Probe laser micro-welding device and method

Abstract

The invention discloses a probe laser micro-welding device and method.The probe laser micro-welding device comprises a probe slave jig taking mechanism used for shooting a probe on a jig, obtaining first position data of the probe and taking out the probe according to the first position data; the mechanism for acquiring the posture degree of the probe before welding is used for acquiring second position data of the probe and comparing the second position data with pre-designed position data; the probe posture correction and solder paste dipping mechanism is used for correcting the posture of the probe and dipping the solder paste according to the comparison result; the probe and bonding pad accurate alignment mechanism is used for shooting the probe dipped with the solder paste, obtaining height data and third position data of the probe, comparing the third position data with the bonding pad position data to obtain position deviation data, and carrying out accurate alignment on the probe and the bonding pad according to the position deviation data; the welding mechanism is used for laser welding; and the control mechanism is used for controlling all the mechanisms. According to the invention, high-precision welding with the minimum probe spacing of 60 microns is realized.

Description

Technical Field

[0001] The invention belongs to the field of probe laser welding, and in particular relates to a probe laser micro welding device and method. Background Art

[0002] During the manufacturing process of wafer test probe cards, the probes need to be welded to the ceramic circuit board according to the designed position. The minimum welding needle distance can reach 60μm, the X and Y position deviation is less than 3μm, the end height deviation is less than 8μm, and the minimum distance between probes can reach 60μm. Due to the high welding precision requirements, the existing laser welding method is difficult to meet the requirements. Summary of the invention

[0003] The purpose of the present invention is to provide a probe laser micro-welding device and method to address the problems existing in the prior art. By taking the probe out of the fixture, dipping the probe in solder paste after correcting its posture, and welding the probe after precise alignment with the pad, high-precision welding with a minimum probe spacing of 60μm can be achieved.

[0004] According to one aspect of the present invention, there is provided a probe laser micro welding device, comprising: The probe takes material from the fixture, and is used to take a picture of the probe on the fixture, obtain the first position data of the probe, take out the probe according to the first position data, and move it to the posture correction station; The probe pre-welding posture acquisition mechanism is used to photograph the removed probe, obtain the second position data of the probe, and compare the second position data with the pre-designed position data to obtain the comparison result; The probe posture correction and solder paste dipping mechanism is used to correct the probe posture according to the comparison result, and to dip the probe after posture correction into solder paste; The probe and pad precise alignment mechanism is used to shoot the probe after being dipped in solder paste, obtain the height data and the third position data of the probe, compare the third position data with the pad position data, obtain the position deviation data, and accurately align the probe and the pad according to the position deviation data; The welding mechanism is used to move the probe to the welding design position according to the measured height data after the probe and the pad are accurately aligned to perform laser welding; The control mechanism is respectively connected with the probe taking material from the fixture mechanism, the probe posture obtaining mechanism before welding, the probe posture correction and solder paste dipping mechanism, the probe and pad precise positioning mechanism and the welding mechanism, and is used to control each mechanism.

[0005] As a further technical solution, the device also includes: a probe loading mechanism, which is used to place a jig with the probe implanted therein and drive the jig to move.

[0006] As a further technical solution, the device also includes: a welding effect detection mechanism, which is used to take pictures and detect the welded product.

[0007] As a further technical solution, the device further comprises: a cooling mechanism for cooling the probe temperature by spraying liquid nitrogen during the welding process.

[0008] According to one aspect of the present invention, a probe laser micro welding method is provided, comprising: The probe on the fixture is photographed to obtain the first position data of the probe, and a material taking step of taking out the probe according to the first position data; The probe is taken out and photographed to obtain second position data of the probe, the second position data is compared with the pre-designed position data to obtain a comparison result, and a posture correction step of correcting the posture of the probe according to the comparison result; The probe after posture correction is subjected to the step of dipping in solder paste; The probe after being dipped in solder paste is photographed to obtain height data and third position data of the probe, the third position data is compared with the pad position data to obtain position deviation data, and the precise alignment step of the probe and the pad is corrected according to the position deviation data; After the probe and the pad are accurately aligned, the probe is moved to the welding design position according to the measured height data to perform the laser welding steps.

[0009] As a further technical solution, the step of accurately aligning the probe with the pad also includes: a pad positioning step of locating a marking point of the probe pad to obtain pad position data.

[0010] As a further technical solution, the method further includes: after welding is completed, a welding effect detection step of photographing and detecting the welded product.

