Piezoelectric heat dissipation device and heat dissipation system

Abstract

The invention relates to the technical field of electronic equipment, and discloses a piezoelectric heat dissipation device and a heat dissipation system.The piezoelectric heat dissipation device comprises a shell, a connecting assembly and a piezoelectric assembly, the piezoelectric assembly is arranged in the shell and connected with the shell through the connecting assembly, and the piezoelectric assembly comprises a first piezoelectric element, a vibrating diaphragm, a supporting frame and a jet plate which are sequentially connected in the first direction; a jet hole is formed in the jet plate, and an energy conversion cavity communicated with the jet hole is defined by the vibrating diaphragm, the supporting frame and the jet plate; the shell comprises a shell body and an air outlet cover plate, the shell body is provided with an opening facing the jet flow plate in the first direction, the air outlet cover plate covers the opening and is provided with an air outlet communicated with the jet flow hole, and the shell body is further provided with an air inlet communicated with the jet flow hole. The piezoelectric heat dissipation device is simple in structure and easy to miniaturize, and the structural arrangement of the heat dissipation system is beneficial to improving the heat dissipation effect of the piezoelectric heat dissipation device.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic equipment, and in particular to a piezoelectric heat dissipation device and a heat dissipation system. Background Art

[0002] With the rapid development of science and technology, electronic products are constantly moving towards high performance, miniaturization and high integration. However, this trend also makes the cooling system of electronic products face greater challenges, because high performance usually brings greater heat generation. In addition, due to the limitations of its mechanical structure, traditional cooling fans are difficult to achieve miniaturization and thinness, which is also contrary to the development trend of electronic products to be thin and light. At present, the commonly used heat dissipation devices and heat dissipation systems have become unable to cope with a series of challenges such as the growing demand for heat dissipation and the miniaturization and thinness of products. Summary of the invention

[0003] The purpose of the present invention is to design a piezoelectric heat dissipation device that can be miniaturized and made thinner.

[0004] In order to achieve the above object, the present invention provides a piezoelectric heat dissipation device, comprising: a housing, a connecting component, and a piezoelectric component.

[0005] The piezoelectric assembly is arranged in the housing and connected to the housing through the connecting assembly. The piezoelectric assembly includes a first piezoelectric element, a diaphragm, a support frame and a jet plate connected in sequence along a first direction. The jet plate is provided with a jet hole. The diaphragm, the support frame and the jet plate enclose and define an energy conversion cavity that is connected to the jet hole.

[0006] The shell includes a shell body and an air outlet cover plate, the shell body is provided with an opening arranged along the first direction toward the jet plate, the air outlet cover plate is covered on the opening and is provided with an air outlet hole connected to the jet hole, and the shell body is also provided with an air inlet connected to the jet hole.

[0007] Further, one side of the connecting component is connected to the edge of the jet plate, and the other side thereof is connected to the air outlet cover plate, and the connecting component is provided with an air vent, and the air inlet is connected to the jet hole through the air vent; and / or,

[0008] One side of the connecting component is connected to the outer peripheral wall of the piezoelectric component along the first direction, and the other side thereof is connected to the inner peripheral wall of the shell body along the first direction. The connecting component is provided with a ventilation channel, and the air inlet is connected to the jet hole through the ventilation channel.

[0009] Furthermore, one side of the connecting component is connected to the edge of the diaphragm, and the other side thereof is connected to the inner wall of the shell body facing the diaphragm in the first direction.

[0010] Furthermore, it also includes a second piezoelectric element, which is arranged on the inner wall of the shell body facing the diaphragm in the first direction, and the movement direction of the second piezoelectric element is opposite to that of the first piezoelectric element.

[0011] Furthermore, the connecting component includes at least two elastic support members, the elastic support members connect the piezoelectric component and the shell, and the elastic support members are arranged at intervals along the circumference of the piezoelectric component.

[0012] Furthermore, it comprises a plurality of the piezoelectric components, and the piezoelectric components are arranged at intervals along a direction perpendicular to the first direction.

[0013] Furthermore, the jet plate is provided with a plurality of the jet holes, and the air outlet cover plate is provided with a plurality of the air outlet holes, wherein in the first direction, one air outlet hole is provided correspondingly to a plurality of the jet holes.

[0014] The present invention also provides a heat dissipation system, comprising one or more of the above-mentioned piezoelectric heat dissipation devices, each of the piezoelectric heat dissipation devices is arranged at intervals along a direction perpendicular to the first direction, and the outer peripheral walls of adjacent shell bodies are connected to each other, and the air inlet is opened on the side of the shell body away from the opening along the first direction.

