Server Chassis

Abstract

The present invention provides a server chassis, including a chassis body, a single-channel component and a dual-channel component, wherein the mainboard installation area of ​​the chassis body has N1 first connectors and multiple groups of first guide slides; N2 second connectors of the single-channel component cooperate with N2 first connectors, and multiple groups of second guide slides cooperate with multiple groups of first guide slides in a one-to-one correspondence; N3 third connectors of the dual-channel component cooperate with N3 first connectors, and multiple groups of third guide slides cooperate with multiple groups of first guide slides in a one-to-one correspondence; at least one first connector of the N2 first connectors and one first connector of the N3 first connectors are at different positions on the chassis body, and the mainboard installation area can be selectively connected to one of the single-channel mainboard tray and the dual-channel mainboard tray. The present invention solves the problems of poor compatibility and poor flexibility of the server chassis in the prior art.

Description

Technical Field

[0001] The present invention relates to the field of computer technology, and in particular to a server chassis. Background Art

[0002] In the computer room of a data center, the server is the core equipment used to carry the upper-level business system. Its operating status directly affects the operating effect of the entire business system. The server room of a data center usually uses rack-mounted servers, which have the advantages of low energy consumption, high security, hot backup of equipment, and high scalability. However, as the scale of the business system of the data center becomes larger and larger, the demand for servers becomes higher and higher, and the server architecture, performance, configuration, installation method, etc. have also undergone major changes.

[0003] In terms of server architecture, server architectures have evolved from dual-channel to quad-channel, then to eight-channel, and even to sixteen-channel architectures; in terms of server performance, the processing power of servers has been greatly improved from single-core processors to sixteen-core or even twenty-four-core processors; in terms of server configuration, the storage capacity of servers has been greatly improved from traditional built-in hard drives to external hard drives, and then to the popular NVMe hard drives. In order to support the architecture, performance, and configuration of the above servers, the structure of the server chassis has also changed significantly. For example, the size of the server chassis, the internal space of the server chassis, the layout of the server chassis, and the installation method of the server chassis have all changed.

[0004] In terms of server installation methods, the traditional hand-tightened screw fixation has been changed to the current rail installation, which greatly improves the installation efficiency and maintenance efficiency of the server. However, when facing the adaptation of motherboards with completely different architectures, the architecture layout design of the server chassis in the prior art can only be adapted and installed separately by opening a new server chassis mold, resulting in a high cost of the mold invested in the server chassis. Alternatively, by increasing the material number distinction of the server chassis to avoid local interference of single-channel motherboards or dual-channel motherboards, although this can reduce a lot of mold costs, the model of the server chassis will increase exponentially, which is not a perfect solution for the late hidden cost growth points such as material control, mold replacement and maintenance.

[0005] Therefore, how to provide a server chassis with high compatibility and flexibility becomes an urgent problem to be solved. Summary of the invention

[0006] The main purpose of the present invention is to provide a server chassis to solve the problems of poor compatibility and poor flexibility of the server chassis in the prior art.

[0007] In order to achieve the above-mentioned purpose, the present invention provides a server chassis, including a chassis body, a single-channel component and a dual-channel component, wherein the chassis body has a motherboard installation area, and the motherboard installation area has N1 first connecting members and multiple groups of first guide slides; the single-channel component includes a single-channel motherboard tray and a single-channel motherboard, wherein the single-channel motherboard tray is detachably arranged at the motherboard installation area, and the single-channel motherboard is arranged on the single-channel motherboard tray, and the single-channel component has N2 second connecting members and multiple groups of second guide slides, wherein N2<N1, and the N2 second connecting members cooperate with the N2 first connecting members, and the multiple groups of second guide slides cooperate with the multiple groups of first guide slides in a one-to-one correspondence. ; The dual-way component includes a dual-way motherboard tray and a dual-way motherboard, wherein the dual-way motherboard tray can be detachably set at the motherboard installation area, the dual-way motherboard is set on the dual-way motherboard tray, and the dual-way component has N3 third connecting members and multiple groups of third guide slides, wherein N3<N1, the N3 third connecting members cooperate with the N3 first connecting members, and the multiple groups of third guide slides cooperate with the multiple groups of first guide slides in a one-to-one correspondence; wherein at least one first connecting member among the N2 first connecting members and one first connecting member among the N3 first connecting members are at different positions on the chassis body, and the motherboard installation area can be selectively connected to one of the single-way motherboard tray and the dual-way motherboard tray.

[0008] In an exemplary embodiment, N1 first connecting members are all nuts provided on the chassis body, and the N1 nuts are spaced apart along the length direction of the chassis body; some of the N2 second connecting members are hand screws provided on the single-way motherboard tray, and another part of the N2 second connecting members are hand screws provided on the single-way motherboard; N2 first avoidance vias are provided on the single-way motherboard tray, and the N2 first avoidance vias correspond one-to-one to the N2 second connecting members, and each first avoidance via is used to penetrate the corresponding second connecting members; N3 third connecting members are hand screws provided on the dual-way motherboard; N3 second avoidance vias are provided on the dual-way motherboard tray, and the N3 second avoidance vias correspond one-to-one to the N3 third connecting members, and each second avoidance via is used to penetrate the corresponding third connecting members.

[0009] In an exemplary embodiment, N2 nuts are concentrically arranged with the corresponding N2 first avoidance through holes, and N3 nuts are concentrically arranged with the corresponding N3 second avoidance through holes.

[0010] In an exemplary embodiment, a first sliding stroke L1 of the second guide slide relative to the first guide slide and a second sliding stroke L2 of the third guide slide relative to the first guide slide satisfy: L1>L2.

[0011] In an exemplary embodiment, multiple groups of first guide slides include a first group of first guide slides, the first group of first guide slides include N4 first I-shaped nails, and the N4 first I-shaped nails are arranged at intervals along the length direction and the width direction of the chassis body; multiple groups of second guide slides include a first group of second guide slides, the first group of second guide slides include N4 first gourd holes, the N4 first gourd holes are arranged in a one-to-one correspondence with the N4 first I-shaped nails, and each first gourd hole is slidably matched with the corresponding first I-shaped nails; multiple groups of third guide slides include a first group of third guide slides, the first group of third guide slides include N4 second gourd holes, the N4 second gourd holes are arranged in a one-to-one correspondence with the N4 first I-shaped nails, and each second gourd hole is slidably matched with the corresponding first I-shaped nails.

[0012] In an exemplary embodiment, the first I-shaped nail is disposed concentrically with the small hole of the first gourd hole, and the first I-shaped nail is disposed concentrically with the small hole of the second gourd hole.

[0013] In an exemplary embodiment, multiple groups of first guide slides include a second group of first guide slides, the second group of first guide slides include N5 second I-shaped nails, and the N5 second I-shaped nails are arranged at intervals along the width direction of the chassis body; multiple groups of second guide slides include a second group of second guide slides, the second group of second guide slides include N5 third gourd holes, the N5 third gourd holes are arranged in a one-to-one correspondence with the N5 second I-shaped nails, and each third gourd hole is slidably matched with the corresponding second I-shaped nails; multiple groups of third guide slides include a second group of third guide slides, the second group of third guide slides include N5 fourth gourd holes, the N5 fourth gourd holes are arranged in a one-to-one correspondence with the N5 second I-shaped nails, and each fourth gourd hole is slidably matched with the corresponding second I-shaped nails.

[0014] In an exemplary embodiment, the second I-shaped nail is concentrically arranged with the small hole of the third gourd hole, and the second I-shaped nail is concentrically arranged with the small hole of the fourth gourd hole.

[0015] In an exemplary embodiment, the size of the first I-shaped nail is larger than the size of the second I-shaped nail; the size of the first gourd hole is equal to the size of the second gourd hole, and the size of the third gourd hole is equal to the size of the fourth gourd hole; wherein the size of the first gourd hole is larger than the size of the third gourd hole.

