A blue film electroplating equipment

Abstract

A blue film electroplating equipment, including: an equipment housing; a master control machine for regulating the operation of the electroplating equipment; a material feeding mechanism, which at least includes a first material feeding mechanism and a second material feeding mechanism which are arranged in parallel and have opposite transmission directions; an electroplating system, which is arranged at the intersection of the first material feeding mechanism and the second material feeding mechanism, and at least includes an electroplating tank, a liquid supply mechanism and a flip suction cup, wherein the liquid supply mechanism can supply electroplating liquid to the electroplating tank, and the flip suction cup can flip the sucked sheet into the electroplating tank; wherein an anode mesh plate is provided in the electroplating tank, and the contact surface between the flip suction cup and the sheet is a cathode orifice plate, and the anode mesh plate and the cathode orifice plate are connected through an external circuit. The present application has a high degree of automation, high production efficiency and high yield, and there is no rigid extrusion between the flip suction cup and the sheet, which can avoid damage to the sheet; the flip suction cup automatically transfers the sheet between the material feeding mechanism and the electroplating tank, and has high production efficiency.

Description

Technical Field

[0001] The present application belongs to the technical field of cell electroplating, and in particular, relates to a blue film electroplating device. Background Art

[0002] Metallization is one of the important links in the production of solar cells. It uses contact or non-contact technology to prepare grid lines on the surface of the cell, so that a close and efficient ohmic contact is formed between the grid lines and the cell to guide the photogenerated carriers out of the cell. Metallization affects the cost and conversion efficiency of the cell, and ultimately affects the choice of the cell path.

[0003] Currently, the main metallization solutions include screen printing and electroplating. Screen printing requires silver paste, which is relatively expensive. In addition, it needs to be sintered after printing to form grid lines, and the process flow is complicated. Therefore, the use of electroplating technology to construct low-cost metal grid lines, reduce costs and increase efficiency has become the mainstream development trend of the industry.

[0004] When the industry adopts electroplating technology to construct gate lines, the blue diaphragm is usually suspended in the plating solution by a hanger. The placement and removal of the blue diaphragm on the conductive hanger are all done manually, which is inefficient and difficult to achieve automated assembly line operation. In addition, the conductive hanger needs to firmly clamp the blue diaphragm, at least forming a semi-enclosed physical contact with the blue diaphragm. Deformation of the hanger, hand shaking when placing and removing the blue diaphragm, and other misoperations may cause damage to the structure of the blue diaphragm and the surface to be plated, reducing the production yield. Summary of the invention

[0005] The present application provides a blue diaphragm electroplating equipment, which utilizes a conductive flip suction cup to replace a traditional conductive hanger, and adopts single-sided physical contact throughout the entire process of material transfer and electroplating to reduce the chance of damage to the blue diaphragm. It is also combined with an electroplating tank, a liquid supply mechanism, a material transfer mechanism, etc. to form a highly automated electroplating equipment, which can effectively improve production yield and electroplating efficiency.

[0006] In order to solve at least one of the above technical problems, the technical solution adopted in the present application is: a blue film electroplating device, which comprises:

[0007] Equipment housing;

[0008] A master control machine, used to regulate the operation of the electroplating equipment;

[0009] The material conveying mechanism at least comprises a first material conveying mechanism and a second material conveying mechanism which are arranged in parallel and have opposite conveying directions;

[0010] An electroplating system, which is arranged at the intersection of the first material feeding mechanism and the second material feeding mechanism, and comprises at least an electroplating tank, a liquid supply mechanism and a flip suction cup, wherein the liquid supply mechanism can supply electroplating liquid to the electroplating tank, and the flip suction cup can flip the sucked material sheet into the electroplating tank;

[0011] Wherein, an anode mesh plate is provided in the electroplating tank, the contact surface between the flip suction cup and the material sheet is a cathode orifice plate, and the anode mesh plate and the cathode orifice plate are connected through an external circuit.

[0012] Preferably, a suction cup bracket is provided outside the electroplating tank, and a suction cup flip shaft is pivotally connected to the suction cup bracket, and both ends of the suction cup flip shaft are respectively connected to the flip suction cup and a suction cup flip motor, and the suction cup flip motor can drive the flip suction cup to rotate around the suction cup flip shaft to: an electroplating station in the electroplating tank, an initial station outside the electroplating tank, or a drainage station above the electroplating tank. At the electroplating station and the initial station, the cathode orifice plate is horizontal and faces opposite directions.

[0013] Preferably, a series rod is provided at the output end of the suction cup flipping motor, and a plurality of transmission components are arranged on the series rod, and the plurality of transmission components are respectively connected to different suction cup flipping shafts;

[0014] The suction cup flip axis is arranged in the same direction as the diagonal of the flip suction cup, and the transmission assembly includes a suction cup synchronous belt, a suction cup synchronous wheel and a bevel gear. The suction cup synchronous wheel is respectively provided with a group at the top and bottom ends of the suction cup bracket and is driven by the suction cup synchronous belt, and the bevel gear is respectively provided with a group at the power input end of the suction cup synchronous wheel and the series rod and is meshed for transmission.

[0015] Preferably, the flip suction cup comprises a shell, the shell is in the shape of a groove with one end open, the cathode orifice plate is at the open end of the shell, and is sealed and connected to the shell to form a negative pressure chamber; the shell is provided with an exhaust pipe connected to the negative pressure chamber, and the other end of the exhaust pipe is connected to a vacuum generator;

[0016] The outer periphery of the shell is provided with an air blowing cavity in the same direction as its opening, the air blowing cavity is connected with an air inlet pipe, and the other end of the air inlet pipe is connected to an air source.

[0017] Preferably, a third material feeding mechanism is provided at the intersection of the first material feeding mechanism and the second material feeding mechanism, and the third material feeding mechanism transfers materials between the loading end and the unloading end of the electroplating system, wherein the handover material position and the material feeding position are alternately configured, and a material transfer synchronous wheel which is transmission-connected with the material transfer position is provided in the handover material position, and when the flip suction cup is located in the handover material position, the material transfer synchronous wheel penetrates the top surface of the flip suction cup;

[0018] The third material transmission mechanism is provided with a plurality of first leveling bolts, and the flip suction cup is provided with a plurality of second leveling bolts. Both the first leveling bolts and the second leveling bolts can move along the thickness direction of the flip suction cup. When the flip suction cup is located in the handover material position, the first leveling bolts abut against the flip suction cup. When the flip suction cup is located in the electroplating tank, the second leveling bolts abut against the electroplating tank.

[0019] Preferably, a material sorting mechanism is provided on the outer side of the flip suction cup, and the material sorting mechanism comprises:

[0020] A first material sorting component is located outside a group of opposite sides of the flip suction cup close to the material transfer mechanism, the first material sorting component includes a first material sorting cylinder, a guide block and a first material sorting plate, the first material sorting cylinder is used to lift the guide block, the top of the guide block is provided with a straight slot extending along the material transfer direction of the third material transfer mechanism, a sliding member connected to the first material sorting plate is slidably provided in the straight slot, and a material sorting plate rotating shaft connecting the first material sorting plate and the third material transfer mechanism is provided above the sliding member;

[0021] A second material sorting component is located outside another set of opposite sides of the flip suction cup, and the second material sorting component includes a second material sorting cylinder and a second material sorting plate. The piston rod of the second material sorting cylinder is horizontally arranged and connected to the second material sorting plate. The second material sorting plate is driven by the second material sorting cylinder to approach or move away from the flip suction cup.

[0022] Preferably, the electroplating tank comprises a bottom plate, an outer plate and an inner partition, the inner partition is smaller in height than the outer plate, a plurality of the inner partitions enclose an electroplating area, and a plurality of the outer plates are located outside the inner partitions and enclose an overflow tank with the inner partitions;

[0023] The anode mesh plate is located in the electroplating area, and a flow stabilizing orifice plate located above the anode mesh plate is provided in the electroplating area. The liquid supply mechanism supplies liquid to the electroplating area through a liquid supply pipe and a liquid inrush pipe. The electroplating liquid supplied by the liquid supply pipe forms a stable liquid surface after passing through the flow stabilizing orifice plate, and the electrolyte inrushed by the liquid inrush pipe forms a liquid column higher than the stable liquid surface; the electroplating area and the overflow tank return liquid to the liquid supply mechanism through a liquid return pipe and an overflow pipe respectively;

[0024] The electroplating tank is at least partially light-transmissive, and the light-transmissive portion is provided with an LED light source.

[0025] Preferably, the liquid supply mechanism comprises:

[0026] A liquid storage tank, used for storing electroplating liquid;

[0027] A liquid replenishing tube, used for replenishing liquid into the liquid storage tank;

[0028] an emptying pipe, the input end of which is connected to the liquid supply pipe and is used to empty the electroplating liquid in the liquid supply pipe;

[0029] A visual liquid level gauge, used to monitor the liquid level height of the liquid storage tank;

[0030] A liquid level sensor, used to monitor whether the liquid level in the liquid storage tank exceeds a limit;

[0031] A filter, used for filtering the return liquid of the return pipe and the overflow pipe;

[0032] A heater, used for heating the electrolyte in the liquid storage tank;

[0033] A temperature sensor, used to monitor the temperature of the electrolyte in the liquid storage tank;

[0034] A magnetic suction pump, one output end of which is connected to the liquid supply pipe and / or the liquid inflow pipe through a one-way valve, and the other output end of which is connected to the liquid storage tank through a protective tube and a safety valve.

[0035] Preferably, it is characterized in that a pre-plating cleaning system and a quality inspection system are provided between the first material feeding mechanism and the electroplating system, a fourth material feeding mechanism is provided between the pre-plating cleaning system and the quality inspection system, the fourth material feeding mechanism is provided with a turning plate, a turning motor, a turning shaft and a turning bracket, the extension direction of the turning shaft is perpendicular to the material feeding direction of the first material feeding mechanism, and its two ends are rotatably arranged on the turning bracket and fixedly connected to the output end of the turning motor; the turning plate is coaxially sleeved on the turning shaft, and the turning plate is provided with a sheet receiving groove which is concave toward the axis along its outer edge;

[0036] At least one side of the material turning plate is provided with an offset material transfer assembly, and the offset material transfer assembly includes a plurality of groups of first material transfer devices, a plurality of groups of second material transfer devices, a scheduling base frame, a linear guide module 1, a scheduling driver, a scheduling lifting cylinder and a scheduling suction cup. The first material transfer device and the second material transfer device extend in the same direction as the first material transfer mechanism, and the scheduling base frame is straddled at both ends of the arrangement direction of the first material transfer device and the second material transfer device; the linear guide module 1 is constructed in the same direction as the scheduling base frame, and the scheduling suction cup is connected to the linear guide module 1 through a scheduling lifting cylinder, and the scheduling driver is used for driving the scheduling suction cup to move along the extension direction of the scheduling base frame.

[0037] Preferably, a fifth material transfer mechanism is provided between the quality inspection system and the electroplating system, and a buffer mechanism is provided on the fifth material transfer mechanism, and the buffer mechanism includes a buffer material frame and a material frame lifting assembly;

[0038] The buffer material frame comprises two groups of side panels and connecting pieces located at the top and bottom ends of the side panels, and the adjacent surfaces of the two groups of side panels are provided with a plurality of groups of supporting pieces of different heights, and at least one group of side panels is provided with a material transfer port corresponding to the position of the supporting piece;

[0039] The material frame lifting assembly is used to lift the cache material frame, and includes: a material frame lifting base, a cache driver and a linear guide module 2. The linear guide module 2 is connected to the cache material frame through the material frame lifting base, and the cache driver is used to drive the linear guide module 2 to move.

[0040] The beneficial effects of the present application are: providing a blue film electroplating equipment with a high degree of automation, high production efficiency and high yield, fixing the sheet by the adsorption effect of the flip suction cup, and there is no rigid extrusion between the sheet, which can avoid damage to the sheet caused by manual operation errors or deformation of the hanger in the prior art, and can improve the yield rate; using the flip suction cup to automatically transfer the sheet between the material transfer mechanism and the electroplating tank, the production efficiency can be improved; through the structural design of the liquid inrush pipe, the air blowing cavity, the material sorting mechanism, the offset material transfer component, etc., the electroplating process is optimized and the product quality is improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1 is a top view of an embodiment of the present invention;

[0042] Figure 2 is a distribution diagram of the third material feeding mechanism, the fifth material feeding mechanism, the electroplating system and the sixth material feeding mechanism in the embodiment of the present invention;

[0043] Figure 3 is a distribution diagram of the pre-plating cleaning system, the fourth material feeding mechanism and the quality inspection system in an embodiment of the present invention;

[0044] Figure 4 is a three-dimensional diagram of a fourth material feeding mechanism in an embodiment of the present invention;

[0045] Figure 5 is a top view of the fourth material feeding mechanism in an embodiment of the present invention;

[0046] Figure 6 is a partial structural diagram of a staggered material transfer component in the fourth material transfer mechanism in an embodiment of the present invention;

[0047] Figure 7 It is a partial structural diagram of the quality inspection material transfer component in an embodiment of the present invention;

[0048] Figure 8 is a distribution diagram of a quality inspection system and a defective film rejection mechanism in an embodiment of the present invention;

[0049] Fig. 9 is a structural diagram of a defective film rejection mechanism in an embodiment of the present invention;

[0050] Fig.10 is a structural diagram of a cache mechanism in an embodiment of the present invention;

[0051] Fig.11 is a distribution diagram of the third material conveying mechanism and the material sorting mechanism in the embodiment of the present invention;

[0052] Fig.12 It is a structural diagram of the first material sorting component in the non-material sorting position and the material sorting position in an embodiment of the present invention;

[0053] Fig.13 is a top view of the guide block and the sliding member in a connected state in an embodiment of the present invention;

[0054] Fig.14 is a structural diagram of a second material sorting component in an embodiment of the present invention;

[0055] Fig.15 is a distribution diagram of the flip suction cup, the suction cup bracket and the suction cup flip motor in an embodiment of the present invention;

[0056] Fig.16 is a connection structure diagram of the flip suction cup and the suction cup flip motor in an embodiment of the present invention;

[0057] Fig.17 The embodiment of the present invention is attached Fig.16 A magnified view of the structure at center A;

[0058] Fig.18 is a structural diagram of a flip suction cup in an embodiment of the present invention;

[0059] Fig.19 is a partial structural diagram of an electroplating system in an embodiment of the present invention;

[0060] Fig. 20 is a three-dimensional structural diagram of an electroplating tank in an embodiment of the present invention;

[0061] Fig.21 2 are longitudinal and transverse cross-sectional views of an electroplating tank according to an embodiment of the present invention;

[0062] Fig. 22 2 is a longitudinal sectional view of a liquid storage tank in an embodiment of the present invention.

