Method and device for processing solar module

Abstract

The invention relates to a method for processing a solar module by means of a recycling device, said method comprising the following steps: detecting the solar module by means of at least one sensor such that said at least one sensor sends measurement data to an electrical control device, said measurement data containing information about said solar module; evaluating the measurement data and determining operation parameters of the recovery equipment; and processing the solar module in the recovery device, the recovery device operating with the determined operating parameters.

Description

Technical Field

[0001] The invention relates to a method for processing solar modules by means of a recycling plant and to a device for carrying out the method. Background Art

[0002] Solar modules are increasingly being used in various configurations to generate electricity from sunlight. For example, these solar modules can be installed in small numbers on private roofs, such as on residential buildings, in order to at least partially cover the electricity needs of the house where the solar modules are installed. This decentralized energy supply is being used more and more, for example, to charge electric vehicles in a decentralized manner. However, solar modules are also installed on a large scale in agricultural areas to generate electricity for commercial purposes and feed it into the public grid.

[0003] The problem is that solar modules have a limited lifespan. The production of solar modules requires the use of expensive raw materials. For example, the conductive strips of most solar modules are made of silver. This alone requires a method to recycle these raw materials so that they can be reused. In addition, more and more solar modules have reached the end of their lifespan and are therefore discarded, which generates a lot of waste that should be recycled or processed, especially considering the environmental compatibility of power generation, which is the epitome of solar modules and the use of sunlight to generate electricity.

[0004] There are many different types of solar modules known in the prior art. However, most known solar modules contain a number of elements. For example, a solar module generally has a base body on which electrical conductors or other metallic components are arranged. The base body can be made of silicon or glass. A solar module also generally has a cover layer, which delimits the solar module to the outside and is generally made of glass or another material that is at least partially transparent, but preferably completely transparent, to visible light.

[0005] Different solar modules must be recycled in different ways to obtain valuable raw materials and enable them to be further utilized. Therefore, different methods are disclosed in different prior art documents. For example, for solar modules with metal components arranged on a glass substrate, JP2014 / 054593A proposes a method in which these components are mechanically removed. Summary of the invention

[0006] The object of the present invention is to simplify the method for processing solar modules and to enable the processing of a greater number of solar modules of different designs.

[0007] The invention achieves the stated object by a method for processing solar modules using a recycling plant, wherein the method comprises the following steps:

[0008] - detecting the solar module by means of at least one sensor, so that the at least one sensor sends measurement data to an electronic control device, wherein the measurement data contains information about the solar module;

[0009] - evaluating the measurement data and determining operating parameters of the recovery device; and

[0010] The solar module is processed in the recycling plant, which is operated with determined operating parameters.

[0011] Therefore, in the method according to the invention, the solar module to be processed is detected by a sensor. Here, the solar module can be detected in whole or in part, it is only important that the measurement data obtained here contain information about the solar module. The measurement data sent by the sensor to the electric control device contain information about the solar module. For example, this information includes the geometric dimensions and / or weight of the solar module or one or more parts of the solar module (such as individual layers). This information may also include information about transmission characteristics and / or materials or materials, and the solar module is at least partially made of said materials or materials. Alternatively or additionally, this information can also include a type name, a manufacturer's name, a logo, a serial number and / or a product series, a bar code or a QR code in order to identify the type of solar module, so that the operating parameters can be determined. For this purpose, it is preferably possible to clearly identify the solar module. However, in many cases, it is sufficient to determine only certain parameters or properties of the solar module or, for example, the product series or classification of the solar module.

[0012] In particular, measurement data are understood to mean all data which can be detected and transmitted by a sensor, ie in particular image data and the information contained therein.

[0013] The electric control device is preferably an electronic data processing device which is able to evaluate the measurement data transmitted to it by the sensor and to use the evaluated measurement data and / or the solar module information extracted therefrom to determine operating parameters used in the subsequent processing of the solar module for operating the recovery device.

