Coupler and radio frequency module

Abstract

The invention provides a coupler and a radio frequency module, and relates to the technical field of radio frequency. In the coupler, a target signal wire is additionally arranged between a main signal path wire and a coupling path wire, at least one end of the target signal wire is grounded through an impedance adjustable network, and the to-ground impedance value of the impedance adjustable network is adjustable. When the earth impedance value of the impedance adjustable network changes, the electromagnetic coupling effect between the main signal path wire and the coupling path wire can be influenced, so that the coupling coefficient adjustable characteristic of the coupler is realized, the problem of coupling coefficient imbalance existing in a broadband is solved, and the coupling efficiency of the coupler is improved. The coupler has a relatively consistent coupling coefficient for different sub-bands in the whole application frequency band so as to better realize power calibration.

Description

Technical Field

[0001] The present application relates to the field of radio frequency technology, and in particular to a coupler and a radio frequency module. Background Art

[0002] In the current design of RF front-end LPAMID, LPMIF and other modules, the coupler used to detect the output power of the power amplifier is usually integrated into the chip, and the coupler is implemented through the metal layer of the back-end process. With the increase of the bandwidth of the 5G NR frequency band, due to the characteristics of the coupler itself, the coupling coefficient is unbalanced in the broadband. As the frequency increases, the coupling coefficient gradually decreases, and the coupling coefficient of the high sideband and the low sideband differs greatly. Summary of the invention

[0003] In view of the above problems, the present application provides a coupler and a radio frequency module, wherein the coupling coefficient of the coupler is adjustable to solve the problem of unbalanced coupling coefficient in broadband, so as to achieve a relatively consistent coupling coefficient for different sub-bands in the entire application frequency band, so as to better realize power calibration. The specific scheme is as follows:

[0004] A first aspect of the present application provides a coupler, the coupler comprising a main signal path routing, a coupling path routing, and a target signal routing located between the main signal path routing and the coupling path routing;

[0005] At least one end of the target signal routing line is grounded through an adjustable impedance network; the impedance value to ground of the adjustable impedance network is adjustable.

[0006] Preferably, in the above-mentioned coupler, the coupler includes a first adjustable impedance network and a second adjustable impedance network; the first end of the target signal routing is grounded through the first adjustable impedance network, and the second end of the target signal routing is grounded through the second adjustable impedance network.

[0007] Preferably, in the above coupler, the adjustable impedance network includes a plurality of parallel branches, one end of which is electrically connected to the target signal line and the other end of which is grounded;

[0008] The branch includes a target component and a switch connected in series in sequence; the target component is a resistor, a capacitor or an inductor.

[0009] Preferably, in the above coupler, the adjustable impedance network includes a plurality of parallel branches, one end of which is electrically connected to the target signal line and the other end of which is grounded;

[0010] The branches include target components and switches connected in series in sequence; the target components on a part of the branches are first target components, and the first target component is any one of a resistor, a capacitor and an inductor; the target components on another part of the branches are second target components, and the second target component is any one of the remaining two of the resistor, the capacitor and the inductor except the first target component.

[0011] Preferably, in the above coupler, the adjustable impedance network includes a plurality of parallel branches, one end of which is electrically connected to the target signal line and the other end of which is grounded;

[0012] The branch includes a target component and a switch connected in series in sequence; the branch is divided into three parts, the target component on the first part of the branch is a resistor, the target component on the second part of the branch is a capacitor, and the target component on the third part of the branch is an inductor.

[0013] Preferably, in the above coupler, the working state of the adjustable impedance network is controlled by digital control to adjust the impedance value to ground of the adjustable impedance network.

[0014] Preferably, in the above coupler, the main signal path routing and the coupling path routing are located on the first layer, and the target signal routing is located on the second layer;

[0015] The first layer and the second layer are different metal layers.

[0016] Preferably, in the above coupler, the main signal path routing, the coupling path routing and the target signal routing are located in the same layer.

[0017] Preferably, in the above coupler, the main signal path routing is located on the first layer, and the coupling path routing and the target signal routing are located on the second layer;

[0018] The first layer and the second layer are different metal layers.