[0063] In the figure: 1. Equipment casing; 1.1. Maintenance passage;

[0064] 2. Master control machine;

[0065] 3. The first material feeding mechanism;

[0066] 4. The second material feeding mechanism;

[0067] 5. The third material transfer mechanism; 5.1. The material transfer position; 5.2. The material transfer position; 5.3. The placement groove; 5.4. The installation cavity; 5.5. The installation groove; 5.6. The first leveling bolt;

[0068] 6. The fourth material transfer mechanism; 6.1. The material turning plate; 6.1-1. The material sheet bearing groove; 6.1-2. The weight reduction hole; 6.2. The material turning motor; 6.3. The material turning shaft; 6.4. The material turning bracket; 6.5. The offset material transfer assembly; 6.5-1. The first material transfer device A; 6.5-2. The first material transfer device B; 6.5-3. The second material transfer device; 6.5-4. The dispatching base frame; 6.5-5. The guide rail 1; 6.5-6. The moving part 1; 6.5-7. The dispatching driver; 6.5-8. The dispatching lifting cylinder; 6.5-9. The dispatching suction cup; 6.5-10. The mounting plate; 6.5-11. The in-position sensor;

[0069] 7. The fifth material transmission mechanism;

[0070] 8. Sixth material transfer mechanism;

[0071] 9. Electroplating system; 9.1. Electroplating tank; 9.1-1. Anode screen; 9.1-2. Bottom plate; 9.1-3. External plate; 9.1-4. Internal partition; 9.1-4a. Drainage slope; 9.1-5. Overflow trough; 9.1-6. Connecting block; 9.1-7. Flow stabilizing orifice plate; 9.1-7a. Flow stabilizing orifice; 9.1-8. Leveling gasket; 9.1-9. Annular storage table; 9.1-9a. First storage step; 9.1-9b. Second storage step; 9.1-10, anode power supply unit; 9.2, liquid supply mechanism; 9.2-1, liquid storage tank; 9.2-2, liquid supply pipe; 9.2-3, liquid return pipe; 9.2-4, magnetic suction pump; 9.2-5, overflow pipe; 9.2-6, liquid inflow pipe; 9.2-7, drain pipe; 9.2-8, liquid replenishment pipe; 9.2-9, visual liquid level gauge; 9.2-10, liquid level sensor; 9.2-11, one-way valve; 9.2-12, protection pipe; 9.2-13, safety valve ; 9.2-14, filter; 9.2-15, heater; 9.2-16, temperature sensor; 9.3, flip suction cup; 9.3-1, cathode hole plate; 9.3-1a, adsorption through hole; 9.3-2, shell; 9.3-3, exhaust pipe; 9.3-4, conductive bolt; 9.3-5, cathode power supply part; 9.3-6, sealing pad; 9.3-7, blowing cavity; 9.3-8, air inlet pipe; 9.3-9, connecting claw; 9.3-9a, Connecting arm; 9.3-9b, connecting finger; 9.3-10, mounting arm; 9.3-11, second leveling bolt; 9.3-12, guide wheel hole; 9.4, suction cup bracket; 9.5, suction cup flip motor; 9.6, suction cup flip shaft; 9.7, serial rod; 9.8, suction cup synchronous belt; 9.9, suction cup synchronous wheel; 9.10, bevel gear; 9.11, photoelectric sensor; 9.12, induction plate; 9.12-1, induction slot; 9.13, limit plate;

[0072] 10. Inferior film rejecting mechanism; 10.1. Film rejecting base; 10.1-1. Film rejecting avoidance groove; 10.2. Film rejecting synchronous belt; 10.3. Film rejecting synchronous wheel; 10.4. Film rejecting driving motor; 10.5. Film rejecting lifting cylinder; 10.6. Inferior film material frame; 10.7. First inferior film sensor; 10.8. Second inferior film sensor;

[0073] 11. Cache mechanism; 11.1. Material frame lifting assembly; 11.1-1. Material frame lifting base; 11.1-2. Cache driver; 11.1-3. Guide rail 2; 11.1-4. Moving part 2; 11.2. Cache material frame; 11.2-1. Side plate; 11.2-2. Connecting part; 11.2-3. Supporting part; 11.2-4. Material transfer port;

[0074] 12. Material transfer synchronous wheel; 12.1. First wheel part; 12.2. Second wheel part;

[0075] 13. Material sorting mechanism; 13.1. First material sorting assembly; 13.1-1. First material sorting cylinder; 13.1-2. Guide block; 13.1-2a. Straight notch; 13.1-2b. Support boss; 13.1-3. First material sorting plate; 13.1-4. Sliding member; 13.1-4a. U-shaped member; 13.1-4b. Sliding rod; 13.1-5. Material sorting plate shaft; 13.1-6. First material sorting block; 13.1-7. Dust baffle; 13.2. Second material sorting assembly; 13.2-1. Second material sorting cylinder; 13.2-2. Second material sorting plate; 13.2-3. Second material sorting block;

[0076] 14. LED light source;

[0077] 15. Gas storage tank;

[0078] 16. Sheet;

[0079] 17. Pre-plating cleaning system; 17.1. Cleaning of unloading components;

[0080] 18. Quality inspection system; 18.1. Quality inspection material transfer component; 18.2. Material transfer avoidance slot;

[0081] 19. Post-plating cleaning system. DETAILED DESCRIPTION

[0082] The present application is described in detail below with reference to the accompanying drawings and specific embodiments.

[0083] This embodiment provides a blue film electroplating device, such as Figure 1 As shown, it includes: an equipment housing 1, a master control machine 2 for regulating the operation of the electroplating equipment, a material feeding mechanism for transmitting the material sheet, and an electroplating system 9 for electroplating. The master control machine 2, the material feeding mechanism, and the electroplating system 9 are all located in the equipment housing 1. The material feeding mechanism at least includes a first material feeding mechanism 3 and a second material feeding mechanism 4 arranged in parallel and having opposite transmission directions. The electroplating system 9 is arranged at the intersection of the first material feeding mechanism 3 and the second material feeding mechanism 4. One of the first material feeding mechanism 3 and the second material feeding mechanism 4 is used to load the electroplating system 9, and the other is used to unload the electroplating system 9; refer to the attached Figure 2 , Attachment Fig.18 and attached Fig. 20 The electroplating system 9 at least includes an electroplating tank 9.1, a liquid supply mechanism 9.2 and a flip suction cup 9.3. The liquid supply mechanism 9.2 is used to supply electroplating liquid to the electroplating tank 9.1. The flip suction cup 9.3 can absorb the material 16 and flip it inside and outside the electroplating tank 9.1. An anode mesh plate 9.1-1 is provided in the electroplating tank 9.1. The contact surface of the flip suction cup 9.3 and the material 16 is a cathode orifice plate 9.3-1. The anode mesh plate 9.1-1 and the cathode orifice plate 9.3-1 are connected through an external circuit.

[0084] The basic structure of the material transfer mechanism used in this application is a synchronous belt-synchronous wheel mechanism, which is a mature existing mechanism. For the part of the material transfer mechanism without special functions or structures, this application will not be repeated later. For the part of the material transfer mechanism with special functions or structures, this application will be described in detail later. In order to facilitate the concise and clear description of the technical solution, this application defines the first material transfer mechanism 3 mentioned above as being used for loading the electroplating system 9, and the second material transfer mechanism 4 as being used for unloading the electroplating system 9, but this is not intended to limit the scope of protection of this application.

[0085] During the electroplating operation, it is necessary to ensure that the clean, intact surface to be plated of the sheet 16 does not contact any structure before contacting the electroplating solution. The synchronous belt-synchronous wheel mechanism is a bottom support mode and should be in direct contact with the non-plated surface of the sheet 16. Therefore, at the input end of the electroplating system 9, the sheet 16 should be placed on the material transfer mechanism with the surface to be plated facing upward; and, when receiving the material, the flip suction cup 9.3 should also be in direct contact with the non-plated surface of the sheet 16. Therefore, in the electroplating system 9, when the flip suction cup 9.3 is in the initial position, it should be set with the adsorption surface (i.e. the surface on the cathode orifice plate 9.3-1 that directly contacts the sheet 16) facing upward. When using the present electroplating equipment for production, the flip suction cup 9.3 is arranged at the initial station with the adsorption surface facing upward, the top is connected to the material and the non-plated surface of the sheet 16 is stably adsorbed, and then the sheet 16 is flipped into the electroplating tank 9.1, so that the surface to be plated of the sheet 16 contacts the electroplating solution; the anode screen plate 9.1-1 and the cathode orifice plate 9.3-1 are energized to charge the sheet 16 for electroplating; after the electroplating is completed, the flip suction cup 9.3 is flipped back to the initial station, the adsorption is released and the plated sheet 16 is transferred out; finally, the flip suction cup 9.3 located at the initial station and unloaded is ready for the next cycle of electroplating operation.

[0086] The electroplating equipment fixes the material 16 through the adsorption effect of the flip suction cup 9.3, and there is no rigid extrusion between the material 16, which can avoid damage to the material 16 caused by manual operation errors or deformation of the hanger in the prior art, and can improve the yield rate; the flip suction cup 9.3 is used to automatically transfer the material 16 between the material transfer mechanism and the electroplating tank 9.1, which can improve production efficiency.

[0087] As mentioned above, in this application, the first material feeding mechanism 3, the electroplating system 9 and the second material feeding mechanism 4 are configured into a U-shaped layout. When it is necessary to add other process systems before and after the electroplating system 9 (for example, to add a cleaning system, a quality inspection system 18 before the electroplating system 9 or to increase the number of parallel electroplating systems 9), the electroplating system 9 can be separated from the first material feeding mechanism 3 and the second material feeding mechanism 4, and the electroplating system 9 can be translated along the extension direction of the first material feeding mechanism 3. Other process systems are arranged on both sides of the electroplating system 9, and finally the process systems are connected in series. Compared with the straight-line layout, when adding or reducing other process systems, the U-shaped layout can avoid the work of moving the material feeding mechanisms at both ends of the electroplating system 9. It only needs to split and translate the electroplating system 9, which can reduce the difficulty and intensity of work and improve efficiency.

[0088] In order to improve the production capacity, a plurality of electroplating tanks 9.1 can be arranged in rows and columns in the electroplating system 9. Then, the electroplating system 9 has a larger layout size in the connection direction of the first material feeding mechanism 3 and the second material feeding mechanism 4. In order to smoothly transfer the material sheet 16 between the first material feeding mechanism 3, the electroplating system 9 and the second material feeding mechanism 4, the present embodiment constructs a third material feeding mechanism 5 in the electroplating system 9. The third material feeding mechanism 5 extends along the connection direction of the first material feeding mechanism 3 and the second material feeding mechanism 4, and its two ends are respectively connected to the output end of the first material feeding mechanism 3 and the input end of the second material feeding mechanism 4. A plurality of electroplating tanks 9.1 are arranged along the extension direction of the third material feeding mechanism 5, and correspondingly, a plurality of flip suction cups 9.3 are also arranged along the extension direction of the third material feeding mechanism 5. In a complete electroplating operation, the first feeding mechanism 3 loads the material; the third feeding mechanism 5 receives the material from the first feeding mechanism 3 and transfers it to the flip suction cup 9.3; the flip suction cup 9.3 receives, absorbs and flips the sheet 16 from the third feeding mechanism 5, and after electroplating in the electroplating tank 9.1, the plated sheet 16 is transferred to the third feeding mechanism 5; the second feeding mechanism 4 receives the material from the third feeding mechanism 5 and transfers it to the outside of the electroplating equipment to realize material unloading.

[0089] The material pieces 16 involved in this application are all blue film pieces to be electroplated, which can be single-sided electroplated or double-sided electroplated. When double-sided electroplating is required, the material piece 16 is loaded and electroplated in this electroplating equipment twice, first and then. Before electroplating, it is usually necessary to clean and inspect the surface to be plated of the material piece 16 to ensure that the surface to be plated of the material piece 16 is clean and intact, and to ensure product quality. The electroplating equipment provided in this application can only include a feeding mechanism and an electroplating system 9 as mentioned above, and the user can add a pre-plating cleaning system 17 and a quality inspection system 18 to the total input end of the feeding mechanism. The electroplating equipment provided in this application can also directly construct a pre-plating cleaning system 17 and a quality inspection system 18 in sequence at the output end of the first feeding mechanism 3 to form a complete set of finished equipment that does not require modification or additional structure for direct use by users.

[0090] When the pre-plating cleaning system 17 and the quality inspection system 18 are sequentially configured at the output end of the first material conveying mechanism 3, the pre-plating cleaning system 17 can adopt the existing technology in this field - a chain cleaning machine. The chain cleaning machine is usually configured with a conveying roller and a cleaning liquid with a liquid level slightly lower than the top of the conveying roller. When the conveying roller rotates, it can drive the material sheet 16 carried thereon to move, and due to the rotation of the conveying roller, the cleaning liquid produces fluctuations, and the waves contact the lower surface of the material sheet 16, and diffuse on the lower surface of the material sheet 16 with the help of surface tension, and the lower surface of the material sheet 16 is cleaned. Therefore, in the cleaning system, the surface of the material sheet 16 to be plated faces downward. The quality inspection system 18 can also adopt the existing technology in this field - using a CCD camera to obtain image information of the surface to be plated of the material sheet 16, and sending the image information to the electronic detection system for quality inspection, refer to the attached Figure 1 and attached Figure 3 The quality inspection system 18 is usually equipped with a gantry for installing a CCD camera and a quality inspection material transfer component 18.1 for transferring materials. The quality inspection material transfer component 18.1 supports and transfers the material 16 to the bottom of the gantry for quality inspection, that is, the CCD camera can photograph the upper surface of the material 16. In the pre-plating cleaning system 17, the surface of the material 16 to be plated faces downward. If the CCD camera is to be used to photograph the surface of the material 16 to be plated in the quality inspection system 18, a fourth material transfer mechanism 6 for turning the material must be constructed between the output end of the pre-plating cleaning system 17 and the input end of the quality inspection system 18 to adjust the surface of the material 16 to be plated from downward to upward.

