Circuit board assembly and electronic equipment

Abstract

The invention discloses a circuit board assembly and electronic equipment, and belongs to the field of circuit boards. The circuit board assembly comprises a circuit board; the first electronic component is arranged on one side, deviating from the circuit board, of the first electronic component; the second electronic component is arranged on the side, away from the circuit board, of the first electronic component in a stacked mode, the second electronic component is electrically connected with the first electronic component, and the projection of the second electronic component on the circuit board and the projection of the first electronic component on the integrated surface are at least partially overlapped.

Description

Technical Field

[0001] The present application belongs to the field of circuit boards, and specifically relates to a circuit board assembly and an electronic device. Background Art

[0002] With the development of science and technology, electronic devices are increasingly widely used. Electronic devices can be used to shoot videos, watch images, and communicate remotely. Usually, electronic devices are provided with circuit boards, and various electronic components are integrated on the circuit boards. For example, infrared chips are provided on the circuit boards. The electronic components on the circuit boards can enable the electronic devices to achieve various functions. However, in the related art, the electronic components are provided on the circuit boards, which makes the utilization rate of the space on the circuit boards poor. Summary of the invention

[0003] The purpose of the embodiments of the present application is to provide a circuit board assembly and an electronic device, which at least solves the problem that electronic components are arranged on the circuit board, resulting in poor utilization of the circuit board.

[0004] In a first aspect, an embodiment of the present application provides a circuit board assembly, the circuit board assembly comprising:

[0005] Circuit boards;

[0006] A first electronic component, wherein the first electronic component is disposed on a surface of one side of the circuit board;

[0007] The second electronic component is stacked on a side of the first electronic component away from the circuit board, and the second electronic component is electrically connected to the first electronic component, and a projection of the second electronic component on the circuit board at least partially overlaps with a projection of the first electronic component on the circuit board.

[0008] In a second aspect, an embodiment of the present application provides an electronic device, wherein the electronic device includes the circuit board assembly described in the first aspect.

[0009] In the embodiment of the present application, since the first electronic component is arranged on the surface of one side of the circuit board, the second electronic component is arranged on the side of the first electronic component away from the circuit board, and the second electronic component is electrically connected to the first electronic component, it is equivalent to stacking the second electronic component with the first electronic component, so that the projection of the second electronic component on the circuit board overlaps with the projection of the first electronic component on the circuit board at least partially, so that the area occupied by the second electronic component and the first electronic component on the circuit board can be smaller, so that the space utilization rate of the surface of the circuit board is improved, and more electronic components can be arranged on the circuit board. That is, in the embodiment of the present application, by arranging the first electronic component on the circuit board, and the second electronic component on the side of the first electronic component away from the circuit board, the first electronic component and the second electronic component are stacked, so that the space utilization rate of the integrated surface of the circuit board can be effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 An exploded diagram showing that a second electronic component provided in an embodiment of the present application is an infrared chip, and a second electronic component on a circuit board is connected to a plurality of first electronic components;

[0011] Figure 2 A schematic diagram showing that a second electronic component provided in an embodiment of the present application is an infrared chip, and one second electronic component is connected to a plurality of first electronic components on a circuit board;

[0012] Figure 3 A top view showing that a second electronic component provided by an embodiment of the present application is an infrared chip, and one second electronic component is connected to a plurality of first electronic components;

[0013] Figure 4 A bottom view showing that a second electronic component provided by an embodiment of the present application is an infrared chip, and one second electronic component is connected to a plurality of first electronic components;

[0014] Figure 5 A front view showing that a second electronic component provided by an embodiment of the present application is an infrared chip, and one second electronic component is connected to a plurality of first electronic components;

[0015] Figure 6 A side view showing that a second electronic component provided by an embodiment of the present application is an infrared chip, and one second electronic component is connected to a plurality of first electronic components;

[0016] Figure 7 An exploded diagram showing that a second electronic component provided in an embodiment of the present application is an infrared chip, and at least two pins of a second electronic component on a circuit board share a first electronic component;

