Edge grinding equipment and edge grinding method

Abstract

The invention provides edge grinding equipment and an edge grinding method, and the equipment comprises a loading unit which comprises a loading inlet and a first workbench; the first grinding unit comprises at least two periphery coarse grinding mechanisms, each periphery coarse grinding mechanism comprises a second workbench and a periphery coarse grinding wheel, and the grinding parameters of the different periphery coarse grinding mechanisms are different; the first carrying unit is used for carrying the silicon wafers to the corresponding second workbenches from the first workbenches; the second grinding unit comprises a notch coarse grinding wheel, a notch fine grinding wheel, a peripheral fine grinding wheel and a third workbench, and the third workbench can be sequentially matched with the notch coarse grinding wheel, the notch fine grinding wheel and the peripheral fine grinding wheel to grind the silicon wafer; the second carrying unit is used for carrying the silicon wafer from the second workbench to the third workbench; an unloading unit; and the third carrying unit is used for carrying the silicon wafers from the third workbench to the unloading unit. According to the edge grinding equipment and the edge grinding method provided by the invention, the productivity can be improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to an edge grinding device and an edge grinding method. Background Art

[0002] As a good conductive material, monocrystalline silicon wafers can be widely used in semiconductor, solar cell and other technical fields. The processing of monocrystalline silicon wafers generally requires edge grinding in the later stage, which can include peripheral grinding and Notch grinding. Peripheral grinding refers to the processing of the edge of the silicon wafer to remove possible defects and irregular shapes. Notch grinding refers to processing a notch at a specific location (usually the edge) of the silicon wafer.

[0003] In the related art, for edge grinding equipment, when the wafer edge specifications change, it is necessary to stop the machine and replace the grinding wheel of the corresponding specifications. Replacing the grinding wheel is time-consuming and labor-intensive, and the downtime will affect the utilization rate of the equipment. In addition, frequent replacement of grinding wheels will cause wear and tear on the hardware structure of the equipment, such as assembly flanges, shaft heads, etc., and long-term operation will easily lead to deterioration of the mechanical precision of the equipment. In addition, in traditional edge grinding equipment, peripheral grinding and Notch grinding are completed on the same workbench (Table), and one processing operation needs to be completed before the next processing operation can be carried out, and the processing interval time is relatively long. Summary of the invention

[0004] In order to solve at least one of the above technical problems in the prior art, an embodiment of the present disclosure provides an edge grinding device and an edge grinding method.

[0005] The technical solutions provided by the embodiments of the present disclosure are as follows:

[0006] In a first aspect, an embodiment of the present disclosure provides an edge grinding device, comprising:

[0007] A loading unit, comprising a loading inlet and a first workbench for carrying silicon wafers loaded from the loading inlet;

[0008] A first grinding unit includes at least two peripheral rough grinding mechanisms, each of which includes a second workbench for carrying a silicon wafer, and a peripheral rough grinding wheel for cooperating with the second workbench to perform rough grinding on the peripheral edge of the silicon wafer, and different peripheral rough grinding mechanisms have different grinding parameters;

[0009] A first transport unit, used for transporting the silicon wafer from the first workbench to the corresponding second workbench of the peripheral rough grinding mechanism;

[0010] A second grinding unit comprises a notched rough grinding wheel, a notched fine grinding wheel, a peripheral fine grinding wheel and a third workbench, wherein the third workbench is configured to cooperate with the notched rough grinding wheel, the notched fine grinding wheel and the peripheral fine grinding wheel in sequence to perform corresponding grinding operations on the silicon wafer;

[0011] a second transport unit, used for transporting the silicon wafer from the second workbench to the third workbench; a discharge unit, used for unloading the silicon wafer; and

[0012] The third transport unit is used to transport the silicon wafer from the third workbench to the unloading unit.

[0013] Exemplarily, it also includes a control unit, which is used to control the first transport unit to selectively transport the silicon wafers to the corresponding second workbench according to the specification parameters of the silicon wafers loaded on the first workbench.