[0015] Furthermore, it also includes a heating element, the air inlet is opened on the side of the shell body away from the opening along the first direction, and the heating element is arranged at intervals on the side of the piezoelectric heat dissipation device along the first direction toward the air outlet cover plate.

[0016] Furthermore, it also includes a heating element, a heat conducting plate, and a support member, wherein the heat conducting plate has a hot end and a cold end arranged opposite to each other along the second direction, the heating element abuts against the hot end, the piezoelectric heat dissipation device and the cold end are spaced apart along the first direction, one side of the support member is connected to the heat conducting plate, and the other side is connected to the edge of the piezoelectric heat dissipation device, an air outlet channel is formed between the air outlet cover plate, the support member and the heat conducting plate, an exhaust port is provided on one side of the support member close to the cold end along the second direction, and the exhaust port is connected to the air outlet channel; the air inlet is provided on a side of the shell body away from the opening along the first direction, or on a side of the shell body away from the exhaust port along the second direction;

[0017] The second direction is perpendicular to the first direction.

[0018] Compared with the prior art, the piezoelectric heat dissipation device and heat dissipation system of the embodiment of the present invention have the following beneficial effects:

[0019] The piezoelectric heat dissipation device and heat dissipation system of the embodiments of the present invention have a simple structure. The piezoelectric component serves as a basic driving unit, and is composed of a first piezoelectric element, a diaphragm, a supporting frame and a jet plate. It does not have the movable blade structure of a traditional fan, is easy to miniaturize, and can be used inside thinner electronic products. At the same time, the jet hole of the present application is connected with the air outlet, and the air outlet is connected with the jet hole, forming a good air inlet and outlet path, which can ensure the heat dissipation effect of the heat dissipation device and improve the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 is a schematic cross-sectional structural diagram of a piezoelectric heat dissipation device according to a first embodiment of the present invention;

[0021] Figure 2 is a schematic cross-sectional structure diagram of a piezoelectric heat dissipation device according to a first embodiment of the present invention in which a diaphragm is bent downward;

[0022] Figure 3 is a schematic cross-sectional structure diagram of a piezoelectric heat dissipation device according to a first embodiment of the present invention in which a diaphragm bends upward;

[0023] Figure 4 is an exploded schematic diagram of a piezoelectric heat dissipation device according to a first embodiment of the present invention;

[0024] Figure 5 is a schematic cross-sectional structural diagram of a piezoelectric heat dissipation device according to a second embodiment of the present invention;

[0025] Figure 6 is a schematic cross-sectional structural diagram of a piezoelectric heat dissipation device according to a third embodiment of the present invention;

[0026] Figure 7 is a schematic cross-sectional structural diagram of a piezoelectric heat dissipation device according to a fourth embodiment of the present invention;

[0027] Figure 8 is a schematic diagram of the internal top view of the piezoelectric heat dissipation device according to the fourth embodiment of the present invention;

[0028] Fig. 9 is a schematic cross-sectional structural diagram of a piezoelectric heat dissipation device according to a fifth embodiment of the present invention;

[0029] Fig.10 is a schematic diagram of the three-dimensional structure of a piezoelectric heat dissipation device according to a fifth embodiment of the present invention;

[0030] Fig.11 is a schematic diagram of the three-dimensional structure of a piezoelectric heat dissipation device according to a sixth embodiment of the present invention;

[0031] Fig.12is a schematic top view of the structure of a piezoelectric heat dissipation device according to a sixth embodiment of the present invention;

[0032] Fig.13 is a schematic top view of the structure of a piezoelectric heat dissipation device according to a seventh embodiment of the present invention;

[0033] Fig.14 is a schematic cross-sectional structural diagram of a heat dissipation system according to a first embodiment of the present invention;

[0034] Fig.15 is a schematic diagram of the three-dimensional structure of the heat dissipation system according to the first embodiment of the present invention;

[0035] Fig.16 is a schematic cross-sectional structural diagram of a heat dissipation system according to a second embodiment of the present invention;

[0036] Fig.17 is a schematic cross-sectional structural diagram of a heat dissipation system according to a third embodiment of the present invention;

[0037] Fig.18 FIG. 4 is a schematic cross-sectional view of a heat dissipation system according to a fourth embodiment of the present invention.

