.

[0116] (F) Other additives

[0117] Meanwhile, the black photosensitive resin composition may further include additives such as malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a surfactant, a polymerization inhibitor or a combination thereof.

[0118] The silane coupling agent may have a reactive substituent (eg, a vinyl group, a carboxyl group, a methacryloxy group, an isocyanate group, or an epoxy group) to improve adhesion to the substrate.

[0119] Examples of silane coupling agents may include trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, γ-glycidyloxypropyltrimethoxysilane, β-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, etc. The silane coupling agents may be used alone or in the form of a mixture of two or more.

[0120] The silane-based coupling agent may be included in an amount of about 0.01 parts by weight to about 10 parts by weight based on 100 parts by weight of the photosensitive resin composition. If the silane-based coupling agent is included within the above range, adhesion, storage ability, and the like are improved.

[0121] In addition, if necessary, the photosensitive resin composition may further include a surfactant, such as a fluorine-based surfactant and / or a silicone-based surfactant, to improve coating properties and prevent defect formation.

[0122] Examples of fluorine-based surfactants include commercial fluorine-based surfactants such as BM Chemie Inc. etc.; MEGAFACE F from Dainippon Ink KagakuKogyo Co., Ltd. Megafa F Megafa F Megafa F Megafa F etc.; FULORAD of SUMITOMO 3M Co., Ltd. Florard Florard Florard etc.; SURFLON of Asahi Glass Co., Ltd. Saffron Saffron Saffron Saffron etc.; Toray Silicone Co., Ltd. wait.

[0123] The silicone surfactant may be a commercial silicone surfactant, such as BYK-307, BYK-333, BYK-361N, BYK-051, BYK-052, BYK-053, BYK-067A, BYK-077, BYK-301, BYK-322, BYK-325, etc. from BYK Chem.

[0124] The surfactant may be used in an amount of about 0.001 to about 5 parts by weight based on 100 parts by weight of the photosensitive resin composition. If the surfactant is included within the range, coating uniformity may be ensured, stains may not be generated, and wettability on an indium zinc oxide (IZO) substrate or a glass substrate may be improved.

[0125] The polymerization inhibitor may include a hydroquinone compound, a catechol compound, or a combination thereof, but is not necessarily limited thereto. Since the black photosensitive resin composition according to some embodiments further includes a hydroquinone compound, a catechol compound, or a combination thereof, room temperature crosslinking can be prevented during exposure after coating the black photosensitive resin composition.

[0126] For example, the hydroquinone compound, the catechol compound or a combination thereof may include hydroquinone, methyl hydroquinone, methoxy hydroquinone, tert-butyl hydroquinone, 2,5-di-tert-butyl hydroquinone, 2,5-bis(1,1-dimethylbutyl) hydroquinone, 2,5-bis(1,1,3,3-tetramethylbutyl) hydroquinone, catechol, tert-butyl catechol, 4-methoxyphenol, pyrogallol, 2,6-di-tert-butyl-4-methylphenol, 2-naphthol, tris(N-hydroxy-N-nitrosophenylaminato-O,O')aluminum or a combination thereof, but is not necessarily limited thereto.

[0127] The hydroquinone compound, the catechol compound or a combination thereof may be used in the form of a dispersion, and the polymerization inhibitor in the form of a dispersion may be included in an amount of about 0.001 wt % to about 3 wt %, for example, about 0.01 wt % to about 1 wt %, based on the total amount of the black photosensitive resin composition. If the polymerization inhibitor is included within the above range, the aging problem at room temperature can be solved, and sensitivity degradation and surface peeling can be prevented.

[0128] Furthermore, the black photosensitive resin composition may include a predetermined amount of other additives such as antioxidants, stabilizers, and the like unless the additives deteriorate the properties of the black photosensitive resin composition.

[0129] The black photosensitive resin composition according to some embodiments may be positive or negative, but should be negative to completely remove residues in a region where a pattern is exposed after exposing and developing the composition having a light-blocking property.

[0130] Another embodiment provides a black partition wall manufactured by exposing, developing and curing the black photosensitive resin composition.

[0131] The method of manufacturing the black partition walls is as follows.

