Reinforcement processing method and device for flexible circuit board

Abstract

The invention provides a reinforcing processing method and device for a flexible circuit board. The method comprises the following steps: acquiring target demand data of a flexible circuit board and basic data of a reinforcing plate; according to the target demand data and the basic data, determining hypotenuse data; according to the bevel edge data and the basic data, bevel edge machining parameters are determined; carrying out beveled edge processing on the stiffening plate according to the beveled edge processing parameters to obtain a target stiffening plate; and performing lamination processing on the target reinforcing plate and the flexible circuit board to obtain a target flexible circuit board. According to the method, the reinforcing plate is subjected to beveled edge processing, so that stress generated in the bending process of the flexible circuit board can be effectively dispersed and relieved, line damage caused by bending of the flexible circuit board is avoided, the safety of the flexible circuit board is improved, and the service life of the flexible circuit board is prolonged.

Description

Technical Field

[0001] The present invention relates to the technical field of flexible circuit boards, and also to a reinforcement processing method and device for a flexible circuit board. Background Art

[0002] Although flexible printed circuit boards (FPCBs) are thin, light, and soft, they also lose their rigidity. In application scenarios where they need to withstand large external forces or maintain a certain shape stability, flexible printed circuit boards may be damaged due to insufficient mechanical strength. Mounting FR4 (a code for a flame-resistant material grade, which means that the resin material must be able to extinguish itself after burning) reinforcement plates (or reinforcement sheets) can effectively improve the mechanical strength of flexible printed circuit boards, enabling them to withstand greater external forces, thereby improving product reliability and service life. However, the reinforcement plates currently mounted on flexible printed circuit boards are generally designed with side right angles. The flexible printed circuit boards are prone to breaking the circuit when bending back and forth, and the safety performance is poor. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a method and device for reinforcing a flexible circuit board, so as to improve the safety of the flexible circuit board when it is bent.

[0004] In order to solve the above technical problems, the technical solution of the present invention is as follows:

[0005] A first aspect of the present invention provides a method for reinforcing a flexible circuit board, comprising:

[0006] Obtain target demand data for flexible circuit boards and basic data for reinforcement boards;

[0007] Determining hypotenuse data according to the target demand data and the basic data;

[0008] Determining bevel processing parameters according to the bevel data and the basic data;

[0009] Performing beveling processing on the reinforcement plate according to the beveling processing parameters to obtain a target reinforcement plate;

[0010] The target reinforcement plate and the flexible circuit board are bonded to obtain a target flexible circuit board.

[0011] Optionally, obtain target demand data for flexible circuit boards, including:

[0012] Obtain bending radius data, bending frequency data and material property data of the flexible circuit board;

[0013] Target demand data for the flexible circuit board is obtained according to the bending radius data, the bending frequency data and the material property data.

[0014] Optionally, determining the hypotenuse data according to the target demand data and the basic data includes:

[0015] Obtaining a hypotenuse angle according to the target demand data and the basic data;

[0016] Obtaining the hypotenuse length according to the target demand data and the hypotenuse angle;

[0017] The hypotenuse data is determined according to the hypotenuse angle and the hypotenuse length.

[0018] Optionally, obtaining the bevel angle according to the target demand data and the basic data includes:

[0019] Input the target demand data and the basic data into the preset bevel angle simulation model , get the simulated bevel angle;

[0020] Verifying the simulated bevel angle to obtain a verification result;

[0021] Adjusting the simulated bevel angle according to the verification result to obtain the bevel angle;

[0022] in, is the simulated bevel angle, R is the bending radius data, f is the bending frequency data, T is the thickness data, M is the material property data, a, b, c, d are all preset coefficients, is the base value of the bending radius, is the thickness reference value, It is the reference value of bending frequency.

[0023] Optionally, obtaining the hypotenuse length according to the target demand data and the hypotenuse angle includes:

[0024] Obtaining a vertical projection length according to the target demand data and the preset coverage data;

[0025] The hypotenuse length is obtained according to the vertical projection length and the hypotenuse angle.

[0026] Optionally, determining the beveling processing parameters according to the beveling data and the basic data includes:

[0027] According to the basic data, cutting parameters are obtained;

[0028] Obtaining bevel processing parameters according to the bevel data;

[0029] The beveling processing parameters are determined according to the cutting parameters and the beveling processing parameters.

[0030] Optionally, performing beveling processing on the reinforcement plate according to the beveling processing parameters to obtain a target reinforcement plate includes:

[0031] Convert the beveling processing parameters into a format to obtain cutting control parameters and beveling processing control parameters;

[0032] Controlling the cutting equipment to cut the reinforcing plate according to the cutting control parameters to obtain an intermediate reinforcing plate;

[0033] The bevel processing device is controlled to perform bevel processing on the intermediate reinforcement plate according to the bevel processing control parameters to obtain a target reinforcement plate.

