Circuit board and computing device

Abstract

The embodiment of the invention provides a circuit board and computing equipment. The circuit board comprises a carrier board; the temperature monitoring loop comprises a monitoring wire, a leading-out wire and a sampling resistor, the monitoring wire is arranged in a monitoring area of the carrier plate, the sampling resistor is arranged in a control area of the carrier plate, the leading-out wire is connected between the monitoring wire and the sampling resistor in series, the monitoring wire is configured to have a preset thermosensitive resistance value range, and the sampling resistor is configured to have a preset thermosensitive resistance value range. The sampling resistor has a given resistance value, and the thermosensitive resistance value in a preset thermosensitive resistance value range and the given resistance value are both higher than the line resistance value of the lead-out wire; the detection circuit is arranged in the control area, the detection circuit is used for detecting the voltage at the two ends of the sampling resistor to obtain detection voltage, and the change of the detection voltage is in inverse correlation with the change of the temperature of the monitoring area; and the control circuit is arranged in the control area, is connected with the detection circuit and is used for judging the temperature state of the monitoring area based on the detection voltage.

Description

Technical Field

[0001] The embodiments of the present disclosure relate to the field of electronic and electrical technology, and more particularly, to a circuit board and a computing device. Background Art

[0002] A circuit board is installed in a computing device such as a server. As a core component of the computing device, the circuit board integrates devices such as a processor and peripheral circuits to perform the computing power of the computing device. For example, the circuit board can be a printed circuit board (PCB). The printed circuit board generally integrates key electronic components such as a processor, memory, and input / output interface, and undertakes the important task of data transmission and processing.

[0003] Generally speaking, the stability of circuit boards is crucial to the performance of computing devices, especially computing devices such as servers deployed in data centers. Once a circuit board fails, such as burning or short circuiting, it will not only directly affect the normal operation of the computing device, but may also cause delays in R&D progress or service interruptions, causing losses to users. Therefore, ensuring the reliability and durability of circuit boards is the key to the design and maintenance of computing devices.

[0004] Currently, there are many solutions to ensure the temperature reliability of circuit boards. A more effective way is to use a specific position of the circuit board as a temperature monitoring area, and arrange thermal sensing elements such as temperature sensors or thermal imagers in the temperature monitoring area to monitor the temperature of the entire circuit board, trigger an alarm or perform a power shutdown operation when the temperature is abnormal. However, such thermal sensing elements have high requirements for the arrangement position on the circuit board, resulting in poor flexibility. For example, it is impossible to implement temperature monitoring of the entire circuit board. Summary of the invention

[0005] In view of this, embodiments of the present disclosure provide a circuit board and a computing device to solve the above problems.

[0006] According to a first aspect of an embodiment of the present disclosure, a circuit board is provided, the circuit board comprising: a carrier board; a temperature monitoring circuit, comprising a monitoring line, a lead-out line and a sampling resistor, wherein the monitoring line is arranged in a monitoring area of ​​the carrier board, the sampling resistor is arranged in a control area of ​​the carrier board, and the lead-out line is connected in series between the monitoring line and the sampling resistor, wherein the monitoring line is configured to have a preset thermistor resistance range, the sampling resistor has a given resistance value, and the thermistor resistance value within the preset thermistor resistance range and the given resistance value are both higher than the line resistance value of the lead-out line; a detection circuit is arranged in the control area, the detection circuit is used to detect the voltage across the sampling resistor to obtain a detection voltage, wherein the change of the detection voltage is inversely correlated with the temperature change of the monitoring area; a control circuit is arranged in the control area, the control circuit is connected to the detection circuit, and is used to judge the temperature state of the monitoring area based on the detection voltage.

[0007] According to a second aspect of an embodiment of the present disclosure, a circuit board is provided, the circuit board comprising: a carrier board; a temperature monitoring circuit, comprising a monitoring line, a lead-out line, a first sampling resistor and a second sampling resistor, the monitoring line being arranged in a monitoring area of ​​the carrier board, the first sampling resistor and the second sampling resistor being arranged in a control area of ​​the carrier board, the lead-out line being connected in series between the monitoring line, the first sampling resistor and the second sampling resistor, wherein the monitoring line is configured to have a preset thermistor resistance range, the first sampling resistor has a first given resistance value, the second sampling resistor has a second given resistance value, the thermistor resistance value within the preset thermistor resistance range, the first given resistance value and the second given resistance value are all higher than the The line resistance of the lead-out wiring; a first detection circuit is arranged in the control area, the first detection circuit is used to detect the voltage across the first sampling resistor to obtain a first detection voltage, wherein the change of the first detection voltage is inversely correlated with the temperature change of the monitoring area; a second detection circuit is arranged in the control area, the second detection circuit is used to detect the voltage across the second sampling resistor to obtain a second detection voltage, wherein the change of the second detection voltage is inversely correlated with the temperature change of the monitoring area; a control circuit is arranged in the control area, the control circuit is connected to the first detection circuit and the second detection circuit, and is used to judge the temperature state of the monitoring area based on the first detection voltage and the second detection voltage.

