Manufacturing method of multi-layer aluminum substrate and manufactured multi-layer aluminum substrate

Abstract

The invention relates to the technical field of aluminum substrates, in particular to a manufacturing method of a multi-layer aluminum substrate and the multi-layer aluminum substrate manufactured by the same, and the manufacturing method comprises the following steps: drilling, obtaining non-metallized holes, pasting blue glue on the aluminum-based surface of the aluminum substrate, filling resin into the non-metallized holes, and grinding the non-aluminum-based surface of the aluminum substrate. Manufacturing an inner layer pattern and performing optical detection on the inner layer to obtain a manufactured aluminum substrate; manufacturing an inner layer pattern on the flame-retardant plate, performing optical detection on the inner layer, and performing browning treatment to obtain the manufactured flame-retardant plate; the manufactured aluminum substrate and the manufactured flame-retardant plate are pressed together, plated-through holes are drilled, copper deposition and whole plate electroplating are carried out, an outer layer pattern is manufactured, optical detection is carried out on an outer layer, and solder resisting, gold melting and forming treatment are carried out. The aluminum substrate and the flame-retardant plate are adopted for manufacturing, so that the production cost can be reduced; according to the invention, the plated-through holes for connecting the inner-layer copper foil can be manufactured in the aluminum substrate, so that the use requirements of people are met.

Description

Technical Field

[0001] The invention relates to the technical field of aluminum substrates, in particular to a method for manufacturing a multi-layer aluminum substrate and a method for installing the same. Background Art

[0002] As the functions and performance requirements of electronic products become higher and higher, the technical requirements for aluminum substrates are becoming more and more stringent. For example, characteristics such as high-speed transmission, low energy consumption and high stability have brought new challenges to the design and manufacture of aluminum substrates. Therefore, aluminum substrates need to continuously introduce new technologies and products to meet market demand, such as multi-layer aluminum substrates.

[0003] Existing multi-layer aluminum substrates are mostly made by mixing aluminum substrates and aluminum substrates. Although multi-layer aluminum substrates can be obtained, the cost is relatively high, and the obtained multi-layer aluminum substrates cannot be made with metallized holes (PTH holes) that can connect to the inner copper foil. Summary of the invention

[0004] The present invention provides a method for manufacturing a multi-layer aluminum substrate. Because an aluminum substrate and a flame retardant plate are mixed and pressed, the production cost is reduced. First, the aluminum substrate is drilled and the holes are plugged with resin. Secondly, the flame retardant plate and the aluminum substrate are pressed together. Finally, the required holes are drilled at the positions of the resin plugging holes of the aluminum substrate. PTH holes can be manufactured by copper deposition and electroplating to meet people's usage needs.

[0005] To achieve the above object, the present invention provides the following technical solutions: A method for manufacturing a multi-layer aluminum substrate, the specific steps are as follows: Making aluminum substrate: drilling holes in the reserved metallized holes in the aluminum substrate to obtain non-metallized holes, pasting blue glue on the aluminum base surface of the aluminum substrate, inserting resin into the non-metallized holes, grinding the non-aluminum base surface of the aluminum substrate, and then making inner layer patterns and optically inspecting the inner layer to obtain the finished aluminum substrate; Making flame retardant board: making inner layer pattern on the flame retardant board and optically inspecting the inner layer, and then browning the inner layer to obtain the flame retardant board; Making a multi-layer aluminum substrate: Press the aluminum substrate and the flame-retardant board together, drill metallized holes on the resin of the non-metallized holes, perform copper deposition and whole-board electroplating, make the outer layer graphics and perform optical inspection on the outer layer, perform solder mask, gold plating and molding treatment, and the finished product can be obtained.

[0006] As a further solution of the present invention: the flame retardant grade of the flame retardant board reaches FR4 level, which can greatly reduce the damage of electronic products caused by heating.

