Chip detecting and sorting equipment and method

Abstract

The invention relates to the field of semiconductor detection, and discloses a chip detecting and sorting device and method.A rack is provided with a feeding and discharging gripper module, a detecting module, a transferring module and a braiding module; the transfer module comprises a first conveying line, a second conveying line, a third conveying line and a tray transfer mechanism; the detection module comprises a first detection device and a second detection device, the first detection device is used for detecting the side surface and the bottom surface of the chip, and the second detection device is used for detecting the front surface of the chip; the taping module comprises a taping mechanism, and the taping mechanism is used for taping and packaging the chip; the feeding and discharging gripper module comprises a feeding mechanism and a discharging mechanism. The feeding mechanism is used for transferring chips between the first conveying line and the first detection device. The discharging mechanism is used for transferring chips among the second conveying line, the third conveying line and the braiding mechanism. The chips are transferred through the feeding mechanism and the discharging mechanism, damage to the chips when the chips are manually moved is avoided, and the chip sorting and detecting efficiency is higher.

Description

Technical Field

[0001] The present invention relates to the field of chip detection and sorting, and in particular to a chip detection and sorting device and method. Background Art

[0002] At the end of the chip production process, the packaged chips need to be optically inspected and sorted according to the inspection results, with the good and defective chips being placed in different trays.

[0003] The current detection methods mainly rely on manual and electron microscope detection, visual camera detection, etc. The working efficiency of single-function equipment is low, and different detection items may require multiple inspections by different personnel or different equipment, which makes it difficult to ensure the production efficiency and detection quality of the product. In addition, for chip products, multiple stations, multiple equipments, multiple repeated inspections, sorting, transportation, and conveying processes are prone to damage and additional risks to the chips, resulting in a low final yield of chip products. Summary of the invention

[0004] The technical problem to be solved by the present invention is: how to improve the efficiency of chip detection and sorting. In order to solve the above technical problem, the present invention provides a chip detection and sorting device, including a frame, wherein the frame is provided with a loading and unloading gripper module, a detection module, a transfer module and a taping module; The transfer module comprises a first conveyor line, a second conveyor line, a third conveyor line and a tray transfer mechanism arranged side by side, wherein the first conveyor line, the second conveyor line and the third conveyor line are all extended along the Y direction, and the tray transfer mechanism is arranged along the X direction, and the tray transfer mechanism is used to transfer the chip tray between the first conveyor line, the second conveyor line and the third conveyor line; The detection module includes a first detection device and a second detection device, wherein the first detection device is used to detect the side and bottom surfaces of the chip, and the first detection device is arranged on a side of the first conveyor line away from the second conveyor line; the second detection device is used to detect the front surface of the chip, and the second detection device is arranged on a side of the first detection device along the Y direction, and the second detection device is arranged directly above the first conveyor line or the second conveyor line; The taping module comprises a taping mechanism, which is arranged on a side of the third conveying line away from the second conveying line, and is used for taping and packaging the chip; The loading and unloading gripper module includes a loading mechanism and a unloading mechanism. The loading mechanism is used to transfer chips between the first conveyor line and the first detection device; the unloading mechanism is used to transfer chips between the second conveyor line, the third conveyor line and the braiding mechanism.

[0005] Preferably, a loading station is provided at one end of the first conveyor line, and the first conveyor line is used to convey the chip tray to be tested to the tray transfer mechanism along the Y direction; a first unloading station is provided at one end of the second conveyor line away from the tray transfer mechanism; a second unloading station and the braiding mechanism are provided on the side of the third conveyor line away from the tray transfer mechanism.

[0006] Preferably, the loading and unloading gripper module includes a first gantry arranged along the X direction, the first gantry is provided with a first linear module, the first linear module is extended along the X direction, the loading mechanism includes a first module mover and a loading gripper, the unloading mechanism includes a second module mover and a unloading gripper, the first module mover and the second module mover respectively drive the loading gripper and the unloading gripper to reciprocate along the X direction on the first linear module.

[0007] Preferably, the first linear module is also slidably connected to a re-inspection mechanism, which includes a third module mover, a re-inspection camera and a re-inspection light source. The third module mover is slidably connected to the first linear module to drive the re-inspection camera and the re-inspection light source to reciprocate along the X direction, and the re-inspection camera and the re-inspection light source are coaxially arranged in the vertical direction.

[0008] Preferably, the first detection device includes a multi-camera structure and a 3D line scan structure; The multi-camera structure includes a first mounting frame fixed to a frame, and a first camera, a second camera, a third camera, and a multi-camera light source arranged in the first mounting frame, wherein the first camera and the multi-camera light source are arranged in a vertical direction, the first camera is used to photograph the bottom surface of the chip, the second camera and the third camera are arranged on both sides of the first camera along the X direction, and the second camera and the third camera respectively photograph the chip at a 45-degree upward angle; The 3D line scan structure includes a second mounting frame fixed to a frame, a slide extending along the Y direction is arranged in the second mounting frame, and a 3D line scan camera is arranged on the slide.