[0091] Reference Figure 4 -Attached Figure 6The fourth material transmission mechanism 6 is provided with a turning plate 6.1, a turning motor 6.2, a turning shaft 6.3 and a turning bracket 6.4. The turning bracket 6.4 is arranged at both ends of the turning shaft 6.3 and is rotatably connected to the turning shaft 6.3; the turning motor 6.2 is arranged on one of the turning brackets 6.4, and the output shaft of the turning motor 6.2 is coaxially fixedly connected to the turning shaft 6.3; the turning plate 6.1 is coaxially sleeved on the turning shaft 6.3, and is distributed along the axial direction of the turning shaft 6.3 with a plurality of turning plates; the turning plate 6.1 is provided with a material sheet receiving groove 6.1-1 which is recessed from its outer edge to the axis center, and a plurality of material sheet receiving grooves 6.1-1 are arranged along the circumference of the turning plate 6.1. In the prior art, the cleaning loading assembly and the cleaning unloading assembly 17.1 in the pre-plating cleaning system 17, and the quality inspection material transfer assembly 18.1 in the quality inspection system 18 are all synchronous belt-synchronous wheel mechanisms. When the fourth material transfer mechanism 6 is arranged, the material turning shaft 6.3 can be placed horizontally, and the extension direction is perpendicular to the material transfer direction of the cleaning unloading assembly 17.1. At this time, the axis of the material turning plate 6.1 is horizontal and the plate surface is vertical, so that a sheet receiving groove 6.1 on the material turning plate 6.1 -1 is horizontal and its opening faces the cleaning and unloading component 17.1 to receive the sheet 16 transmitted from the cleaning and unloading component 17.1. When the sheet 16 is inserted into the sheet receiving groove 6.1-1, the turning motor 6.2 is started, and the turning shaft 6.3 and the turning plate 6.1 are synchronously rotated 180° to turn the sheet 16 over so that the surface to be plated faces upward instead of downward. Finally, the sheet 16 falls on the quality inspection material transfer component 18.1 and is taken away to meet the subsequent quality inspection requirements.

[0092] In the cleaning and unloading component 17.1 and the quality inspection and conveying component 18.1, the base of the synchronous belt-synchronous wheel mechanism may be a wide base whose width dimension is slightly smaller than the side length of the material sheet 16, or may be two slender bases arranged in parallel and spaced apart. Therefore, the number and placement position of the turning plate 6.1 on the turning shaft 6.3 can be configured according to the above actual situation. That is, a turning plate 6.1 can be arranged on both sides of each wide base, or one can be inserted in the two slender bases to smoothly receive the material sheet 16. In the former, the number of the turning plate 6.1 is twice the number of the positions in the cleaning and unloading component 17.1, and in the latter, the number of the turning plate 6.1 is equal to the number of the positions in the cleaning and unloading component 17.1, and the thickness of the turning plate 6.1 can be appropriately increased according to the needs to increase the contact area between the material sheet bearing groove 6.1-1 and the material sheet 16 and improve the stability.

[0093] In order to optimize the layout design and control the extension length of the electroplating equipment in a certain dimension to adapt to the reasonable structure of the factory building in actual production (generally, the factory building is a rectangle with moderate length and width, rather than a flat straight line with unlimited length extension), in this application: the material feeding direction of the pre-plating cleaning system 17 is configured in the same direction as the material feeding direction of the first material feeding mechanism 3; the quality inspection material feeding component 18.1 is configured as two sets of vertically crossed synchronous belt-synchronous wheel mechanisms, the top surfaces of the two sets of synchronous belt-synchronous wheel mechanisms are aligned, and one set of synchronous belt-synchronous wheel mechanisms is provided with a material transfer avoidance groove 18.2 that is recessed from the top downward (refer to the attached Figure 7 ), the material transfer avoidance groove 18.2 is used to avoid another set of synchronous belt-synchronous wheel mechanisms, and the synchronous wheels in the synchronous belt-synchronous wheel mechanism with the material transfer avoidance groove 18.2 are arranged along the contour of the material transfer avoidance groove 18.2 to achieve the normal operation of the two sets of synchronous belt-synchronous wheel mechanisms; the material transfer direction of the synchronous belt-synchronous wheel mechanism that runs through the gantry in the quality inspection material transfer component 18.1 is configured to be in the same direction as the material transfer direction of the third material transfer mechanism 5, and the material transfer direction of the synchronous belt-synchronous wheel mechanism that is connected to the fourth material transfer mechanism 6 in the quality inspection material transfer component 18.1 is configured to be in the same direction as the material transfer direction of the third material transfer mechanism 5. The material feeding direction is arranged in the same direction as the material feeding direction of the cleaning unloading component 17.1, and a fifth material feeding mechanism 7 is arranged between the total output end of the quality inspection material feeding component 18.1 and the input end of the third material feeding mechanism 5. The material feeding direction of the fifth material feeding mechanism 7 is the same as that of the first material feeding mechanism 3. At this time, a blank area is formed just between the output end of the pre-plating cleaning system 17, the total output end of the quality inspection system 18 and the input end of the fifth material feeding mechanism 7 for placing the master control machine 2, so that the structure of the electroplating equipment is compact, the adaptability to the actual space of the factory building is high, and the space utilization rate is high.

[0094] Reference Figure 1 , Attachment Figure 3 -Attached Figure 6In order to improve space utilization and meet maintenance needs, some embodiments of the present application do not arrange the loading positions of the cleaning and unloading component 17.1, the fourth material feeding mechanism 6 and the quality inspection material feeding component 18.1 as equal and one-to-one corresponding layouts, but adopt the following layout: the side ends of the first material feeding mechanism 3, the pre-plating cleaning system 17 and the fifth material feeding mechanism 7 facing away from the second material feeding mechanism 4 are aligned; a maintenance channel 1.1 is reserved between the electroplating system 9 and the quality inspection system 18 of the above-mentioned layout, and the maintenance channel 1.1 is L-shaped, one end of which is between the second material feeding mechanism 4 and the fifth material feeding mechanism 7, extending along the feeding direction of the third material feeding mechanism 5, and the other end is between the second material feeding mechanism 4 and the quality inspection system 18, extending along the second material feeding mechanism 4. The material transfer direction of the material mechanism 4 extends to the equipment casing 1 of the electroplating equipment, and an entrance door of the maintenance passage 1.1 is arranged at this position of the equipment casing 1; the number of loading positions of the cleaning and unloading component 17.1, the number of loading positions of the quality inspection and material transfer component 18.1, and the number of flipping trays 6.1 on the flipping shaft 6.3 are configured to be equal, the loading position of the cleaning and unloading component 17.1 and the loading position of the quality inspection and material transfer component 18.1 are staggered, the loading position of the flipping tray 6.1 and the loading position of the quality inspection and material transfer component 18.1 are configured one by one, and a staggered material transfer component 6.5 is configured between the flipping tray 6.1 and the loading position of the cleaning and unloading component 17.1, and the staggered material transfer component 6.5 and the flipping tray 6.1 are used to transfer the material sheets 16 in groups to the correct loading position.

[0095] The offset material transfer assembly 6.5 includes a plurality of groups of first material transfer devices, a plurality of groups of second material transfer devices 6.5-3, a dispatching base frame 6.5-4, a linear guide module 1, a dispatching driver 6.5-7, a dispatching lifting cylinder 6.5-8 and a dispatching suction cup 6.5-9. The first material transfer devices and the second material transfer devices 6.5-3 are arranged in parallel, and the material transfer directions are perpendicular to the material turning shaft 6.3, that is, parallel to the material transfer direction of the cleaning and unloading assembly 17.1. The second material transfer devices 6.5-3 and part of the first material transfer assemblies adjacent thereto have the same number of loading positions and completely corresponding positions as the cleaning and unloading assembly 17.1, and are used to directly receive the material sheets 16 transmitted by the cleaning and unloading assembly 17.1. All the first material transfer assemblies have the same number of groups and completely corresponding positions as the material turning plate 6.1, and are used to directly contact the material sheet bearing The groove 6.1-1 intersects the material piece 16; the two ends of the scheduling base frame 6.5-4 are respectively straddled on the outermost first material feeder and the outermost second material feeder 6.5-3; the linear guide module 1 includes a guide rail 6.5-5 and a moving part 6.5-6; the guide rail 6.5-5 is arranged on the scheduling base frame 6.5-4 and extends in the same direction as the scheduling base frame 6.5-4; the moving part 6.5-6 is slidably arranged on the guide rail 6.5-5 and can be driven by the scheduling driver 6.5-7 to move along the guide rail 6.5-5; the scheduling suction cup 6.5-9 is connected to the moving part 6.5-6 through the scheduling lifting cylinder 6.5-8 and can move with the moving part 6.5-6, so as to schedule the material piece 16 on the second material feeder 6.5-3 to the first material feeder.

[0096] Specifically, let the number of loading positions of the cleaning and unloading component 17.1 be x, let the number of loading positions corresponding to the cleaning and unloading component 17.1 and the quality inspection and feeding component 18.1 be y, y<x, let the number of offset loading positions between the cleaning and unloading component 17.1 and the quality inspection and feeding component 18.1 be xy, then the number of groups of the first feeder + the number of groups of the second feeder = 2x-y. Let the first feeder directly corresponding to the loading position of the cleaning and unloading component 17.1 be the first feeder A6.5-1, let the remaining first feeders be the first feeder B6.5-2, when the loading position of the cleaning and unloading component 17.1 receives material, the first feeder A6.5-1 and the second feeder 6.5-3 directly receive the material 16, the scheduling lifting cylinder 6.5-8 and the scheduling driver 6.5-7 are activated, and the material 16 on the second feeder 6.5-3 is transferred to the first feeder B6.5-2, and then the first feeder The material feeder A6.5-1 and the first material transfer device B6.5-2 respectively transfer the material sheet 16 to the turning plate 6.1, so that each turning plate 6.1 located on the same turning shaft 6.3 receives the material, and the turning motor 6.2 is started, so that each turning plate 6.1 turns over the material sheet 16 in groups and transfers it to the quality inspection and material transfer component 18.1. When the material sheet 16 is taken away for quality inspection, the turning plate 6.1 continues to rotate, so that the unloaded material receiving groove 6.1-1 returns to the cleaning system side, and the next cycle of turning and transferring is carried out.

[0097] The process of transferring the material 16 on the second material feeder 6.5-3 to the first material feeder B6.5-2 includes: ① the scheduling suction cup 6.5-9 is located above the second material feeder 6.5-3, the scheduling lifting cylinder 6.5-8 is actuated to lower the scheduling suction cup 6.5-9 so that the scheduling suction cup 6.5-9 contacts and absorbs the material 16 on the second material feeder 6.5-3; ② the scheduling lifting cylinder 6.5-8 is reversed to lift the scheduling suction cup 6.5-9 and the material 16; ③ the scheduling driver 6.5-7 is actuated , so that the moving part 1 6.5-6, the dispatching lifting cylinder 6.5-8 and the dispatching suction cup 6.5-9 move along the guide rail 1 6.5-5 to the top of the first material feeder B6.5-2, ④ the dispatching lifting cylinder 6.5-8 moves, lowers the dispatching suction cup 6.5-9, so that the dispatching suction cup 6.5-9 desorbs and releases the material sheet 16, ⑤ the dispatching driver 6.5-7 moves in the reverse direction, so that the moving part 1 6.5-6, the dispatching lifting cylinder 6.5-8 and the dispatching suction cup 6.5-9 return to the top of the second material feeder 6.5-3. Among them, the dispatching lifting cylinder 6.5-8 can prevent the dispatching suction cup 6.5-9 from being too low and causing accidents such as collision.

[0098] The scheduling suction cup 6.5-9 can adopt the vacuum suction cup commonly used in the field, and the material can be taken when the vacuum is drawn, and the material can be discharged when the vacuum is broken; the scheduling driver 6.5-7 can adopt a linearly retractable device, such as a cylinder, a hydraulic rod, an electric telescopic rod, etc., and its telescopic direction is consistent with the extension direction of the scheduling base frame 6.5-4. A servo motor can also be used in combination with synchronous wheels, synchronous belts and other structures. For example, synchronous wheels and synchronous belts are arranged along the extension direction of the scheduling base frame 6.5-4, and the moving part 6.5-6 is connected to the synchronous belt. When the servo motor drives the synchronous wheel to rotate, the moving part 6.5-6 and the scheduling suction cup 6.5-9 move together with the synchronous belt.

[0099] The number of the scheduling suction cups 6.5-9 is determined according to the number of offset load positions. In order to improve the synchronization of the movements, save consumables and equipment operating costs, a mounting plate 6.5-10 can be set on the moving part 6.5-6, and scheduling suction cups 6.5-9 equal to the number of offset load positions are arranged in parallel on the mounting plate 6.5-10. Each scheduling suction cup 6.5-9 is connected to the mounting plate 6.5-10 through a mutually independent scheduling lifting cylinder 6.5-8.

[0100] The above-mentioned technical scheme can solve the problem of low material turning and transferring efficiency caused by the non-one-to-one correspondence between the loading positions of the cleaning unloading component 17.1 and the quality inspection material transfer component 18.1 due to equipment layout problems. By adjusting the material transfer speed and material transfer path length of the first material feeder and the second material feeder 6.5-3 and the rotation speed of the material turning plate 6.1, the material transfer time difference between the structures can be balanced, so that the material sheet 16 can be transferred in an orderly and efficient manner. For example, the material transfer speed can be controlled: the first material transfer device A6.5-1 is less than the first material transfer device B6.5-2, which can compensate for the time spent by the scheduling suction cup 6.5-9 to transfer the material sheet 16 from the second material transfer device 6.5-3 to the first material transfer device B6.5-2, so that the first material transfer device A6.5-1 and the first material transfer device B6.5-2 can transfer the same group of material sheets 16 to the turning plate 6.1 at the same time; the material transfer speed can be controlled: the second material transfer device 6.5-3 is less than the first material transfer device A6.5-1, which can compensate for the time spent by the scheduling suction cup 6.5-9 to return from the first material transfer device B6.5-2 to the second material transfer device 6.5-3, so that the scheduling component has enough time to return to the second material transfer device 6.5-3 to adsorb and move the newly transferred material sheet 16.

[0101] In addition, an in-place sensor 6.5-11 can be provided at the output end of the first material feeder. The in-place sensor 6.5-11 can detect whether the output end of each first material feeder is loaded with material sheets 16 to control the start and stop of the material turning motor 6.2. When the material sheets 16 on the second material feeder 6.5-3 are transferred to the first material feeder B6.5-2 and are synchronously transferred to the material turning plate 6.1 with the material sheets 16 on the first material feeder A6.5-1, all the material sheets 16 in the same group are in place and sensed by the in-place sensor 6.5-11. Then, the material turning motor 6.2 is started to control the material turning plate 6.1 to flip a group of material sheets 16, thereby further ensuring the consistency of rhythm and ensuring that the processes in the electroplating equipment are carried out efficiently and orderly.

[0102] As mentioned above, the first material feeder and the second material feeder 6.5-3 can both adopt a synchronous belt-synchronous wheel mechanism, wherein the base can be a wide base with a width slightly smaller than the side length of the material piece 16, or it can be two slender bases arranged in parallel and with a distance between them. The number and placement position of the turning plate 6.1 on the turning shaft 6.3 can be configured according to the actual situation mentioned above. Similar technical solutions have been described in detail above and will not be repeated here.

[0103] In order to improve the efficiency of material turning and transferring, in the present application, a plurality of sheet receiving grooves 6.1-1 are evenly distributed along the circumference of the turning plate 6.1. When a group of sheet receiving grooves 6.1-1 on the turning plate 6.1 is unloading, the sheet receiving grooves 6.1-1 opposite to it can be used to receive materials; when the thickness of the turning plate 6.1 is large, a plurality of weight reduction holes 6.1-2 can be provided on the turning plate 6.1, and the weight reduction holes 6.1-2 are evenly distributed between adjacent sheet receiving grooves 6.1-1 to reduce the driving load.