[0014] Exemplarily, the edge grinding equipment includes a loading area, a first processing area, a second processing area and an unloading area arranged in sequence along the assembly line direction, the loading unit is located in the loading area, the first grinding unit is located in the first processing area, the second grinding unit is located in the second processing area, the unloading unit is located in the unloading area, and the first processing area includes at least two sub-processing areas arranged in parallel between the loading area and the second processing area, and each of the sub-processing areas is provided with one of the peripheral rough grinding mechanisms.

[0015] Exemplarily, the first workbench and at least two of the second workbench are configured to be distributed at intervals on the same virtual circle, and the third workbench is arranged on the outer circumference of the virtual circle and located between two adjacent second workbench.

[0016] Exemplarily, it includes a support frame assembly, the support frame assembly includes a main frame and a plurality of branch frames connected to the main frame, and the first workbench and at least two of the second workbench are respectively connected to the branch frames.

[0017] Exemplarily, any one of the first transport unit, the second transport unit, and the third transport unit includes a robot.

[0018] Exemplarily, in the second grinding unit, the notched rough grinding wheel, the notched fine grinding wheel, and the peripheral fine grinding wheel are arranged in sequence along a predetermined direction, and the third workbench is configured to be movable to different positions corresponding to the notched rough grinding wheel, the notched fine grinding wheel, and the peripheral fine grinding wheel.

[0019] Exemplarily, any one of the first workbench, the second workbench and the third workbench includes a carrying body, a negative pressure chamber is provided inside the carrying body, and the carrying body includes a carrying surface; wherein the carrying surface is configured to be made of a porous ceramic material.

[0020] In a second aspect, the embodiment of the present disclosure further provides an edge grinding method, which is applied to the edge grinding device as described above, and the method comprises the following steps:

[0021] loading a silicon wafer into a first workbench;

[0022] Controlling the first transport unit to transport the silicon wafer to the corresponding second workbench to perform rough grinding on the outer periphery of the silicon wafer;

[0023] Controlling the second transport unit to transport the silicon wafer from the second workbench to the third workbench, so that the third workbench cooperates with the notch rough grinding wheel, the notch fine grinding wheel, and the peripheral fine grinding wheel in sequence to perform notch rough grinding, notch fine grinding, and peripheral fine grinding on the silicon wafer accordingly;

[0024] The third transport unit is controlled to transport the silicon wafer from the third workbench to the unloading unit.

[0025] Exemplarily, controlling the first transport unit to transport the silicon wafer to the corresponding second workbench specifically includes:

[0026] According to the specification parameters of the silicon wafers loaded on the first workbench, the first transport unit is controlled to selectively transport the silicon wafers to the corresponding second workbench.

[0027] The beneficial effects brought by the embodiments of the present disclosure are as follows:

[0028] In the edge grinding equipment and edge grinding method provided in the embodiments of the present disclosure, at least two peripheral rough grinding mechanisms are arranged, and the grinding parameters in each peripheral rough grinding mechanism are different. For example, the parameters such as the grinding speed, grinding amount or grinding wheel grit of the peripheral rough grinding wheel are different. When processing silicon wafers of different specifications, the silicon wafers can be transported to the second workbench in an adapted peripheral rough grinding mechanism by the first transport unit to select a suitable peripheral rough grinding wheel to perform peripheral rough grinding on the silicon wafer. After the peripheral rough grinding is completed, it is transported to the second grinding unit, and the same second grinding unit is used to perform notch rough grinding, notch fine grinding and peripheral fine grinding on the silicon wafers of different specifications after the peripheral rough grinding. It can be seen that the edge grinding equipment and edge grinding method provided by the embodiments of the present disclosure, by setting at least two peripheral rough grinding mechanisms with different grinding parameters, can process silicon wafers of different specifications by only selecting suitable peripheral rough grinding wheels according to the specifications of the silicon wafers for processing, without the need to replace the peripheral rough grinding wheels, thus avoiding the reduction of equipment production capacity caused by frequent replacement of grinding wheels; and, while one of the peripheral rough grinding mechanisms is performing peripheral rough grinding on the silicon wafer, the other peripheral rough grinding mechanism can be used as a backup or simultaneously process silicon wafers of another specification, the operations between silicon wafers of different specifications will not affect each other, and the traditional processing operation method can be improved to assembly line processing, with shorter production intervals and higher production capacity. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 A schematic diagram showing the structure of an edge grinding device provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0031] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0032] The features such as "parallel", "perpendicular", and "same" used in the embodiments of the present disclosure include the features such as "parallel", "perpendicular", and "same" in a strict sense, as well as the cases where "approximately parallel", "approximately perpendicular", "approximately the same", etc. include certain tolerances, taking into account the tolerances associated with the measurement of specific quantities (e.g., the limitations of the measurement system), and represent the acceptable deviation range for a specific value determined by ordinary technicians in the field. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0033] In addition, in this document, unless otherwise defined, the terms "substantially", "substantially", "approximately" and "about" are used to describe and explain small changes. When used with an event or situation, these terms can cover situations where the event or situation occurs exactly, and can also cover situations where the event or situation occurs approximately. For example, when used with a numerical value, these terms can include a range of variation of less than or equal to 10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, less than or equal to ±0.05%. The term "substantially coplanar" can refer to two surfaces being arranged along the same plane in the micrometer range, for example, arranged along the same plane within 40μm, 30μm, 20μm, 10μm or 1μm.