[0009] Preferably, the tray transfer mechanism comprises a second gantry arranged along the X direction, the second gantry is provided with a second linear module and a tray gripper, the second linear module is extended along the X direction, and the second linear module is used to drive the tray gripper to reciprocate along the X direction; The tray gripper includes a first mounting plate, a lifting motor and a tray clamp, the first mounting plate is slidably connected to the second linear module, the lifting motor is fixed to the first mounting plate, and the lifting motor is used to drive the tray clamp to reciprocate in the vertical direction.

[0010] Preferably, the second detection device comprises a third linear module and a front camera structure arranged on the second gantry, the third linear module is extended along the X direction, and the third linear module is arranged on a side of the second gantry away from the second linear module, and the third linear module is used to drive the front camera structure to reciprocate along the X direction; The front camera structure includes a second mounting plate, the second mounting plate is slidably connected to the third linear module, and the second mounting plate is provided with a coaxially mounted front camera lens and a front camera light source along the vertical direction.

[0011] Preferably, the taping mechanism includes a conveying track, a heat sealing component, a winding component and a taping detection component. The conveying track component is used to input a carrier tape full of good chips to the heat sealing component, the heat sealing component is used to heat-seal and package the cover tape and the carrier tape, the winding component is used to wind up the packaged good chips, and the taping detection component is used to detect the status of the chips to be taped and packaged.

[0012] The present invention also provides a chip detection and sorting method, comprising the following sorting steps: S1. Start the running program after the power-on self-test, and manually place the tray with the chips to be tested on the loading station of the first conveyor line, and place the empty tray on the first unloading station of the second conveyor line; S2, the first conveyor line conveys the pallet to be inspected to the first inspection station along the Y direction, and the second conveyor line conveys the empty pallet to the first sorting station along the Y direction; S3, the loading mechanism grabs the chip from the tray to be inspected and puts it into the first inspection device, the first inspection device inspects the bottom and side surfaces of the chip and transmits the inspection results to the unloading mechanism; after the chip inspection is completed, the loading mechanism transfers the chip back to the tray to be inspected; S4, the first conveyor line conveys the tray to be inspected to the second inspection station, the second inspection device inspects the front of the chip and transmits the inspection result to the unloading mechanism; then the tray transfer mechanism transfers the tray to be sorted after the inspection to the third conveyor line; S5, the third conveyor line conveys the tray to be sorted to the second sorting station, and the unloading mechanism sorts the defective chips in the tray to be sorted into the empty tray at the first sorting station according to the detection results in step S3 and step S4; S6, the second conveyor line conveys the tray carrying defective chips to the first unloading station; at the same time, the third conveyor line conveys the tray carrying good chips to the second unloading station or the unloading mechanism transfers the good chips in the tray to the carrier grid of the tape braiding mechanism; S7. When the good chips are transferred to the carrier grid of the taping mechanism, the taping mechanism packages the good chips.

[0013] Preferably, the second inspection station is arranged above the first conveyor line, the second conveyor line and the third conveyor line. In step S4: after the first conveyor line conveys the tray to be inspected to the bottom of the tray transfer mechanism, the tray gripper in the tray transfer mechanism grabs the tray to be inspected and transfers the tray to be inspected to the second inspection station of the third conveyor line, and the front camera structure in the second inspection device inspects the front side of the chip at the second inspection station and transmits the inspection result to the unloading mechanism.

[0014] Compared with the prior art, the chip detection and sorting device provided in the embodiment of the present invention has the following beneficial effects: In the present invention, a total of three conveyor lines are set up, the first conveyor line is used for loading, the first unloading station of the second conveyor line is used for unloading defective products, and the end of the third conveyor line is provided with a second unloading station and a taping module, the second unloading station and the taping module are respectively used for unloading and packaging of good chips, and the detection module is also respectively provided with a first detection device and a second detection device, the first detection device is used to detect the bottom and side surfaces of the chip, and the second detection device can detect the front of the chip, and the chip can be transferred to the first detection device for detection through the loading mechanism, thereby reducing the problem of chip damage caused by manual chip movement, and can also grab multiple chips for detection at the same time, thereby improving the chip detection efficiency; and the unloading mechanism can quickly sort the chips according to the detection results of the detection module, thereby eliminating the inefficiency of manual sorting and the possible chip damage, making the chip sorting efficiency higher, reducing manual participation in the entire chip detection and sorting process, and having higher efficiency and lower chip damage rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 is a top view of the present invention; Figure 2 is a stereoscopic view of the present invention; Figure 3 It is a structural schematic diagram of the loading and unloading gripper module of the present invention; Figure 4 is a schematic structural diagram of a multi-camera structure of the present invention; Figure 5 is a structural schematic diagram of the 3D line scanning structure of the present invention; Figure 6 is a schematic structural diagram of a second detection device of the present invention; Figure 7 It is a schematic diagram of the process of the present invention.

