Etching device for diode production and processing

By setting limits, etching and cleaning mechanisms in the diode processing device, the problem of etching failure caused by dust on the diode surface is solved, the production efficiency is improved and manual labor is reduced, and efficient diode processing is achieved.

CN119208201AInactive Publication Date: 2024-12-27YANCHENG SIRUN SEMICON CO LTD
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Patent Information

Application Number
CN202411320281.9
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-20
Publication Date
2024-12-27
Estimated Expiration
Not applicable · inactive patent

AI Technical Summary

Technical Problem

During diode processing, dust or waste chips are prone to fall on the surface, resulting in etching failure, requiring secondary cleaning to reduce production efficiency.

Method used

An etching device for diode production and processing including limiting, etching and cleaning mechanisms is designed. The limiting and etching of the diode is realized through the motor driving threaded rod and push rod system, and the passive telescopic plate and buffer elastic rod are used to achieve the limiting and etching of the diode. Cleaning mechanism cleans up dust from the diode surface.

Benefits of technology

It effectively improves the production efficiency of diode processing, reduces labor force for manual cleaning, and ensures the smooth progress of the etching process.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention relates to the technical field of diode etching, and discloses an etching device for diode production and processing, which comprises a workbench, the surface of the workbench is fixedly connected with a right-angle frame, the top of the right-angle frame is fixedly connected with a cooling pump, and the surface of the cooling pump is fixedly connected with a cooling telescopic pipe. A placing table is fixedly connected to the surface of the workbench, and a motor is fixedly connected to the bottom of the workbench. Firstly, a diode is placed on the surface of a placement table, then a motor is started to drive a threaded rod to rotate, when the threaded rod rotates, a threaded ring moves upwards, when the threaded ring moves upwards, a lifting frame is driven to move upwards, and the lifting frame drives a right-angle plate to move upwards; when the right-angle plate moves upwards, the sliding frame is pushed to slide on the inner wall of the sliding groove in the mutually-approaching direction, when the sliding frame moves, the pushing rod is pushed to move in the mutually-approaching direction, and when the pushing rod moves, the limiting extension rod is pushed to extend in the mutually-approaching direction.
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Description

Technical Field

[0001] The invention relates to the technical field of diode etching equipment, in particular to an etching device for diode production and processing. Background Art

[0002] Diode, among electronic components, is a device with two electrodes that only allows current to flow in a single direction. Many uses apply its rectification function, while varactor diodes are used as electronic adjustable capacitors. The current directionality possessed by most diodes is usually called the "rectification" function. The most common function of a diode is to only allow current to flow in a single direction, which is called forward bias, and to block it in the reverse direction, which is called reverse bias. Therefore, a diode can be thought of as an electronic version of a check valve, an early vacuum electronic diode; it is an electronic device that can conduct current in one direction. There is a PN junction and two lead terminals inside the semiconductor diode. This electronic device has the conductivity of unidirectional current according to the direction of the applied voltage.

[0003] In the prior art, after the diode is processed in the previous step, some dust or scraps will inevitably fall on the surface of the diode. When etching the diode, it is easy to cause etching failure, resulting in the need for the diode to be reworked for a second time, which is time-consuming and labor-intensive. At this time, the diode surface needs to be cleaned and then etched, which will lead to a decrease in the production efficiency of the diode. Summary of the invention

[0004] The object of the present invention is to provide an etching device for diode production and processing to solve the problems raised in the above background technology.

[0005] In order to solve the above technical problems, the present invention is achieved through the following technical solutions:

[0006] The present invention is an etching device for diode production and processing, comprising a workbench, a right-angle frame is fixedly connected to the surface of the workbench, a cooling pump is fixedly connected to the top of the right-angle frame, a cooling telescopic pipe is fixedly connected to the surface of the cooling pump, a placing table is fixedly connected to the surface of the workbench, a motor is fixedly connected to the bottom of the workbench, and further comprising;

[0007] A limiting mechanism, the limiting mechanism comprising a limiting plate, a surface of the limiting plate being fixedly connected to a telescopic rod, and an end of the telescopic rod away from the limiting plate being fixedly connected to a contact plate;

[0008] An etching mechanism, the etching mechanism comprising a passive disk, a passive frame is fixedly connected to the surface of the passive disk, and a slide rail is fixedly connected to the bottom of the passive disk;

[0009] The cleaning mechanism comprises a passive telescopic plate, the bottom of which is fixedly connected with a buffer elastic rod, and one end of the buffer elastic rod away from the passive telescopic plate is fixedly connected with the cleaning plate.