[0104] As mentioned above, the quality inspection system 18 is a prior art, and the prior art quality inspection system 18 will issue an alarm or suspend the material transfer action after inspecting the material, indicating that the current material sheet 16 is a defective sheet. The defective sheets are sorted by manual sorting, and the efficiency of this sorting is too low. Therefore, the present application configures a defective sheet rejection mechanism 10 for automatically sorting defective sheets at the total output end of the quality inspection material transfer component 18.1. Figure 8 -Attached Fig. 9The bad film rejecting mechanism 10 is at least provided with a film picking base 10.1, a film picking synchronous belt 10.2, a film picking synchronous wheel 10.3, a film picking driving motor 10.4, a film picking lifting cylinder 10.5 and a bad film material frame 10.6. The extending direction of the film picking base 10.1 is perpendicular to the material transmission direction of the total output end of the quality inspection material transmission component 18.1. The film picking synchronous belt 10.2 and the film picking synchronous wheel 10.3 are arranged on the film picking base 10.1 along the extending direction of the film picking base 10.1, and are connected to the film picking driving motor 10.4 by transmission. The film picking base 10.1 is provided with a film picking avoidance groove 10.1-1 which is concave downward from the top surface. The film picking avoidance groove 10.1-1 is used to avoid the synchronous belt and synchronous wheel in the quality inspection material transmission component 18.1. The picking piece 18.1 is near the picking piece synchronizing wheel 10.3 and the picking piece synchronizing belt 10.2 are arranged along the contour of the picking piece avoidance groove 10.1-1 so as not to affect the normal operation of the quality inspection material transmission component 18.1; the picking piece lifting cylinder 10.5 is located at the bottom of the picking piece base 10.1, the minimum value of the total height of the picking piece lifting cylinder 10.5 and the picking piece base 10.1 is not greater than the height of the quality inspection material transmission component 18.1, and the maximum value of the total height of the picking piece lifting cylinder 10.5 and the picking piece base 10.1 is not less than the height of the quality inspection material transmission component 18.1; the inferior piece material frame 10.6 is located at the output end of the picking piece synchronizing belt 10.2, and has at least one material receiving opening, which can be located at the top of the inferior piece material frame 10.6 and / or towards the side of the picking piece synchronizing belt 10.2.

[0105] When the defective sheets fall on the overlapping part of the sheet picking synchronous belt 10.2 and the quality inspection material transfer assembly 18.1, the sheet picking lifting cylinder 10.5 lifts the sheet picking base 10.1, and at the same time, the sheet picking driving motor 10.4 is activated, and the sheet picking synchronous belt 10.2 and the sheet picking synchronous wheel 10.3 transfer the defective sheets to the defective sheet material frame 10.6.

[0106] In order to improve the efficiency of chip picking, a first inferior chip sensor 10.7 and a second inferior chip sensor 10.8 can be respectively arranged at the chip picking base 10.1 and the inferior chip material frame 10.6. When the first inferior chip sensor 10.7 senses that there are inferior chips on the chip picking base 10.1, it outputs a signal and controls the chip picking lifting cylinder 10.5 and the chip picking driving motor 10.4 to move. When the second inferior chip sensor 10.8 senses that the inferior chip falls into the inferior chip material frame 10.6, it outputs a signal and controls the chip picking lifting cylinder 10.5 to move in the reverse direction and the chip picking driving motor 10.4 to stop moving. The sensors used to detect the position of silicon chips, such as the in-place sensors 6.5-11, the first inferior chip sensor 10.7 and the second inferior chip sensor 10.8 involved in this application, can all be selected from existing devices such as infrared sensors and photoelectric sensors 9.11.

[0107] The present application controls the size, speed, etc. of the quality inspection material transfer component 18.1 and the defective film rejection mechanism 10, for example, controls the maximum value of the total height of the film rejection lifting cylinder 10.5 and the film rejection base 10.1 to be greater than the height of the quality inspection material transfer component 18.1, and controls the movement speed of the defective film rejection mechanism 10 to be greater than the material transfer speed of the quality inspection material transfer component 18.1, so that the interval of the material sheets 16 on the quality inspection material transfer component 18.1 satisfies the following requirements: after the film is rejected, when the film rejection base 10.1 drops to a low position, the next material sheet 16 of the defective film is just or has not been transmitted to the top of the film rejection base 10.1, thereby avoiding the problem that the quality inspection material transfer component 18.1 is forced to stop and wait during the process of the defective film rejection mechanism 10 rejecting the defective film, or the material sheet 16 transmitted during its normal operation collides with the raised film rejection base 10.1, so that the material transfer and film rejection are carried out in an orderly, smooth and efficient manner.

[0108] In actual production, in order to ensure the continuous production of the electroplating system 9, the production capacity of other process systems at its front end will be adjusted to be higher than the production capacity of the electroplating system 9. This is because if the production capacity of the quality inspection system 18 is adjusted to be the same as that of the electroplating system 9, after the inferior film removal mechanism removes the inferior films, the quality inspection material transfer component 18.1 and the fifth material transfer mechanism 7 will produce corresponding inferior film vacancies at the inferior film position, which will inevitably lead to material shortage in the electroplating system 9; and when the production capacity of other process systems at the front end of the electroplating system 9 is higher, it is necessary to set a buffer mechanism 11 at the input end of the electroplating system 9 (refer to the attached Figure 1 or attached Figure 2 or attached Figure 3 or attached Figure 8 ), using the buffer mechanism 11 to orderly receive, buffer, and discharge the sheet 16 to balance the production capacity difference of the electroplating system 9 and other front-end process systems to prevent collision of materials.

[0109] The specific structure of the cache mechanism 11 can be configured according to actual needs. The cache mechanism 11 in this application is configured as a liftable cache material frame 11.2. Fig.10, which specifically includes: a material frame lifting component 11.1 and a cache material frame 11.2, the material frame lifting component 11.1 is used to lift or lower the height of the cache material frame 11.2, the cache material frame 11.2 has two side panels 11.2-1 arranged opposite to each other, the top and bottom ends of the two side panels 11.2-1 are respectively provided with connecting members 11.2-2, the connecting members 11.2-2 can be plates, rods or other forms, the two groups of side panels 11.2-1 and the connecting members 11.2-2 at the top and bottom ends thereof form a square structure, the gap between the two groups of side panels 11.2-1 is used to penetrate the fifth material feeding mechanism 7 or the quality inspection material feeding component 18.1, in addition, the adjacent surfaces of the two groups of side panels 11.2-1 of the cache material frame 11.2 are also respectively provided with a plurality of groups of supporting members 11.2-3, the free ends of the supporting members 11.2-3 extend in the horizontal direction to the outside of the fifth material feeding mechanism 7 or the quality inspection material feeding component 18.1, and are used to support the material The supporting members 11.2-3 on each set of side plates 11.2-1 are evenly distributed in the vertical direction. When the sheet 16 is transferred to between the two sets of side plates 11.2-1 of the buffer material frame 11.2, the bottom surface of the sheet 16 is supported by the fifth material transfer mechanism 7 (or the quality inspection material transfer component 18.1) and the supporting members 11.2-3 at the same time. The height of the buffer material frame 11.2 is raised by the material frame lifting component 11.1, so that the loaded supporting members 11.2 -3 is flush with the fifth material transfer mechanism 7 (or the quality inspection material transfer component 18.1), waiting to receive the next material sheet 16; when it is necessary to discharge the material, the material frame lifting component 11.1 is used to lower the height of the buffer material frame 11.2, so that the loaded supporting member 11.2-3 is flush with the fifth material transfer mechanism 7 (or the quality inspection material transfer component 18.1), and the fifth material transfer mechanism 7 (or the quality inspection material transfer component 18.1) transports the material sheet 16 away.

[0110] The material frame lifting component 11.1 in the cache mechanism 11 can be configured according to actual use requirements, for example, it can be a jacking type or a hanging type. A material frame lifting base 11.1-1 is arranged on the outer side of the cache material frame 11.2, and a cache driver 11.1-2 and a linear guide module 2 are arranged on the material frame lifting base 11.1-1. The linear guide module 2 includes a guide rail 11.1-3 and a moving part 11.1-4. The guide rail 11.1-3 is vertically arranged, and the moving part 11.1-4 is slidably arranged on the guide rail 11.1-3 and connected to the connecting parts 11.2-2 or the side plates 11.2-1 at the top and bottom of the cache material frame 11.2. The cache driver 11.1-2 is used to drive the moving part 11.1-4 to slide, so that the cache material frame 11.2 moves on the guide rail 11.1-3 with the moving part 11.1-4, and changes its height. Similarly, the cache driver 11.1-2 can use a linearly retractable device, such as a cylinder, a hydraulic rod, an electric telescopic rod, etc., and its retractable direction is consistent with the extension direction of the scheduling base frame 6.5-4. It can also use a servo motor in combination with synchronous wheels, synchronous belts and other structures. For example, synchronous wheels and synchronous belts are arranged along the extension direction of the guide rail 11.1-3, and the moving part 11.1-4 is connected to the synchronous belt. When the servo motor drives the synchronous wheel to rotate, the moving part 11.1-4 and the cache material frame 11.2 move together with the synchronous belt.

[0111] By temporarily caching the material 16 through the cache mechanism 11, the production capacity difference between the upstream and downstream processes can be balanced, so that both upstream and downstream processes can run in an orderly and efficient manner; and, the cache mechanism 11 occupies the space in the height direction of the factory building when caching, which is conducive to optimizing the layout design and improving space utilization.

[0112] The above-mentioned buffer material frame 11.2 can be constructed on a certain section of a material conveying mechanism that conveys materials in a straight line direction, and the two ends of the channel between the two sets of side panels 11.2-1 are used as the inlet and outlet ports respectively; it can also be constructed at the right angle corner where two sections of mutually perpendicular material conveying mechanisms intersect, but it is necessary to set a plurality of groups of material conveying ports 11.2-4 with different heights on a set of side panels 11.2-1 of the buffer material frame 11.2, and the number of the material conveying ports 11.2-4 on the side panels 11.2-1 is equal to that of the supporting member 11.2-3, and the positions are corresponding, and a material conveying port 11.2-4 is set between the two sets of side panels 11.2-1. A synchronous belt-synchronous wheel mechanism of the same form as the quality inspection material transfer component 18.1, that is: two sets of synchronous belt-synchronous wheel mechanisms that cross vertically, the top surfaces of the two sets of synchronous belt-synchronous wheel mechanisms are aligned, one set of synchronous belt-synchronous wheel mechanisms is provided with a material transfer avoidance groove 18.2 that is recessed from the top downward, the material transfer avoidance groove 18.2 is used to avoid the other set of synchronous belt-synchronous wheel mechanisms, and the synchronous wheels in the synchronous belt-synchronous wheel mechanism with the material transfer avoidance groove 18.2 are arranged along the contour of the material transfer avoidance groove 18.2 to achieve normal operation of the two sets of synchronous belt-synchronous wheel mechanisms.

[0113] A group of synchronous belt-synchronous wheel mechanisms without material transfer avoidance groove 18.2 has a material transfer direction parallel to the side plate 11.2-1 surface of the buffer material frame 11.2; a group of synchronous belt-synchronous wheel mechanisms with material transfer avoidance groove 18.2 has a material transfer direction perpendicular to the side plate 11.2-1 surface of the buffer material frame 11.2 with a material transfer port 11.2-4; the outer side of the side plate 11.2-1 with the material transfer port 11.2-4 is provided with another group of synchronous belt-synchronous wheel mechanisms, and the material transfer direction is the same as that of the group of synchronous belt-synchronous wheel mechanisms with the material transfer avoidance groove 18.2. In this way, one end of the channel between the two groups of side plates 11.2-1 and one of the material transfer ports 11.2-4 can be used as a feed port, and the other can be used as a discharge port, so as to realize the caching and material transfer functions at the position where the material transfer direction turns. This technical solution is beneficial to improving the space utilization rate in the equipment casing 1 and improving the structural integration of the equipment. After the position of the larger process system in the electroplating equipment is designed, a buffer frame 11.2 of a suitable type (referring to whether there is a discharge port on the side panel 11.2-1) can be placed in the empty space.

[0114] After the material sheet 16 is transferred to the third material feeding mechanism 5 in the electroplating system 9 via the buffer mechanism 11 and the fifth material feeding mechanism 7, the flip suction cup 9.3 receives, adsorbs, and flips the material sheet 16 for electroplating. As mentioned above, when the flip suction cup 9.3 is in the initial position, its adsorption surface should face upward to directly contact the surface to be plated of the material sheet 16. The third material feeding mechanism 5 is also a synchronous belt-synchronous wheel mechanism to support the bottom surface of the material sheet 16. Therefore, in order to smoothly transfer the material sheet 16 between the flip suction cup 9.3 and the third material feeding mechanism 5, the top surface of the flip suction cup 9.3 at the initial position should be smoothly connected to the top surface of the third material feeding mechanism 5 to avoid collision of the material sheet 16 during the transfer between the two. Therefore, the present application alternately constructs a handover position 5.1 and a transfer position 5.2 in the third material feeding mechanism 5 (refer to the attached Fig.11 ), the synchronous wheel can be arranged along the contours of the transfer material position 5.1 and the transfer material position 5.2 and connected through a synchronous belt transmission. The elevation of the transfer material position 5.1 is lower than the elevation of the transfer material position 5.2, forming a concave placement groove 5.3. The transfer material position 5.1 is the initial position of the flip suction cup 9.3. The height of the placement groove 5.3 can be configured according to actual needs to ensure that when the flip suction cup 9.3 is located in the placement groove 5.3, its top surface is flush with the top surface of the transfer material position 5.2.

[0115] To achieve smooth material transfer between the flip suction cup 9.3 and the third material transfer mechanism 5, it can be achieved by controlling the size of the flip suction cup 9.3 and the spacing between the synchronous wheels on the material transfer positions 5.2 on both sides thereof. For example, the outline size of the flip suction cup 9.3 is configured to be smaller than the area of ​​the material sheet 16, and the synchronous wheels on the material transfer positions 5.2 on both sides of the flip suction cup 9.3 are close to the flip suction cup 9.3 to contact the part of the material sheet 16 that exceeds the flip suction cup 9.3, thereby achieving rolling transfer of the material sheet 16. However, in the present application, the cathode orifice plate 9.3-1 used for electroplating is located on the flip suction cup 9.3. When the cathode orifice plate 9.3-1 is energized, the material sheet 16 is conductive to achieve electroplating. If the outer edge of the material sheet 16 exceeds the size of the flip suction cup 9.3 by too much, the electric field force of the exceeding part will be reduced or disappear because it does not directly contact the cathode orifice plate 9.3-1, affecting the electroplating uniformity at the middle and edge of the plated surface of the material sheet 16 and reducing the yield rate.