[0034] A second aspect of the present invention provides a reinforcement processing device for a flexible circuit board, comprising:

[0035] An acquisition module is used to obtain target demand data of the flexible circuit board and basic data of the reinforcement board;

[0036] A processing module is used to determine bevel data according to the target demand data and the basic data; determine bevel processing parameters according to the bevel data and the basic data; perform bevel processing on the reinforcement plate according to the bevel processing parameters to obtain a target reinforcement plate; and perform bonding processing on the target reinforcement plate and the flexible circuit board to obtain a target flexible circuit board.

[0037] According to a third aspect of the present invention, a computing device is provided, comprising: a processor and a memory storing a computer program, wherein when the computer program is executed by the processor, the method according to the first aspect is executed.

[0038] A fourth aspect of the present invention provides a computer-readable storage medium storing instructions, which, when executed on a computer, causes the computer to execute the method described in the first aspect.

[0039] The above solution of the present invention includes at least the following beneficial effects:

[0040] The above scheme of the present invention determines the bevel data based on the acquired target demand data of the flexible circuit board and the basic data of the reinforcement plate, and then determines the bevel processing parameters based on the bevel data and the basic data of the reinforcement plate. After beveling the reinforcement plate according to the bevel processing parameters, the target reinforcement plate and the flexible circuit board are bonded to obtain the target flexible circuit board. The bevel processing method is used to effectively disperse and relieve the stress generated during the bending process of the flexible circuit board, avoid circuit damage caused by the bending of the flexible circuit board, and is beneficial to improving the safety of use and the service life of the flexible circuit board. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1is a schematic flow chart of a reinforcement processing method for a flexible circuit board in an embodiment of the present invention;

[0042] Figure 2 is a schematic structural diagram of a target reinforcement plate in an embodiment of the present invention;

[0043] Figure 3 is a schematic structural diagram of a target flexible circuit board in an embodiment of the present invention;

[0044] Figure 4 It is a structural schematic diagram of a reinforcement processing device for a flexible circuit board in an embodiment of the present invention.

[0045] Explanation of reference numerals: 11 - target flexible circuit board, 12 - target reinforcement plate. DETAILED DESCRIPTION

[0046] The exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present invention are shown in the accompanying drawings, it should be understood that the present invention can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present invention and to enable the scope of the present invention to be fully communicated to those skilled in the art.

[0047] like Figure 1 As shown, an embodiment of the present invention provides a reinforcement processing method for a flexible circuit board, comprising the following steps:

[0048] Step 101, obtaining target demand data of the flexible circuit board and basic data of the reinforcement board;

[0049] Step 102, determining hypotenuse data according to the target demand data and the basic data;

[0050] Step 103, determining bevel processing parameters according to the bevel data and the basic data;

[0051] Step 104, performing beveling processing on the reinforcement plate according to the beveling processing parameters to obtain a target reinforcement plate;

[0052] Step 105 , performing bonding processing on the target reinforcement plate and the flexible circuit board to obtain a target flexible circuit board.

[0053] The reinforcement processing method for a flexible circuit board proposed in an embodiment of the present invention determines bevel data based on the acquired target demand data of the flexible circuit board and the basic data of the reinforcement plate, and then determines bevel processing parameters based on the bevel data and the basic data of the reinforcement plate. Subsequently, after beveling the reinforcement plate according to the bevel processing parameters, the target reinforcement plate and the flexible circuit board are bonded to obtain a target flexible circuit board. The bevel processing method is used to effectively disperse and relieve the stress generated during the bending process of the flexible circuit board, avoid circuit damage caused by the bending of the flexible circuit board, and is beneficial to improving the safety of use and the service life of the flexible circuit board.

[0054] In an optional embodiment of the present invention, in step 101, obtaining target demand data for flexible circuit boards may include:

[0055] Step 1011, obtaining bending radius data, bending frequency data and material property data of the flexible circuit board;

[0056] Specifically, the bending radius and bending frequency of the flexible circuit board will affect the bevel angle. A smaller bending radius requires a larger bevel angle to disperse stress to prevent the circuit from being damaged by excessive pressure during the bending process of the flexible circuit board. For example, if the bending radius of the flexible circuit board is 1mm, it may be necessary to select a bevel angle of 30° or more to ensure sufficient stress dispersion; for flexible circuit boards that need to be bent frequently, a larger bevel angle should be selected to enhance the stress dispersion effect, thereby increasing its service life. For example, if the flexible circuit board needs to be bent frequently in the device (such as the flexible connection in the flip phone), it may be necessary to select a bevel angle of 45° or more; in addition, the material properties of the flexible circuit board are also an important factor in determining the bevel angle. The elastic modulus, yield strength and toughness of flexible circuit boards of different materials will affect the selection of the bevel angle. Therefore, it is necessary to obtain the bending radius data, bending frequency data and material property data of the flexible circuit board to facilitate the accuracy of the subsequent bevel angle calculation and ensure that the bevel angle can meet the bending requirements and expected life of the flexible circuit board.