[0010] Furthermore, there are four right-angle frames, which are symmetrically arranged with the placement table as the center, and the inner surface of the right-angle frame is provided with a sliding groove. There are two cooling telescopic tubes, which are symmetrically arranged with the cooling pump as the center.

[0011] Furthermore, the limiting mechanism includes a threaded rod, a threaded ring is threadedly connected to the surface of the threaded rod, a rising frame is fixedly connected to the surface of the threaded ring, an end of the rising frame away from the threaded ring is fixedly connected to a right-angle plate, an end of the right-angle plate away from the rising frame is fixedly connected to a sliding frame, a pushing rod is rotatably connected to the surface of the sliding frame, an end of the pushing rod away from the sliding frame is fixedly connected to a limiting extension rod, and the top of the limiting plate is fixedly connected to an elastic frame.

[0012] Furthermore, the end of the threaded rod is fixedly connected to the output end of the motor, the end of the threaded rod away from the motor is rotatably connected to the bottom of the workbench, the rising frame completely penetrates the surface of the workbench and is fixedly connected to the bottom of the right-angle plate, the surface of the sliding frame is slidably connected to the inner wall of the sliding groove, the end of the limiting extension rod away from the limiting plate is fixedly connected to the inner wall of the sliding groove, and the bottom of the contact plate contacts the surface of the placing table.

[0013] Furthermore, the etching mechanism includes a slide plate, the bottom of the slide plate is fixedly connected to a slide rod, the inner wall of the slide plate is slidably connected to a slider frame, the bottom of the slider frame is rotatably connected to a lower push rod, the end of the lower push rod away from the slider frame is rotatably connected to a lower push block, the bottom of the lower push block is fixedly connected to a lower push plate, the surface of the slide rod is fixedly connected to an extrusion plate, the surface of the slide rail is slidably connected to a slide rod, the surface of the slide rod is fixedly connected to a force block, the two sides of the slide rod are fixedly connected to contraction plates, and the bottom of the passive disk is fixedly connected to an etching rod.

[0014] Furthermore, the inner surface of the right-angle frame is fixedly connected to the top of the slide plate, the top of the elastic frame is fixedly connected to the bottom of the slider frame, the end of the push-down plate away from the push-down block is fixedly connected to the surface of the passive disk, the end of the extrusion plate away from the slide rod is in contact with the surface of the force block, and the end of the cooling telescopic tube away from the cooling pump is fixedly connected to the surface of the etching rod.

[0015] Furthermore, the cleaning mechanism includes a fixed plate, the inner surface of which is rotatably connected to a driven plate, the end of the driven plate is fixedly connected to a pushing elastic rod, the end of the driven plate away from the pushing elastic rod is fixedly connected to a cleaning rod, and the surface of the fixed plate is fixedly connected to a cross bar.

[0016] Furthermore, one end of the pushing elastic rod away from the driven plate is fixedly connected to the surface of the passive frame, a movable groove is opened on the surface of the cross bar, the passive telescopic plate is slidably connected to the inner wall of the movable groove, and one end of the cleaning rod away from the driven plate is fixedly connected to the surface of the passive telescopic plate.

[0017] The present invention has the following beneficial effects:

[0018] The present invention provides a limiting mechanism, firstly, the diode is placed on the surface of the placing table, and then the motor is started to drive the threaded rod to rotate. When the threaded rod rotates, the threaded ring moves upward, and the threaded ring drives the rising frame to move upward when it moves upward, and the rising frame drives the right-angle plate to move upward, and when the right-angle plate moves upward, it pushes the sliding frame to slide on the inner wall of the sliding groove in the direction of approaching each other, and when the sliding frame moves, it pushes the pushing rod to move in the direction of approaching each other, and when the pushing rod moves, it pushes the limiting extension rod to extend in the direction of approaching each other, and when the limiting extension rod is extended, it pushes the limiting plate to move in the direction of approaching each other, and the limiting plate pushes the telescopic rod to move in the direction of approaching each other, and the telescopic rod pushes the contact plate to move in the direction of approaching each other, and when the limiting plate moves, it drives the elastic frame to move in the direction of approaching each other and squeezes it, and when the elastic frame is squeezed, the middle part is bent in the direction of approaching each other, so that diodes of different sizes are effectively limited, thereby improving production efficiency.