[0116] Therefore, refer to the attached Fig.11 , Attachment Fig.14 and attached Fig.18 In the present application, a guide wheel hole 9.3-12 is provided on the flip suction cup 9.3, and the guide wheel hole 9.3-12 extends along the thickness direction of the flip suction cup 9.3 and passes through the top and bottom surfaces of the flip suction cup 9.3. A guide wheel bracket is arranged in the placement groove 5.3, and a material delivery synchronous wheel 12 is constructed on the guide wheel bracket. The material delivery synchronous wheel 12 is constructed in the same direction as the synchronous wheels at other parts of the third material delivery mechanism 5 and is connected through a synchronous belt transmission. The top end of the material delivery synchronous wheel 12 passes through the guide wheel hole 9.3-12 and extends out of the adsorption surface of the flip suction cup 9.3. In this technical solution, there is no need to excessively reduce the size of the flip suction cup 9.3 in order to smoothly transfer the material. As long as the spacing between the material delivery synchronous wheel 12 and the synchronous wheels on both sides of the flip suction cup 9.3 is less than the side length of the material sheet 16, it can ensure that the electric field force on the material sheet 16 is uniform, the electroplating uniformity is guaranteed, and the material sheet 16 can be transferred smoothly.

[0117] In order to make the flip suction cup 9.3 flip smoothly, in the present application, a suction cup bracket 9.4 is provided on the outside of the electroplating tank 9.1 (see attached Fig.15 -Attached Fig.17), the suction cup bracket 9.4 is provided with a transmission assembly and a suction cup flip motor 9.5, the flip suction cup 9.3 is rotatably connected to the suction cup bracket 9.4 through a suction cup flip shaft 9.6, the suction cup flip shaft 9.6 is connected to the suction cup flip motor 9.5 through a transmission assembly, and the suction cup flip motor 9.5 can drive the flip suction cup 9.3 to flip to: an initial position outside the electroplating tank 9.1, an electroplating position inside the electroplating tank 9.1, and a draining position above the electroplating tank 9.1, the initial position mentioned here is the above-mentioned At the initial station at the junction material position 5.1, the flip suction cup 9.3 is in a horizontal state at both the initial station and the electroplating station, but the adsorption surface of the flip suction cup 9.3 in the initial station faces upward, and the adsorption surface of the flip suction cup 9.3 in the electroplating station faces downward, and the flip suction cup 9.3 is in an oblique state at the draining station, but its top-down projection at this station is completely located in the electroplating tank 9.1, so that the residual electroplating liquid flowing down the material sheet 16 falls into the electroplating tank 9.1, avoiding waste or corrosion and pollution of other structures outside the electroplating tank 9.1.

[0118] When the flip suction cup 9.3 is at the drainage station, due to gravity, the residual electroplating liquid on the sheet 16 gathers to the lowest part of the sheet 16. Taking the square sheet 16 as an example, if the drainage efficiency and effect are to be improved, it is best to make the lowest part of the square sheet 16 the vertex position rather than the side length position. Generally, in order to make the electric field force uniform and save consumables of the flip suction cup 9.3, a square flip suction cup 9.3 is usually used in correspondence thereto. When adsorbing the material sheet 16, the flip suction cup 9.3 corresponds to the corners of the square material sheet 16 one by one. To improve the drainage efficiency and effect, the plating tank 9.1 and the material transfer position 5.2 can be set correspondingly, the plating tank 9.1 and the junction material position 5.1 can be set obliquely, and the suction cup flip axis 9.6 can be set obliquely and extend along a diagonal line of the flip suction cup 9.3, so that when the suction cup flip axis 9.6 rotates, the other diagonal line of the flip suction cup 9.3 gradually becomes upright, and the corresponding diagonal line of the square material sheet 16 located thereon also gradually stands upright, so that the residual plating liquid gathers and falls to the lowest vertex of the material sheet 16.

[0119] The transmission component can be configured according to actual usage requirements. In order to increase the production capacity of the electroplating system 9, multiple groups of third material feeding mechanisms 5 are arranged in parallel in the present application, and electroplating tanks 9.1 are arranged in a row next to each group of third material feeding mechanisms 5. In each row, multiple electroplating tanks 9.1 are configured along the material feeding direction of the third material feeding mechanism 5, and a corresponding flip suction cup 9.3 is set for each electroplating tank 9.1, that is: there are multiple flip suction cups 9.3 and transmission components distributed along the material feeding direction of the third material feeding mechanism 5. In order to improve the integration of the internal structure of the equipment in this scheme, efficiently utilize the internal space of the equipment casing 1, and reduce the production and operation costs of the equipment, the present application configures a group of suction cup flip motors 9.5 for each column of flip suction cups 9.3, and the output end of the suction cup flip motor 9.5 is fixedly connected to a series rod 9.7, and the series rod 9.7 extends along the material feeding direction of the third material feeding mechanism 5, connects the transmission components in each column in series, and drives them to operate synchronously. In order to meet the above functional requirements, the present application configures the transmission assembly to include: a suction cup synchronous belt 9.8, a suction cup synchronous wheel 9.9 and a bevel gear 9.10. A set of suction cup synchronous wheels 9.9 are respectively provided at the top and bottom ends of the suction cup bracket 9.4 and are driven by the suction cup synchronous belt 9.8. A set of bevel gears 9.10 are respectively provided at the power input end of the suction cup synchronous wheel 9.9 and the power output end of the suction cup flip motor 9.5 and are meshed for transmission. The bevel gears 9.10 can be selected according to specific usage requirements, wherein one set of bevel gears 9.10 is coaxially sleeved on the series rod 9.7, and another set of bevel gears 9.10 is coaxially connected to the suction cup synchronous wheel 9.9.

[0120] The suction cup flipping motor 9.5 can be configured with a coaxially connected servo motor, a coupling and a reducer, the output end of the reducer is connected to the series rod 9.7, and the servo motor is pre-programmed to control the orderly conversion of the initial position, the drainage position and the electroplating position of the flipping suction cup 9.3. Furthermore, the suction cup bracket 9.4 can be arranged on one side of the serial rod 9.7, and the photoelectric sensor 9.11 can be arranged on the other side of the serial rod 9.7, and the photoelectric sensor 9.11 can be connected to the suction cup flip motor 9.5 signal, and the induction disk 9.12 can be set on the serial rod 9.7, and the induction disk 9.12 can be fixedly connected to the serial rod 9.7, and the induction end of the photoelectric sensor 9.11 can be arranged corresponding to the induction disk 9.12, and the induction slot 9.12-1 extending radially along the serial rod 9.7 can be arranged on the induction disk 9.12, wherein: the size of the induction disk 9.12 and the size of the induction slot 9.12-1 are set according to the size and position of the induction end of the photoelectric sensor 9.11, so that when the induction disk 9.12 rotates with the serial rod 9.7, the induction slot 9.12-1 can rotate to the induction end of the photoelectric sensor 9.11.

[0121] In some feasible solutions, multiple limit plates 9.13 can be set on the equipment casing 1, and a hole is dug in the center of the limit plate 9.13 to pass the series rod 9.7 to provide support and limit for the series rod 9.7. A slot-type photoelectric sensor 9.11 is selected and installed on the limit plate 9.13, with the slot facing the transmission assembly and the induction disk 9.12 partially located in the slot.

[0122] Through preset programming, the suction cup flip motor 9.5 is controlled to perform the following actions: when the flip suction cup 9.3 is located at the initial position and adsorbs the material 16, the induction disc 9.12 blocks the sensing end of the photoelectric sensor 9.11, and generates a sensing signal 1 to control the suction cup flip motor 9.5 to rotate the flip suction cup 9.3 to the electroplating position, and keep the flip suction cup 9.3 at the electroplating position for a period of time to complete the electroplating operation of the material 16; when the flip suction cup 9.3 is located at the electroplating position, the sensing slot 9.12-1 corresponds to the sensing end of the photoelectric sensor 9.11, and the photoelectric sensor 9.11 generates a sensing signal 2. After the electroplating operation is completed, the suction cup flip motor 9.5 is controlled to reversely rotate, rotate the flip suction cup 9.3 to the draining position first, and keep it at the draining position for a period of time to drain the residual electroplating liquid on the material 16, and control the suction cup flip motor 9.5 to continue to reversely rotate, rotate the flip suction cup 9.3 to the initial position, and unload the plated material 16. In this way, the action can be repeated repeatedly.

[0123] Since the flip suction cup 9.3 is large in size and heavy in weight, in order to improve the connection stability, the present application provides a connection claw 9.3-9 on the non-adsorption surface of the flip suction cup 9.3 (see attached Fig.16 ), the connecting claw 9.3-9 includes a connecting arm 9.3-9a and a plurality of connecting fingers 9.3-9b, one end of the connecting arm 9.3-9a is connected to the suction cup flip shaft 9.6, and a plurality of connecting fingers 9.3-9b are fixedly arranged at the other end of the connecting arm 9.3-9a, radially diverge, and are connected to the flip suction cup 9.3 by bolts and other structures. The connection stability is improved by a plurality of connecting fingers 9.3-9b, and the total weight of the connecting claw 9.3-9 and the flip suction cup 9.3 is minimized to reduce the wear rate of the driving equipment.

[0124] Reference Fig.18The flip suction cup 9.3 includes a shell 9.3-2, a cathode orifice plate 9.3-1 and an exhaust pipe 9.3-3. The shell 9.3-2 is in the shape of a groove with one end open. The cathode orifice plate 9.3-1 is at the open end of the shell 9.3-2 and is sealed and connected to the shell 9.3-2 to form a negative pressure chamber; the negative pressure chamber is connected to the outside through the exhaust pipe 9.3-3 and the adsorption through hole 9.3-1a located on the cathode orifice plate 9.3-1. The cathode orifice plate 9.3-1 is made of a material that is insoluble in the electroplating solution, such as graphite material when nickel plating, copper plating, etc., and there are multiple adsorption through holes 9.3-1a evenly distributed on the cathode orifice plate 9.3-1 to ensure adsorption stability. When in use, the exhaust pipe 9.3-3 can be connected to the vacuum generator (finished product equipment, not shown in the figure). When the vacuum generator is evacuated, negative pressure is formed in the negative pressure chamber, and adsorption force is generated on the material sheet 16 through the adsorption through hole 9.3-1a, thereby stably adsorbing the material sheet 16. When the vacuum generator breaks the vacuum, the negative pressure chamber gradually returns to normal pressure and loses its adsorption force on the material sheet 16.

[0125] Integrating the cathode orifice plate 9.3-1 on the flip suction cup 9.3 can increase the area of ​​the charged body, improve the uniformity of the electric field on the sheet 16, and ensure the uniformity of electroplating. During electroplating, the cathode orifice plate 9.3-1 is connected to the anode screen plate 9.1-1 in the electroplating tank 9.1 through an external circuit. To ensure the flatness of the cathode orifice plate 9.3-1, the shell 9.3-2 and the cathode orifice plate 9.3-1 can be connected through a conductive bolt 9.3-4, and the conductive bolt 9.3-4 is extended from the shell 9.3-2 to the cathode orifice plate 9.3-1, and the end does not penetrate the cathode orifice plate 9.3-1, and the conductive bolt 9.3-4 is energized on the non-adsorption surface of the flip suction cup 9.3, so that the cathode orifice plate 9.3-1 is charged, so as to avoid the surface from having a concave and convex shape when the cathode orifice plate 9.3-1 is directly connected to the cathode power terminal of the external circuit, thereby affecting the adsorption stability; a sealing pad 9.3-6 is provided on the side of the shell 9.3-2 facing the cathode orifice plate 9.3-1, and the sealing pad 9.3-6 is provided at the edge of the inner wall of the shell 9.3-2 and the penetration of the conductive bolt 9.3-4 to prevent air leakage in the negative pressure cavity, ensure the sealing of the negative pressure cavity, and improve the vacuum adsorption stability.

[0126] During implementation, the conductive bolt 9.3-4 can be directly connected to the cathode terminal of the external circuit, or the shell 9.3-2 can be configured as a conductive material, and a cathode power-on part 9.3-5 is set on the shell 9.3-2. The cathode power-on part 9.3-5 can be configured according to the shape and structure of the cathode power terminal actually used, and can be in the shape of an internal thread groove, a card slot, etc., and no specific restrictions are made here. When the cathode power-on part 9.3-5 is energized by the cathode power terminal, the shell 9.3-2 conducts current to the conductive bolt 9.3-4, and the conductive bolt 9.3-4 conducts current to the cathode orifice plate 9.3-1. The cathode orifice plate 9.3-1 is charged to carry out the electroplating process of the sheet 16.

[0127] In addition, as mentioned above, a guide wheel hole 9.3-12 is provided on the flip suction cup 9.3, that is, the shell 9.3-2 and the cathode orifice plate 9.3-1 are respectively provided with guide wheel holes 9.3-12 at corresponding positions, and the side wall of the guide wheel hole 9.3-12 is not connected to the negative pressure chamber, that is: on the side of the shell 9.3-2 facing the cathode orifice plate 9.3-1, even if a guide wheel hole 9.3-12 is provided, the side wall of the guide wheel hole 9.3-12 also serves as the side wall of the groove structure of the shell 9.3-2, and a sealing rubber pad 9.3-6 is correspondingly constructed, so that the negative pressure chamber can only be connected to the outside world through the adsorption through hole 9.3-1a and the exhaust pipe 9.3-3, and no air leakage occurs at the guide wheel hole 9.3-12.

[0128] As mentioned above, the portion of the material sheet 16 that is not in contact with the cathode orifice plate 9.3-1 may have a problem of weakening or disappearing the electric field force, so the size of the guide wheel hole 9.3-12 should be minimized. However, in order to ensure the structural strength, the synchronous wheel on the material transfer mechanism is generally larger in size. Therefore, the present application constructs the material transfer synchronous wheel 12 to include a first wheel portion 12.1 and a second wheel portion 12.2 that are coaxially fixed (see Appendix 1). Fig.14 ), wherein the first wheel portion 12.1 is connected to the synchronous belt drive in the third material transmission mechanism 5, and has a corresponding size with other synchronous wheels used in the material transmission mechanism to ensure structural strength and service life, the thickness of the second wheel portion 12.2 is smaller than the first wheel portion 12.1, and is adapted to the size of the guide wheel hole 9.3-12, and the diameter of the second wheel portion 12.2 is larger than the first wheel portion 12.1, the purpose is to adapt to the thickness of the flip suction cup 9.3, so that at least a part of the second wheel portion 12.2 is exposed to the adsorption surface of the cathode hole plate 9.3-1, so as to realize the transfer of the material sheet 16. During implementation, the size of the guide wheel hole 9.3-12 and the thickness of the first wheel portion 12.1 can be designed according to the actual influence of the guide wheel hole 9.3-12 on the distribution uniformity of the electric field force on the material sheet 16, and no specific limitation is made here.