[0034] like Figure 1 As shown, an embodiment of the present disclosure provides an edge grinding device, including: a loading unit 100, a first grinding unit 200, a second grinding unit 300, a unloading unit 400, a first conveying unit 500, a second conveying unit 600 and a third conveying unit 700.

[0035] The loading unit 100 includes a load port 110 and a first workbench 120 . The first workbench 120 is used to carry silicon wafers loaded from the load port 110 .

[0036] The first grinding unit 200 includes at least two peripheral rough grinding mechanisms 210, such as Figure 1 As shown, the first grinding unit 200 includes a first peripheral rough grinding mechanism 210A and a second peripheral rough grinding mechanism 210B.

[0037] Each of the peripheral rough grinding mechanisms 210 includes a second workbench 211 and a peripheral rough grinding wheel 212, wherein the second workbench 211 is used to carry the silicon wafer, and the peripheral rough grinding wheel 212 is used to cooperate with the second workbench 211 to perform rough grinding on the peripheral edge of the silicon wafer. Among them, the grinding parameters of different peripheral rough grinding mechanisms 210 are different. The grinding parameters may include but are not limited to the grinding rate, grinding amount, and grinding wheel mesh number of the peripheral rough grinding wheel 212. In this way, different peripheral rough grinding mechanisms 210 can be suitable for silicon wafers of different specifications.

[0038] The first transport unit 500 may be configured to transport the silicon wafer from the first workbench 120 to any second workbench 211 of the peripheral rough grinding mechanism 210. In this way, for silicon wafers of different specifications, the first transport unit 500 may transport the silicon wafer from the first workbench 120 to the corresponding second workbench 211 of the peripheral rough grinding mechanism 210.

[0039] The second grinding unit 300 may include a notched rough grinding wheel 310, a notched fine grinding wheel 320, a peripheral fine grinding wheel 330 and a third workbench 340. The third workbench 340 is configured to cooperate with the notched rough grinding wheel 310, the notched fine grinding wheel 320, and the peripheral fine grinding wheel 330 in sequence to perform corresponding notched rough grinding, notched fine grinding, peripheral fine grinding and other grinding operations on the silicon wafer.

[0040] The second transport unit 600 is used to transport the silicon wafer from the second workbench 211 to the third workbench 340. The unloading unit 400 is used to unload the silicon wafer, and the third transport unit 700 is used to transport the silicon wafer from the third workbench 340 to the unloading unit 400.

[0041] In the edge grinding equipment provided by the embodiment of the present disclosure, at least two peripheral rough grinding mechanisms 210 are provided, and the grinding parameters in each peripheral rough grinding mechanism 210 are different, for example, the parameters such as the grinding speed, grinding amount or grinding wheel grit of the peripheral rough grinding wheel 212 are different. When processing silicon wafers of different specifications, the silicon wafers can be transported to the second workbench 211 in an adapted peripheral rough grinding mechanism 210 by the first transport unit 500, so as to select a suitable peripheral rough grinding wheel 212 to perform peripheral rough grinding on the silicon wafer. After the peripheral rough grinding is completed, it is transported to the second grinding unit 300, and the same second grinding unit 300 is used to perform notch rough grinding, notch fine grinding and peripheral fine grinding and other grinding operations on the silicon wafers of different specifications after the peripheral rough grinding.