[0019] When the sliding plate moves downward, it pushes the lower push rod to move downward, and the lower push rod pushes the lower push block to move downward. The lower push block pushes the lower push plate to move downward. When the lower push plate moves downward, it pushes the passive plate to move downward, and the passive plate drives the passive frame to move downward. When the passive plate moves downward, it pushes the sliding rod to move downward, and the sliding rod drives the force-bearing block to move downward. When the force-bearing block moves downward, it contacts with the extrusion plate and is extruded. When the force-bearing block is extruded, it pushes the sliding rod to move on the surface of the slide rail in the direction of approaching each other. When the sliding rod moves, it drives the shrinking plate to move and shrink. When the passive plate moves downward, it drives the etching rod to move downward, and the etching rod drives the cooling telescopic tube to move downward. When the etching rod reaches a certain position and etches, the diode is effectively etched, and the smoke generated during the etching process can also be isolated by the shrinking plate.

[0020] The present invention provides a cleaning mechanism, when the passive frame moves downward, it drives the elastic rod to move downward, and when the elastic rod is pushed downward, it drives the driven plate of the placing table to rotate downward on the inner surface, when one end of the driven plate moves downward, the other end of the driven plate is lifted upward, and when the other end of the driven plate is lifted upward, it drives the cleaning rod to move in directions away from each other, and when the cleaning rod moves, it pulls the passive telescopic plate to extend downward and slides on the inner wall of the moving groove in directions away from each other, and when the passive telescopic plate extends downward, it drives the buffer elastic rod to move downward, and when the buffer elastic rod moves, it drives the cleaning plate to move downward and contact the surface of the diode, so that dust on the surface of the diode is effectively cleaned, labor is saved for the staff, and production efficiency is improved.

[0021] Of course, any product implementing the present invention does not necessarily need to achieve all of the advantages described above at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings required for describing the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other accompanying drawings can be obtained based on these accompanying drawings without paying creative work.

[0023] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0024] Figure 2 It is a schematic diagram of the overall cross-sectional structure of the present invention;

[0025] Figure 3 It is a schematic diagram of the overall structure of the limiting mechanism of the present invention;

[0026] Figure 4 For the present invention Figure 3 A schematic diagram of the enlarged structure of part A;

[0027] Figure 5 It is a schematic diagram of the threaded rod structure of the present invention;

[0028] Figure 6 It is a schematic diagram of the overall structure of the etching mechanism of the present invention;

[0029] Figure 7 For the present invention Figure 6 A schematic diagram of the enlarged structure of part B in FIG.

[0030] Figure 8 It is a schematic diagram of the overall structure of the cleaning mechanism of the present invention;

[0031] Fig. 9 For the present invention Figure 8 Schematic diagram of the enlarged structure of part C in.

[0032] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0033] In the figure: 1, workbench; 2, right angle frame; 3, cooling pump; 4, cooling telescopic tube; 5, placing table; 6, motor; 10, limit mechanism; 11, threaded rod; 12, threaded ring; 13, rising frame; 14, right angle plate; 15, sliding frame; 16, push rod; 17, limit extension rod; 18, limit plate; 19, telescopic rod; 20, contact plate; 21, elastic frame; 30, etching mechanism; 31, slide plate; 32, slide rod; 3 3. Slider frame; 34. Push rod; 35. Push block; 36. Push plate; 37. Extrusion plate; 38. Passive disk; 39. Passive frame; 40. Slide rail; 41. Slide rod; 42. Force block; 43. Contraction plate; 44. Etching rod; 50. Cleaning mechanism; 51. Fixed plate; 52. Driven plate; 53. Push elastic rod; 54. Cleaning rod; 55. Passive telescopic plate; 56. Buffer elastic rod; 57. Cleaning plate; 58. Cross bar. DETAILED DESCRIPTION