[0008] According to a third aspect of an embodiment of the present disclosure, a computing device is provided, including a chassis and the circuit board described in the first aspect or the second aspect.

[0009] In the solution of the embodiment of the present disclosure, the detection circuit and the control circuit can be arranged in the control area of ​​the carrier board, and the control area and the monitoring area can be electrically connected through the lead wires, thereby avoiding the arrangement position of the detection circuit and the control circuit to be dependent on the arrangement position of the monitoring wires.

[0010] [P-137600-CN-PRI-1][HS2411085CCN] The routing, lead routing and sampling resistor form a temperature monitoring loop. In the temperature monitoring loop, the detection circuit detects the voltage across the sampling resistor. By monitoring the thermal characteristics of the routing, the change in the detection voltage is inversely correlated with the temperature change in the monitoring area, thereby accurately collecting the temperature change in the monitoring area. In addition, the monitoring routing is set in the monitoring area of ​​the carrier board, and the monitoring routing is configured to have a preset thermistor resistance range. Compared with circuit components such as thermistors, the monitoring routing can be flexibly set in any monitoring area on the carrier board, which improves the flexibility of temperature monitoring and enables the entire board temperature monitoring of the circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings.

[0012] Figure 1 The present invention is a schematic structural diagram of a circuit board according to some embodiments of the present invention.

[0013] Figure 2 for Figure 1 Side view of a circuit board of some examples of embodiments.

[0014] Figure 3 for Figure 1 Schematic circuit diagrams of on-board circuitry of some examples of embodiments.

[0015] Figure 4 Schematic structural diagrams of circuit boards according to other embodiments of the present disclosure.

[0016] Figure 5 for Figure 4 Schematic circuit diagrams of on-board circuits of some examples of embodiments.

[0017] Figure 6 The present invention is a schematic block diagram of a computing device according to some other embodiments of the present invention. DETAILED DESCRIPTION

[0018] In order to enable those skilled in the art to better understand the technical solutions in the embodiments of the present disclosure, the technical solutions in the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings in the embodiments of the present disclosure. Obviously, the described embodiments are only part of the embodiments of the present disclosure, rather than all of the embodiments. All other embodiments obtained by ordinary technicians in the field based on the embodiments in the embodiments of the present disclosure should fall within the scope of protection of the embodiments of the present disclosure.

[0019] The specific implementation of the embodiment of the present disclosure is further explained below in conjunction with the accompanying drawings of the embodiment of the present disclosure.

[0020] Temperature monitoring on circuit boards, such as PCBs, is critical to ensuring the performance and safety of computing devices. As the density of electrical components in computing devices increases and power density rises, the temperature on the circuit board can rise to levels that can cause performance degradation or permanent damage.

[0021] [P-137600-CN-PRI-1][HS2411085CCN]Measurement can help identify overheating areas so that preventive measures can be taken, for example, heat dissipation can be enhanced or equipment load can be adjusted. In addition, temperature data of circuit boards is essential for optimizing system design, improving energy efficiency, and extending equipment life. Temperature monitoring is particularly necessary in computing devices with high requirements for operating stability and reliability, such as servers, industrial control systems, or automotive electronic components. By continuously monitoring the temperature, it can be ensured that the computing equipment operates within the specified temperature range, thereby reducing the failure rate and improving the stability and reliability of the system.

[0022] There are many solutions to ensure the temperature reliability of circuit boards. A relatively effective way is to use a specific position of the circuit board as a temperature monitoring area, and arrange thermal sensing elements such as temperature sensors or thermal imagers in the temperature monitoring area to monitor the temperature of the entire circuit board, trigger an alarm or perform a power shutdown operation when the temperature is abnormal. However, such thermal sensing elements have high requirements for the arrangement position on the circuit board. For example, the space of the on-board circuit needs to be sufficient to arrange the thermal sensing element, so as to achieve electrical isolation from the on-board circuit. Such a temperature monitoring solution has poor flexibility and cannot achieve temperature monitoring of the entire circuit board. To this end, the embodiments of the present disclosure provide a series of solutions to improve the flexibility of temperature monitoring, thereby enabling temperature monitoring of the entire circuit board.

[0023] Specifically, Figure 1 A circuit board of some embodiments is shown. Figure 1 The circuit board 100 includes a carrier board 10, a temperature monitoring circuit 20, a detection circuit 30 and a control circuit 40. The temperature monitoring circuit 20, the detection circuit 30 and the control circuit 40 may also be collectively referred to as a board-mounted circuit.

[0024] Specifically, the temperature monitoring loop 20 includes a monitoring line 21, an output line 22 and a sampling resistor 23. The monitoring line 21 is arranged in the monitoring area of ​​the carrier (as shown by the left dashed line), the sampling resistor 23 is arranged in the control area of ​​the carrier (as shown by the right dashed line), and the output line 22 is connected in series between the monitoring line 21 and the sampling resistor 23.

[0025] In some examples, the lead-out routing has routing flexibility, and the control area and the monitoring area can be far apart. For example, the monitoring area can be a location where the circuit wiring is dense, and temperature monitoring is performed on such a location. Such a location is not suitable for the arrangement of other circuit components or other routings, so other circuit components or other routings can be arranged in the control area. In other words, the location separation of the monitoring area and the control area is achieved through the lead-out routing.