[0014] The at least one sensor preferably has at least one optical sensor, in particular at least one optical camera and / or barcode scanner, wherein the measurement data are preferably digital image data. Alternatively or additionally, the at least one sensor has an acoustic sensor, for example an ultrasonic sensor, preferably an ultrasonic transmitter. Alternatively or additionally, the at least one sensor also includes at least one distance sensor, at least one balance, at least one layer thickness sensor and / or a system for performing Laser Induced Breakdown Spectroscopy (LIBS).

[0015] Particularly preferably, the measurement data are evaluated by image recognition software. The image recognition software is executed in the electric control device and evaluates the measurement data transmitted by the at least one optical sensor. Advantageously, the electric control device compares the measurement data with reference data stored in an electronic database.

[0016] Particularly preferably, the electric control device is able to unambiguously determine the type of solar module based on the measurement data. This can be done, for example, if the image recognition software is able to recognize the model identification and / or the serial number in the measurement data (i.e. the digital image data). The model identification and / or the serial number do not necessarily have to be in alphabetical and / or numerical form, but can also be in a purely machine-readable form, such as a barcode or a QR code. The electric control device is preferably configured to have access to an electronic data memory in which information about the various types of solar modules is stored in electronic form and can be read by the electric control device. The electronic data memory preferably contains a database in which the respective operating parameters of the different types of solar modules that can be processed are stored. The electric control device is preferably able to compare the identified type of solar module with the entries in the database and thus read out the optimal operating parameters for this type of solar module, which operating parameters have been stored in the database.

[0017] The electronic control device sends control commands to the recycling device, which control commands contain operating parameters in a form understandable to the recycling device, so that the recycling device is operated according to the operating parameters determined for the solar modules to be processed.

[0018] In addition to the type of solar module, the measurement data may also contain information about the individual components and layers of the solar module. This relates, for example, to the geometrical dimensions, i.e. the spatial extent, of the different layers. For example, information about the dimensions and / or thickness of a glass layer, such as a cover layer, and / or information about the refractive index and / or reflectivity of the glass used, and / or information about the composition of the glass, may be contained in the measurement data and evaluated by the electronic control device. In this case, the electronic control device is preferably configured to have access to an electronic database in an electronic data storage device in order to determine the required operating parameters based on the evaluated measurement data and the information extracted therefrom.

[0019] Advantageously, the solar module has a base body with an upper side, on which the metallic conductor strips or conductor tracks are arranged. The solar module also has a cover layer, which is arranged on the upper side of the base body via an adhesive layer. During the processing of the solar module, the adhesive layer is heated so that it at least partially loses its adhesive effect, but preferably completely. The cover layer is then removed from the base body using a tool. The conductor strips are then removed mechanically, with the removed material being collected.

[0020] The operating parameters preferably include the time, method, speed and / or temperature of heating the adhesion layer, and / or whether the entire adhesion layer or which part of the adhesion layer is heated. The adhesion layer is preferably heated by infrared radiation and / or magnetic induction and / or microwave radiation. The recycling device preferably has a separate heat source for a variety of heating methods, preferably all heating methods. In this case, which heat source is used is included in the operating parameters. The recycling device preferably has a plurality of heat sources. These heat sources can respectively realize different heating possibilities, or they can realize the same heating possibilities. For example, there can be a plurality of heat sources of the same type, such as a plurality of infrared radiation sources. The operating parameters preferably include information about which heat sources are used to heat the adhesion layer or a portion of the adhesion layer. For example, if the heat source is set to heat a larger spatial area than the upper side of the solar module, this is very useful.

[0021] The heating temperature is preferably above 180° C., preferably above 200° C., particularly preferably above 230° C., and below 400° C., preferably below 350° C., particularly preferably below 280° C. The temperature used is preferably included in the operating parameters.