[0057] Step 1012, obtaining target demand data of the flexible circuit board according to the bending radius data, the bending frequency data and the material property data;

[0058] Specifically, the target demand data of the flexible circuit board includes the bending radius data, bending frequency data and material property data of the flexible circuit board, and may also include the expected service life data of the flexible circuit board. According to the actual situation, specific target demand data can be obtained, such as bending area width data, to adapt to the determination of the bevel angle or bevel length in different scenarios.

[0059] In an optional embodiment of the present invention, in step 101, obtaining basic data of the reinforcement plate may include:

[0060] Step 1013, obtaining thickness data and geometric data of the reinforcement plate;

[0061] Specifically, the thickness of the reinforcement plate will also affect the subsequent calculation of the bevel angle, so it is necessary to obtain the thickness data of the reinforcement plate; the geometric data of the reinforcement plate includes dimensional data (such as length, width, and shape, etc.), and the geometric data of the reinforcement plate will affect the subsequent calculation of the bevel length. In addition, the position data of the reinforcement plate can also be obtained, that is, the installation position of the reinforcement plate on the flexible circuit board, so as to facilitate the subsequent determination of the bevel length based on the geometric data, position data, etc. of the reinforcement plate.

[0062] Step 1014: Obtain basic data of the reinforcement plate according to the thickness data and the geometric data.

[0063] Specifically, the basic data of the reinforcement plate includes thickness data and geometric data of the reinforcement plate, and may also include position data of the reinforcement plate, that is, the installation position of the reinforcement plate on the flexible circuit board. According to actual conditions, specific basic data can be obtained to determine the bevel angle or bevel length in different scenarios.

[0064] In an optional embodiment of the present invention, step 102 includes:

[0065] Step 1021, obtaining a hypotenuse angle according to the target demand data and the basic data;

[0066] Specifically, the bevel angle can be determined according to the bending radius data, the bending frequency data, the material property data in the target demand data, and the thickness data in the basic data.

[0067] Step 1022, obtaining the hypotenuse length according to the target demand data and the hypotenuse angle;

[0068] Specifically, firstly, the vertical projection length is obtained according to the bending radius data and the bending area width data in the target demand data, and then the hypotenuse length is determined according to the vertical projection length and the hypotenuse angle. Here, the hypotenuse length should be sufficient to cover the bending area of ​​the flexible circuit board to ensure that the stress can be evenly distributed to the entire hypotenuse area during the bending process.

[0069] Step 1023, determining the hypotenuse data according to the hypotenuse angle and the hypotenuse length.

[0070] Specifically, the bevel data mainly includes the bevel angle and the bevel length, which is convenient for the subsequent bevel processing of the reinforcement plate according to the bevel data. It should be noted that the bevel angle and the bevel length can also be determined according to the bending requirements and expected life of the flexible circuit board, and the appropriate calculation method can be selected according to the actual situation. For example, for a flexible circuit board with a bending radius of 2mm and a medium bending frequency (bending several times a day), the reinforcement plate material is FR4 (glass fiber cloth + resin), and the final bevel angle is 30° (selected according to the bending radius and bending frequency), and the bevel length is 5mm (calculated according to the bending area and processing accuracy).

[0071] In an optional embodiment of the present invention, step 1021 includes:

[0072] Step 10211: input the target demand data and the basic data into a preset bevel angle simulation model , get the simulated bevel angle;

[0073] Specifically, the simulated bevel angle calculated according to the preset bevel angle simulation model formula can be adjusted according to actual conditions.

[0074] Step 10212, verifying the simulated bevel angle to obtain a verification result;

[0075] Specifically, after calculating the simulated bevel angle, a reinforcement plate sample with a simulated bevel angle can be made first. After the sample is attached to the flexible circuit board, a bending test is performed to observe its durability and performance, and a verification result is obtained. The verification result may include the simulated bevel angle, durability and performance.

[0076] Step 10213, adjusting the simulated bevel angle according to the verification result to obtain the bevel angle;

[0077] Specifically, if the durability and performance in the verification results can meet the expected requirements, the simulated bevel angle can be used as the final bevel angle; otherwise, the bevel angle needs to be adjusted and then verified or tested until the optimal bevel angle is found so that the durability and performance in the verification results can meet the expected requirements.