[0016] In the figure: 1. Frame; 2. Loading and unloading gripper module; 21. Loading mechanism; 211. First module mover; 212. Loading gripper; 22. Unloading mechanism; 221. Second module mover; 222. Unloading gripper; 23. First gantry; 231. First linear module; 24. Re-inspection mechanism; 241. Third module mover; 242. Re-inspection camera; 243. Re-inspection light source; 3. Detection module; 31. First detection device; 311. Multi-camera structure; 3111. First mounting frame; 3112. First camera; 3113. Second camera; 3114. Third camera; 3115. Multi-camera light source; 312. 3D line scan structure; 3121. Second mounting frame; 3122. Slide; 3123. 3D line scan camera; 32. Second detection device; 321. Third linear module; 322. Front camera structure; 3221. Second mounting plate; 3222. Front camera lens; 3223. Front camera light source; 4. Transfer module; 41. First conveyor line; 411. Loading station; 42. Second conveyor line; 421. First unloading station; 43. Third conveyor line; 431. Second unloading station; 44. Tray transfer mechanism; 441. Second gantry; 442. Second linear module; 443. Tray gripper; 4431. First mounting plate; 4432. Tray clamp; 5. Taping module; 51. Taping mechanism; 511. Conveying track; 512. Heat sealing component; 513. Winding component; 514. Taping detection component. DETAILED DESCRIPTION

[0017] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0018] like Figure 1 and Figure 2 As shown, a preferred embodiment of the present invention provides a chip detection and sorting device, which has a Y direction and an X direction that intersect vertically, and includes a frame 1, and the frame 1 is provided with a loading and unloading gripper module 2, a detection module 3, a transfer module 4 and a tape module 5; The transfer module 4 includes a first conveyor line 41, a second conveyor line 42, a third conveyor line 43 and a tray transfer mechanism 44 arranged side by side. The first conveyor line 41, the second conveyor line 42 and the third conveyor line 43 are all extended along the Y direction, and the tray transfer mechanism 44 is arranged along the X direction. The tray transfer mechanism 44 is used to transfer the chip tray between the first conveyor line 41, the second conveyor line 42 and the third conveyor line 43; The detection module 3 includes a first detection device 31 and a second detection device 32. The first detection device 31 is used to detect the side and bottom surfaces of the chip, and the first detection device 31 is arranged on the side of the first conveyor line 41 away from the second conveyor line 42; the second detection device 32 is used to detect the front surface of the chip, and the second detection device 32 is arranged on one side of the first detection device 31 along the Y direction, and the second detection device 32 is arranged directly above the first conveyor line 41 or the second conveyor line 42; The taping module 5 includes a taping mechanism 51, which is disposed on a side of the third conveying line 43 away from the second conveying line 42, and is used for taping and packaging the chip; The loading and unloading gripper module 2 includes a loading mechanism 21 and a unloading mechanism 22 . The loading mechanism 21 is used to transfer chips between the first conveyor line 41 and the first detection device 31 ; the unloading mechanism 22 is used to transfer chips between the second conveyor line 42 , the third conveyor line 43 and the braiding mechanism 51 .

[0019] Specifically, in the traditional solution, the inspection and sorting of finished chips include multiple processes, and manual transfer is often required between each process. The inspection of chips also often relies on manual labor, which is not only inefficient, but the chips are also susceptible to irreversible damage during multiple transfers and inspections, resulting in a low chip yield. In the present invention, the chip to be inspected is placed in a tray and transported along the Y direction by the first conveyor line 41, passing through the first inspection device 31 and the second inspection device 32 in sequence. When the tray is near the first inspection device 31, the first conveyor line 41 will stop to facilitate the loading mechanism 21 to transfer the chip in the tray to the first inspection device 31 for inspection. After the inspection is completed, the first conveyor line 41 will continue to move the tray until the tray is directly below the second inspection device 32. At this time, the second inspection device 32 can inspect the front of the chip. When After completing all the chip inspection processes, the tray transfer mechanism 44 will transfer the tray to the third conveyor line 43, and the tray will be transported by the third conveyor line 43 in the opposite direction of the Y direction to the bottom of the unloading mechanism 22. Then the unloading mechanism 22 will sort the chips according to the inspection results of the first inspection device 31 and the second inspection device 32, and sort the defective chips into the empty tray on the second conveyor line 42, leaving only good chips in the original tray. Then the original tray is transported to the second unloading station, or transferred by the unloading mechanism 22 to the braiding module 5 for braiding packaging. In this entire inspection and sorting process, all is automated and there is no manual contact, which not only improves the inspection efficiency and sorting efficiency of the chip, but also reduces the chip damage problem caused by manual chip transfer, and improves the overall yield of the chip.

[0020] In some embodiments, a loading station 411 is provided at one end of the first conveyor line 41, and the first conveyor line 41 is used to convey the chip tray to be tested to the tray transfer mechanism 44 along the Y direction; a first unloading station 421 is provided at one end of the second conveyor line 42 away from the tray transfer mechanism 44; a second unloading station 431 and a braiding mechanism 51 are provided on the side of the third conveyor line 43 away from the tray transfer mechanism 44.

