Wafer cutting path detection device

Abstract

The invention discloses a wafer cutting path detection device, comprising a cutting detection platform and a material bin arranged on the cutting detection platform; the cutting detection platform is provided with a conveying track; a material discharge notch is provided on one side of the material bin; a material blocking structure is provided on the other side of the material bin; the cutting detection platform is also provided with two tangent turntables that are rotatable; part of the turntable is located at the position of the material discharge notch; an arc boss is provided on the upper surface of the turntable; the arc boss can enable the material blocking structure to release the obstruction of the material discharge notch; a friction strip is embedded in the outer wall of one of the arc bosses; the cutting detection platform is also provided with a driving mechanism; the driving mechanism comprises a first slider that can slide back and forth; the first slider can drive the material discharge control mechanism to discharge the wafer; the cutting detection platform is relatively provided with clamping and centering mechanisms on both sides of the conveying track; automatic feeding of the wafer is realized, the structure is more reliable, the efficiency of cutting detection is improved, and the cost of using the structure is lower.

Description

Technical Field

[0001] The present invention relates to the field of wafer technology, and in particular to a wafer cutting path detection device. Background Art

[0002] In the semiconductor manufacturing process, wafer cutting line detection is an important part of ensuring product quality. With the continuous advancement of integrated circuit technology, the size and complexity of wafers have gradually increased, which has put forward higher requirements for the accuracy and consistency of cutting lines.

[0003] Currently, a robot is usually used to vacuum grasp and transfer wafers. During the grasping process, the vacuum suction cup will damage the surface of the wafer, affecting the cutting and inspection of the wafer cutting path. The grasping relies on airtightness, which also leads to unreliable grasping, and the reliability of the structure still needs to be improved. In addition, during the cutting and inspection process, the direction of the wafer needs to be adjusted. The existing robot obviously cannot meet this requirement, and an additional rotating device needs to be added for adjustment, resulting in a higher structural cost. Summary of the invention

[0004] The purpose of the present invention is to overcome the above-mentioned shortcomings and provide a wafer cutting path detection device to realize automatic feeding of wafers. The structure is more reliable to use. At the same time, the friction strip on the arc boss can effectively adjust the direction of the wafer under the drive of the driving mechanism, thereby improving the efficiency of cutting detection and lowering the cost of using the structure.

[0005] To achieve the above object, the specific scheme of the present invention is as follows:

[0006] A wafer cutting lane detection device comprises a cutting detection platform and a material bin arranged on the cutting detection platform; the cutting detection platform is provided with a conveying track; a material discharge notch is provided on one side of the material bin; a material blocking structure for blocking the material discharge notch is provided on the material discharge notch; a material discharge control mechanism is provided on the other side of the material bin on the cutting detection platform; the cutting detection platform is also provided with two tangent turntables which are rotatable; a part of the turntable is located at the position of the material discharge notch; an arc boss is provided on the upper surface of the turntable; the arc boss can enable the material blocking structure to release the blocking of the material discharge notch; a friction strip is embedded in the outer side wall of at least one arc boss;

[0007] The cutting inspection table is also provided with a driving mechanism for driving the two turntables to rotate synchronously and in opposite directions; the driving mechanism includes a first slider capable of reciprocating sliding; the first slider can drive the unloading control mechanism to unload the wafer;

[0008] The cutting and testing table is provided with clamping and centering mechanisms on both sides of the conveying track.

[0009] Optionally, the driving mechanism further comprises a motor, a gear rotatably arranged on the cutting detection table, and a gear ring sleeved on the shaft journal of one of the rotating disks;

[0010] The gear ring is meshed with the gear; the first slider is slidably arranged on the cutting detection table; the first slider is hinged with two connecting rods; the journals of the two rotating disks are both convexly provided with eccentric shafts, and the eccentric shafts are hinged with the connecting rods.