[0078] in, is the simulated bevel angle, in degrees (°), R is the bending radius data, in millimeters (mm), f is the bending frequency data, in times / day, T is the thickness data, in millimeters (mm), M is the material property data, which can be an indicator that combines properties such as elastic modulus, yield strength and toughness. The specific value can be determined based on empirical values ​​or experimental data (in one embodiment, M is 1.5), a, b, c, and d are all preset coefficients (in one embodiment, a is 2.5, b is 0.75, c is 1.2, and d is 0.5), is the base value of the bending radius, is the thickness reference value, are the bending frequency reference values. These reference values ​​are used to make the variables dimensionless. In one embodiment, The value is 5mm. The value is 1mm. The value is 100 times / day.

[0079] In an optional embodiment of the present invention, step 1022 includes:

[0080] Step 10221, obtaining a vertical projection length according to the target demand data and the preset coverage data;

[0081] Specifically, the vertical projection length is the vertical projection length of the reinforcement plate at the bend of the flexible circuit board ("projection length" or "L"), which refers to the length of the straight line segment that the reinforcement plate should cover on the bend area of ​​the flexible circuit board without considering the bevel treatment. This length is generally determined based on the bending design of the flexible circuit board, the position and size requirements of the reinforcement plate. In a specific embodiment, the flexible circuit board needs to be bent at a certain position, the bending radius is R, and the reinforcement plate needs to cover the entire bending area.

[0082] The vertical projection length can be calculated by any of the following methods:

[0083] (1) Obtain the vertical projection length based on the arc length of the bending area.

[0084] According to the bending angle (such as 90 degrees, 180 degrees, etc.) and bending radius in the target demand data, the arc length of the bending area, that is, the vertical projection length, can be calculated. The formula is: , where L is the vertical projection length, is the bending angle, and R is the bending radius.

[0085] (2) Obtain the vertical projection length based on the width of the bending area.

[0086] The preset coverage data is the bending area width, which can be obtained from the design drawing of the flexible circuit board, or calculated according to the following method: , where W is the preset coverage data (i.e. the bending area width), R is the bending radius, is the neutral plane offset (determined according to the mechanical properties of the flexible circuit board material, generally 5% to 20% of the thickness of the flexible circuit board. In this embodiment, for a flexible circuit board with a polyimide (PI) or polyester (PET) substrate, the neutral plane offset can be 0.005 to 0.02 mm), is the bending angle.

[0087] The vertical projection length can be equal to or slightly larger than the bending area width. For example, if the bending area width of the flexible circuit board is 8 mm and the reinforcement plate is required to completely cover this area, the vertical projection length L can be set to 8 mm or slightly larger (for example, 8.5 mm to provide additional support).

[0088] Step 10222, obtaining the hypotenuse length according to the vertical projection length and the hypotenuse angle.

[0089] Specifically, you can To get the hypotenuse length, where S is the hypotenuse length and L is the vertical projection length (i.e. the vertical projection length of the reinforcement plate at the bend). is the hypotenuse angle in radians. When calculating, if the angle is given in degrees, it needs to be converted to radians, that is, ,in, is radians, For degree.

[0090] In a specific embodiment, the vertical projection length L of the reinforcing plate at the bend is 10 mm, and the bevel angle , we need to calculate the hypotenuse length S. First convert the hypotenuse angle from degrees to radians: . Then use the formula to calculate the length of the hypotenuse: Therefore, in this embodiment, the length of the hypotenuse is about 14.14 mm.

[0091] In an optional embodiment of the present invention, step 103 includes:

[0092] Step 1031, obtaining cutting parameters according to the basic data;

