Foreign matter inspection system, exposure apparatus, and article manufacturing method

Abstract

The present invention provides a foreign matter inspection system, an exposure apparatus, and a method of manufacturing an article, the foreign matter inspection system comprising: a transport hand that transports an object; a foreign matter detection means for performing foreign matter inspection on the object; and a guide unit that comes into contact with the conveying hand, guides the driving of the conveying hand, and performs foreign matter inspection of the object by the foreign matter detection mechanism while driving the conveying hand in a state in which the conveying hand is brought into contact with the guide unit.

Description

Technical Field

[0001] The present invention relates to a foreign matter inspection system, an exposure device and an article manufacturing method. Background Art

[0002] In the photolithography process, which is one of the manufacturing processes of semiconductor devices or liquid crystal display devices, an exposure process is performed, in which a circuit pattern formed on a mask is exposed on a wafer or glass substrate coated with a resist via a projection optical system using an exposure device. During the exposure process, for example, if foreign matter is attached to the mask that becomes the original, the image of the foreign matter is exposed to the wafer or glass substrate at the same time as the circuit pattern, which causes a decrease in the yield. Therefore, it is required to carry a foreign matter inspection device on the exposure device to inspect foreign matter on the original, etc.

[0003] Patent Document 1 discloses that a substrate is inspected for foreign matter while being transported by a transport robot (transport arm).

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2012-112921 Summary of the invention

[0006] Problems to be solved by the invention

[0007] When a transfer robot is used to transfer a substrate while inspecting foreign matter, it is required to drive the transfer robot in a horizontal direction while scanning the entire substrate for inspection. However, when the transfer robot is driven in a horizontal direction, the accuracy of foreign matter measurement may be reduced due to vibration of the transfer robot or deflection of the substrate.

[0008] Therefore, an object of the present invention is to provide a foreign matter inspection system that is advantageous in suppressing a decrease in the measurement accuracy of foreign matter.

[0009] Solutions to Solve Problems

[0010] In order to achieve the above-mentioned purpose, a foreign matter inspection system as one embodiment of the present invention is characterized in that the foreign matter inspection system comprises: a carrying hand for carrying an object; a light receiving part for receiving light from the object; and a rotating part for contacting with the carrying hand and rotating as the carrying hand is driven, and the carrying hand is driven while being in contact with the rotating part, while foreign matter on the object is inspected.

[0011] Effects of the Invention

[0012] According to the present invention, it is possible to provide a foreign matter inspection system which is advantageous in suppressing a decrease in the measurement accuracy of foreign matter.

[0013] Further features of the present invention will become apparent from the following description of exemplary embodiments (with reference to the attached drawings). BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is a schematic diagram showing the structure of an exposure device.

[0015] Figure 2 It is a schematic diagram showing the configuration of the foreign matter inspection system in the first embodiment.

[0016] Figure 3 It is a schematic diagram showing the configuration of a foreign matter inspection system in a modified example of the first embodiment.

[0017] Figure 4 It is a flow chart of the foreign body inspection method.

[0018] Figure 5 It is a schematic diagram showing the structure of a foreign matter inspection system in a second embodiment.

[0019] Figure 6 It is a schematic diagram showing the structure of a foreign matter inspection system in a second embodiment.

[0020] Figure 7 It is a schematic diagram showing the structure of a foreign matter inspection system in a third embodiment.

[0021] Figure 8 It is a schematic diagram showing the structure of a foreign matter inspection system in a fourth embodiment.

[0022] Fig. 9 It is a flowchart of the manufacturing method of an item. DETAILED DESCRIPTION

[0023] Hereinafter, preferred embodiments of the present invention will be described in detail based on the accompanying drawings. In addition, in each of the drawings, the same reference numerals are given to the same components, and repeated descriptions are omitted.

[0024] [First embodiment]

[0025] In this embodiment, an embodiment of a foreign matter inspection system used in a lithography apparatus that forms a pattern of an original plate on a substrate is described. Hereinafter, as a lithography apparatus, an exposure apparatus that illuminates an original plate and projects an image of the original plate pattern onto a substrate is described as an example.