[0038] In the figure, 1, shell; 11, shell body; 111, opening; 112, air inlet; 12, air outlet cover; 121, air outlet; 2, connecting component; 21, ventilation channel; 22, elastic support member; 3, piezoelectric component; 30, energy conversion chamber; 31, first piezoelectric element; 32, diaphragm; 33, support frame; 34, jet plate; 341, jet hole; 4, second piezoelectric element; 5, heating element; 6, heat conducting plate; 61, hot end; 62, cold end; 7, support member; 70, air outlet channel; 71, exhaust port; x, first direction; y, second direction. DETAILED DESCRIPTION

[0039] The specific implementation of the present invention is further described in detail below in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0040] In the description of the present invention, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" used in the present invention to indicate the orientation or position relationship are based on the orientation or position relationship shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0041] In the description of the present invention, it should be understood that the terms "connected", "connected", "fixed" and the like used in the present invention should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or a welding connection; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0042] The present invention uses the terms "first", "second", etc. to describe various information, but these information should not be limited to these terms, and these terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present invention, "first" information may also be referred to as "second" information, and similarly, "second" information may also be referred to as "first" information.

[0043] Reference Figure 1 A piezoelectric heat dissipation device according to an embodiment of the present invention comprises: a housing 1, a connecting component 2, and a piezoelectric component 3.

[0044] The piezoelectric component 3 is arranged in the shell 1 and is connected to the shell 1 through the connecting component 2. The piezoelectric component 3 includes a first piezoelectric element 31, a diaphragm 32, a supporting frame 33 and a jet plate 34 which are connected in sequence along a first direction x. The jet plate 34 is provided with a jet hole 341. The diaphragm 32, the supporting frame 33 and the jet plate 34 enclose and define an energy conversion chamber 30 connected to the jet hole 341. The shell 1 includes a shell body 11 and an air outlet cover plate 12. The shell body 11 is provided with an opening 111 arranged along the first direction x toward the jet plate 34. The air outlet cover plate 12 is covered on the opening 111 and the air outlet cover plate 12 is provided with an air outlet hole 121 connected to the jet hole 341. The shell body 11 is also provided with an air inlet 112 connected to the jet hole 341.

[0045] Specifically, there can be one or more air inlets 112 arranged on the shell body 11. The air inlet 112 can be arranged in the middle, around or on the side wall of the shell body 11. The air inlet 112 can be rectangular, circular, conical or other structures. The diaphragm 32 can be made of metal films such as stainless steel, copper, aluminum alloy, titanium alloy, etc., or can be made of non-metallic films such as polyimide film, PET film, epoxy resin, rubber, etc., and its thickness range can be 0.01mm to 1mm. The first piezoelectric element 31 is fixed on the diaphragm 32. The first piezoelectric element 31 can be a separate piezoelectric crystal, which together with the diaphragm 32 constitutes a transducer that can bend and vibrate; it can also be a piezoelectric single crystal composed of a piezoelectric crystal and an elastic substrate; or a piezoelectric double crystal formed by attaching a piezoelectric crystal to both sides of an elastic substrate; it can also be a piezoelectric laminate formed by bonding two piezoelectric crystals that can bend and vibrate. The common point of the above schemes is that they can drive the diaphragm 32 to produce bending deformation vibration. The above piezoelectric crystal can be a multilayer piezoelectric ceramic or a single-layer piezoelectric ceramic. The first piezoelectric element 31 can be of any structural shape, such as circular, square, ring, etc.

[0046] The dimension from the diaphragm 32 to the jet plate 34 in the first direction x is the height H1 of the energy conversion chamber 30. In order to prevent the jet plate 34 from interfering with the vibration of the diaphragm 32, H1 needs to be greater than the maximum downward amplitude of the diaphragm 32. At the same time, the closer to the diaphragm 32, the higher the energy obtained by the gas, and the greater its initial velocity. In some embodiments, the size of H1 is 20um to 500um. In some embodiments, the size of H1 is 20um to 300um. In some embodiments, the size of H1 is 50um to 500um.

[0047] The jet holes 341 are evenly distributed on the jet plate 34. The jet holes 341 are generally circular, and may also be rectangular, waist-shaped, elliptical, etc. The diameter of a single jet hole 341 may be 5um to 500um. The number of jet holes 341 is determined by the total area of ​​the jet plate 34 and the area of ​​a single jet hole 341. The total opening area on the jet plate 34 accounts for 0.1% to 10%. In some embodiments, the number of jet holes 341 is 10 to 2000.

