Assembly equipment and assembly method for laser radar and circuit board of laser radar

Abstract

The invention provides assembly equipment and an assembly method for a laser radar and a circuit board of the laser radar. The laser radar comprises a circuit board, a bonding pad is arranged on the circuit board, the assembling equipment is used for welding a terminal on the bonding pad, and the assembling equipment comprises a fixing device, a forming device, an assembling device and a welding device. The fixing device is configured to fix the circuit board. The forming device is configured to take a welding wire and form the welding wire into a welding wire ring matched with the size of the terminal. The assembling device is configured to sleeve the welding wire ring on the terminal. The welding device is configured to heat the wire ring to weld the terminal to the pad. According to the embodiment of the invention, the welding wire ring matched with the size of the terminal can be machined, the space limitation is small, and the welding wire ring is suitable for welding the small-size terminal or the terminal with the small welding space. And on the other hand, welding spots formed by the welding wire ring are convenient to detect, and the detection process is simplified.

Description

Technical Field

[0001] The present disclosure relates to the technical field of laser radar assembly, and in particular to an assembly device and an assembly method for a laser radar, and a circuit board of the laser radar. Background Art

[0002] The laser radar includes a variety of electronic components and optical components integrated on the circuit board. Terminals are also provided on the laser radar circuit board for connecting with other components, or for mounting electronic components or optical components on the circuit board. For example, the terminal can be connected to components such as power supply, processor, antenna, etc. through a cable. The terminal is welded on the circuit board and protrudes relative to the circuit board. For example, the terminal includes a PIN pin, a plug pin, a fence-type terminal, etc.

[0003] With the development of technology and the improvement of market requirements, the size of LiDAR is getting smaller and smaller, and the integration is getting higher and higher. In the circuit board of LiDAR, the number and types of terminals increase, the size decreases, and the spacing decreases, making the assembly of the circuit board of LiDAR more difficult. Summary of the invention

[0004] In view of one or more defects in the prior art, the present disclosure provides an assembly device for a laser radar, wherein the laser radar includes a circuit board, and a soldering pad is provided on the circuit board. The assembly device is used to solder a terminal to the soldering pad, and the assembly device includes: a fixing device, a molding device, an assembling device, and a welding device;

[0005] The fixing device is configured to fix the circuit board;

[0006] The shaping device is configured to obtain welding wire and shape the welding wire into a welding wire ring matching the size of the terminal;

[0007] The assembling device is configured to sleeve the welding wire ring onto the terminal; and

[0008] The welding device is configured to heat the wire loop to weld the terminal to the pad.

[0009] Optionally, the length of the welding wire loop is determined according to at least one of the following parameters:

[0010] The diameter of the terminal, the diameter of the welding wire, and the gap between the terminal and the welding pad.

[0011] Optionally, the forming device comprises: a feeding mechanism, a forming die and a cutting mechanism;

[0012] The feeding mechanism is configured to extend the welding wire toward the forming die;

[0013] The forming die and the feeding mechanism can move relative to each other, or the welding wire moves around the forming die along a preset trajectory, so that the welding wire surrounds the surface of the forming die to form the welding wire ring;

[0014] The cutting mechanism is configured to cut the welding wire to separate the welding wire loops.

[0015] Optionally, the forming device further comprises a clamp configured to fix the welding wire on the surface of the forming die.

[0016] Optionally, the forming die is movable in the axial direction.

[0017] Optionally, the forming device further comprises a shaping mechanism, which can move relative to the forming die and is configured to press the two ends of the welding wire ring tightly against the surface of the forming die.

[0018] Optionally, the circuit board includes a plurality of the terminals, and the sizes of the plurality of the terminals are different; a plurality of the soldering pads are arranged on the circuit board, and the plurality of the terminals correspond to the plurality of the soldering pads one by one.

[0019] Optionally, the forming device includes a plurality of the forming dies, the plurality of forming dies have different radial sizes, and the diameter of the welding wire ring is equal to or slightly larger than the diameter of the terminal.

[0020] Optionally, the angle at which the welding wire wraps around the surface of the forming die is greater than or equal to 360°.

[0021] Optionally, the assembly equipment further comprises a driving device, wherein the driving device is configured to drive the forming device to move after the welding wire ring is formed so as to align the forming die and the terminal in the axial direction.

[0022] Optionally, the assembling device includes a pushing claw, which is arranged on a side of the forming mold and is configured to push the welding wire ring away from the forming mold and sleeve it on the terminal.

[0023] Optionally, the assembly equipment further comprises a positioning device, which is configured to determine the position of the terminal; the driving device communicates with the positioning device and is configured to drive the molding die to align axially with the terminal according to the position of the terminal.

[0024] Optionally, the positioning device includes an image acquisition device, and the image acquisition device is configured to acquire images of the circuit board and the terminals.

[0025] Optionally, the positioning device communicates with the fixing device, and the fixing device is configured to adjust the posture of the circuit board according to the image of the circuit board.

[0026] Optionally, the welding device includes a laser source, which is configured to emit a laser beam and irradiate the terminal and heat the welding wire ring.

[0027] Optionally, the laser beam is divergent light or convergent light, and the laser source is movable along the axial direction of the terminal to change the range of irradiation on the terminal.

[0028] Optionally, the assembly equipment further comprises a heating device, and the heating device is configured to heat the solder pad.

[0029] Optionally, the assembly equipment further comprises a detection device, wherein the detection device is configured to detect a solder joint between the terminal and the pad.

[0030] Optionally, the detection device includes: a planar image acquisition device and a stereoscopic image acquisition device; wherein,

[0031] The planar image acquisition device is configured to acquire a planar image of the welding point;

[0032] The stereoscopic image acquisition device is configured to acquire a stereoscopic image of the welding point;

[0033] The detection device detects the welding point according to the planar image and / or the stereoscopic image.

[0034] Optionally, the detection device is configured to determine the area or proportion of the solder joint covering the solder pad based on the planar image; and / or, the detection device is configured to determine the inclination angle of the side of the solder joint relative to the circuit board based on the stereoscopic image.

[0035] Optionally, the present disclosure further relates to an assembly method for a laser radar, wherein the laser radar includes a circuit board, and a soldering pad is provided on the circuit board. The assembly method is used to solder a terminal to the soldering pad, and the assembly method includes:

[0036] fixing the circuit board;

[0037] Keeping the terminal and the pad relatively fixed;

[0038] The welding wire is formed and cut to form a welding wire loop;

[0039] Sleeve the welding wire ring onto the terminal;

[0040] The wire ring is heated to weld the terminal to the pad.

[0041] Optionally, the step of shaping and cutting the welding wire to form a welding wire ring includes:

[0042] forming the welding wire into a ring shape;

[0043] The welding wire is cut to separate the welding wire loop.

[0044] Optionally, the step of wrapping the welding wire into a ring shape includes: wrapping the welding wire around a forming die;

[0045] The step of sleeve-connecting the welding wire ring onto the terminal comprises:

[0046] Driving the molding die to move to a position aligned with the terminal in the axial direction;

[0047] The welding wire ring is separated from the forming die, and the welding wire ring is sleeved on the terminal.