[0017] Figure 8A schematic diagram showing that a second electronic component provided in an embodiment of the present application is an infrared chip, and at least two pins of a second electronic component on a circuit board share a first electronic component;

[0018] Fig. 9 A bottom view showing that a second electronic component provided in an embodiment of the present application is an infrared chip, and at least two pins of a second electronic component on a circuit board share a first electronic component;

[0019] Fig.10 A front view showing that a second electronic component provided in an embodiment of the present application is an infrared chip, and at least two pins of a second electronic component on a circuit board share a first electronic component;

[0020] Fig.11 A side view showing that a second electronic component provided in an embodiment of the present application is an infrared chip, and at least two pins of a second electronic component on a circuit board share a first electronic component;

[0021] Fig.12 An exploded diagram showing that a second electronic component provided in an embodiment of the present application is a radio frequency chip, and at least two pins of a second electronic component on a circuit board share a first electronic component;

[0022] Fig.13 A schematic diagram showing that a second electronic component provided in an embodiment of the present application is a baseband chip, and a second electronic component on a circuit board is connected to a plurality of first electronic components;

[0023] Fig.14 A front view showing a circuit board provided in an embodiment of the present application, in which a first electronic component and a second electronic component are projected on an integrated surface in a "π" shape;

[0024] Fig.15 A top view showing a circuit board provided in an embodiment of the present application, in which a first electronic component and a second electronic component are projected on an integrated surface in a “π” shape;

[0025] Fig.16 A side view showing a circuit board provided in an embodiment of the present application, in which a first electronic component and a second electronic component are projected on an integrated surface in a "π" shape;

[0026] Fig.17 A top view showing a circuit board provided in an embodiment of the present application, in which the projections of a first electronic component and a second electronic component on an integrated surface form a "mouth" shape;

[0027] Fig.18 A side view showing a circuit board provided in an embodiment of the present application, in which the projections of a first electronic component and a second electronic component on an integrated surface form a "mouth" shape;

[0028] Fig.19 A front view showing a circuit board provided in an embodiment of the present application, in which the projections of a first electronic component and a second electronic component on an integrated surface form a "mouth" shape;

[0029] Fig. 20 Indicates that on a circuit board provided in an embodiment of the present application, the projections of the first electronic component and the second electronic component on the integrated surface are " ＝ "The front view of the type;

[0030] Fig.21 Indicates that on a circuit board provided in an embodiment of the present application, the projections of the first electronic component and the second electronic component on the integrated surface are " ＝ "Top view of the type;

[0031] Fig. 22 Indicates that on a circuit board provided in an embodiment of the present application, the projections of the first electronic component and the second electronic component on the integrated surface are " ＝ "Side view of the type;

[0032] Fig.23 Indicates that on a circuit board provided in an embodiment of the present application, a first electronic component and a second electronic component are stacked into a " _ -_” type front view;

[0033] Fig.24 Indicates that on a circuit board provided in an embodiment of the present application, a first electronic component and a second electronic component are stacked into a " _ -_” type top view;

[0034] Fig.25 Indicates that on a circuit board provided in an embodiment of the present application, a first electronic component and a second electronic component are stacked into a " _ -_" type side view.

[0035] Reference numerals:

[0036] 001: solder; 10: circuit board; 101: integrated surface; 20; first electronic component; 21: first component body; 22; first pin; 23: second pin; 30: second electronic component; 31: second component body; 32: third pin; 33: fourth pin. DETAILED DESCRIPTION

[0037] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0038] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0039] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0040] like Figures 1 to 25 As shown, the circuit board assembly includes: a circuit board 10. A first electronic component 20, which is disposed on a surface of one side of the circuit board 10; a second electronic component 30, which is stacked and disposed on a side of the first electronic component 20 away from the circuit board 10, and the second electronic component 30 is electrically connected to the first electronic component 20, and the projection of the second electronic component 30 on the circuit board 10 at least partially overlaps with the projection of the first electronic component 20 on the circuit board 10. The circuit board 10 may have an integrated surface 101, and the first electronic component 20 may be disposed on the integrated surface 101.