[0129] Usually, the sheet 16 is electroplated on only one side at a time. If the non-plated surface of the sheet 16 is contaminated with electroplating liquid during this electroplating process, the plated layer will also be deposited on the non-plated surface of the sheet 16 due to the charge on the sheet 16, which will affect the subsequent process and the quality of the sheet 16. Even if the size of the flip suction cup 9.3 is larger than the size of the sheet 16, it is difficult to avoid the electroplating liquid from surging to the gap between the two and diffusing along the gap to the non-plated surface of the sheet 16, which will not only affect the quality of the sheet 16, but the plated layer at the gap may also tightly connect the sheet 16 and the flip suction cup 9.3. Even after the flip suction cup 9.3 breaks the vacuum, it is difficult to remove the sheet 16 from the flip suction cup 9.3. Therefore, the present application configures the size of the flip suction cup 9.3 to be slightly smaller than the size of the sheet 16. For example, a millimeter-level blank area is reserved on each single side of the non-plated surface of the sheet 16 to avoid affecting the uniformity of the electric field force; and a blowing cavity 9.3-7 is configured on the periphery of the flip suction cup 9.3 (refer to Attachment 1). Fig.16 and attached Fig.18 ), the blowing port of the blowing cavity 9.3-7 faces the blank area of ​​the material sheet 16, and can be slightly inclined toward the outer edge of the material sheet 16. The end of the blowing cavity 9.3-7 away from the material sheet 16 is closed and an air inlet pipe 9.3-8 is provided, so that one end of the air inlet pipe 9.3-8 is connected to the inside of the blowing cavity 9.3-7, and the other end is connected to the air source. During electroplating, the air source is kept open, and the blowing port continuously blows toward the outer edge of the material sheet 16 to prevent the electroplating liquid from splashing or surging to the non-plated surface of the material sheet 16, causing related production quality problems.

[0130] Since the flip suction cup 9.3 and the third material feeding mechanism 5 are two independent parts, the production accuracy and assembly accuracy of the flip suction cup 9.3, the suction cup bracket 9.4 and other structures will affect the horizontality of the top surface of the flip suction cup 9.3 when it is located at the initial position. If its top surface is tilted, it may cause the received material 16 to slip and collide or slide directly. Therefore, before formal production, the flip suction cup 9.3 needs to be moved to the initial position to adjust the horizontality of its top surface. The present application is provided with a plurality of first leveling bolts 5.6 in the placement groove 5.3 of the third material feeding mechanism 5 (see attached Fig.14 ), the first leveling bolt 5.6 is vertically installed in the placement groove 5.3, and can move in the vertical direction when rotating, and the top of the first leveling bolt 5.6 abuts against the bottom surface of the flip suction cup 9.3. Before formal production, the height of the first leveling bolt 5.6 is adjusted to meet the following requirements: when the flip suction cup 9.3 is located at the initial position, when the top of each first leveling bolt 5.6 abuts against the flip suction cup 9.3, the level of the top surface of the flip suction cup 9.3 is detected by a level meter or other equipment. The first leveling bolt 5.6 can not only level the top surface of the flip suction cup 9.3 before production, but also provide continuous support for the flip suction cup 9.3 during formal production, ensuring that the top surface of the flip suction cup 9.3 can be kept level each time it moves to the initial position.

[0131] When the sheet 16 is transferred in each material conveying mechanism, it may be skewed. The skew here does not refer to the horizontality problem, but refers to the fact that the center of the sheet 16 deviates from the top center of the material conveying mechanism under the premise of ensuring the horizontality of the sheet 16, or the square sheet 16 rotates around its center and does not correspond to the corners of the material conveying mechanism. When the sheet 16 is transferred to the flip suction cup 9.3 in the above-mentioned skewed state, it may cause unstable adsorption and collide with the side wall of the electroplating tank 9.1 when it is flipped into the electroplating tank 9.1. Therefore, the present application constructs a material sorting mechanism 13 (see attached) outside the flip suction cup 9.3. Fig.11 -Attached Fig.14 ), the material sorting mechanism 13 includes a first material sorting component 13.1 and a second material sorting component 13.2. The first material sorting component 13.1 is arranged outside a group of opposite sides of the flip suction cup 9.3 close to the material transfer position 5.2, and the second material sorting component 13.2 is arranged outside another group of opposite sides of the flip suction cup 9.3.

[0132] As mentioned above, the basic structure of the material transmission mechanism involved in the present application is a synchronous wheel-synchronous belt mechanism, which is usually constructed with a base, a synchronous wheel, a synchronous belt and a drive motor, etc. In order to facilitate installation and improve the integration of components, the present application installs the first material sorting component 13.1 and the second material sorting component 13.2 on the base of the third material transmission mechanism 5. Since the first material sorting component 13.1 is located outside a group of opposite sides of the flip suction cup 9.3 close to the material transfer position 5.2, in order to achieve its material sorting function and avoid affecting the material transfer, the present application configures a mounting cavity 5.4 in the base of the material transfer position 5.2, and an opening is formed on one side of the top of the mounting cavity 5.4 close to the material flipping suction cup, the first material sorting component 13.1 is configured in the mounting cavity 5.4, and the first material sorting component 13.1 is configured with: a first material sorting cylinder 13.1-1, a guide block 13.1-2 and a first material sorting plate 13.1-3, wherein the piston rod of the first material sorting cylinder 13.1-1 is configured vertically, and the guide block 13.1-2 is located at the top of the piston rod. The piston rod of the first material sorting cylinder 13.1-1 can drive the guide block 13.1-2 to move up and down. The side of the guide block 13.1-2 is provided with a straight slot 13.1-2a extending along the material transmission direction of the third material transmission mechanism 5. The bottom end of the first material sorting plate 13.1-3 is provided with a sliding member 13.1-4. The sliding member 13.1-4 is movably arranged in the straight slot 13.1-2a and can slide and rotate in the straight slot 13.1-2a; the first material sorting plate 13.1-3 is located in the installation cavity 5.4 and is connected to the base through the material sorting plate rotating shaft 13.1-5. The bottom end of the first material sorting plate 13.1-3 is fixedly connected to the sliding member 13.1-4. When the first sorting cylinder 13.1-1 lifts the guide block 13.1-2, driving the sliding member 13.1-4 to slide and rotate in the straight slot 13.1-2a, the bottom end height of the first sorting plate 13.1-3 changes, and the inclination angle of the first sorting plate 13.1-3 changes due to the limiting effect of the receiving plate shaft 13.1-5, so that the horizontal and vertical positions of the top end of the first sorting plate 13.1-3 are changed, and the material sheet 16 is pushed forward by switching between the non-sorting position and the sorting position.

[0133] Among them, when it is not in the material sorting position, that is, when the piston rod of the first material sorting cylinder 13.1-1 is not extended, the inclination direction of the first material sorting plate 13.1-3 can be toward the center of the intersection material level 5.1, and the sliding member 13.1-4 is located at one end of the straight slot 13.1-2a close to the center of the intersection material level 5.1. When the piston rod of the first material sorting cylinder 13.1-1 is extended, the straight slot 13.1-2a moves upward, and the sliding member 13.1-4 slides and rotates toward the other end of the straight slot 13.1-2a, and the first material sorting plate 13.1-3 rotates to the material sorting position accordingly. At this time, the height of the top end of the first material sorting plate 13.1-3 is reduced, and the lateral position gradually approaches the center of the intersection material level 5.1, that is, the area where the sheet 16 is located, thereby producing a pushing effect on the sheet 16.

[0134] Of course, when the material is not in the material sorting position, that is, when the piston rod of the first material sorting cylinder 13.1-1 is not extended, the tilting direction of the first material sorting plate 13.1-3 can also be away from the center of the material intersection level 5.1, and the sliding member 13.1-4 is arranged on the plate surface of the first material sorting plate 13.1-3 close to the first material sorting cylinder 13.1-1, and the first material sorting block 13.1-6 is arranged on the other plate surface of the first material sorting plate 13.1-3, and the sliding member 13.1-4 is located at one end of the straight slot 13.1-2a close to the center of the ring. When the piston rod of the first material sorting cylinder 13.1-1 is extended, the straight slot 13.1-2a moves upward, the sliding member 13.1-4 slides and rotates toward the other end of the straight slot 13.1-2a, and the first material sorting plate 13.1-3 rotates to the material sorting position. At this time, the top height of the first material sorting plate 13.1-3 increases, and the lateral position gradually approaches the center of the junction material level 5.1, driving the first material sorting block 13.1-6 to approach the center of the junction material level 5.1, that is, the area where the sheet 16 is located, thereby producing a pushing effect on the sheet 16.

[0135] The above two configurations can be selected according to actual use requirements, including but not limited to: the difference between the top surface height of the flip suction cup 9.3 at the initial workstation and the top surface height of the material transfer station 5.2, the material (structural strength and torsional strength are different), size, etc. of each structure in the first material sorting component 13.1.

[0136] In this embodiment, the sliding member 13.1-4 includes a U-shaped member 13.1-4a and a sliding rod 13.1-4b, the first material sorting plate 13.1-3 is located at the sealed end of the U-shaped member 13.1-4a, and the guide block 13.1-2 extends into the open end of the U-shaped member 13.1-4a; the sliding rod 13.1-4b is movably inserted into the straight slot 13.1-2a, and the end is fixedly connected to the open end of the U-shaped member 13.1-4a. When the guide block 13.1-2 rises, the sliding rod 13.1-4b slides from one end of the straight slot 13.1-2a to the other end. Due to the restrictions of the first material sorting plate 13.1-3 and the material sorting plate shaft 13.1-5, the sliding rod 13.1-4b will also rotate, and the U-shaped member 13.1-4a provided in this embodiment can rotate accordingly, and its opening can accommodate the guide block 13.1-2, providing an obstacle avoidance space for the relative displacement of the guide block 13.1-2 and the sliding member 13.1-4, thereby preventing the top end of the guide block 13.1-2 from directly abutting the first material sorting plate 13.1-3 and hindering the rotation of the first material sorting plate 13.1-3.

[0137] In addition, a support boss 13.1-2b can be provided on the guide block 13.1-2, and the support boss 13.1-2b is located below the straight slot 13.1-2a, and the bottom end of the U-shaped member 13.1-4a abuts against the support boss 13.1-2b. The support boss 13.1-2b can support the sliding member 13.1-4, the first material sorting plate 13.1-3 and other structures to prevent the sliding rod 13.1-4b from bearing the weight of all the components above, resulting in torque overload and shortening the service life.

[0138] In addition, in the technical solution in which the first sorting plate 13.1-3 is tilted away from the center of the ring, a dust baffle 13.1-7 can be provided on the plate surface close to the first sorting cylinder 13.1-1, and the angle between the dust baffle 13.1-7 and the first sorting plate 13.1-3 is greater than 0° and less than 90°. The design of the size and assembly of each workpiece can be determined according to actual production requirements, for example, Fig.12 In the embodiment, an L-shaped plate is arranged on the plate surface of the first sorting plate 13.1-3 near the first sorting cylinder 13.1-1, wherein the plate portion of the L-shaped plate parallel to the first sorting plate 13.1-3 is used to install detachable fixing parts such as bolts, and the plate portion of the L-shaped plate parallel to the first sorting plate 13.1-3 is used as a dust baffle 13.1-7. When the first sorting plate 13.1-3 is in a non-sorting position, the first sorting plate 13.1-3 can block the top opening of the installation cavity 5.4, and when the first sorting plate 13.1-3 rotates to the sorting position, the dust baffle 13.1-7 can block the top opening of the installation cavity 5.4 to prevent debris from falling into the installation cavity 5.4 and causing a movement failure of the internal structure of the installation cavity 5.4, such as preventing debris from being stuck in the straight slot 13.1-2a, causing the first sorting plate 13.1-3 to be unable to move.

[0139] Since the second material handling component 13.2 is another set of opposite sides of the flip suction cup 9.3 and has no effect on material transfer, its structural design is simplified compared to the first material handling component 13.1, and specifically includes: a second material handling cylinder 13.2-1 and a second material handling plate 13.2-2, the second material handling cylinder 13.2-1 is laterally arranged on the base at the material connection position 5.1, the bottom end of the second material handling plate 13.2-2 is fixedly connected to the piston rod of the second material handling cylinder 13.2-1, and the top end is provided with a second material handling block 13.2-3 on the side facing the center of the material connection position 5.1. When the piston rod of the second material handling cylinder 13.2-1 is extended or retracted, the second material handling plate 13.2-2 and the second material handling block 13.2-3 will approach or move away from the center of the material connection position 5.1, and when approaching the center of the material connection position 5.1, the material sheet on the flip suction cup 9.3 can be pushed.

[0140] During implementation, the first material sorting block 13.1-6 and the second material sorting block 13.2-3 can be polyurethane blocks, which are detachably connected to the first material sorting board 13.1-3 and the second material sorting board 13.2-2 for installation and maintenance. The polyurethane blocks have a certain flexibility and can avoid rigid collision with the material sheet, resulting in damage to the material sheet.

[0141] In addition, a transversely penetrating mounting groove 5.5 can be provided on the base at the material transfer position 5.1, and the second material handling cylinder 13.2-1 can be placed in the mounting groove 5.5, with the free end of its piston rod facing away from the center of the material transfer position 5.1. The bottom surface of the mounting groove 5.5 can provide good support for the second material handling cylinder 13.2-1, and can also reduce the space occupied by the second material handling component 13.2 outside the base, thereby improving the integration of the mechanism and the space utilization rate.

[0142] When the first material handling components 13.1 on both sides of the flip suction cup 9.3 are in motion at the same time, the material sheet 16 can be adjusted to a point where the line connecting the center of the material sheet 16 and the center of the flip suction cup 9.3 is perpendicular to the material conveying direction of the third material conveying mechanism 5. When the second material handling components 13.2 on both sides of the flip suction cup 9.3 are in motion at the same time, the material sheet 16 can be adjusted to a point where the line connecting the center of the material sheet 16 and the center of the flip suction cup 9.3 is parallel to the material conveying direction of the third material conveying mechanism 5. Therefore, the first material handling component 13.1 and the second material handling component 13.2 are in motion at the same time, and the material sheet 16 and the flip suction cup 9.3 can be adjusted to overlap in the center.

[0143] After the material sheet 16 is straightened by the material sorting mechanism 13, the flip suction cup 9.3 starts to draw a vacuum to adsorb the material sheet 16. After the adsorption is stable, the suction cup flip motor 9.5 is activated to flip the flip suction cup 9.3 to the electroplating station, so that the surface of the material sheet 16 to be plated faces downward and contacts the electroplating solution in the electroplating tank 9.1. The anode screen plate 9.1-1 in the electroplating tank 9.1 and the cathode hole plate 9.3-1 in the flip suction cup 9.3 are powered on to make the circuit conductive, and the material sheet 16 is charged for electroplating.