[0011] Optionally, the material unloading control mechanism includes a second slider slidably arranged on the cutting detection table, a mandrel movably arranged on the cutting detection table, a cross block rotatably sleeved on the outer wall of the mandrel, and a third slider slidably arranged on the side wall of the silo and located above the cross block;

[0012] The second slider is extended with a push rod for contacting the first slider; a first spring is provided between the push rod and the cutting detection table; a second spring is provided between the third slider and the silo; the two ends of the push rod are wedge-fitted with the second slider and the third slider respectively; the cross block part passes through the side wall of the silo; the inner wall of the cross block is provided with a driving groove; the outer wall of the push rod is elastically provided with a pin key; the pin key is movably embedded in the driving groove; the inner side wall of the third slider is provided with a pin in the silo.

[0013] Optionally, the driving groove includes a plurality of vertical grooves and a plurality of spiral grooves; the plurality of vertical grooves and the plurality of spiral grooves are connected end to end alternately in the circumferential direction; blocking steps are provided at both ends of the vertical grooves and between adjacent spiral grooves.

[0014] Optionally, the cutting detection table is provided with a guide groove; the second sliding block is also convexly provided with a slide; and the slide is slidably connected in the guide groove.

[0015] Optionally, a guide hole is provided on the side wall of the silo; a sliding pin is protruded from the third sliding block; and the sliding pin is movably embedded in the guide hole.

[0016] Optionally, the second slider is provided with a first sliding hole, and a first inclined surface is provided in the first sliding hole; the third slider is provided with a second sliding hole; the second sliding hole is provided with a second inclined surface; the inclination direction of the first inclined surface is the same as the inclination direction of the second inclined surface; both ends of the push rod are round head structures.

[0017] Optionally, the material blocking structure includes a third sliding hole arranged at the discharge notch position of the silo, a return spring arranged in the third sliding hole, and an arc baffle slidably arranged in the third sliding hole; the arc baffle is connected to the return spring so that the arc baffle remains in a state of blocking the discharge notch; avoidance openings are provided at both ends of the outer wall of the arc baffle, and a third inclined surface is provided in the avoidance opening.

[0018] Optionally, it also includes a cutting detection head, a first displacement mechanism for driving the cutting detection head to move forward and backward, a second displacement mechanism for driving the cutting detection head to move left and right, and a third displacement mechanism for driving the cutting detection head to move up and down; the first displacement mechanism is arranged on the cutting detection table; the second displacement mechanism is arranged on the output end of the first displacement mechanism; the third displacement mechanism is arranged on the output end of the second displacement mechanism; and the cutting detection head is arranged on the output end of the third displacement mechanism.

[0019] Optionally, the cutting detection table is provided with conveying rollers in the conveying track and between the two clamping and centering mechanisms.

[0020] The beneficial effects of the present invention are as follows: the present invention arranges two tangent turntables, and arranges an arc boss on the turntable, and arranges a friction strip on the arc boss, so that under the drive of the driving mechanism, the unloading control mechanism cooperates with the turntable to realize automatic feeding of the wafer, and the structure is more reliable to use. At the same time, the friction strip on the arc boss can effectively adjust the direction of the wafer under the drive of the driving mechanism, thereby improving the efficiency of cutting detection, and the cost of using the structure is lower. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the structure of the present invention;

[0022] Figure 2 It is a cross-sectional schematic diagram of the present invention;

[0023] Figure 3 yes Figure 2 The enlarged schematic diagram of point A in the middle;

[0024] Figure 4 It is a schematic diagram of the structure of the driving mechanism, rotating disk, silo and material unloading control mechanism of the present invention;

[0025] Figure 5 It is a schematic diagram of the structure of the driving mechanism, the rotating disk, the material bin and the material blocking mechanism of the present invention;

[0026] Figure 6 It is a structural schematic diagram of the material unloading control mechanism of the present invention;

[0027] Figure 7 It is a cross-sectional schematic diagram of the material feeding control mechanism of the present invention;

[0028] Figure 8 It is a cross-sectional schematic diagram of the cross clamp block of the present invention;

[0029] Fig. 9 It is a structural schematic diagram of the material blocking structure of the present invention installed on the silo;

[0030] Fig.10 It is a structural schematic diagram of the clamping and centering mechanism of the present invention;

[0031] Fig.11 It is a schematic structural diagram of the cutting detection head of the present invention;