[0016] In an exemplary embodiment, multiple groups of first guide slides include a third group of first guide slides, the third group of first guide slides include N6 guide limit structures, and the N6 guide limit structures are evenly distributed on both side edges of the chassis body in the width direction; multiple groups of second guide slides include a third group of second guide slides, the third group of second guide slides include N6 first notches, the N6 first notches are arranged in a one-to-one correspondence with the N6 guide limit structures, and each first notch is slidably matched with each corresponding guide limit structure; multiple groups of third guide slides include a third group of third guide slides, the third group of third guide slides include N6 second notches, the N6 second notches are arranged in a one-to-one correspondence with the N6 guide limit structures, and each second notch is slidably matched with each corresponding guide limit structure.

[0017] In an exemplary embodiment, the guide and limiting structure is disposed in close contact with the wall surface of the first notch, and the guide and limiting structure is disposed in close contact with the wall surface of the second notch.

[0018] In an exemplary embodiment, N4, N5, and N6 satisfy: N4>N5=N6.

[0019] In an exemplary embodiment, the single-way component also includes a single-way power supply board and a first sliding fitting part, wherein the single-way power supply board is arranged on the single-way mainboard tray, and the single-way power supply board is plugged and matched with the single-way mainboard; the first sliding fitting part is arranged on the single-way mainboard and extends along the length direction of the single-way mainboard; the single-way mainboard tray includes a single-way tray body, a single-way tray Mylar, and a second sliding fitting part, the single-way tray Mylar is attached to the single-way tray body, the second sliding fitting part is arranged on the single-way tray body, and the single-way mainboard is positioned on the single-way tray body by sliding cooperation between the first sliding fitting part and the second sliding fitting part.

[0020] In an exemplary embodiment, the single-channel component also includes a single-channel TSOM module, which is arranged on the front window side of the single-channel mainboard close to the chassis body; and / or, the single-channel component also includes a single-channel rear window PCIe module, which is arranged on the rear window side of the single-channel mainboard close to the chassis body; and / or, the single-channel component also includes a single-channel power supply structure, which is arranged on the single-channel power supply board and is arranged adjacent to the single-channel rear window PCIe module; and / or, the single-channel component also includes a single-channel built-in Raid module, which is arranged on the single-channel tray body and located on the outer peripheral side of the single-channel mainboard; and / or, the single-channel component also includes a single-channel supercapacitor box, which is arranged on the single-channel tray body and located on the outer peripheral side of the single-channel mainboard; and / or, the single-channel component also includes a single-channel built-in M.2 module, which is arranged on the single-channel tray body and located on the outer peripheral side of the single-channel mainboard.

[0021] In an exemplary embodiment, the dual-path component also includes a third sliding fitting part, which is arranged on the dual-path mainboard and extends along the length direction of the dual-path mainboard; the dual-path mainboard tray includes a dual-path tray body, a dual-path tray Mylar, and a fourth sliding fitting part, the dual-path tray Mylar is attached to the dual-path tray body, the fourth sliding fitting part is arranged on the dual-path tray body, and the dual-path mainboard is positioned on the dual-path tray body through the sliding fit between the third sliding fitting part and the fourth sliding fitting part.

[0022] In an exemplary embodiment, the dual-way component also includes a dual-way built-in M.2 module, which is arranged on the front window side wall of the chassis body; and / or, the dual-way component also includes a dual-way rear window PCIe module, which is arranged on the rear window side of the dual-way mainboard close to the chassis body; and / or, the dual-way component also includes a dual-way supercapacitor box, which is arranged on the dual-way mainboard.

[0023] The technical solution of the present invention is applied to provide a server chassis, including a chassis body, a single-channel component and a dual-channel component, wherein the chassis body has a motherboard installation area, and the motherboard installation area has N1 first connectors and multiple groups of first guide slides; the single-channel component includes a single-channel motherboard tray and a single-channel motherboard, wherein the single-channel motherboard tray is detachably arranged at the motherboard installation area, and the single-channel motherboard is arranged on the single-channel motherboard tray, and the single-channel component has N2 second connectors and multiple groups of second guide slides, wherein N2<N1, and the N2 second connectors cooperate with the N2 first connectors, and the multiple groups of second guide slides cooperate with the multiple groups of first guide slides in a one-to-one correspondence; The dual-path component includes a dual-path motherboard tray and a dual-path motherboard, wherein the dual-path motherboard tray can be detachably arranged at the motherboard installation area, the dual-path motherboard is arranged on the dual-path motherboard tray, and the dual-path component has N3 third connecting members and multiple groups of third guide slides, wherein N3<N1, the N3 third connecting members cooperate with the N3 first connecting members, and the multiple groups of third guide slides cooperate with the multiple groups of first guide slides in a one-to-one correspondence; wherein at least one first connecting member among the N2 first connecting members and one first connecting member among the N3 first connecting members are at different positions on the chassis body, and the motherboard installation area can be selectively connected to one of the single-path motherboard tray and the dual-path motherboard tray.

[0024] The server chassis provided by the present application sets N1 first connecting parts and multiple groups of first guide sliding parts in the motherboard installation area, so that the server chassis of the present application can be shared by two single- and dual-channel servers with completely different motherboard architectures. On the premise of opening a set of chassis molds, it meets the market demand of users for different numbers of CPUs in general servers, and also reduces the development cost of the server chassis.

[0025] Specifically, the N1 first connecting parts and multiple groups of first guide slides on the motherboard mounting area of ​​the server chassis provided in the present application, by using the single-way motherboard tray as a transfer carrier between the single-way motherboard and the chassis body, enable the single-way motherboard to cooperate with the N2 first connecting parts through the N2 second connecting parts, and the multiple groups of second guide slides to cooperate with the multiple groups of first guide slides in a one-to-one correspondence, and be positioned and installed in the motherboard mounting area of ​​the chassis body; similarly, by using the dual-way motherboard tray as a transfer carrier between the dual-way motherboard and the chassis body, the dual-way motherboard can cooperate with the N3 first connecting parts through the N3 third connecting parts, and the multiple groups of third guide slides to cooperate with the multiple groups of first guide slides in a one-to-one correspondence, and be positioned and installed in the motherboard mounting area of ​​the chassis body, thereby achieving that when a single-way server is needed, the user can cooperate the single-way component with the chassis body, and when a dual-way server is needed, the user can cooperate the dual-way component with the chassis body. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings constituting a part of the present application are used to provide a further understanding of the present invention. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation of the present invention. In the drawings:

[0027] Figure 1 A schematic structural diagram of a server chassis according to an optional embodiment of the present invention is shown;

[0028] Figure 2 Shows Figure 1 The internal structure diagram of the server chassis in the figure omits the front section and the rear section of the upper cover;

[0029] Figure 3 Shows Figure 2 A schematic diagram of the structure of the chassis body of the server chassis from a top view;

[0030] Figure 4 A schematic diagram showing the structure of a single-channel component and a chassis body in an assembled state according to the first embodiment of the present invention is shown;

[0031] Figure 5 Shows Figure 4 Schematic diagram of the partial installation structure of the single-channel built-in Raid module and the single-channel super capacitor box;

[0032] Figure 6 Shows Figure 4 A schematic diagram of the structure of the single-channel components and the chassis body in a disassembled state;

[0033] Figure 7 Shows Figure 6 A schematic diagram of the structure of a single-channel mainboard tray and a single-channel mainboard of a single-channel component in a disassembled state;

[0034] Figure 8 Shows Figure 7 A schematic diagram of the structure of a single-channel motherboard tray of a single-channel component in FIG.