[0093] Specifically, the basic data may include the shape, size, material, thickness and other data of the reinforcement plate, and the cutting parameters may include the focal position, cutting speed, output power, gas pressure and gas type, etc. Here, the focal position can be determined according to the thickness and material of the reinforcement plate. The focal position is one of the key factors affecting the quality of laser cutting. For example, for a 1 mm thick stainless steel reinforcement plate, the focus is usually set between 1 / 3 and 1 / 2 of the thickness of the reinforcement plate to ensure that the laser energy can fully act on the reinforcement plate and avoid slag or burnt edges on the cutting surface. The focal position can be precisely controlled by adjusting the focal length of the laser cutting machine; the cutting speed is determined according to the thickness and material of the reinforcement plate. The cutting speed determines the time for the laser to interact with the reinforcement plate, thereby affecting the cutting quality and efficiency. For stainless steel reinforcement plates, cutting speeds that are too fast may result in an uneven cutting surface, while cutting speeds that are too slow may increase the heat-affected zone and reduce the cutting quality. For example, for a 1 mm thick stainless steel reinforcement plate, the cutting speed is usually set between 30 and 100 meters per minute. The specific value needs to be adjusted according to the performance of the laser cutting machine and the material properties of the reinforcement plate; the output power determines the laser The energy output of the cutting machine directly affects the cutting depth and cutting speed. For stainless steel reinforcement plates, the output power needs to be high enough to penetrate the material, but it cannot be too high to avoid excessive melting or burning of the material. According to the model of the laser cutting machine and the material properties of the reinforcement plate, the output power is usually set between several hundred watts and several kilowatts. For example, for a 1 mm thick stainless steel reinforcement plate, a suitable output power range is 1000-2000 watts; during the laser cutting process, auxiliary gases (such as oxygen, nitrogen, etc.) are usually required to blow away the slag and heat generated by the cutting, and at the same time protect the cutting surface from oxidation. The selection of gas pressure and type needs to be determined according to the material properties and cutting requirements of the reinforcement plate. For stainless steel reinforcement plates, nitrogen is usually used as an auxiliary gas to reduce oxidation and slag on the cutting surface. The gas pressure needs to be adjusted according to the cutting speed and output power to ensure cutting quality and efficiency. In this embodiment, the gas pressure of nitrogen can be 4 to 6 bar.

[0094] Step 1032, obtaining bevel processing parameters according to the bevel data;

[0095] Specifically, the bevel processing parameters need to include the bevel angle and bevel length in the bevel data, and may also include the grinding accuracy. Among them, the bevel angle is the core parameter in the bevel processing, which determines the degree of inclination of the bevel of the reinforcement plate. The common bevel angle range is usually between 2° and 45°, and the specific value depends on the bevel angle calculated in the above steps or the actual application scenario. For example, in the reinforcement plate of some precision electronic components, a smaller bevel angle may be required to ensure a close fit with other components, while in some structural parts, a larger bevel angle may help increase the connection strength or optimize the appearance. The bevel length refers to the extension length of the bevel part of the reinforcement plate, and the specific value depends on the bevel angle calculated in the above steps or the actual application scenario. In general, the bevel length should not be too short to avoid causing the edge of the reinforcement plate to be easily damaged, and it should not be too long to avoid unnecessary material waste or affect the aesthetics of the product. The common bevel length ranges from a few millimeters to tens of millimeters (such as 8mm or 8.5mm in the above embodiment), and the specific value needs to be determined according to the actual situation. Grinding accuracy refers to the surface smoothness and angle accuracy achieved after fine grinding of the bevel. The requirements for grinding accuracy usually depend on the application scenario and performance requirements of the reinforcement plate. In some high-precision occasions, it may be necessary to use a high-precision grinder or grinding wheel for fine grinding to ensure that the angle and length of the bevel are extremely accurate. The specific range of grinding accuracy may vary depending on the equipment, process and material.

[0096] Step 1033, determining the beveling processing parameters according to the cutting parameters and the beveling processing parameters.

[0097] Specifically, the beveling processing parameters include cutting parameters for cutting the reinforcing plate and beveling processing parameters for beveling the reinforcing plate.

[0098] In an optional embodiment of the present invention, step 104 includes:

[0099] Step 1041, converting the beveling processing parameters into a format to obtain cutting control parameters and beveling processing control parameters;

[0100] Specifically, according to the type of cutting equipment and the format that can be identified and processed, the format of the cutting parameters in the beveling processing parameters is converted to ensure that the cutting equipment can recognize and cut the reinforcement plate according to the cutting control parameters; according to the type of beveling processing equipment and the format that can be identified and processed, the format of the beveling processing parameters in the beveling processing parameters is converted to ensure that the beveling processing equipment can recognize and bevel the reinforcement plate according to the beveling processing control parameters.

[0101] Step 1042, controlling the cutting device to cut the reinforcing plate according to the cutting control parameters to obtain an intermediate reinforcing plate;

[0102] Specifically, the cutting control parameters are input into the controller of the cutting device, so that the cutting device cuts the reinforcing plate fixed on its workbench into the intermediate reinforcing plates.

[0103] Step 1043, controlling the beveling processing equipment to perform beveling processing on the intermediate reinforcement plate according to the beveling processing control parameters to obtain a target reinforcement plate.

[0104] Specifically, the beveling control parameters are input into the controller of the beveling equipment, so that the chamfering machine in the beveling equipment performs chamfering on the edge of the reinforcement plate to form a desired bevel angle; the grinding wheel grinder in the beveling equipment performs polishing on the bevel to improve its flatness and smoothness; and the edge of the bevel is chamfered to avoid injury to operators caused by sharp edges and improve the safety of the reinforcement plate.