[0042] It can be seen that the edge grinding equipment provided by the embodiment of the present disclosure, by setting at least two peripheral rough grinding mechanisms 210 with different grinding parameters, can process silicon wafers of different specifications by only selecting a suitable peripheral rough grinding wheel 212 for processing according to the specifications of the silicon wafers. There is no need to replace the peripheral rough grinding wheel 212, thereby avoiding the problem of reduced equipment production capacity due to frequent replacement of grinding wheels, improving equipment utilization rate, and increasing equipment production capacity.

[0043] Furthermore, while one of the peripheral rough grinding mechanisms 210 is performing peripheral rough grinding on a silicon wafer, the other peripheral rough grinding mechanism 210 can be used as a backup or can simultaneously process silicon wafers of another specification, and the operations between silicon wafers of different specifications will not affect each other. Through the above-mentioned improvements and automatic transportation of silicon wafers between different units through transportation units, the traditional processing operation mode is improved to assembly line processing, the production interval time is shortened, and the equipment production capacity is improved.

[0044] As an exemplary embodiment, the edge grinding device also includes a control unit, which is used to control the first transport unit 500 to selectively transport the silicon wafer to the corresponding second workbench 211 according to the specification parameters of the silicon wafer loaded on the first workbench 120.

[0045] By adopting the above scheme, information such as the identification of the silicon wafer can be pre-stored on the silicon wafer processing production line. The control unit can identify the specification parameters of the silicon wafer loaded on the first workbench 120, and control the first conveying unit 500 to convey the silicon wafer to the corresponding second workbench 211 according to the specification parameters of the silicon wafer. In this way, silicon wafers of different specifications can be automatically sorted to the appropriate peripheral rough grinding wheel 212 for peripheral rough grinding.

[0046] As an exemplary embodiment, Figure 1As shown, the edge grinding equipment includes a loading area A, a first processing area B, a second processing area C and a unloading area D which are arranged in sequence along the assembly line direction, the loading unit 100 is located in the loading area A, the first grinding unit 200 is located in the first processing area B, the second grinding unit 300 is located in the second processing area C, the unloading unit 400 is located in the unloading area D, and the first processing area B includes at least two sub-processing areas arranged in parallel between the loading area A and the second processing area C, and each of the sub-processing areas is provided with one peripheral rough grinding mechanism 210.

[0047] By adopting the above scheme, the loading area A, the first processing area B, the second processing area C and the unloading area D of the edge grinding equipment are arranged in sequence along the direction of the assembly line, and the first processing area B is divided into at least two sub-processing areas arranged in parallel, and each of the sub-processing areas is arranged with one of the peripheral rough grinding mechanisms 210. When processing silicon wafers, after the silicon wafers are processed by one of the peripheral rough grinding mechanisms 210, they can be transported from the second workbench 211 to the second processing area C by the second transport unit 600. In this way, the assembly line processing method is realized, and the overall layout is reasonable.

[0048] As an exemplary embodiment, Figure 1 As shown, any one of the first transport unit 500 , the second transport unit 600 and the third transport unit 700 may be a robot. However, this is not limited thereto.

[0049] In addition, as an exemplary embodiment, Figure 1 As shown, the first workbench 120 and at least two of the second workbench 211 are configured to be distributed at intervals on the same virtual circle E, and the third workbench 340 is arranged on the outer peripheral side of the virtual circle E and located between two adjacent second workbench 211 .

[0050] By adopting the above solution, the second transport unit 600 can be arranged in the virtual circle E. Thus, the transport between the third workbench 340 and different second workbench 211 can be completed by using one second transport unit 600 .

[0051] As an exemplary embodiment, Figure 1 As shown, the first grinding unit 200 includes a carrier assembly, and the carrier assembly includes a main bracket 231 and a plurality of branch brackets 232 connected to the main bracket 231, and the first workbench 120 and at least two of the second workbench 211 are respectively connected to the branch brackets 232.