[0007] As a further solution of the present invention: the manufactured aluminum substrate and the manufactured flame retardant plate are pressed together with thermally conductive adhesive. The thermally conductive adhesive is a single-component, heat-conductive, room-temperature curing silicone adhesive sealant. It releases low molecules through a condensation reaction with moisture in the air to cause cross-linking and curing, and is vulcanized into a high-performance elastomer. The thermally conductive adhesive has excellent resistance to cold and hot alternation, aging resistance and electrical insulation performance, and has excellent moisture resistance, shock resistance, corona resistance, leakage resistance and chemical medium resistance. It can be used sustainably at -60~280℃ and maintain performance. The thermally conductive adhesive does not swell and has good adhesion to most metal and non-metal materials, ensuring the use effect.

[0008] As a further solution of the present invention: the diameter of the non-metallized hole is 0.2-0.3 mm larger than the diameter of the metallized hole, which is convenient for the subsequent production of the metallized hole.

[0009] As a further solution of the present invention: resin is plugged into the non-metallized hole by vacuum plugging. Vacuum plugging utilizes vacuum to absorb air in the aluminum substrate and injects resin into the non-metallized hole so that there is no obvious boundary between the non-metallized hole and the aluminum substrate, thereby achieving a soft appearance with good appearance consistency.

[0010] As a further solution of the present invention: a single-sided grinding plate is used to grind the non-aluminum base surface of the aluminum substrate to avoid damaging the aluminum base surface of the aluminum substrate.

[0011] As a further solution of the present invention: the flame retardant board adopts a double-sided copper-clad board. Copper is not only conductive but also has a high TG transition temperature (the temperature point at which the material begins to transform from a solid state to a rubber state), which is low in cost and has a good use effect.

[0012] As a further solution of the present invention: the double-sided copper clad laminate includes two copper foil layers and a PP (polypropylene) layer located between the two copper foil layers, which has a simple structure, is easy to manufacture and has low cost.

[0013] The present invention also includes a multilayer aluminum substrate obtained by the above-mentioned manufacturing method, wherein the multilayer aluminum substrate includes, from top to bottom, a copper base of the aluminum substrate, an aluminum base of the aluminum substrate, a thermal conductive adhesive, a first copper foil layer of a double-sided copper clad laminate, a PP layer of the double-sided copper clad laminate, and a second copper foil layer of the double-sided copper clad laminate, and the non-metallized hole is located between the copper base of the aluminum substrate and the aluminum base of the aluminum substrate and is in contact with the thermal conductive adhesive.

[0014] Compared with the prior art, the present invention has the following beneficial effects: First, the present invention adopts aluminum substrate and flame retardant board, which can reduce production cost compared with the existing aluminum substrate and aluminum substrate mixed; Second, the present invention can make metallized holes in the aluminum substrate for connecting the inner copper foil, which meets people's use needs and has broad market prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 Schematic diagram of the overall structure of a multi-layer aluminum substrate obtained by the method for manufacturing a multi-layer aluminum substrate in an embodiment of the present invention.