[0105] Here, after the reinforcement plate is beveled, the reinforcement plate after the bevel treatment can also be inspected. If the bevel angle of the reinforcement plate after the bevel treatment conforms to the bevel angle in the bevel data, the bevel length of the reinforcement plate after the bevel treatment conforms to the bevel length in the bevel data, and the flatness of the reinforcement plate after the bevel treatment conforms to the preset flatness, then the reinforcement plate after the bevel treatment is the target reinforcement plate.

[0106] In an optional embodiment of the present invention, step 105 includes:

[0107] Use dust-free cloth and special cleaning agent to clean the bonding surface of the flexible circuit board and the target reinforcement board, remove impurities such as oil, dust, etc., and ensure that the bonding surface is dry and free of moisture residue; determine the position and direction of the target reinforcement board on the flexible circuit board according to the target demand data of the flexible circuit board; use double-sided tape or other bonding materials to stick the target reinforcement board to the specified position of the flexible circuit board, and ensure that there are no bubbles or misalignment between the target reinforcement board and the flexible circuit board; put the bonded target reinforcement board and the flexible circuit board into a press or hot press; perform the pressing process according to the preset pressing parameters. During the pressing process, the equipment will provide appropriate temperature and pressure to fully solidify the double-sided tape or other bonding materials to ensure a tight fit between the target reinforcement board and the flexible circuit board; after the pressing is completed, take out the flexible circuit board with the target reinforcement board and check the bonding quality. If there are problems such as bubbles and misalignment, necessary repairs are required.

[0108] A specific embodiment of the reinforcement processing method of the flexible circuit board proposed in the embodiment of the present invention is as follows:

[0109] Step 111, obtaining data;

[0110] The bending radius data, bending frequency data and material property data of the flexible circuit board are obtained as the target demand data of the flexible circuit board, and the thickness data and geometric data of the reinforcement plate are obtained as the basic data of the reinforcement plate. The acquisition of these data provides a basis for the subsequent bevel data.

[0111] Step 112, determining the hypotenuse data;

[0112] Bevel data includes bevel angle and bevel length. According to the target demand data of the flexible circuit board, the basic data of the reinforcement plate and the relevant formula, the bevel angle and bevel length can be calculated, and the calculated bevel angle and bevel length can be adjusted as needed.

[0113] Step 113, determining bevel processing parameters;

[0114] The beveling processing parameters include cutting parameters for cutting the reinforcing plate and beveling processing parameters for beveling the reinforcing plate.

[0115] Step 114, beveling the reinforcing plate;

[0116] After the format conversion of the cutting parameters in the beveling processing parameters, the cutting control parameters are obtained, which are input into the controller of the cutting device, so that the cutting device cuts the reinforcing plate fixed on its workbench into the first reinforcing plate; after the format conversion of the beveling processing parameters in the beveling processing parameters, the beveling processing control parameters are obtained, which are input into the beveling processing device, so that the beveling processing device performs chamfering, grinding and chamfering on the first reinforcing plate to obtain the target reinforcing plate, such as Figure 2 Shown is a structural schematic diagram of the target reinforcement plate.

[0117] Step 115, lamination processing to obtain the target flexible circuit board.

[0118] After cleaning the bonding surfaces of the flexible circuit board and the target reinforcement board, use double-sided tape or other bonding materials to stick the target reinforcement board on the flexible circuit board, and use a laminating machine or a hot press to press the target flexible circuit board to obtain the target flexible circuit board. Figure 3 , which is a schematic structural diagram of a target flexible circuit board after bonding of the flexible circuit boards, wherein a target reinforcing plate 12 is bonded between the ends of two layers of flexible circuit boards to form a target flexible circuit board 11 .

[0119] The reinforcement processing method for a flexible circuit board proposed in an embodiment of the present invention can transform the sharpness of the right-angle edge into a smoother transition area by beveling the reinforcement plate. During the bending process, the stress will gradually disperse to a wider area along the bevel, rather than being concentrated at one point or one line, which can improve the deformation capacity of the material between the reinforcement plate and the flexible circuit board; during the bending process, the reinforcement plate and the flexible circuit board are allowed to bend in a more natural and smoother manner, reducing the stress caused by material mismatch or uncoordinated deformation. The bending life of the flexible circuit board can be significantly improved, and after multiple bending cycles, the flexible circuit board can still maintain its original performance and structural integrity. In addition, the beveling treatment can also enhance the connection strength between the reinforcement plate and the flexible circuit board, and can provide a larger contact area and a better mechanical locking effect, thereby ensuring that the reinforcement plate will not separate or fall off from the flexible circuit board during the bending process. This stress dispersion effect can significantly reduce the damage to the flexible circuit board during bending, thereby improving its service life and reliability.