[0011] As a further technical solution, the posture correction step further includes: The probe is photographed by two mutually perpendicular photographing mechanisms to obtain the XY coordinate data and angle data of the probe; Compare the acquired XY coordinate data and angle data with the pre-designed XY coordinate data and angle data to obtain the XY direction deviation and rotation deviation; The probe posture correction mechanism is used to correct the rotation deviation, the solder paste tray Y-axis is used to correct the X-direction deviation, and the lifting axis is used to correct the Y-direction deviation.

[0012] As a further technical solution, the solder paste dipping step also includes: arranging a plurality of dipping positions at intervals on the solder paste tray, one dipping position corresponds to one probe dipping in solder paste, and automatically switching the dipping position when the next probe dips in solder paste.

[0013] As a further technical solution, the welding step further includes: during the welding process, controlling the probe temperature by combining laser pulse energy control and liquid nitrogen injection.

[0014] Compared with the prior art, the present invention has the following beneficial effects: The present invention removes the probe from the fixture by image capture, thereby solving the problem of welding accuracy caused by poor consistency of the probe in the fixture; by correcting the posture of the removed probe, it is ensured that the probe is dipped in solder paste in the same posture, thereby solving the problem of uneven dipping of the probe in solder paste before welding; by accurately aligning the probe with the pad, it is ensured that the probe can accurately enter the welding design position, and then through the mutual cooperation of the aforementioned steps, accurate alignment of the welding process is achieved, meeting the high-precision requirements of probe welding.

[0015] The present invention not only solves the problem of low welding accuracy caused by incorrect position and inconsistent height during probe welding, but also avoids the problem of adjacent probes being deformed by heat due to heat dissipation during welding by controlling laser pulse energy and liquid nitrogen spray during the welding process, thereby ensuring the welding effect of a minimum welding probe spacing of 60μm. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 A schematic diagram of the overall structure of a probe laser micro welding device provided in an embodiment of the present invention.

[0017] Figure 2 A schematic diagram of the structure of a probe material-taking mechanism from a fixture provided in an embodiment of the present invention.

[0018] Figure 3 A schematic structural diagram of a probe feeding mechanism provided in an embodiment of the present invention.

[0019] Figure 4 Schematic diagram of a probe calibration image acquisition system provided in an embodiment of the present invention.

[0020] Figure 5 A schematic diagram of the structure of a probe posture correction and solder paste dipping mechanism provided in an embodiment of the present invention.

[0021] Figure 6 A schematic structural diagram of a probe welding clamping mechanism provided in an embodiment of the present invention.

[0022] Figure 7 A schematic diagram of a probe welding height detection system provided in an embodiment of the present invention.

[0023] Figure 8 A schematic diagram of the structure of a probe welding plate fixing and a three-dimensional moving platform provided in an embodiment of the present invention.

[0024] Fig. 9A schematic diagram of the structure of a probe welding laser head adjustment mechanism provided in an embodiment of the present invention.

[0025] Fig.10 A schematic diagram of the structure of a probe welding effect detection mechanism provided in an embodiment of the present invention.

[0026] Fig.11 A schematic flow chart of a probe laser micro welding method provided in an embodiment of the present invention.