[0022] In particular, when using infrared radiation or microwave radiation, the radiation is preferably conducted through a cover layer which is preferably at least partially transparent to the corresponding type of radiation, but preferably completely transparent. The wavelength of the infrared radiation used for this purpose is preferably between 1000 and 4000 nanometers, preferably between 1000 and 2000 nanometers. The wavelength used is preferably included in the operating parameters. If microwave radiation is used, its frequency is preferably between 2.4 GHz and 2.5 GHz, preferably 2.45 GHz. Alternatively, the frequency of the microwave radiation is 5.8 GHz.

[0023] When heating by magnetic induction, an alternating magnetic field is used, the frequency of which is preferably between 1 kHz and 500 kHz. The frequency range used is called the low-frequency range and includes frequencies between 1 kHz and 7 kHz. Another frequency range is called the medium-frequency range and includes frequencies between 8 kHz and 40 kHz. The high-frequency range includes frequencies between 60 kHz and 500 kHz. The frequency used is preferably between 25 kHz and 300 kHz, particularly preferably between 25 kHz and 100 kHz.

[0024] Preferably, the operating parameters include which tool is used to remove the cover layer, preferably a scraper, a spatula, a knife, a blade and / or a wire and / or other tools. Particularly preferably, the operating parameters include which operating parameters are used. For example, the operating parameters contain information about the angle of attack and / or the contact pressure of the tool.

[0025] In a preferred embodiment, the operating parameters include which removal method is used to remove the conductor strip. In particular, the operating parameters include whether it is done by brushing, milling, planing, pounding, scraping, chiseling, broaching, sandblasting and / or grinding. Particularly preferably, the operating parameters include method parameters of the removal method. For example, the method parameters include information such as the angle of attack and / or contact pressure of the tool, the rotational speed of the brushing and / or grinding element or the force or impact frequency used.

[0026] The operating parameters preferably include whether the cover layer was damaged before removal. If this is the case, the operating parameters preferably also include whether the cover layer was damaged by a scraper, a scraper, a knife and / or a wire and / or other tool.

[0027] Preferably, in the method, the adhesion layer is heated to the adhesion layer temperature and the underside of the substrate is cooled to the underside temperature. By heating the adhesion layer, the cover layer can be removed from the rest of the layer element. The cover layer is particularly preferably a glass layer that is completely transparent to visible light. By heating the adhesion layer, the adhesion of the adhesion layer is reduced, so that the cover layer can be removed. The heat introduced into the adhesion layer diffuses within the layer element and gradually heats the other layers and elements of the layer element. A plastic layer, for example a plastic layer made of polyvinyl fluoride (PVF), is usually arranged on the underside of the substrate. The heat resistance of the material of the plastic layer is usually lower than that of the substrate, the cover layer, and in particular the adhesion layer. The heat introduced by heating the adhesion layer will also heat the plastic layer, so that the plastic layer may decompose and release harmful and unhealthy gases. According to the present invention, this situation can be prevented by cooling the underside of the substrate to the underside temperature.

[0028] In the sense of the present invention, the processing of a layer element includes, for example, at least partial removal of the layer element. In a preferred embodiment, this is accomplished by removing all or part of the covering layer from the substrate. This is preferably done without damaging or destroying the covering layer. However, this does not necessarily have to be the case. Even if the covering layer is damaged or destroyed during and / or before the covering layer is completely or partially removed from the substrate, this also belongs to "processing" in the sense of the present invention.

[0029] This does not mean that the underside is cooled during the method, for example to a temperature below room temperature. Prior to the method, the temperature of the underside of the layer element base body is significantly lower than the underside temperature to be achieved during the method. This simply means that heat is dissipated from the underside of the base body in order to achieve and preferably maintain the underside temperature. The underside temperature is lower than the adhesive layer temperature.

[0030] In order to cool the bottom side of the base body to the bottom side temperature, it is necessary to provide a cooling device, by means of which the heat is dissipated from the bottom side of the base body.

[0031] One difficulty that the methods of these configurations have to overcome is that the conductor strips of the layer elements, for example the conductor strips of solar modules made of precious raw materials, are not accessible from the outside. Although they are located on the upper side of the substrate, they are covered by a cover layer, which is fixed by at least one adhesive layer. By heating the adhesive layer, its adhesion is reduced, so that the cover layer and the substrate can be removed from each other. In this way, the conductor strips arranged on the upper side of the substrate can be accessed. They can now be removed from the substrate mechanically and the removed material can be collected.

