Ignition IGBT power module packaging structure and ignition circuit

Abstract

The invention discloses an ignition IGBT power module packaging structure and an ignition circuit. The ignition IGBT power module packaging structure comprises a ceramic substrate; the copper-clad layer is arranged on the ceramic substrate; the IGBT chip and the driving IC chip are arranged on the copper-clad layer, and the IGBT chip and the driving IC chip are provided with a plurality of pin ends; the plurality of vertically arranged leading-out terminals are electrically connected with the plurality of pin ends respectively; and the wrapping frame covers the IGBT chip, the driving IC chip and the copper-clad layer, and the top ends of the plurality of leading-out terminals are exposed out of the wrapping frame. The ignition IGBT power module is provided with the packaging structure, and the ignition circuit comprises the ignition IGBT power module. According to the packaging structure and the ignition circuit, heat dissipation is good, the size is small, intelligentization, integration, miniaturization and high reliability are achieved, meanwhile, elements needed by the system design periphery are reduced, the overall reliability of the system is improved, and cost is reduced.

Description

Technical Field

[0001] The invention relates to an ignition power module and an ignition circuit, and in particular to an ignition IGBT power module packaging structure and an ignition circuit. Background Art

[0002] At present, automobile ignition mainly adopts "plug-in" coils, eliminates high-voltage wiring, and integrates insulated gate bipolar transistor (IGBT) devices and their drive circuits, making the automobile ignition system more compact and simple. Automobile ignition mainly consists of IGBT drive circuit board, ignition coil, high-voltage diode, spring, sheath, anti-interference resistor and connector.

[0003] With the development of the ignition system, higher requirements are put forward for the monitoring function of the automobile ignition system, such as intelligent system diagnosis, obtaining the combustion state of the fuel mixture during the combustion process, enhancing reliability, and reducing engine emissions. Therefore, higher requirements are also put forward for the ignition coil driver: 1) It can obtain the current information of the primary coil to determine the IGBT conduction time, control the primary side current, and realize the precise control of the ignition energy; 2) When a short circuit occurs on the primary side, it is required to monitor the primary side current and cut off the IGBT in time to realize the short circuit protection function; 3) It is required to continuously optimize the IGBT heat dissipation performance, improve the current capacity and service life; 4) Increase the integration, reduce the number of components, and improve the overall reliability; 5) With the pressure of cost reduction in the automotive industry, it is required to provide more cost-effective automotive ignition IGBT products; Therefore, it is urgent to design a more intelligent, more integrated, more miniaturized and more reliable automotive ignition IGBT module. Summary of the invention

[0004] The technical problem to be solved by the present invention is to overcome the defects in the prior art and provide a packaging structure of an ignition IGBT power module with small size, good heat dissipation, intelligence, integration and high reliability, an ignition IGBT power module with the packaging structure, and an ignition circuit.

[0005] The present invention solves the above technical problems through the following technical solutions: an ignition IGBT power module packaging structure, characterized in that it includes:

[0006] Ceramic substrate;

[0007] A copper-clad layer is provided on the ceramic substrate;

[0008] An IGBT chip and a driver IC chip are arranged on the copper clad layer, and the IGBT chip and the driver IC chip have a plurality of pin ends;

[0009] A plurality of vertically arranged lead terminals are electrically connected to the plurality of pin ends respectively;

[0010] A wrapping frame covers the IGBT chip, the driver IC chip and the copper cladding layer, and top ends of the plurality of lead terminals are exposed from the wrapping frame.

[0011] Preferably, a heat dissipation base plate is further provided below the ceramic substrate.

[0012] Preferably, the copper clad layer includes a plurality of spaced copper clad areas, including a base copper clad area for placing an IGBT chip and a driver IC chip, and a connection copper clad area for connecting lead terminals.

[0013] Preferably, the lead terminal is directly connected to the pin end, or is connected to the pin end through a bonding wire and the connecting copper clad area.

[0014] Preferably, both the emitter power terminal and the collector power terminal of the IGBT chip are directly connected to the lead-out terminal.

[0015] Preferably, the gate signal terminal, the emitter signal terminal of the IGBT chip, and each pin terminal of the driver IC chip are connected to one end of the connection copper-clad area through the bonding wire, and the other end of the connection copper-clad area is connected to the lead terminal.

[0016] Preferably, a plurality of pin ends of the IGBT chip and the driver IC chip are arranged upward.