[0035] Fig. 9 Shows Figure 8 A schematic diagram of the structure of a single-channel motherboard tray in FIG. 1 , in which the single-channel tray Mylar is omitted;

[0036] Fig.10 A schematic diagram showing the structure of a dual-channel component and a chassis body in an assembled state according to a second embodiment of the present invention is shown;

[0037] Fig.11 Shows Fig.10 A schematic diagram of a partial installation structure of a dual-channel supercapacitor box;

[0038] Fig.12 Shows Fig.10 A schematic diagram of the structure of the dual-channel components and the chassis body in a disassembled state;

[0039] Fig.13 Shows Fig.12 A schematic diagram of the structure of a dual-way mainboard tray and a dual-way mainboard of a dual-way assembly in a disassembled state;

[0040] Fig.14 Shows Fig.13 A schematic diagram of the structure of a dual-way motherboard tray of a dual-way component in FIG.

[0041] Fig.15 Shows Fig.14 A schematic diagram of the structure of a dual-way motherboard tray in FIG. 1 , in which the dual-way tray Mylar is omitted;

[0042] Fig.16 Shows Figure 1 A partial structural diagram of the optional 2SFF module installed in the area next to the front window of the chassis body in the fixed hard disk frame;

[0043] Fig.17 Shows Figure 1 A schematic diagram of the partial structure of the front window of the chassis body in which the front window is installed in the area next to the hard disk frame and the optional 2PCIe modules are installed;

[0044] Fig.18 Shows Figure 1 A structural diagram of the hard disk backplane and the front window fixed hard disk frame before assembly;

[0045] Fig.19 Shows Fig.18 A schematic diagram of the structure after the hard disk backplane and the front window fixed hard disk frame are assembled;

[0046] Fig. 20 Shows Fig.12 A schematic diagram of the partial structure in which the dual-channel fan board and fan module are installed in the chassis body.

[0047] The above drawings include the following reference numerals:

[0048] 10. Chassis body; 11. Motherboard installation area; 12. First connecting piece; 13. First guide slide piece; 131. First I-shaped nail; 132. Second I-shaped nail; 133. Guide limit structure; 14. Front section of upper cover; 15. Rear section of upper cover; 16. Right box ear; 17. Fan wall; 18. Rear window; 19. Power supply box; 101. Left box ear; 102. Front window fixed hard disk box;

[0049] 20. Single-channel component; 21. Single-channel motherboard tray; 211. Single-channel tray body; 212. Single-channel tray Mylar; 213. Second sliding fitting; 22. Single-channel motherboard; 23. Second connecting member; 24. Second guide sliding member; 241. First gourd hole; 242. Third gourd hole; 243. First notch; 25. Single-channel power board; 27. Single-channel TSOM module; 28. Single-channel rear window PCIe module; 29. ​​Single-channel power supply structure; 201. Single-channel built-in Raid module; 202. Single-channel super capacitor box; 203. Single-channel built-in M.2 module;

[0050] 30. Dual-channel assembly; 31. Dual-channel motherboard tray; 311. Dual-channel tray body; 312. Dual-channel tray Mylar; 313. Fourth sliding fitting; 32. Dual-channel motherboard; 33. Third connecting piece; 34. Third guiding sliding piece; 341. Second gourd hole; 342. Fourth gourd hole; 343. Second notch; 36. Dual-channel built-in M.2 module; 37. Dual-channel rear window PCIe module; 38. Dual-channel supercapacitor box;

[0051] 40. Front window hard disk module; 50. Front window can be equipped with 2SFF modules as an option; 60. Front window can be equipped with 2PCIe modules as an option; 70. Hard disk backplane; 80. Single-channel fan board; 90. Fan module; 100. Dual-channel fan board. DETAILED DESCRIPTION

[0052] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is by no means intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0053] In order to solve the problems of poor compatibility and poor flexibility of a server chassis in the prior art, the present invention provides a server chassis.

[0054] like Figures 1 to 20 As shown, the server chassis includes a chassis body 10, a single-channel component 20 and a dual-channel component 30, wherein the chassis body 10 has a motherboard installation area 11, and the motherboard installation area 11 has N1 first connectors 12 and multiple groups of first guide slides 13; the single-channel component 20 includes a single-channel motherboard tray 21 and a single-channel motherboard 22, wherein the single-channel motherboard tray 21 is detachably arranged at the motherboard installation area 11, and the single-channel motherboard 22 is arranged on the single-channel motherboard tray 21, and the single-channel component 20 has N2 second connectors 23 and multiple groups of second guide slides 24, wherein N2<N1, and the N2 second connectors 23 cooperate with the N2 first connectors 12, and the multiple groups of second guide slides 24 cooperate with the multiple groups of first guide slides 13 in a one-to-one correspondence; the dual-channel component 30 includes The dual-way motherboard tray 31 and the dual-way motherboard 32 are included, wherein the dual-way motherboard tray 31 is detachably arranged at the motherboard installation area 11, and the dual-way motherboard 32 is arranged on the dual-way motherboard tray 31, and the dual-way component 30 has N3 third connecting members 33 and multiple groups of third guide slides 34, wherein N3<N1, the N3 third connecting members 33 cooperate with the N3 first connecting members 12, and the multiple groups of third guide slides 34 cooperate with the multiple groups of first guide slides 13 in a one-to-one correspondence; wherein at least one first connecting member 12 among the N2 first connecting members 12 and one first connecting member 12 among the N3 first connecting members 12 are at different positions on the chassis body 10, and the motherboard installation area 11 can be selectively connected to one of the single-way motherboard tray 21 and the dual-way motherboard tray 31.

[0055] The server chassis provided in the present application sets N1 first connecting parts 12 and multiple groups of first guide sliding parts 13 in the motherboard installation area 11, so that the server chassis of the present application can be shared by two single-channel and dual-channel servers with completely different motherboard architectures. On the premise of opening a set of chassis molds, it meets the market demand of users for different numbers of CPUs in general servers, and also reduces the development cost of the server chassis.

[0056] Specifically, the N1 first connecting members 12 and the multiple groups of first guide slides 13 on the motherboard installation area 11 of the server chassis provided in the present application use the single-channel motherboard tray 21 as a transfer carrier between the single-channel motherboard 22 and the chassis body 10, so that the single-channel motherboard 22 can be matched with the N2 first connecting members 12 through the N2 second connecting members 23, and the multiple groups of second guide slides 24 are matched with the multiple groups of first guide slides 13 one by one, and positioned and installed in the motherboard installation area 11 of the chassis body 10; similarly, by using the dual-channel motherboard tray 21 The board tray 31 serves as a transfer carrier between the dual-way mainboard 32 and the chassis body 10, so that the dual-way mainboard 32 can be positioned and installed in the mainboard installation area 11 of the chassis body 10 through N3 third connecting parts 33 and N3 first connecting parts 12, and multiple groups of third guide slides 34 and multiple groups of first guide slides 13 in a one-to-one correspondence. In this way, when a single-way server is needed, the user can match the single-way component 20 with the chassis body 10, and when a dual-way server is needed, the user can match the dual-way component 30 with the chassis body 10.

[0057] like Figures 1 to 9 As shown, in an embodiment of assembling a single-way component 20 with a chassis body 10, N1 first connectors 12 are all nuts arranged on the chassis body 10, and the N1 nuts are arranged at intervals along the length direction of the chassis body 10; some of the N2 second connectors 23 are hand screws arranged on the single-way motherboard tray 21, and another part of the N2 second connectors 23 are hand screws arranged on the single-way motherboard 22; N2 first avoidance vias are provided on the single-way motherboard tray 21, and the N2 first avoidance vias correspond one-to-one to the N2 second connectors 23, and each first avoidance via is used to penetrate the corresponding second connector 23.

[0058] like Figures 10 to 15 As shown, in an embodiment of assembling a dual-way component 30 with a chassis body 10, N3 third connecting members 33 are hand-tightened screws arranged on a dual-way motherboard 32; N3 second avoidance vias are provided on the dual-way motherboard tray 31, and the N3 second avoidance vias correspond one-to-one with the N3 third connecting members 33, and each second avoidance via is used to penetrate a corresponding third connecting member 33.