[0048] The air outlet holes 121 on the air outlet cover plate 12 are used for allowing gas to pass through the jet holes 341. Generally speaking, the air outlet holes 121 and the jet holes 341 correspond one to one, or they may not correspond one to one. For example, multiple air outlet holes 121 may be combined into one air outlet hole 121 for the gas from multiple jet holes 341 to pass through. Generally speaking, the size of the air outlet hole 121 is larger than the size of the jet hole 341, or it may be equal to or smaller than the size of the jet hole 341, and can be adjusted according to the required flow rate and noise level. In some embodiments, the opening area on the air outlet cover plate 12 accounts for 1% to 20%.

[0049] The distance between the jet plate 34 and the air outlet cover plate 12 is H2, which affects the size of the gas flow rate entering the energy conversion chamber 30 from the air inlet 112, and also affects the size of the gas flow rate taken away during the entrainment of the gas jet in the jet hole 341. The size of H2 can be adjusted according to the required flow rate and noise level. In some embodiments, the size of H2 is 0.1mm to 2mm. In some embodiments, the size of H2 is 0.1mm to 1mm. In some embodiments, the size of H2 is 0.5mm to 2mm.

[0050] Applying an AC excitation signal to the piezoelectric element causes the diaphragm 32 to vibrate at a high frequency, thereby doing work on the gas and driving the gas to flow in a directional manner. The frequency of the applied excitation signal is within the ultrasonic frequency range to avoid generating noise audible to the human ear. When the frequency of the excitation signal is the same as or close to the characteristic frequency of the piezoelectric element, the maximum flow rate can be obtained. The Helmholtz resonance frequency of the energy conversion chamber 30 can be designed to be close to the drive signal frequency to maximize the use of system energy. Of course, other frequencies can also be used.

[0051] In some improved schemes of the present application, one side of the connecting component 2 is connected to the edge of the jet plate 34, and the other side thereof is connected to the air outlet cover plate 12. A ventilation channel 21 is provided on the connecting component 2, and the air inlet 112 is connected to the jet hole 341 through the ventilation channel 21.

[0052] like Figure 1 As shown, in some improved solutions of the present application, one side of the connecting component 2 is connected to the edge of the jet plate 34, and the other side thereof is connected to the outlet cover plate 12. The connecting component 2 is provided with a ventilation channel 21, and the air inlet 112 is connected to the jet hole 341 through the ventilation channel 21. The piezoelectric component 3 is connected to the outlet cover plate 12 through the connecting component 2 to obtain support.

[0053] The first piezoelectric element 31 vibrates at high speed under an AC driving signal of a specific frequency, driving the diaphragm 32 to generate periodic bending deformation. Figure 2 As shown, the first piezoelectric element 31 bends downward, the gas in the energy conversion chamber 30 is compressed, and obtains an initial forward velocity. The gas moves outward through the jet hole 341 of the jet plate 34, generating a gas jet, forming a vortex pair and entraining nearby gas. The gas ejected from the jet hole 341 forms a gas jet, entrains the surrounding gas and continues to move forward, and is ejected through the gas outlet 121.

[0054] like Figure 3As shown, the first piezoelectric element 31 bends upward, the pressure in the energy conversion chamber 30 decreases, and the external gas enters the energy conversion chamber 30 from the air inlet 112 through the jet hole 341. Due to inertia, the gas previously ejected from the energy conversion chamber 30 has passed through the air outlet 121 and is far away from the jet hole 341. Combined with the blocking effect of the air outlet cover 12, only a small part of the gas will flow back at this time, and the rest of the gas entering the energy conversion chamber 30 mainly enters from the air inlet 112 and enters through the ventilation channel 21 of the connecting component 2. Repeat the cycle continuously Figure 2 and Figure 3 By means of the process, the cooling gas can be continuously sucked in from the air inlet 112 and finally ejected from the air outlet 121 .

[0055] Figure 4 This is a three-dimensional diagram of a specific implementation scheme of the first embodiment of the present application: Figure 4 As shown, from top to bottom are the shell body 11, the first piezoelectric element 31, the diaphragm 32, the support frame 33, the jet plate 34, the connecting assembly 2 and the air outlet cover plate 12, and the various components are fixed by welding or adhesive.

[0056] The shell body 11 is made of metal or plastic and has an air inlet 112 thereon.

[0057] The diaphragm 32 is a rectangular film, which is rectangular in the figure, but can also be circular or other shapes. The first piezoelectric element 31 is bonded and fixed in the middle of the diaphragm 32. An alternating driving signal is applied to the first piezoelectric element 31 to generate bending vibration, thereby driving the diaphragm 32 to vibrate together. The diaphragm 32 and the jet plate 34 are fixed on the support frame 33 around, and the middle of the support frame 33 is an air-avoiding area to form an energy conversion chamber 30.