[0026] First, the structure of the exposure apparatus EXP in this embodiment is demonstrated. Figure 11 is a schematic diagram showing the structure of the exposure device EXP. In the following description, the plane on which the substrate P is placed is defined as the XY plane, and the direction perpendicular to the XY plane is defined as the Z direction to define the coordinate system. In addition, in the XY plane, the scanning direction of scanning the substrate P is defined as the Y direction, and the non-scanning direction perpendicular to the scanning direction is defined as the X direction.

[0027] The exposure device EXP in this embodiment is a photolithography device used in the photolithography process of manufacturing devices such as semiconductor devices or flat panel displays (FPD). The exposure device EXP performs an exposure process of exposing a substrate P via an original plate M on which a pattern is formed, and transferring the pattern of the original plate M to the substrate P. The exposure device EXP can adopt a so-called step-and-scan method in which scanning exposure is performed while the original plate M and the substrate P are synchronously scanned. In addition, without being limited to this method, other exposure methods such as a step-and-repeat method can also be used for exposure processing.

[0028] The exposure device EXP includes an illumination optical system IL, an original plate stage MS holding an original plate M, a projection optical system PO, a substrate stage PS holding a substrate P, an original plate storage device 28, an original plate loader 29, and a main control unit 20. The exposure device EXP further includes a light receiving unit 3, a transport hand 4, and a cleaning device 33. Exposure light irradiated from a light source (such as a high-pressure mercury lamp or an LED) not shown in the figure is focused on the original plate M through the illumination optical system IL. A deflection reducing member 2 for forming a closed space may be arranged above the original plate M. By controlling the pressure of the space above the original plate, the deflection of the original plate M can be reduced.

[0029] The projection optical system PO is an optical system for projecting the pattern formed on the original plate M onto a substrate P coated with a photosensitive material and transferring the pattern. In this embodiment, a projection optical system based on an Offner type optical system is assumed. In the case of the Offner type optical system, in order to ensure a good image area, the original plate M is irradiated in an arc-shaped illumination area. In addition, the irradiation shape of the exposure light reaching the substrate P also becomes an arc shape. Since the projection optical system PO forms the pattern of the original plate on the substrate, it is also called a pattern forming unit.

[0030] A plurality of original plates used in the exposure process of the exposure device EXP are stored in the original plate storage device 28. When the original plates are transported from the outside of the exposure device EXP to the original plate storage device 28, they can be transported by the transport hand 4. In addition, the transport hand 4 can be used when the original plates are transported from the original plate storage device 28. The original plate loader 29 can be used when the original plates are transported to the original plate stage MS. Instead of the original plate loader 29, the original plate can be transported to the original plate stage MS by the transport hand 4, and foreign matter inspection can also be performed at this time.

[0031] The main control unit 20 controls each operation of the exposure device. The light receiving unit 3 checks for foreign matter on the object (original plate, etc.) transported by the transport hand 4. When a foreign matter is detected by the light receiving unit 3, the object on the transport hand is transported to the cleaning device 33. The cleaning device 33 removes foreign matter on the object by a known method such as a gas jet. The rotating unit 5 (guide unit) is configured to reduce the vibration of the transport hand. The rotating unit 5 (guide unit) is configured to guide the drive of the transport hand. A plurality of light receiving units 3 (for example, 4) may be arranged in an array along the X direction.

[0032] Next, the foreign matter inspection system 30 in this embodiment will be described. Figure 2 : is a diagram showing the structure of a foreign matter inspection system. The foreign matter inspection system 30 has a light receiving unit 3, a conveying arm 4, a rotating unit 5 and a control unit 11. The control unit 11 controls each unit of the foreign matter inspection system 30. The foreign matter inspection system 30 may also be provided with a light projecting unit (not shown) for projecting light onto an object (inspected object) on the conveying arm 4. In addition, a tray 6 for placing the original plate M and a support member 7 for supporting the outer area of ​​the original plate M in a manner that the pattern of the original plate M does not contact the tray 6 may be provided. The conveying arm 4 is driven in the direction of the arrow 8. Below, an example is described in which the original plate M is conveyed by the conveying arm 4 and foreign matter on the original plate M being conveyed is inspected by the foreign matter inspection system 30.