[0026] In other examples, the lead-out routing has routing flexibility, and the control area and the monitoring area can be close to each other, so that the control area can correspond to multiple different monitoring areas, while reducing the circuit board.

[0027] [P-137600-CN-PRI-1][HS2411085CCN] optimizes the trace layout on the circuit board while optimizing other circuits and wiring.

[0028] In addition, the monitoring trace is configured to have a preset thermistor resistance range, the sampling resistor has a given resistance value, and the thermistor resistance value within the preset thermistor resistance range and the given resistance value are both higher than the line resistance value of the lead-out trace. It should be understood that the monitoring trace can be a metal wire such as a copper wire. For example, the metal wire resistance R = ρL / A, where ρ(T) is the resistivity of the material of the metal wire, which is positively correlated with the temperature T of the metal wire, that is, the metal wire acts as a positive temperature coefficient (NTC) thermistor; L is the conductor length of the metal wire; A is the conductor cross-sectional area of ​​the metal wire. That is, the monitoring trace is configured to have a preset thermistor resistance range R = ρ(T)L / A.

[0029] In some examples, the resistance of the sampling resistor and the preset thermistor resistance range can be equivalent values, for example, the two can be of the same order of magnitude, that is, the resistance of the sampling resistor is not less than 1 / 10 of the lower limit of the preset thermistor resistance range, and not more than 10 times the upper limit of the preset thermistor resistance range.

[0030] In addition, the line resistance of the lead-out wiring may be smaller than the resistance of the sampling resistor and the preset thermistor resistance range. For example, the line resistance of the lead-out wiring is smaller than 1 / 10 of the lower limit of the preset thermistor resistance range.

[0031] In addition, the sampling resistor is configured to have a given resistance value, and the thermal coefficient of the sampling resistor is smaller than the thermal coefficient of the monitoring line. Preferably, the thermal coefficient of the sampling resistor is extremely small, that is, the sampling resistor is a non-thermistor.

[0032] It should be understood that the temperature monitoring loop also includes a voltage source, which is connected in series in the temperature monitoring loop, and the voltage source provides a supply voltage for the temperature monitoring loop, and the monitoring line, the lead-out line and the sampling resistor satisfy the resistance-dividing relationship of the supply voltage based on the voltage source. In the case of the above-mentioned resistance value relationship, the lead-out line has wiring flexibility, and the voltage divided by the lead-out line is negligible compared to the sampling resistor and the monitoring line, and will not affect the voltage divided by the monitoring line. It should be understood that if the line resistance of the lead-out line is small enough, it will not affect the voltage divided by the monitoring line, even in the case where the lead-out line can also have a thermal characteristic (i.e., a larger thermal coefficient).

[0033] In other words, under a given supply voltage, the effect of temperature on the resistance of the sampling resistor is minimal, and the factors that affect the voltage divided by the sampling resistor mainly lie in the resistance of the sampling resistor and the temperature of the monitoring wiring.

[0034] In addition, the detection circuit and the control circuit are both arranged in the control area. The detection circuit is used to

[0035] [P-137600-CN-PRI-1][HS2411085CCN]The voltage across the resistor is detected to obtain a detection voltage. The control circuit is connected to the detection circuit and is used to determine the temperature state of the monitoring area based on the detection voltage. It should be understood that based on the above resistance value voltage division relationship, under the condition of a given resistance value of the sampling resistor, the change of the detection voltage of the sampling resistor is inversely correlated with the temperature change of the monitoring area.

[0036] In addition, the circuit board 100 may further include a power supply circuit 50 disposed on the carrier board 10 for supplying power to other circuits on the carrier board 10 .

[0037] In some examples, the control circuit 40 can be used to sound an alarm when the temperature status indicates that the circuit board 100 is in an abnormal state. In other examples, the control circuit 40 can also shut down the power supply circuit 50 when the temperature status indicates that the circuit board is in an abnormal state. For example, the power supply circuit 50 can be a power switch circuit, such as a DC-DC circuit. That is, when the temperature status indicates that the circuit board is in an abnormal state, the power supply circuit is turned off, and over-temperature protection of the circuit board is achieved, that is, the effect of preventing the circuit board from burning is achieved. In addition, the voltage source can be connected to the power supply circuit to directly obtain the power supply voltage of the temperature monitoring loop, or the voltage obtained from the power supply circuit is stepped down or stepped up to obtain the power supply voltage of the temperature monitoring loop.

[0038] In the scheme of the embodiment of the present disclosure, the detection circuit and the control circuit can be arranged in the control area of ​​the carrier board, and the control area and the monitoring area can be electrically connected through the lead-out wiring, thereby avoiding the dependence of the layout position of the detection circuit and the control circuit on the layout position of the monitoring wiring. In addition, the monitoring wiring, the lead-out wiring and the sampling resistor form a temperature monitoring loop. In the temperature monitoring loop, the detection circuit detects the voltage across the sampling resistor. Through the thermistor characteristics of the monitoring wiring, the change in the detection voltage is inversely correlated with the temperature change in the monitoring area, thereby accurately collecting the temperature change in the monitoring area. In addition, the monitoring wiring is arranged in the monitoring area of ​​the carrier board, and the monitoring wiring is configured to have a preset thermistor resistance range. Compared with circuit elements such as thermistors, the monitoring wiring can be flexibly arranged in any monitoring area on the carrier board, thereby improving the flexibility of temperature monitoring, and thus enabling the whole board temperature monitoring of the circuit board.