[0027] In the figure: 10, probe material taking mechanism from fixture; 20, equipment control cabinet; 30, horizontal moving axis of probe clamping jaws; 40, probe calibration image acquisition system; 50, probe material feeding mechanism; 60, equipment rack; 70, probe posture correction and solder paste dipping mechanism; 80, probe welding plate fixing and three-dimensional moving platform; 90, probe welding effect detection system; 100, probe welding laser head adjustment mechanism; 110, probe welding cooling mechanism; 120, probe welding height detection system; 130, probe welding clamping mechanism; 2-1, lifting axis of the clamping jaws for picking up materials from the material box; 2-2, camera for obtaining the position of the probe; 2-3, lens for obtaining the position of the probe; 2-4, lens fixing seat; 2-5, clamping jaw angle adjustment mechanism; 2-6, ring light source for obtaining the position of the probe for taking photos; 2-7, coaxial point light source for obtaining the position of the probe for taking photos; 2-8, clamping jaw driving cylinder; 2-9-fixed clamping jaw fixing plate; 2-10-movable clamping jaw fixing plate; 2-11, material box picking up material probe clamping jaw; 3-1, Y-axis moving axis of the fixture; 3-2, front fixed locking handle of the fixture; 3-3, middle positioning block of the fixture; 3-4, fixed side rib of the fixture; 3-5, side fixed locking handle of the fixture; 3-6, probe loading fixture, 3-7, fixture support connecting bottom plate; 4-1. Probe front camera; 4-2. Probe front camera lens; 4-3. Probe front camera lens fixing seat; 4-4. Probe front camera coaxial point light source; 4-5. 90° folding mirror; 4-6. Probe front camera XY adjustment mechanism; 4-7. Probe front camera height adjustment mechanism; 4-8. Probe front camera mechanism padding block; 4-9. Probe correction image camera mechanism fixing base plate; 4-10. Probe side camera mechanism padding block; 4-11. Probe side camera height adjustment mechanism; 4-12. Probe side camera XY adjustment mechanism; 4-13. Probe side camera coaxial point light source; 4-14. Probe side camera lens; 4-15. Probe side camera lens fixing seat; 4-16. Probe side camera; 5-1, solder paste injection storage tube; 5-2, solder paste storage tube fixing block; 5-3, solder paste quantitative scraper lifting drive mechanism; 5-4, solder paste storage tube lifting drive mechanism; 5-5, lifting mechanism fixing seat; 5-6, solder paste tray Y-axis; 5-7, solder paste loading container fixing frame, 5-8, probe posture correction mechanism, 5-9, solder paste recovery device, 5-10, probe correction clamping mechanism, 5-11, solder paste loading container, 5-12, solder paste quantitative scraper; 6-1, jaw lifting shaft; 6-2, jaw angle adjustment mechanism fixing plate; 6-3, jaw angle adjustment mechanism; 6-4, jaw clamping and pushing cylinder; 6-5, movable jaw fixing plate; 6-6, fixed jaw fixing plate; 6-7, probe jaw; 7-1, focusing detection lens lifting mechanism; 7-2-photographing mechanism and lifting shaft connection seat; 7-3, probe focusing detection camera; 7-4, lens fixing seat; 7-5, probe focusing detection lens; 7-6, lens level adjustment mechanism; 7-7, coaxial laser point light source; 7-8, probe focusing detection objective lens; 8-1, probe welding chassis; 8-2, probe welding chassis vacuum adsorption table; 8-3, probe welding chassis rotation axis; 8-4, probe welding chassis X-axis movement axis; 8-5, probe welding chassis Y-axis movement axis; 9-1, welding laser head lifting axis; 9-2, XY adjustment mechanism fixing seat; 9-3, laser welding head XY adjustment mechanism; 9-4, adjustment mechanism connecting block; 9-5, laser welding head rotation adjustment mechanism; 9-6, welding laser head fixing seat; 9-7, probe welding laser head; 10-1. Coaxial point light source for effect detection photography; 10-2. Effect detection photography lens; 10-3. Photography mechanism connecting plate; 10-4. Effect detection photography lens fixing seat; 10-5. Welding effect detection photography camera; 10-6. Effect detection photography XY adjustment mechanism; 10-7. Effect detection photography height adjustment mechanism; 10-8. Adjustment mechanism connecting plate. DETAILED DESCRIPTION

[0028] The technical solution of the present invention will be described clearly and completely below in conjunction with the accompanying drawings of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0029] When directions are defined in order to clearly describe the embodiments of the present invention, the X direction mentioned in the specification may be a direction parallel to the horizontal plane, and the Y direction may be a direction perpendicular to the horizontal plane.

[0030] The embodiment of the present invention provides a probe laser micro welding device, such as Figure 1 As shown, it includes: a probe picking mechanism from a fixture, which is used to photograph the probe on the fixture, obtain the first position data of the probe, take out the probe according to the first position data and move it to a posture correction station; a probe posture acquisition mechanism before welding, which is used to photograph the taken probe, obtain the second position data of the probe, compare the second position data with the pre-designed position data, and obtain the comparison result; a probe posture correction and solder paste dipping mechanism, which is used to correct the posture of the probe according to the comparison result, and dip the probe after the posture correction into solder paste; a probe and pad precise alignment mechanism, which is used to align the probe with the dipped solder paste. The probe behind the solder paste is used to shoot, obtain the height data and the third position data of the probe, compare the third position data with the pad position data, obtain the position deviation data, and accurately align the probe and the pad according to the position deviation data; the welding mechanism is used to move the probe to the welding design position according to the measured height data after the probe and the pad are accurately aligned, and perform laser welding; the control mechanism is respectively connected with the probe taking material from the fixture mechanism, the probe posture acquisition mechanism before welding, the probe posture correction and solder paste dipping mechanism, the probe and pad accurate alignment mechanism and the welding mechanism, and is used to control each mechanism.