[0132] (1) Coating and film formation

[0133] The black photosensitive resin composition is coated on a substrate (e.g., a glass substrate or an ITO substrate and the like) that has been pre-treated in advance to have a desired thickness using a spin coating method or a slit coating method, a roll coating method, a screen printing method, an applicator method, and the like, and heated at about 100° C. for about 1 minute to 10 minutes to remove the solvent and thereby form a photosensitive resin layer. Through this step, image quality, etc. can be improved.

[0134] (2) Exposure

[0135] After a mask is set to form a necessary pattern on the obtained photosensitive resin layer, exposure is performed by radiating actinic rays of i-line. As a light source for irradiation, a low-pressure mercury lamp, a high-pressure mercury lamp, an ultra-high-pressure mercury lamp, a metal halide lamp, an argon laser, etc. can be used, and in some cases, X-rays, electron beams and similar light sources can be used.

[0136] When a high pressure mercury lamp is used, the exposure process uses, for example, 500 mJ / cm 2 Or less than 500mJ / cm 2 The light dose is 200 nm (using a 365 nm sensor). However, the light dose may vary depending on the type of each component, their combination ratio, and the dry film thickness. Through this step, the pixel size can be fine-tuned, thereby enabling high resolution to be achieved.

[0137] (3) Development

[0138] In the development method, after the exposure step, an alkaline aqueous solution is used as a developer to dissolve and remove unnecessary parts, leaving only the exposed parts to form a pattern. Through this step, a contour can be formed to achieve high resolution.

[0139] (4) Post-processing

[0140] There is a post-heating process to obtain a pattern excellent in heat resistance, light resistance, adhesion, crack resistance, chemical resistance, high strength, and storage stability of the image pattern obtained by development in the above process. For example, after development, it can be heated at 250° C. for 1 hour in a convection oven. Through this step, color uniformity can be ensured and transparency can be improved.

[0141] Some embodiments provide a display device including a black partition wall.

[0142] The display device may be a micro organic light emitting diode (OLED) display device.

[0143] Reference Figure 1 A micro organic light emitting diode (OLED) display device may include an OLED substrate deposited on a silicon wafer, an inorganic layer stacked on the OLED substrate, an adhesive protective layer stacked on the inorganic layer, and a color filter layer stacked on the adhesive protective layer and converting white light generated from the OLED substrate into light of multiple colors, wherein the color filter layer includes a red filter, a green filter, and a blue filter, and a black partition wall is located between each color filter.

[0144] Conventionally, an OLED substrate in which an OLED is deposited on a glass or polyimide substrate has been used, but a micro OLED display device according to some embodiments may be more advantageous in realizing a micro display because the OLED is deposited on a silicon wafer. These micro displays have attracted much attention as next generation displays, and it is expected that micro displays will be applied to devices such as MR. In fact, Apple, Meta, and LG Display have all entered or announced their entry into the next generation MR device market.

[0145] For example, the micro OLED display device may further include a micro lens array, which may be located on the adhesive protection layer and surround the color filter layer and the black partition wall.

[0146] By depositing WOLED on a highly integrated silicon wafer, a micro OLED display device having the above structure can be driven on a pixel basis, and the transmission wavelength can be easily controlled through a color filter layer patterned with a resolution of less than or equal to about 3 μm, thereby enabling high color reproduction and ensuring high resolution.

[0147] For example, the adhesive protection layer may be a cured layer of a composition including a binder resin, a photopolymerization initiator, a photopolymerizable monomer, a solvent, etc., and the lower inorganic layer may prevent cracks from occurring by eliminating irregularities and increase the adhesiveness of the color filter layer.

[0148] For example, the adhesive protection layer may have a thickness of less than or equal to about 1 μm. In this case, the above-mentioned effect can be further maximized.

[0149] For example, the color filter layer may have a thickness of about 1.1 μm to about 1.6 μm.

[0150] For example, the black partition wall may have a thickness of about 0.5 μm to about 1.2 μm.

[0151] If the thickness of each of the color filter layer and the black partition wall is controlled as described above, it may be more advantageous to realize a micro OLED display device.