[0034] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0035] See also Figure 1-Figure 9 As shown, the present invention is an etching device for diode production and processing, comprising a workbench 1, a right angle frame 2 is fixedly connected to the surface of the workbench 1, a cooling pump 3 is fixedly connected to the top of the right angle frame 2, a cooling telescopic pipe 4 is fixedly connected to the surface of the cooling pump 3, a placing table 5 is fixedly connected to the surface of the workbench 1, a motor 6 is fixedly connected to the bottom of the workbench 1, and further comprising;

[0036] The limiting mechanism 10 includes a limiting plate 18. When the limiting extension rod 17 is extended, the limiting plate 18 is pushed to move in a direction approaching each other. A telescopic rod 19 is fixedly connected to the surface of the limiting plate 18. The limiting plate 18 pushes the telescopic rod 19 to move in a direction approaching each other. One end of the telescopic rod 19 away from the limiting plate 18 is fixedly connected to a contact plate 20. The telescopic rod 19 pushes the contact plate 20 to move in a direction approaching each other.

[0037] The etching mechanism 30 includes a passive disk 38. When the push plate 36 moves downward, the passive disk 38 is pushed downward. A passive frame 39 is fixedly connected to the surface of the passive disk 38. The passive disk 38 drives the passive frame 39 to move downward. A slide rail 40 is fixedly connected to the bottom of the passive disk 38.

[0038] The cleaning mechanism 50 includes a passive telescopic plate 55. When the cleaning rod 54 moves, the passive telescopic plate 55 is pulled to extend downward and slides on the inner wall of the moving groove in a direction away from each other. A buffer elastic rod 56 is fixedly connected to the bottom of the passive telescopic plate 55. When the passive telescopic plate 55 extends downward, the buffer elastic rod 56 is pushed to move downward. One end of the buffer elastic rod 56 away from the passive telescopic plate 55 is fixedly connected to a cleaning plate 57. When the buffer elastic rod 56 moves, the cleaning plate 57 is pushed to move downward and contact the surface of the diode.

[0039] There are four right angle frames 2, which are symmetrically arranged with the placement table 5 as the center. The inner surface of the right angle frame 2 is provided with a sliding groove. There are two cooling telescopic pipes 4, which are symmetrically arranged with the cooling pump 3 as the center.

[0040] The limiting mechanism 10 includes a threaded rod 11, and a threaded ring 12 is threadedly connected to the surface of the threaded rod 11. When the threaded rod 11 rotates, the threaded ring 12 moves upward, and a rising frame 13 is fixedly connected to the surface of the threaded ring 12. The end of the rising frame 13 away from the threaded ring 12 is fixedly connected to a right-angle plate 14, and the end of the right-angle plate 14 away from the rising frame 13 is fixedly connected to a sliding frame 15. The surface of the sliding frame 15 is rotatably connected with a pushing rod 16. When the sliding frame 15 moves, the pushing rod 16 is pushed to move in a direction close to each other. The end of the pushing rod 16 away from the sliding frame 15 is fixedly connected to a limiting extension rod 17, and the top of the limiting plate 18 is fixedly connected to an elastic frame 21. When the limiting plate 18 moves, the elastic frame 21 is driven to move and squeeze in a direction close to each other. When the elastic frame 21 is squeezed, the middle part is bent in a direction close to each other, which effectively limits diodes of different sizes, thereby improving production efficiency.

[0041] The end of the threaded rod 11 is fixedly connected to the output end of the motor 6, and the end of the threaded rod 11 away from the motor 6 is rotatably connected to the bottom of the workbench 1. First, the diode is placed on the surface of the placement table 5, and then the motor 6 is started to drive the threaded rod 11 to rotate. The rising frame 13 completely penetrates the surface of the workbench 1. When the threaded ring 12 moves upward, it drives the rising frame 13 to move upward and is fixedly connected to the bottom of the right-angle plate 14. The rising frame 13 drives the right-angle plate 14 to move upward, and the surface of the sliding frame 15 is slidably connected to the inner wall of the sliding groove. When the right-angle plate 14 moves upward, it pushes the sliding frame 15 to slide on the inner wall of the sliding groove in the direction of approaching each other. The end of the limit extension rod 17 away from the limit plate 18 is fixedly connected to the inner wall of the sliding groove. When the push rod 16 moves, it pushes the limit extension rod 17 to extend in the direction of approaching each other, and the bottom of the contact plate 20 contacts the surface of the placement table 5.