[0032] The operating parameters preferably include the time, manner, speed and / or temperature of cooling the underside and / or whether the entire underside or a part of the underside is cooled.

[0033] The layer element is preferably a solar module, wherein the layer element preferably comprises a metallic conductor track which is particularly preferably arranged on the upper side of the base body and is covered by the cover layer.

[0034] Preferably, the temperature of the adhesive layer is at least 180° C., preferably at least 200° C., particularly preferably at least 230° C., and at most 400° C., preferably at most 350° C., particularly preferably at most 280° C. This is particularly advantageous if the adhesive layer is made of or comprises ethylene vinyl acetate (EVA). The temperature of the adhesive layer is preferably selected so that the adhesive layer does not undergo thermal decomposition, during which toxic and environmentally harmful gases are released. This can be avoided at temperatures below 400°. When the temperature exceeds 180° C., preferably exceeds 200° C., acetic acid is released from the EVA adhesive layer, which forms a lubricating film between the layers connected by the adhesive layer. In this way, the adhesive force exerted by the adhesive layer is reduced and the two connected elements can be separated from each other. Therefore, it is preferred to also use at least one layer of EVA film as the adhesive layer.

[0035] The temperature of the underside is preferably at most 150° C., preferably at most 110° C., particularly preferably at most 100° C. The lower the temperature, the less the thermal influence on the layers arranged on the underside of the base body.

[0036] Preferably, the substrate comprises a structure consisting of a plurality of adjacent layers. The bottom side of the substrate constitutes the bottom side of the layer element processed by the method described herein. For example, the substrate has a substrate, which is preferably made of silicon, particularly preferably made of silicon, and has charge-doped regions and hole-doped regions. Metal conductor strips are arranged on the upper side of the substrate, which constitutes the upper side of the substrate. The bottom side of the substrate does not necessarily have to constitute the bottom side of the layer element. Other layers, such as the aforementioned plastic layer, can also be arranged on the bottom side of the substrate. The bottom side of the substrate preferably constitutes the bottom side of the layer element.

[0037] The invention also achieves the stated object by means of a device for processing solar modules, wherein the device comprises at least one sensor for detecting the solar modules, a recovery device and an electrical control device which is provided for carrying out one of the methods described herein.

[0038] The device preferably has a heating device for heating the adhesive layer of the layer element to an adhesive layer temperature and a cooling device for cooling the base body underside of the layer element to an underside temperature.

[0039] Preferably, the device comprises a holding device, by which the layer elements processed by means of the device are held. Preferably, the device comprises a workbench for supporting the layer elements, wherein the cooling device is preferably arranged in the workbench. In a particularly preferred design, the workbench comprises a supporting surface, on which the layer elements are supported during the execution of the method. The cooling device can cool the supporting surface. The holding device for holding the layer elements is, for example, a traction device for applying a tensile force. It can, for example, have at least one negative pressure element, such as a suction element. For example, the layer elements are positioned on openings of the supporting surface, which are closed by the layer elements. By applying a negative pressure or suction to the closed openings, suction and tensile forces can be applied to the layer elements, thereby holding them on the supporting surface.

[0040] Alternatively or additionally, the holding device also has a pressure device for applying pressure. The layer element is pressed onto the support surface by the pressure. The pressure device preferably has at least one, preferably a plurality of pressing members. These are preferably movable relative to the support surface. The pressing members are preferably away from the support surface in order to arrange the layer element to be processed on the support surface. The pressing members are then lowered until they come into contact with the layer element and exert a pressing force on the layer element.

[0041] Preferably, the cooling device has at least one fluid channel through which a cooling medium can be guided. The cooling medium can be, for example, a cooling liquid, such as water. The cooling device preferably has a pump, through which the cooling medium can flow through the fluid channel. If the fluid channel is located inside the workbench, the cooling channel is preferably made of a material with high thermal conductivity, for example a metal such as aluminum or steel.