[0017] Another aspect of the present invention provides an ignition IGBT power module, characterized in that it includes an IGBT chip and a driver IC chip, and has a packaging structure as described in any one of the above items.

[0018] Another aspect of the present invention provides an ignition circuit of an ignition IGBT power module, characterized in that it has the above-mentioned ignition IGBT power module, the output end of the driver IC chip of the ignition IGBT power module is connected to the gate of the IGBT chip through a driving resistor, and the emitter of the IGBT chip is connected to the driver IC chip for detection.

[0019] Preferably, if an overcurrent condition is detected in the emitter current of the IGBT chip, the driver IC chip sends a shutdown signal to cut off the large current of the IGBT chip.

[0020] The positive progressive effect of the present invention is that the ignition IGBT power module packaging structure, IGBT power module and ignition circuit for automobile ignition provided by the present invention can solve the problem that the current ignition IGBT device has simple functions and cannot achieve self-protection. During system design, there are fewer peripheral components, good heat dissipation and miniaturized size, thus achieving intelligence, integration, miniaturization and high reliability. At the same time, the peripheral components required for system design are reduced, the overall reliability of the system is improved, and the cost is reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a front view of the packaging structure of the ignition IGBT power module disclosed in Embodiment 1 of the present invention;

[0022] Figure 2 It is a side view of the packaging structure of the ignition IGBT power module disclosed in Embodiment 1 of the present invention;

[0023] Figure 3 It is a three-dimensional schematic diagram of the ignition IGBT power module disclosed in Embodiment 2 of the present invention;

[0024] Figure 4 This is a schematic diagram of an ignition circuit of an ignition IGBT power module of Embodiment 2 disclosed in Embodiment 3 of the present invention. DETAILED DESCRIPTION

[0025] The present invention is further described below by way of examples, but the present invention is not limited to the scope of the examples.

[0026] Example 1

[0027] like Figure 1-2 As shown, the ignition IGBT power module packaging structure disclosed in Embodiment 1 of the present invention includes a heat dissipation base plate 1 located at the bottom layer, and the heat dissipation base plate 1 is used to conduct away the heat generated by the device above it during operation;

[0028] The ceramic substrate 2 is located above the heat dissipation base plate 1. The ceramic substrate 2 transfers heat to the heat dissipation base plate 1 on the one hand, and acts as an insulator between the upper copper clad layers and between the copper clad layers and the heat dissipation base plate 1 on the other hand;

[0029] A copper clad layer 3 is provided above the ceramic substrate 2, and an IGBT chip 41 and a driver IC (Integrated Circuit) chip 42 are provided on the copper clad layer 3. The IGBT chip 41 and the driver IC chip 42 have a plurality of pin ends 5, and the plurality of pin ends 5 of the IGBT chip 41 and the driver IC chip 42 are all arranged upward;

[0030] A plurality of vertically arranged lead terminals 7 are electrically connected to the plurality of pin ends 5 respectively;

[0031] The wrapping frame 8 covers the IGBT chip 41 , the driver IC chip 42 and the copper cladding layer 3 , and the top ends of the plurality of lead terminals 7 are exposed from the wrapping frame 8 .

[0032] Preferably, the copper-clad layer 3 includes a plurality of spaced copper-clad areas, forming a fixed pattern above the ceramic substrate 2. An IGBT chip 41 and a driver IC chip 42, as well as a plurality of lead terminals 7 are respectively provided on the plurality of copper-clad areas, and the lead terminals 7 are electrically connected to the respective pin ends 5 of the IGBT chip 41 and the driver IC chip 42 through bonding wires 6 or directly electrically connected.

[0033] Preferably, the pin ends 5 of the IGBT chip 41 and the driver IC chip 42 are respectively arranged on the upper surfaces of the IGBT chip 41 and the driver IC chip 42 , and the lead terminals 7 are vertically arranged.

[0034] Preferably, the plurality of copper-clad areas include a base copper-clad area 31 and a connection copper-clad area 32. An IGBT chip 41 and a driver IC chip 42 are respectively disposed on two base copper-clad areas 31. One end of the connection copper-clad area 32 is used to be connected to a plurality of pin ends 5 through a bonding wire 6, and the other end of the connection copper-clad area 32 is connected to a lead-out terminal 7.