[0059] Specifically, the value of N1 is 3, that is, Figure 3 The motherboard mounting area 11 is provided with three #6-32 nuts (numbered A1-A3 in the figure); the number of N2 is 2, that is, Fig. 9The single-channel motherboard tray 21 is provided with two first avoidance holes (in the figure, the letters are E1 and E3) for assembly with two #6-32 screws, wherein the hand screw at E1 directly passes through the first avoidance hole at this position and is riveted to the single-channel tray body 211, the hand screw at E1 cooperates with the nut at A1, the hand screw at E3 is directly welded on the single-channel motherboard 22 and passes through the first avoidance hole at this position, and the hand screw at E3 is used to cooperate with the nut at A3; the number of N3 is 2, that is, Fig.15 The dual-way motherboard tray 31 is provided with two second avoidance holes (labeled J1 and J2 in the figure) for assembly with two #6-32 screws, wherein the hand screws at positions J1 and J2 are both welded on the dual-way motherboard 32, and respectively pass through the two second avoidance holes on the corresponding dual-way motherboard tray 31, the hand screw at J1 is used to cooperate with the nut at A1, and the hand screw at J2 is used to cooperate with the nut at A2.

[0060] It should be noted that in the present application, when the single-way motherboard tray 21 is installed in place, N2 nuts and the corresponding N2 first avoidance holes are all concentrically arranged, and when the dual-way motherboard tray 31 is installed in place, N3 nuts and N3 second avoidance holes are all concentrically arranged. In this way, it is only necessary to ensure the above-mentioned concentric setting requirements, and in the subsequent design of other motherboards for adapting to the chassis body 10 of the present application, the decoupling of the motherboard and the chassis body 10 can be achieved.

[0061] It should be noted that, in the present application, since the dual-way mainboard 32 does not need to be inserted into the rear window 18, while the single-way mainboard 22 needs to be inserted into the rear window 18, the sliding stroke of the single-way component 20 is longer than the sliding stroke of the dual-way component 30 to avoid the components on the single-way component 20 colliding with the rear window 18 during vertical installation. Preferably, the first sliding stroke L1 of the second guide slide 24 relative to the first guide slide 13 and the second sliding stroke L2 of the third guide slide 34 relative to the first guide slide 13 satisfy: L1>L2.

[0062] Furthermore, the first sliding stroke L1 is 14 mm, and the second sliding stroke L2 is 10 mm.

[0063] like Figures 1 to 9As shown, in an embodiment of assembling a single-channel component 20 with a chassis body 10, a plurality of groups of first guide slides 13 include a first group of first guide slides 13, the first group of first guide slides 13 include N4 first I-shaped nails 131, and the N4 first I-shaped nails 131 are arranged at intervals along the length direction and the width direction of the chassis body 10; a plurality of groups of second guide slides 24 include a first group of second guide slides 24, the first group of second guide slides 24 include N4 first gourd holes 241, the N4 first gourd holes 241 are arranged in a one-to-one correspondence with the N4 first I-shaped nails 131, and each first gourd hole 241 is slidably matched with the corresponding first I-shaped nail 131.

[0064] like Figures 10 to 15 As shown, in an embodiment of assembling the dual-path component 30 with the chassis body 10, the multiple groups of third guide slides 34 include a first group of third guide slides 34, the first group of third guide slides 34 include N4 second gourd holes 341, the N4 second gourd holes 341 are arranged in a one-to-one correspondence with the N4 first I-shaped nails 131, and each second gourd hole 341 is slidably matched with the corresponding first I-shaped nail 131.

[0065] Specifically, the quantity value of N4 is 9, that is, Figure 3 The 9 first I-shaped nails 131 (numbered B1 to B9 in the figure) used for limiting the position are provided. Fig. 9 The single-channel motherboard tray 21 is provided with nine first calabash holes 241 (numbered F1-F9 in the figure) for cooperating with the nine first I-shaped nails 131. The nine first I-shaped nails 131 correspond to the nine first calabash holes 241 one by one, that is, B1→F1, B2→F2, B3→F3, B4→F4, B5→F5, B6→F6, B7→F7, B8→F8, B9→F9; Fig.15 The dual-way motherboard tray 31 is provided with 9 second gourd holes 341 (labeled K1-K9 in the figure) for cooperating with the 9 first I-pins 131. The 9 second gourd holes 341 correspond one-to-one with the 9 first gourd holes 241, that is, B1→K1, B2→K2, B3→K3, B4→K4, B5→K5, B6→K6, B7→K7, B8→K8, B9→K9.

[0066] It should be noted that in the present application, when the single-way motherboard tray 21 is installed in place, the first I-shaped nail 131 is concentrically arranged with the small hole of the first gourd hole 241, and when the dual-way motherboard tray 31 is installed in place, the first I-shaped nail 131 is concentrically arranged with the small hole of the second gourd hole 341. In this way, it is only necessary to ensure the above-mentioned concentric setting requirements, and in the subsequent process of designing other motherboards for adapting to the chassis body 10 of the present application, the decoupling of the motherboard and the chassis body 10 can be achieved.

[0067] It should be noted that, in the present application, the sliding stroke between each first I-shaped nail 131 and each first gourd hole 241 is 14 mm, and the sliding stroke between each first I-shaped nail 131 and each second gourd hole 341 is 10 mm.

[0068] like Figures 1 to 9 As shown, multiple groups of first guide slides 13 include a second group of first guide slides 13, the second group of first guide slides 13 include N5 second I-shaped nails 132, and the N5 second I-shaped nails 132 are arranged at intervals along the width direction of the chassis body 10; multiple groups of second guide slides 24 include a second group of second guide slides 24, the second group of second guide slides 24 include N5 third gourd holes 242, the N5 third gourd holes 242 are arranged one by one with the N5 second I-shaped nails 132, and each third gourd hole 242 is slidably matched with the corresponding second I-shaped nails 132.

[0069] like Figures 10 to 15 As shown, the multiple groups of third guide slides 34 include a second group of third guide slides 34, and the second group of third guide slides 34 include N5 fourth gourd holes 342. The N5 fourth gourd holes 342 are arranged in a one-to-one correspondence with the N5 second I-shaped nails 132, and each fourth gourd hole 342 is slidably matched with the corresponding second I-shaped nail 132.

[0070] Specifically, the quantity value of N5 is 4, that is, Figure 3 The four second I-shaped nails 132 (in the figure, letter numbers C1-C4) used for limiting the position are provided. Fig. 9 The single-channel motherboard tray 21 is provided with four third gourd holes 242 (in the figure, the letters are G1-G4) for cooperating with the four second I-shaped nails 132. The four second I-shaped nails 132 correspond to the four third gourd holes 242 one by one, that is, C1→G1, C2→G2, C3→G3, C4→G4; Fig.15 The dual-way motherboard tray 31 is provided with four fourth gourd holes 342 (labeled L1-L4 in the figure) for cooperating with the four second I-shaped nails 132. The four second I-shaped nails 132 correspond to the four fourth gourd holes 342 one by one, that is, C1→L1, C2→L2, C3→L3, C4→L4.

[0071] It should be noted that in the present application, when the single-way motherboard tray 21 is installed in place, the second I-shaped nail 132 is concentrically arranged with the small hole of the third gourd hole 242, and when the dual-way motherboard tray 31 is installed in place, the second I-shaped nail 132 is concentrically arranged with the small hole of the fourth gourd hole 342. In this way, it is only necessary to ensure the above-mentioned concentric setting requirements, and in the subsequent process of designing other motherboards for adapting to the chassis body 10 of the present application, the decoupling of the motherboard and the chassis body 10 can be achieved.

[0072] It should be noted that in the present application, the size of the first I-shaped nail 131 is larger than the size of the second I-shaped nail 132; the size of the first gourd hole 241 is equal to the size of the second gourd hole 341, and the size of the third gourd hole 242 is equal to the size of the fourth gourd hole 342; wherein, the size of the first gourd hole 241 is larger than the size of the third gourd hole 242.