[0058] The jet plate 34 has a plurality of jet holes 341 evenly distributed thereon, and the distribution area of ​​the jet holes 341 is within the hollow area of ​​the energy conversion chamber 30 .

[0059] The other side of the jet plate 34 is fixed on the connecting component 2, and a vent channel 21 for gas to enter is left around the connecting component 2. The outlet cover plate 12 is located on the other side of the connecting component 2, and the piezoelectric component 3 is fixed on the outlet cover plate 12 through the connecting component 2.

[0060] This figure shows one embodiment of the present application. Of course, there may be other specific implementations.

[0061] like Figure 7As shown, in some improved schemes of the present application, one side of the connecting component 2 is connected to the outer peripheral wall of the piezoelectric component 3 along the first direction x, and the other side thereof is connected to the inner peripheral wall of the shell body 11 along the first direction x, and a ventilation channel 21 is provided on the connecting component 2, and the air inlet 112 is connected to the jet hole 341 through the ventilation channel 21.

[0062] In this embodiment, the basic structure of the piezoelectric component 3 is the same as that of the above embodiment. The entire piezoelectric heat dissipation device is composed of a shell 1, a first piezoelectric element 31, a diaphragm 32, a support frame 33, a jet plate 34 and an air outlet cover plate 12. The piezoelectric component 3 is connected and fixed to the side wall of the shell body 11 through a connecting component 2.

[0063] like Figure 5 As shown, in some improved solutions of the present application, one side of the connecting component 2 is connected to the edge of the diaphragm 32, and the other side thereof is connected to the inner wall of the shell body 11 in the first direction x facing the diaphragm 32. That is, in the second embodiment, the piezoelectric component 3 is fixed to the top of the shell body 11 through the connecting component 2 to form a suspended structure. When the cooling gas flows from the air inlet 112 into the area between the jet plate 34 and the air outlet cover plate 12, it does not need to pass through the connecting component 2, and the ventilation channel 21 is larger than the ventilation channel 21 in other embodiments, so there will be a larger gas flow.

[0064] In addition, in the second embodiment, the top of the shell body 11, the connecting component 2, and the diaphragm 32 form a resonance cavity. The Helmholtz resonance frequency of the resonance cavity can be designed to be the same as or close to the driving signal frequency, so that the diaphragm 32 resonates with it, which can increase the amplitude and increase the flow rate of the heat dissipation device.

[0065] In some improved schemes of the present application, a second piezoelectric element 4 is further included, and the second piezoelectric element 4 is arranged on the inner wall of the shell body 11 facing the diaphragm 32 in the first direction x, and the movement direction of the second piezoelectric element 4 is opposite to that of the first piezoelectric element 31. This embodiment is an improvement of the second embodiment: the second piezoelectric element 4 is fixed on the top structure of the shell body 11, and a driving signal is applied. The second piezoelectric element 4 can drive the top of the shell body 11 to produce bending vibration similar to the diaphragm 32, and the same frequency of driving signals are applied to the two to make them vibrate in opposite directions, and the two resonate. When they vibrate, the forces applied to the connecting component 2 cancel each other, which can increase the amplitude of the diaphragm 32, thereby increasing the flow rate of the heat dissipation device.

[0066] In some improved schemes of the present application, the connecting component 2 includes at least two elastic supports 22, and the elastic supports 22 connect the piezoelectric component 3 and the shell 1, and each of the elastic supports 22 is arranged at intervals along the circumference of the piezoelectric component 3. The piezoelectric component 3 is connected and fixed to the shell 1 through multiple elastic supports 22. Because when the piezoelectric heat dissipation device is working, the vibration of the first piezoelectric element 31 will be transmitted to the air outlet cover plate 12 and the shell body 11 through the connecting component 2, driving the entire shell 1 to vibrate, so part of the energy will be lost and the efficiency will be reduced. In this embodiment, the piezoelectric component 3 is connected and fixed by the elastic support 22, which can play a shock-absorbing role when the heat dissipation device is working, and can minimize the vibration transmitted to the shell 1 when the piezoelectric component 3 is working, thereby effectively reducing energy loss and improving heat dissipation efficiency. In particular, when the piezoelectric component 3 is connected to the inner circumferential wall of the shell body 11 through the connecting component 2, the shock-absorbing effect is more obvious.

[0067] like Figure 8 As shown, the elastic support member 22 may be a U-shaped spring sheet. Of course, elastic support members 22 of other structures are also used in this solution, which can also achieve the effect of reducing the vibration of the external structure of the heat dissipation device and improving the heat dissipation efficiency.