[0032] Explanation of reference numerals: 1, cutting and testing table; 11, conveying track; 12, guide groove; 13, conveying roller; 2, material bin; 21, discharge notch; 221, return spring; 222, arc baffle; 223, third inclined plane; 23, guide hole; 31, second slide block; 311, push rod; 312, slide table; 313, first inclined plane; 32, push rod; 321, pin key; 33, cross block; 331, vertical groove; 332, spiral groove; 34, third slide Block; 341, latch; 342, sliding pin; 343, second inclined surface; 35, first spring; 36, second spring; 4, turntable; 41, arc boss; 42, friction strip; 43, eccentric shaft; 51, motor; 52, gear; 53, gear ring; 54, first slider; 55, connecting rod; 61, centering seat; 62, clamping slider; 63, clamping spring; 7, cutting detection head; 8, first displacement mechanism; 9, second displacement mechanism; 10, third displacement mechanism. DETAILED DESCRIPTION

[0033] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments, but the implementation scope of the present invention is not limited thereto.

[0034] like Figures 1 to 11 As shown, a wafer cutting path detection device described in this embodiment includes a cutting detection table 1 and a silo 2 fixedly installed on the cutting detection table 1; the silo 2 is roughly annular; the wafer is placed on a carrier, and the carrier is disc-shaped; a support column is provided on the top surface of the carrier; each carrier carrying a wafer is stacked in the silo 2 in sequence; the cutting detection table 1 is provided with a conveying track 11; a discharge notch 21 is opened on one side of the silo 2; the discharge notch 21 is provided with a blocking structure for blocking the discharge notch 21; the cutting detection table 1 is provided with a material A material unloading control mechanism is provided on the other side of the bin 2; the cutting inspection table 1 is also rotatably provided with two tangent turntables 4; a portion of the turntable 4 is located at the position of the material discharge notch 21; a circular arc boss 41 is convexly provided on the upper surface of the turntable 4; the circular arc boss 41 can enable the blocking structure to release the blocking of the material discharge notch 21; a friction strip 42 is embedded in the outer wall of at least one circular arc boss 41; the friction strip 42 can be provided on only one circular arc boss 41, or on two circular arc bosses 41, which can be freely set according to design requirements;

[0035] The cutting inspection table 1 is also provided with a driving mechanism for driving the two turntables 4 to rotate synchronously in opposite directions; the driving mechanism includes a first slider 54 that can slide back and forth; the first slider 54 can drive the unloading control mechanism to unload the wafer; the cutting inspection table 1 is provided with clamping and centering mechanisms on both sides of the conveying track 11.

[0036] Specifically, when the wafer cutting path detection device of this embodiment is actually used, the driving mechanism drives the two turntables 4 to rotate synchronously in the opposite directions, and at the same time the first slider 54 slides back and forth, and the first slider 54 reciprocates once, and the turntable 4 rotates twice. Within one reciprocating cycle of the first slider 54, that is, when the turntable 4 rotates for the first time, the arc boss 41 on the turntable 4 enables the blocking structure to release the blocking of the discharge notch 21. At this time, the arc boss 41 enters the material bin 2, and the carrier at the bottom is supported on the arc boss 41. With the rotation of the turntable 4, the arc boss 41 gradually moves out of the material bin 2 until the arc boss 41 completely moves out of the discharge notch, and the blocking structure resumes the blocking of the discharge notch 21. At this time, the carrier at the bottom is supported by the two turntables 4 and is in the waiting discharge position. The carrier at the bottom is blocked by the blocking structure and cannot move out of the discharge notch 21;

[0037] As the turntable 4 continues to rotate, that is, when the turntable 4 rotates for the second circle, the arc boss 41 again releases the blocking structure from the discharge notch 21. Since there is a carrier on the turntable 4, the arc boss 41 applies a thrust to the carrier at the bottom, so that the carrier at the bottom moves out of the bin 2 through the discharge notch 21. After moving out of the bin 2, the carrier is guided by the conveying track 11 and enters between the two clamping and centering mechanisms. At this time, the two clamping and centering mechanisms clamp and self-center the carrier. At this time, the wafer on the carrier is in the test position to cut and detect the wafer, so that the center point of the wafer falls into the center of the detection point to ensure the accuracy of cutting and detection; when the turntable 4 is tangent to the carrier outside the bin 2, the rotation of the turntable 4 is controlled by the driving mechanism, and the friction strip 42 on the arc boss 41 is in friction contact with the carrier, thereby driving the carrier to drive the wafer to rotate, thereby effectively adjusting the direction of the wafer, so that the position of the wafer can be adjusted for cutting and cutting path detection, thereby improving the cutting detection efficiency.