[0035] The pin ends 5 of the IGBT chip 41 and the driver IC chip 42 are respectively arranged upward and located on the upper surfaces of the IGBT chip 41 and the driver IC chip 42. The pin ends 5 are electrically connected to the connection copper-clad areas 32 of the copper-clad layer 3 through bonding wires 6. The connection copper-clad areas 32 are provided with lead terminals 7, and then the pin ends of the IGBT chip 41 and the driver IC chip 42 are connected through bonding wires 6, the connection copper-clad areas 32 and the lead terminals 7. Alternatively, the lead terminals 7 are directly provided on some of the pin ends 5.

[0036] The wrapping frame 8 covers the IGBT chip 41, the driver IC chip 42 and the copper clad layer 3, which not only plays a supporting role but also isolates interference such as external pollution and water vapor. The lead-out terminal 7 is vertically arranged, with the bottom end connected to each connection copper clad area or the bottom copper clad area 31, and the upper end extending out of the wrapping frame 8.

[0037] Preferably, the pin end 5 on the IGBT chip 41 includes an emitter power end 513 and a collector power end, and the emitter power end 513 and the collector power end are directly connected to the lead-out terminal 7. The gate signal end 511 and the emitter signal end 512 of the IGBT chip 41 are connected to the copper-clad area 32 through bonding wires 6, and then the lead-out terminal 7 connected to the copper-clad area 32 is led out of the entire packaging structure. The lead-out terminal connected to the power end and the lead-out terminal connected to the signal end through the copper-clad area can be two lead-out terminals of different sizes, and those skilled in the art can set them as needed. All the lead-out terminals 7 of the ignition IGBT power module extend upward from the wrapping frame 8, that is, they are led out of the entire packaging structure from the top, which is convenient for the external PCB circuit to be connected to the upper and lower parts of the module.

[0038] The pin terminals 5 of the driver IC chip 42 include a GND terminal 521, a Vbat terminal 522, an Input terminal 523, a Vsense terminal 524, an NC terminal 525, an Output terminal 526, a CSSD terminal 527 and a RA terminal 528. The above terminals are connected to the copper-clad area 32 through a bonding wire 6, and then led out of the entire packaging structure through a lead-out terminal 7 connected to the copper-clad area 32.

[0039] The ignition IGBT power module packaging structure of this embodiment integrates the IGBT chip and the driver IC chip into one module. Compared with the circuit design after packaging the two chips separately, the overall size and packaging cost of the two can be significantly reduced, fewer peripheral circuit components are required, and the overall reliability is higher. In addition, the DBC substrate is used to replace the traditional solution of packaging the two chips and then soldering them on the PCB board, which can achieve better heat dissipation performance, reduce the working junction temperature of the IGBT chip, and increase the service life of the IGBT. In addition, all terminals are led upward, which is convenient for the external circuit board to be directly installed from top to bottom, making full use of the longitudinal space and significantly reducing the size of the automobile ignition module. Unlike traditional ignition IGBT devices, the ignition IGBT power module integrates the driver IC chip and the IGBT chip, which can collect, monitor, judge and protect the IGBT chip current, thereby realizing the overcurrent protection function of the ignition IGBT current.

[0040] Example 2

[0041] This embodiment discloses an ignition IGBT power module, such as Figure 3As shown, the ignition IGBT power module is used in the ignition system of the car and can be used to connect other ignition circuits and peripheral circuits. The ignition IGBT power module has the packaging structure as described in Example 1. The ignition IGBT power module includes an IGBT chip 41 and a driver IC chip 42, wherein the IGBT chip 41 is used to conduct or cut off the large current on the primary side of the car ignition coil, thereby generating a high-voltage ignition pulse. The driver IC chip 42 performs voltage shaping on the ignition signal sent by the car ignition control unit to drive the ignition switch IGBT chip 41. The multiple lead terminals 7 of the ignition IGBT power module extend out from the top of the ignition IGBT power module, which is convenient for welding on the external PCB board.

[0042] The ignition IGBT power module integrates the IGBT chip and the driver IC chip in one module, requiring fewer peripheral circuit components and having higher overall reliability. In addition, all the lead terminals of the module are led upward, which is convenient for the external circuit board to be directly installed from top to bottom, making full use of the longitudinal space and significantly reducing the size of the automotive ignition module. Unlike traditional ignition IGBT devices, the ignition IGBT power module integrates the driver IC chip and the IGBT chip, which can collect, monitor, judge and protect the IGBT chip current, thereby realizing the overcurrent protection function of the ignition IGBT current.