[0019] Preferably, in the above coupler, the target signal routing line includes a first routing line and a second routing line; the first routing line and the second routing line are electrically connected via a conductive component;

[0020] The first routing line and the main signal path routing line are located on the first layer, and the coupling path routing line and the second routing line are located on the second layer; the first layer and the second layer are different metal layers.

[0021] A second aspect of the present application provides a radio frequency module, which includes the coupler described in any one of the above items.

[0022] By means of the above technical solution, the present application provides a coupler and a radio frequency module. In the coupler, a target signal line is newly provided between the main signal path line and the coupling path line, and at least one end of the target signal line is grounded through an adjustable impedance network, and the impedance value to ground of the adjustable impedance network is adjustable. When the impedance value to ground of the adjustable impedance network changes, it will affect the electromagnetic coupling effect between the main signal path line and the coupling path line, thereby realizing the adjustable coupling coefficient characteristic of the coupler, solving the problem of unbalanced coupling coefficient in broadband, and realizing that the coupler has a more consistent coupling coefficient for different sub-bands in the entire application frequency band, so as to better realize power calibration. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The above and other features, advantages and aspects of the embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. Throughout the accompanying drawings, the same or similar reference numerals represent the same or similar elements. It should be understood that the drawings are schematic and the originals and elements are not necessarily drawn to scale.

[0024] Figure 1 A schematic diagram of an equivalent circuit of a coupler provided by an embodiment of the present invention;

[0025] Figure 2 A schematic diagram of the structure of a coupler provided in an embodiment of the present invention;

[0026] Figure 3 A schematic diagram of an equivalent circuit of another coupler provided by an embodiment of the present invention;

[0027] Figure 4 A schematic diagram of an equivalent circuit of another coupler provided by an embodiment of the present invention;

[0028] Figure 5 A schematic diagram of the structure of an impedance adjustable network provided by an embodiment of the present invention;

[0029] Figure 6 A schematic diagram of the structure of another impedance adjustable network provided by an embodiment of the present invention;

[0030] Figure 7 A schematic diagram of the structure of another impedance adjustable network provided by an embodiment of the present invention;

[0031] Figure 8 A schematic diagram of the structure of another impedance adjustable network provided by an embodiment of the present invention;

[0032] Fig. 9 A schematic diagram of the structure of another impedance adjustable network provided by an embodiment of the present invention;

[0033] Fig.10A schematic diagram of the structure of another impedance adjustable network provided by an embodiment of the present invention;

[0034] Fig.11 A schematic diagram of the structure of another impedance adjustable network provided by an embodiment of the present invention;

[0035] Fig.12 A schematic diagram of the structure of another coupler provided in an embodiment of the present invention;

[0036] Fig.13 A schematic diagram of the structure of another coupler provided in an embodiment of the present invention;

[0037] Fig.14 A schematic diagram of the structure of another coupler provided in an embodiment of the present invention;

[0038] Fig.15 A schematic diagram of a change in a coupling coefficient of a coupler provided in an embodiment of the present invention;

[0039] Fig.16 A schematic diagram of the structure of a 5GL-FEM radio frequency module provided in an embodiment of the present invention;

[0040] Fig.17 A schematic diagram of the structure of a 5GL-PAMiF radio frequency module provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0041] The embodiments of the present application are described below in conjunction with the drawings in the embodiments of the present application. The terms used in the implementation method section of the present application are only used to explain the specific embodiments of the present application, and are not intended to limit the present application. It is known to those of ordinary skill in the art that with the development of technology and the emergence of new scenarios, the technical solutions provided in the embodiments of the present application are also applicable to similar technical problems. It should be noted that the directional words appearing in the present invention are based on the relative position relationship shown in the drawings and cannot be used as an absolute limitation on the present application.