[0052] Thus, in some embodiments, either the first workbench 120 or the second workbench 211 can carry and fix silicon wafers by vacuum adsorption. The first workbench 120 and the second workbench 211 are arranged on the same main bracket 231 through a plurality of branch brackets 232. The structure is more compact, and the same negative pressure generating mechanism can be used to provide negative pressure for each workbench.

[0053] For example, the main support 231 and the branch support 232 may be respectively provided with vacuum channels, and the vacuum channels are connected to the negative pressure chambers inside each workbench. With this arrangement, the structure is simpler and more compact, and taking the second conveying unit 600 as an example using a robot, it is also convenient for the robot to carry out the conveying.

[0054] Of course, it is understandable that the specific arrangement of the first workbench 120 , the second workbench 211 and the third workbench 340 is not limited thereto.

[0055] Furthermore, in some exemplary embodiments, Figure 1 As shown, the second transport unit 600 and the third transport unit 700 may be implemented by using the same robot. However, this is not limited to this. In other embodiments, the second transport unit 600 and the third transport unit 700 may also be implemented by using different robots.

[0056] Furthermore, in some embodiments, Figure 1 As shown, the loading unit 100 may further include a fourth transport unit 800 for transporting the silicon wafer from the loading entrance 110 to the first workbench 120 .

[0057] Furthermore, in some exemplary embodiments, Figure 1 As shown, in the second grinding unit 300, the notched rough grinding wheel 310, the notched fine grinding wheel 320, and the peripheral fine grinding wheel 330 are arranged in sequence along a predetermined direction, and the third workbench 340 is configured to be movable to different positions corresponding to the notched rough grinding wheel 310, the notched fine grinding wheel 320, and the peripheral fine grinding wheel 330.

[0058] By adopting the above solution, by setting the third workbench 340 to be movable, the third workbench 340 can be matched with the notched rough grinding wheel 310, the notched fine grinding wheel 320, and the peripheral fine grinding wheel 330 in sequence. For example, the notched rough grinding wheel 310, the notched fine grinding wheel 320, and the peripheral fine grinding wheel 330 can be arranged in sequence along a first direction, and the third workbench 340 can reciprocate along the first direction X, and the third workbench 340 is also configured to reciprocate along a second direction Y perpendicular to the first direction X, so as to control the silicon wafer to approach or move away from each grinding wheel in the radial direction of the silicon wafer, so as to achieve contact or separation between the silicon wafer and the grinding wheel, and control the grinding amount of the silicon wafer.

[0059] In addition, in the prior art, a workbench for carrying silicon wafers is provided with a plurality of adsorption holes on the carrying surface to adsorb and fix the silicon wafers. The workbench is difficult to clean and may cause defects on the back side of the silicon wafers.

[0060] In order to solve the above problems, in some exemplary embodiments, Figure 1 As shown, any one of the first workbench 120, the second workbench 211 and the third workbench 340 includes a carrier body S1, a negative pressure chamber S2 is provided inside the carrier body S1, and the carrier body S1 includes a carrier surface S11; wherein the carrier surface S11 is configured to be made of a porous ceramic material.

[0061] The above solution uses porous ceramic material as the bearing surface of the workbench, which has the following advantages:

[0062] Porous ceramic materials generally have a large specific surface area, which enables them to adsorb gases or liquids more effectively in a vacuum environment. Despite their porous structure, porous ceramic materials generally have high mechanical strength and can withstand large loads and pressures. In addition, porous ceramic materials can generally withstand high temperature environments, which makes them perform well in high-temperature vacuum adsorption applications. Porous ceramic materials generally have good chemical stability and can resist corrosion from a variety of chemicals. In addition, porous ceramic materials have good air permeability, and the porous structure allows gases or liquids to flow freely, which helps to improve adsorption efficiency. In addition, the adjustable pore structure can adjust the porosity and pore size distribution of porous ceramic materials by controlling the manufacturing process to meet the needs of specific applications. In addition, porous ceramic materials are generally made of natural materials, meet environmental protection requirements, and can be recycled after use.