[0021] Specifically, multiple rows of chips are placed in a tray, and the tray is conveyed along the Y direction by the first conveyor line 41. When the tray is conveyed to the first inspection station, the loading mechanism 21 will grab a row of chips and move along the X direction to the top of the first inspection device 31, and then the first inspection device 31 will inspect the bottom and side surfaces of the chips. When a row of chips is inspected, the loading mechanism 21 moves back to the first inspection station in the opposite direction along the X direction, puts the inspected chips back to the original position of the tray and re-grabs the next row of chips to repeat the above actions until all chips in this tray are inspected. The first conveyor line 41 continues to convey the tray to be inspected to the second inspection station. At this time, the front side of the chip can be inspected by the second inspection device 32, and then the first conveyor line 41 continues to convey the tray to move to the bottom of the tray gripper 443 for transfer of the tray; or after the tray transfer mechanism 44 transfers the entire tray to the third conveyor line 43, the front side of the chip can be inspected by the second inspection device 32. During the inspection of the front side of the chip, the conveyor line will drive the tray to move along the Y direction, and the second inspection device 32 can move back and forth along the X direction, so as to inspect the front sides of all chips in the tray. The inspection range is wider and can adapt to the inspection needs of chips of more different sizes. When the front sides of all chips in the tray have been inspected, the third conveyor line 43 conveys the inspected tray in the opposite direction Y to the second sorting station. At the second sorting station, the unloading mechanism 22 transfers the chips detected as defective to the empty tray on the second conveyor line 42, while the good chips remain in the original tray. When the empty tray loaded with defective chips is full, the second conveyor line 42 conveys the tray to the first unloading station 421 for the convenience of staff to take away. After the defective chips in the original tray have been sorted, all that remain are good chips. According to different shipping and packaging requirements, such as tray packaging and shipping or braid packaging and shipping, the original tray can be conveyed to the second unloading station 431 by the third conveyor line 43, or the unloading mechanism 22 can convey the good chips to the braiding module 5 for packaging and shipping.

[0022] like Figure 3As shown, in some embodiments, the loading and unloading gripper module 2 includes a first gantry 23 arranged along the X direction, the first gantry 23 is provided with a first linear module 231, the first linear module 231 is extended along the X direction, the loading mechanism 21 includes a first module mover 211 and a loading gripper 212, the unloading mechanism 22 includes a second module mover 221 and a unloading gripper 222, the first module mover 211 and the second module mover 221 respectively drive the loading gripper 212 and the unloading gripper 222 to reciprocate along the X direction on the first linear module 231.

[0023] Specifically, the loading gripper 212 and the unloading gripper 222 are both fixed by a pneumatic structure to be inspected and sorted. The loading gripper 212 and the unloading gripper 222 are both slidably arranged on the first linear module 231, which can improve the space utilization rate of the entire equipment and avoid excessive space occupation. The operating ranges of the loading gripper 212 and the unloading gripper 222 are also different, and the movements between the two will not interfere with each other. Further, in this embodiment, the linear module can adopt a three-motor linear motor to drive the movement of the loading gripper 212 or the unloading gripper 222. In addition, in a specific embodiment, the unloading gripper 222 is provided with seven suction nozzles, which can complete the classification and placement of good chips and defective chips, or move good chips from the material tray to the inner packaging of the tape, and can complete the placement of a single chip, or the placement of multiple chips at the same time.

[0024] In some embodiments, the first linear module 231 is also slidably connected to a re-inspection mechanism 24, which includes a third module mover 241, a re-inspection camera 242 and a re-inspection light source 243. The third module mover 241 is slidably connected to the first linear module 231 to drive the re-inspection camera 242 and the re-inspection light source 243 to move back and forth along the X direction. The re-inspection camera 242 and the re-inspection light source 243 are coaxially arranged along the vertical direction.

[0025] Specifically, the re-inspection mechanism 24 can conduct a second re-inspection on the sorted chips, and the re-inspection light source 243 provides the light required for detection. The re-inspection camera 242 is set above the re-inspection light source 243, and the re-inspection camera 242 can re-inspect the front of the chip, thereby ensuring that there are no missed or undetected defective chips in the tray of the third conveyor line 43. At the same time, a sensor for stacking detection is also installed next to the re-inspection camera 242 in the re-inspection mechanism 24, which can detect whether there are stacking and insufficient chips in the material tray grid, and then promptly remind the workers to confirm and replenish the material, or take out the extra chips in the grid.

[0026] like Figure 4 and Figure 5 As shown, in some embodiments, the first detection device 31 includes a multi-camera structure 311 and a 3D line scanning structure 312; The multi-camera structure 311 includes a first mounting frame 3111 fixed to the frame 1, and a first camera 3112, a second camera 3113, a third camera 3114 and a multi-camera light source 3115 arranged in the first mounting frame 3111. The first camera 3112 and the multi-camera light source 3115 are arranged in a vertical direction. The first camera 3112 is used to photograph the bottom surface of the chip. The second camera 3113 and the third camera 3114 are arranged on both sides of the first camera 3112 along the X direction. The second camera 3113 and the third camera 3114 respectively photograph the chip at a 45-degree upward angle. The 3D line scan structure 312 includes a second mounting frame 3121 fixed to the frame 1 . A slide 3122 extending along the Y direction is disposed in the second mounting frame 3121 . The slide 3122 is provided with a 3D line scan camera 3123 .