[0033] In the exposure device, if foreign matter is attached to the original plate M, the foreign matter is also transferred to the substrate together with the pattern during exposure, which may cause defective products. Therefore, in order to suppress the generation of defective products and improve the yield rate, it is also required to perform foreign matter inspection using the foreign matter inspection system 30 before exposure using the exposure device. However, since the inspection area of ​​the original plate M is wide, it is necessary to inspect the foreign matter of the original plate M while scanning the original plate M with the transport hand 4, for example.

[0034] Here, as a comparative example, a foreign matter inspection system that does not include the rotating unit 5 will be described.

[0035] When the transport hand 4 is used to scan the original plate M, it is necessary to drive the transport hand 4 so that the joints of the transport hand 4 are gradually extended, so the transport hand 4 is likely to vibrate. The transport hand 4 is structured to rotate around a plurality of joints, and is structured to easily vibrate the end portion holding the original plate M. When foreign matter inspection is performed while the transport hand 4 is vibrating, the amount of light received by the light receiving unit 3 changes, which may result in a decrease in the accuracy of foreign matter detection.

[0036] In the foreign matter inspection system 30 of the present embodiment, as Figure 2As shown, a rotating part 5 is arranged below the transport hand 4. The rotating part 5 is arranged in a manner of contacting the end of the transport hand 4. And, when the transport hand 4 is driven in the horizontal direction, the rotating part 5 rotates, so that it can be driven smoothly. The rotating part 5 may include a bearing and a roller. The rotating part 5 may be fixed independently of the transport hand 4 by a fixing member. The transport hand 4 is driven in the direction of the arrow 8 while being in contact with the rotating part 5.

[0037] As a method for bringing the transport hand 4 into contact with the rotating part 5, a method of moving the transport hand 4 so as to be located above the rotating part 5 and lowering the transport hand 4 in the -Z direction may be implemented. Alternatively, as a modified example, Figure 3 As shown, a tapered portion 9 may be provided at the end of the transport hand 4 so that the transport hand 4 is horizontally driven from a position where the transport hand 4 overlaps with the rotating portion 5 when viewed from the -Y direction. In this embodiment, by driving the transport hand 4 and performing a foreign matter inspection while the transport hand 4 is in contact with the rotating portion 5, the rotating portion 5 can absorb the vibration of the transport hand 4 and suppress the vibration of the transport hand 4.

[0038] In addition, in the present embodiment, the rotating part 5 that makes the transport hand 4 contact and hold is described, but other than this, it is also possible. For example, it is also possible to have a holding part that makes the original plate M contact and hold without providing a rotating mechanism. The holding part holds the transport hand 4 in a manner that reduces the vibration of the transport hand 4. In this case, it is possible to have a structure that reduces friction by providing a bearing on the lower surface of the transport hand 4 and providing a track on the holding part.

[0039] Alternatively, a holding unit that holds the transport hand 4 in a non-contact manner to reduce vibration may be used instead of the rotating unit 5. The holding unit may be an air bearing that floats and holds the master plate M by ejecting gas, or a holding unit that uses magnetism. By making it non-contact, dust generation can be suppressed compared to a contact type.

[0040] In addition, in the present embodiment, the foreign matter inspection of the original plate M is described, but the foreign matter inspection of the deflection reducing member 2 transported together with the original plate M or separately may also be performed. Alternatively, the foreign matter inspection of the protective film provided in the pattern area of ​​the original plate M to protect the pattern of the original plate M may also be performed. That is, the object to be inspected in the present embodiment may be the deflection reducing member 2 or the protective film. In addition, the glass substrate or the wafer may also be the object to be inspected. In the present embodiment, the risk of interference between the object transported by the transport hand 4 and other members can also be reduced.

[0041] In this embodiment, the size of the original plate M may be 850 mm in width, 120 mm in length, and 10 mm in thickness. The original plate M may be made of quartz. In addition, the deflection reducing member 2 covers the upper surface of the original plate M as a closed space and sets the closed space to a negative pressure, thereby reducing the deflection caused by the self-weight of the original plate M. The deflection reducing member 2 may also be made of quartz.