[0039] In other embodiments, the carrier is a multi-layer substrate, such as Figure 2 As shown, the exemplary multi-layer substrate includes a board layer L1, a board layer L2, and a board layer L3. The monitoring trace 21 is arranged between the board layer 21 and the board layer 22, that is, the inner substrate region of the multi-layer substrate. The sampling resistor is arranged on the board layer L3, that is, the outer substrate region of the multi-layer substrate. The lead trace 22 is connected from the monitoring trace 21 to the sampling resistor 23 via the board layer L2 and the board layer L3 (for example, through the through hole in the board layer). Without loss of generality, the monitoring area is

[0040] [P-137600-CN-PRI-1][HS2411085CCN] is an inner substrate area of ​​a multi-layer substrate, and the control area is an outer substrate area of ​​the multi-layer substrate. The lead-out wiring connects the monitoring wiring and the sampling resistor through at least one through hole in the multi-layer substrate. The sampling resistor is arranged in the control area. When it is difficult to arrange circuit elements in the inner substrate area of ​​the multi-layer substrate, the monitoring wiring is arranged in the inner substrate area, thereby increasing the arrangement range of the monitoring area.

[0041] In other embodiments, the lead-out wiring has wiring flexibility, and the monitoring area can be a location with dense circuit wiring. Such a location is not suitable for the arrangement of other circuit components or other wirings, so other circuit components or other wirings can be arranged in the control area. That is, the circuit wiring density of the monitoring area can be greater than the circuit wiring density of the control area, so that the area with higher wiring density can be used as the monitoring area for temperature monitoring.

[0042] In addition, for a given monitoring area, the shape of the monitoring area may be different. For example, in the case where the monitoring area is relatively narrow and long, the routing trajectory of the monitoring line can be roughly consistent with the shape of the monitoring area. For another example, the monitoring line can be set as a zigzag line or a roundabout line in the monitoring area, which can increase the actual length of the monitoring line, thereby increasing the thermal sensitivity coefficient of the monitoring line. Without loss of generality, the monitoring area is formed by the circuit wiring gap, and the monitoring line is set to have a preset electrical isolation distance from the edge of the monitoring area. That is, when the monitoring area is formed by the circuit wiring gap, the monitoring line can be arranged in the monitoring area, realizing the monitoring of the area with high wiring density, and the monitoring line is set to have a preset electrical isolation distance from the edge of the monitoring area to avoid affecting the electrical performance of the circuit wiring.

[0043] In other embodiments, Figure 3 As shown, the temperature monitoring loop in the circuit board 100 includes a monitoring line, a lead line, a sampling resistor and a voltage source. The monitoring line includes a resistor R1 having a preset thermistor resistance range. The voltage source provides a power supply voltage VCC. The lead line includes a first lead line and a second lead line, the first lead line is connected between one end of the sampling resistor and the monitoring line, and the second lead line is connected between the other end of the sampling resistor and the monitoring line. The first lead line is configured as a first equivalent thermistor R2, and the second lead line is configured as a second equivalent thermistor R3. The sampling resistor is configured to have a given resistance value R4, and R4 can be changed without changing with the temperature of the sampling resistor. In addition, the circuit board 100 also includes an amplifier U1 as an example of the detection circuit 30, and includes a comparator U2 as an example of the control circuit 40.

[0044] In the case where the detection circuit is an amplifier, the first input of the amplifier is connected to one end of the sampling resistor, the second input of the amplifier is connected to the other end of the sampling resistor, and the output of the amplifier is connected to

[0045] [P-137600-CN-PRI-1][HS2411085CCN] control circuit, the amplifier is used to amplify the sampling voltage of the sampling resistor to obtain the detection voltage, and output the detection voltage to the control circuit through the output terminal. That is to say, by amplifying the voltage across the sampling resistor to obtain the detection voltage, the temperature change of the monitoring area can be more significantly judged, and the requirement for the thermal sensitivity coefficient of the monitoring line is also reduced. In some examples, such as Figure 3 As shown, the negative electrode of the voltage source is connected to one end of the sampling resistor and to the ground, and the positive side of the voltage source is connected to the lead-out wiring, that is, the first input terminal of the amplifier is connected to the ground, which is beneficial to saving the static power consumption of the amplifier.

[0046] Specifically, when the temperature of the monitoring area is T1, the monitoring line R1 (T1) is within the preset thermistor resistance range, the resistance of the first equivalent thermistor is R2 (T1), and the resistance of the second equivalent thermistor is R3 (T1). Accordingly, the voltage VR4 (T1) across the sampling resistor detected by the detection circuit 30 is = VCC / (R1 (T1) + R2 (T1) + R3 (T1) + R4) * R4 ≈ VCC / (R1 (T1) + R4) * R4. Alternatively, in the example where the detection circuit 30 is an amplifier U1, the amplifier has a gain coefficient G, and the detection voltage VD (T1) = VR4 (T1) * G.