[0042] Before describing the technical solution of the present application, some technical terms involved in the field are explained here first, as follows:

[0043] RF chip: RF (Radio Frequency, RF for short), also known as radio frequency, wireless radio frequency, high frequency, etc., refers to the frequency range of 300kHz-300GHz. RF technology is closely related to contemporary wireless communication technology. Typical RF devices include filters, duplexers, multiplexers, power amplifiers, low noise amplifiers (LNA), RF switches, monolithic microwave integrated chips (MICC) and RF modules with integrated functions, etc. Furthermore, 5G refers to the fifth generation of mobile communication networks, which have fast transmission speeds and stable transmission signals, and are used in the field of high-frequency transmission. Currently, there are two major frequency ranges defined, FR1 (450MHz-6GHz, commonly known as Sub-6GHz) and FR2 (24.25GHz-52.6GHz, commonly known as the millimeter wave frequency band); some typical sub-bands include n77 (3300-4200MHz), n78 (3300-3800MHz) and n79 (4400-5000MHz). Related technical applications have put forward higher requirements for cost (requiring multiple chips or discrete devices), volume (requiring extremely high integration and smaller space occupation), process (mass production performance and design performance, yield, etc.), modularization (reducing debugging costs, etc.), bandwidth, performance, etc., which distinguishes it from previous RF designs. RF chips are an important branch of the application of RF technology in the semiconductor field. They are related fields that use semiconductor technology to process and manufacture RF integrated circuits, which are different from the technical solutions of discrete devices.

[0044] RF module: that is, RF front-end module (the back end is often discrete devices). Previously, since discrete devices can also meet the needs of manufacturers, there was a clear distinction between high-end equipment using modules and low-end equipment using discrete devices. Modules can provide higher integration and high performance. In the 5G era, due to the sharp increase in the number of RF components in a single product, the area occupied by discrete solutions exceeds the acceptable limit, and the debugging time will be longer. Therefore, modularization has become the development trend of the mobile communication market. Modules are divided into FEMiD (integrated switches, filters and duplexers), PAMiD (integrated multi-mode multi-band PA and FEMiD), LPAMiD (PAMiD plus LNA), DiFEM (RF switches and filters), LFEM (RF switches, low noise amplifiers and filters), etc. Among them, the design and manufacturing level of filters and other devices is the basis for module product development.

[0045] Among them, the role of the RF switch is to connect any one or several of the multiple RF signals through control logic to achieve switching of different signal paths, including switching between reception and transmission, switching between different frequency bands, etc. The filter is the core component of the RF module. At present, the most mainstream implementation methods of RF filters are SAW (Surface Acoustic Wave) filters and BAW (Bulk Acoustic Wave) filters. SAW filter is a special filtering device made by using the piezoelectric effect and the physical characteristics of surface acoustic wave propagation. It has the characteristics of excellent frequency selectivity (optional frequency range 10MHz-3GHz), small input and output impedance error, small transmission loss, and good anti-electromagnetic interference performance. BAW filter is different from SAW filter. The sound waves in BAW filter propagate vertically, and the metal embedded on the top and bottom sides of the quartz substrate excites the sound waves, causing the sound waves to bounce from the top surface to the bottom to form standing sound waves.

[0046] Based on the content recorded in the background technology, in the current design of RF front-end LPAMID, LPMIF and other modules, the coupler used to realize the power amplifier output power detection is usually integrated inside the chip, and the coupler is realized through the metal layer of the back-end process. With the increase of the bandwidth of the 5G NR frequency band, due to the characteristics of the coupler itself, the coupling coefficient is unbalanced in the broadband. As the frequency increases, the coupling coefficient gradually decreases, and the coupling coefficient of the high sideband and the low sideband differs greatly.

[0047] Based on this, a coupler and a radio frequency module are provided in the present application, wherein the coupling coefficient of the coupler is adjustable to solve the problem of unbalanced coupling coefficient in a wide band, so that the coupler has a relatively consistent coupling coefficient for different sub-bands in the entire application frequency band, so as to better realize power calibration. In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0048] refer to Figure 1 , Figure 1 Schematic diagram of an equivalent circuit of a coupler provided in an embodiment of the present invention; Figure 2 , Figure 2 A schematic diagram of the structure of a coupler provided by an embodiment of the present invention. The coupler provided by an embodiment of the present invention comprises: a main signal path line 11, a coupling path line 12, and a target signal line 13 located between the main signal path line 11 and the coupling path line 12.

[0049] At least one end of the target signal wiring 13 is grounded through an adjustable impedance network ZL; the impedance value to ground of the adjustable impedance network ZL is adjustable.