[0068] In some improved solutions of the present application, a plurality of the piezoelectric components 3 are included, and the piezoelectric components 3 are arranged at intervals along a direction perpendicular to the first direction x.

[0069] like Fig. 9 As shown, the piezoelectric heat dissipation device of the fifth embodiment of the present application has a shell 1 composed of a shell body 11 and an air outlet cover plate 12. Inside the shell body 11, there are multiple piezoelectric components 3. Each piezoelectric component 3 has the same structure as the piezoelectric component 3 in the first embodiment, and is composed of a first piezoelectric element 31, a diaphragm 32, a support frame 33 and a jet plate 34.

[0070] Fig.10 This is a three-dimensional diagram of the fifth embodiment, and it can be seen that four piezoelectric components 3 are arranged inside the shell body 11. This embodiment can integrate more energy conversion structures in a limited cavity, so it has a higher flow rate than the first embodiment. In addition, the area of ​​the air outlet 121 of this embodiment is increased, and the heat dissipation area is increased, which is suitable for occasions requiring large flow and large heat dissipation area.

[0071] In other specific embodiments, other numbers of piezoelectric components 3 may be arranged in the housing 1 of a piezoelectric heat dissipation device, such as 2, 8, etc.

[0072] In some improved schemes of the present application, a plurality of the jet holes 341 are opened on the jet plate 34, and a plurality of the outlet holes 121 are opened on the outlet cover plate 12, wherein in the first direction x, one outlet hole 121 is arranged corresponding to a plurality of the jet holes 341.

[0073] like Fig.11 As shown in the sixth embodiment, the air outlet holes 121 on the air outlet cover plate 12 are not circular, nor do they correspond one-to-one with the jet holes 341 on the jet plate 34, but are arc-shaped strip holes. Fig.12 As shown in , each strip-shaped air outlet 121 may correspond to three jet holes 341, allowing the gas jets from the three jet holes 341 to pass through. In the first embodiment, when the gas ejected from the jet hole 341 passes through the small hole air outlet 121, the speed and pressure change dramatically, causing the surrounding air to vibrate and generate airflow noise. The design in this embodiment can increase the cross-sectional area of ​​the air outlet 121, reduce the gas flow rate change rate, and thus reduce the noise generated when the airflow passes through.

[0074] Apart from Fig.12 In addition to the arc-shaped strip holes shown in the figure, Fig.13 As shown, the seventh embodiment uses a larger circular air outlet hole 121. Each air outlet hole 121 allows the gas jets of four jet holes 341 to pass through, which can also reduce the airflow noise.

[0075] Of course, the arrangement of the air outlet 121 is not limited to the above two methods, and other methods that can achieve similar effects are feasible, and the corresponding solution can be selected according to actual needs.

[0076] A heat dissipation system according to an embodiment of the present invention comprises one or more of the above-mentioned piezoelectric heat dissipation devices, wherein the piezoelectric heat dissipation devices are arranged at intervals along a direction perpendicular to the first direction x, and the outer peripheral walls of adjacent shell bodies 11 are connected to each other, and the air inlet 112 is opened on the side of the shell body 11 away from the opening 111 along the first direction x.

[0077] Fig.14 and Fig.15 A heat dissipation system including multiple piezoelectric heat dissipation devices is described.

[0078] like Fig.14 As shown, each piezoelectric heat dissipation device has the same structure as the first embodiment of the piezoelectric heat dissipation device. Since the flow rate and heat dissipation area of ​​the entire heat dissipation system are the cumulative superposition of the flow rate and heat dissipation area of ​​the piezoelectric heat dissipation device, its theoretical flow rate and heat dissipation area can be designed according to actual needs. It is suitable for occasions that require large flow rate and large heat dissipation area but cannot be met by a single piezoelectric heat dissipation device. Moreover, its expansion method is simple and it is very easy to use.

[0079] In some improved schemes of the present application, a heating element 5 is also included, the air inlet 112 is opened on the side of the shell body 11 away from the opening 111 along the first direction x, and the heating element 5 is arranged at intervals on the side of the piezoelectric heat dissipation device along the first direction x toward the air outlet cover plate 12.

[0080] like Fig.16 As shown, the piezoelectric heat dissipation device can be directly fixed on the surface of the heating element 5, wherein the air outlet 121 of the piezoelectric heat dissipation device is close to one side of the heating element 5, and there is a certain distance between the air outlet 121 and the surface of the heating element 5, and an air outlet channel 70 is reserved between the two.