[0043] Example 3

[0044] like Figure 4 As shown, this embodiment is an ignition circuit with an ignition IGBT power module of embodiment 2, and the ignition circuit includes an IGBT chip 41 and a driver IC chip 42, wherein the IGBT chip 41 is used to conduct or cut off the primary side high current of the automobile ignition coil, thereby generating a high-voltage ignition pulse. The driver IC chip 42 performs voltage shaping on the ignition signal sent by the automobile ignition control unit to drive the ignition switch IGBT chip 41.

[0045] The output terminal of the driver IC chip 42 is connected to the drive resistor R G Connected to the gate of the IGBT chip 41, the emitter of the IGBT chip 41 is connected to the Vsense terminal 524 of the driver IC chip 42, that is, the emitter current of the IGBT chip 41 can be collected to the driver IC chip 42 for monitoring. If an overcurrent occurs, the driver IC chip 42 can directly send a shutdown signal to shut down the IGBT chip 41 and cut off the large current of the IGBT chip 41. Figure 4 As shown in the figure, the output end of the driver IC chip 42 is driven by a resistor R GThe line connected to the gate of the IGBT chip 41 is a dotted line, and the line between the emitter of the IGBT chip 41 and the Vsense terminal of the driver IC chip 42 is also a dotted line, indicating that the above connection line and the drive resistor R G It is an external device independent of the ignition IGBT power module.

[0046] The ignition circuit of the ignition IGBT power module includes a driver IC chip and an IGBT chip, and can realize the current protection function of the IGBT chip.

[0047] Although the specific embodiments of the present invention are described above, it should be understood by those skilled in the art that this is only for illustration and the protection scope of the present invention is defined by the appended claims. Those skilled in the art may make various changes or modifications to these embodiments without departing from the principles and essence of the present invention, but these changes and modifications all fall within the protection scope of the present invention.

Claims

1. An ignition IGBT power module packaging structure, characterized in that: include, Ceramic substrate (2); A copper cladding layer (3) is provided on the ceramic substrate (2); An IGBT chip (41) and a driver IC chip (42) are arranged on the copper cladding layer (3), and the IGBT chip (41) and the driver IC chip (42) have a plurality of pin ends (5); A plurality of vertically arranged lead terminals (7) are electrically connected to the plurality of pin ends (5) respectively; A wrapping frame (8) covers the IGBT chip (41), the driver IC chip (42) and the copper cladding layer (3), and the top ends of the plurality of lead terminals (7) are exposed from the wrapping frame (8).

2. The ignition IGBT power module packaging structure according to claim 1, characterized in that: A heat dissipation base plate (1) is also provided below the ceramic substrate (2).

3. The ignition IGBT power module packaging structure according to claim 1, characterized in that: The copper clad layer (3) comprises a plurality of spaced copper clad areas, including a bottom copper clad area (31) for placing an IGBT chip (41) and a driver IC chip (42), and a connection copper clad area (32) for connecting a lead terminal (7).

4. The ignition IGBT power module packaging structure according to claim 3, characterized in that: The lead terminal (7) is directly connected to the pin end (5), or is connected to the pin end (5) through a bonding wire (6) and the connecting copper cladding area (32).

5. The ignition IGBT power module packaging structure according to claim 4, characterized in that: The emitter power terminal and the collector power terminal of the IGBT chip (41) are both directly connected to the lead-out terminal (7).

6. The ignition IGBT power module packaging structure according to claim 4, characterized in that: The gate signal terminal and the emitter signal terminal of the IGBT chip (41), as well as the respective pin terminals of the driver IC chip (42), are all connected to one end of the connection copper cladding area (32) through the bonding wire (6), and the other end of the connection copper cladding area (32) is connected to the lead terminal (7).

7. The ignition IGBT power module packaging structure according to claim 1, characterized in that: The plurality of pin ends (5) of the IGBT chip (41) and the driver IC chip (42) are arranged upward.

8. An ignition IGBT power module, characterized in that: The invention comprises an IGBT chip (41) and a driver IC chip (42), and has a packaging structure as claimed in any one of claims 1 to 7.

9. An ignition circuit for an ignition IGBT power module, characterized in that: The ignition IGBT power module according to claim 8 is provided, wherein the output end of the driver IC chip of the ignition IGBT power module is connected to the gate of the IGBT chip through a driving resistor, and the emitter of the IGBT chip is connected to the driver IC chip for detection.

10. The ignition circuit of the ignition IGBT power module according to claim 9, characterized in that: If an overcurrent condition is detected in the emitter current of the IGBT chip, the driver IC chip sends a shutdown signal to cut off the high current of the IGBT chip.

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