[0050] Specifically, in the embodiment of the present invention, the coupler is a six-port coupler, and the two ends of the main signal path line 11, the two ends of the coupling path line 12, and the two ends of the target signal line 13 constitute the six ports of the coupler (i.e. Figure 1 and Figure 2 1 to 6 shown in FIG. 1 ). The target signal line 13 and the main signal path line 11 and the coupling path line 12 will generate a certain amount of electrical coupling and magnetic coupling. Since at least one end of the target signal line 13 is grounded through the adjustable impedance network ZL, when the impedance value to ground of the adjustable impedance network ZL changes, it will affect the electromagnetic coupling effect between the main signal path line 11 and the coupling path line 12, thereby realizing the adjustable coupling coefficient characteristic of the coupler.

[0051] For a coupler with an adjustable coupling coefficient, the problem of unbalanced coupling coefficient in a broadband can be solved, so that the coupler has a relatively consistent coupling coefficient for different sub-bands in the entire application frequency band, so as to better realize power calibration.

[0052] In an optional embodiment of the present invention, reference Figure 3 , Figure 3 This is a schematic diagram of an equivalent circuit of another coupler provided by an embodiment of the present invention. In the coupler provided by an embodiment of the present invention, one end of the main signal path line 11 is the input end 1, and the other end of the main signal path line 11 is the output end 2; one end of the coupling path line 12 is the isolation end 3, and the other end of the coupling path line is the coupling end 4. Among them, the input end 1 and the isolation end 3 are located on the same side, and the output end 2 and the coupling end 4 are located on the same side.

[0053] The target signal line 13 includes a first end 5 and a second end 6. The first end 5, input end 1 and isolation end 3 of the target signal line 13 are located on the same side; the second end 6, output end 2 and coupling end 4 of the target signal line 13 are located on the same side.

[0054] Specifically, in the embodiments of the present invention, Figure 1 As shown, the first end 5 of the target signal line 13 is grounded through the impedance adjustable network ZL. Figure 3 As shown, the second end 6 of the target signal line 13 is grounded through the adjustable impedance network ZL. Whether the first end 5 of the target signal line 13 or the second end 6 of the target signal line 13 is grounded through the adjustable impedance network ZL, when the impedance value to ground of the adjustable impedance network ZL changes, the electromagnetic coupling effect between the main signal path line 11 and the coupling path line 12 will be affected, thereby realizing the adjustable coupling coefficient characteristic of the coupler. Therefore, in the embodiment of the present invention, the position of the adjustable impedance network ZL can be reasonably planned based on the consideration of factors such as the structure and layout of the actual coupler, so as to achieve the purpose of simplifying the process difficulty.

[0055] In an optional embodiment of the present invention, reference Figure 4 , Figure 4 Schematic diagram of an equivalent circuit of another coupler provided in an embodiment of the present invention. The coupler provided in an embodiment of the present invention comprises a first adjustable impedance network ZL1 and a second adjustable impedance network ZL2, the first end 5 of the target signal line 13 is grounded through the first adjustable impedance network ZL1, and the second end 6 of the target signal line 13 is grounded through the second adjustable impedance network ZL2.

[0056] Specifically, in the embodiments of the present invention, Figure 4 As shown, the first end 5 and the second end 6 of the target signal line 13 are grounded through their respective corresponding adjustable impedance networks ZL. In other words, the coupler provided in the embodiment of the present invention includes two adjustable impedance networks ZL. Under this structure, it is obvious that the impedance value to ground of the first adjustable impedance network ZL1 and the impedance value to ground of the second adjustable impedance network ZL2 can be adjusted at the same time, so as to achieve a wider range of adjustment of the impedance value to ground, and thus the electromagnetic coupling effect between the main signal path line 11 and the coupling path line 12 can be more finely controlled, so as to achieve the fine adjustable characteristics of the coupling coefficient of the coupler.