[0041] In the embodiment of the present application, since the first electronic component 20 is arranged on the surface of one side of the circuit board 10, the second electronic component 30 is arranged on the side of the first electronic component 20 away from the circuit board 10, and the second electronic component 30 is electrically connected to the first electronic component 20, it is equivalent to stacking the second electronic component 30 with the first electronic component 20, so that the projection of the second electronic component 30 on the circuit board 10 overlaps with the projection of the first electronic component 20 on the circuit board 10 at least partially, so that the area occupied by the second electronic component 30 and the first electronic component 20 on the circuit board 10 can be smaller, so that the space utilization rate of the surface of the circuit board 10 is improved, and more electronic components can be arranged on the circuit board 10. That is, in the embodiment of the present application, by arranging the first electronic component 20 on the circuit board 10, and the second electronic component 30 on the side of the first electronic component 20 away from the circuit board 10, the first electronic component 20 and the second electronic component 30 are stacked, so that the space utilization rate of the integrated surface 101 of the circuit board 10 can be effectively improved.

[0042] In the related art, when electronic components are arranged on the circuit board 10, the electronic components are usually arranged along the extension direction of the surface of the circuit board 10, so that the electronic components are adjacent in the extension direction of the surface of the circuit board 10. However, this method results in a small number of electronic components being arranged on the surface of the circuit board 10, and when communication is required between the electronic components, the communication can only be completed through the circuit board 10, that is, the distance of communication between the electronic components is long. In the embodiment of the present application, it is equivalent to stacking the first electronic component 20 and the second electronic component 30 on the circuit board 10 of the circuit board 10, and the second electronic component 30 is arranged on the side of the first electronic component 20 away from the circuit board 10, so that not only the space on the circuit board 10 is saved, but also more electronic components can be arranged on the circuit board 10, and when the first electronic component 20 and the second electronic component 30 need to communicate, the first electronic component 20 and the second electronic component 30 can communicate directly without passing through the circuit board 10, that is, the distance of communication between the first electronic component 20 and the second electronic component 30 is short, which improves the efficiency of communication between the first electronic component 20 and the second electronic component 30.

[0043] In addition, in the embodiment of the present application, the second electronic component 30 may include at least one of an infrared chip, a radio frequency chip, and a baseband chip, and the first electronic component 20 may include at least one of an inductor, a capacitor, and a resistor.

[0044] When the second electronic component 30 includes an infrared chip, at this time, the first electronic component 20 can be a capacitor, resistor, inductor and other components related to the infrared chip, which is equivalent to stacking the infrared chip on the capacitor, inductor, resistor and other components, so that the utilization rate of the circuit board 10 of the circuit board 10 is improved. In addition, in the related art, when the infrared chip is set on the circuit board 10, it is usually necessary to use an additional padding circuit board for padding, the padding circuit board is set on the circuit board 10 of the circuit board 10, and then the infrared chip is set on the padding circuit board, and the capacitor, resistor, inductor and other components related to the infrared chip are set on the circuit board 10, thereby resulting in a low space utilization rate of the circuit board 10, and the additional use of the padding circuit board also leads to an increase in the cost of the circuit board. In the embodiment of the present application, the infrared chip is stacked on the capacitor, inductor, resistor and other components, which not only improves the space utilization rate of the integrated surface 101 of the circuit board 10, but also can pad the infrared chip by capacitors, inductors, resistors and other components, avoid the additional use of padding circuit boards, and reduce the cost of the circuit board.

[0045] When the second electronic component 30 includes a radio frequency chip, at this time, the first electronic component 20 can be a capacitor, resistor, inductor or other component related to the radio frequency chip, which is equivalent to stacking the radio frequency chip on the capacitor, inductor, resistor or other component, so that the utilization rate of the integrated surface 101 of the circuit board 10 is improved. When the second electronic component 30 includes a baseband chip, at this time, the first electronic component 20 can be a capacitor, resistor, inductor or other component related to the baseband chip, which is equivalent to stacking the baseband chip on the capacitor, inductor, resistor or other component, so that the utilization rate of the integrated surface 101 of the circuit board 10 is improved.

