Mould pressing structure for diode production

Abstract

The invention provides a mould pressing structure for diode production, and relates to the technical field of diode packaging, and the mould pressing structure comprises a fixing frame, four supporting legs are fixedly installed on the lower end face of the fixing frame, four limiting cylinders are fixedly installed on the upper end face of the fixing frame, and four through square holes are formed in the surface of a top plate of the fixing frame; the limiting cylinders communicate with square holes in the top plate surface of the fixing frame. According to the invention, the cooling pipe is arranged in the cavity, cooling liquid can cool the mold cavity between the upper mold plate and the lower mold plate when passing through the cooling pipe, the cover plates are located right below diode pins, and after the driving motor is started, the two cover plates move upwards at the same time to support the diodes upwards, so that the diodes can be prevented from being damaged, and the service life of the diodes is prolonged. And meanwhile, workers can conveniently take the diode out of the die cavity, and the problems that the cooling speed of epoxy resin colloid in the die cavity is low, the part, located in the die cavity, of the diode is prone to adhering to the inner wall of the die cavity, and pins of the diode are prone to being damaged are solved.

Description

Technical Field

[0001] The invention relates to the technical field of diode packaging, and in particular to a molded structure for diode production. Background Art

[0002] As a basic component of electronic products, diodes are widely used in various fields. In the production process of diodes, they need to be molded and packaged. The specific process is to put the pressed LED bracket into the mold, close the upper and lower molds, put the solid epoxy into the entrance of the injection channel and heat it, so that the epoxy enters the mold cavity along the glue channel and solidifies.

[0003] Referring to the patent CN202011272993.X, a diode packaging process and a packaged diode are provided, wherein the process includes: fixing a diode chip on a metal substrate to obtain a diode to be packaged; placing the diode to be packaged in the central area inside the tube shell, wherein the diode to be packaged has a metal lead connected to an external pin; injecting silicone into the tube shell so that the silicone wraps the diode to be packaged and the metal lead; using a molded packaging process, injecting epoxy resin colloid into the tube shell to obtain a packaged diode, wherein the epoxy resin colloid generates an optical lens inside the tube shell, and the optical lens is fixed to the central area of ​​the upper surface layer of the silicone. By using silicone to wrap the diode to be packaged and the metal lead, the structure of the metal lead in the packaged diode can be protected from being broken even when the packaged diode is in a high-temperature working state.

[0004] Based on the search of the above patents and combined with the current use of diode molding devices, it is found that the existing diode molding devices still have the following two disadvantages: First, after the diode is molded and packaged, it is necessary to wait for the epoxy resin to cool down before the diode can be taken out. This process consumes a lot of time and reduces the work efficiency of workers. Secondly, after the upper and lower templates are separated, the part of the diode located in the mold cavity is prone to adhesion to the inner wall of the mold cavity, making it difficult for workers to remove the diode. Moreover, when workers take the diode out of the mold cavity, they apply unidirectional force, which can easily cause damage to the pins of the diode. Summary of the invention

[0005] In view of this, the present invention provides a mold pressing structure for diode production, wherein a cooling pipe is arranged inside the cavity, and the coolant cools the cavity between the upper mold plate and the lower mold plate when passing through the cooling pipe, and the cooling pipe is arranged in an S-shaped structure, which can prolong the flow time of the coolant inside the cavity, thereby taking away more heat, improving the cooling effect on the colloid outside the diode, and improving work efficiency. The cover plate is located directly below the pins of the diode. After the drive motor is started, the two cover plates move upward at the same time to lift the diode upward, and the pins at the front and rear ends of the diode are subjected to force at the same time, which can prevent the diode from being damaged and facilitate workers to take the diode out of the mold cavity.