[0057] It should be noted that based on Figure 4 For the coupler shown, the impedance value to ground of any one of the first impedance adjustable network ZL1 and the second impedance adjustable network ZL2 can also be adjusted. For example, in a certain scenario, the impedance value to ground of the first impedance adjustable network ZL1 is adjusted, and the impedance value to ground of the second impedance adjustable network ZL2 is not adjusted. It is not necessary to adjust the impedance values ​​to ground of the first impedance adjustable network ZL1 and the second impedance adjustable network ZL2 at the same time in any scenario. The specific adjustment method can be determined according to actual needs and is not limited in the embodiments of the present invention. This can also indirectly illustrate that when the coupler includes two impedance adjustable networks ZL, it has the advantages of more flexible adjustment and diversified adjustment.

[0058] In an optional embodiment of the present invention, reference Figure 5 , Figure 5 A schematic diagram of a structure of an impedance adjustable network provided by an embodiment of the present invention, referring to Figure 6 , Figure 6 A schematic diagram of another impedance adjustable network provided in an embodiment of the present invention, referring to Figure 7 , Figure 7A schematic diagram of another impedance adjustable network provided in an embodiment of the present invention. The impedance adjustable network ZL provided in an embodiment of the present invention comprises a plurality of parallel branches, one end of which is electrically connected to the target signal trace 13 and the other end of which is grounded; the branch comprises a target component and a switch connected in series in sequence; the target component is a resistor, a capacitor or an inductor.

[0059] Specifically, in the embodiments of the present invention, Figure 5 As shown, the impedance adjustable network ZL is a parallel network composed of resistors and switches, including n resistors and n switches, namely R1...Rn, S1...Sn; Figure 6 As shown, the impedance adjustable network ZL is a parallel network composed of capacitors and switches, including n capacitors and n switches, namely C1...Cn, S1...Sn; Figure 7 As shown, the impedance adjustable network ZL is a parallel network composed of inductors and switches, including n inductors and n switches, namely L1...Ln, S1...Sn. Figure 5 As shown, by switching the switch, the resistance value can be changed to adjust the impedance value of the adjustable impedance network ZL to the ground, thereby adjusting the coupling coefficient of the coupler. Figure 6 As shown, by switching the switch, the capacitance value can be changed to adjust the impedance value of the adjustable impedance network ZL to the ground, thereby adjusting the coupling coefficient of the coupler. Figure 7 As shown, by switching the switch, the inductance value can be changed to adjust the impedance value of the adjustable impedance network ZL to the ground, thereby adjusting the coupling coefficient of the coupler.

[0060] In an optional embodiment of the present invention, reference Figure 8 , Figure 8 A schematic diagram of another impedance adjustable network provided in an embodiment of the present invention, referring to Fig. 9 , Fig. 9 A schematic diagram of another impedance adjustable network provided in an embodiment of the present invention, referring to Fig.10 , Fig.10 A schematic diagram of the structure of another impedance adjustable network provided by an embodiment of the present invention. The impedance adjustable network ZL provided by an embodiment of the present invention includes a plurality of parallel branches, one end of which is electrically connected to the target signal trace 13 after parallel connection, and the other end of which is grounded after parallel connection; the branches include target components and switches connected in series in sequence; the target components on a part of the branches are first target components, and the first target component is any one of a resistor, a capacitor, and an inductor; the target components on another part of the branches are second target components, and the second target component is any one of the remaining two of a resistor, a capacitor, and an inductor except the first target component.

[0061] Specifically, in the embodiments of the present invention, Figure 8 As shown, the impedance adjustable network ZL is a parallel network composed of resistors, capacitors and matching switches, including n resistors, n capacitors and 2n switches, namely R1...Rn, C1...Cn, S1...S2n; Fig. 9 As shown, the impedance adjustable network ZL is a parallel network composed of resistors, inductors and matching switches, including n resistors, n inductors and 2n switches, namely R1...Rn, L1...Ln, S1...S2n; Fig.10 As shown, the impedance adjustable network ZL is a parallel network composed of inductors, capacitors and matching switches, including n inductors, n capacitors and 2n switches, namely L1...Ln, C1...Cn, S1...S2n. Figure 8 As shown, by switching the switch, the resistance value and / or the capacitance value can be changed to adjust the impedance value of the adjustable impedance network ZL to the ground, thereby adjusting the coupling coefficient of the coupler. Fig. 9 As shown, by switching the switch, the resistance value and / or the inductance value can be changed to adjust the impedance value of the adjustable impedance network ZL to the ground, thereby adjusting the coupling coefficient of the coupler. Fig.10 As shown, by switching the switch, the inductance value and / or the capacitance value can be changed to adjust the impedance value of the adjustable impedance network ZL to the ground, thereby adjusting the coupling coefficient of the coupler.