[0016] In the figure: 1-copper base, 2-aluminum base, 3-thermal conductive adhesive, 4-first copper foil layer, 5-PP layer, 6-second copper foil layer, 7-non-metallized hole. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0019] Embodiment 1: A method for manufacturing a multi-layer aluminum substrate, the specific steps are as follows: Making an aluminum substrate: drilling holes at the positions reserved for metallized holes in the aluminum substrate to obtain non-metallized holes 7. The aperture of the non-metallized holes 7 is 0.2 mm larger than the aperture of the required metallized holes, which is convenient for making metallized holes later. Pasting blue glue on the aluminum base surface of the aluminum substrate can prevent the resin from overflowing to the aluminum base surface of the aluminum substrate when the resin is plugged into the non-metallized holes 7, thereby avoiding the subsequent cleaning process and even affecting the performance of the finished product. The resin is plugged into the non-metallized holes 7 by vacuum plugging. The vacuum plugging uses vacuum to absorb the air in the aluminum substrate and injects the resin into the non-metallized holes 7, so that there is no obvious boundary between the non-metallized holes and the aluminum substrate, thereby achieving a soft appearance with good appearance consistency. Because the aluminum base is easily corroded by acidic solutions, plugging the resin can prevent the aluminum base in the non-metallized holes 7 from being corroded. Then, a single-sided grinding plate is used to grind the non-aluminum base surface of the aluminum substrate to avoid damaging the aluminum base surface of the aluminum substrate. Then, an inner layer pattern is made and an optical inspection is performed on the inner layer to obtain the aluminum substrate after manufacture. Making flame retardant board: Make inner layer pattern on the flame retardant board and conduct optical inspection on the inner layer, and then carry out browning treatment. Browning treatment is to make a brown oxide layer, which can remove grease and debris on the surface, ensure the cleanliness of the board surface, and make the surface of the flame retardant board have a uniform layer of fluff, thereby increasing the bonding strength with the aluminum substrate, avoiding problems such as delamination and explosion, and obtaining the flame retardant board after making; Making a multi-layer aluminum substrate: Pressing the aluminum substrate and the flame-retardant board together with thermally conductive adhesive can ensure the good pressing effect and thermal conductivity between the two. Drilling metallized holes on the resin of the non-metallized hole 7, copper deposition and whole-board electroplating. Copper deposition is to deposit a thin layer of chemical copper on the hole wall of the non-conductive resin hole by chemical methods to serve as the base for the subsequent copper electroplating. Whole-board electroplating is to perform electroplating on the entire board, make the outer layer pattern and perform optical inspection on the outer layer, perform solder mask, gold deposition and molding treatment. Solder mask, also known as resistance welding, refers to the method of using the resistance heat generated by the current passing through the weldment and the contact as a heat source to locally heat the weldment, and pressurize the welding at the same time, and form a film by silk screen printing Attached to the board surface, this film is exposed to light and temperature and solidifies to avoid welding short circuits. Chemical gold plating is chemical gold plating, which means that no external power source is required and only the plating solution is used for chemical reduction reaction, so that the metal ions are continuously reduced on the surface to form a gold plating layer. The molding process is to make the working board produced by the PCB factory into the shape of the finished board shipped to the customer according to the customer's requirements, and then the finished product is subjected to finished product quality control, that is, appearance inspection, size / aperture measurement, performance test, etc. A comprehensive and final inspection and test is carried out to ensure that the product meets the shipping specifications, and then the factory quality assurance test is carried out to ensure that the final product meets the quality management requirements during the factory warehousing process, and then it is packaged and shipped.

[0020] Embodiment 2: A method for manufacturing a multi-layer aluminum substrate, the specific steps are as follows: Making an aluminum substrate: drilling holes at positions reserved for metallized holes in the aluminum substrate to obtain non-metallized holes 7. The aperture of the non-metallized hole 7 is 0.25 mm larger than the aperture of the required metallized hole, which is convenient for making metallized holes later. Pasting blue glue on the aluminum base surface of the aluminum substrate can prevent the resin from overflowing to the aluminum base surface of the aluminum substrate when the resin is inserted into the non-metallized hole 7, thereby avoiding the subsequent cleaning process and even affecting the performance of the finished product. Inserting resin into the non-metallized hole 7 can prevent the aluminum base in the non-metallized hole 7 from being corroded because the aluminum base is easily corroded by acidic liquid medicine. Then, a single-sided grinding plate is used to grind the non-aluminum base surface of the aluminum substrate to avoid damaging the aluminum base surface of the aluminum substrate. Then, an inner layer pattern is made and an optical inspection is performed on the inner layer to obtain the aluminum substrate after manufacture. Making flame retardant board: Making inner layer pattern on the flame retardant board and optically inspecting the inner layer, and then browning treatment. Browning treatment is to make a brown oxide layer, which can remove grease and debris on the surface, ensure the cleanliness of the board surface, and make the surface of the flame retardant board have a uniform fluff, thereby increasing the bonding strength with the aluminum substrate, avoiding problems such as delamination and explosion, and obtaining the flame retardant board after making. The flame retardant grade of the flame retardant board reaches FR4 level, which can greatly reduce the damage caused by heating of electronic products and ensure the service life. The flame retardant board adopts double-sided copper clad board. Copper is not only conductive but also has a high TG transition temperature (the temperature point at which the material begins to change from solid to rubber state), low cost and good use effect. The double-sided copper clad board includes two copper foil layers and a PP layer 5 located between the two copper foil layers; Making a multi-layer aluminum substrate: pressing the aluminum substrate and the flame-retardant board together, drilling metallized holes on the resin of the non-metallized hole 7, and performing copper deposition and whole-board electroplating. Copper deposition is to deposit a thin layer of chemical copper on the hole wall of the non-conductive resin hole by a chemical method to serve as the base for the subsequent copper electroplating. Whole-board electroplating is to perform electroplating on the entire board, make the outer layer graphics and perform optical inspection on the outer layer, perform solder mask, print text, gold deposition and molding. Solder mask, also known as resistance welding, refers to a method of using the resistance heat generated by the current passing through the weldment and the contact as a heat source to locally heat the weldment, and pressurize the weldment at the same time. A film is formed on the board surface by silk screen printing. This film is exposed to light and temperature and solidifies, which can avoid welding. Short circuit, printed text is to engrave the required text information, such as production batch, production number and other information, chemical gold plating is chemical gold plating, that is, no external power supply is required, only relying on the plating solution for chemical reduction reaction, so that the metal ions are continuously reduced on the surface to form a gold plating process, the molding process is to make the working board produced by the PCB factory into the shape of the finished board shipped to the customer according to the customer's requirements, and then the finished product is subjected to finished product quality control, that is, appearance inspection, size / aperture measurement, performance test, etc. Comprehensive and final inspection and testing to ensure that the product meets the shipping specifications, and then the factory quality assurance test is carried out to ensure that the final product meets the quality management requirements during the factory warehousing process, and then it can be packaged and shipped.