[0047] For another example, when the temperature of the monitoring area is T2, the monitoring line R1 (T2) is within the preset thermistor resistance range, the resistance of the first equivalent thermistor is R2 (T2), and the resistance of the second equivalent thermistor is R3 (T2). Accordingly, the voltage VR4 across the sampling resistor detected by the detection circuit 30 is VCC / (R1 (T2) + R2 (T2) + R3 (T2) + R4) * R4 ≈ VCC / (R1 (T2) + R4) * R4. Alternatively, in the example where the detection circuit 30 is an amplifier U1, the amplifier has a gain coefficient G, and the detection voltage VD (T2) = VR4 (T2) * G.

[0048] When the control circuit 40 is a comparator U2, the first input terminal of the comparator U2 is connected to the output terminal of the amplifier for receiving a detection voltage, the second input terminal of the comparator U2 receives a preset voltage threshold, and the comparator U2 is used to compare the detection voltage with the preset voltage threshold and output a control signal indicating the comparison result.

[0049] Specifically, when the temperature of the monitoring area is T, the detection voltage is VD(T)=VR4(T)*G≈VCC*G / (R1(T)+R4)*R4. Tth can be set as the upper temperature limit of the monitoring area based on experience or customization, and it is considered that when the temperature of the monitoring area exceeds the upper temperature limit, the circuit board is in an abnormal state, for example, the circuit board is at risk of burning.

[0050] In this example, R1(T) is positively correlated with T, and VD(T) is negatively correlated with R1(T), that is, VD(T)

[0051] [P-137600-CN-PRI-1][HS2411085CCN] is inversely correlated with T. Accordingly, VD(Tth) can be set as the lower threshold of the detection voltage, that is, the preset voltage threshold. When the detection voltage is greater than the preset voltage threshold, the comparison result output by the comparator U2 indicates that the circuit board is in a normal state. When the detection voltage is less than the preset voltage threshold, the comparison result output by the comparator U2 indicates that the circuit board is in an abnormal state.

[0052] That is to say, the simple circuit configuration of the comparator realizes accurate comparison between the preset voltage threshold and the detection voltage, thereby accurately judging the temperature state of the monitoring area.

[0053] Without loss of generality, the control circuit can be configured as an analog circuit, and the control circuit determines that the temperature state of the monitoring area indicates that the circuit board is in an abnormal state when the detection voltage is less than a preset voltage threshold. The change in the detection voltage is inversely correlated with the temperature change in the monitoring area. The detection voltage being less than the preset voltage threshold indicates that the voltage at both ends of the monitoring line is large, that is, the temperature of the monitoring area where the monitoring line is located is high. In this case, by setting the preset voltage threshold, it can be determined that the temperature state of the monitoring area indicates that the circuit board is in an abnormal state. Alternatively, when the detection voltage is greater than the preset voltage threshold, it can be determined that the temperature state of the monitoring area is in a normal state.

[0054] In addition, the preset voltage threshold can be provided by a voltage divider circuit formed by a plurality of series resistors, and different preset voltage thresholds can be output from different series nodes between the plurality of series resistors, thereby adjusting the preset voltage threshold. For example, the voltage divider circuit can be connected between the ground terminal and the voltage source of the temperature monitoring loop, or between the ground terminal and the power supply terminal of the power supply circuit.

[0055] The following will be combined Figure 4 Circuit boards according to other embodiments of the present disclosure are described in detail. Figure 4 The circuit board includes a carrier board 10 , a temperature monitoring circuit 20 , a first detection circuit 31 , a second detection circuit 32 and a control circuit 60 .

[0056] Specifically, the temperature monitoring circuit 20 includes a monitoring line 21, a lead-out line 22, a first sampling resistor 231 and a second sampling resistor 232. The monitoring line 21 is arranged in the monitoring area of ​​the carrier 10 (as shown by the dotted line on the left), the first sampling resistor 231 and the second sampling resistor 232 are arranged in the control area of ​​the carrier 10 (as shown by the dotted line on the right), and the lead-out line 22 is connected in series between the monitoring line 21, the first sampling resistor 231 and the second sampling resistor 232.

[0057] In addition, the monitoring line 21 is configured to have a preset thermistor resistance range, the first sampling resistor 231 has a first given resistance value, and the second sampling resistor 232 has a second given resistance value. The thermistor resistance value, the first given resistance value, and the second given resistance value within the preset thermistor resistance range are all higher than the lead

[0058] [P-137600-CN-PRI-1][HS2411085CCN]The line resistance of trace 22.

[0059] The first detection circuit 231 is arranged in the control area, and the first detection circuit 231 is used to detect the voltage across the first sampling resistor 231 to obtain a first detection voltage. The change of the first detection voltage is inversely correlated with the temperature change of the monitoring area; the second detection circuit 232 is arranged in the control area, and the second detection circuit 232 is used to detect the voltage across the second sampling resistor 232 to obtain a second detection voltage. The change of the second detection voltage is inversely correlated with the temperature change of the monitoring area.