[0081] The air inlet 112 of the piezoelectric heat dissipation device is arranged away from the heating element 5. When the piezoelectric heat dissipation device is working, it can continuously inhale cooling gas from the air inlet 112 and spray it onto the heating element 5 from the air outlet 121. Through heat exchange, the cooling air becomes hot and is finally discharged from the air outlet channel 70, taking away a large amount of heat, thereby achieving a heat dissipation effect.

[0082] In some improved schemes of the present application, it also includes a heating element 5, a heat conducting plate 6, and a support member 7. The heat conducting plate 6 has a hot end 61 and a cold end 62 that are relatively arranged along the second direction y. The heating element 5 abuts against the hot end 61. The piezoelectric heat dissipation device and the cold end 62 are spaced apart along the first direction x. One side of the support member 7 is connected to the heat conducting plate 6, and the other side is connected to the edge of the piezoelectric heat dissipation device. The air outlet cover plate 12, the support member 7 and the heat conducting plate 6 form an air outlet channel 70. The support member 7 is provided with an exhaust port 71 on one side close to the cold end 62 along the second direction y, and the exhaust port 71 is connected to the air outlet channel 70; the air inlet 112 is opened on the side of the shell body 11 that is away from the opening 111 along the first direction x, or on the side of the shell body 11 that is away from the exhaust port 71 along the second direction y, wherein the second direction y is perpendicular to the first direction x.

[0083] like Fig.17As shown, in the third embodiment of the present application, one end of the heating element 5 and the heat conducting plate 6 are fixed, and the other end of the piezoelectric heat dissipation device and the heat conducting plate 6 are fixed. At this time, the temperature of this end of the heating element 5 is higher, which is the hot end 61, and the temperature of this end of the piezoelectric heat dissipation device is lower, which is the cold end 62. Through heat conduction, the heat of the hot end 61 flows continuously to the cold end 62. A shell is set as an electronic product shell to cover the heat dissipation system components, and an air inlet port and an air outlet port are opened on the shell. The piezoelectric heat dissipation device continuously inhales the cooling gas through the air inlet port and the air inlet 112, sprays it to the cold end 62 of the heat conducting plate 6, and finally discharges it from the air outlet port. This process takes away a lot of heat, so the temperature of the cold end 62 of the heat conducting plate 6 is reduced, and heat is absorbed from the hot end 61, so that the temperature of the hot end 61 is reduced, and finally the temperature of the heating element 5 is reduced. This process is continuously circulated to achieve the effect of heat dissipation for electronic products.

[0084] Since the heating element 5 and the piezoelectric heat sink are fixed side by side on the heat conducting plate 6, the space in the vertical direction can be greatly saved. The piezoelectric heat sink used in this embodiment has a compact structure, and its size and thickness are much smaller than that of a traditional fan, and are similar to the size of a conventional chip. Therefore, in theory, the thickness of the electronic product does not need to be increased, and a good heat dissipation effect can be achieved at the same time.

[0085] Fig.18 In the heat dissipation method and Fig.17 The difference is that the air inlet 112 of the piezoelectric heat sink is opened on the side, and there is almost no need to reserve an air flow channel above it, so it can be used in lighter and thinner electronic products.

[0086] In summary, the embodiments of the present invention provide a piezoelectric heat dissipation device and a heat dissipation system, which have the following advantages:

[0087] 1. Simple structure, easy to miniaturize: The piezoelectric component 3 serves as a basic driving unit, and the energy conversion chamber 30 is composed of a first piezoelectric element 31, a diaphragm 32, a support frame 33 and a jet plate 34 to jet the air outlet cover plate 12. It has no movable blade structure of a traditional fan, is easy to miniaturize, and can be used in thinner electronic products.

[0088] 2. The outlet distribution area is large, and the heat dissipation effect and heat dissipation uniformity are good: the traditional synthetic jet plate 34 generally only has holes in the middle area, the jet area is concentrated, the heat dissipation area is small, and the heat dissipation is uneven. The present invention uses piezoelectric elements to do work on the gas, so that the gas obtains an initial forward velocity, and generates a gas jet through the jet hole 341. Holes can be evenly opened in the entire area of ​​the jet plate 34, which greatly increases the heat dissipation area, improves the heat dissipation effect, and ensures uniform heat dissipation.

[0089] 3. Large flow rate and high energy utilization rate: The conventional synthetic jet plate 34 generally only has one or several jet holes 341 in the middle area, and the overall efficiency is low. The present invention arranges a large number of jet holes 341 in the entire area of ​​the jet plate 34, fully utilizing the system energy, with high energy utilization rate and good heat dissipation effect.