[0027] Specifically, in this embodiment, the multi-camera structure 311 and the 3D line scan structure 312 are arranged along the X direction on the side of the first conveyor line 41 away from the second conveyor line 42, and the connection line between the multi-camera structure 311 and the 3D line scan structure 312 coincides with the projection of the motion path of the loading mechanism 21; when the tray is moved on the first conveyor line 41 to directly below the loading mechanism 21, the loading mechanism 21 will grab the chip and move it to the multi-camera structure 311 for inspection, or move it to the 3D line scan structure 312 for scanning inspection, wherein according to different chip packaging types and different chip inspection items, the inspection items on the bottom and side of the chip can be photographed by a single camera in the multi-camera structure 311 alone, or by two or more cameras simultaneously; that is, the first camera 3112, the second camera 3113, the third camera 3114, and the 3D line scan camera 3123 can work independently or in combination according to different inspection items. Furthermore, in the multi-camera structure 311, the multi-camera light source 3115 is set below the chip to provide light for chip detection, and the first camera 3112, the second camera 3113, and the third camera 3114 all shoot from bottom to top. The three cameras can focus on the same position of the focal plane, take pictures at the same time, and collect pictures from multiple angles. A single camera can also collect pictures from different surfaces of the chip. The bottom surface and four side surfaces of the chip can be collected, and the images at each angle can be judged by software algorithms. Most of the appearance defects and bad features such as height, size, short circuit and disconnection on each surface of the chip can be detected. Furthermore, the 3D line scan camera 3123 also shoots from bottom to top, and can scan the bottom surface of the chip to obtain the height data of the bottom surface of the chip. The software can perform height analysis on the bottom surface features of the chip through this height information; the 3D line scan camera 3123 can slide along the Y direction on the slide 3122 to achieve full coverage of the bottom surface of chips of various sizes.

[0028] like Figure 6As shown, in some embodiments, the tray transfer mechanism 44 includes a second gantry 441 arranged along the X direction, the second gantry 441 is provided with a second linear module 442 and a tray gripper 443, the second linear module 442 is extended along the X direction, and the second linear module 442 is used to drive the tray gripper 443 to reciprocate along the X direction; The tray gripper 443 includes a first mounting plate 4431, a lifting motor and a tray clamp 4432. The first mounting plate 4431 is slidably connected to the second linear module 442. The lifting motor is fixed to the first mounting plate 4431. The lifting motor is used to drive the tray clamp 4432 to reciprocate in the vertical direction.

[0029] Specifically, the second gantry 441 is arranged across the top of the three conveyor lines and is arranged on the side of the first conveyor line 41 away from the loading station 411. When the chip is inspected at the first inspection station, the first conveyor line 41 will continue to convey the tray to the bottom of the second gantry 441. At this time, the second linear module 442 can drive the tray gripper 443 to move along the X direction to the top of the tray. Then the lifting motor starts the tray clamp 4432 to move downward to the position of the tray. The tray clamp 4432 clamps the tray under the action of pneumatic drive. Then the lifting motor drives the tray clamp 4432 and the tray to move upward in the vertical direction. The second linear module 442 drives the first mounting plate 4431 to move along the X direction until the tray is above the third conveyor line 43. The lifting motor cooperates with the tray clamp 4432 to place the tray on the third conveyor line 43.

[0030] In addition, the second linear module 442 can be a belt module or a linear motor, or other module structures that can drive the tray gripper 443 to reciprocate linearly along the X direction.

[0031] In some embodiments, the second detection device 32 includes a third linear module 321 and a front camera structure 322 disposed on the second gantry 441, the third linear module 321 extending along the X direction, and the third linear module 321 is disposed on a side of the second gantry 441 away from the second linear module 442, and the third linear module 321 is used to drive the front camera structure 322 to reciprocate along the X direction; The front camera structure 322 includes a second mounting plate 3221, which is slidably connected to the third linear module 321, and the second mounting plate 3221 is provided with a coaxially mounted front camera lens 3222 and a front camera light source 3223 along the vertical direction.

[0032] Specifically, the first conveyor line 41, the second conveyor line 42 and the third conveyor line 43 are all provided with a second inspection station. The second inspection device 32 can inspect the front of the chip at different second inspection stations according to the needs. The inspection of the front of the chip can be carried out on the first conveyor line 41 or the third conveyor line 43. The third linear module 321 drives the front camera structure 322 to move back and forth along the X direction, and the conveyor line drives the material tray to move along the Y direction, so that the camera field of view of the front camera structure 322 can cover the front of the entire material tray on the first conveyor line 41, the second conveyor line 42 and the third conveyor line 43, so as to meet the inspection requirements of different inspection positions. For the inspection of the front of the chip, the entire tray is placed under the front camera light source 3223, and the front camera light source 3223 emits light from the bottom downward. The front camera lens 3222 obtains the light reflected from the front of each chip, and uses it to obtain the status information of the front of the chip, identify the defective chip, and send the location information of the defective chip to the unloading mechanism 22. The unloading mechanism 22 can remove and transfer the defective product based on the information.

[0033] In some embodiments, the taping mechanism 51 includes a conveying track 511, a heat sealing component 512, a winding component 513 and a taping detection component 514. The conveying track 511 component is used to input the carrier tape loaded with good chips to the heat sealing component 512. The heat sealing component 512 is used to heat-seal and package the cover tape and the carrier tape. The winding component 513 is used to wind up the packaged good chips. The taping detection component 514 is used to detect the status of the chips to be taped and the status of the seal after taping.