[0060] The control circuit 60 is disposed in the control area. The control circuit 60 is connected to the first detection circuit 31 and the second detection circuit 32 and is used to determine the temperature state of the monitoring area based on the first detection voltage and the second detection voltage.

[0061] It should be understood that the explanation and illustration of the above-mentioned similar technical concepts and corresponding elements can refer to the explanation and illustration based on the circuit board 100.

[0062] In the scheme of the embodiment of the present disclosure, the monitoring trace is set in the monitoring area of ​​the carrier board, and the monitoring trace is configured to have a preset thermistor resistance range. Compared with circuit elements such as thermistors, the monitoring trace can be flexibly set in any monitoring area on the carrier board, thereby improving the flexibility of temperature monitoring and realizing the whole board temperature monitoring of the circuit board.

[0063] In addition, the first detection circuit, the second detection circuit and the control circuit can be arranged in the control area of ​​the carrier board, and the control area and the monitoring area can be electrically connected through the lead-out wiring, thereby avoiding the dependence of the layout positions of the first detection circuit, the second detection circuit and the control circuit on the layout position of the monitoring wiring. In addition, the monitoring wiring, the lead-out wiring and the first sampling resistor and the second sampling resistor form a temperature monitoring loop. In the temperature monitoring loop, the first detection circuit detects the voltage across the first sampling resistor, and the second detection circuit detects the voltage across the second sampling resistor. Through the thermal sensitivity of the monitoring wiring, the changes in the first detection voltage and the second detection voltage are inversely correlated with the temperature changes in the monitoring area. By comprehensively judging the first detection voltage and the second detection voltage, the temperature changes in the monitoring area are accurately collected.

[0064] In other embodiments, the monitoring area is the inner substrate area of ​​the multi-layer substrate, the control area is the outer substrate area of ​​the multi-layer substrate, and the lead-out wiring connects the monitoring wiring with the first sampling resistor and the second sampling resistor through at least one through hole in the multi-layer substrate, and the first sampling resistor and the second sampling resistor are arranged in the control area.

[0065] [P-137600-CN-PRI-1][HS2411085CCN] is arranged in the inner substrate area, which increases the layout range of the monitoring area.

[0066] In other embodiments, as shown in Figure 5, the first detection resistor 231 is R41, the second detection resistor is R42, the control circuit 60 includes a first comparator U12, a second comparator U22 and a logic OR gate U3, the output of the first comparator U12 is connected to the first input of the logic OR gate U3, and the output of the second comparator U22 is connected to the second input of the logic OR gate U3.

[0067] In addition, the first input end of the first comparator U12 is connected to the first detection circuit for receiving the first detection voltage, the second input end of the first comparator U12 is connected to the first preset voltage threshold, the first comparator U12 is used to compare the first detection voltage with the first preset voltage threshold, and output a first high level when the first detection voltage is less than the first preset voltage threshold. The first input end of the second comparator U22 is connected to the second detection circuit for receiving the second detection voltage, the second input end of the second comparator U22 is connected to the second preset voltage threshold, the second comparator U22 is used to compare the second detection voltage with the second preset voltage threshold, and output a second high level when the second detection voltage is less than the second preset voltage threshold.

[0068] In addition, Figure 5 In the example, the first detection circuit 31 can be an amplifier U11, and the second detection circuit can be U21. Specifically, when the temperature of the monitoring area is T1, the monitoring line R1 (T1) is within the preset thermistor resistance range, the resistance of the first equivalent thermistor is R2 (T1), and the resistance of the second equivalent thermistor is R3 (T1). Accordingly, the voltage across the sampling resistor detected by the detection circuit 31 is VR 41 (T1) = VCC / (R1 (T1) + R2 (T1) + R3 (T1) + R41 + R42) * R41 ≈ VCC / (R1 (T1) + R41 + R42) * R41. Alternatively, in the example where the detection circuit 31 is an amplifier U11, the amplifier has a gain coefficient G1, and the first detection voltage VD (T1) = VR41 (T1) * G1.

[0069] Correspondingly, when the temperature of the monitoring area is T2, the monitoring line R1 (T2) is within the preset thermistor resistance range, the resistance of the first equivalent thermistor is R2 (T2), and the resistance of the second equivalent thermistor is R3 (T2). Correspondingly, the voltage across the sampling resistor detected by the detection circuit 31 is VR41 (T2) = VCC / (R1 (T2) + R2 (T2) + R3 (T2) + R41 + R42) * R41 ≈ VCC / (R1 (T2) + R41 + R42) * R41. Alternatively, in the example where the detection circuit 31 is an amplifier U11, the amplifier has a gain coefficient G1, and the first detection voltage VD1 (T2) = VR41 (T2) * G1.