[0073] Preferably, the first I-shaped nail 131 is a large I-shaped nail, the first gourd hole 241 is a large gourd hole, the second gourd hole 341 is a large gourd hole, the second I-shaped nail 132 is a small I-shaped nail, the third gourd hole 242 is a small gourd hole, and the fourth gourd hole 342 is a small gourd hole.

[0074] It should be noted that, in the present application, the sliding stroke between each second I-shaped nail 132 and each third gourd hole 242 is 14 mm, and the sliding stroke between each second I-shaped nail 132 and each fourth gourd hole 342 is 10 mm.

[0075] like Figures 1 to 9 As shown, multiple groups of first guide slides 13 include a third group of first guide slides 13, the third group of first guide slides 13 include N6 guide limit structures 133, and the N6 guide limit structures 133 are evenly distributed on both side edges of the width direction of the chassis body 10; multiple groups of second guide slides 24 include a third group of second guide slides 24, the third group of second guide slides 24 include N6 first notches 243, the N6 first notches 243 are arranged one by one with the N6 guide limit structures 133, and each first notch 243 is slidably matched with the corresponding guide limit structures 133.

[0076] like Figures 10 to 15 As shown, the multiple groups of third guide slides 34 include a third group of third guide slides 34, and the third group of third guide slides 34 include N6 second notches 343, and the N6 second notches 343 are arranged in a one-to-one correspondence with the N6 guide limit structures 133, and each second notch 343 is slidably matched with each corresponding guide limit structure 133.

[0077] Specifically, the quantity value of N5 is 4, that is, Figure 3 The four guide limit structures 133 (in the figure, letter numbers are D1-D4) are used for limiting. Fig. 9 The single-channel motherboard tray 21 is provided with four first notches 243 (in the figure, the letters are H1-H4) for cooperating with the four guide limit structures 133. The four guide limit structures 133 correspond to the four first notches 243 one by one, that is, D1→H1, D2→H2, D3→H3, D4→H4; Fig.15The dual-way motherboard tray 31 is provided with four second notches 343 (labeled M1-M4 in the figure) for cooperating with the four guide limit structures 133. The four guide limit structures 133 correspond to the four second notches 343 one by one, that is, D1→M1, D2→M2, D3→M3, D4→M4.

[0078] It should be noted that in the present application, when the single-way motherboard tray 21 is installed in place, the guide limit structure 133 is arranged to fit the wall of the first notch 243, and when the dual-way motherboard tray 31 is installed in place, the guide limit structure 133 is arranged to fit the wall of the second notch 343. In this way, it is only necessary to ensure the above-mentioned concentric setting requirements, and in the subsequent design of other motherboards for adapting to the chassis body 10 of the present application, the decoupling of the motherboard and the chassis body 10 can be achieved.

[0079] It should be noted that, in the present application, the sliding stroke between each guide limiting structure 133 and each first notch 243 is 14 mm, and the sliding stroke between each guide limiting structure 133 and each second notch 343 is 10 mm.

[0080] Preferably, the guide limiting structure 133 is a guide limiting pin.

[0081] Optionally, N4, N5, and N6 satisfy: N4>N5=N6.

[0082] like Figures 4 to 8 As shown, the single-channel component 20 further includes a single-channel power board 25 and a first sliding fitting, wherein the single-channel power board 25 is arranged on the single-channel mainboard tray 21, and the single-channel power board 25 is plugged and matched with the single-channel mainboard 22; the first sliding fitting is arranged on the single-channel mainboard 22 and extends along the length direction of the single-channel mainboard 22; the single-channel mainboard tray 21 includes a single-channel tray body 211, a single-channel tray Mylar 212, and a second sliding fitting 213, wherein the single-channel tray Mylar 212 is attached to the single-channel tray body 211, and the second sliding fitting 213 is arranged on the single-channel tray body 211, and the single-channel mainboard 22 is positioned on the single-channel tray body 211 through the sliding fitting of the first sliding fitting and the second sliding fitting 213. In this way, the convenience of assembly between the single-channel mainboard 22 and the single-channel tray body 211 is ensured.

[0083] like Figures 4 to 8As shown, the single-channel component 20 further includes a single-channel TSOM module 27, which is arranged on the front window side of the single-channel mainboard 22 close to the chassis body 10; and / or, the single-channel component 20 further includes a single-channel rear window PCIe module 28, which is arranged on the rear window side of the single-channel mainboard 22 close to the chassis body 10; and / or, the single-channel component 20 further includes a single-channel power supply structure 29, which is arranged on the single-channel power supply board 25 and is arranged adjacent to the single-channel rear window PCIe module 28; and / or, the single-channel component 2 0 also includes a single-channel built-in Raid module 201, which is arranged on the single-channel tray body 211 and located on the outer peripheral side of the single-channel mainboard 22; and / or, the single-channel component 20 also includes a single-channel supercapacitor box 202, which is arranged on the single-channel tray body 211 and located on the outer peripheral side of the single-channel mainboard 22; and / or, the single-channel component 20 also includes a single-channel built-in M.2 module 203, which is arranged on the single-channel tray body 211 and located on the outer peripheral side of the single-channel mainboard 22.

[0084] like Figures 10 to 14 As shown, the dual-way assembly 30 further includes a third sliding fitting, which is arranged on the dual-way mainboard 32 and extends along the length direction of the dual-way mainboard 32; the dual-way mainboard tray 31 includes a dual-way tray body 311, a dual-way tray Mylar 312, and a fourth sliding fitting 313, the dual-way tray Mylar 312 is attached to the dual-way tray body 311, the fourth sliding fitting 313 is arranged on the dual-way tray body 311, and the dual-way mainboard 32 is positioned on the dual-way tray body 311 through the sliding fitting of the third sliding fitting and the fourth sliding fitting 313. In this way, the convenience of assembly between the dual-way mainboard 32 and the dual-way tray body 311 is ensured.

[0085] like Figures 10 to 14 As shown, the dual-way component 30 also includes a dual-way built-in M.2 module 36, which is arranged at the front window side wall of the chassis body 10; and / or, the dual-way component 30 also includes a dual-way rear window PCIe module 37, which is arranged on the rear window side of the dual-way mainboard 32 close to the chassis body 10; and / or, the dual-way component 30 also includes a dual-way supercapacitor box 38, which is arranged on the dual-way mainboard 32.

[0086] like Fig.16 and Fig.17 As shown, one of the front window optional 2SFF modules 50 and the front window optional 2PCIe modules 60 can be selectively installed in the area next to the front window fixed hard disk frame 102 of the chassis body 10, wherein: Fig.16The schematic diagram of the partial structure of the front window optional 2SFF module 50 is shown in the area next to the front window fixed hard disk frame 102 of the chassis body 10. Fig.17 A partial structural diagram is shown of an area next to the front window fixed hard disk frame 102 of the chassis body 10 where the optional 2SFF module 50 for the front window and the optional 2PCIe module 60 for the front window are installed. The optional 2SFF module 50 for the front window and the optional 2PCIe module 60 for the front window occupy the same installation area of ​​the chassis body 10, and the two screw locking points of the chassis body 10 in this area are both suitable for the optional 2SFF module 50 for the front window and the optional 2PCIe module 60 for the front window. However, due to the structural differences between the optional 2SFF module 50 for the front window and the optional 2PCIe module 60 for the front window, each of them also has two other screw locking points, and the chassis body 10 retains corresponding locking points at corresponding positions in this area to perform adaptive installation according to user needs.

[0087] Furthermore, if Figure 6 and Fig.12 As shown, the server chassis also includes a hard disk backplane 70. A bending feature for clamping the hard disk backplane 70 with the front window fixed hard disk frame 102 is opened on the PCB substrate of the hard disk backplane 70 at the initial installation position, and an avoidance notch corresponding to the convex bridge feature for clamping the hard disk backplane 70 with the chassis body 10 is opened on the PCB of the hard disk backplane 70 at the initial installation position, and other places in contact with the bending features and the convex bridge features are exposed copper; two hand screws are also welded on the PCB to ensure that the installation and fixation of the entire hard disk backplane 70 are tool-free.