[0006] The present invention provides a purpose and effect of a molded structure for diode production, specifically comprising: a fixing frame; The lower end surface of the fixing frame is fixedly mounted with four supporting legs, the upper end surface of the fixing frame is fixedly mounted with four limiting cylinders, the top plate surface of the fixing frame is provided with four through-shaped square holes, and the limiting cylinders are connected with the square holes on the top plate surface of the fixing frame; An electric cylinder, wherein the electric cylinder is fixedly mounted on the upper surface of the top plate of the fixing frame, and a lifting plate is fixedly mounted on the end of the telescopic part of the lower end of the electric cylinder; An upper template, wherein four connecting rods are fixedly installed on the upper end surface of the upper template, the upper ends of the connecting rods are fixedly connected to the lifting plate, and a storage box is fixedly installed in the middle position of the upper end surface of the upper template; A lower template, wherein the lower template is fixedly mounted on the surface of the bottom plate of the fixing frame, and a cavity is opened inside the lower template; A device box, the device box is fixedly mounted on the lower end surface of the bottom plate of the fixing frame, and two vertical sliding grooves are provided on the surface of the left end side plate of the device box; A driving motor, wherein the driving motor is fixedly mounted on the front end surface of the device box, and the front end surface of the driving motor is drivingly connected to the driving shaft; A fixed plate, the upper end surface of which is fixedly mounted with a lifting rod, which is slidably clamped on the bottom plate surface of the fixed frame; The fixed rack is fixedly mounted on the lower end surface of the fixed plate, and a connecting block is fixedly mounted on the outer end surface of the fixed plate.

[0007] Furthermore, a cooling pipe is provided inside the cavity, the cooling pipe body is arranged in an S-shaped structure, and three heat-conducting columns are provided at the front end of the cavity.

[0008] Furthermore, four limiting rods are fixedly mounted on the upper end surface of the lifting plate, and the upper ends of the limiting rods pass through the top plate of the fixing frame and are slidably mounted inside the limiting cylinder.

[0009] Furthermore, two driving gears are fixedly mounted on the surface of the driving shaft, and the end of the driving shaft is rotatably connected to the rear end side plate of the device box.

[0010] Furthermore, the driving gear is meshed with the fixed rack, and the outer end surface of the fixed rack is in contact with the outer end surface of the fixed plate.

[0011] Furthermore, a limiting block is fixedly installed on the outer end surface of the connecting block, and the limiting block is slidably mounted in a vertical sliding groove on the inner end surface of the left end side plate of the device box.

[0012] Furthermore, a cover plate is fixedly connected to the top end of the lifting rod, the middle part of the cover plate is a semicircular structure, and the left and right ends of the cover plate are arranged in an inclined structure.

[0013] Furthermore, a discharge pipe is fixedly installed at the lower end of the storage box, and the discharge pipe is connected to the mold cavity of the upper mold plate.

[0014] The present invention provides a molded structure for diode production, which has the following beneficial effects: In the present invention, by arranging a cooling tube inside the cavity, the coolant can cool the cavity between the upper template and the lower template when passing through the cooling tube, and the cooling tube is arranged in an S-shaped structure, which can prolong the flow time of the coolant inside the cavity, thereby taking away more heat, improving the cooling effect on the colloid outside the diode, and improving work efficiency.

[0015] In addition, by sliding the limit rod on the upper end surface of the lifting plate into the limit cylinder, the limit rod can limit the lifting plate when the lifting plate moves up and down, ensuring that the lifting plate will not swing left and right when it moves up and down.

[0016] In addition, by meshing the active gear with the fixed rack, the active gear drives the fixed rack to move upward during rotation. The fixed rack is fixedly installed on the lower end surface of the fixed plate, and a lifting rod is fixedly installed on the upper end surface of the fixed plate. Therefore, when the fixed rack moves upward, the lifting rod and the cover plate will also move upward. The cover plate is located directly below the pins of the diode. Therefore, when the two cover plates move upward at the same time, the two cover plates can fit with the pins of the diode and lift the diode upward. The pins at the front and rear ends of the diode are subjected to force at the same time, which can prevent the diode from being damaged and facilitate workers to remove the diode from the mold cavity. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings of the embodiment are briefly introduced below.

[0018] The drawings described below are only related to some embodiments of the present invention, but are not intended to limit the present invention.

[0019] In the attached picture: Figure 1 It is a schematic diagram of the overall device structure of the present invention; Figure 2 It is a schematic cross-sectional structural diagram of the lower template of the present invention; Figure 3 It is a schematic diagram of the cross-sectional structure of the device box of the present invention; Figure 4 It is a schematic diagram of the structure of the fixed rack and the driving gear of the present invention; Figure 5 It is a schematic diagram of the cooling pipe and the lower template structure of the present invention; Figure 6 It is a schematic diagram of the connection structure between the electric cylinder and the lifting plate of the present invention; Figure 7 It is a schematic diagram of the connection structure between the limiting rod and the limiting cylinder of the present invention; Figure 8 It is a schematic diagram of the cross-sectional structure of the upper template and the storage box of the present invention.