[0046] In addition, in the embodiment of the present application, when the second electronic component 30 includes at least one of an infrared chip, a radio frequency chip, and a baseband chip, and the first electronic component 20 includes at least one of an inductor, a capacitor, and a resistor, the second electronic component 30 and the first electronic component 20 may be arranged on the circuit board 10 in different ways, and the following are specifically described as examples:

[0047] Method (1), the function of the first electronic component 20 is different from that of the second electronic component 30, the second electronic component 30 has multiple pins, the number of first electronic components 20 is multiple, the multiple first electronic components 20 are distributed on the circuit board 10 at intervals, and one pin is electrically connected to one first electronic component 20.

[0048] Through such a configuration, it is equivalent to that each pin of the second electronic component 30 is connected to the circuit board 10 through a first electronic component 20, so that the second electronic component 30 can be electrically connected to the circuit board 10, and the second electronic component 30 is equivalent to being stacked on the first electronic component 20, thereby saving space on the circuit board 10 and improving the space utilization rate of the integrated surface 101 of the circuit board 10.

[0049] Method (2): the function of the first electronic component 20 is different from the function of the second electronic component 30; the second electronic component 30 has a plurality of pins, among which at least one group of pins has the same function, and each group of pins includes at least two pins; the number of the first electronic components 20 is multiple, and the multiple first electronic components 20 are arrayed on the circuit board 10, and each group of pins is electrically connected to the same first electronic component 20.

[0050] Through such an arrangement, the pins with the same function as the second electronic component 30 can be connected to the circuit board 10 through the same first electronic component 20, so that the number of first electronic components 20 that can be used for the second electronic component 30 is reduced, which helps to reduce the cost of the circuit board, and the second electronic component 30 is equivalent to being stacked on the first electronic component 20, thereby saving space on the integrated surface 101 of the circuit board 10 and improving the space utilization rate of the integrated surface 101 of the circuit board 10.

[0051] In addition, in the embodiment of the present application, the first electronic component 20 and the second electronic component 30 may include at least one of a resistor, a capacitor, and an inductor, so that components such as an inductor, a capacitor, and a resistor may also be stacked on the integrated surface 101 of the circuit board 10, thereby improving the space utilization of the integrated surface 101. Among them, when the first electronic component 20 and the second electronic component 30 both include at least one of a resistor, a capacitor, and an inductor, the first electronic component 20 and the second electronic component 30 may be arranged on the integrated surface 101 of the circuit board 10 in a variety of ways, and the following are specifically described as examples:

[0052] Method (a), such as Fig.15As shown, the function of the first electronic component 20 is the same as that of the second electronic component 30, and the number of the first electronic components 20 is multiple; the first electronic component 20 includes a first component body 21, a first pin 22 and a second pin 23, the first pin 22 and the second pin 23 are respectively connected to the two opposite ends of the first component body 21, and the first pin 22 and the second pin 23 are both connected to the circuit board 10; at least two of the multiple first electronic components 20 are arrayed along the first direction, and the first pins 22 of the at least two first electronic components 20 arranged in the array are located on the same side of the first component body 21; The second electronic component 30 includes a second component body 31, a third pin 32 and a fourth pin 33. The third pin 32 and the fourth pin 33 are respectively arranged at two opposite ends of the second component body 31. The third pin 32 is connected to the first pin 22 of one of the at least two first electronic components 20 distributed in the array, and the fourth pin 33 is connected to the first pin 22 of another of the at least two first electronic components 20 distributed in the array at intervals. The projection of the at least two first electronic components 20 distributed in the array on the circuit board 10 and the projection of the second electronic component 30 on the circuit board 10 form a "π" shape.