[0088] like Figure 6 and Fig.12 As shown, the server chassis also includes a single-way fan board 80 and a dual-way fan board 100, and the PCB substrates of the single-way fan board 80 and the dual-way fan board 100 are of the same plate type, but the types and positions of the connectors on their respective PCB substrates are slightly different, thereby ensuring that the single-way fan board 80 and the dual-way fan board 100 share the same installation position on the chassis body 10; the chassis body 10 is riveted with a "J"-shaped sheet metal and two stepped studs for fixing the single-way fan board 80 and the dual-way fan board 100, and the "J"-shaped sheet metal opening has an angle guide to ensure that the single-way fan board 80 and the dual-way fan board 100 can be smoothly slid into the opening and installed in place when they are installed separately. Of course, the single-way server chassis only needs to be installed with the single-way fan board 80, and the corresponding dual-way server chassis only needs to be installed with the dual-way fan board 100.

[0089] like Figure 6 and Fig.12As shown, the server chassis also includes a fan module 90 and a fan wall 17. The front side of the fan module 90 is provided with a bracket for fixing the fan line and the connector. The rear side of the fan module 90 is provided with glue nails. The fan wall 17 is provided with ventilation holes and notches for the glue nails, thereby limiting the freedom of the fan module 90 in the front, back, left, right and downward directions.

[0090] like Figure 4 As shown, the single-channel TSOM module 27 is fixed with adhesive, which is easy to install. The single-channel TSOM module 27 can monitor the temperature, humidity, air pressure, vibration and other information inside the server chassis.

[0091] like Figure 4 , Figure 5 , Fig.10 , Fig.11 As shown, the single-channel rear window PCIe module 28 and the dual-channel rear window PCIe module 37 are both composed of their own butterfly card modules and half-height card modules, wherein the butterfly card module of the single-channel rear window PCIe module 28 only supports riser cards in the form of gold fingers, and a full-height half-length card and a half-height half-length card can be inserted into the riser card, and the half-height card module of the single-channel rear window PCIe module 28 only supports riser cards in the form of welding wires, and a half-height half-length card can be inserted into the riser card; while the butterfly card module of the dual-channel rear window PCIe module 37 supports both gold fingers and riser cards in the form of welding wires, and a full-height half-length card and a half-height half-length card can be inserted into the riser card, and the half-height card module of the dual-channel rear window PCIe module 37 supports both gold fingers and riser cards in the form of welding wires, and a half-height half-length card can be inserted into the riser card.

[0092] like Figure 4 , Figure 5 , Fig.10 , Fig.11 As shown, the installation positions of the single-channel built-in M.2 module 203 and the dual-channel built-in M.2 module 36 are different. The single-channel built-in M.2 module 203 is assembled on the single-channel motherboard tray 21, and the dual-channel built-in M.2 module 36 is assembled on the front window side wall of the chassis body 10. Due to space limitations, the dual-channel built-in M.2 module 36 can only support M.2 hard disks with a length of 80mm, while the single-channel built-in M.2 module 203 has relatively ample space and can support M.2 hard disks with lengths of 80mm and 110mm.

[0093] like Figure 4 and Figure 5As shown, the riser card of the single-channel built-in Raid module 201 only supports the welding wire form, and can insert a half-height and half-length card; the bracket is respectively locked on the single-channel power supply structure 29 and the single-channel motherboard tray 21 by two screws, and the side wall of the bracket has two convex bridge features, which cooperate with the two hanging ear features of the single-channel super capacitor box 202. The single-channel super capacitor box 202 is then locked on the single-channel motherboard tray 21 by a screw to improve reliability.

[0094] like Fig.10 As shown in Figure 11, the dual-channel super capacitor box 38 is connected to the T-shaped hole opened on the power frame 19 through three T-shaped hanging ears, and then its freedom is limited by the upper cover.

[0095] like Figure 2 , Figure 6 and Fig.12 As shown, the server chassis also includes a front window, a left box ear 101, a right box ear 16, a fan wall 17, a power supply frame 19, a rear window 18, and an upper cover (including an upper cover front section 14 and an upper cover rear section 15). The front window has an area for installing a front window fixed hard disk frame 102 and an area for installing a replaceable optional module (the front window can be optionally equipped with 2SFF modules 50 or the front window can be optionally equipped with 2PCIe modules 60). The front window fixed hard disk frame 102 is riveted to the base of the chassis body by rivets, and the replaceable optional module The front window is connected to the hard disk frame 102 and the base by screws; the left box ear 101 and the right box ear 16 are fixed to the base by screws; the fan wall 17, the single-channel power supply structure 29 and the rear window 18 are fixed to the base by rivets; the upper cover is divided into two sections, the front section 14 of the upper cover is fixed to the base by screws, the rear section 15 of the upper cover is matched with the gourd holes of the base by the I-nail on both sides, and the upper cover lock is locked to the fan wall 17.

[0096] It should be noted that in the present application, the single-channel motherboard 22 includes 1 PCB substrate, 1 CPU module, 16 memory slots, a number of high-speed signals, low-speed signals, power connectors, a number of small chips, capacitors and inductors, etc.; the single-channel power board 25 includes 1 PCB substrate, a number of low-speed signals, power connectors, a number of small chips, capacitors and inductors, etc.; the single-channel motherboard tray 21 includes a single-channel tray body 211, a number of rivet nuts of different specifications, positioning pins, hand screws, and stainless steel locking buckles, all riveted on the single-channel tray body 211 The single-channel tray Mylar 212 is adhered to the single-channel tray body 211 through local adhesive; there is also a second sliding mating piece 213 (OCP slide) fixed to the single-channel motherboard tray 21 by screws, and another first sliding mating piece (OCP slide) is fixed to the single-channel motherboard 22 by screws; the single-channel motherboard 22 is fixed to the single-channel motherboard tray 21 by screws, and the single-channel power supply board 25 is also fixed to the single-channel motherboard tray 21 by screws, and the single-channel motherboard 22 and the single-channel power supply board 25 are plug-in mated by a board-to-board power connector.

[0097] It should be noted that in the present application, the dual-way motherboard 32 includes a PCB substrate, 2 CPU modules, 32 memory slots, a number of high-speed signals, low-speed signals, power connectors, a number of small chips, capacitors and inductors, etc.; the dual-way motherboard tray 31 includes a dual-way tray body 311, a number of rivet nuts and stainless steel locking buckles of different specifications, all of which are riveted on the dual-way tray body 311, and the dual-way tray Mylar 312 is adhered to the dual-way tray body 311 through local adhesive; the dual-way motherboard 32 and the dual-way tray body 311 are also locked with screws.

[0098] The following describes the assembly process of the server chassis in this application, as follows:

[0099] When assembling a single-channel server, first install the single-channel motherboard 22 onto the corresponding four step nuts on the single-channel motherboard tray 21. At this time, the other screw holes correspond to the regular nuts, and all the holes are locked with screws. Then install the single-channel power board 25. The power connector on the single-channel power board 25 and the power connector on the single-channel motherboard 22 have their own guide positioning. After vertically inserting them into place, directly use screws to lock the single-channel power board 25.

[0100] Next, hold the hand screws on the rear window side of the single-way motherboard 22 and the front window side of the single-way motherboard tray 21 with both hands, align the four notched rear window sides of the single-way motherboard tray 21 with the guide limit pins of the base of the chassis body 10 by visual inspection, and drop it vertically. At this time, the heads of the large and small limit I-shaped nails on the base fall into the large holes of the corresponding gourd holes on the single-way motherboard tray 21d. Then, hold the hand screws with your hands and push them toward the side of the rear window 18. The single-way motherboard tray 21 slides along the guide of the gourd hole until the large and small limit I-shaped nails are concentric with the small holes of the gourd hole. At this time, the single-way motherboard tray 21 can no longer be pushed toward the side of the rear window 18. Then, lock the hand screws on the single-way motherboard 22 and the hand screws on the single-way motherboard tray 21 with the nuts corresponding to the base.