[0031] Reference Figure 1 The probe can be moved horizontally along the horizontal moving axis of the probe clamping claw. In practical applications, the device can also be equipped with an equipment control cabinet and an equipment rack.

[0032] like Figure 2 As shown, the probe picking mechanism from the jig includes a material box picking jaw lifting shaft, and a first shooting component and a jaw component that are arranged on the material box picking jaw lifting shaft and can move with the lifting shaft. In actual application, the position consistency of the probe in the jig is not so good, and secondary correction is required to achieve the required accuracy for welding. Therefore, the embodiment of the present invention clamps the probe by image shooting and performs correction processing to ensure the welding accuracy when the probe spacing is very small.

[0033] The lifting shaft of the material box picking clamp is used to drive the clamp to rise and fall to facilitate material picking; at the same time, it is also used to compensate for the deviation of the probe in the Y direction by lifting and falling when the probe posture is calibrated.

[0034] The first shooting component includes a probe position acquisition camera, and a probe position acquisition camera lens, a probe position acquisition camera ring light source, and a probe position acquisition camera coaxial point light source configured to facilitate shooting with the probe position acquisition camera. Among them, the probe position acquisition camera lens is arranged on the connecting plate of the lifting shaft of the material box picking clamp through a lens fixing seat. In the embodiment of the present invention, the probe position acquisition camera searches for the probe on the fixture by taking a picture, and uploads the probe position data. The material box picking probe clamp takes out the probe according to the position data and puts it into the probe posture correction station. It should be noted that the search here means that some tunnels in the fixture may not have products, and they need to be pre-determined and then their clamping positions are identified.

[0035] The clamp assembly is arranged on the lifting shaft of the material box picking clamp through a connecting piece, and includes a clamp angle adjustment mechanism for adjusting the clamp angle, a clamp clamp driving cylinder for driving the clamp, and a material box picking probe clamp for performing the material picking action. The material box picking probe clamp includes a fixed clamp and a movable clamp for cooperating with the clamp clamp action, and a fixed clamp fixing plate and a movable clamp fixing plate respectively connected thereto.

[0036] The probe is taken out from the jig by the jig taking mechanism, and the jig is fixed on the feeding mechanism and can move along the Y direction on the feeding mechanism. Figure 3 As shown, the feeding mechanism includes a jig fixing assembly, a jig moving assembly, a jig connecting assembly and a jig located on the jig connecting assembly. The jig fixing assembly includes a jig front fixed locking handle, a jig middle positioning block, a jig fixed side rib and a jig side fixed locking handle. Before the probe takes the material, first place the probe loading jig with the probe implanted on the jig connecting assembly, and lock the handles on both sides to facilitate photographing the probe position on the jig and taking the material. The jig connecting assembly is as shown in FIG. Figure 3 Considering the convenience of taking the probe image, the probe loading fixture is set on the Y-axis of the fixture, which can be driven to move in the Y direction.

[0037] In the embodiment of the present invention, the probe is taken out and placed in the probe posture correction station, and the probe correction image acquisition system takes pictures. The photographed position data is compared with the design position and the deviation value is uploaded. The probe posture correction and solder paste dipping mechanism corrects and moves its position. After completion, the probe correction image acquisition system takes pictures for comparison to see whether the design position requirement is met. If not, the correction is repeated until the designed posture degree is reached.

[0038] The probe calibration image acquisition system, such as Figure 4As shown, it includes two sets of shooting components arranged perpendicularly to each other, one set is a camera for shooting the front of the probe and its supporting shooting auxiliary equipment, and the other set is a camera for shooting the side of the probe and its supporting shooting auxiliary equipment. The two sets of shooting components are arranged on a fixed bottom plate of a probe correction image shooting mechanism. The probe is photographed by two cameras perpendicular to each other to obtain its position state, and then the probe is calibrated by the probe posture correction and solder paste dipping mechanism. After the correction is completed, the probe is taken out by the probe welding clamping mechanism and moved to the solder paste dipping station.

[0039] Reference Figure 4 , the shooting auxiliary equipment of the probe front camera includes: a probe front camera lens for shooting, a probe front camera coaxial point light source for providing shooting light source, a 90° folding mirror for optical path deflection, a probe front camera XY adjustment mechanism for XY direction adjustment, a probe front camera height adjustment mechanism for height direction adjustment, and a probe front camera mechanism padding block for auxiliary padding. The shooting auxiliary equipment of the probe side camera includes: a probe side camera mechanism padding block for auxiliary padding, a probe side camera height adjustment mechanism for height direction adjustment, a probe side camera XY adjustment mechanism for XY direction adjustment, a probe side camera coaxial point light source for providing shooting light source, and a probe side camera lens for shooting. Wherein, the probe front camera lens and the probe side camera lens are respectively equipped with lens fixing seats.