[0053] Through such an arrangement, it is equivalent to stacking one second electronic component 30 on at least two first electronic components 20 at the same time, so that the space utilization rate of the integrated surface 101 of the circuit board 10 can be improved. In addition, the projection of at least two first electronic components 20 and the projection of the second electronic component 30 on the circuit board 10 are arranged in an array to form a "π" shape, which is equivalent to stacking one second electronic component 30 on two first electronic components 20, so that the space utilization rate of the integrated surface 101 of the circuit board 10 can be improved.

[0054] It should be noted that the first pin 22 and the second pin 23 can be fixed on the circuit board 10 by solder 001 , and the third pin 32 and the fourth pin 33 can be connected to the first pin 22 or the second pin 23 by solder 001 .

[0055] Method (b), such as Fig.23As shown, the function of the first electronic component 20 is the same as that of the second electronic component 30, and the number of the first electronic components 20 is multiple; the first electronic component 20 includes a first component body 21, a first pin 22 and a second pin 23, the first pin 22 and the second pin 23 are respectively connected to the two opposite ends of the first component body 21, and the first pin 22 and the second pin 23 are both connected to the circuit board 10; at least two of the multiple first electronic components 20 are arranged in an array, and the at least two first electronic components 20 arranged in the array are located on the same straight line, and among the at least two first electronic components 20 arranged in the array, the first pin 22 of one first electronic component faces the other The second electronic component 30 includes a second component body 31, a third pin 32 and a fourth pin 33, the third pin 32 and the fourth pin 32 are respectively arranged at two opposite ends of the second component body 31, the third pin 32 is connected to the first pin 22 of one of the at least two first electronic components 20 distributed in the array, and the fourth pin 33 is connected to the second pin 23 of the other of the at least two first electronic components 20 distributed in the array, and the projections of the at least two first electronic components 20 distributed in the array on the circuit board 10 and the projections of the second electronic component 30 on the circuit board 10 are located in the same straight line.

[0056] Through such an arrangement, it is equivalent to stacking one second electronic component 30 on at least two first electronic components 20 at the same time, so that the space utilization rate of the integrated surface 101 of the circuit board 10 can be improved. In addition, the projections of at least two first electronic components 20 distributed in the array on the circuit board 10 and the projections of the second electronic component 30 on the circuit board 10 are located in the same straight line, which is equivalent to stacking the first electronic component 20 and the second electronic component 30 to form a "_-_" shape, so that one second electronic component 30 is stacked on two first electronic components 20, which can improve the space utilization rate of the integrated surface 101 of the circuit board 10.

[0057] Method (c), such as Fig. 20 and Fig. 22 As shown, the function of the first electronic component 20 is the same as that of the second electronic component 30; the first electronic component 20 includes a first component body 21, a first pin 22 and a second pin 23, the first pin 22 is connected to the first end of the first component body 21, the second pin 23 is connected to the second end of the first component body 21, and the first pin 22 and the second pin 23 are both connected to the circuit board 10; the second electronic component 30 includes a second component body 31, a third pin 32 and a fourth pin 33, the third pin 32 is connected to one end of the second component body 31, the fourth pin 33 is connected to the other end of the second component body 31, the third pin 32 is connected to the first pin 22, and the fourth pin 33 is connected to the second pin 23.

[0058] Through such an arrangement, it is equivalent to stacking a second electronic component 30 on a first electronic component 20, so that the space utilization rate of the circuit board 10 can be improved. In addition, the fourth pin 33 is connected to the other end of the second component body 31, the third pin 32 is connected to the first pin 22, and the fourth pin 33 is connected to the second pin 23, which is equivalent to stacking the first electronic component 20 and the second electronic component 30 to form an "=" shape, which can improve the space utilization rate of the circuit board 10.