[0038] In one reciprocating cycle of the first slider 54, the first slider 54 drives the unloading control mechanism to control the unloading of the wafers stacked in the silo 2 in sequence, that is, each time a carrier is pushed out, the carrier in the silo 2 will move down one carrier position under the action of the unloading control mechanism, thereby realizing automatic feeding of wafers without vacuum adsorption and grasping, thereby improving detection efficiency;

[0039] After the wafer at the test position completes the cutting inspection, the arc boss 41 pushes the next carrier out of the hopper 2. During the moving process, the next carrier pushes the carrier at the test position to gradually disengage from the two clamping and centering mechanisms until the next carrier enters the test position, and the carrier that completes the cutting inspection automatically moves out of the test position.

[0040] like Figure 4As shown, a wafer cutting path detection device described in this embodiment, in some embodiments, the driving mechanism also includes a motor 51, a gear 52 rotatably arranged on the cutting detection table 1, and a ring gear 53 mounted on the shaft neck of one of the turntables 4; the ring gear 53 is meshed with the gear 52; a first slider 54 is slidably arranged on the cutting detection table 1; the first slider 54 is hinged with two connecting rods 55; the shaft necks of the two turntables 4 are both protruding with an eccentric shaft 43, and the eccentric shaft 43 is hinged with the connecting rod 55.

[0041] Specifically, in this embodiment, the motor 51 drives the gear 52 to rotate, the gear 52 drives the ring gear 53 to rotate, the ring gear 53 drives one of the turntables 4 to rotate, one of the turntables 4 drives the first slider 54 to slide through the connecting rod 55, and the first slider 54 drives the other turntable 4 to rotate in the opposite direction synchronously through the connecting rod 55, thereby realizing automatic feeding of wafers.

[0042] When the wafer is in the testing position, the rotation of the motor 51 is adjusted to adjust the wafer position, so as to change the cutting angle and direction, as well as the detection position, thereby improving the cutting detection efficiency.

[0043] like Figures 2 to 4 , Figures 6 to 8 As shown, a wafer cutting path detection device described in this embodiment, in some embodiments, the unloading control mechanism includes a second slider 31 slidably arranged on the cutting detection platform 1, a push rod 32 movably penetrated through the cutting detection platform 1, a cross block 33 rotatably sleeved on the outer wall of the push rod 32, and a third slider 34 slidably arranged on the side wall of the silo 2 and located above the cross block 33; the second slider 31 extends with a push rod 311 for contacting the first slider 54; a first spring 35 is provided between the push rod 32 and the cutting detection platform 1; a second spring 36 is provided between the third slider 34 and the silo 2; the two ends of the push rod 32 are wedge-matched with the second slider 31 and the third slider 34 respectively; the cross block 33 partially penetrates the side wall of the silo 2; the inner wall of the cross block 33 is provided with a driving groove; the outer wall of the push rod 32 is elastically provided with a pin key 321; the pin key 321 is movably embedded in the driving groove; the inner side wall of the third slider 34 is provided with a latch pin 341 in the silo 2.