[0048] Optionally, the step of heating the welding wire ring includes:

[0049] Preheating the pad;

[0050] The wire loop is heated by a laser source.

[0051] Optionally, the assembly method further includes detecting the solder joints; the step of detecting the solder joints includes:

[0052] Acquire a planar image of the solder joint, and detect the area or proportion of the solder joint covering the solder pad according to the planar image;

[0053] Acquire a stereoscopic image of the solder joint, and detect the inclination angle of the side surface of the solder joint relative to the circuit board based on the stereoscopic image,

[0054] The step of detecting the solder joints further comprises:

[0055] When the area or the ratio is not less than the area threshold or the ratio threshold, the solder joint is judged to be qualified; and / or

[0056] When the tilt angle is not less than the angle threshold, the solder joint is judged to be unqualified.

[0057] Optionally, the assembly method is performed by the assembly equipment as described above.

[0058] Optionally, the present disclosure also relates to a circuit board of a laser radar, the circuit board comprising: a substrate, a terminal, a pad and solder;

[0059] The substrate is provided with a hole, which is a through hole or a blind hole;

[0060] The terminal is arranged at the position of the hole;

[0061] The pad is located in the circumference of the terminal;

[0062] The solder is filled in the hole and protrudes from the pad, and the side surface of the portion of the solder protruding from the pad is a plane or a curved surface recessed toward the substrate.

[0063] Optionally, the side surface of the portion of the solder protruding from the pad is approximately conical or truncated cone-shaped, and the inclination angle of the side surface of the solder relative to the substrate is less than or equal to 70°.

[0064] Optionally, the inclination angle of the side surface of the solder relative to the substrate is less than or equal to 45°.

[0065] Optionally, the circuit board is assembled by the assembly equipment as described above; or the circuit board is assembled by the assembly method as described above.

[0066] Compared with the prior art, the embodiments of the present disclosure provide an assembly device for a laser radar, wherein a fixing device keeps the circuit board fixed, a forming device can form the welding wire into a welding wire ring that matches the size of the terminal, an assembly device is used to sleeve the welding wire ring on the terminal, and the terminal is welded to the pad. The assembly device can process a matching welding wire ring according to the size of the terminal, is less restricted by space, and is suitable for welding small-sized terminals or terminals with small welding space. On the other hand, the solder joints formed by the welding wire ring are easy to detect, which is conducive to simplifying the detection process and reducing the detection cost.

[0067] The present disclosure also relates to an assembly method for a laser radar. After the welding wire is processed into a welding wire ring, it is sleeved on a terminal, which is conducive to simplifying the welding process, is suitable for welding in a smaller space, and is convenient for detecting welding points.

[0068] The present disclosure also relates to a circuit board for a laser radar, in which terminals are welded on pads, and the side surface of the portion of the solder protruding from the pad is a plane or a curved surface recessed toward the substrate, which can be formed by heating and welding with a welding wire ring, and is convenient for detecting the welding quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0069] In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the following will provide an exemplary introduction to the drawings used in the description of the embodiments. The drawings described below are only embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without creative work. The drawings are used to provide a further understanding of the present disclosure and constitute a part of the specification. They are used together with the embodiments of the present disclosure to explain the present disclosure and do not constitute a limitation on the present disclosure. In the drawings:

[0070] Figure 1 shows a block diagram of an exemplary assembly apparatus consistent with some embodiments of the present disclosure;

[0071] Figure 2 A schematic structural diagram of an exemplary molding device consistent with some embodiments of the present disclosure is shown;

[0072] Figure 3 shows a schematic diagram of an exemplary assembly apparatus consistent with some embodiments of the present disclosure;

[0073] Figure 4 A schematic diagram showing an exemplary welding apparatus consistent with some embodiments of the present disclosure is shown;

[0074] Figure 5 A block diagram showing an exemplary detection device consistent with some embodiments of the present disclosure is shown;

[0075] Figure 6 A schematic flow chart showing an exemplary assembly method consistent with some embodiments of the present disclosure is shown;

[0076] Figure 7 A schematic diagram of an exemplary process of forming a welding wire loop consistent with some embodiments of the present disclosure is shown;

[0077] Figure 8 A schematic diagram of an exemplary heating wire loop process consistent with some embodiments of the present disclosure is shown;

[0078] Fig. 9 A schematic diagram of an exemplary process of inspecting solder joints consistent with some embodiments of the present disclosure is shown;

[0079] Fig.10 A cross-sectional view of a circuit board consistent with some embodiments of the present disclosure is shown. DETAILED DESCRIPTION

[0080] In the following, only certain exemplary embodiments are described by way of example. As will be appreciated by those skilled in the art, the described embodiments may be modified in various ways without departing from the spirit or scope of the present disclosure. Therefore, the drawings and descriptions are considered to be exemplary and non-restrictive in nature.

[0081] In the description of the present disclosure, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the present disclosure and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present disclosure. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present disclosure, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0082] In the description of the present disclosure, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be directly connected, or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to specific circumstances.

[0083] In the present disclosure, unless otherwise clearly specified and limited, the first feature being "above" or "below" the second feature may include the first and second features being in direct contact, or the first and second features being not in direct contact but in contact through another feature between them. Moreover, the first feature being "above", "above" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature includes the first feature being directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature. In the description of the present disclosure, "at least one" or "at least one of" a plurality of objects refers to any object or any combination of a plurality of objects, for example, "at least one of a1, a2, a3" includes: "alone a1", "alone a2", "alone a3", "a1 and a2", "a1 and a3", "a2 and a3", or "a1, a2 and a3".

[0084] The disclosure below provides many different embodiments or examples to realize different structures of the present disclosure. In order to simplify the disclosure of the present disclosure, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present disclosure. In addition, the present disclosure can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplicity and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed. In addition, the present disclosure provides various specific examples of processes and materials, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0085] The embodiments of the present disclosure are described below in conjunction with the accompanying drawings. It should be understood that the embodiments described herein are only used to illustrate and explain the present disclosure, and are not used to limit the present disclosure.

[0086] The present disclosure relates to an assembly device for a laser radar. The laser radar includes a circuit board, on which a soldering pad is provided, and the assembly device is used to solder a terminal to the soldering pad. The assembly device includes: a fixing device, a forming device, an assembling device and a welding device. The fixing device is configured to fix the circuit board. The forming device is configured to obtain a welding wire and form the welding wire into a welding wire ring matching the size of the terminal. The assembling device is configured to sleeve the welding wire ring on the terminal. The welding device is configured to heat the welding wire ring to solder the terminal to the soldering pad.

[0087] In some embodiments, the terminal is arranged at a corresponding position in the circuit board, and the fixing device keeps the circuit board fixed. The forming device obtains the welding wire and forms the welding wire into a welding wire ring, and the size of the welding wire ring matches the size of the terminal. For example, the axial cross-section of the terminal is circular, and the forming device processes the welding wire ring into a circular ring shape, and the inner diameter of the circular ring shape is close to the outer diameter of the circular cross-section of the terminal, so that the welding wire ring can be sleeved on the terminal. In some embodiments, the axial cross-section of the terminal is other shapes, such as a polygon, and the forming device processes the welding wire ring into a corresponding polygonal ring. The assembling device can sleeve the formed welding wire ring on the terminal. The welding device can heat the welding wire ring so that the terminal and the pad are welded and fixed.