[0042] The transport hand 4 can transport the object placed on the transport hand 4 in the horizontal direction at a speed of, for example, 10 mm / sec or more and 50 mm / sec or less and perform a foreign matter inspection.

[0043] As a light source for foreign matter inspection, an LED or a laser diode (LD) can be used. LED is excellent in that it can perform irradiation with less uneven illumination by arranging a plurality of light-emitting elements in a two-dimensional shape. LD is excellent in that it can irradiate a distant position, and therefore has a high degree of freedom in the configuration of the light source. For example, in the light receiving unit 3, a line sensor in which pixels are arranged in a one-dimensional shape can be used. By performing a foreign matter inspection while scanning the object with a transport hand, the entire surface of the object can be inspected. The light receiving unit 3 can detect light reflected from the object (for example, scattered light), and can determine the presence and size of foreign matter based on the amount of light obtained.

[0044] The material of the roller of the rotating part 5 may be made of resin. Resin is advantageous in that it can absorb the impact when the transport hand 4 contacts. In this embodiment, since foreign matter inspection can be performed during the transport of the object, it is advantageous from the viewpoint of throughput.

[0045] Each step of the foreign matter inspection method according to the present embodiment will be described. Figure 4 1 is a flowchart of the foreign matter inspection method in this embodiment. Each step of the flowchart is executed by the control unit 11 controlling each unit of the foreign matter inspection system.

[0046] In step S1, the object is placed on the transport hand 4. In step S2, the transport hand 4 is brought into contact with the rotating part 5 (contact process). In step S3, the transport hand 4 is driven in the horizontal direction while being brought into contact with the rotating part 5 (first driving process). In the foreign matter inspection method, while the transport hand 4 is driven in the first driving process, the light receiving part 3 receives light from the object, so that foreign matter on the object can be inspected.

[0047] [Second embodiment]

[0048] In this embodiment, an example of implementing foreign matter inspection with high precision when the object to be inspected for foreign matter is bent is described. In addition, the basic structure of the foreign matter inspection system is the same as that of the first embodiment, so the description of common matters is omitted. Regarding matters not mentioned in this embodiment, the first embodiment is followed.

[0049] Figure 5 4 is a diagram showing the structure of the foreign matter inspection system 40 in this embodiment. Figure 5 As shown, the foreign body inspection system 40 of this embodiment further includes a driving unit 10 that drives the rotating unit 5 to drive the position of the rotating unit 5. The driving unit 10 drives the rotating unit 5, for example, to change the position of the rotating unit 5 in the gravity direction (Z direction). Thus, the focus position of the light receiving unit 3 and the position of the surface of the object to be inspected can be adjusted.

[0050] This embodiment is particularly effective when the inspection object is changed and the height position of the inspection object is changed. Figure 5 In the case where the deflection reducing member 2 is the inspection object, Figure 6 This is the case where the original M is the object of inspection. Figure 6 In, with Figure 5 In the case of comparison, the height of the inspection object becomes lower than that of the deflection reducing member 2. Figure 6 Although the deflection reducing member 2 is not shown in the figure, the original plate M can be inspected in a state where the deflection reducing member 2 is arranged.

[0051] In the present embodiment, when inspecting the deflection reducing member 2, the driving unit 10 is driven to make the position of the rotating unit 5 the first position, and when inspecting the original plate M, the driving unit 10 is driven to make the position of the rotating unit 5 the second position higher than the first position. Thus, each foreign matter inspection can be performed with high precision. In addition, when inspecting the protective film disposed on the back of the original plate M, the protective film can be inspected for foreign matter with high precision by driving the driving unit 10 to make the position of the rotating unit 5 the third position higher than the second position.

[0052] The driving unit 10 may be an air cylinder or a stepping motor. An air cylinder is advantageous in that it generates less heat, has a simple structure, and can be used at low cost. A stepping motor is advantageous in that it is easy to control the speed.

[0053] Each step of the foreign body inspection method of this embodiment is described. The basic steps are the same as those of the first embodiment ( Figure 4 The present embodiment further includes a step (second driving step) of driving the rotating unit 5 by the driving unit 10 to change the position of the rotating unit 5 in parallel with the first driving step.