[0021] Embodiment 3: A method for manufacturing a multi-layer aluminum substrate, the specific steps are as follows: Making an aluminum substrate: drilling holes at the positions reserved for metallized holes in the aluminum substrate to obtain non-metallized holes 7. The aperture of the non-metallized holes 7 is 0.3 mm larger than the aperture of the required metallized holes, which is convenient for making metallized holes later. Pasting blue glue on the aluminum base surface of the aluminum substrate can prevent the resin from overflowing to the aluminum base surface of the aluminum substrate when the resin is inserted into the non-metallized holes 7, thereby avoiding the subsequent cleaning process and even affecting the performance of the finished product. Inserting the resin into the non-metallized holes 7 by vacuum plugging, because the aluminum base is easily corroded by acidic solution, inserting the resin can prevent the aluminum base in the non-metallized holes 7 from being corroded. The vacuum plugging utilizes vacuum to absorb the air in the aluminum substrate and injects the resin into the non-metallized holes 7, so that there is no obvious boundary between the non-metallized holes and the aluminum substrate, thereby achieving a soft appearance with good appearance consistency. Then, the non-aluminum base surface of the aluminum substrate is ground, and then the inner layer pattern is made and the inner layer is optically inspected to obtain the aluminum substrate after manufacture. Making flame retardant board: Making inner layer pattern on the flame retardant board and optically inspecting the inner layer, and then browning treatment. Browning treatment is to make a brown oxide layer, which can remove grease and debris on the surface, ensure the cleanliness of the board surface, and make the surface of the flame retardant board have a uniform layer of fluff, thereby increasing the bonding strength with the aluminum substrate, avoiding problems such as delamination and explosion, and obtaining the flame retardant board after making. The flame retardant grade of the flame retardant board reaches FR4 level, which can greatly reduce the damage of electronic products caused by heating. The flame retardant board adopts double-sided copper clad board. Copper is not only conductive but also has a high TG transition temperature (the temperature point at which the material begins to change from solid to rubber state), low cost and good use effect. The double-sided copper clad board includes two copper foil layers and a PP layer 5 located between the two copper foil layers; Making a multi-layer aluminum substrate: Pressing the aluminum substrate and the flame-retardant board together with a thermally conductive adhesive 3 can ensure the good pressing effect and thermal conductivity between the two. Drilling a metallized hole on the resin of the non-metallized hole 7, copper deposition and whole-board electroplating are performed. Copper deposition is to deposit a thin layer of chemical copper on the hole wall of the non-conductive resin hole by a chemical method to serve as the base for the subsequent copper electroplating. Whole-board electroplating is to perform electroplating on the entire board, make the outer layer pattern and perform optical inspection on the outer layer, perform solder mask, gold deposition and molding treatment. Solder mask, also known as resistance welding, refers to a method of using the resistance heat generated by the current passing through the weldment and the contact as a heat source to locally heat the weldment, and pressurize the weldment at the same time, and form a film by silk screen printing Attached to the board surface, this film is exposed to light and temperature and solidifies to avoid welding short circuits. Chemical gold plating is chemical gold plating, which means that no external power source is required and only the plating solution is used for chemical reduction reaction, so that the metal ions are continuously reduced on the surface to form a gold plating layer. The molding process is to make the working board produced by the PCB factory into the shape of the finished board shipped to the customer according to the customer's requirements, and then the finished product is subjected to finished product quality control, that is, appearance inspection, size / aperture measurement, performance test, etc. A comprehensive and final inspection and test is carried out to ensure that the product meets the shipping specifications, and then the factory quality assurance test is carried out to ensure that the final product meets the quality management requirements during the factory warehousing process, and then it is packaged and shipped.