[0034] Specifically, the taping mechanism 51 includes a carrier tape and a cover tape, and the carrier tape is provided with empty slots for accommodating chips. The unloading mechanism 22 places the good chips in the material tray in the empty slots, and the conveying track 511 conveys the carrier tape toward the heat sealing component 512. In the heat sealing component 512, the cover tape covers the carrier tape and is heat-sealed with the carrier tape, so that the chips are sealed and packaged in the empty slots. The taping detection component 514 can perform a final inspection on the chips before chip packaging, detect the placement direction of the chips in the slots, whether there are too many or too few chips in the slots, and other defects on the front of the chips. If there are any abnormalities, the unloading robot can also change the material before heat-sealing the cover tape to avoid packaging of defective chips. In addition, the taping detection component 514 can also detect the already packaged taping to detect whether the state of the hot pressing seal is intact to avoid problems such as poor sealing, damage, and empty packages in the taping packaging.

[0035] See also Figure 7 The present invention also provides a chip detection and sorting method, using the chip detection and sorting device described above, comprising the following sorting steps: S1, start the running program after the power-on self-test, and at the same time manually place the tray with the chips to be tested on the loading station 411 of the first conveyor line 41, and place the empty tray on the first unloading station 421 of the second conveyor line 42; S2, the first conveyor line 41 conveys the pallet to be inspected to the first inspection station along the Y direction, and the second conveyor line 42 conveys the empty pallet to the first sorting station along the Y direction; S3, the loading mechanism 21 grabs the chip from the inspection tray to the first inspection device 31, and the multi-camera structure 311 and the 3D line scanning structure 312 in the first inspection device 31 inspect the bottom and side surfaces of the chip; after the chip inspection is completed, the loading mechanism 21 transfers the chip back to the inspection tray and transmits the inspection result to the unloading mechanism 22; S4, the first conveyor line 41 conveys the tray to be inspected after the first round of inspection to the second inspection station, and the front camera structure 322 in the second inspection device 32 inspects the front of the chip at the second inspection station, and transmits the inspection result to the unloading mechanism 22; then the first conveyor line 41 conveys the tray after the front inspection to the tray grabbing position, and the tray gripper 443 in the tray transfer mechanism 44 grabs the tray to be sorted after the inspection, and transfers the tray to be sorted to the third conveyor line 43; S5, the third conveyor line 43 conveys the tray to be sorted to the second sorting station, and the unloading mechanism 22 sorts the defective chips in the tray to be sorted into the empty tray at the first sorting station according to the detection results in step S3 and step S4; S6, the second conveyor line 42 conveys the tray carrying defective chips to the first unloading station 421; at the same time, the third conveyor line 43 conveys the tray carrying good chips to the second unloading station 431, or the unloading mechanism 22 transfers the good chips in the tray to the tape carrier grid of the tape mechanism 51; S7. When the qualified chips are transferred to the carrier tape grid of the weaving mechanism 51, the weaving detection component 514 detects the chips in the carrier tape grid. When the weaving detection component 514 detects defective chips, the unloading mechanism 22 absorbs the defective chips into the empty tray of the first sorting station, and absorbs new qualified chips from the qualified chip tray into the carrier tape of the weaving mechanism 51. Then, the heat sealing component 512 completes the heat sealing connection between the carrier tape and the cover tape, and the winding component 513 winds and packs the qualified chips.

[0036] Specifically, in the present embodiment, for the inspection and sorting of chips, the inspection tray can be transported to the first inspection station via the first conveyor line 41, and then the fixed chips are sucked by the loading gripper 212, and the chips are transferred to the multi-camera structure 311 and the 3D line scanning structure 312 for inspection in sequence. According to the number of chips in the inspection tray and the number of chips sucked by the loading gripper 212 at a time, the loading gripper 212 needs to grab the chips for inspection multiple times until all the chips in the inspection tray are inspected. During this process, the first inspection device 31 cooperates with the loading mechanism 21 to send the information of defective products to the sorting controller for processing. When the bottom and side surfaces of all chips are inspected, the first conveyor line 41 continues to transport the inspection tray to the second inspection station, and then the front surface is inspected. The camera structure 322 moves back and forth along the X direction to complete the scanning and detection of the front state of the chip. For the detected defective products, the unloading mechanism 22 is also controlled by the controller to process; when the chip detection is completed, the tray gripper 443 can start to transfer the tray to be sorted to the third conveyor line 43, and the third conveyor line 43 conveys the tray to be sorted to the second sorting station. At this time, the sorting controller controls the unloading mechanism 22 to accurately grab the defective products and transfer the defective products to the empty tray of the second conveyor line 42. The sorting controller can be a chip computer or other equipment. When the defective chips are transferred, the unloading gripper 222 can transfer the good chips to the empty space of the braid for packaging, or the third conveyor line 43 conveys the tray full of good chips against the Y direction to the second unloading station. In the above-mentioned whole process, only the workers need to put in the tray to be inspected and the empty tray at the beginning stage. The transfer and detection in the chip detection process and sorting process do not require the participation of workers. The detection, sorting and transportation efficiency is higher, and the detection process and sorting process are also more stable and reliable.