[0090] 4. High back pressure and high heat dissipation efficiency: The present invention uses piezoelectric elements to work on the gas and drive the gas to flow in a directional manner. The back pressure generated is more than ten times that of traditional heat dissipation fans, and the heat dissipation efficiency is higher;

[0091] 5. Reasonable structure: The structural design of the heat dissipation system can realize the suction of cooling gas from the cooling end and the ejection of gas from the other end away from the cooling end to the heating element 5 for heat dissipation. The heat exchange efficiency is high and the heat dissipation effect can be further improved.

[0092] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principles of the present invention. These improvements and substitutions should also be regarded as the scope of protection of the present invention.

Claims

1. A piezoelectric heat dissipation device, characterized in that: include: Housing, connecting components, and piezoelectric components, The piezoelectric assembly is arranged in the housing and connected to the housing through the connecting assembly. The piezoelectric assembly includes a first piezoelectric element, a diaphragm, a support frame and a jet plate connected in sequence along a first direction. The jet plate is provided with a jet hole. The diaphragm, the support frame and the jet plate enclose and define an energy conversion cavity that is connected to the jet hole. The shell includes a shell body and an air outlet cover plate, the shell body is provided with an opening arranged along the first direction toward the jet plate, the air outlet cover plate is covered on the opening and is provided with an air outlet hole connected to the jet hole, and the shell body is also provided with an air inlet connected to the jet hole.

2. The piezoelectric heat sink according to claim 1, characterized in that: One side of the connecting component is connected to the edge of the jet plate, and the other side thereof is connected to the air outlet cover plate, and a ventilation channel is provided on the connecting component, and the air inlet is connected to the jet hole through the ventilation channel; and / or, One side of the connecting component is connected to the outer peripheral wall of the piezoelectric component along the first direction, and the other side thereof is connected to the inner peripheral wall of the shell body along the first direction. The connecting component is provided with a ventilation channel, and the air inlet is connected to the jet hole through the ventilation channel.

3. The piezoelectric heat sink according to claim 1, wherein: One side of the connecting component is connected to the edge of the diaphragm, and the other side of the connecting component is connected to the inner wall of the shell body facing the diaphragm in the first direction.

4. The piezoelectric heat sink according to claim 3, characterized in that: It also includes a second piezoelectric element, which is arranged on the inner wall of the shell body facing the diaphragm in the first direction, and the movement direction of the second piezoelectric element is opposite to that of the first piezoelectric element.

5. The piezoelectric heat sink according to claim 1, wherein: The connecting component includes at least two elastic supporting members, which connect the piezoelectric component and the shell, and the elastic supporting members are arranged at intervals along the circumference of the piezoelectric component.

6. The piezoelectric heat sink according to claim 1, wherein: It includes a plurality of piezoelectric components, and each of the piezoelectric components is arranged at intervals along a direction perpendicular to the first direction.

7. The piezoelectric heat sink according to claim 1, wherein: The jet plate is provided with a plurality of the jet holes, and the air outlet cover plate is provided with a plurality of the air outlet holes, wherein in the first direction, one air outlet hole is arranged correspondingly to a plurality of the jet holes.

8. A heat dissipation system, characterized in that: It comprises one or more piezoelectric heat dissipation devices as described in any one of claims 1 to 7, each of the piezoelectric heat dissipation devices is arranged at intervals in a direction perpendicular to the first direction, and the outer peripheral walls of adjacent shell bodies are connected to each other, and the air inlet is opened on the side of the shell body away from the opening along the first direction.

9. The heat dissipation system according to claim 8, characterized in that: It also includes a heating element, the air inlet is opened on the side of the shell body away from the opening along the first direction, and the heating element is arranged at intervals on the side of the piezoelectric heat dissipation device along the first direction toward the air outlet cover plate.

10. The heat dissipation system according to claim 8, characterized in that: It also includes a heating element, a heat conducting plate, and a support member, wherein the heat conducting plate has a hot end and a cold end arranged opposite to each other along a second direction, the heating element abuts against the hot end, the piezoelectric heat dissipation device and the cold end are spaced apart along the first direction, one side of the support member is connected to the heat conducting plate, and the other side is connected to the edge of the piezoelectric heat dissipation device, an air outlet channel is formed between the air outlet cover plate, the support member and the heat conducting plate, an exhaust port is provided on one side of the support member close to the cold end along the second direction, and the exhaust port is connected to the air outlet channel; the air inlet is provided on a side of the shell body away from the opening along the first direction, or on a side of the shell body away from the exhaust port along the second direction; The second direction is perpendicular to the first direction.

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