[0040] The probe calibration image acquisition system identifies the captured probe image to obtain its XY coordinate data and rotation data (i.e., angle data), and compares the identified XY coordinate data and rotation data with the corresponding data of the designed position to obtain deviation data. The deviation data includes XY coordinate deviation and rotation deviation.

[0041] The probe posture correction and solder paste dipping mechanism are corrected according to the deviation data, wherein the rotation deviation data is obtained by Figure 5 The probe posture correction mechanism is executed, and the X-direction deviation data is Figure 5 The Y-direction movement axis of the solder paste tray is executed, and the Y-direction deviation data is calculated by Figure 2 The height of the lifting axis of the material box picking jaw is compensated, that is, the deviation data is added or subtracted from the standard picking height, which can be regarded as the compensated height moving probe when moving from the posture correction station to the solder paste dipping station. It should be noted that the coordinates described in the embodiment of the present invention are based on the probe as a reference, and the plane placement direction of the probe is perpendicular to the device itself, so the deviation of the probe in the X direction can be implemented by the Y-axis movement of the solder paste tray.

[0042] It should be noted that the probe posture correction mechanism in the embodiment of the present invention can be regarded as an angle adjustment mechanism (such as a turntable, etc.), and through its angle rotation, the angle of the probe can be changed to keep it consistent with the angle data of the designed position.

[0043] Reference Figure 5 A probe correction clamping mechanism is connected above the probe posture correction mechanism to clamp and fix the probe for posture shooting and correction.

[0044] like Figure 6 As shown, the probe welding clamping mechanism includes a clamping jaw lifting shaft, and a clamping jaw angle adjustment mechanism fixing plate is provided on the clamping jaw lifting shaft for fixing the clamping jaw angle adjustment mechanism. The clamping jaw angle adjustment mechanism is connected to a clamping jaw assembly through a connecting piece, and the clamping jaw assembly includes a clamping jaw holding and pushing cylinder for pushing the clamping jaw to move and a probe clamping jaw. The probe clamping jaw is equipped with a movable clamping jaw and a fixed clamping jaw, as well as a movable clamping jaw fixing plate and a fixed clamping jaw fixing plate for fixing the two respectively.

[0045] Reference Figure 5 The solder paste dipping mechanism includes: a solder paste injection storage tube for injecting solder paste, a driving mechanism and a scraper for quantitatively scraping solder paste, a solder paste loading container for loading solder paste, a solder paste recovery device for recovering the scraped solder paste, and an adjustment component for driving the solder paste loading container to move. The solder paste injection storage tube is connected to the solder paste storage tube lifting drive mechanism through a fixed block, and the solder paste storage tube lifting drive mechanism and the solder paste quantitative scraper lifting drive mechanism are arranged on the lifting mechanism fixing seat together. The solder paste quantitative scraper lifting drive mechanism drives the solder paste quantitative scraper to move and scrape the excess solder paste into the solder paste recovery device. The adjustment component includes a solder paste tray Y-axis moving shaft that drives the solder paste tray to move in the Y direction, for example, it can drive the solder paste tray close to or away from the solder paste quantitative scraper. The solder paste loading container is supported and fixed by a container fixing frame.

[0046] The solder paste loading container is provided with a plurality of dipping positions at intervals. After the current probe is dipped in glue, the next probe switches to the next position for dipping in glue. The position switching here is performed by Figure 1 The horizontal axis of the pick-and-place probe gripper performs X-direction movement, which is Figure 5 The solder paste tray Y-axis moves in the Y direction, completing the dipping position switch.

[0047] In the embodiment of the present invention, before dipping, the solder paste is first injected into the solder paste loading container through the solder paste injection storage tube, and the injected amount must be higher than the container mouth. Then the solder paste quantitative scraper will scrape the excess solder paste into the solder paste recovery device. At this time, the solder paste capacity in each container is basically the same, and the cutting height is also basically the same. The height of the container is pre-adjusted and parallel to the Y-axis moving mechanism.

[0048] After completing the posture correction, the probe is clamped to the solder paste dipping station. The probe welding clamping mechanism drives the clamping jaws down to the preset position to ensure that the amount of glue dipping is the set amount. The depth of the clamping jaws at this time determines the amount of glue dipping. The posture correction before dipping is to ensure that the probe dips in the solder paste in the same posture. After the probe is dipped in the solder paste, the clamping mechanism will move to the welding position, completing the function of dipping the probe in the solder paste before welding.