[0144] Reference Fig.19In this application, the plating tank 9.1 is arranged vertically above the liquid supply mechanism 9.2 to improve the utilization rate of the horizontal space in the equipment housing 9.3-2. The liquid supply mechanism 9.2 includes a liquid storage tank 9.2-1 and a pipeline connected to the liquid storage tank 9.2-1 for transmitting the plating liquid. These pipelines at least include a liquid supply pipe 9.2-2 and a liquid return pipe 9.2-3 connected to the plating tank 9.1, and each pipeline is provided with an independent valve, and the opening and closing of all valves are controlled by the total air machine; the liquid supply pipe 9.2-2 is used to inject the plating liquid in the liquid storage tank 9.2-1 into the plating tank 9. .1, but due to the height difference between the liquid storage tank 9.2-1 and the electroplating tank 9.1, a magnetic suction pump 9.2-4 is set at the input end of the liquid supply pipe 9.2-2, and the input end of the magnetic suction pump 9.2-4 is connected to the liquid storage tank 9.2-1, and the electroplating liquid in the liquid storage tank 9.2-1 is pumped into the liquid supply pipe 9.2-2 and the electroplating tank 9.1 by the magnetic suction pump 9.2-4; the return pipe 9.2-3 is used to discharge the electroplating liquid in the electroplating tank 9.1 back to the liquid storage tank 9.2-1. Although the solute concentration of the electroplating liquid discharged into the liquid storage tank 9.2-1 is slightly reduced, it can still be recycled.

[0145] In addition to the liquid supply pipe 9.2-2 and the liquid return pipe 9.2-3, an overflow pipe 9.2-5 can be arranged between the electroplating tank 9.1 and the liquid storage tank 9.2-1 to optimize the structure of the electroplating tank 9.1 and improve the electroplating quality. Fig. 20 -Attached Fig.21The electroplating tank 9.1 is constructed to include a bottom plate 9.1-2, an outer plate 9.1-3 and an inner partition plate 9.1-4. A plurality of outer plates 9.1-3 are connected in sequence to form a first cylinder. A plurality of inner partition plates 9.1-4 are connected in sequence to form a second cylinder. The axial dimension of the second cylinder is smaller than the axial dimension of the first cylinder. The first cylinder is sleeved on the outside of the second cylinder, and the bottom surfaces of the two are flush. The bottom plate 9.1-2 is fixedly arranged at the bottom of the first cylinder and the second cylinder to block the bottom opening of the first cylinder. The anode screen plate 9.1-1 is constructed inside the second cylinder. The second cylinder serves as an electroplating area, and the gap between the first cylinder and the second cylinder serves as an overflow groove 9.1-5. The output end of the liquid supply pipe 9.2-2 and the input end of the liquid return pipe 9.2-3 are connected to the inner side of the second cylinder. The overflow pipe 9.2-5 The two ends are connected to the overflow tank 9.1-5 and the liquid storage tank 9.2-1 respectively. During electroplating, the liquid supply pipe 9.2-2 and the overflow pipe 9.2-5 are opened to control the height of the tablet 16 suspended by the flip suction cup 9.3 to be higher than the top of the second barrel and lower than the top of the first barrel. The liquid supply pipe 9.2-2 is used to supply liquid to the electroplating tank 9.1, so that the liquid level is raised to contact with the tablet 16 for electroplating. However, since the liquid level that can contact the tablet 16 is higher than the top of the second barrel, the electroplating liquid near the liquid surface will fall into the overflow tank 9.1-5 after reacting with the tablet 16, and return to the liquid supply tank through the overflow tank 9.1-5 for recycling. In this way, the electroplating liquid near the surface to be plated of the tablet 16 can always circulate, maintain the concentration of the electroplating liquid near the tablet 16, ensure the deposition thickness of the coating, and improve the yield rate.

[0146] Since the inner partition 9.1-4 has a certain height, in order to prevent the electroplating liquid from falling from the top of the inner partition 9.1-4 into the overflow groove 9.1-5, and falling rapidly to hit the bottom plate 9.1-2 or the original liquid in the overflow groove 9.1-5, causing splashing, this embodiment provides a drainage slope 9.1-4a on the top of the inner partition 9.1-4, and the top of the drainage slope 9.1-4a faces the electroplating area, and the bottom faces the overflow groove 9.1-5.

[0147] In addition, in this embodiment, a connecting block 9.1-6 is provided between the outer vertical plate 9.1-3 and the inner partition plate 9.1-4. The connecting block 9.1-6 is integrally formed with the outer vertical plate 9.1-3 and the inner partition plate 9.1-4 or fixedly connected by other means (gluing, welding, etc.). The liquid supply pipe 9.2-2 and the liquid discharge pipe are respectively passed through the connecting block 9.1-6 and extended into the electroplating area to avoid mixing of plating solutions of different concentrations in the electroplating area and the overflow tank 9.1-5, thereby reducing the renewal effect of the plating solution near the sheet 16.

[0148] In order to ensure the uniformity of the coating deposition, a flow stabilizing orifice plate 9.1-7 can be arranged on the top of the second cylinder, and a plurality of flow stabilizing holes 9.1-7a are arranged on the flow stabilizing orifice plate 9.1-7, so that the electroplating liquid entering the electroplating tank 9.1 through the liquid supply pipe 9.2-2 forms a stable liquid surface on the flow stabilizing orifice plate 9.1-7, and then fully and evenly contacts the surface to be plated of the sheet 16; in addition, the levelness of the surface to be plated of the sheet 16 is also an important factor affecting the uniformity of the coating deposition. Considering the influence of the structural production accuracy and the assembly accuracy on the levelness of the sheet 16 after the flip, the flip suction cup 9. 3 is provided with a plurality of mounting arms 9.3-10, and a second leveling bolt 9.3-11 is passed through the mounting arms 9.3-10, and the axial direction of the second leveling bolt 9.3-11 is the same as the thickness direction of the flip suction cup 9.3. When rotating, the end of the second leveling bolt 9.3-11 can move along the thickness direction of the flip suction cup 9.3. Before formal production, the flip suction cup 9.3 is moved to the electroplating station, and the second leveling nuts are adjusted until each second leveling nut abuts against the horizontal base surface in the electroplating tank 9.1, so as to ensure that the adsorption surface of the flip suction cup 9.3 is in a horizontal state at this time.

[0149] The horizontal base surface can be selected from an end surface in the electroplating tank 9.1 with good production accuracy, assembly accuracy and qualified levelness, or it can be a leveling gasket 9.1-8 added to the top surface of the electroplating tank 9.1 after the electroplating tank 9.1 is assembled. According to the production accuracy and assembly accuracy of each electroplating tank 9.1, each leveling gasket 9.1-8 is cut until the top of each leveling gasket 9.1-8 is coplanar and horizontal. Any of the above methods is acceptable without specific limitation.

[0150] In addition, a liquid gushing pipe 9.2-6 may be arranged between the electroplating tank 9.1 and the liquid storage tank 9.2-1, and the output end of the liquid gushing pipe 9.2-6 is connected to the inner side of the second cylinder, and the output end of the liquid gushing pipe 9.2-6 is vertically upward, and the liquid supply speed of the liquid supply pipe 9.2-2 is adjusted so that there is a small gap between the stable liquid surface formed above the steady flow orifice plate 9.1-7 and the electroplating surface of the material sheet 16, which may be a gap of millimeter level or smaller, and the height or liquid gushing speed of the liquid gushing pipe 9.2-6 is adjusted (that is, the liquid gushing pipe 9.2-6 can be lower than the steady flow orifice plate 9.1-7, or higher than the steady flow orifice plate 9.1-7). Orifice plate 9.1-7, when it is lower than the steady flow orifice plate 9.1-7, the liquid gushing speed of the liquid gushing pipe 9.2-6 can be appropriately increased), so that the top surface of the liquid column gushing out of the output end of the liquid gushing pipe 9.2-6 contacts the surface to be plated of the sheet 16. Since the stable liquid surface formed by the liquid column and the steady flow plate is a continuous liquid, under the combined influence of the surface tension of the liquid column and the sheet 16 and the gravity of the electroplating liquid itself, the stable liquid surface formed by the steady flow plate can only be barely pulled to the surface to be plated of the sheet 16 for electroplating reaction, and cannot surge to the non-plated surface of the sheet 16, thereby improving the yield rate of electroplating of the sheet 16.

[0151] In the technical solution with the liquid gushing pipe 9.2-6, the stable liquid surface formed by the flow stabilizing plate is not intended to directly contact the material sheet 16, but to make the liquid level in the electroplating tank 9.1 uniform and the distance from the top surface of the liquid column formed by the liquid gushing pipe 9.2-6 the same, so as to achieve effective traction and avoid the liquid level in the electroplating tank 9.1 being high and low, and the low part cannot be pulled by the surface tension between the liquid column and the material sheet 16. In addition, the liquid gushing tube 9.2-6 should also correspond to the middle part of the sheet 16 as much as possible, rather than the edge part. This is because the farther the point on the stable liquid surface is from the liquid column formed by the liquid gushing tube 9.2-6, the less affected by the traction of the surface tension. If the liquid gushing tube 9.2-6 corresponds to the middle part of the sheet 16, the liquid gushing speed can be slightly increased to ensure that the edge of the sheet 16 can contact the plating liquid and avoid liquid overflow to the non-plated surface of the sheet 16. However, if the liquid gushing tube 9.2-6 corresponds to the edge of the sheet 16, if the sheet 16 is to be evenly plated, the liquid gushing speed must be increased until the edge of the sheet 16 away from the liquid gushing tube 9.2-6 can also contact the plating liquid. In this case, the edge of the sheet 16 close to the liquid gushing tube 9.2-6 is likely to overflow.

[0152] The electroplating tank 9.1 can be configured to be light-transmissive throughout or partially, and an LED light source 14 can be configured in the light-transmissive portion to increase the ion activity of the electroplating solution in the electric field and improve the efficiency and quality of electroplating. In the drawings of the present application, as an example, the electroplating tank 9.1 is configured to be light-transmissive at least on the bottom surface, and the LED light source 14 is placed at the bottom of the electroplating tank 9.1.

[0153] Reference Fig.21 An annular storage platform 9.1-9 is provided in the electroplating area. The annular storage platform 9.1-9 is arranged on the inner partition plate 9.1-4 and can be integrally formed therewith or fixedly connected by other means (adhesion, welding, etc.). The annular storage platform 9.1-9 includes a first storage step 9.1-9a and a second storage step 9.1-9b. The first storage step 9.1-9a is higher than the second storage step 9.1-9b. The flow stabilizing orifice plate 9.1-7 is detachably connected to the first storage step 9.1-9a, and the anode screen plate 9.1-1 is detachably connected to the second storage step 9.1-9b, so as to facilitate installation, disassembly and maintenance.

[0154] When copper grid lines are plated on the blue film, since the bonding between the blue film and copper is weak, a nickel seed layer can be plated on the blue film first to improve the bonding with copper; it is also possible to plate tin, nickel, copper, tin, etc. on the surface of the copper grid lines according to process requirements. The anode mesh plate 9.1-1 can be made of the same material as the plated metal and constructed into a mesh-like hollow plate shape so that the electroplating solution passes through the anode mesh plate 9.1-1 and contacts the material sheet 16; the size of the anode mesh plate 9.1-1 is configured according to actual use requirements, and the area of ​​its top-view projection should not be less than the area of ​​the surface to be plated of the material sheet 16 to ensure that a uniform electric field force is generated on each part of the material sheet 16 and improve the uniformity of electroplating.

[0155] In order to make the anode mesh plate 9.1-1 charged, the present application constructs an anode power-carrying part 9.1-10 on the anode mesh plate 9.1-1. The anode power-carrying part 9.1-10 can be in any shape such as block shape, rod shape, plate shape, etc. One end of the anode power-carrying part 9.1-10 is connected to the anode mesh plate 9.1-1, and the other end passes through the annular storage table 9.1-9, the inner partition plate 9.1-4 and the outer plate 9.1-3 in sequence to connect the anode power terminal. The anode power-carrying part 9.1-10 can be integrally formed with the anode mesh plate 9.1-1, or can be connected by a conductive connector 11.2-2 such as bolts for easy installation and removal; the part where the anode power-carrying part 9.1-10 passes through the outer plate 9.1-3 on the electroplating tank 9.1 should be well sealed to prevent leakage; the shape and structure of the anode power-carrying part 9.1-10 located on the outside of the electroplating tank 9.1 is configured according to the shape and structure of the anode power terminal, and a threaded groove or a card slot for installing the anode power terminal can be adaptively provided, and no specific restrictions are made here.

[0156] In addition to the above, please refer to the attached Fig.19 and attached Fig. 22A liquid replenishing pipe 9.2-8 may also be arranged on the liquid storage tank 9.2-1, and the liquid replenishing pipe 9.2-8 is used to replenish liquid into the liquid storage tank 9.2-1; a visual liquid level gauge 9.2-9 is arranged on the side wall of the liquid storage tank 9.2-1, and is used to monitor the liquid level height in the liquid storage tank 9.2-1; a liquid level sensor 9.2-10 is arranged on the side wall of the liquid storage tank 9.2-1, and is used to monitor whether the liquid level in the liquid storage tank 9.2-1 exceeds the limit, especially whether it is too low, and the liquid level sensor 9.2-10 transmits the sensing signal to the master control machine 2, and if the liquid level exceeds the limit, the master control machine 2 issues an alarm; a magnetic suction pump 9.2-4 is arranged on the side wall of the liquid storage tank 9.2-1, and is used to monitor whether the liquid level in the liquid storage tank 9.2-1 exceeds the limit, especially whether it is too low, and the liquid level sensor 9.2-10 transmits the sensing signal to the master control machine 2, and if the liquid level exceeds the limit, the master control machine 2 issues an alarm; A one-way valve 9.2-11 is arranged between the liquid supply pipe 9.2-2 to prevent liquid backflow, and a protection pipe 9.2-12 is arranged between the magnetic suction pump 9.2-4 and the one-way valve 9.2-11. The two ends of the protection pipe 9.2-12 are respectively connected to the magnetic suction pump 9.2-4 and the liquid storage tank 9.2-1. A safety valve 9.2-13 controlled by the master control machine 2 is arranged on the protection pipe 9.2-12. If the liquid supply pipe 9.2-2 is blocked, the one-way valve 9.2-11 cannot flow liquid, and the safety valve 9.2-13 will be opened to transfer the liquid in the magnetic suction pump 9.2-4 back to the liquid storage tank 9.2 -1, to prevent the pump from being damaged by excessive pressure; due to the one-way valve 9.2-11, the electroplating liquid in the liquid supply pipe 9.2-2 cannot be emptied during equipment maintenance. Therefore, an emptying pipe 9.2-7 can be adaptively provided on the liquid supply pipe 9.2-2, and the input end of the emptying pipe 9.2-7 is connected to the liquid supply pipe 9.2-2 to empty the electroplating liquid in the liquid supply pipe 9.2-2; filters 9.2-14 can be provided at the inner side of the liquid storage tank 9.2-1 at the positions connected to the return pipe 9.2-3 and the overflow pipe 9.2-5 to filter out the electroplating liquid in the return pipe 9.2-3 and the overflow pipe 9.2-5. Solid impurities carried by the liquid in the flow tube 9.2-5 (for example, dust impurities falling into the top opening of the electroplating tank 9.1); a heater 9.2-15 (for example, a heating wire or other structure) can be set in the liquid storage tank 9.2-1, and a temperature sensor 9.2-16 can be set at an appropriate position, such as the input end of the magnetic suction pump 9.2-4 or other positions, and the heater 9.2-15 is used to heat the plating liquid, and the temperature sensor 9.2-16 is used to detect the temperature of the plating liquid to monitor whether it meets the requirements of the electroplating process, and the working state of the heater 9.2-15 is regulated by the master control machine 2.

