Bending degree measuring device and skeleton

By attaching a conductive substrate and measuring resistance on the flexible circuit board, and determining the bending degree by using the test circuit and controller, the problems of inaccurate and high cost in the existing technology are solved, and more efficient and economical Bending degree measurement.

CN119223152APending Publication Date: 2024-12-31DONGGUAN DERUCCI BEDDING CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202411339014.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-25
Publication Date
2024-12-31

AI Technical Summary

Technical Problem

The existing bending degree measurement devices rely on pressure-sensitive sensors, resulting in inaccurate and expensive measurement results, especially more obvious when measuring at longer distances.

Method used

Design a bending degree measuring device, including a flexible circuit board and a conductive substrate attached in sequence along its length direction. Each conductive substrate is provided with a measuring resistance on one side of the circuit board, and the resistance value of the measurement node is determined by the test circuit and the controller. Determining the degree of bending overcomes the accuracy and cost issues of traditional devices.

Benefits of technology

Improves the accuracy and anti-interference capability of bending degree measurement, while reducing the cost of the device, and is suitable for bending degree measurements of various portable devices and wearable devices.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119223152A_ABST
    Figure CN119223152A_ABST
Patent Text Reader

Abstract

The invention discloses a bending degree measuring device and a skeleton. The bending degree measuring device comprises a flexible circuit board; the n conductive substrates are sequentially attached to the flexible circuit board in the first direction; the n measuring resistors are arranged on the sides, away from the flexible circuit board, of the conductive substrates in a one-to-one correspondence mode; when the flexible circuit board is bent, the connection state between the measuring resistors is changed; the test circuit comprises a first power supply end, a second power supply end, a divider resistor and a measurement node; the divider resistor is connected with the first power supply end, and the measuring resistor located at the first arrangement position is connected with the divider resistor through a measuring node; the measuring resistor located at the last arrangement position is connected with a second power supply end; the controller is connected with the test circuit; the controller is used for obtaining the resistance value of the measuring node and determining the bending degree of the flexible circuit board according to the resistance value. According to the technical scheme, the cost of the bending degree measuring device can be reduced, and meanwhile the anti-interference capability of the bending degree measuring device can be improved.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The invention relates to the technical field of bending degree measurement, and in particular to a bending degree measurement device and a slat frame. Background Art

[0002] Circuit boards can carry various electronic components to achieve electrical connections between them, thereby realizing various functions of the device. Flexible circuit boards are widely used in various portable devices and wearable devices due to their bendable, foldable and curlable properties.

[0003] At present, for the bending degree measurement device, the pressure-sensitive sensor is mainly used to sense the pressure degree. However, the signal of the pressure-sensitive sensor is extremely small and is easily affected by the surrounding environment, thus affecting the accuracy of the bending degree measurement result. In addition, due to the high price of the pressure-sensitive sensor, when it comes to the bending degree measurement over a long distance, the bending degree measurement device is expensive. Summary of the invention

[0004] The invention provides a bending degree measuring device and a slat frame to solve the problems existing in the prior art, reduce the cost of the bending degree measuring device and improve the anti-interference ability of the bending degree measuring device.

[0005] In a first aspect, the present invention provides a bending degree measuring device, comprising:

[0006] Flexible circuit boards;

[0007] n conductive substrates are sequentially attached to the flexible circuit board along a first direction; the distance d between two adjacent conductive substrates is ≥ 0; the first direction is the length direction of the flexible circuit board; n ≥ 2;

[0008] n measuring resistors are arranged one by one on a side of each conductive substrate away from the flexible circuit board; when the flexible circuit board is bent, the connection state between the measuring resistors changes;

[0009] The test circuit comprises a first power supply terminal, a second power supply terminal, a voltage-dividing resistor and a measuring node; the voltage-dividing resistor is connected to the first power supply terminal, the measuring resistor at the first position is connected to the voltage-dividing resistor through the measuring node; the measuring resistor at the last position is connected to the second power supply terminal;

[0010] A controller is connected to the test circuit; the controller is used to obtain the resistance value of the measurement node and determine the bending degree of the flexible circuit board according to the resistance value.