[0049] It should be noted that the above preset position is the control position of the amount of glue dipped by the probe, that is, the deeper the probe descends, the greater the amount. The preset position is debugged according to the welding state, and the control condition of the amount is: the welding can be reliable, but the amount cannot overflow the pad area due to excessive amount.

[0050] After dipping in solder paste, the probe is clamped to the welding station, where it is precisely aligned with the pad before laser welding.

[0051] like Figure 7 As shown, the probe welding height detection system includes a probe focus detection camera, which is equipped with a probe focus detection lens, a coaxial laser point light source, and a probe focus detection objective lens. The probe focus detection lens is also connected to a focus detection lens lifting mechanism through a connecting seat, which is used to drive the camera mechanism to lift and lower. The probe focus detection lens is fixed to the connecting seat through a fixing seat. The probe focus detection lens is also equipped with a lens horizontal adjustment mechanism to achieve horizontal adjustment of the lens.

[0052] When the probe welding height detection system detects the probe end face height, its detection method is the same as the height detection method disclosed in the probe welding height alignment detection method, equipment and system, specifically: starting from a preset image capture initial position, the image capture device is moved along the probe height direction, and each time it moves a preset capture interval, the image capture device is triggered to capture a probe image, and the area of ​​the captured probe image is calculated; after the image capture device moves a preset number of times, the position corresponding to the area of ​​the minimum probe image is determined according to the areas of all captured probe images; according to the position corresponding to the image capture initial position and the area of ​​the minimum probe image, the height detection value of the current probe is obtained.

[0053] Before accurately aligning the probe and the pad, the probe welding height detection system also locates the Mark point of the probe welding pad to obtain the pad position data.

[0054] like Figure 8As shown, the probe welding plate fixing and three-dimensional moving platform includes a probe welding chassis, a vacuum adsorption platform is connected below the probe welding chassis, the probe welding chassis is also connected to a probe welding chassis rotating shaft, which is used to drive the welding chassis to rotate, and the probe welding chassis is also connected below the probe welding chassis to an X-direction moving shaft and a Y-direction moving shaft, which are used to drive the probe welding chassis to move along the X-direction or Y-direction. Figure 8 The structure shown can realize the XYθ three-dimensional movement of the probe welding chassis.

[0055] After dipping in solder paste, the probe welding clamping mechanism moves the probe to the welding position. The probe welding height detection system detects the probe end face height, obtains the probe height data, and then obtains the probe XY position data, which is then compared with the pad position data. After obtaining the XYθ position data, it is uploaded to the control mechanism. The control mechanism fixes the probe welding pad and the three-dimensional mobile platform and corrects it according to the deviation data. After the correction is completed, take photos to compare whether it meets the design requirements. If there is still a deviation, correct it again. After the correction is completed, the probe welding clamping mechanism descends to the welding design position according to the measured height, and laser welding is performed.

[0056] During laser welding, the cooling mechanism discharges liquid nitrogen to cool the probe, which prevents the probe from being deformed by heat and prevents oxidation during the welding process. At the same time, the probe temperature is controlled by the pulse energy control of the laser, that is, the pulse period of picoseconds is adopted, and the single pulse energy is controlled by the pulse width, which ensures a large light output energy and a very short execution time of picoseconds, so that the heat is more concentrated.

[0057] like Fig. 9 As shown, the probe welding laser head adjustment mechanism includes a welding laser head lifting shaft, the welding laser head lifting shaft is connected to the laser welding head XY adjustment mechanism through a fixed seat, the laser welding head XY adjustment mechanism is connected to a laser welding head rotation adjustment mechanism through a connecting block, and the laser welding head rotation adjustment mechanism fixes the probe welding laser head through a fixed seat. The embodiment of the present invention adjusts the laser head through the probe welding laser head adjustment mechanism so that its light output position and angle are more in line with welding requirements.

[0058] After welding is completed, the probe welding effect detection system takes photos to detect the welding effect, checking whether the solder paste is completely melted, whether the weld is well filled, whether the solder paste overflows the pad and other defects. If the detection fails, it will be marked in red on the mapping diagram generated by the welding. If three consecutive failures occur, an alarm will be issued and the machine will be shut down.