[0059] Method (d), such as Fig.17 As shown, the function of the first electronic component 20 is the same as that of the second electronic component 30, the number of the first electronic components 20 is multiple, and the number of the second electronic components 30 is multiple; the first electronic component 20 includes a first component body 21, a first pin 22 and a second pin 23, the first pin 22 and the second pin 23 are respectively connected to the two opposite ends of the first component body 21, the first pin 22 and the second pin 23 are both connected to the circuit board 10, and the second electronic component 30 includes a second component body 31, a third pin 32 and a fourth pin 32 are respectively arranged at the two opposite ends of the second component body 31; at least two of the multiple first electronic components 20 are arranged in an array along the first direction, and the array The first pins 22 of the at least two first electronic components 20 distributed in a row are located on the same side of the first component body 21, the first pin 22 of one of the at least two first electronic components 20 distributed in an array is respectively connected to the third pin 32 and the fourth pin 33 of a second electronic component 30, the first pin 22 of another of the at least two first electronic components 20 distributed in an interval is respectively connected to the third pin 32 and the fourth pin 33 of another second electronic component 30, and the projections of the at least two first electronic components 20 distributed in an array and the projections of the second electronic components 30 connected to the first electronic components 20 on the circuit board 10 enclose a "mouth" shape.

[0060] Through such an arrangement, it is equivalent to stacking two second electronic components 30 on at least two first electronic components 20 at the same time, so that the space utilization rate of the integrated surface 101 of the circuit board 10 can be improved. In addition, the projections of the at least two first electronic components 20 distributed in the array on the circuit board 10 and the projections of the second electronic components 30 connected to the first electronic components 20 on the circuit board 10 are enclosed to form a "mouth" shape, which can improve the space utilization rate of the integrated surface 101 of the circuit board 10.

[0061] Of course, in the embodiment of the present application, the first electronic component 20 and the second electronic component 30 may also have other stacking methods, not limited to the methods disclosed in the present application, for example, two first electronic components 20 are arranged in an array, one second electronic component 30 crosses the two first electronic components 20 at the same time, and the second electronic component 30 is simultaneously connected to the side of the two second electronic components 30 away from the circuit board 10. The embodiment of the present application does not limit the stacking method of the first electronic component 20 and the second electronic component 30.

[0062] In the embodiment of the present application, since the first electronic component 20 is arranged on the surface of one side of the circuit board 10, the second electronic component 30 is arranged on the side of the first electronic component 20 away from the circuit board 10, and the second electronic component 30 is electrically connected to the first electronic component 20, it is equivalent to stacking the second electronic component 30 with the first electronic component 20, so that the projection of the second electronic component 30 on the circuit board 10 overlaps with the projection of the first electronic component 20 on the circuit board 10 at least partially, so that the area occupied by the second electronic component 30 and the first electronic component 20 on the circuit board 10 can be smaller, so that the space utilization rate of the surface of the circuit board 10 is improved, and more electronic components can be arranged on the circuit board 10. That is, in the embodiment of the present application, by arranging the first electronic component 20 on the circuit board 10, and the second electronic component 30 on the side of the first electronic component 20 away from the circuit board 10, the first electronic component 20 and the second electronic component 30 are stacked, so that the space utilization rate of the integrated surface 101 of the circuit board 10 can be effectively improved.

[0063] An embodiment of the present application provides an electronic device, which includes the circuit board assembly in any one of the above embodiments.

[0064] It should be noted that in the embodiments of the present application, electronic devices include but are not limited to controllers, smart devices, terminal products and other devices, where smart devices are, for example, smart phones, smart TVs, smart speakers, smart robots, VR devices, AR devices, XR devices and other devices, and terminal products include personal computers, tablet computers and other products.

[0065] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0066] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A circuit board assembly, characterized in that: The circuit board assembly comprises: Circuit boards; A first electronic component, wherein the first electronic component is disposed on a surface of one side of the circuit board; The second electronic component is stacked on a side of the first electronic component away from the circuit board, and the second electronic component is electrically connected to the first electronic component, and a projection of the second electronic component on the circuit board at least partially overlaps with a projection of the first electronic component on the circuit board.

2. The circuit board assembly according to claim 1, characterized in that: The function of the first electronic component is different from that of the second electronic component. The second electronic component has a plurality of pins. There are a plurality of first electronic components. The plurality of first electronic components are distributed on the circuit board at intervals. One pin is electrically connected to one first electronic component.