[0042] The etching mechanism 30 includes a slide plate 31, a slide rod 32 is fixedly connected to the bottom of the slide plate 31, a slider frame 33 is slidably connected to the inner wall of the slide plate 31, a lower push rod 34 is rotatably connected to the bottom of the slider frame 33, and when the slider frame 33 moves, the lower push rod 34 is pushed to move downward, and the end of the lower push rod 34 away from the slider frame 33 is rotatably connected to a lower push block 35, and the lower push rod 34 pushes the lower push block 35 to move downward, and the bottom of the lower push block 35 is fixedly connected to a lower push plate 36, and the surface of the slide rod 32 is fixedly connected to an extrusion plate 37, and the surface of the slide rail 40 is slidably connected to the slide rod 41. When the force block 42 is subjected to the extrusion force, the slide rod 41 is pushed on the surface of the slide rail 40 in a direction close to each other. Move, when the passive disk 38 moves downward, it pushes the sliding rod 41 to move downward, the surface of the sliding rod 41 is fixedly connected with a force block 42, the sliding rod 41 drives the force block 42 to move downward, and the two sides of the sliding rod 41 are fixedly connected with contraction plates 43, when the sliding rod 41 moves, it drives the contraction plate 43 to move and contract, and the bottom of the passive disk 38 is fixedly connected with an etching rod 44, when the passive disk 38 moves downward, it drives the etching rod 44 to move downward, and the etching rod 44 drives the cooling telescopic tube 4 to move downward, when the etching rod 44 reaches a certain position and etches, the diode is effectively etched, and the smoke generated during the etching process can also be isolated by the contraction plate 43.

[0043] The inner surface of the right-angle frame 2 is fixedly connected to the top of the slide plate 31, and the top of the elastic frame 21 is fixedly connected to the bottom of the slider frame 33. When the elastic frame 21 bends, it drives the slider frame 33 to slide on the inner wall of the slide plate 31 in the direction of approaching each other. The end of the lower push plate 36 away from the lower push block 35 is fixedly connected to the surface of the passive disk 38. The lower push block 35 pushes the lower push plate 36 to move downward, and the end of the extrusion plate 37 away from the slide rod 32 contacts the surface of the force block 42. When the force block 42 moves downward, it contacts and is squeezed by the extrusion plate 37, and the end of the cooling telescopic tube 4 away from the cooling pump 3 is fixedly connected to the surface of the etching rod 44.

[0044] The cleaning mechanism 50 includes a fixed plate 51, and the inner surface of the fixed plate 51 is rotatably connected to a driven plate 52. When the elastic rod 53 is pushed downward, the driven plate 52 of the placement table is driven to rotate downward on the inner surface. The end of the driven plate 52 is fixedly connected to the pushing elastic rod 53. When the passive frame 39 moves downward, the pushing elastic rod 53 is driven downward. The end of the driven plate 52 away from the pushing elastic rod 53 is fixedly connected to a cleaning rod 54. The surface of the fixed plate 51 is fixedly connected to a cross bar 58, which effectively cleans the dust on the surface of the diode, saves labor for the staff, and improves production efficiency.

[0045] One end of the elastic rod 53 is pushed away from the driven plate 52 and is fixedly connected to the surface of the passive frame 39. When one end of the driven plate 52 moves downward, the other end of the driven plate 52 is lifted upward. A movable groove is provided on the surface of the cross bar 58. The passive telescopic plate 55 is slidably connected to the inner wall of the movable groove. One end of the cleaning rod 54 is away from the driven plate 52 and is fixedly connected to the surface of the passive telescopic plate 55. When the other end of the driven plate 52 is lifted upward, the cleaning rod 54 is driven to move in a direction away from each other.