[0070] Similarly, when the temperature of the monitoring area is T1, the voltage across the sampling resistor detected by the detection circuit 32 is VR42(T1)=VCC / (R1(T1)+R2(T1)+R3(T1)+R41+R42)*R42≈VCC / (R1(T1)+R41+R42)*R42. Alternatively, in the example where the detection circuit 32 is an amplifier U21, the amplifier

[0071] [P-137600-CN-PRI-1][HS2411085CCN] The amplifier has a gain coefficient G2, and the second detection voltage VD2 (T1) = VR42 (T1) * G2.

[0072] Accordingly, when the temperature of the monitoring area is T2, the voltage across the sampling resistor detected by the detection circuit 32 is VR42(T2)=VCC / (R1(T2)+R2(T2)+R3(T2)+R41+R42)*R42≈VCC / (R1(T2)+R41+R42)*R42. Alternatively, in the example where the detection circuit 32 is an amplifier U21, the amplifier has a gain coefficient G2, and the second detection voltage VD2(T2)=VR42(T2)*G2.

[0073] Therefore, VD1(T) is inversely correlated with T, and VD2(T) is inversely correlated with T. Tth can be set empirically or customized as the upper temperature limit of the monitoring area. For example, VD1(Tth) is set as the lower threshold of the first detection voltage, that is, the first preset voltage threshold, and VD2(Tth) is set as the lower threshold of the second detection voltage, that is, the second preset voltage threshold.

[0074] That is, when the first detection voltage is less than the first preset voltage threshold, if only the comparison result (e.g., high level) output by the first comparator U12 is considered, the circuit board is in an abnormal state. When the second detection voltage is less than the second preset voltage threshold, if only the comparison result (e.g., high level) output by the second comparator U22 is considered, the circuit board is in an abnormal state.

[0075] In this case, the output result of the comparator U11 and the output result of the comparator U21 are synthesized by the logic OR gate U3. When the output signal at the output end of the logic OR gate U3 is at a high level, the temperature state of the monitoring area indicates that the circuit board 400 is in an abnormal state. When the output signal at the output end of the logic OR gate U3 is at a low level, the temperature state of the monitoring area indicates that the circuit board 400 is in a normal state. That is, if the output result of at least one of the first detection circuit and the second detection circuit indicates that the circuit board is in an abnormal state, it is judged that the circuit board is in an abnormal state, thereby performing temperature monitoring more reliably. The logic OR gate U3 can be connected to the power supply circuit of the circuit board, and control the power supply circuit to be turned off when the circuit board is judged to be in an abnormal state.

[0076] In addition, some other embodiments of the present disclosure further provide a computing device, such as Figure 6 As shown, the computing device 600 includes a chassis 610 and a circuit board 620. In some examples, the circuit board 620 can be the circuit board 100 or the circuit board 400 described above. For example, as a computing device, a server includes a circuit board as a core component. The circuit board can integrate key electronic components required for the operation of the server, such as a central processing unit (CPU), a random access memory (RAM), an input / output interface, and various other supporting chips. The above components work together to perform data processing, storage, and transmission tasks. The complex wiring on the circuit board connects the various components to each other, ensuring that the server can efficiently handle a large number of computing

[0077] [P-137600-CN-PRI-1][HS2411085CCN] computing tasks and network requests. In addition, in order to ensure the stability of the server under long-term high-load operation, the solution of the embodiment of the present disclosure can be used to perform temperature monitoring, and the temperature monitoring can be associated with key factors such as heat dissipation management and power management.

[0078] Thus far, specific embodiments of the subject matter have been described. Other embodiments are within the scope of the appended claims. In some cases, the actions recited in the claims may be performed in a different order and still achieve the desired results. Additionally, the processes depicted in the accompanying drawings do not necessarily require the specific order or sequential order shown to achieve the desired results. In some embodiments, multitasking and parallel processing may be advantageous.

[0079] It should also be noted that the terms "include", "comprises" or any other variations thereof are intended to cover non-exclusive inclusion, so that a process, method, commodity or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, commodity or device. In the absence of more restrictions, the elements defined by the sentence "comprises a ..." do not exclude the existence of other identical elements in the process, method, commodity or device including the elements.

[0080] Those skilled in the art will appreciate that the embodiments of the present application may be provided as methods, systems or computer program products. Therefore, the present application may adopt the form of a complete hardware embodiment, a complete software embodiment or an embodiment in combination with software and hardware. Moreover, the present application may adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) that contain computer-usable program code.

[0081] Each embodiment in this specification is described in a progressive manner, and the same or similar parts between the embodiments can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the system embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and the relevant parts can be referred to the partial description of the method embodiment.

[0082] The above is only an embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various changes and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application should be included in the scope of the claims of the present application.

Claims

1. A circuit board, comprising: Carrier board; A temperature monitoring loop, comprising a monitoring line, a lead-out line and a sampling resistor, wherein the monitoring line is arranged in a monitoring area of ​​the carrier board, the sampling resistor is arranged in a control area of ​​the carrier board, and the lead-out line is connected in series between the monitoring line and the sampling resistor, wherein the monitoring line is configured to have a preset thermistor resistance range, the sampling resistor has a given resistance value, and the thermistor resistance value within the preset thermistor resistance range and the given resistance value are both higher than the line resistance value of the lead-out line; A detection circuit is arranged in the control area, and is used for detecting the voltage across the sampling resistor to obtain a detection voltage, wherein a change of the detection voltage is inversely correlated with a temperature change of the monitoring area; A control circuit is arranged in the control area, the control circuit is connected to the detection circuit, and is used to determine the temperature state of the monitoring area based on the detection voltage.