[0120] like Figure 4 As shown, an embodiment of the present invention provides a reinforcement processing device 200 for a flexible circuit board, comprising:

[0121] An acquisition module 201 is used to acquire target demand data of the flexible circuit board and basic data of the reinforcement board;

[0122] The processing module 202 is used to determine the bevel data according to the target demand data and the basic data; determine the bevel processing parameters according to the bevel data and the basic data; perform bevel processing on the reinforcement plate according to the bevel processing parameters to obtain a target reinforcement plate; and perform bonding processing on the target reinforcement plate and the flexible circuit board to obtain a target flexible circuit board.

[0123] Optionally, obtain target demand data for flexible circuit boards, including:

[0124] Obtain bending radius data, bending frequency data and material property data of the flexible circuit board;

[0125] Target demand data for the flexible circuit board is obtained according to the bending radius data, the bending frequency data and the material property data.

[0126] Optionally, determining the hypotenuse data according to the target demand data and the basic data includes:

[0127] Obtaining a hypotenuse angle according to the target demand data and the basic data;

[0128] Obtaining the hypotenuse length according to the target demand data and the hypotenuse angle;

[0129] The hypotenuse data is determined according to the hypotenuse angle and the hypotenuse length.

[0130] Optionally, obtaining the bevel angle according to the target demand data and the basic data includes:

[0131] Input the target demand data and the basic data into the preset bevel angle simulation model , get the simulated bevel angle;

[0132] Verifying the simulated bevel angle to obtain a verification result;

[0133] Adjusting the simulated bevel angle according to the verification result to obtain the bevel angle;

[0134] in, is the simulated bevel angle, R is the bending radius data, f is the bending frequency data, T is the thickness data, M is the material property data, a, b, c, d are all preset coefficients, is the base value of the bending radius, is the thickness reference value, It is the reference value of bending frequency.

[0135] Optionally, obtaining the hypotenuse length according to the target demand data and the hypotenuse angle includes:

[0136] Obtaining a vertical projection length according to the target demand data and the preset coverage data;

[0137] The hypotenuse length is obtained according to the vertical projection length and the hypotenuse angle.

[0138] Optionally, determining the beveling processing parameters according to the beveling data and the basic data includes:

[0139] According to the basic data, obtaining cutting parameters;

[0140] Obtaining bevel processing parameters according to the bevel data;

[0141] The beveling processing parameters are determined according to the cutting parameters and the beveling processing parameters.

[0142] Optionally, performing beveling processing on the reinforcement plate according to the beveling processing parameters to obtain a target reinforcement plate includes:

[0143] Convert the beveling processing parameters into a format to obtain cutting control parameters and beveling processing control parameters;

[0144] Controlling the cutting equipment to cut the reinforcing plate according to the cutting control parameters to obtain an intermediate reinforcing plate;

[0145] The bevel processing device is controlled to perform bevel processing on the intermediate reinforcement plate according to the bevel processing control parameters to obtain a target reinforcement plate.

[0146] The reinforcement processing device for a flexible circuit board proposed in an embodiment of the present invention determines bevel data based on the acquired target demand data of the flexible circuit board and the basic data of the reinforcement plate, and then determines bevel processing parameters based on the bevel data and the basic data of the reinforcement plate. Subsequently, after beveling the reinforcement plate according to the bevel processing parameters, the target reinforcement plate and the flexible circuit board are bonded together to obtain a target flexible circuit board. The bevel processing method is used to effectively disperse and relieve the stress generated during the bending process of the flexible circuit board, thereby avoiding circuit damage caused by the bending of the flexible circuit board, which is beneficial to improving the safety of use and the service life of the flexible circuit board.

[0147] It should be noted that the device is a device corresponding to the above method, and all implementations in the above method embodiment are applicable to the embodiment of the device and can achieve the same technical effect. This embodiment will not be repeated.

[0148] The embodiment of the present invention further provides a computing device, comprising: a processor, and a memory storing a computer program, wherein when the computer program is executed by the processor, the method described in any one of the above embodiments is executed. All implementations in the above method embodiments are applicable to the embodiments of the device, and can achieve the same technical effects. They will not be described in detail in this embodiment.

[0149] The embodiment of the present invention further provides a computer-readable storage medium on which instructions are stored. When the instructions are executed on a computer, the computer executes the method as described in any one of the above embodiments. All implementations in the above method embodiments are applicable to the embodiments of the device and can achieve the same technical effects. They will not be described in detail in this embodiment.