[0088] The assembly equipment can process matching wire rings according to the size and shape of the terminal, which is easy to operate, highly matched with the terminal, and suitable for small-sized terminals. In the process of welding the terminal, there is no need to extend the welding wire or heating source to the position where the terminal and the pad meet, and the space requirement is low, and it can be used in a working environment with a small spacing. On the other hand, using the forming device to process the wire ring is conducive to controlling the amount of solder used and is convenient for detecting the welding quality by optical detection.

[0089] Figure 1The structure of an assembly device for a laser radar according to some embodiments of the present disclosure is shown. The laser radar includes a circuit board, and a soldering pad is provided on the circuit board. The assembly device is used to solder the terminal to the soldering pad. The assembly device includes a fixing device, a molding device, an assembling device and a welding device. In different embodiments, the circuit board may include circuit board one and circuit board two; the soldering pad may include soldering pad one, soldering pad two and soldering pad three; the terminal may include terminal one, terminal two, terminal three and terminal four; the molding device may include molding device one and molding device two; the assembling device may include assembling device one and assembling device two; the welding device may include welding device one and welding device two.

[0090] The fixing device 102 can fix the circuit board 120. For example, the fixing device 102 includes a clamping fixing device, or the fixing device 102 includes a bolt to keep the circuit board 120 fixed. In some embodiments, the fixing device 102 fixes the circuit board 120 along a horizontal plane. This can reduce the influence of gravity and facilitate soldering the terminal 124 to the pad 122.

[0091] In some embodiments, the circuit board 120 can be pre-fixedly connected to the outer shell of the laser radar, and the fixing device 102 can fix the outer shell of the laser radar to keep the circuit board 120 in a fixed position.

[0092] The forming device 104 can obtain the welding wire 110 and form the welding wire 110 into a welding wire ring 112 that matches the size of the terminal 124. In different embodiments, the welding wire may include welding wire 1 and welding wire 2; the welding wire ring may include welding wire ring 1, welding wire ring 2, welding wire ring 3, and welding wire ring 4.

[0093] For example, the forming device 104 may include a welding wire bin, in which the welding wire is stored. Alternatively, the welding wire 110 may be stored outside the assembly device 100, and the forming device 104 may obtain the welding wire 110 from the outside, for example, the forming device 104 may obtain one end of the welding wire 110 and drive the welding wire 110 to extend.

[0094] After the forming device 104 obtains the welding wire 110, it can shape the welding wire 110, for example, drive the welding wire 110 to move, bend, twist, cut the welding wire 110, etc., so that the welding wire 110 is formed into a welding wire ring 112 that matches the size of the terminal 124.

[0095] In some embodiments, the welding wire ring 112 includes a section of bent welding wire 110, and the ends of the welding wire 110 can be connected to each other, overlapped with each other, or spaced apart from each other. In other words, the bending angle of the welding wire 110 in the welding wire ring 112 can be equal to 360°, greater than 360°, or less than 360°. In some embodiments, the bending angle of the welding wire 110 in the welding wire ring 112 is greater than or equal to 360°. In this way, the solder can be evenly distributed on the edge of the terminal 124, which is conducive to improving the welding quality.

[0096] The assembly device 106 can sleeve the welding wire ring 112 on the terminal 124. For example, the assembly device 106 can obtain the welding wire ring 112 from the forming device 104, and drive the welding wire ring 112 to surround the circumferential outer side of the terminal 124. Alternatively, when the bending angle of the welding wire 110 in the welding wire ring 112 is less than 360°, the welding wire ring 112 surrounds part of the circumferential outer side of the terminal 124.

[0097] The welding device 108 can heat the welding wire ring 112 so that the welding wire ring 112 is melted and then the terminal 124 is welded to the welding pad 122. For example, the welding device 108 includes a heating source, and the heating source can be in direct contact with the welding wire ring 112 to heat the welding wire ring 112 by heat conduction, or the heating source can be spaced from the welding wire ring 112 to heat the welding wire ring 112 by heat radiation.

[0098] The assembly device 100 of the present disclosure forms the welding wire 110 into a welding wire ring 112 through a forming device 104. The size of the welding wire ring 112 matches the size of the terminal 124, and the welding wire ring 112 can be processed according to the size of the terminal 124. The welding wire ring 112 is sleeved on the terminal 124 through the assembly device 106, which is less restricted by space. During the welding process, there is no need to drive the welding wire to move around the terminal 124, nor is there any need to press the welding wire at the joint position of the terminal 124 and the pad 122, which is conducive to simplifying the welding operation.

[0099] On the other hand, the size of the wire ring 112 matches the size of the terminal 124, which is conducive to accurately controlling the amount of solder. When the amount of solder is controlled, the solder joint can be inspected by optical inspection, which is conducive to simplifying the inspection process and reducing the inspection cost.

[0100] In some embodiments, the length of the welding wire ring 112 (the length of the welding wire 110 in the welding wire ring 112) can be determined according to at least one of the diameter of the terminal 124, the diameter of the welding wire 110, or the gap between the terminal 124 and the pad 122. Among them, the gap between the terminal 124 and the pad 122 represents the distance between the outer periphery of the terminal 124 and the inner surface of the pad 122. The outer periphery size of the terminal 124 can be determined according to the diameter of the terminal 124. For example, the amount of solder can be determined according to the diameter of the terminal 124, or the diameter of the welding wire 110 or the gap between the terminal 124 and the pad 122. For example, the amount of solder is represented by the volume of the welding wire 110, and the welding wire 110 is simplified into a cylindrical shape, and the volume is the cross-sectional size of the welding wire 110 multiplied by the length. After determining the amount of solder, the length of the welding wire ring 112 can be determined according to the diameter of the welding wire 110. In some embodiments, by selecting a welding wire 110 with a smaller diameter, the length of the welding wire ring 112 can be increased so that the bending angle of the welding wire 110 in the welding wire ring 112 is greater than or equal to 360°, so that the solder is evenly distributed around the terminal 124, thereby improving the welding quality.

[0101] The amount of solder used can be determined based on welding quality detection. The welding quality detection includes detection items such as copper leakage rate or solder joint shape. In some embodiments, after welding is completed, the solder joint is subjected to welding quality detection, and the amount of solder used is optimized based on the welding quality detection, and the optimization direction can be to reduce the amount of solder used.

[0102] In some embodiments, the molding device 104 can be adapted to a variety of different welding wires 110, for example, welding wires 110 of different diameters or welding wires of different materials, so as to improve the application scope of the assembly device 100 and be applicable to different types of circuit boards 120 or terminals 124 of different types, sizes or shapes on the circuit board 120.