[0046] When in use, first place the diode on the surface of the placement table 5, then start the motor 6 to drive the threaded rod 11 to rotate, when the threaded rod 11 rotates, the threaded ring 12 moves upward, and when the threaded ring 12 moves upward, it drives the rising frame 13 to move upward, and the rising frame 13 drives the right-angle plate 14 to move upward, and when the right-angle plate 14 moves upward, it pushes the sliding frame 15 to slide on the inner wall of the sliding groove in the direction of approaching each other, and when the sliding frame 15 moves, it pushes the pushing rod 16 to move in the direction of approaching each other, and when the pushing rod 16 moves, it pushes the limit extension rod 17 to extend in the direction of approaching each other, and when the limit extension rod 17 extends, it pushes the limit plate 18 in the direction of approaching each other. The limit plate 18 pushes the telescopic rod 19 to move in the direction of approaching each other, and the telescopic rod 19 pushes the contact plate 20 to move in the direction of approaching each other. When the limit plate 18 moves, it drives the elastic frame 21 to move in the direction of approaching each other and squeezes it. When the elastic frame 21 is squeezed, the middle part bends in the direction of approaching each other. When the elastic frame 21 bends, it drives the slider frame 33 to slide on the inner wall of the slide plate 31 in the direction of approaching each other. When the slider frame 33 moves, it pushes the lower push rod 34 to move downward, the lower push rod 34 pushes the lower push block 35 to move downward, and the lower push block 35 pushes the lower push plate 36 to move downward. When the lower push plate 36 moves downward, it pushes the passive The plate 38 moves downward, and the passive plate 38 drives the passive frame 39 to move downward. When the passive plate 38 moves downward, it pushes the slide bar 41 to move downward, and the slide bar 41 drives the force block 42 to move downward. When the force block 42 moves downward, it contacts with the extrusion plate 37 and is squeezed. When the force block 42 is squeezed, it pushes the slide bar 41 to move toward each other on the surface of the slide rail 40. When the slide bar 41 moves, it drives the contraction plate 43 to move and contract. When the passive plate 38 moves downward, it drives the etching rod 44 to move downward. The etching rod 44 drives the cooling telescopic tube 4 to move downward. When the etching rod 44 reaches a certain position and etches, when the passive frame 39 When it moves downward, it drives the elastic rod 53 to move downward. When the elastic rod 53 moves downward, it drives the placement table driven plate 52 to rotate downward on the inner surface. When one end of the driven plate 52 moves downward, the other end of the driven plate 52 is lifted upward. When the other end of the driven plate 52 is lifted upward, it drives the cleaning rod 54 to move away from each other. When the cleaning rod 54 moves, it pulls the passive telescopic plate 55 to extend downward and slides on the inner wall of the moving groove in the direction away from each other. When the passive telescopic plate 55 extends downward, it pushes the buffer elastic rod 56 to move downward. When the buffer elastic rod 56 moves, it pushes the cleaning plate 57 to move downward and contact the surface of the diode.

[0047] The preferred embodiments of the present invention disclosed above are only used to help illustrate the present invention. The preferred embodiments do not describe all the details in detail, nor do they limit the invention to the specific implementation methods described. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the present invention, so that those skilled in the art can understand and use the present invention well. The present invention is limited only by the claims and their full scope and equivalents.

Claims

1. An etching device for diode production and processing, comprising a workbench (1), a right-angle frame (2) is fixedly connected to the surface of the workbench (1), a cooling pump (3) is fixedly connected to the top of the right-angle frame (2), a cooling telescopic pipe (4) is fixedly connected to the surface of the cooling pump (3), a placing table (5) is fixedly connected to the surface of the workbench (1), and a motor (6) is fixedly connected to the bottom of the workbench (1), characterized in that: Also includes; A limiting mechanism (10), the limiting mechanism (10) comprising a limiting plate (18), a surface of the limiting plate (18) being fixedly connected to a telescopic rod (19), and an end of the telescopic rod (19) away from the limiting plate (18) being fixedly connected to a contact plate (20); An etching mechanism (30), the etching mechanism (30) comprising a passive disk (38), a passive frame (39) being fixedly connected to the surface of the passive disk (38), and a slide rail (40) being fixedly connected to the bottom of the passive disk (38); A cleaning mechanism (50) comprises a passive telescopic plate (55), the bottom of the passive telescopic plate (55) is fixedly connected to a buffer elastic rod (56), and one end of the buffer elastic rod (56) away from the passive telescopic plate (55) is fixedly connected to a cleaning plate (57).