[0011] Optionally, each of the conductive substrates is attached to the first surface of the flexible circuit board, and when the flexible circuit board is not bent, there is a gap between adjacent conductive substrates, and when the flexible circuit board is bent toward the first surface, adjacent conductive substrates are in contact at the bent portion;

[0012] Along the first direction, the measurement resistors arranged in sequence are respectively the first measurement resistor to the nth measurement resistor; an end of each measurement resistor close to the first power supply end is a first end, and an end of each measurement resistor close to the second power supply end is a second end;

[0013] The first end of the first measuring resistor is connected to the voltage-dividing resistor, and the second end of the first measuring resistor is connected to the second end of the second measuring resistor; the first end of the i-1th measuring resistor is connected to the second end of the i-th measuring resistor, and the first end of the i-th measuring resistor is connected to the second end of the i+1th measuring resistor; the first end of the nth measuring resistor is connected to the second power supply end; wherein 3≤i≤n-1, and i is an integer.

[0014] Optionally, the resistance values ​​of each measuring resistor are equal; the controller is used to determine the bending degree P = j / n of the flexible circuit board when the first resistance value K = (nj)k of the measuring node; wherein j is the number of the short-circuited measuring resistors; and k is the resistance value of each measuring resistor.

[0015] Optionally, each of the conductive substrates is attached to the first surface of the flexible circuit board, and when the flexible circuit board is not bent, there is a gap between adjacent conductive substrates, and when the flexible circuit board is bent toward the first surface, adjacent conductive substrates are in contact at the bent portion;

[0016] Along the first direction, the measurement resistors arranged in sequence are respectively the first measurement resistor to the nth measurement resistor; an end of each measurement resistor close to the first power supply end is a first end, and an end of each measurement resistor close to the second power supply end is a second end;

[0017] The first end of the first measuring resistor is connected to the voltage dividing resistor; the first end of the i-th measuring resistor is connected to the first end of the i+1-th measuring resistor through a resistor of a certain value; the first end of the n-th measuring resistor is connected to the second power supply end through a resistor of a certain value; wherein 2≤i≤n-1, and i is an integer.

[0018] Optionally, the resistance values ​​of each of the measuring resistors are equal; the controller is used to determine the bending degree P = j / n of the flexible circuit board when the measured first resistance value K = (nj)r + j [rk / (r + k)]; wherein r is the resistance value of each of the fixed resistors; k is the resistance value of each of the measuring resistors; and j is the number of the conductive substrates in contact.

[0019] Optionally, each of the conductive substrates is attached to the second surface of the flexible circuit board, and when the flexible circuit board is not bent, the adjacent conductive substrates are in contact, and when the flexible circuit board is bent toward the first surface, there is a gap between the adjacent conductive substrates in the bent portion; wherein the first surface and the second surface are two opposite surfaces of the flexible circuit board respectively;

[0020] Along the first direction, the measurement resistors arranged in sequence are respectively the first measurement resistor to the nth measurement resistor; an end of each measurement resistor close to the first power supply end is a first end, and an end of each measurement resistor close to the second power supply end is a second end;

[0021] The first end of the first measuring resistor is connected to the voltage dividing resistor; the first end of the i-th measuring resistor is connected to the first end of the i+1-th measuring resistor through a resistor of a certain value; the first end of the n-th measuring resistor is connected to the second power supply end through a resistor of a certain value; wherein 2≤i≤n-1, and i is an integer.

[0022] Optionally, the controller is used to determine the bending degree P = j / n of the flexible circuit board when the first resistance value K = (nj)rk / (r+k)+jr of the measuring node, wherein r is the resistance value of each of the fixed resistors; k is the resistance value of each of the measuring resistors; and j is the number of the conductive substrates with gaps.

[0023] Optionally, the flexible circuit board includes at least one critical position and a non-critical position, the resistance value of the measuring resistor set on each of the conductive substrates attached to the critical position is k1, and the resistance value of the measuring resistor set on each of the conductive substrates attached to the non-critical position is k2.

[0024] Optionally, the measuring resistor is a chip resistor.

[0025] In a second aspect, the present invention provides a rib rack, comprising: a plurality of rib strips and a bending degree measuring device as described in any one of claims 1 to 9 arranged on at least one of the rib strips.