[0103] Figure 2 The structure of an exemplary molding device consistent with some embodiments of the present disclosure is shown. Figure 2 , the second molding device 204 may be Figure 1 The forming device 104 shown in FIG. The forming device 204 can obtain the welding wire 210 and form the welding wire 210 into a welding wire ring 212. The welding wire 210 can be Figure 1 The welding wire 110 shown in FIG. 1 and the welding wire ring 212 can be Figure 1 The welding wire ring 112 is shown in FIG.

[0104] The second forming device 204 includes a feeding mechanism, a forming mold and a cutting mechanism. In different embodiments, the forming mold may include a forming mold 1 and a forming mold 2. The feeding mechanism 232 can extend the welding wire 210 toward the forming mold 1 234. For example, in some embodiments, the feeding mechanism 232 can move relative to the forming mold 1 234, and the feeding mechanism 232 can drive one end of the welding wire 210 to approach the forming mold 1 234. Alternatively, in some embodiments, the position of the feeding mechanism 232 and the position of the forming mold 1 234 remain fixed, and the feeding mechanism 232 can drive one end of the welding wire 210 to move toward the forming mold 1 234. For example, one end of the welding wire 210 passes through the feeding mechanism 232, and the feeding mechanism 232 includes an active roller, which pushes the welding wire 210 to extend to the outside of the feeding mechanism 232.

[0105] The feeding mechanism 232 and the forming mold 1 234 cooperate with each other to wrap the welding wire 210 around the surface of the forming mold 1 234 to form a welding wire ring 212. The surface size of the forming mold 1 234 can be determined according to the size of the terminal, and the size of the welding wire ring 212 formed by the welding wire 210 wrapping around the surface of the forming mold 1 234 matches the size of the terminal. For example, the terminal includes a PIN pin, and the forming mold 1 234 can be a cylindrical shape with a diameter substantially equal to that of the PIN pin.

[0106] In some embodiments, the first forming mold 234 and the feeding mechanism 232 can move relative to each other. For example, after the feeding mechanism 232 extends the second welding wire 210 to the first forming mold 234, the first forming mold 234 rotates relative to the feeding mechanism 232, or the feeding mechanism 232 rotates relative to the first forming mold 234, or the feeding mechanism 232 moves the second welding wire 210, so that the second welding wire 210 surrounds the surface of the first forming mold 234.

[0107] In some embodiments, the welding wire 210 moves along a preset trajectory around the forming mold 1 234, and the positions of the feeding mechanism 232 and the forming mold 1 234 can be relatively fixed. For example, the feeding mechanism 232 can drive the welding wire 210 to extend toward the forming mold 1 234, and a limiting groove is provided on the outer side of the forming mold 1 234. One end of the welding wire 210 extends along the limiting groove, and is shaped by the limiting groove, and surrounds the surface of the forming mold 1 234 to form a welding wire ring 212.

[0108] The cutting mechanism 236 can cut the welding wire 210 to separate the welding wire loop 212 from the welding wire 210. For example, the cutting mechanism 236 includes a cutter, and when the welding wire 210 is wrapped around the surface of the forming mold 1 234, the cutter cuts the welding wire 210 at a preset position to separate the welding wire loop 212, and the welding wire loop 212 meets the preset length. The length of the welding wire loop 212 can be determined according to at least one of the diameter of the terminal, the diameter of the welding wire 210, or the gap between the terminal and the pad.

[0109] The second forming device 204 can control the time or frequency of cutting the second welding wire 210 by the cutting mechanism 236 so that the second welding wire loop 212 meets the preset length. Alternatively, the second forming device 204 controls the feeding mechanism 232 to drive the second welding wire 210 to extend to the first forming mold 234 by the preset length and then stops, and the cutting mechanism 236 cuts the second welding wire 210 at the preset position.

[0110] refer to Figure 2 In some embodiments, the second forming device 204 further includes a clamp 238. The clamp 238 can make the welding wire 210 fit on the surface of the first forming mold 234. The clamp 238 can cooperate with the first forming mold 234 to form the welding wire 210 into a welding wire ring 212.

[0111] For example, the feeding mechanism 232 drives the welding wire 210 to move toward the forming mold 1 234, and the clamping jaw 238 makes the welding wire 210 close to the surface of the forming mold 1 234. For example, the clamping jaw 238 is set on the side of the forming mold 1 234, and one end of the welding wire 210 is clamped between the forming mold 1 234 and the clamping jaw 238. The feeding mechanism 232 and the forming mold 1 234 rotate relative to each other, so that the welding wire 210 surrounds the surface of the forming mold 1 234. Optionally, the clamping jaw 238 can move close to or away from the forming mold 1 234.

[0112] In some embodiments, the forming mold 1 234 can move in the axial direction. The axial direction of the forming mold 1 234 refers to the direction perpendicular to the plane around which the welding wire 210 surrounds the surface of the forming mold 1 234. For example, the forming mold 1 234 is roughly cylindrical, and the axial direction refers to the direction of the rotation axis of the cylinder. In this embodiment, the forming mold 1 234 moves in the axial direction, and the position of the clamp 238 remains fixed, so that the clamp 238 can hold the welding wire 210, avoid the welding wire 210 from being entangled on the outside of the clamp 238, and make the welding wire 210 be formed into the welding wire ring 212 according to the shape of the forming mold 1 234, which is conducive to improving the accuracy of the formed shape of the welding wire ring 212.

[0113] For example, welding wire 210 wraps around the surface of forming mold 1 234 for multiple times. During the process of welding wire 210 wrapping around forming mold 1 234 , forming mold 1 234 can move axially so that welding wire 210 avoids clamping jaw 238 and wraps around the surface of forming mold 1 234 .

[0114] refer to Figure 2 In some embodiments, the second molding device 204 further includes a shaping mechanism 240. The shaping mechanism 240 can move relative to the molding die 1 234. For example, the shaping mechanism 240 can move closer to or farther from the surface of the molding die 1 234. The shaping mechanism 240 can press the two ends of the welding wire ring 212 tightly against the surface of the molding die 1 234 to prevent the two ends of the welding wire ring 212 from protruding or warping, which is conducive to uniform distribution of solder and improves welding quality. In some embodiments, the shaping mechanism 240 includes a shaping surface, and the shape of the shaping surface matches the surface shape of the molding die 1 234. For example, the molding die 1 234 is roughly cylindrical, the surface of the molding die 1 234 is an arcuate surface, and the shape of the shaping surface is an arcuate surface.

[0115] In some embodiments, the circuit board includes a plurality of terminals, and the sizes of the plurality of terminals are different. For example, the terminals on the circuit board have different size specifications, including round PIN pins with diameters of 0.1 mm, 0.5 mm, 1 mm, 3 mm, and 5 mm. Terminals of different sizes can be used to connect different cables and achieve different functions. A plurality of pads are provided on the circuit board, and the plurality of terminals correspond to the plurality of pads one by one. A terminal can be welded on a pad. The sizes of the pads corresponding to terminals of different sizes may also be different. For example, the size of the pad corresponding to a terminal with a larger diameter is larger.