[0044] Specifically, a third spring is connected between the pin key 321 and the push rod 32, so that the pin key 321 maintains the cooperation with the driving groove through the third spring; in a reciprocating cycle of the first slider 54, the first slider 54 slides toward the second slider 31 and contacts the push rod 311, the first slider 54 pushes the second slider 31 to slide through the push rod 311, the second slider 31 pushes the push rod 32 to slide upward, the first spring 35 is compressed, and the push rod 32 synchronously pushes the third slider 34 to slide, so that the latch 341 on the third slider 34 is retracted from the silo 2, the second spring 36 is compressed, and the latch 341 releases the restriction on the carrier in the silo 2. At this time, the carrier is supported on the cross block 33; When the block 54 slides away from the second slider 31, the first spring 35 and the second spring 36 are reset, the push rod 32 moves downward, the push rod 32 pushes the second slider 31 to reset, and the second spring 36 pushes the third slider 34 to reset, so that the pin 341 of the third slider 34 is inserted into the silo 2 again, thereby restricting the carrier in the silo 2, and at the same time, the pin key 321 cooperates with the driving groove to make the cross block 33 rotate ninety degrees, thereby gradually releasing the restriction on the carrier, so that the carrier falls into the position to be discharged; in this way, in each reciprocating cycle of the first slider 54, a wafer will be pushed out of the silo 2 and enter the test position, and at the same time, the next wafer will fall into the position to be discharged; in this way, automatic feeding of wafers is realized.

[0045] like Figure 8 As shown, in some embodiments of the wafer cutting path detection device described in this embodiment, the driving groove includes a plurality of vertical grooves 331 and a plurality of spiral grooves 332; the plurality of vertical grooves 331 and the plurality of spiral grooves 332 are alternately connected end to end along the circumferential direction; blocking steps are provided between the two ends of the vertical groove 331 and the adjacent spiral grooves 332. Specifically, when the top rod 32 moves upward, the pin key 321 moves along the vertical groove 331, and when the top rod 32 moves downward, the pin key 321 moves along the spiral groove 332, so that the cross block 33 rotates to allow the wafer to fall into the position to be discharged.

[0046] like Figure 3 As shown, in the wafer cutting lane detection device described in this embodiment, in some embodiments, the cutting detection platform 1 is provided with a guide groove 12; the second slider 31 is also provided with a slide 312; the slide 312 is slidably connected in the guide groove 12. In this embodiment, the guide groove 12 and the slide 312 are provided to cooperate, thereby providing guidance and limiting for the second slider 31, so that the movement of the second slider 31 is more stable.

[0047] like Figure 4As shown, in the wafer cutting lane detection device described in this embodiment, in some embodiments, the side wall of the silo 2 is provided with a guide hole 23; the third slider 34 is provided with a slide pin 342; the slide pin 342 is movably embedded in the guide hole 23. In this embodiment, the guide hole 23 and the slide pin 342 are provided to cooperate, so that the third slider 34 is more stable when moving.

[0048] like Figure 3 and Figure 7 As shown, in some embodiments of a wafer cutting lane detection device described in this embodiment, the second slider 31 is provided with a first sliding hole, and a first inclined surface 313 is provided in the first sliding hole; the third slider 34 is provided with a second sliding hole; the second sliding hole is provided with a second inclined surface 343; the inclination direction of the first inclined surface 313 is the same as the inclination direction of the second inclined surface 343; both ends of the push rod 32 are round head structures. In this embodiment, the first sliding hole and the second sliding hole are provided so that the push rod 32 cooperates with the second slider 31 and the third slider 34 respectively, and the round head structure of the push rod 32 is used to contact and cooperate with the first inclined surface 313 and the second inclined surface 343, so that the second slider 31, the push rod 32 and the third slider 34 can be mutually linked and cooperated to realize automatic feeding of wafers.

[0049] like Figure 5 and Fig. 9 As shown, a wafer cutting path detection device described in this embodiment, in some embodiments, the material blocking structure includes a third sliding hole arranged at the position of the discharge notch 21 of the silo 2, a return spring 221 arranged in the third sliding hole, and an arc baffle 222 slidably arranged in the third sliding hole; the arc baffle 222 is connected to the return spring 221 so that the arc baffle 222 remains in a state of blocking the discharge notch 21; both ends of the outer side wall of the arc baffle 222 are provided with avoidance openings, and a third inclined surface 223 is provided in the avoidance opening.