[0020] List of reference numerals: 1. Fixed frame; 101. Support leg; 102. Limit cylinder; 2. Electric cylinder; 3. Lifting plate; 301. Limit rod; 4. Upper template; 401. Storage box; 402. Connecting rod; 5. Lower template; 501. Cavity; 502. Heat-conducting column; 6. Cooling pipe; 7. Device box; 701. Vertical slide; 8. Drive motor; 801. Drive shaft; 8011. Driving gear; 9. Fixed plate; 901. Lifting rod; 9011. Cover plate; 10. Fixed rack; 11. Connecting block; 1101. Limit block. DETAILED DESCRIPTION

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings of specific embodiments of the present invention.

[0022] Example 1: Please refer to Figures 1 to 8 As shown: The present invention provides a molded structure for diode production, comprising a fixing frame 1; Four supporting legs 101 are fixedly installed on the lower end surface of the fixing frame 1, four limiting cylinders 102 are fixedly installed on the upper end surface of the fixing frame 1, and four through-shaped square holes are opened on the top plate surface of the fixing frame 1, and the limiting cylinders 102 are connected to the square holes on the top plate surface of the fixing frame 1; The electric cylinder 2 is fixedly mounted on the upper surface of the top plate of the fixing frame 1, and a lifting plate 3 is fixedly mounted on the end of the telescopic part of the lower end of the electric cylinder 2; The upper template 4 has four connecting rods 402 fixedly mounted on its upper end surface, the upper ends of the connecting rods 402 are fixedly connected to the lifting plate 3, a storage box 401 is fixedly mounted on the middle position of the upper end surface of the upper template 4, a discharge pipe is fixedly mounted on the lower end of the storage box 401, and the discharge pipe is connected to the mold cavity of the upper template 4; The lower template 5 is fixedly mounted on the bottom plate surface of the fixing frame 1, and a cavity 501 is formed inside the lower template 5; The device box 7 is fixedly mounted on the lower end surface of the bottom plate of the fixing frame 1, and two vertical slide grooves 701 are provided on the surface of the left side plate of the device box 7; A driving motor 8, which is fixedly mounted on the front end surface of the device box 7, and the front end surface of the driving motor 8 is drivingly connected to a driving shaft 801; A fixing plate 9, the upper end surface of which is fixedly mounted a lifting rod 901, which is slidably mounted on the bottom surface of the fixing frame 1; The fixed rack 10 is fixedly mounted on the lower end surface of the fixed plate 9 , and a connecting block 11 is fixedly mounted on the outer end surface of the fixed plate 9 .

[0023] Among them, a cooling pipe 6 is provided inside the cavity 501, and the main body of the cooling pipe 6 is arranged in an S-shaped structure. Three heat-conducting columns 502 are arranged at the front end of the cavity 501. During use, the diode to be processed is placed in the mold cavity on the surface of the lower template 5. After the telescopic part at the lower end of the electric cylinder 2 drives the lifting plate 3 and the upper template 4 to move downward, the diode will be located in the mold cavity between the lower template 5 and the upper template 4, and then the colloid can enter the mold cavity through the storage box 401. The diode packaging process needs to be carried out under high temperature conditions. After the packaging is completed, the colloid can be taken out of the mold cavity after cooling. At this time, through the arrangement of the cooling pipe 6 inside the cavity 501, the coolant will cool the mold cavity between the upper template 4 and the lower template 5 when passing through the cooling pipe 6. The cooling pipe 6 is arranged in an S-shaped structure, which can extend the flow time of the coolant in the cavity 501, so that it can take away more heat, improve the cooling effect of the colloid outside the diode, and improve work efficiency. Through the arrangement of the heat-conducting column 502, the heat exchange between the cavity 501 and the outside world can be promoted.

[0024] Among them, four limit rods 301 are fixedly installed on the upper end surface of the lifting plate 3, and the upper ends of the limit rods 301 pass through the top plate of the fixing frame 1 and are slidably clamped in the limit cylinder 102. During use, after the telescopic part of the electric cylinder 2 frequently drives the lifting plate 3 to move up and down, the lifting plate 3 is prone to left and right swinging, which will cause the mold cavity between the upper mold plate 4 and the lower mold plate 5 to be unable to be completely closed. At this time, the limit rods 301 on the upper end surface of the lifting plate 3 are slidably clamped in the limit cylinder 102, so that when the lifting plate 3 moves up and down, the limit rods 301 can play a role in limiting the lifting plate 3, ensuring that the lifting plate 3 will not swing left and right when moving up and down.