[0101] Next, before assembling the hard disk backplane 70, first install the front window hard disk module 40 to the front window fixed hard disk frame 102. The hard disk backplane 70 adopts a tool-free assembly form. There are many notches on the PCB substrate of the hard disk backplane 70, so that when the hard disk backplane 70 is just assembled, it can avoid the bending features on the front window fixed hard disk frame 102 for clamping the hard disk backplane 70 and the convex bridge features on the base for clamping the hard disk backplane 70. At this time, looking from the side of the rear window 18, push the hard disk backplane 70 from left to right until the hard disk backplane 70 reaches the limit, and then unscrew the two hand screws on the left and right to complete the installation of the hard disk backplane 70.

[0102] Next, according to the configuration, select the optional 2SFF modules 50 for the front window or the optional 2PCIe modules 60 for the front window in the optional module part. After vertical installation, they are fixed with 4 screws respectively. Two of the screws are shared by the two modules, and the other two are in different positions due to the differences in the module structures.

[0103] Then, assemble the single-way fan plate 80 and the fan module 90. The chassis body 10 is riveted with a "J"-shaped sheet metal and two step studs for fixing the single-way fan plate 80. After the single-way fan plate 80 falls vertically, it is pushed from the front window to the rear window 18 and stuck in the open notch of the "J"-shaped sheet metal until the two round holes fall into the step studs. The single-way fan plate 80 is locked with two screws, and then the male head of the connector of the fan module 90 is aligned with the female head of the connector on the single-way fan plate 80. It falls vertically and is pressed by hand. The two plastic nails at the other end are stuck in the notch on the fan wall 17. Repeat this process to complete the installation of 8 fan modules 90. At this time, the fan module 90 only has the upward freedom, which is restricted by the final cover.

[0104] Then, assemble the single-channel rear window PCIe module 28. The single-channel rear window PCIe module 28 consists of a single-channel butterfly card module and a single-channel half-height card module. The head of the single-channel butterfly card bracket is vertically inserted into the guide limit groove of the rear window 18, and the tail cooperates with a guide limit pin on the single-channel mainboard 22. After pressing the gold finger of the riser card into the connector slot, rotate 1 / 4 turn of the tool-free screw to lock the bracket with the single-channel mainboard 22. The head of the single-channel half-height card bracket is also vertically inserted into the guide limit groove of the rear window 18, and the I-nail on the side is inserted into the U-shaped groove of the power frame 19. The tail cooperates with another guide limit pin on the single-channel mainboard 22, and finally relies on the upper cover to limit the upward freedom.

[0105] In addition, some optional modules for the single channel need to be assembled, for example, the single channel built-in Raid module 201 is attached to the single channel power board 25 and the single channel motherboard tray 21 by two positioning pins and two screws; the single channel super capacitor box 202 is attached to the single channel motherboard tray 21 by two hanging ears cooperating with the convex bridge of the built-in Raid bracket and a screw; the single channel built-in M.2 module 203 is pre-positioned by two bends on the single channel motherboard tray 21, and the two I-shaped nails of the single channel motherboard tray 21 are inserted into the large holes of the gourd hole of the M.2 bracket, and the spring pin on the M.2 bracket is pulled to slide the single channel built-in Raid module 201 toward the left box ear 101. After it is in place, release the spring pin, and the spring pin falls into the travel stop position in the sleeve on the single channel motherboard tray 21; the single channel TSOM module 27 is attached to the designated position on the single channel motherboard tray 21 by adhesive backing.

[0106] Finally, insert the single-way power supply structure 29 into the power frame 19 and plug it into place with the power connector on the single-way power board 25. At the same time, connect all the wires and signal lines of the single-way power supply structure 29. Then, cover the front section 14 and the rear section 15 of the upper cover, tighten the screws and the upper cover lock, and the single-way server is assembled.

[0107] It should be noted that in the present application, when assembling a dual-channel server, the principle of assembling each module is the same as that of a single-channel server, and will not be repeated here.

[0108] In summary, the above specific embodiment is a preferred embodiment of the present application, but it cannot be used to limit the scope of implementation of the present application. That is, all equivalent changes and modifications made based on the scope of the patent application of the present application should fall within the scope covered by the patent application of the present application.

[0109] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0110] Unless otherwise specifically stated, the relative arrangement of the parts and steps described in these embodiments, numerical expressions and numerical values ​​do not limit the scope of the present invention. At the same time, it should be understood that, for ease of description, the sizes of the various parts shown in the accompanying drawings are not drawn according to the actual proportional relationship. The technology, method and equipment known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the technology, method and equipment should be regarded as a part of the authorization specification. In all examples shown and discussed here, any specific value should be interpreted as being merely exemplary, rather than as a limitation. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once a certain item is defined in an accompanying drawing, it does not need to be further discussed in subsequent drawings.

[0111] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0112] It should be noted that the terms used herein are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, it indicates the presence of features, steps, operations, devices, components and / or combinations thereof.

[0113] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein.

[0114] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A server chassis, characterized in that: include: A chassis body (10), the chassis body (10) having a mainboard installation area (11), the mainboard installation area (11) having N1 first connecting members (12) and a plurality of groups of first guide sliding members (13); A single-channel component (20), the single-channel component (20) comprising a single-channel mainboard tray (21) and a single-channel mainboard (22), wherein the single-channel mainboard tray (21) is detachably arranged at the mainboard mounting area (11), and the single-channel mainboard (22) is arranged on the single-channel mainboard tray (21), and the single-channel component (20) has N2 second connecting members (23) and a plurality of groups of second guide slides (24), wherein N2<N1, and the N2 second connecting members (23) cooperate with the N2 first connecting members (12), and the plurality of groups of second guide slides (24) cooperate with the plurality of groups of first guide slides (13) in a one-to-one correspondence; A dual-way component (30), the dual-way component (30) comprising a dual-way motherboard tray (31) and a dual-way motherboard (32), wherein the dual-way motherboard tray (31) is detachably arranged at the motherboard mounting area (11), and the dual-way motherboard (32) is arranged on the dual-way motherboard tray (31), and the dual-way component (30) has N3 third connecting members (33) and multiple groups of third guide slides (34), wherein N3<N1, the N3 third connecting members (33) cooperate with the N3 first connecting members (12), and the multiple groups of the third guide slides (34) cooperate with the multiple groups of the first guide slides (13) in a one-to-one correspondence; Wherein, at least one of the N2 first connectors (12) and one of the N3 first connectors (12) are located at different positions on the chassis body (10), and the motherboard mounting area (11) can be selectively connected to one of the single-way motherboard tray (21) and the dual-way motherboard tray (31).

2. The server chassis according to claim 1, characterized in that: N1 of the first connecting members (12) are nuts arranged on the chassis body (10), and the N1 of the nuts are arranged at intervals along the length direction of the chassis body (10); Some of the N2 second connecting members (23) are hand screws arranged on the single-channel motherboard tray (21), and another part of the N2 second connecting members (23) are hand screws arranged on the single-channel motherboard (22); The single-channel motherboard tray (21) is provided with N2 first avoidance holes, and the N2 first avoidance holes correspond to the N2 second connecting members (23) one by one, and each of the first avoidance holes is used to penetrate a corresponding second connecting member (23); N3 of the third connecting members (33) are hand screws arranged on the dual-circuit mainboard (32); The dual-channel motherboard tray (31) is provided with N3 second avoidance vias, and the N3 second avoidance vias correspond to the N3 third connecting members (33) one by one, and each of the second avoidance vias is used to penetrate a corresponding third connecting member (33).