[0042] Preferably, the at least one cooling channel is as close as possible to the actual support surface of the workbench, for example at most 15 cm, preferably at most 10 cm, particularly preferably at most 5 cm from the support surface. Preferably, the material of the workbench (at least the material of the workbench located between the at least one cooling channel and the support surface) preferably has a high thermal conductivity. The material is preferably a metal, for example aluminum or steel.

[0043] Alternatively or additionally, the cooling device has at least one blower, by which air can be directed to the underside of the layer element. For example, the blower can take the form of one or more fans, which are arranged and directed so that they can move air in the direction of the underside of the layer element.

[0044] Preferably, the device has a first temperature sensor for detecting the temperature of the adhesive layer and / or a second temperature sensor for detecting the temperature of the underside. The first temperature sensor and / or the second temperature sensor preferably have a pyrometer, by which the occurring temperature can be detected, preferably contactlessly.

[0045] Preferably, the device has an electric control device, particularly preferably an electronic data processing unit, which is set to control the heating device and / or cooling device according to the detected adhesion layer temperature and / or the lower side temperature. For this purpose, the corresponding detected temperature is compared with the rated temperature stored in the electronic data memory. The rated temperature can also be a temperature range, and the detected temperature should be within this temperature range. The electric control device is configured to increase the power of the heating device and / or increase the heating duration if the detected adhesion layer temperature is too low compared to the stored rated temperature. Alternatively or additionally, the electric control device is preferably configured to increase the power of the cooling device and / or increase the cooling duration if the detected lower side temperature is too high compared to the stored rated temperature.

Claims

1. A method for processing solar modules by a recycling device, wherein the method comprises the following steps: - detecting the solar module by means of at least one sensor, so that the at least one sensor sends measurement data to an electronic control device, wherein the measurement data contains information about the solar module; - evaluating the measurement data and determining operating parameters of the recovery device; and The solar module is processed in the recycling plant, which is operated with determined operating parameters.

2. The method according to claim 1, characterized in that The at least one sensor comprises at least one optical sensor, in particular at least one optical camera, wherein the measurement data are preferably digital image data.

3. The method according to claim 2, characterized in that The measurement data are evaluated by image recognition software which compares the measurement data with reference data stored in an electronic database.

4. The method according to any one of the preceding claims, characterized in that The solar module comprises a base body having a top side on which metallic conductor tracks are arranged, and a cover layer arranged on the top side of the base body via an adhesive layer, wherein the adhesive layer is heated during processing of the solar module, the cover layer is then removed from the base body by a tool, and the conductor tracks are then mechanically removed, wherein the removed material is collected.

5. The method according to claim 4, characterized in that The operating parameters include how long the adhesive layer is heated, how it is heated, at what rate it is heated and / or to what temperature it is heated and / or whether the entire adhesive layer or which part of the adhesive layer is heated.

6. The method according to claim 4 or 5, characterized in that: The operating parameters include which tool is used to remove the cover layer, preferably whether a spatula, a scraper, a knife, a blade and / or a wire and / or other tool is used.

7. The method according to claim 6, characterized in that The operating parameters include working parameters of the tool.

8. The method according to any one of claims 4 to 7, characterized in that The operating parameters include the removal method by which the conductor strip is removed, in particular whether this is carried out by brushing, milling, planing, pounding, scraping, chiseling, broaching, sandblasting and / or grinding.

9. The method according to claim 8, characterized in that The operating parameters include method parameters of the removal method.

10. The method according to any one of claims 4 to 9, characterized in that The operating parameters include whether the cover layer is damaged prior to removal, and whether this is preferably accomplished by a spatula, scraper, knife and / or wire and / or other tool. 11 . A device for processing solar modules, wherein the device comprises at least one sensor for detecting the solar modules, a recovery device and an electrical control device which is provided for carrying out the method according to one of the preceding claims.