[0062] In an optional embodiment of the present invention, reference Fig.11 , Fig.11 A schematic diagram of the structure of another impedance adjustable network provided by an embodiment of the present invention. The impedance adjustable network ZL provided by an embodiment of the present invention comprises a plurality of parallel branches, one end of which is electrically connected to the target signal trace 13 after parallel connection, and the other end of which is grounded after parallel connection; the branch comprises a target component and a switch connected in series in sequence; the branch is divided into three parts, the target component on the first part of the branch is a resistor, the target component on the second part of the branch is a capacitor, and the target component on the third part of the branch is an inductor.

[0063] Specifically, in the embodiments of the present invention, Fig.11 As shown, the impedance adjustable network ZL is a parallel network composed of resistors, capacitors, inductors and matching switches, including n resistors, n capacitors, n inductors and 3n switches, namely R1...Rn, C1...Cn, L1...Ln, S1...S3n; by switching the switches, the resistance value and / or the inductance value and / or the capacitance value can be changed to achieve the adjustment of the impedance value of the impedance adjustable network ZL to the ground, and then the adjustment of the coupling coefficient of the coupler can be achieved.

[0064] It should be noted that Figure 5-Figure 11The structure of the adjustable impedance network ZL shown only lists some possible structures and does not represent all situations. There may be other forms of deformation, which will not be described one by one in the embodiments of the present invention.

[0065] In an optional embodiment of the present invention, the working state of the switch can be controlled by digital control to achieve the adjustment of the impedance value of the adjustable impedance network ZL to the ground.

[0066] In an optional embodiment of the present invention, the variation range of the impedance value to ground of the impedance adjustable network ZL may be determined according to the routing mode of the target signal routing line 13 .

[0067] In an optional embodiment of the present invention, reference Fig.12 , Fig.12 A schematic diagram of another coupler provided by an embodiment of the present invention. In the coupler provided by an embodiment of the present invention, the main signal path line 11 and the coupling path line 12 are located on the first layer, and the target signal line 13 is located on the second layer, and the first layer and the second layer are different metal layers.

[0068] or, as Figure 2 The main signal path trace 11, the coupling path trace 12 and the target signal trace 13 are located on the same layer.

[0069] Specifically, in the embodiment of the present invention, when the main signal path wiring 11 and the coupling path wiring 12 are located in the same layer, the following can be done: Figure 2 The target signal trace 13 is directly placed between the main signal path trace 11 and the coupling path trace 12; Fig.12 As shown, the target signal trace 13 is also placed between the main signal path trace 11 and the coupling path trace 12 by using a non-same-layer method.

[0070] In an optional embodiment of the present invention, reference Fig.13 , Fig.13 A schematic diagram of a structure of another coupler provided in an embodiment of the present invention, referring to Fig.14 , Fig.14 A schematic diagram of another coupler provided by an embodiment of the present invention. In the coupler provided by an embodiment of the present invention, the main signal path line 11 is located on the first layer, the coupling path line 12 and the target signal line 13 are located on the second layer, and the first layer and the second layer are different metal layers.

[0071] Alternatively, the target signal routing 13 includes a first routing 131 and a second routing 132, the first routing 131 and the main signal path routing 11 are located on the first layer, the coupling path routing 12 and the second routing 132 are located on the second layer, and the first layer and the second layer are different metal layers; the first routing 131 and the second routing 132 are electrically connected through a conductive component 133.

[0072] Specifically, in the embodiment of the present invention, when the main signal path wiring 11 and the coupling path wiring 12 are located in different layers, the following can be done: Fig.13 As shown, the target signal trace 13 is located in the film layer where the coupling path trace 12 is located, and there is a gap between the two; it can also be as shown in FIG. Fig.14 The first routing line 131 and the second routing line 132 are shown to be electrically connected by a conductive component 133 and are placed on the sides of the main signal path routing line 11 and the coupling path routing line 12. The conductive component 133 can be placed in a through hole that penetrates the film layer.