3. The server chassis according to claim 2, characterized in that: The N2 nuts are concentrically arranged with the corresponding N2 first avoidance through holes, and the N3 nuts are concentrically arranged with the N3 second avoidance through holes.

4. The server chassis according to claim 1, characterized in that: A first sliding stroke L1 of the second guide slide member (24) relative to the first guide slide member (13) and a second sliding stroke L2 of the third guide slide member (34) relative to the first guide slide member (13) satisfy the following relationship: L1>L2.

5. The server chassis according to claim 1, characterized in that: The plurality of groups of the first guide slide members (13) include a first group of the first guide slide members (13), the first group of the first guide slide members (13) including N4 first I-shaped nails (131), the N4 first I-shaped nails (131) being arranged at intervals along the length direction and the width direction of the chassis body (10); The plurality of groups of the second guide slide members (24) include a first group of the second guide slide members (24), the first group of the second guide slide members (24) including N4 first gourd holes (241), the N4 first gourd holes (241) being arranged in one-to-one correspondence with the N4 first I-shaped nails (131), and each of the first gourd holes (241) is slidably matched with each of the corresponding first I-shaped nails (131); The plurality of groups of third guide slide members (34) include a first group of third guide slide members (34), wherein the first group of third guide slide members (34) includes N4 second gourd holes (341), the N4 second gourd holes (341) are arranged in one-to-one correspondence with the N4 first I-shaped nails (131), and each of the second gourd holes (341) is slidably matched with each of the corresponding first I-shaped nails (131).

6. The server chassis according to claim 5, characterized in that: The first I-shaped nail (131) is concentrically arranged with the small hole of the first gourd hole (241), and the first I-shaped nail (131) is concentrically arranged with the small hole of the second gourd hole (341).

7. The server chassis according to claim 5, characterized in that: The plurality of groups of the first guide slide members (13) include a second group of the first guide slide members (13), the second group of the first guide slide members (13) include N5 second I-shaped nails (132), and the N5 second I-shaped nails (132) are arranged at intervals along the width direction of the chassis body (10); The plurality of groups of the second guide slide members (24) include a second group of the second guide slide members (24), the second group of the second guide slide members (24) include N5 third gourd holes (242), the N5 third gourd holes (242) are arranged in one-to-one correspondence with the N5 second I-shaped nails (132), and each of the third gourd holes (242) is slidably matched with a corresponding second I-shaped nail (132); The plurality of groups of third guide slide members (34) include a second group of third guide slide members (34), the second group of third guide slide members (34) including N5 fourth gourd holes (342), the N5 fourth gourd holes (342) and the N5 second I-shaped nails (132) being arranged in a one-to-one correspondence, and each of the fourth gourd holes (342) is slidably matched with a corresponding second I-shaped nail (132).

8. The server chassis according to claim 7, characterized in that: The second I-shaped nail (132) is arranged concentrically with the small hole of the third gourd hole (242), and the second I-shaped nail (132) is arranged concentrically with the small hole of the fourth gourd hole (342).

9. The server chassis according to claim 7, characterized in that: The size of the first I-shaped nail (131) is greater than the size of the second I-shaped nail (132); The size of the first gourd hole (241) is equal to the size of the second gourd hole (341), and the size of the third gourd hole (242) is equal to the size of the fourth gourd hole (342); Wherein, the size of the first gourd hole (241) is larger than the size of the third gourd hole (242).

10. The server chassis according to claim 7, characterized in that: The plurality of groups of the first guide slide members (13) include a third group of the first guide slide members (13), the third group of the first guide slide members (13) include N6 guide limit structures (133), and the N6 guide limit structures (133) are evenly distributed at the edges of both sides in the width direction of the chassis body (10); The plurality of groups of the second guide slide members (24) include a third group of the second guide slide members (24), the third group of the second guide slide members (24) include N6 first notches (243), the N6 first notches (243) and the N6 guide limit structures (133) are arranged in a one-to-one correspondence, and each of the first notches (243) is slidably matched with each of the corresponding guide limit structures (133); The plurality of groups of third guide slide members (34) include a third group of third guide slide members (34), the third group of third guide slide members (34) include N6 second notches (343), the N6 second notches (343) and the N6 guide limit structures (133) are arranged in a one-to-one correspondence, and each of the second notches (343) is slidably matched with each corresponding guide limit structure (133).

11. The server chassis according to claim 10, characterized in that: The guide and limit structure (133) is arranged to fit the wall surface of the first notch (243), and the guide and limit structure (133) is arranged to fit the wall surface of the second notch (343).

12. The server chassis according to claim 10, characterized in that: N4, N5, and N6 satisfy: N4>N5=N6.

13. The server chassis according to any one of claims 1 to 12, characterized in that: The single-channel component (20) further comprises: A single-channel power supply board (25), the single-channel power supply board (25) being arranged on the single-channel mainboard tray (21), and the single-channel power supply board (25) being plugged and matched with the single-channel mainboard (22); A first sliding fitting member, the first sliding fitting member being arranged on the single-circuit main board (22) and extending along the length direction of the single-circuit main board (22); The single-channel motherboard tray (21) comprises: A single-channel tray body (211), a single-channel tray Mylar (212), and a second sliding fitting member (213), wherein the single-channel tray Mylar (212) is attached to the single-channel tray body (211), the second sliding fitting member (213) is arranged on the single-channel tray body (211), and the single-channel mainboard (22) is positioned on the single-channel tray body (211) through the sliding fitting of the first sliding fitting member and the second sliding fitting member (213).

14. The server chassis according to claim 13, characterized in that: The single-channel component (20) further comprises: A single-channel TSOM module (27), the single-channel TSOM module (27) being arranged on a front window side of the single-channel mainboard (22) close to the chassis body (10); and / or, a single-channel rear window PCIe module (28), the single-channel rear window PCIe module (28) being arranged on a side of the rear window of the single-channel mainboard (22) close to the chassis body (10); and / or, a single-channel power supply structure (29), the single-channel power supply structure (29) being arranged on the single-channel power supply board (25) and being arranged adjacent to the single-channel rear window PCIe module (28); and / or, A single-channel built-in Raid module (201), the single-channel built-in Raid module (201) being arranged on the single-channel tray body (211) and located on the outer peripheral side of the single-channel mainboard (22); and / or, A single-channel supercapacitor box (202), the single-channel supercapacitor box (202) being arranged on the single-channel tray body (211) and located on the outer peripheral side of the single-channel mainboard (22); and / or, A single-channel built-in M.2 module (203), wherein the single-channel built-in M.2 module (203) is arranged on the single-channel tray body (211) and is located on the outer peripheral side of the single-channel mainboard (22).

15. The server chassis according to any one of claims 1 to 12, characterized in that: The two-way component (30) further comprises: a third sliding fitting member, the third sliding fitting member being arranged on the dual-circuit mainboard (32) and extending along the length direction of the dual-circuit mainboard (32); The dual-way motherboard tray (31) comprises: A dual-path tray body (311), a dual-path tray Mylar (312), and a fourth sliding fitting member (313), wherein the dual-path tray Mylar (312) is attached to the dual-path tray body (311), the fourth sliding fitting member (313) is arranged on the dual-path tray body (311), and the dual-path mainboard (32) is positioned on the dual-path tray body (311) through the sliding fitting between the third sliding fitting member and the fourth sliding fitting member (313).

16. The server chassis according to claim 15, characterized in that: The two-way component (30) further comprises: A dual-channel built-in M.2 module (36), wherein the dual-channel built-in M.2 module (36) is arranged on a front window side wall of the chassis body (10); and / or, A dual-channel rear window PCIe module (37), the dual-channel rear window PCIe module (37) being arranged on a rear window side of the dual-channel mainboard (32) close to the chassis body (10); and / or, A dual-channel supercapacitor box (38), wherein the dual-channel supercapacitor box (38) is arranged on the dual-channel mainboard (32).

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