[0059] like Fig.10As shown, the probe welding effect detection system includes a welding effect detection camera, which is equipped with an effect detection camera coaxial point light source and an effect detection camera lens, and the effect detection camera lens is fixed to the mounting member through a fixing seat. The camera assembly composed of the welding effect detection camera and its supporting equipment is connected to an effect detection camera XY adjustment mechanism, and the effect detection camera XY adjustment mechanism is connected to an effect detection camera height adjustment mechanism, and the effect detection camera height adjustment mechanism is arranged on the adjustment mechanism connection plate.

[0060] Based on the same technical concept as the above-mentioned embodiment, the embodiment of the present invention also provides a probe laser micro welding method, such as Fig.11 As shown, including: Step S1, photographing the probe on the fixture to obtain first position data of the probe, and taking out the material from the probe according to the first position data; Step S2, photographing the removed probe to obtain second position data of the probe, comparing the second position data with pre-designed position data to obtain a comparison result, and correcting the probe posture according to the comparison result; Step S3, dipping the probe after posture correction into solder paste; Step S4, photographing the probe after being dipped in solder paste, obtaining height data and third position data of the probe, comparing the third position data with the pad position data to obtain position deviation data, and correcting the pad position according to the position deviation data to accurately align the probe with the pad; Step S5, after the probe and the pad are accurately aligned, the probe is moved to the welding design position according to the measured height data, and the laser welding step is performed.

[0061] In step S1, the probe on the fixture is photographed and searched by the probe position acquisition camera, and the probe position data is uploaded to the control mechanism. The control mechanism controls the material box to take out the probe clamp according to the position data and put it into the probe posture correction station. It should be noted that the search here means that some tunnels in the fixture may not have products, and they need to be pre-determined and then their clamping positions are identified.

[0062] In step S2, after the probe is taken out and placed in the probe posture correction station, the probe correction image acquisition system takes a photo, compares the photographed position data with the design position and uploads the deviation value, and the probe posture correction and solder paste dipping mechanism corrects and moves its position. After completion, the probe correction image acquisition system takes a photo comparison to see whether it meets the design position requirements. If not, the correction is repeated until the designed posture degree is reached.

[0063] In step S3, before dipping, the solder paste is injected into the storage tube to inject the solder paste into the solder paste loading container. The injected amount should be higher than the container mouth. Then the solder paste quantitative scraper will scrape the excess solder paste into the solder paste recovery device. At this time, the solder paste capacity in each container is basically the same, and the cutting height is also basically the same. The height of the container is pre-adjusted and parallel to the Y-axis moving mechanism.

[0064] When dipping glue, the probe welding clamping mechanism drives the clamping jaws to descend to the preset position to ensure that the amount of glue dipped is the set amount. The depth of the clamping jaws at this time determines the amount of glue dipped. Posture correction before dipping glue is to ensure that the probe descends to dip in solder paste in the same posture. After the probe is dipped in solder paste, the clamping mechanism will move to the welding position, completing the function of dipping the probe in solder paste before welding. It should be noted that the above-mentioned preset position is the control position of the probe's glue dipping amount, that is, the deeper the probe descends, the greater the amount. The preset position is debugged according to the welding state, and the quantity control condition is: the welding can be reliable, but it cannot overflow the pad area due to excessive amount.

[0065] In step S4, the probe welding clamping mechanism moves the probe to the welding position, the probe welding height detection system detects the probe end face height, obtains the probe height data, and then obtains the probe XY position data, which is then compared with the position data of the pad. After obtaining the XYθ position data, it is uploaded to the control mechanism, and the control mechanism fixes the probe welding pad and the three-dimensional mobile platform and calibrates it according to the deviation data. After the calibration is completed, photos are taken to compare whether they meet the design requirements. If there is still a deviation, it is calibrated again. After the calibration is completed, the probe welding clamping mechanism descends to the welding design position according to the measured height, and laser welding is performed.

[0066] In step S5, during laser welding, the cooling mechanism discharges liquid nitrogen to cool the probe, and physically cools the probe so that it will not be deformed by heat, and prevents oxidation during the welding process. At the same time, the probe temperature is controlled by the pulse energy control of the laser, that is, a picosecond pulse period is adopted, and the single pulse energy is controlled by the pulse width, which ensures a large light output energy, and the execution time is very short, at the picosecond level, so that the heat is more concentrated.

[0067] After welding is completed, the probe welding effect detection system takes photos to detect the welding effect, checking whether the solder paste is completely melted, whether the weld is well filled, whether the solder paste overflows the pad and other defects. If the detection fails, it will be marked in red on the mapping diagram generated by the welding. If three consecutive failures occur, an alarm will be issued and the machine will be shut down.