[0054] [Third Embodiment]

[0055] In this embodiment, an example of implementing foreign matter inspection with high precision when the object to be inspected for foreign matter is bent is described. In addition, the basic structure of the foreign matter inspection system is the same as that of the first embodiment, so the description of common matters is omitted. Regarding matters not mentioned in this embodiment, the first embodiment is followed.

[0056] Figure 7 is a diagram showing the structure of the foreign matter inspection system 50 in this embodiment. Figure 7 As shown in FIG. 1 , the original plate M in this embodiment is in a bent state. Therefore, when the transport hand 4 is simply driven in the horizontal direction, there are portions where the focus position is inconsistent depending on the area, so that high-precision inspection cannot be performed.

[0057] Therefore, in the foreign matter inspection system 50 of the present embodiment, as Figure 7 As shown, a curved portion 12 is provided below the transport hand 4 (the surface in contact with the rotating portion 5). The curved portion 12 may be integral with the transport hand 4 or may be a separate body. The curved portion 12 has a convex shape (convex downward), and may be designed to have the same shape as the deflection of the original plate M simulated or tested in advance, for example. By providing the curved portion 12, the transport hand 4 is driven along the curved portion 12, so that the transport hand 4 is driven in an ascending manner like a cam mechanism, which can reduce the deviation between the focus position of the light receiving portion 3 and the surface position of the original plate M. As a result, foreign matter inspection can be performed with high precision.

[0058] In this embodiment, instead of providing the bending portion 12, the driving portion 10 may be driven to reduce the deviation between the focus position of the light receiving portion 3 and the surface position of the original plate M. Specifically, the height position of the transport hand 4 may be increased as the amount of deflection of the original plate M increases.

[0059] [Fourth Embodiment]

[0060] In this embodiment, an example in which the vibration of the transport hand 4 can be further reduced compared to the first embodiment is described. In addition, the basic structure of the foreign matter inspection system is the same as that of the first embodiment, so the description of the common matters is omitted. Regarding matters not mentioned in this embodiment, the first embodiment is followed.

[0061] Figure 8 1 is a diagram showing the structure of the foreign matter inspection system 60 in this embodiment. As described in the first embodiment, by providing the rotating portion 5, the vibration of the transport hand 4 can be reduced. However, even when the transport hand 4 is driven while being in contact with the rotating portion 5, since the transport hand 4 is not a completely rigid body, the transport hand 4 may be in a state of slight vibration.

[0062] Therefore, in this embodiment, in order to further reduce the vibration of the transport hand 4, the signal of the rotary encoder provided in the transport hand 4 is input to the control unit 11, and in order to reduce the vibration of the transport hand 4, a control signal is output to the drive unit 10. The rotary encoder can be set at the joint of the transport hand 4. The rotary encoder can detect the vibration of the transport hand 4 in real time, so the drive unit 10 can perform feedback control on the signal of the rotary encoder. As a result, compared with the first embodiment, the vibration of the transport hand 4 can be further reduced. In addition, an accelerometer or a displacement meter can be used instead of a rotary encoder, and an accelerometer or a displacement meter can be used in addition.

[0063] [Embodiment of the method for manufacturing an article]

[0064] The method for manufacturing an article according to the embodiment of the present invention is suitable for manufacturing an article such as a flat panel display (FPD), a semiconductor device, a sensor, or an optical element. Fig. 9 This is a flow chart of the method for manufacturing an article of the present embodiment. The method for manufacturing an article of the present embodiment includes a process of forming a latent image pattern on a photosensitive material coated on a substrate by exposure using the above-mentioned exposure device EXP to obtain an exposed substrate (exposure process, step S11). In addition, it also includes a process of developing the substrate exposed in this process to obtain a developed substrate (development process, step S12). In addition, the manufacturing method includes other well-known processes (oxidation, film formation, evaporation, doping, flattening, etching, resist stripping, punching, bonding, packaging, etc.) (processing process, step S13). Compared with previous methods, the method for manufacturing an article of the present embodiment is advantageous in at least one of the performance, quality, productivity, and production cost of the article.