[0063] It can be seen that compared with the solution of setting a number of adsorption holes on the bearing surface in the prior art, the use of porous ceramic materials to make the bearing surface of the workbench can achieve comprehensive adsorption, stronger adsorption force, and stronger cleaning ability, which can reduce defects on the back of the silicon wafer caused by edge grinding.

[0064] Specifically, the working process of the edge grinding device provided by the embodiment of the present disclosure may be as follows:

[0065] When a silicon wafer of the first specification needs to be processed, the silicon wafer is loaded onto the first workbench 120 through the loading port, and the silicon wafer is transported to the second workbench 211 of the first peripheral rough grinding mechanism 210 by the first conveying unit 500, and the silicon wafer is rough ground at the periphery. Then, the silicon wafer is transported to the third workbench 340 by the second conveying unit 600, and is grinded accordingly by the notch rough grinding wheel 310, the notch fine grinding wheel 320 and the peripheral fine grinding wheel 330 in sequence. The silicon wafer is transported from the third workbench 340 to the unloading unit 400 by the third conveying unit 700, and the edge grinding of the silicon wafer of the first specification is completed.

[0066] When a silicon wafer of the second specification needs to be processed, the silicon wafer is loaded onto the first workbench 120 through the loading port, and the silicon wafer is transported to the second workbench 211 of the second peripheral rough grinding mechanism 210 by the first conveying unit 500, and the silicon wafer is rough ground at the periphery. Then, the silicon wafer is transported to the third workbench 340 by the second conveying unit 600, and is grinded accordingly by the notch rough grinding wheel 310, the notch fine grinding wheel 320 and the peripheral fine grinding wheel 330 in sequence. The silicon wafer is transported from the third workbench 340 to the unloading unit 400 by the third conveying unit 700, and the edge grinding of the silicon wafer of the second specification is completed.

[0067] In addition, the edge grinding equipment provided by the embodiment of the present disclosure can complete the edge grinding of silicon wafers of one specification before performing edge grinding of silicon wafers of other specifications; it can also synchronously process silicon wafers of different specifications by controlling the working status of each unit. For example, when a silicon wafer of one specification is transported to the third workbench 340 for grinding, a silicon wafer of another specification can simultaneously be undergoing periphery rough grinding on the adapted second workbench 211.

[0068] In addition, the embodiment of the present disclosure also provides an edge grinding method, which is applied to the edge grinding device provided in the embodiment of the present disclosure. The method comprises the following steps:

[0069] Step S01, loading a silicon wafer into the first workbench 120;

[0070] Step S02, controlling the first transport unit 500 to transport the silicon wafer to the corresponding second workbench 211 to perform rough grinding on the outer periphery of the silicon wafer;

[0071] Step S03, controlling the second transport unit 600 to transport the silicon wafer from the second workbench 211 to the third workbench 340, so that the third workbench 340 cooperates with the notch rough grinding wheel 310, the notch fine grinding wheel 320, and the peripheral fine grinding wheel 330 in sequence to perform corresponding notch rough grinding, notch fine grinding, and peripheral fine grinding on the silicon wafer;

[0072] Step S04 , controlling the third transport unit 700 to transport the silicon wafer from the third workbench 340 to the unloading unit 400 .

[0073] Exemplarily, the step S02 specifically includes: controlling the first transport unit 500 to selectively transport the silicon wafer to the corresponding second workbench 211 according to the specification parameters of the silicon wafer loaded on the first workbench 120 .

[0074] Since the principle of solving the problem by the edge grinding method provided in the embodiment of the present disclosure is similar to the principle of solving the problem by the above-mentioned edge grinding equipment, the embodiment of the edge grinding method provided in the embodiment of the present disclosure can refer to the embodiment of the above-mentioned edge grinding equipment provided in the embodiment of the present disclosure, and will not be repeated here.

[0075] There are a few points to note:

[0076] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0077] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0078] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0079] The above are only specific implementations of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure shall be based on the protection scope of the claims.