[0073] In summary, the position selection of the newly added target signal wiring 13 in the embodiment of the present invention is diverse and is not limited to a certain form. It can be flexibly set according to the actual situation, which can greatly simplify the process difficulty.

[0074] It should be noted that the main signal path wiring 11 , the coupling path wiring 12 and the target signal wiring 13 in the embodiment of the present invention need to be insulated from each other.

[0075] Among them, the main signal path line 11 can be a wider metal straight line to ensure that the main RF signal passes through in a low-resistance state. The coupling path line 12 can be implemented using a metal line on the same layer as the main signal path line 11, or a metal line on the next layer. Different inductances can be formed by winding according to different design requirements, and the strength of electrical coupling and magnetic coupling can be controlled by different spacings. The target signal line 13 is located between the main signal path line 11 and the coupling path line 12, and the final design forms a six-port coupler.

[0076] refer to Fig.15 , Fig.15 A schematic diagram of the change of the coupling coefficient of a coupler provided in an embodiment of the present invention. Figure 5 The structure of the impedance adjustable network ZL shown in FIG. Fig.12 The wiring layout shown in the figure is used to design a six-port coupler in the N77 frequency band. By controlling the size of the parallel resistor by 3 bits, the impedance value from the adjustable impedance network ZL to the ground is adjusted, thereby adjusting the coupling coefficient of the coupler. Fig.15As shown, it is a schematic diagram of the change of the coupling coefficient of the coupler. When working in different sub-bands of N77, by switching codewords, the coupling coefficient can be changed within 0.8dB, which is greatly reduced compared with the 2dB change before applying this technical solution. This also proves that this technical solution can effectively adjust the coupling coefficient of the RF front-end coupler.

[0077] Based on the above embodiments of the present invention, a radio frequency module is provided in another embodiment of the present invention. The radio frequency module includes the coupler described in the above embodiments.

[0078] Specifically, in the embodiment of the present invention, the six-port coupler can be applied to any scenario including a coupler. Fig.16 , Fig.16 A structural diagram of a 5GL-FEM radio frequency module provided in an embodiment of the present invention. The receiving path formed by antenna port Rx1, antenna port Rx2, antenna interface M1 and antenna interface M2 in the radio frequency module is composed of a radio frequency switch (Switch), a filter (Filter), a coupler (Coupler) and a low noise amplifier (LNA). In other words, the radio frequency module uses the six-port coupler provided by the technical solution to connect the radio frequency switch (Switch), the filter (Filter), the six-port coupler (Coupler) and the low noise amplifier (LNA) in sequence, so as to use the variable coupling coefficient of the coupler to adapt to different receiving frequency bands and optimize the performance of the receiving path.

[0079] Among them, the antenna port Rx1 and the radio frequency switch (Switch) include a low noise amplifier (LNA1), a coupler (Coupler1) and a filter (Filter1) connected in sequence. The antenna port Rx2 and the radio frequency switch (Switch) include a low noise amplifier (LNA2), a coupler (Coupler2) and a filter (Filter2) connected in sequence.

[0080] refer to Fig.17 , Fig.17A structural diagram of a 5GL-PAMiF radio frequency module provided in an embodiment of the present invention. The receiving path formed by antenna port Rx1, antenna port Rx2, antenna interface M1 and antenna interface M2 in the radio frequency module is composed of a radio frequency switch (Switch), a filter (Filter), a coupler (Coupler) and a low noise amplifier (Low Noise Amplifier, referred to as LNA). In other words, the radio frequency module uses the six-port coupler provided by the technical solution to connect the radio frequency switch (Switch), the filter (Filter), the six-port coupler (Coupler) and the low noise amplifier (LNA) in sequence, so as to use the variable coupling coefficient of the coupler to adapt to different receiving frequency bands and optimize the performance of the receiving path.

[0081] Among them, the antenna port Rx1 and the radio frequency switch (Switch) include a low noise amplifier (LNA1), a coupler (Coupler1) and a filter (Filter1) connected in sequence. The antenna port Rx2 and the radio frequency switch (Switch) include a low noise amplifier (LNA2), a coupler (Coupler2) and a filter (Filter2) connected in sequence.