[0025] Among them, a limit block 1101 is fixedly installed on the outer end surface of the connecting block 11, and the limit block 1101 is slidably mounted in the vertical slide groove 701 on the inner end surface of the left end side plate of the device box 7. During use, when the limit block 1101 moves up and down along the vertical slide groove 701, it can play a limiting role on the fixed rack 10, so that the fixed rack 10 can drive the lifting rod 901 to move vertically up and down.

[0026] Among them, the top of the lifting rod 901 is fixedly connected with a cover plate 9011, the middle part of the cover plate 9011 is a semicircular structure, and the left and right ends of the cover plate 9011 are arranged in an inclined structure. In use, the pins at the front and rear ends of the diode are located at the front and rear ends of the lower template 5. After the diode packaging is completed, the telescopic part of the electric cylinder 2 moves upward. At this time, the upper template 4 is separated from the lower template 5. The worker can start the drive motor 8, and the lifting rod 901 will move upward. The upper ends of the two lifting rods 901 are both installed with cover plates 9011. The two cover plates 9011 are located directly below the pins of the diode. Therefore, when the two cover plates 9011 move upward at the same time, the two cover plates 9011 can fit with the pins of the diode and lift the diode upward. The pins at the front and rear ends of the diode are subjected to force at the same time, which can prevent the diode from being damaged and facilitate the workers to take the diode out of the mold cavity.

[0027] Embodiment 2: The present invention provides a molded structure for diode production, based on the embodiment 1, such as Figure 1-Figure 8 As shown, it also includes: two driving gears 8011 are fixedly installed on the surface of the driving shaft 801, the end of the driving shaft 801 is rotatably connected to the rear end side plate of the device box 7, the driving gear 8011 is meshed with the fixed rack 10, and the outer end surface of the fixed rack 10 is in contact with the outer end surface of the fixed plate 9.

[0028] By adopting the above scheme, the technical effect brought about is: after the diode packaging is completed and the upper template 4 is separated from the lower template 5, the worker can start the drive motor 8, and the drive motor 8 will drive the two active gears 8011 on the surface of the drive shaft 801 to rotate. Through the mutual meshing setting of the active gear 8011 and the fixed rack 10, the active gear 8011 will drive the fixed rack 10 to move upward during rotation. The fixed rack 10 is fixedly installed on the lower end surface of the fixed plate 9, and the upper end surface of the fixed plate 9 is fixedly installed with a lifting rod 901. Therefore, when the fixed rack 10 is upward, the lifting rod 901 and the cover plate 9011 will also move upward, so that the two cover plates 9011 can lift the diode in the mold cavity of the lower template 5, making it convenient for workers to take out the diode.

[0029] Specific usage and function of this embodiment: In the present invention, the diode to be processed is placed in the mold cavity on the surface of the lower mold plate 5. After the telescopic part at the lower end of the electric cylinder 2 drives the lifting plate 3 and the upper mold plate 4 to move downward, the diode will be located in the mold cavity between the lower mold plate 5 and the upper mold plate 4. Then the colloid can enter the mold cavity through the storage box 401. The diode packaging process needs to be carried out under high temperature conditions. After the packaging is completed, the colloid can be taken out of the mold cavity after cooling. At this time, the cooling tube 6 is set inside the cavity 501, so that the coolant will pass through the cooling tube 6. When the cooling liquid passes through the cooling tube 6, it will be cooled to the upper mold. The mold cavity between the upper mold plate 4 and the lower mold plate 5 is cooled, and the cooling tube 6 is arranged in an S-shaped structure, which can prolong the flow time of the coolant in the cavity 501, so as to take away more heat, improve the cooling effect on the external colloid of the diode, and improve work efficiency. After the telescopic part of the electric cylinder 2 frequently drives the lifting plate 3 to move up and down, the lifting plate 3 is prone to left and right swinging, which will cause the mold cavity between the upper mold plate 4 and the lower mold plate 5 to be unable to be completely closed. At this time, the upper end surface limit rod 301 of the lifting plate 3 is slidably mounted in the limit cylinder 102, so that the lifting plate 3 moves up and down. When the lifting plate 3 is lifted, the limit rod 301 can limit the lifting plate 3 to ensure that the lifting plate 3 will not swing left and right when it moves up and down. The pins at the front and rear ends of the diode are located at the front and rear ends of the lower template 5. After the diode is packaged, the telescopic part of the electric cylinder 2 moves upward. At this time, the upper template 4 is separated from the lower template 5. The worker can start the drive motor 8. The drive motor 8 will drive the two active gears 8011 on the surface of the drive shaft 801 to rotate. The active gear 8011 is meshed with the fixed rack 10, so that the active gear 8011 will drive the fixed rack 10 to rotate. The fixed rack 10 moves upward, and the fixed rack 10 is fixedly installed on the lower end surface of the fixed plate 9, and the upper end surface of the fixed plate 9 is fixedly installed with a lifting rod 901. Therefore, when the fixed rack 10 moves upward, the lifting rod 901 and the cover plate 9011 will also move upward. The cover plate 9011 is located directly below the pins of the diode. Therefore, when the two cover plates 9011 move upward at the same time, the two cover plates 9011 can fit with the pins of the diode and lift the diode upward. The pins at the front and back ends of the diode are subjected to force at the same time, which can prevent the diode from being damaged and facilitate workers to take the diode out of the mold cavity.