[0065] The preferred embodiments of the present invention are described above, but the present invention is not limited to these embodiments, and various modifications and changes can be made within the scope of its main purpose. The scope of application of the present invention can also be used in foreign matter inspection systems for substrate processing devices such as semiconductor manufacturing devices (film forming devices, sputtering devices, annealing devices, inspection devices, etc.), organic EL evaporation devices, imprint devices, and flattening devices.

[0066] Description of Reference Numerals

[0067] 3 Light receiving part

[0068] 4 moving hands

[0069] 5 Rotating part (guide part)

[0070] 30, 40, 50, 60 foreign body inspection system

[0071] M Original (object)

Claims

1. A foreign body inspection system, characterized in that: The foreign body inspection system comprises: Carrying hand, moving objects; a foreign matter detection mechanism for performing a foreign matter inspection on the object; and a guide part, which contacts the transport hand and guides the driving of the transport hand, The object is inspected for foreign matter by the foreign matter detecting mechanism while the transport hand is driven in a state where the transport hand is in contact with the guide portion.

2. The foreign body inspection system according to claim 1, characterized in that: The guide portion reduces vibration of the transport hand.

3. The foreign matter inspection system according to claim 1, characterized in that: The foreign matter inspection system further includes a driving unit that drives the guide unit to change a position of the guide unit.

4. The foreign matter inspection system according to claim 3, characterized in that: The driving unit drives the guide unit to change a position of the guide unit in a direction of gravity.

5. The foreign matter inspection system according to claim 3, characterized in that: The foreign matter inspection system further includes a control unit that controls the driving of the driving unit. The control unit drives the driving unit based on the vibration of the transport hand.

6. The foreign matter inspection system according to claim 5, characterized in that: The control unit performs feedback control on the driving unit based on the vibration of the transport hand.

7. The foreign matter inspection system according to claim 1, characterized in that: The transport hand includes a tapered portion having a tapered tip.

8. The foreign matter inspection system according to claim 1, characterized in that: The transport hand includes a convex curved portion on a surface that contacts the guide portion.

9. The foreign matter inspection system according to claim 1, characterized in that: The object is a master plate for a lithographic apparatus.

10. The foreign matter inspection system according to claim 1, characterized in that: The object is a deflection reducing member disposed above a reticle used in a photolithography apparatus and configured to reduce deflection of the reticle by controlling pressure in a space above the reticle.

11. The foreign matter inspection system according to claim 1, characterized in that: The object is a protective film for protecting a pattern of a master plate used in a photolithography apparatus.

12. A foreign matter inspection device having a foreign matter detection mechanism for inspecting foreign matter in an object transported by a transporter, characterized in that: The object is inspected for foreign matter by the foreign matter detecting mechanism while the transport hand is driven in a state where the transport hand is in contact with a guide portion that guides the driving of the transport hand.

13. A foreign body inspection method, characterized in that: The foreign body inspection method comprises: a contact step of bringing the transfer hand carrying the object into contact with the guide portion; and a first driving step of driving the transport hand in a state where the transport hand is in contact with the guide portion; While driving the transfer hand in the first driving step, light from the object is received to inspect foreign matter on the object.

14. The foreign matter inspection method according to claim 13, characterized in that: In the first driving step, the guide portion reduces vibration of the transport hand.

15. The foreign matter inspection method according to claim 13, characterized in that: The foreign matter inspection method further includes a second driving step of driving the guide portion to change a position of the guide portion in parallel with the first driving step.

16. A photolithography apparatus, characterized in that: The lithography apparatus comprises: The foreign matter inspection system according to any one of claims 1 to 12; and The forming section forms a pattern on the substrate based on the pattern of the original plate.

17. An exposure device, characterized in that: The exposure device comprises: The foreign matter inspection system according to any one of claims 1 to 12; and The projection optical system projects the image of the original pattern onto the substrate.

18. A method for manufacturing an article, characterized in that: The method for manufacturing the article comprises: an exposure step of exposing the substrate using the exposure device according to claim 17 to obtain an exposed substrate; and a developing step of developing the exposed substrate to obtain a developed substrate, An article is manufactured from the developed substrate.

Images