[0050] Specifically, in this embodiment, the third sliding hole is provided to facilitate the installation of the arc baffle 222 and the return spring 221; the return spring 221 makes the arc baffle 222 extend to the discharge notch 21 at the initial stage, so that the discharge notch 21 is in a blocked state, and when the turntable 4 drives the arc boss 41 to rotate until the arc boss 41 contacts the third inclined surface 223, as the turntable 4 continues to rotate, the arc boss 41 squeezes the arc baffle 222 inward through the third inclined surface 223, and the return spring 221 is compressed, thereby opening the discharge notch 21, so that when the arc boss 41 contacts the carrier, it can push the carrier to move out of the bin 2 to the test position through the discharge notch 21;

[0051] After the arc boss 41 is out of contact with the arc baffle 222 , the return spring 221 pushes the arc baffle 222 to return to its original position, thereby closing the discharge notch 21 again.

[0052] like Figure 1 , Figure 2 and Fig.10 As shown, in some embodiments of a wafer cutting lane detection device described in this embodiment, the clamping and centering mechanism includes a centering seat 61 fixedly mounted on the cutting detection table 1, a clamping slider 62 slidably mounted on the centering seat 61, and a clamping spring 63 connected between the centering seat 61 and the clamping slider 62; the clamping slider 62 is in an arc shape. Specifically, when the arc boss 41 on the two turntables 4 pushes the carrier to enter between the two clamping sliders 62, the carrier squeezes the two clamping sliders 62, so that the clamping spring 63 is compressed until the two turntables 4 are tangent to the carrier, and at this time, the two clamping sliders 62 clamp and center the carrier under the action of the clamping springs 63.

[0053] like Figure 1 , Figure 2 and Fig.11 As shown, a wafer cutting path detection device described in this embodiment, in some embodiments, also includes a cutting detection head 7, a first displacement mechanism 8 for driving the cutting detection head 7 to move forward and backward, a second displacement mechanism 9 for driving the cutting detection head 7 to move left and right, and a third displacement mechanism 10 for driving the cutting detection head 7 to move up and down; the first displacement mechanism 8 is arranged on the cutting detection table 1; the second displacement mechanism 9 is arranged on the output end of the first displacement mechanism 8; the third displacement mechanism 10 is arranged on the output end of the second displacement mechanism 9; the cutting detection head 7 is arranged on the output end of the third displacement mechanism 10.

[0054] Specifically, the cutting detection head 7 includes a cutting blade group and a detection camera device. After the carrier drives the wafer to enter the test position, the first displacement mechanism 8, the second displacement mechanism 9 and the third displacement mechanism 10 cooperate to drive the cutting detection head 7 to move and adjust the position of the cutting detection head 7 to perform cutting path detection on the wafer in the test position.

[0055] like Figure 2 As shown, in the wafer cutting lane detection device described in this embodiment, in some embodiments, the cutting detection table 1 is provided with a conveying roller 13 in the conveying track 11 and between the two clamping and centering mechanisms. Specifically, there are multiple conveying rollers 13, and the multiple conveying rollers 13 are arranged side by side along the length direction of the conveying track 11; in this way, by arranging the conveying rollers 13, the carrier is conveyed to between the two clamping sliders 62, and the wafer is conveniently moved out of between the two clamping sliders 62 after the cutting detection is completed.

[0056] The above is only a preferred embodiment of the present invention. Therefore, any equivalent changes or modifications made according to the structure, characteristics and principles described in the scope of the patent application of the present invention are included in the protection scope of the patent application of the present invention.

Claims

1. A wafer cutting line detection device, characterized in that: The invention comprises a cutting inspection table and a silo arranged on the cutting inspection table; each carrier carrying wafers is stacked in the silo in sequence; the cutting inspection table is provided with a conveying track; a discharge notch is provided on one side of the silo; a material blocking structure for blocking the discharge notch is provided on the discharge notch; a material unloading control mechanism is provided on the other side of the silo; the cutting inspection table is also provided with two tangent turntables; a part of the turntable is located at the discharge notch; an arc boss is provided on the upper surface of the turntable; the arc boss can enable the material blocking structure to release the blocking of the discharge notch, at which time the arc boss enters the silo, and the carrier located at the bottom is supported on the arc boss; at least one outer wall of the arc boss is embedded with a friction strip; The cutting inspection table is also provided with a driving mechanism for driving the two turntables to rotate synchronously and in opposite directions; the driving mechanism includes a first slider capable of reciprocating sliding; the first slider can drive the unloading control mechanism to unload the wafer; The cutting inspection table is provided with clamping and centering mechanisms on both sides of the conveying track. When the turntable is tangent to the carrier moved out of the silo, the rotation of the turntable is controlled, and the friction strip on the arc boss is in friction contact with the carrier, thereby driving the carrier to drive the wafer to rotate.