[0116] According to some embodiments of the present disclosure, a forming device forms a welding wire into a welding wire ring whose size matches that of a terminal. For terminals of different sizes on a circuit board, the forming device can form the welding wire into welding wire rings of different sizes. For example, in some embodiments, the forming device includes a plurality of forming dies. The plurality of forming dies have different radial sizes. The plurality of forming dies can correspond to terminals of different sizes, and the forming device selects a forming die of a corresponding size to process the welding wire ring.

[0117] In some embodiments, the radial dimension of the molding die can be determined based on the metric dimension of the terminal. The dimension number of the molding die can be greater than the dimension number of the terminal on the circuit board, so that the assembly equipment can be suitable for assembling different circuit boards.

[0118] In some embodiments, the radial dimension of the forming die may be equal to or slightly larger than the dimension of the terminal corresponding to the forming die, so that the diameter of the formed welding wire ring is equal to or slightly larger than the diameter of the terminal. For example, if the diameter of the terminal is 1 mm, the radial dimension of the forming die and the inner diameter of the welding wire ring after processing may be 1.2 mm, which is conducive to sleeve the welding wire ring on the terminal and avoids the inability to move the welding wire ring to the position where the terminal and the pad are connected, which affects the welding quality.

[0119] refer to Figure 1 In some embodiments, the assembly device 100 further includes a driving device 150. After forming the welding wire ring 112, the driving device 150 can drive the forming device 104 to move so that the forming mold and the terminal 124 are aligned in the axial direction. For example, the driving device 150 is in transmission connection with the forming device 104 to drive the forming mold to move. The axial alignment of the forming mold and the terminal 124 means that the axis of the forming mold and the axis of the terminal 124 are colinear. In some embodiments, the driving device 150 can also drive one end of the forming mold to approach the end of the terminal 124 away from the circuit board 120, so that the assembly device 106 can sleeve the welding wire ring 112 on the terminal 124, thereby reducing the risk of the welding wire ring 112 deviating from the terminal 124.

[0120] Figure 3 The structure of an exemplary assembly device consistent with some embodiments of the present disclosure is shown. Figure 3 , the second assembly device 306 includes a push claw 360, wherein the second assembly device 306 can be Figure 1 The assembly device 106 is shown in FIG.

[0121] like Figure 3 As shown, the push claw 360 can be set on the side of the second forming mold 334, and can push the welding wire ring 312 away from the second forming mold 334 and sleeve it on the second terminal 324. Figure 3 The wire ring 312 moves in the direction of the thick arrow shown in the figure, pushing the wire ring 312 to separate from the forming mold 234. The forming mold 234 can be Figure 2 The forming die 234 shown in FIG. 1; the welding wire ring 312 can Figure 2 The wire ring 212 shown in FIG. 2; the terminal 224 can be Figure 1 Terminal one 124 is shown in FIG.

[0122] In some embodiments, the push claw 360 can drive the welding wire ring three 312 to move. For example, the push claw 360 grabs the welding wire ring three 312 so that the welding wire ring three 312 is sleeved on the terminal two 324.

[0123] Alternatively, in some embodiments, the push claw 360 can move relative to the second forming mold 334. When the forming device forms the welding wire into the third welding wire ring 312, the position of the push claw 360 is far away from the second forming mold 334 to avoid interference with the forming device. After the welding wire ring 312 is formed, the push claw 360 is close to the second forming mold 334, and can move along the axial direction of the second forming mold 334 relative to the second forming mold 334, so that the welding wire ring 312 can be separated from the axial end of the second forming mold 334. The driving device can drive the second forming mold 334 to move to align with the second terminal 324 in the axial direction. When the welding wire ring 312 is separated from the second forming mold 334, the welding wire ring 312 falls and is set on the second terminal 324. The second assembly device 306 in this embodiment does not need to move to the position where the second terminal 324 and the pad are connected, and the requirements for the activity space are relatively low, which is suitable for assembling circuit boards with smaller spacing.

[0124] refer to Figure 1 In some embodiments, the assembly device further includes a positioning device 152. The positioning device 152 can determine the position of the terminal 124, and the positioning device 152 communicates with the driving device 150, and can control the driving device 150 to drive the molding device 104 to move according to the position of the terminal 124, so that the molding die and the terminal 124 are aligned in the axial direction.

[0125] For example, the positioning device 152 includes an image acquisition device. For example, the image acquisition device can be a camera or other image acquisition device, which can obtain an image of the circuit board 120, and after analyzing the image, determine the position of the terminal 124 on the circuit board 120. For example, the positioning device 152 includes a processor, which can process the image and determine the position of the terminal 124 by feature recognition or machine learning, for example, determine the three-axis coordinates of the terminal 124. The positioning device 152 communicates with the driving device 150, and can control the driving device 150 to drive the molding device 104 to move, so that the molding mold moves to the Z-axis coordinate of the terminal 124, and the molding mold and the terminal 124 are aligned in the axial direction.

[0126] refer to Figure 1 In some embodiments, the positioning device 152 also communicates with the fixing device 102. The fixing device 102 can adjust the posture of the circuit board 120 according to the image of the circuit board 120. For example, the fixing device 102 can drive the circuit board 120 to move or rotate. The image acquisition device in the positioning device 152 can have a fixed coordinate system. After acquiring and processing the image of the circuit board 120, the distance and angle of the circuit board 120 deviating from the preset position can be determined. The positioning device 152 can control the fixing device 102 to drive the circuit board 120 to move and adjust the posture of the circuit board 120, which is conducive to improving the assembly accuracy of the circuit board 120.

[0127] Figure 4 The structure of an exemplary welding device consistent with some embodiments of the present disclosure is shown. Figure 4 The welding device 2 408 includes a laser source 462, which can emit a laser beam and irradiate the terminal 3 424, heat the welding wire ring 412, and weld the terminal 3 424 to the welding pad 2 422. The terminal 3 424 can be Figure 1 Terminal 124 shown in the figure, or Figure 3 The terminal 2 324 shown in FIG. 4; the welding wire ring 412 may be Figure 1 The wire ring 112 shown in FIG. Figure 2 The wire ring shown in 212, or Figure 3 The welding wire ring 312 shown in FIG. 4 can be Figure 1 The pad 122 is shown in FIG.

[0128] In some embodiments, the energy of the laser beam emitted by the laser source 462 can be absorbed by the welding wire ring four 412, the welding wire ring four 412 melts, fills the gap between the welding pad two 422 and the terminal three 424, and forms a welding point at the joint position of the welding pad two 422 and the terminal three 424.

[0129] In some embodiments, the laser beam emitted by the laser source 462 is divergent light or convergent light. That is, the laser beam has a preset divergent angle or convergent angle. In addition, the laser source 462 can move along the axial direction of the terminal three 424, for example, close to the terminal three 424 or away from the terminal three 424, so as to change the range of the laser beam irradiated on the terminal three 424, so as to fully utilize the energy of the laser beam and reduce the impact on other areas on the circuit board. For example, Figure 4 As shown, the laser beam emitted by the laser source 462 is divergent light. When the laser source 462 is close to the terminal 3 424, the irradiation range of the laser beam emitted by the laser source 462 on the terminal 3 424 decreases. When the laser source 462 is away from the terminal 3 424, the irradiation range of the laser beam emitted by the laser source 462 on the terminal 3 424 increases.