[0157] The blowing chamber 9.3-7 in the device uses a valve body of a pneumatic valve, and the required air source can be transported through a pipeline extending out of the device. An air storage tank 15 can also be constructed in the device to improve the functional integrity of the device.

[0158] The number of loading positions (the number of electroplating tanks 9.1 and the number of turning plates, etc.) in each process system in this application can be set independently, and the adjustment is made by referring to the preset capacity of each process system. Fig.19As shown, the electroplating system 9 has two rows of electroplating tanks 9.1, each row has five electroplating tanks 9.1, and two sets of third material feeding mechanisms 5 and two rows of flip suction cups 9.3 can be respectively arranged on both sides of each row of electroplating tanks 9.1, and the number of flip suction cups 9.3 in each row is also five, corresponding to the electroplating tanks 9.1 one by one. Flip suction cups 9.3 are arranged on both sides of the electroplating tanks 9.1, which can effectively improve the production capacity of the electroplating system 9. In order to improve the equipment integration and space utilization, the second material feeding mechanism 4 can also adopt a vertical cross-combination synchronous belt-synchronous wheel mechanism, which has been explained in many places above and will not be repeated here. The numbers mentioned above are all exemplary descriptions and are not limitations on the scope of protection of this application.

[0159] In addition, according to customized requirements, a post-plating cleaning system 19 can be configured at the total output end of the electroplating system 9 to further clean the electroplating liquid remaining on the plated sheet 16. Similar to the pre-plating cleaning system 17, the post-plating cleaning system 19 can also use an existing chain cleaning machine; a sixth material transfer component can also be configured between the post-plating cleaning system 19 and the electroplating system 9, and the sixth material transfer component is also a synchronous belt-synchronous wheel mechanism. If necessary, as mentioned above, a material transfer avoidance groove 18.2 can be set on part of the synchronous belt synchronous wheel mechanism, and as shown in the attached Figure 1 The material transfer direction of the sixth material transfer mechanism 8 is configured as shown to improve the device structure integration and improve the space utilization rate in the device casing 1.

[0160] Here, the process of electroplating using the blue film electroplating equipment provided by the present application is summarized, wherein the specific operating principles of each structure have been explained in detail above and will not be repeated here.

[0161] Under the control of the master control machine 2:

[0162] The first material transfer mechanism 3 transfers the material sheet 16 to be plated to the pre-plating cleaning system 17;

[0163] After the pre-plating cleaning system 17 cleans the surface to be plated (bottom surface) of the material sheet 16, the material sheet 16 is transferred to the offset material transfer component 6.5 in the fourth material transfer mechanism 6;

[0164] The offset material transfer component 6.5 transfers the material sheet 16 to the material turning plate 6.1 according to the above-mentioned action principle. The material turning motor 6.2 drives the material turning plate 6.1 to rotate. The material turning plate 6.1 turns the material sheet 16 180 degrees and then transfers it to the quality inspection system 18.

[0165] The quality inspection system 18 performs quality inspection on the web 16, transfers qualified webs 16 to the buffer mechanism 11, and removes defective webs through the defective web removal mechanism 10;

[0166] The buffer mechanism 11 transfers the material sheet 16 to the third material transfer mechanism 5 via the fifth material transfer mechanism 7, the flip suction cup 9.3 receives and adsorbs the material sheet 16 at the initial station, the suction cup flip motor 9.5 drives the flip suction cup 9.3 to rotate to the electroplating station and keep it for a period of time, so that the material sheet 16 is electroplated in the electroplating tank 9.1, the suction cup flip motor 9.5 reverses to drive the flip suction cup 9.3 to rotate to the draining station and keep it for a period of time, so that the residual electroplating liquid on the material sheet 16 is drained, the suction cup flip motor 9.5 continues to reverse to drive the flip suction cup 9.3 to rotate to the initial station, the flip suction cup 9.3 releases the adsorption of the material sheet 16, and the third material transfer mechanism 5 transfers the material sheet 16 to the post-plating cleaning system 19 via the sixth material transfer mechanism 8, so as to further remove the residual electroplating liquid on the material sheet 16;

[0167] The post-plating cleaning system 19 transfers the material sheet 16 to the second material feeding mechanism 4 for unloading.

[0168] The beneficial effects of the present application are: providing a blue film electroplating equipment with a high degree of automation, high production efficiency and high yield, fixing the material sheet 16 by the adsorption effect of the flip suction cup 9.3, and there is no rigid extrusion between the material sheet 16, which can avoid the damage to the material sheet 16 caused by manual operation errors or deformation of the hanger in the prior art, and can improve the yield rate; using the flip suction cup 9.3 to automatically transfer the material sheet 16 between the material transfer mechanism and the electroplating tank 9.1, the production efficiency can be improved; through the structural design of the liquid inflow pipe 9.2-6, the blowing cavity 9.3-7, the material sorting mechanism 13, the offset material transfer component 6.5, etc., the electroplating process is optimized and the product quality is improved.

[0169] The above detailed description of the embodiments of the present application is only a preferred embodiment of the present application and cannot be considered to limit the scope of implementation of the present application. All equivalent changes and improvements made within the scope of the present application should still fall within the scope of the patent coverage of the present application.

Claims

1. A blue film electroplating equipment, characterized in that: include: Equipment housing; A master control machine, used to regulate the operation of the electroplating equipment; The material conveying mechanism at least comprises a first material conveying mechanism and a second material conveying mechanism which are arranged in parallel and have opposite conveying directions; An electroplating system, which is arranged at the intersection of the first material feeding mechanism and the second material feeding mechanism, and comprises at least an electroplating tank, a liquid supply mechanism and a flip suction cup, wherein the liquid supply mechanism can supply electroplating liquid to the electroplating tank, and the flip suction cup can flip the sucked material sheet into the electroplating tank; Wherein, an anode screen is provided in the electroplating tank, the contact surface between the flip suction cup and the material sheet is a cathode orifice plate, and the anode screen is connected to the cathode orifice plate through an external circuit; A quality inspection system is provided between the first material conveying mechanism and the electroplating system, and the quality inspection system can perform quality inspection on the material sheet with the surface to be plated facing upwards; A third material feeding mechanism is provided at the intersection of the first material feeding mechanism and the second material feeding mechanism, and the third material feeding mechanism transfers materials between the loading end and the unloading end of the electroplating system, wherein the material transfer position and the material transfer position are alternately configured, and the material transfer synchronous wheel which is transmission-connected with the material transfer position is provided in the material transfer position; when the flip suction cup is located in the material transfer position, its top surface is aligned with the top surface of the material transfer position, and the material transfer synchronous wheel passes through the top surface of the flip suction cup; A suction cup bracket is provided outside the electroplating tank, and a suction cup flip shaft is pivotally connected to the suction cup bracket. Both ends of the suction cup flip shaft are respectively connected to the flip suction cup and a suction cup flip motor. The suction cup flip motor can drive the flip suction cup to rotate around the suction cup flip shaft to: an electroplating station in the electroplating tank, an initial station outside the electroplating tank, or a drainage station above the electroplating tank. At the electroplating station and the initial station, the cathode orifice plate is horizontal and faces opposite directions.

2. The blue film electroplating equipment according to claim 1, characterized in that: The output end of the suction cup flip motor is provided with a series rod, and a plurality of transmission components are arranged on the series rod, and the plurality of transmission components are respectively connected to different suction cup flip shafts; The suction cup flip axis is arranged in the same direction as the diagonal of the flip suction cup, and the transmission assembly includes a suction cup synchronous belt, a suction cup synchronous wheel and a bevel gear. The suction cup synchronous wheel is respectively provided with a group at the top and bottom ends of the suction cup bracket and is driven by the suction cup synchronous belt, and the bevel gear is respectively provided with a group at the power input end of the suction cup synchronous wheel and the series rod and is meshed for transmission.

3. The blue film electroplating equipment according to any one of claims 1-2, characterized in that: The flip suction cup comprises a shell, the shell is in the shape of a groove with one end open, the cathode orifice plate is at the open end of the shell, and is sealed and connected to the shell to form a negative pressure chamber; the shell is provided with an exhaust pipe connected to the negative pressure chamber, and the other end of the exhaust pipe is connected to a vacuum generator; The outer periphery of the shell is provided with an air blowing cavity in the same direction as its opening, the air blowing cavity is connected with an air inlet pipe, and the other end of the air inlet pipe is connected to an air source.

4. The blue film electroplating equipment according to claim 3, characterized in that: The third material transmission mechanism is provided with a plurality of first leveling bolts, and the flip suction cup is provided with a plurality of second leveling bolts. Both the first leveling bolts and the second leveling bolts can move along the thickness direction of the flip suction cup. When the flip suction cup is located in the handover material position, the first leveling bolts abut against the flip suction cup. When the flip suction cup is located in the electroplating tank, the second leveling bolts abut against the electroplating tank.

5. The blue film electroplating equipment according to claim 4, characterized in that: A material sorting mechanism is provided on the outer side of the flip suction cup, and the material sorting mechanism comprises: A first material sorting component is located outside a group of opposite sides of the flip suction cup close to the material transfer mechanism, the first material sorting component includes a first material sorting cylinder, a guide block and a first material sorting plate, the first material sorting cylinder is used to lift the guide block, the top of the guide block is provided with a straight slot extending along the material transfer direction of the third material transfer mechanism, a sliding member connected to the first material sorting plate is slidably provided in the straight slot, and a material sorting plate rotating shaft connecting the first material sorting plate and the third material transfer mechanism is provided above the sliding member; A second material sorting component is located outside another set of opposite sides of the flip suction cup, and the second material sorting component includes a second material sorting cylinder and a second material sorting plate. The piston rod of the second material sorting cylinder is horizontally arranged and connected to the second material sorting plate. The second material sorting plate is driven by the second material sorting cylinder to approach or move away from the flip suction cup.

6. The blue film electroplating equipment according to any one of claims 1-2, 4-5, characterized in that: The electroplating tank comprises a bottom plate, an outer plate and an inner partition plate, wherein the height of the inner partition plate is smaller than that of the outer plate, a plurality of the inner partition plates enclose an electroplating area, and a plurality of the outer plates are located outside the inner partition plates and enclose an overflow tank with the inner partition plates; The anode mesh plate is located in the electroplating area, and a flow stabilizing orifice plate located above the anode mesh plate is provided in the electroplating area. The liquid supply mechanism supplies liquid to the electroplating area through a liquid supply pipe and a liquid inrush pipe. The electroplating liquid supplied by the liquid supply pipe forms a stable liquid surface after passing through the flow stabilizing orifice plate, and the electrolyte inrushed by the liquid inrush pipe forms a liquid column higher than the stable liquid surface; the electroplating area and the overflow tank return liquid to the liquid supply mechanism through a liquid return pipe and an overflow pipe respectively; The electroplating tank is at least partially light-transmissive, and the light-transmissive portion is provided with an LED light source.

7. The blue film electroplating equipment according to claim 6, characterized in that: The liquid supply mechanism comprises: A liquid storage tank, used for storing electroplating liquid; A liquid replenishing tube, used for replenishing liquid into the liquid storage tank; an emptying pipe, the input end of which is connected to the liquid supply pipe and is used to empty the electroplating liquid in the liquid supply pipe; A visual liquid level gauge, used to monitor the liquid level height of the liquid storage tank; A liquid level sensor, used to monitor whether the liquid level in the liquid storage tank exceeds a limit; A filter, used for filtering the return liquid of the return pipe and the overflow pipe; A heater, used for heating the electrolyte in the liquid storage tank; A temperature sensor, used to monitor the temperature of the electrolyte in the liquid storage tank; A magnetic suction pump, one output end of which is connected to the liquid supply pipe and / or the liquid inflow pipe through a one-way valve, and the other output end of which is connected to the liquid storage tank through a protective tube and a safety valve.

8. The blue film electroplating equipment according to any one of claims 1-2, 4-5, and 7, characterized in that: A pre-plating cleaning system is provided between the first material feeding mechanism and the electroplating system, and a fourth material feeding mechanism is provided between the pre-plating cleaning system and the quality inspection system. A material turning plate, a material turning motor, a material turning shaft and a material turning bracket are provided in the fourth material feeding mechanism. The extending direction of the material turning shaft is perpendicular to the material feeding direction of the first material feeding mechanism, and its two ends are rotatably arranged on the material turning bracket and fixedly connected to the output end of the material turning motor; the material turning plate is coaxially sleeved on the material turning shaft, and the material turning plate is provided with a sheet receiving groove which is concave toward the axis along its outer edge; At least one side of the material turning plate is provided with an offset material transfer assembly, and the offset material transfer assembly includes a plurality of groups of first material transfer devices, a plurality of groups of second material transfer devices, a scheduling base frame, a linear guide module 1, a scheduling driver, a scheduling lifting cylinder and a scheduling suction cup. The first material transfer device and the second material transfer device extend in the same direction as the first material transfer mechanism, and the scheduling base frame is straddled at both ends of the arrangement direction of the first material transfer device and the second material transfer device; the linear guide module 1 is constructed in the same direction as the scheduling base frame, and the scheduling suction cup is connected to the linear guide module 1 through a scheduling lifting cylinder, and the scheduling driver is used for driving the scheduling suction cup to move along the extension direction of the scheduling base frame.

9. The blue film electroplating equipment according to claim 8, characterized in that: A fifth material transfer mechanism is provided between the quality inspection system and the electroplating system, and a buffer mechanism is provided on the fifth material transfer mechanism, and the buffer mechanism includes a buffer material frame and a material frame lifting component; The buffer material frame comprises two groups of side panels and connecting pieces located at the top and bottom ends of the side panels, and the adjacent surfaces of the two groups of side panels are provided with a plurality of groups of supporting pieces of different heights, and at least one group of side panels is provided with a material transfer port corresponding to the position of the supporting piece; The material frame lifting assembly is used to lift the cache material frame, and includes: a material frame lifting base, a cache driver and a linear guide module 2. The linear guide module 2 is connected to the cache material frame through the material frame lifting base, and the cache driver is used to drive the linear guide module 2 to move.

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