[0037] In addition, in some other embodiments, the unloading gripper 222 can sort the defective chips and tray chips by first taking out all the defective chips into the empty tray of the second conveyor line 42, and then taking the good chips to replenish the empty spaces on the original tray after sorting. When the empty spaces on the original tray are replenished, the unloading gripper 222 can grab multiple chips at one time and put them into the carrier grid of the weaving mechanism 51 for weaving packaging, which improves the efficiency of weaving packaging and reduces the complexity of the operation of the mechanism; and the empty trays on the second conveyor line 42 can be used to store different categories of defective chips in partitions, thereby improving the efficiency of subsequent classification and detection of defective products.

[0038] Furthermore, in the actual inspection and sorting process, when the empty tray for placing defective chips on the second conveyor line 42 is full, the tray is conveyed by the second conveyor line 42 to the first unloading station 421, and at the same time, the empty tray after taping on the third conveyor line 43 will be moved to the bottom of the tray clamp 4432 and transferred to the second conveyor line 42 by the tray clamp 4432 for loading new defective chips, which reduces manual participation and improves the efficiency of the entire equipment in sorting chips.

[0039] In some embodiments, a second inspection station is provided above the first conveyor line 41, the second conveyor line 42, and the third conveyor line 43. In step S4, after the first conveyor line 41 conveys the tray to be inspected to the bottom of the tray transfer mechanism 44, the tray gripper 443 in the tray transfer mechanism 44 grabs the tray to be inspected and transfers the tray to be inspected to the second inspection station of the third conveyor line 43. The front camera structure 322 in the second inspection device 32 inspects the front of the chip at the second inspection station and delivers the inspection result to the unloading mechanism 22. Specifically, in this embodiment, since there are multiple second inspection stations, during the inspection and sorting process of the chip, the tray transfer mechanism 44 can choose whether to transfer the tray first and then inspect the front of the chip, or to inspect the front of the chip first and then transfer the tray according to the timing of other processes. For example, when there are no empty pallets on the second conveyor line 42, and the unloading mechanism 22 is sorting defective products, the tray transfer mechanism 44 is needed to transfer the empty pallets on the third conveyor line 43 to the second conveyor line 42. At this time, the front side of the chip is inspected at the second inspection station of the first conveyor line 41. The front side inspection of the chip and the transfer of the tray are carried out simultaneously, and the overall working efficiency of the equipment is higher. When there are trays carrying defective chips on the second conveyor line 42, and there are multiple trays that have completed a round of inspection on the first conveyor line 41, or there are no trays to be sorted on the third conveyor line 43, the trays on the first conveyor line 41 can be transferred to the third conveyor line 43 as a priority, and the second inspection device 32 inspects the front side of the chip at the second inspection station of the third conveyor line 43, thereby improving the efficiency of chip inspection and transfer.

[0040] In summary, an embodiment of the present invention provides a chip inspection and sorting equipment, which realizes automatic transportation of chip trays to be inspected through three conveyor lines, and the first inspection device 31 is arranged next to the first conveyor line 41, and the braiding mechanism 51 is arranged on the side of the third conveyor line 43. The transfer of chips between the conveyor line, the first inspection device 31 and the braiding mechanism 51 is realized through the loading mechanism 21 and the unloading mechanism 22, which is more efficient and more stable; and the second inspection device 32 is located directly above the conveyor line, and can inspect the front side of the chip on different conveyor lines, eliminating the trouble of chip transfer, and the first inspection device 31 and the second inspection device 32 are separately arranged, and can perform two inspections at the same time. The equipment can automatically complete various visual inspections of multiple surfaces of the chip, and classify and package them, and the overall inspection efficiency will be further improved.

[0041] The above are only preferred embodiments of the present invention. It should be pointed out that, for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A chip detection and sorting device, having an X direction and a Y direction intersecting vertically, comprising a frame, characterized in that: The frame is provided with a loading and unloading gripper module, a detection module, a transfer module and a braiding module; The transfer module comprises a first conveyor line, a second conveyor line, a third conveyor line and a tray transfer mechanism arranged side by side, wherein the first conveyor line, the second conveyor line and the third conveyor line are all extended along the Y direction, and the tray transfer mechanism is arranged along the X direction, and the tray transfer mechanism is used to transfer the chip tray between the first conveyor line, the second conveyor line and the third conveyor line; The detection module includes a first detection device and a second detection device, wherein the first detection device is used to detect the side and bottom surfaces of the chip, and the first detection device is arranged on a side of the first conveyor line away from the second conveyor line; the second detection device is used to detect the front surface of the chip, and the second detection device is arranged on a side of the first detection device along the Y direction, and the second detection device is arranged directly above the first conveyor line or the second conveyor line; The taping module comprises a taping mechanism, which is arranged on a side of the third conveying line away from the second conveying line, and is used for taping and packaging the chip; The loading and unloading gripper module includes a loading mechanism and a unloading mechanism. The loading mechanism is used to transfer chips between the first conveyor line and the first detection device; the unloading mechanism is used to transfer chips between the second conveyor line, the third conveyor line and the braiding mechanism.

2. The chip detection and sorting equipment according to claim 1, characterized in that: A loading station is provided at one end of the first conveyor line, and the first conveyor line is used to convey the chip tray to be tested to the tray transfer mechanism along the Y direction; a first unloading station is provided at one end of the second conveyor line away from the tray transfer mechanism; a second unloading station and the braiding mechanism are provided at one side of the third conveyor line away from the tray transfer mechanism.