[0130] refer to Figure 1 In some embodiments, the assembly device 100 further includes a heating device 154, which can heat the pad 122. For example, the heating device 154 can preheat the pad 122 before the welding device 108 welds the wire ring 112, which is beneficial to shorten the welding time and improve the welding efficiency. In some embodiments, the heating device 154 can generate hot air, and the heating device 154 does not need to extend to the position of the pad 122, is not limited by space, and is suitable for heating circuit boards with smaller spacing.

[0131] In some embodiments, the assembly equipment further comprises a detection device, and the detection device comprises a detection device 1 and a detection device 2. Figure 1 The assembly equipment 100 includes a detection device 156. The detection device 156 can detect the solder joints between the terminal 124 and the pad 122. The detection device 156 can detect the soldering quality, and can perform repair soldering or re-soldering for solder joints that do not meet the soldering quality requirements, which is beneficial to improving the quality of the circuit board 120.

[0132] Figure 5 FIG. 1 is a block diagram of an exemplary detection device consistent with some embodiments of the present disclosure. Figure 5 , the second detection device 556 includes a planar image acquisition device 564 and a stereoscopic image acquisition device 566. The planar image acquisition device 564 can acquire a planar image of the solder joint. For example, the planar image acquisition device 564 can include a planar camera. The stereoscopic image acquisition device 566 can acquire a stereoscopic image of the solder joint. For example, the stereoscopic image acquisition device 566 can include a structured light camera, which can acquire a stereoscopic image of the solder joint.

[0133] The second detection device 556 can detect the welding spot based on the plane image and / or the stereoscopic image. For example, when any one of the plane image or the stereoscopic image of the welding spot does not meet the preset requirements, the welding spot is judged to be unqualified. When both the plane image and the stereoscopic image of the welding spot meet the preset requirements, the welding spot is judged to be qualified.

[0134] In some embodiments, the detection device can determine the area or proportion of the pad covered by the solder joint according to the plane image. For example, the detection device can detect the copper leakage rate of the solder joint (the area or area proportion of the pad not covered by the solder joint) according to the plane image. When the area of ​​the pad covered by the solder joint is less than the area threshold, or the proportion of the pad covered by the solder joint is less than the proportion threshold, the solder joint is judged to be unqualified.

[0135] The detection device can also detect the tilt angle of the side of the solder joint relative to the circuit board based on the stereoscopic image. For example, when the tilt angle of the side of the solder joint relative to the circuit board is greater than an angle threshold, the solder joint is judged to be unqualified.

[0136] The present disclosure also relates to an assembly method for a laser radar. Figure 6 The process of an exemplary assembly method consistent with some embodiments of the present disclosure is shown, wherein the laser radar includes a circuit board, a soldering pad is provided on the circuit board, and the assembly method is used to solder the terminal to the soldering pad.

[0137] refer to Figure 6, the assembly method 600 for the laser radar includes steps S602 to S610. In step S602, the circuit board is fixed. In some embodiments, the circuit board can be fixed by a fixing device, for example, by clamping, bolting, or adsorption to keep the circuit board in a fixed position. In some embodiments, the circuit board can also be fixed to the housing of the laser radar, and the housing of the laser radar is fixed by a fixing device. This can simplify the process and reduce the risk of damage to the circuit board by the fixing device.

[0138] In step S604, the terminal and the pad are kept fixed. In some embodiments, a through hole or a blind hole is processed on the circuit board, and the pad is in a circular ring shape and is arranged at the position of the through hole or the blind hole. The size of the terminal is slightly smaller than the size of the through hole or the blind hole, and the terminal can be inserted into the through hole or the blind hole, and the position of the pad is kept fixed, so that the terminal can be positioned, and when welding, the position of the terminal is kept fixed, which is conducive to improving the welding accuracy of the terminal.

[0139] In step S606, the welding wire is formed and cut to form a welding wire loop. In some embodiments, the welding wire is processed so that the welding wire is bent into a welding wire loop and cut at a preset position. The shape and size of the welding wire loop match the shape and size of the terminal. In this embodiment, the welding wire loop is formed before welding, and there is no need to extend the welding wire to the position where the terminal and the pad are joined. The requirement for the movable space is small, and the shape and size of the welding wire loop matches the shape and size of the terminal, which can match terminals of different sizes, has a wide range of application, and can be applied to terminals of smaller sizes.

[0140] In step S608, the welding wire ring is sleeved on the terminal. After the welding wire is formed into a welding wire ring, the welding wire ring is sleeved on the terminal, and the position of the welding wire ring is as close as possible to the joint position of the terminal and the pad, for example, the welding wire ring is attached to the pad. In some embodiments, the size of the welding wire ring is equal to or slightly larger than the size of the terminal. In this way, in step S608, the friction between the welding wire ring and the terminal can be reduced, which is conducive to the welding wire ring being close to the joint position of the terminal and the pad, and is conducive to keeping the relative position between the terminal and the pad fixed.

[0141] In step S610, the wire ring is heated to weld the terminal to the pad. The wire ring is heated and melted, filling the gap between the pad and the terminal, and forming a protruding solder joint on the pad to weld the terminal to the pad.

[0142] Figure 7 An exemplary process for forming a wire loop consistent with some embodiments of the present disclosure is shown. Figure 7 The welding wire is formed and cut to form a welding wire ring, which includes step S702 and step S704.

[0143] In step S702, the welding wire is formed into a ring. In some embodiments, the welding wire can be formed into a ring using a forming mold. For example, the size of the forming mold is equal to or slightly larger than the size of the terminal, and the welding wire is wrapped around the surface of the forming mold to obtain a ring that matches the size of the terminal.

[0144] In step S704, the welding wire is cut and the welding wire loop is separated. For example, the welding wire that is not wrapped around the forming mold is cut off to obtain the welding wire loop. In some embodiments, the length of the welding wire loop (the length of the welding wire in the welding wire loop) can be determined according to the diameter of the terminal, the diameter of the welding wire, and the gap between the terminal and the pad. The amount of solder can be controlled by the length of the welding wire loop so that the solder can be fully filled in the gap between the terminal and the pad and form a stable solder joint, while avoiding excessive solder that causes adjacent solder joints on the circuit board to be connected, affecting the welding quality of the circuit board, and is suitable for circuit boards with small spacing between terminals or small spacing between terminals and other electronic components.

[0145] In some embodiments, the welding wire is formed into a ring shape by a forming die. The step of sleeve-fitting the welding wire ring on the terminal includes driving the forming die to move to a position aligned with the terminal in the axial direction, separating the welding wire ring from the forming die, and sleeve-fitting the welding wire ring on the terminal. After the welding wire is formed into a ring shape, the welding wire ring is located on the forming die. The forming die is controlled to move, and the welding wire ring can move with the forming die. When the forming die and the terminal are aligned in the axial direction, the welding wire ring is separated from the forming die, and the welding wire ring can fall and sleeve-fit on the terminal.

[0146] Figure 8 An exemplary heating process of a wire loop is shown in accordance with some embodiments of the present disclosure. Figure 8 , heating the welding wire ring, welding the terminal and the welding pad together, and the step of forming a welding point includes step S802 and step S804.