[0150] It should be noted that in the apparatus and method of the present invention, it is obvious that each component or each step can be decomposed and / or recombined. These decompositions and / or recombinations should be regarded as equivalent solutions of the present invention. In addition, the steps of performing the above series of processes can naturally be performed in chronological order according to the order of description, but do not necessarily need to be performed in chronological order. Some steps can be performed in parallel, crosswise or independently of each other.

[0151] It should be noted that, in the above-mentioned embodiments, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "include one..." do not exclude the existence of other identical elements in the process, method, article or device including the element. In addition, it should be pointed out that the scope of the methods and devices in the implementation of the above-mentioned embodiments is not limited to performing functions in the order shown or discussed, and may also include performing functions in a substantially simultaneous manner or in the opposite order according to the functions involved, for example, the described method may be performed in an order different from that described, and various steps may also be added, omitted, or combined. In addition, the features described with reference to certain examples may be combined in other examples.

[0152] The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for reinforcing a flexible circuit board, characterized in that: include: Obtain target demand data for flexible circuit boards and basic data for reinforcement boards; Determining hypotenuse data according to the target demand data and the basic data; Determining bevel processing parameters according to the bevel data and the basic data; Performing beveling processing on the reinforcement plate according to the beveling processing parameters to obtain a target reinforcement plate; The target reinforcement plate and the flexible circuit board are bonded to obtain a target flexible circuit board.

2. The method for reinforcing a flexible circuit board according to claim 1, characterized in that: Obtain target demand data for flexible circuit boards, including: Obtain bending radius data, bending frequency data and material property data of the flexible circuit board; Target demand data for the flexible circuit board is obtained according to the bending radius data, the bending frequency data and the material property data.

3. The method for reinforcing a flexible circuit board according to claim 1, characterized in that: Determining hypotenuse data according to the target demand data and the basic data includes: Obtaining a hypotenuse angle according to the target demand data and the basic data; Obtaining the hypotenuse length according to the target demand data and the hypotenuse angle; The hypotenuse data is determined according to the hypotenuse angle and the hypotenuse length.

4. The method for reinforcing a flexible circuit board according to claim 3, characterized in that: According to the target demand data and the basic data, the bevel angle is obtained, including: Input the target demand data and the basic data into the preset bevel angle simulation model , get the simulated bevel angle; Verifying the simulated bevel angle to obtain a verification result; Adjusting the simulated bevel angle according to the verification result to obtain the bevel angle; in, is the simulated bevel angle, R is the bending radius data, f is the bending frequency data, T is the thickness data, M is the material property data, a, b, c, d are all preset coefficients, is the base value of the bending radius, is the thickness reference value, It is the reference value of bending frequency.

5. The method for reinforcing a flexible circuit board according to claim 3, characterized in that: According to the target demand data and the hypotenuse angle, the hypotenuse length is obtained, including: Obtaining a vertical projection length according to the target demand data and the preset coverage data; The hypotenuse length is obtained according to the vertical projection length and the hypotenuse angle.

6. The method for reinforcing a flexible printed circuit board according to claim 1, characterized in that: Determining bevel processing parameters according to the bevel data and the basic data, including: According to the basic data, a cutting parameter is obtained; Obtaining bevel processing parameters according to the bevel data; The beveling processing parameters are determined according to the cutting parameters and the beveling processing parameters.

7. The method for reinforcing a flexible printed circuit board according to claim 1, characterized in that: The reinforcing plate is beveled according to the bevel processing parameters to obtain a target reinforcing plate, including: Convert the beveling processing parameters into a format to obtain cutting control parameters and beveling processing control parameters; Controlling the cutting equipment to cut the reinforcing plate according to the cutting control parameters to obtain an intermediate reinforcing plate; The bevel processing device is controlled to perform bevel processing on the intermediate reinforcement plate according to the bevel processing control parameters to obtain a target reinforcement plate.

8. A reinforcement processing device for a flexible circuit board, characterized in that: include: An acquisition module is used to obtain target demand data of the flexible circuit board and basic data of the reinforcement board; A processing module is used to determine bevel data according to the target demand data and the basic data; determine bevel processing parameters according to the bevel data and the basic data; perform bevel processing on the reinforcement plate according to the bevel processing parameters to obtain a target reinforcement plate; and perform bonding processing on the target reinforcement plate and the flexible circuit board to obtain a target flexible circuit board.

9. A computing device, characterized in that include: A processor and a memory storing a computer program, wherein when the computer program is executed by the processor, the method according to any one of claims 1 to 7 is performed.

10. A computer-readable storage medium, characterized in that: Instructions are stored, and when the instructions are executed on a computer, the computer is caused to execute the method according to any one of claims 1 to 7.

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