[0068] In summary, the present invention has the following advantages: The present invention solves the problem of low welding accuracy due to incorrect position and inconsistent height during probe welding, and realizes high-precision welding with a minimum welding probe spacing of 60 μm.

[0069] The present invention solves the problem of uneven solder paste dipping of the probe before welding, avoids the problem that the amount of solder paste dipping cannot be accurately controlled due to a fixed solder paste dipping position or a change in the depth of the solder paste dipping during the solder paste dipping process, and ensures the quality of the probe during the welding process.

[0070] The present invention controls laser pulse energy and liquid nitrogen spraying during the welding process, thereby avoiding the problem of heat deformation of adjacent probes due to heat dissipation during welding, and ensuring the welding effect.

[0071] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A probe laser micro welding device, characterized in that: include: The probe takes material from the fixture, and is used to take a picture of the probe on the fixture, obtain the first position data of the probe, take out the probe according to the first position data, and move it to the posture correction station; The probe pre-welding posture acquisition mechanism is used to photograph the removed probe, obtain the second position data of the probe, and compare the second position data with the pre-designed position data to obtain the comparison result; The probe posture correction and solder paste dipping mechanism is used to correct the probe posture according to the comparison result, and to dip the probe after posture correction into solder paste; The probe and pad precise alignment mechanism is used to shoot the probe after being dipped in solder paste, obtain the height data and the third position data of the probe, compare the third position data with the pad position data, obtain the position deviation data, and accurately align the probe and the pad according to the position deviation data; The welding mechanism is used to move the probe to the welding design position according to the measured height data after the probe and the pad are accurately aligned to perform laser welding; The control mechanism is respectively connected with the probe taking material from the fixture mechanism, the probe posture obtaining mechanism before welding, the probe posture correction and solder paste dipping mechanism, the probe and pad precise positioning mechanism and the welding mechanism, and is used to control each mechanism.

2. A probe laser micro welding device according to claim 1, characterized in that: The device also includes a probe loading mechanism, which is used to place the jig with the probe implanted therein and drive the jig to move.

3. The probe laser micro welding device according to claim 1, characterized in that: The device also includes: a welding effect detection mechanism, which is used to take pictures and detect the welded product.

4. The probe laser micro welding device according to claim 1, characterized in that: The device also includes a cooling mechanism, which is used to cool the probe temperature by spraying liquid nitrogen during the welding process.

5. A probe laser micro welding method, characterized in that: include: The probe on the fixture is photographed to obtain the first position data of the probe, and a material taking step of taking out the probe according to the first position data; The probe is taken out and photographed to obtain second position data of the probe, the second position data is compared with the pre-designed position data to obtain a comparison result, and a posture correction step is performed to correct the posture of the probe according to the comparison result; The probe after posture correction is subjected to the step of dipping in solder paste; The probe after being dipped in solder paste is photographed to obtain height data and third position data of the probe, the third position data is compared with the pad position data to obtain position deviation data, and the precise alignment step of the probe and the pad is corrected according to the position deviation data; After the probe and the pad are accurately aligned, the probe is moved to the welding design position according to the measured height data to perform the laser welding steps.

6. A probe laser micro welding method according to claim 5, characterized in that: The step of accurately aligning the probe with the pad also includes: positioning the marking point of the probe pad to obtain pad position data.

7. A probe laser micro welding method according to claim 5, characterized in that: The method further comprises: after welding is completed, a welding effect detection step of photographing and detecting the welded product.

8. The probe laser micro welding method according to claim 5, characterized in that: The posture correction step also includes: The probe is photographed by two mutually perpendicular photographing mechanisms to obtain the XY coordinate data and angle data of the probe; Compare the acquired XY coordinate data and angle data with the pre-designed XY coordinate data and angle data to obtain the XY direction deviation and rotation deviation; The probe posture correction mechanism is used to correct the rotation deviation, the solder paste tray Y-axis is used to correct the X-direction deviation, and the lifting axis is used to correct the Y-direction deviation.

9. The probe laser micro welding method according to claim 5, characterized in that: The solder paste dipping step further includes: arranging a plurality of dipping positions at intervals on the solder paste tray, wherein one dipping position corresponds to one probe dipping the solder paste, and the dipping position is automatically switched when the next probe dips the solder paste.

10. The probe laser micro welding method according to claim 5, characterized in that: The welding step also includes: during the welding process, combining laser pulse energy control and liquid nitrogen injection to control the probe temperature.

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