3. The circuit board assembly according to claim 1, characterized in that: The function of the first electronic component is different from that of the second electronic component, the second electronic component has a plurality of pins, at least one group of the plurality of pins has the same function, and each group of the pins includes at least two pins; There are multiple first electronic components, and the multiple first electronic components are distributed on the circuit board at intervals, and each group of pins is electrically connected to the same first electronic component.

4. The circuit board assembly according to claim 2 or 3, characterized in that: The second electronic component includes at least one of an infrared chip, a radio frequency chip, and a baseband chip, and the first electronic component includes at least one of an inductor, a capacitor, and a resistor.

5. The circuit board assembly according to claim 1, characterized in that: The function of the first electronic component is the same as that of the second electronic component, and the number of the first electronic components is multiple; The first electronic component comprises a first component body, a first pin and a second pin, the first pin and the second pin are respectively connected to two opposite ends of the first component body, and the first pin and the second pin are both connected to the circuit board; At least two of the first electronic components are distributed in an array along a first direction; the second electronic component includes a second component body, a third pin and a fourth pin, the third pin and the fourth pin are respectively arranged at two opposite ends of the second component body, the third pin is connected to a first pin of one of the first electronic components, the fourth pin is connected to a first pin of another first electronic component, and the projection of the first electronic component on the circuit board and the projection of the second electronic component on the circuit board form a "π" shape.

6. The circuit board assembly according to claim 1, characterized in that: The function of the first electronic component is the same as that of the second electronic component, and the number of the first electronic components is multiple; The first electronic component comprises a first component body, a first pin and a second pin, the first pin and the second pin are respectively connected to two opposite ends of the first component body, and the first pin and the second pin are both connected to the circuit board; At least two of the first electronic components are distributed in an array, and the at least two of the first electronic components are located on the same straight line. Among the at least two of the first electronic components, the first pin of one of the first electronic components faces the second pin of the other first electronic component; the second electronic component includes a second component body, a third pin and a fourth pin, the third pin and the fourth pin are respectively arranged at two opposite ends of the second component body, the third pin is connected to the first pin of one of the first electronic components, and the fourth pin is connected to the second pin of the other first electronic component. The projection of the first electronic component on the circuit board and the projection of the second electronic component on the circuit board are located on the same straight line.

7. The circuit board assembly according to claim 1, characterized in that: The function of the first electronic component is the same as the function of the second electronic component; The first electronic component comprises a first component body, a first pin and a second pin, the first pin and the second pin are respectively connected to two opposite ends of the first component body, and the first pin and the second pin are both connected to the circuit board; The second electronic component includes a second component body, a third pin and a fourth pin. The third pin and the fourth pin are respectively arranged at two opposite ends of the second component body. The third pin is connected to the first pin, and the fourth pin is connected to the second pin.

8. The circuit board assembly according to claim 1, wherein: The function of the first electronic component is the same as that of the second electronic component, the number of the first electronic component is plural, and the number of the second electronic component is plural; The first electronic component includes a first component body, a first pin and a second pin, the first pin and the second pin are respectively connected to two opposite ends of the first component body, and the first pin and the second pin are both connected to the circuit board, and the second electronic component includes a second component body, a third pin and a fourth pin, and the third pin and the fourth pin are respectively arranged at two opposite ends of the second component body; At least two of the first electronic components are distributed in an array along a first direction. Among the at least two first electronic components, a first pin of one of the first electronic components is respectively connected to the third pin and the fourth pin of one of the second electronic components, and a first pin of another first electronic component is respectively connected to the third pin and the fourth pin of another second electronic component. The projections of the at least two first electronic components on the circuit board and the projections of the second electronic components connected to the first electronic components on the circuit board form a "mouth" shape.

9. The circuit board assembly according to any one of claims 5 to 8, characterized in that: The first electronic component and the second electronic component both include at least one of a resistor, a capacitor, and an inductor.

10. An electronic device, characterized in that: The electronic device comprises the circuit board assembly according to any one of claims 1-9.

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