Claims

1. A molded structure for diode production, characterized in that: include: A fixed frame (1), wherein four supporting legs (101) are fixedly mounted on the lower end surface of the fixed frame (1), four limiting cylinders (102) are fixedly mounted on the upper end surface of the fixed frame (1), four through-shaped square holes are opened on the top plate surface of the fixed frame (1), and the limiting cylinders (102) are connected to the square holes on the top plate surface of the fixed frame (1); an electric cylinder (2), wherein the electric cylinder (2) is fixedly mounted on the upper end surface of the top plate of the fixed frame (1), and a lifting plate (3) is fixedly mounted at the end of the telescopic portion of the lower end of the electric cylinder (2); an upper template (4), wherein four connecting rods (402) are fixedly mounted on the upper end surface of the upper template (4), and the upper ends of the connecting rods (402) are fixedly connected to the lifting plate (3), and a storage box (401) is fixedly mounted at the middle position of the upper end surface of the upper template (4); a lower template (5), wherein the lower template (5) is fixed The device is mounted on the bottom plate surface of the fixing frame (1), and a cavity (501) is provided inside the lower template (5); a device box (7), the device box (7) is fixedly mounted on the lower end surface of the bottom plate of the fixing frame (1), and two vertical slide grooves (701) are provided on the left side plate surface of the device box (7); a drive motor (8), the drive motor (8) is fixedly mounted on the front end surface of the device box (7), and the front end surface of the drive motor (8) is drivingly connected to a drive shaft (801); a fixing plate (9), the upper end surface of the fixing plate (9) is fixedly mounted with a lifting rod (901), and the lifting rod (901) is slidably clamped on the bottom plate surface of the fixing frame (1); a fixing rack (10), the fixed rack (10) is fixedly mounted on the lower end surface of the fixing plate (9), and a connecting block (11) is fixedly mounted on the outer end surface of the fixing plate (9).

2. A molded structure for diode production as claimed in claim 1, characterized in that: A cooling pipe (6) is provided inside the cavity (501); the main body of the cooling pipe (6) is arranged in an S-shaped structure; and three heat-conducting columns (502) are provided at the front end of the cavity (501).

3. A molded structure for diode production as claimed in claim 1, characterized in that: Four limiting rods (301) are fixedly mounted on the upper end surface of the lifting plate (3), and the upper ends of the limiting rods (301) pass through the top plate of the fixing frame (1) and are slidably mounted inside the limiting cylinder (102).

4. A molded structure for diode production as claimed in claim 1, characterized in that: Two driving gears (8011) are fixedly mounted on the surface of the driving shaft (801), and the end of the driving shaft (801) is rotatably connected to the rear end side plate of the device box (7).

5. A molded structure for diode production as claimed in claim 4, characterized in that: The driving gear (8011) meshes with the fixed rack (10), and the outer end surface of the fixed rack (10) fits with the outer end surface of the fixed plate (9).

6. A molded structure for diode production as claimed in claim 1, characterized in that: A limit block (1101) is fixedly mounted on the outer end surface of the connection block (11), and the limit block (1101) is slidably mounted in a vertical slide groove (701) on the inner end surface of the left end side plate of the device box (7).

7. A molded structure for diode production as claimed in claim 1, characterized in that: The top end of the lifting rod (901) is fixedly connected to a cover plate (9011); the middle portion of the cover plate (9011) is a semicircular structure; the left and right ends of the cover plate (9011) are arranged in an inclined structure.

8. A molded structure for diode production as claimed in claim 1, characterized in that: A discharge pipe is fixedly mounted on the lower end of the storage box (401), and the discharge pipe is in communication with the mold cavity of the upper mold plate (4).

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