3. The chip detection and sorting equipment according to claim 2, characterized in that: The loading and unloading gripper module comprises a first gantry arranged along the X direction, the first gantry is provided with a first linear module, the first linear module is extended along the X direction, the loading mechanism comprises a first module mover and a loading gripper, the unloading mechanism comprises a second module mover and a unloading gripper, the first module mover and the second module mover respectively drive the loading gripper and the unloading gripper to reciprocate along the X direction on the first linear module.

4. The chip detection and sorting equipment according to claim 3, characterized in that: The first linear module is also slidably connected to a re-inspection mechanism, which includes a third module mover, a re-inspection camera and a re-inspection light source. The third module mover is slidably connected to the first linear module to drive the re-inspection camera and the re-inspection light source to reciprocate along the X direction. The re-inspection camera and the re-inspection light source are coaxially arranged in the vertical direction.

5. The chip detection and sorting equipment according to claim 2, characterized in that: The first detection device includes a multi-camera structure and a 3D line scanning structure; The multi-camera structure includes a first mounting frame fixed to a frame, and a first camera, a second camera, a third camera, and a multi-camera light source arranged in the first mounting frame, wherein the first camera and the multi-camera light source are arranged in a vertical direction, the first camera is used to photograph the bottom surface of the chip, the second camera and the third camera are arranged on both sides of the first camera along the X direction, and the second camera and the third camera respectively photograph the chip at a 45-degree upward angle; The 3D line scan structure includes a second mounting frame fixed to a frame, a slide extending along the Y direction is arranged in the second mounting frame, and a 3D line scan camera is arranged on the slide.

6. The chip detection and sorting equipment according to claim 2, characterized in that: The tray transfer mechanism includes a second gantry arranged along the X direction, the second gantry is provided with a second linear module and a tray gripper, the second linear module is extended along the X direction, and the second linear module is used to drive the tray gripper to reciprocate along the X direction; The tray gripper includes a first mounting plate, a lifting motor and a tray clamp, the first mounting plate is slidably connected to the second linear module, the lifting motor is fixed to the first mounting plate, and the lifting motor is used to drive the tray clamp to reciprocate in the vertical direction.

7. The chip detection and sorting equipment according to claim 6, characterized in that: The second detection device includes a third linear module and a front camera structure arranged on the second gantry, the third linear module is extended along the X direction, and the third linear module is arranged on a side of the second gantry away from the second linear module, and the third linear module is used to drive the front camera structure to reciprocate along the X direction; The front camera structure includes a second mounting plate, the second mounting plate is slidably connected to the third linear module, and the second mounting plate is provided with a coaxially mounted front camera lens and a front camera light source along the vertical direction.

8. The chip detection and sorting equipment according to claim 1, characterized in that: The taping mechanism includes a conveying track, a heat sealing component, a winding component and a taping detection component. The conveying track component is used to input a carrier tape full of good chips to the heat sealing component. The heat sealing component is used to heat-seal and package the cover tape and the carrier tape. The winding component is used to wind up the packaged good chips. The taping detection component is used to detect the status of the chips to be taped and the status of the seal after taping.

9. A chip detection and sorting method, using the chip detection and sorting device according to any one of claims 1 to 8, characterized in that: The sorting steps include: S1. Start the running program after the power-on self-test, and manually place the tray with the chips to be tested on the loading station of the first conveyor line, and place the empty tray on the first unloading station of the second conveyor line; S2, the first conveyor line conveys the pallet to be inspected to the first inspection station along the Y direction, and the second conveyor line conveys the empty pallet to the first sorting station along the Y direction; S3, the loading mechanism grabs the chip from the tray to be inspected and puts it into the first inspection device, the first inspection device inspects the bottom and side surfaces of the chip and transmits the inspection results to the unloading mechanism; after the chip inspection is completed, the loading mechanism transfers the chip back to the tray to be inspected; S4, the first conveyor line conveys the tray to be inspected to the second inspection station, the second inspection device inspects the front of the chip and transmits the inspection result to the unloading mechanism; then the tray transfer mechanism transfers the tray to be sorted after the inspection to the third conveyor line; S5, the third conveyor line conveys the tray to be sorted to the second sorting station, and the unloading mechanism sorts the defective chips in the tray to be sorted into the empty tray at the first sorting station according to the detection results in step S3 and step S4; S6, the second conveyor line conveys the tray carrying defective chips to the first unloading station; at the same time, the third conveyor line conveys the tray carrying good chips to the second unloading station, or the unloading mechanism transfers the good chips in the tray to the tape carrier grid of the tape mechanism; S7. When the good chips are transferred to the carrier grid of the taping mechanism, the taping mechanism packages the good chips.

10. A chip detection and sorting method according to claim 9, characterized in that: The second inspection station is arranged above the first conveyor line, the second conveyor line and the third conveyor line. In step S4: after the first conveyor line conveys the tray to be inspected to the bottom of the tray transfer mechanism, the tray gripper in the tray transfer mechanism grabs the tray to be inspected and transfers the tray to be inspected to the second inspection station of the third conveyor line, and the front camera structure in the second inspection device inspects the front side of the chip at the second inspection station and transmits the inspection result to the unloading mechanism.

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