[0147] In step S802, the pad is preheated. Preheating can keep the pad at a certain temperature before welding, which is helpful to reduce welding time and improve welding efficiency. In some embodiments, the pad can be preheated with hot air, without bringing the heat source close to the pad, and the requirement for movement space is small.

[0148] In step S804, the welding wire loop is heated by using a laser source. In this embodiment, the welding wire can be heated at intervals by using a laser source, without being close to the position of the welding wire loop. Compared with processes such as soldering iron, it is suitable for environments with smaller spaces and for terminals and circuit boards with smaller sizes and higher density.

[0149] Fig. 9 An exemplary process of inspecting solder joints according to some embodiments of the present disclosure is shown. Fig. 9The step of detecting the solder joint includes step S902 to step S912.

[0150] In step S902, a planar image of the solder joint is acquired, and the area or proportion of the solder joint covering the pad is detected based on the planar image. For example, an image of a circuit board is acquired using a planar image acquisition device, and the solder joints and pads therein are identified. Based on the planar image, the area of ​​the overlapping area of ​​the solder joint and the pad, or the proportion of the overlapping area of ​​the solder joint and the pad to the total area of ​​the pad can be determined.

[0151] In step S904, a stereoscopic image of the solder joint is acquired, and the inclination angle of the side of the solder joint relative to the circuit board is detected based on the stereoscopic image. For example, a stereoscopic image acquisition device may be used to acquire a stereoscopic image of the solder joint, and the stereoscopic image may be processed to obtain the inclination angle of the side of the solder joint. The solder joint protrudes from the pad, and the inclination angle of the side of the solder joint relative to the circuit board represents the angle of the cross-sectional shape of the solder joint in a plane perpendicular to the circuit board relative to the plane of the circuit board. At different positions of the solder joint, the inclination angle of the side of the solder joint relative to the circuit board may not be equal. In some embodiments, the average value, maximum value, etc. of the inclination angle of the side of the solder joint at different positions relative to the circuit board may be selected.

[0152] In step S906, it is determined whether the area covered by the solder joint is not less than the area threshold, or whether the ratio of the area covered by the solder joint to the total area of ​​the solder joint is not less than the ratio threshold. When the area covered by the solder joint is greater than or equal to the area threshold, or the ratio of the area covered by the solder joint to the total area of ​​the solder joint is greater than or equal to the ratio threshold, in step S910, it is determined that the solder joint is qualified. When the area covered by the solder joint is less than the area threshold, or the ratio of the area covered by the solder joint to the total area of ​​the solder joint is less than the ratio threshold, in step S912, it is determined that the solder joint is unqualified.

[0153] In step S908, it is determined whether the inclination angle of the side of the solder joint is not less than the angle threshold. When the inclination angle of the side of the solder joint is less than the angle threshold, in step S910, the solder joint is determined to be qualified. When the inclination angle of the side of the solder joint is greater than or equal to the angle threshold, in step S912, the solder joint is determined to be unqualified.

[0154] In some embodiments, the amount of solder used is determined based on the diameter of the terminal, the diameter of the solder wire, and the gap between the terminal and the pad. When the solder completely fills the gap between the terminal and the pad, the shape and size of the solder joint formed by the solder protruding from the pad should meet the preset range, and the approximate size of the solder joint can be determined by detecting the side shape of the solder joint. For example, when the inclination angle of the side of the solder joint is large, for example, the solder joint is roughly spherical, when the amount of solder used is fixed, it means that the solder has not been completely filled in the gap between the terminal and the pad, and the solder joint can be judged to be unqualified.

[0155] In some embodiments, the area or proportion of the solder joint covering the pad can be detected based on the plane image, or the tilt angle of the side of the solder joint relative to the circuit board can be detected based on the stereo image. When the detection result meets any of the above items, the solder joint is judged to be qualified. Alternatively, in some embodiments, the area or proportion of the solder joint covering the pad and the tilt angle of the side of the solder joint relative to the circuit board are detected, and when the detection result meets all of the above judgment conditions, the solder joint is judged to be qualified.

[0156] In some embodiments, the aforementioned assembly method for laser radar can be performed using the assembly device for laser radar in the aforementioned embodiments.

[0157] The present disclosure also relates to a circuit board of a laser radar. Fig.10 A side view of an exemplary circuit board consistent with some embodiments of the present disclosure is shown. Fig.10 , the circuit board 2 1020 includes a pad 3 1022, a terminal 4 1024, a substrate 1026 and solder 1028. Among them, the circuit board 2 1020 can be Figure 1 The circuit board 120 shown in FIG. 1; the pad 3 1022 may be Figure 1 The pad 122 shown in FIG. Figure 4 The pad 2 422 shown in FIG. 1 may be a terminal 4 1024; Figure 1 Terminal 124 shown in FIG. Figure 3 Terminal 2 324 shown in, or Figure 4 Terminal three 424 is shown.

[0158] refer to Fig.10 The substrate 1026 is provided with a hole 1030. The hole 1030 may be a through hole that penetrates the substrate 1026, or a blind hole that is closed at one end. The terminal 1024 is disposed at the position of the hole 1030, for example, the terminal 1024 is embedded in the hole 1030, and there is a gap between the terminal 1024 and the hole 1030.

[0159] The pad 3 1022 is located around the terminal 4 1024 and is fixedly connected to the substrate 1026. For example, the pad 3 1022 is attached to the substrate 1026, and the pad 3 1022 is roughly annular and surrounds the terminal 4 1024. In some embodiments, the pad 3 1022 can be a copper alloy to facilitate welding with the solder 1028.

[0160] The solder 1028 is filled in the hole 1030 and protrudes from the pad three 1022. The portion of the solder 1028 protruding from the pad three 1022 forms a solder joint, and the side of the portion of the solder 1028 protruding from the pad three 1022 is a plane or a curved surface that is concave toward the substrate 1026. When the amount of solder 1028 is preset, the side being a plane or a curved surface that is concave toward the substrate 1026 indicates that the solder 1028 is fully filled in the gap between the terminal four 1024 and the pad three 1022 and the hole 1030, and there is no cavity or the cavity is small, which meets the welding quality requirements.

[0161] In some embodiments, the second circuit board 1020 is assembled by the assembly equipment in the aforementioned embodiments, or the second circuit board 1020 is assembled by the assembly method in the aforementioned embodiments.

[0162] In some embodiments, the side of the solder 1028 protruding from the pad 3 1022 is substantially conical or truncated cone-shaped, and the side of the solder has an inclination angle of less than or equal to 70° relative to the substrate 1026. Optionally, the side of the solder has an inclination angle of less than or equal to 45° relative to the substrate 1026.

[0163] Finally, it should be noted that the above is only an embodiment of the present disclosure and is not intended to limit the present disclosure. Although the present disclosure is described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present disclosure shall be included in the protection scope of the present disclosure.