2. The circuit board according to claim 1, wherein: The temperature monitoring loop also includes a voltage source, which is connected in series in the temperature monitoring loop, the negative electrode of the voltage source is connected to one end of the sampling resistor and to the ground, and the positive side of the voltage source is connected to the lead-out wiring.

3. The circuit board according to claim 1, wherein: The carrier board is a multi-layer substrate, the monitoring area is an inner substrate area of ​​the multi-layer substrate, the control area is an outer substrate area of ​​the multi-layer substrate, and the lead-out line connects the monitoring line and the sampling resistor through at least one through hole in the multi-layer substrate.

4. The circuit board according to claim 3, wherein: The circuit wiring density of the monitoring area is greater than the circuit wiring density of the control area.

5. The circuit board according to claim 1, wherein: The control circuit is specifically used for: when the detection voltage is less than a preset voltage threshold, determining that the temperature state of the monitoring area indicates that the circuit board is in an abnormal state.

6. The circuit board according to claim 5, wherein: The circuit board includes a power supply circuit arranged on the carrier board for supplying power to other circuits on the carrier board, and the control circuit is further used to shut down the power supply circuit when the temperature status indicates that the circuit board is in an abnormal state.

7. The circuit board according to claim 5, wherein: The detection circuit is an amplifier, a first input of the amplifier is connected to one end of the sampling resistor, a second input of the amplifier is connected to the other end of the sampling resistor, an output of the amplifier is connected to the control circuit, and the amplifier is used to amplify the sampling voltage of the sampling resistor to obtain a detection voltage, and output the detection voltage to the control circuit through the output end.

8. The circuit board according to claim 7, wherein: The control circuit is a comparator, a first input terminal of the comparator is connected to the output terminal of the amplifier and is used to receive the detection voltage, a second input terminal of the comparator receives the preset voltage threshold, and the comparator is used to compare the detection voltage with the preset voltage threshold and output a control signal indicating the comparison result.

9. The circuit board according to claim 1, wherein: The monitoring area is formed by circuit wiring gaps, and the monitoring lines are arranged to have a preset electrical isolation distance from the edge of the monitoring area.

10. The circuit board according to claim 9, wherein: The monitoring line is arranged as a zigzag line or a roundabout line in the monitoring area.

11. A circuit board, comprising: Carrier board; A temperature monitoring loop, comprising a monitoring line, a lead-out line, a first sampling resistor and a second sampling resistor, wherein the monitoring line is arranged in a monitoring area of ​​the carrier board, the first sampling resistor and the second sampling resistor are arranged in a control area of ​​the carrier board, and the lead-out line is connected in series between the monitoring line, the first sampling resistor and the second sampling resistor, wherein the monitoring line is configured to have a preset thermistor resistance range, the first sampling resistor has a first given resistance value, the second sampling resistor has a second given resistance value, and the thermistor resistance within the preset thermistor resistance range, the first given resistance value and the second given resistance value are all higher than the line resistance value of the lead-out line; A first detection circuit is arranged in the control area, the first detection circuit is used to detect the voltage across the first sampling resistor to obtain a first detection voltage, wherein the change of the first detection voltage is inversely correlated with the temperature change of the monitoring area; A second detection circuit is arranged in the control area, the second detection circuit is used to detect the voltage across the second sampling resistor to obtain a second detection voltage, wherein the change of the second detection voltage is inversely correlated with the temperature change of the monitoring area; A control circuit is arranged in the control area, the control circuit is connected to the first detection circuit and the second detection circuit, and is used to determine the temperature state of the monitoring area based on the first detection voltage and the second detection voltage.

12. The circuit board according to claim 11, wherein: The control circuit includes a first comparator, a second comparator and a logic OR gate, the output end of the first comparator is connected to the first input end of the logic OR gate, the output end of the second comparator is connected to the second input end of the logic OR gate, when the output signal of the output end of the logic OR gate is at a high level, the temperature state of the monitoring area indicates that the circuit board is in an abnormal state, and when the output signal of the output end of the logic OR gate is at a low level, the temperature state of the monitoring area indicates that the circuit board is in a normal state; Wherein, the first input end of the first comparator is connected to the first detection circuit for receiving the first detection voltage, the second input end of the first comparator is connected to a first preset voltage threshold, the first comparator is used to compare the first detection voltage with the first preset voltage threshold, and output a first high level when the first detection voltage is less than the first preset voltage threshold; Among them, the first input end of the second comparator is connected to the second detection circuit for receiving the second detection voltage, the second input end of the second comparator is connected to the second preset voltage threshold, the second comparator is used to compare the second detection voltage with the second preset voltage threshold, and output a second high level when the second detection voltage is less than the second preset voltage threshold.

13. A computing device comprising: Chassis; A circuit board according to any one of claims 1 to 12.

Images