Claims

1. An edge grinding device, characterized in that: include: A loading unit, comprising a loading inlet and a first workbench for carrying silicon wafers loaded from the loading inlet; A first grinding unit includes at least two peripheral rough grinding mechanisms, each of which includes a second workbench for carrying a silicon wafer, and a peripheral rough grinding wheel for cooperating with the second workbench to perform rough grinding on the peripheral edge of the silicon wafer, and different peripheral rough grinding mechanisms have different grinding parameters; A first transport unit, used for transporting the silicon wafer from the first workbench to the corresponding second workbench of the peripheral rough grinding mechanism; A second grinding unit comprises a notched rough grinding wheel, a notched fine grinding wheel, a peripheral fine grinding wheel and a third workbench, wherein the third workbench is configured to cooperate with the notched rough grinding wheel, the notched fine grinding wheel and the peripheral fine grinding wheel in sequence to perform corresponding grinding operations on the silicon wafer; A second transport unit, used for transporting the silicon wafer from the second workbench to the third workbench; A discharge unit, used for unloading silicon wafers; and The third transport unit is used to transport the silicon wafer from the third workbench to the unloading unit.

2. The edge grinding device according to claim 1, characterized in that: It also includes a control unit, which is used to control the first transport unit to selectively transport the silicon wafers to the corresponding second workbench according to the specification parameters of the silicon wafers loaded on the first workbench.

3. The edge grinding device according to claim 1, characterized in that: The edge grinding equipment includes a loading area, a first processing area, a second processing area and an unloading area which are arranged in sequence along the assembly line direction, the loading unit is located in the loading area, the first grinding unit is located in the first processing area, the second grinding unit is located in the second processing area, the unloading unit is located in the unloading area, and the first processing area includes at least two sub-processing areas arranged in parallel between the loading area and the second processing area, and each of the sub-processing areas is provided with one of the peripheral rough grinding mechanisms.

4. The edge grinding device according to claim 1, characterized in that: The first workbench and at least two of the second workbench are configured to be distributed at intervals on the same virtual circle, and the third workbench is arranged on the outer circumference of the virtual circle and located between two adjacent second workbench.

5. The edge grinding device according to claim 1, characterized in that: It comprises a bearing frame assembly, wherein the bearing frame assembly comprises a main frame and a plurality of branch frames connected to the main frame, and the first workbench and at least two of the second workbench are respectively and correspondingly connected to the branch frames.

6. The edge grinding device according to claim 1, characterized in that: Any one of the first conveying unit, the second conveying unit, and the third conveying unit includes a robot.

7. The edge grinding device according to claim 1, characterized in that: In the second grinding unit, the notched rough grinding wheel, the notched fine grinding wheel and the peripheral fine grinding wheel are arranged in sequence along a predetermined direction, and the third workbench is configured to be movable to different positions corresponding to the notched rough grinding wheel, the notched fine grinding wheel and the peripheral fine grinding wheel.

8. The edge grinding device according to claim 1, characterized in that: Any one of the first workbench, the second workbench and the third workbench includes a carrier body, a negative pressure chamber is provided inside the carrier body, and the carrier body includes a carrier surface; wherein the carrier surface is configured to be made of a porous ceramic material.

9. An edge grinding method, characterized in that: Applied to the edge grinding device according to any one of claims 1 to 8, the method comprises the following steps: loading a silicon wafer into a first workbench; Controlling the first transport unit to transport the silicon wafer to the corresponding second workbench to perform rough grinding on the outer periphery of the silicon wafer; Controlling the second transport unit to transport the silicon wafer from the second workbench to the third workbench, so that the third workbench cooperates with the notch rough grinding wheel, the notch fine grinding wheel, and the peripheral fine grinding wheel in sequence to perform notch rough grinding, notch fine grinding, and peripheral fine grinding on the silicon wafer accordingly; The third transport unit is controlled to transport the silicon wafer from the third workbench to the unloading unit.

10. The edge grinding method according to claim 9, characterized in that: The controlling the first transport unit to transport the silicon wafer to the corresponding second workbench specifically includes: According to the specification parameters of the silicon wafers loaded on the first workbench, the first transport unit is controlled to selectively transport the silicon wafers to the corresponding second workbench.

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