[0152] For example, the inorganic layer may have a thickness of less than or equal to about 2 μm. Even with WOLED, since light does not always diffuse in a direction perpendicular to the OLED substrate, color mixing of red, green, and blue is unavoidable. Therefore, in the past, an inorganic layer was deposited on the OLED substrate to prevent such color mixing. However, since color mixing cannot be completely prevented even by depositing an inorganic layer, in some embodiments, slight light leakage can be prevented by thinning the inorganic layer, for example, controlling the thickness of the inorganic layer to be less than or equal to about 2 μm. In addition, high resolution can be achieved by placing black partition walls between color filters.

[0153] In addition, since the black photosensitive resin composition used as the material of the black partition wall is a black material, there are problems such as photocuring properties. As described above, the photosensitive resin composition according to some embodiments enables the production of a cured layer only by low temperature curing during pre-baking and i-line light curing, and there is inevitably a huge difference in achievable resolution compared to conventional display devices.

[0154] Hereinafter, preferred examples of the present invention will be described. However, the following examples are only preferred examples of the present invention, and the present invention is not limited to the following examples.

[0155] (Example)

[0156] (Preparation of Photosensitive Resin Composition)

[0157] Examples 1 to 6 and Comparative Examples 1 and 2

[0158] Using the composition shown in Table 1, the photopolymerization initiator was dissolved in the solvent and stirred at room temperature for 2 hours. Here, the binder resin and the photopolymerizable monomer were added and stirred at room temperature for 1 hour. After adding other additives and a black colorant thereto, the solution was stirred at room temperature for 1 hour, and then the entire solution was stirred for 2 hours. The solution was filtered three times to remove impurities, thereby preparing each photosensitive resin composition.

[0159] [Table 1]

[0160] (Unit: grams)

[0161]

[0162] (A) Binder resin

[0163] Acrylic binder resin (SP-RY92-M10; Resonac Corporation) (double bond equivalent weight greater than or equal to about 340 g / mol)

[0164] (B) Black colorant

[0165] (B-1) Lactam black grinding base (BC4001, SAKATA; solid content 15 wt%)

[0166] (B-2) Carbon black grinding base (CI-M463, Sakata; solid content 15 wt%)

[0167] (B-3) Red pigment grinding base (BA6228, Sakata; solid content 15 wt%)

[0168] (B-4) Green pigment grinding base (BJ1564, Sakata; solid content 15 wt%)

[0169] (B-5) Blue pigment grinding base (BB6136, Sakata; solid content 15 wt%)

[0170] (C) Photopolymerizable monomer

[0171] Dipentaerythritol hexa(meth)acrylate (DPHA, Nippon Kayaku Co., Ltd.)

[0172] (D) Photopolymerization initiator

[0173] Oxime initiator (SPI-03W, Samyang Corporation)

[0174] (E) Solvent

[0175] Propylene glycol monomethyl ether acetate (PGMEA, Sigma-Aldrich Corporation)

[0176] (F) Other additives

[0177] (F-1) Leveling agent (F-556, DIC Co., Ltd.)

[0178] (F-2) Surfactant (KBM-503, Shin-Etsu Chemical Co., Ltd.)

[0179] (F-3) Polymerization inhibitor (MHQ, JH Chem)

[0180] Rating 1

[0181] Each of the photosensitive resin compositions according to Examples 1 to 6 and Comparative Examples 1 and 2 was coated on a 10 cm*10 cm ITO glass (resistance: 30Ω), and heated on a hot plate at 100° C. for 1 minute in a proxy type, and then heated again for 1 minute in a contact type to form a 1 μm thick photosensitive resin layer. The optical density (OD) of the resin film was measured by using a densitometer 361T manufactured by X-Rite Inc., and the results are shown in Table 2.

[0182] [Table 2]

[0183]

[0184] Rating 2

[0185] The substrate coated with the photosensitive resin layer was exposed to light by using a mask engraved with patterns of various sizes and changing the exposure dose using an exposure machine (UX-1200SM-AKS02 manufactured by Ushio Inc.), developed in a 2.38% tetramethylammonium hydroxide (TMAH) solution (aqueous developer) at room temperature to dissolve and remove the exposed area, and washed with pure water for 50 seconds to obtain a cured layer.

[0186] The minimum size of the pattern of the cured layer was checked by measuring the resolution of the pattern using a micro optical microscope (STM6-LM, Olympus Corp.). In other words, the minimum pattern size after curing was measured at an optimal exposure dose where a 2 μm line pattern had a line width (critical dimension (CD), unit: μm) of less than 3 μm. If the line width is less than or equal to 1.5 μm, ◎ is given, if the line width is less than or equal to 2 μm, ○ is given, if greater than 2 μm and less than 3 μm, △ is given, and if greater than or equal to 3 μm, X is given, and the results are shown in Table 3.