[0082] Optionally, the transmission path formed by the antenna port Tx1, the antenna interface M3 and the antenna interface M4 in the RF module is composed of a RF switch (Switch), a filter (Filter), a coupler (Coupler) and a low noise amplifier (LNA). In other words, the RF module uses the six-port coupler provided by the technical solution, and also connects the RF switch (Switch), the filter (Filter), the six-port coupler (Coupler) and the low noise amplifier (LNA) in sequence, so as to use the variable coupling coefficient of the coupler to adapt to different receiving frequency bands and optimize the performance of the transmission path.

[0083] Among them, the antenna port Tx1 and the radio frequency switch (Switch) include an integrated multi-mode multi-band (PA1), a coupler (Coupler3) and a filter (Filter3) connected in sequence.

[0084] The above is a detailed introduction to a coupler and a radio frequency module provided by the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for those skilled in the art, according to the idea of ​​the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present invention.

[0085] It should be noted that each embodiment in this specification is described in a progressive manner, and each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description.

[0086] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device that includes a series of elements is inherent to the elements, or also includes elements inherent to these processes, methods, articles or devices. In the absence of further restrictions, the elements defined by the sentence "including a..." do not exclude the presence of other identical elements in the process, method, article or device that includes the elements.

[0087] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A coupler, characterized in that: The coupler includes a main signal path routing, a coupling path routing, and a target signal routing located between the main signal path routing and the coupling path routing; At least one end of the target signal routing line is grounded through an adjustable impedance network; the impedance value to ground of the adjustable impedance network is adjustable.

2. The coupler according to claim 1, characterized in that The coupler includes a first adjustable impedance network and a second adjustable impedance network; the first end of the target signal line is grounded through the first adjustable impedance network, and the second end of the target signal line is grounded through the second adjustable impedance network.

3. The coupler according to claim 1, characterized in that: The adjustable impedance network includes a plurality of parallel branches, one end of which is electrically connected to the target signal line and the other end of which is grounded; The branch includes a target component and a switch connected in series in sequence; the target component is a resistor, a capacitor or an inductor.

4. The coupler according to claim 1, characterized in that The adjustable impedance network includes a plurality of parallel branches, one end of which is electrically connected to the target signal line and the other end of which is grounded; The branches include target components and switches connected in series in sequence; the target components on a part of the branches are first target components, and the first target component is any one of a resistor, a capacitor and an inductor; the target components on another part of the branches are second target components, and the second target component is any one of the remaining two of the resistor, the capacitor and the inductor except the first target component.

5. The coupler according to claim 1, characterized in that: The adjustable impedance network includes a plurality of parallel branches, one end of which is electrically connected to the target signal line and the other end of which is grounded; The branch includes a target component and a switch connected in series in sequence; the branch is divided into three parts, the target component on the first part of the branch is a resistor, the target component on the second part of the branch is a capacitor, and the target component on the third part of the branch is an inductor.

6. The coupler according to claim 1, characterized in that The working state of the adjustable impedance network is controlled by digital control to adjust the impedance value to ground of the adjustable impedance network.

7. The coupler according to any one of claims 1 to 6, characterized in that: The main signal path routing and the coupling path routing are located on the first layer, and the target signal routing is located on the second layer; The first layer and the second layer are different metal layers.

8. The coupler according to any one of claims 1 to 6, characterized in that: The main signal path routing, the coupling path routing and the target signal routing are located on the same layer.

9. The coupler according to any one of claims 1 to 6, characterized in that: The main signal path routing is located on the first layer, and the coupling path routing and the target signal routing are located on the second layer; The first layer and the second layer are different metal layers.

10. The coupler according to any one of claims 1 to 6, characterized in that: The target signal routing line includes a first routing line and a second routing line; the first routing line and the second routing line are electrically connected via a conductive component; The first routing line and the main signal path routing line are located on the first layer, and the coupling path routing line and the second routing line are located on the second layer; the first layer and the second layer are different metal layers.

11. A radio frequency module, characterized in that: The radio frequency module comprises the coupler described in any one of claims 1-10.

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