2. A wafer dicing lane detection device according to claim 1, characterized in that: The driving mechanism also includes a motor, a gear rotating on the cutting and detecting table, and a gear ring sleeved on the shaft neck of one of the rotating disks; The gear ring is meshed with the gear; the first slider is slidably arranged on the cutting detection table; the first slider is hinged with two connecting rods; the journals of the two rotating disks are both convexly provided with eccentric shafts, and the eccentric shafts are hinged with the connecting rods.

3. The wafer dicing lane detection device according to claim 1, characterized in that: The material unloading control mechanism includes a second slider slidably arranged on the cutting detection table, a top rod movably arranged on the cutting detection table, a cross block rotatably sleeved on the outer wall of the top rod, and a third slider slidably arranged on the side wall of the silo and located above the cross block; The second slider is extended with a push rod for contacting the first slider; a first spring is provided between the push rod and the cutting detection table; a second spring is provided between the third slider and the silo; the two ends of the push rod are wedge-fitted with the second slider and the third slider respectively; the cross block part passes through the side wall of the silo; the inner wall of the cross block is provided with a driving groove; the outer wall of the push rod is elastically provided with a pin key; the pin key is movably embedded in the driving groove; the inner side wall of the third slider is provided with a pin in the silo.

4. The wafer dicing lane detection device according to claim 3, characterized in that: The driving groove comprises a plurality of vertical grooves and a plurality of spiral grooves; the plurality of vertical grooves and the plurality of spiral grooves are connected end to end alternately in the circumferential direction; blocking steps are respectively arranged between the two ends of the vertical grooves and the adjacent spiral grooves.

5. The wafer dicing lane detection device according to claim 1, characterized in that: The cutting detection table is provided with a guide groove; the second sliding block is also convexly provided with a slide table; the slide table is slidably connected in the guide groove.

6. The wafer dicing lane detection device according to claim 1, characterized in that: A guide hole is arranged on the side wall of the silo; a sliding pin is convexly arranged on the third sliding block; and the sliding pin is movably embedded in the guide hole.

7. The wafer dicing lane detection device according to claim 1, characterized in that: The second slide block is provided with a first slide hole, and a first inclined surface is provided in the first slide hole; the third slide block is provided with a second slide hole; the second slide hole is provided with a second inclined surface; the inclination direction of the first inclined surface is the same as the inclination direction of the second inclined surface; both ends of the push rod are round head structures.

8. The wafer dicing lane detection device according to claim 1, characterized in that: The material blocking structure includes a third sliding hole arranged at the discharge notch position of the silo, a return spring arranged in the third sliding hole, and an arc baffle slidably arranged in the third sliding hole; the arc baffle is connected to the return spring so that the arc baffle remains in a state of blocking the discharge notch; avoidance openings are provided at both ends of the outer side wall of the arc baffle, and a third inclined surface is provided in the avoidance opening.

9. The wafer dicing lane detection device according to claim 1, characterized in that: It also includes a cutting detection head, a first displacement mechanism for driving the cutting detection head to move forward and backward, a second displacement mechanism for driving the cutting detection head to move left and right, and a third displacement mechanism for driving the cutting detection head to move up and down; the first displacement mechanism is arranged on the cutting detection table; the second displacement mechanism is arranged on the output end of the first displacement mechanism; the third displacement mechanism is arranged on the output end of the second displacement mechanism; and the cutting detection head is arranged on the output end of the third displacement mechanism.

10. The wafer dicing lane detection device according to claim 1, characterized in that: The cutting detection table is provided with a conveying roller in the conveying track and between two clamping and centering mechanisms.

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