[0022] The present invention also includes a multilayer aluminum substrate obtained by the above-mentioned manufacturing method. In one embodiment, the multilayer aluminum substrate includes, from top to bottom, a copper base 1 of the aluminum substrate, an aluminum base 2 of the aluminum substrate, a thermal conductive adhesive 3, a first copper foil layer 4 of a double-sided copper clad laminate, a PP layer 5 of the double-sided copper clad laminate, and a second copper foil layer 6 of the double-sided copper clad laminate. The non-metallized hole 7 is located between the copper base 1 of the aluminum substrate and the aluminum base 2 of the aluminum substrate and is in contact with the thermal conductive adhesive 3.

[0023] It should be noted that, in the present invention, unless otherwise clearly specified and limited, the term "connection" and the like should be understood in a broad sense, for example, it can be a welding connection, a bolt connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0024] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A method for manufacturing a multi-layer aluminum substrate, characterized in that: The specific steps are as follows: Making aluminum substrate: drilling holes in the reserved metallized holes in the aluminum substrate to obtain non-metallized holes, pasting blue glue on the aluminum base surface of the aluminum substrate, inserting resin into the non-metallized holes, grinding the non-aluminum base surface of the aluminum substrate, and then making inner layer patterns and optically inspecting the inner layer to obtain the finished aluminum substrate; Making flame retardant board: making inner layer pattern on the flame retardant board and optically inspecting the inner layer, and then browning the inner layer to obtain the flame retardant board; Making a multi-layer aluminum substrate: Press the aluminum substrate and the flame-retardant board together, drill metallized holes on the resin of the non-metallized holes, perform copper deposition and whole-board electroplating, make the outer layer graphics and perform optical inspection on the outer layer, perform solder mask, gold plating and molding treatment, and the finished product can be obtained.

2. The method for manufacturing a multi-layer aluminum substrate according to claim 1, characterized in that: The flame retardant grade of the flame retardant board reaches FR4 level.

3. The method for manufacturing a multi-layer aluminum substrate according to claim 1, characterized in that: The manufactured aluminum substrate and the manufactured flame retardant plate are pressed together by using a thermal conductive adhesive.

4. The method for manufacturing a multi-layer aluminum substrate according to claim 1 or 3, characterized in that: The diameter of the non-metallized hole is 0.2-0.3 mm larger than the diameter of the metallized hole.

5. The method for manufacturing a multi-layer aluminum substrate according to claim 1, characterized in that: The resin is filled into the non-metallized holes by vacuum plugging.

6. The method for manufacturing a multi-layer aluminum substrate according to claim 1 or 2, characterized in that: The flame retardant board is a double-sided copper-clad board.

7. The method for manufacturing a multi-layer aluminum substrate according to claim 6, characterized in that: The double-sided copper clad laminate comprises two copper foil layers and a PP layer located between the two copper foil layers.

8. A multi-layer aluminum substrate obtained by the method for manufacturing a multi-layer aluminum substrate according to any one of claims 1 to 7.

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