2. The etching device for diode production and processing according to claim 1, characterized in that: The number of the right-angle frames (2) is four, and the four right-angle frames (2) are symmetrically arranged with the placement table (5) as the center. The inner surface of the right-angle frame (2) is provided with a sliding groove. The number of the cooling telescopic pipes (4) is two, and the two cooling telescopic pipes (4) are symmetrically arranged with the cooling pump (3) as the center.

3. The etching device for diode production and processing according to claim 2, characterized in that: The limiting mechanism (10) comprises a threaded rod (11), the surface of the threaded rod (11) is threadedly connected to a threaded ring (12), the surface of the threaded ring (12) is fixedly connected to a rising frame (13), one end of the rising frame (13) away from the threaded ring (12) is fixedly connected to a right angle plate (14), one end of the right angle plate (14) away from the rising frame (13) is fixedly connected to a sliding frame (15), the surface of the sliding frame (15) is rotatably connected to a pushing rod (16), one end of the pushing rod (16) away from the sliding frame (15) is fixedly connected to a limiting extension rod (17), and the top of the limiting plate (18) is fixedly connected to an elastic frame (21).

4. The etching device for diode production and processing according to claim 3, characterized in that: The end of the threaded rod (11) is fixedly connected to the output end of the motor (6); the end of the threaded rod (11) away from the motor (6) is rotatably connected to the bottom of the workbench (1); the rising frame (13) completely penetrates the surface of the workbench (1) and is fixedly connected to the bottom of the right-angle plate (14); the surface of the sliding frame (15) is slidably connected to the inner wall of the sliding groove; the end of the limiting extension rod (17) away from the limiting plate (18) is fixedly connected to the inner wall of the sliding groove; and the bottom of the contact plate (20) contacts the surface of the placement table (5).

5. The etching device for diode production and processing according to claim 4, characterized in that: The etching mechanism (30) comprises a slide plate (31), the bottom of the slide plate (31) is fixedly connected with a slide rod (32), the inner wall of the slide plate (31) is slidably connected with a slider frame (33), the bottom of the slider frame (33) is rotatably connected with a lower push rod (34), the end of the lower push rod (34) away from the slider frame (33) is rotatably connected with a lower push block (35), the bottom of the lower push block (35) is fixedly connected with a lower push plate (36), the surface of the slide rod (32) is fixedly connected with an extrusion plate (37), the surface of the slide rail (40) is slidably connected with a slide rod (41), the surface of the slide rod (41) is fixedly connected with a force block (42), the two sides of the slide rod (41) are fixedly connected with contraction plates (43), and the bottom of the passive disk (38) is fixedly connected with an etching rod (44).

6. The etching device for diode production and processing according to claim 5, characterized in that: The inner surface of the right-angle frame (2) is fixedly connected to the top of the slide plate (31), the top of the elastic frame (21) is fixedly connected to the bottom of the slider frame (33), the end of the push-down plate (36) away from the push-down block (35) is fixedly connected to the surface of the passive disk (38), the end of the extrusion plate (37) away from the slide rod (32) is in contact with the surface of the force block (42), and the end of the cooling telescopic tube (4) away from the cooling pump (3) is fixedly connected to the surface of the etching rod (44).

7. The etching device for diode production and processing according to claim 6, characterized in that: The cleaning mechanism (50) comprises a fixed plate (51), the inner surface of the fixed plate (51) is rotatably connected to a driven plate (52), the end of the driven plate (52) is fixedly connected to a pushing elastic rod (53), one end of the driven plate (52) away from the pushing elastic rod (53) is fixedly connected to a cleaning rod (54), and the surface of the fixed plate (51) is fixedly connected to a cross bar (58).

8. The etching device for diode production and processing according to claim 7, characterized in that: One end of the pushing elastic rod (53) away from the driven plate (52) is fixedly connected to the surface of the passive frame (39), a movable groove is provided on the surface of the cross bar (58), the passive telescopic plate (55) is slidably connected to the inner wall of the movable groove, and one end of the cleaning rod (54) away from the driven plate (52) is fixedly connected to the surface of the passive telescopic plate (55).