[0187] [Table 3]

[0188] Example 1 Example 2 Example 3 Example 4 Example 5 Example 6 Comparative Example 1 Comparative Example 2 Resolution ◎ △ △ △ ○ △ X X

[0189] Referring to Table 2 and Table 3, the black photosensitive resin composition according to the example is a composition having high optical density and curable at a low temperature of 100° C. or less to achieve an ultra-high resolution pattern of less than 3 μm, and is proven to be applicable to a micro OLED display device.

[0190] Although the present invention has been described in conjunction with what are currently considered to be practical exemplary embodiments, it should be understood that the present invention is not limited to the disclosed embodiments, but on the contrary, is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims. Therefore, it should be understood that the foregoing embodiments are exemplary and do not limit the present invention in any way.

Claims

1. A black photosensitive resin composition, comprising: Binder resin; Black colorants including lactam black; photopolymerizable monomers; Photopolymerization initiator; as well as Solvents, The optical density per 1 μm is greater than or equal to 1.

5.

2. The black photosensitive resin composition according to claim 1, wherein The black colorant is included in an amount of 60 wt % to 80 wt % based on the total amount of the black photosensitive resin composition.

3. The black photosensitive resin composition according to claim 1, wherein The black colorant consists of lactam black millbase.

4. The black photosensitive resin composition according to claim 3, wherein The black photosensitive resin composition has an optical density per 1 μm of greater than or equal to 2.

0.

5. The black photosensitive resin composition according to claim 1, wherein The black photosensitive resin composition is curable at a temperature of 100° C. or less.

6. The black photosensitive resin composition according to claim 1, wherein The binder resin includes an acrylic binder resin.

7. The black photosensitive resin composition according to claim 6, wherein The acrylic binder resin has a double bond equivalent weight greater than or equal to 340 g / mol.

8. The black photosensitive resin composition according to claim 1, wherein Based on the total amount of the black photosensitive resin composition, the black photosensitive resin composition comprises: 1 wt % to 10 wt % of said binder resin; 60 wt % to 80 wt % of said black colorant; 0.5 wt % to 5 wt % of said photopolymerizable monomer; 0.1 wt % to 3 wt % of the photopolymerization initiator; and The balance is the solvent.

9. The black photosensitive resin composition according to claim 1, wherein The black photosensitive resin composition further comprises the following additives: malonic acid, 3-amino-1,2-propylene glycol, a silane coupling agent, a leveling agent, a surfactant, a polymerization inhibitor or a combination thereof. 10 . A black partition wall produced by using the black photosensitive resin composition according to claim 1 .

11. A display device comprising the black partition wall according to claim 10.

12. The display device according to claim 11, wherein The display device is a micro organic light emitting diode display device, which includes an organic light emitting diode substrate deposited on a silicon wafer, an inorganic layer stacked on the organic light emitting diode substrate, an adhesive protective layer stacked on the inorganic layer, and a color filter layer, which is stacked on the adhesive protective layer and converts white light generated from the organic light emitting diode substrate into light of multiple colors, wherein the color filter layer includes a red color filter, a green color filter and a blue color filter, and The black partition wall is located between each color filter.

13. The display device according to claim 12, wherein The display device further includes a micro lens array located on the adhesive protection layer and surrounding the color filter layer and the black partition wall.

14. The display device according to claim 12, wherein The adhesive protection layer has a thickness less than or equal to 1 μm.

15. The display device according to claim 12, wherein The color filter layer has a thickness of 1.1 μm to 1.6 μm.

16. The display device according to claim 12, wherein The black partition wall has a thickness of 0.5 μm to 1.2 μm.

17. The display device according to claim 12, wherein The inorganic layer has a thickness less than or equal to 2 μm.

18. A method for manufacturing a black partition wall, comprising: Applying the black photosensitive resin composition as claimed in claim 1; Pre-baking at a temperature less than or equal to 100° C. after coating; exposing to i-line after performing the pre-bake; as well as The black photosensitive resin composition is developed.

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