Claims

1. An assembly device for laser radar, characterized in that: The laser radar includes a circuit board, a soldering pad is provided on the circuit board, and the assembly equipment is used to solder the terminal on the soldering pad. The assembly equipment includes: a fixing device, a molding device, an assembling device and a welding device; wherein, The fixing device is configured to fix the circuit board; The shaping device is configured to obtain welding wire and shape the welding wire into a welding wire ring matching the size of the terminal; The assembling device is configured to sleeve the welding wire ring onto the terminal; and The welding device is configured to heat the wire loop to weld the terminal to the pad.

2. The assembly equipment according to claim 1, characterized in that The length of the welding wire loop is determined according to at least one of the following parameters: The diameter of the terminal, the diameter of the welding wire, and the gap between the terminal and the welding pad.

3. The assembly equipment according to claim 1, characterized in that The forming device comprises: a feeding mechanism, a forming die and a cutting mechanism; wherein, The feeding mechanism is configured to extend the welding wire toward the forming die; The forming die and the feeding mechanism can move relative to each other, or the welding wire moves around the forming die along a preset trajectory, so that the welding wire surrounds the surface of the forming die to form the welding wire ring; and The cutting mechanism is configured to cut the welding wire to separate the welding wire loops.

4. The assembly equipment according to claim 3, characterized in that The forming device also includes a clamp configured to fix the welding wire on the surface of the forming die.

5. The assembly device according to claim 4, characterized in that The forming die can move in the axial direction.

6. The assembly equipment according to claim 3, characterized in that The forming device also includes a shaping mechanism, which can move relative to the forming die and is configured to press the two ends of the welding wire ring tightly against the surface of the forming die.

7. The assembly equipment according to claim 3, characterized in that The circuit board includes a plurality of the terminals, and the sizes of the plurality of the terminals are different; a plurality of the pads are arranged on the circuit board, and the plurality of the terminals correspond to the plurality of the pads one by one.

8. The assembly device according to claim 7, characterized in that The forming device comprises a plurality of the forming dies, the plurality of forming dies have different radial sizes, and the diameter of the welding wire ring is equal to or slightly larger than the diameter of the terminal.

9. The assembly equipment according to claim 3, characterized in that The angle at which the welding wire surrounds the surface of the forming die is greater than or equal to 360°.

10. The assembly equipment according to claim 3, characterized in that The assembly equipment further includes a driving device configured to drive the forming device to move after the welding wire loop is formed so as to align the forming die and the terminal in the axial direction.

11. The assembly device according to claim 10, characterized in that The assembling device comprises a pushing claw, which is arranged on the side of the forming die and is configured to push the welding wire ring away from the forming die and sleeve it on the terminal.

12. The assembly device according to claim 10, characterized in that The assembly equipment further comprises a positioning device, which is configured to determine the position of the terminal; the driving device communicates with the positioning device and is configured to drive the molding die to align with the terminal in the axial direction according to the position of the terminal.

13. The assembly device according to claim 12, characterized in that The positioning device includes an image acquisition device configured to acquire images of the circuit board and the terminals.

14. The assembly device according to claim 13, characterized in that The positioning device communicates with the fixing device, and the fixing device is configured to adjust the posture of the circuit board according to the image of the circuit board.

15. The assembly device according to any one of claims 1 to 14, characterized in that: The welding device includes a laser source configured to emit a laser beam and irradiate the laser beam onto the terminal and heat the wire loop.

16. The assembly device according to claim 15, characterized in that The laser beam is divergent light or convergent light, and the laser source is movable along the axial direction of the terminal to change the range of irradiation on the terminal.

17. The assembly device according to claim 15, characterized in that The assembly equipment further includes a heating device configured to heat the pad.

18. The assembly device according to any one of claims 1 to 14, characterized in that The assembly equipment further includes a detection device configured to detect solder joints between the terminals and the pads.

19. The assembly device according to claim 18, characterized in that The detection device includes: a planar image acquisition device and a stereoscopic image acquisition device; wherein, The planar image acquisition device is configured to acquire a planar image of the welding point; The stereoscopic image acquisition device is configured to acquire a stereoscopic image of the welding point; The detection device detects the welding point according to the planar image and / or the stereoscopic image.

20. The assembly device according to claim 19, characterized in that The detection device is configured to determine the area or proportion of the solder joint covering the solder pad based on the planar image; and / or, the detection device is configured to determine the inclination angle of the side of the solder joint relative to the circuit board based on the stereoscopic image.

21. An assembly method for a laser radar, characterized in that: The laser radar includes a circuit board, a soldering pad is provided on the circuit board, and the assembly method is used to solder a terminal on the soldering pad. The assembly method includes: fixing the circuit board; Keeping the terminal and the pad relatively fixed; The welding wire is formed and cut to form a welding wire loop; Sleeve the welding wire ring onto the terminal; The wire ring is heated to weld the terminal to the pad.

22. The assembly method according to claim 21, characterized in that: The steps of shaping and cutting the welding wire to form a welding wire ring include: forming the welding wire into a ring shape; The welding wire is cut to separate the welding wire loop.

23. The assembly method according to claim 22, characterized in that: The step of wrapping the welding wire into a ring shape comprises: wrapping the welding wire around a forming die; The step of sleeve-connecting the welding wire ring onto the terminal comprises: Driving the molding die to move to a position aligned with the terminal in the axial direction; The welding wire ring is separated from the forming die, and the welding wire ring is sleeved on the terminal.

24. The assembly method according to claim 21, characterized in that: The step of heating the welding wire ring comprises: Preheating the pad; The wire loop is heated by a laser source.

25. The assembly method according to claim 21, characterized in that: The assembly method further includes detecting the solder joints; the step of detecting the solder joints includes: Acquire a planar image of the solder joint, and detect the area or proportion of the solder joint covering the solder pad according to the planar image; Acquire a stereoscopic image of the solder joint, and detect the inclination angle of the side surface of the solder joint relative to the circuit board based on the stereoscopic image, The step of detecting the solder joints further comprises: When the area or the ratio is not less than the area threshold or the ratio threshold, the solder joint is judged to be qualified; and / or When the tilt angle is not less than the angle threshold, the solder joint is judged to be unqualified.

26. The assembly method according to any one of claims 21 to 25, characterized in that: The assembly method is performed by the assembly device according to any one of claims 1 to 20.

27. A circuit board for a laser radar, characterized in that: include: Substrates, terminals, pads and solder; The substrate is provided with a hole, which is a through hole or a blind hole; The terminal is arranged at the position of the hole; The pad is located in the circumference of the terminal; The solder is filled in the hole and protrudes from the pad, and the side surface of the portion of the solder protruding from the pad is a plane or a curved surface recessed toward the substrate.

28. The circuit board according to claim 27, characterized in that The side surface of the portion of the solder protruding from the pad is substantially conical or truncated cone-shaped, and the inclination angle of the side surface of the solder relative to the substrate is less than or equal to 70°.

29. The circuit board according to claim 28, characterized in that The inclination angle of the side surface of the solder relative to the substrate is less than or equal to 45°.

30. The circuit board according to any one of claims 27 to 29, characterized in that: The circuit board is assembled by the assembly equipment described in any one of claims 1 to 20; or the circuit board is assembled by the assembly method described in any one of claims 21 to 26.

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