[0026] The technical solution of the present invention is that the bending degree measuring device includes a flexible circuit board, n conductive substrates are sequentially attached to the flexible circuit board along a first direction, n measuring resistors are arranged one by one on the side of each conductive substrate away from the flexible circuit board, and the test circuit includes a first power supply terminal, a second power supply terminal, a voltage-dividing resistor and a measuring node, the voltage-dividing resistor is connected to the first power supply terminal, the measuring resistor at the first position in the arrangement is connected to the voltage-dividing resistor through the measuring node, and the measuring resistor at the last position in the arrangement is connected to the second power supply terminal. When the flexible circuit board is bent, the connection state between the measuring resistors changes, so that the controller of the bending degree measuring device can determine the bending degree of the flexible circuit board according to the resistance value of the measuring node, thereby overcoming the shortcomings of inaccurate measurement results and high cost of the bending degree measuring device relying on the pressure-sensitive sensor, which is beneficial to reducing the cost of the bending degree measuring device and improving the anti-interference ability of the bending degree measuring device.

[0027] It should be understood that the contents described in this section are not intended to identify the key or important features of the embodiments of the present invention, nor are they intended to limit the scope of the present invention. Other features of the present invention will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0029] Figure 1 A top view of a bending degree measuring device provided by an embodiment of the present invention;

[0030] Figure 2 A partial side view of a bending degree measuring device provided by an embodiment of the present invention;

[0031] Figure 3 A schematic diagram of a test circuit when a flexible printed circuit board is not bent provided by an embodiment of the present invention;

[0032] Figure 4 A schematic diagram of a test circuit when another flexible printed circuit board provided by an embodiment of the present invention is not bent;

[0033] Figure 5 A partial side view of another bending degree measuring device provided by an embodiment of the present invention;

[0034] Figure 6 A schematic diagram of a test circuit when another flexible printed circuit board is not bent is provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0035] In order to enable those skilled in the art to better understand the scheme of the present invention, the technical scheme in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0036] It should be noted that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the numbers used in this way can be interchanged where appropriate, so that the embodiments of the present invention described herein can be implemented in an order other than those illustrated or described herein.

[0037] This embodiment provides a bending degree measuring device, Figure 1 A top view of a bending degree measuring device provided by an embodiment of the present invention, Figure 2 A partial side view of a bending degree measuring device provided by an embodiment of the present invention, Figure 3 A schematic diagram of a test circuit when a flexible circuit board is not bent provided by an embodiment of the present invention, referring to Figures 1 to 3 As shown, the bending degree measuring device includes: a flexible circuit board 1, n conductive substrates 2, n measuring resistors 3, a test circuit 4 and a controller R_TEST. Each conductive substrate 2 is sequentially attached to the flexible circuit board 1 along the first direction L1, and each measuring resistor 3 is arranged one by one on the side of each conductive substrate 2 away from the flexible circuit board 1. When the flexible circuit board 1 is bent, the connection state between each measuring resistor 3 changes. The test circuit 4 includes a first power supply terminal 41, a second power supply terminal 42, a voltage divider resistor 43 and a measuring node 44. The voltage divider resistor 43 is connected to the first power supply terminal 41, the measuring resistor 3 at the first position is connected to the voltage divider resistor 43 through the measuring node 44, and the measuring resistor 3 at the last position is connected to the second power supply terminal 42. The controller R_TEST is connected to the test circuit 4, and the controller R_TEST is used to obtain the resistance value of the measuring node 44, and determine the bending degree of the flexible circuit board 1 according to the resistance value of the measuring node 44.

[0038] The distance d between two adjacent conductive substrates 2 is ≥ 0; the first direction L1 is the length direction of the flexible circuit board 1; and n is ≥ 2.

[0039] The distance between two adjacent conductive substrates 2 is the distance between adjacent edges of the two adjacent conductive substrates 2. The distance d≥0 between two adjacent conductive substrates 2 can be understood as the distance between the two adjacent conductive substrates 2 is 0, that is, the two adjacent conductive substrates 2 are in contact, or the distance between the two adjacent conductive substrates 2 is greater than 0, that is, there is a gap between the two adjacent conductive substrates 2. It should be noted that when the distance between the two adjacent conductive substrates 2 is greater than 0, it is necessary to ensure that the two adjacent conductive substrates 2 are in contact when the flexible circuit board 1 is bent to a certain extent, so that when the flexible circuit board 1 is bent, the connection state between the measuring resistors 3 changes. In an exemplary embodiment, the value range of the distance d between the two adjacent substrates is: 0≤d≤0.5mm.

[0040] It can be understood that the greater the distance between two adjacent conductive substrates 2, the less sensitive the measurement of the degree of bending is, that is, the lower the sensitivity of the bending degree measuring device; the smaller the distance, the more sensitive the measurement of the degree of bending is, that is, the higher the sensitivity of the bending degree measuring device. Therefore, in actual applications, the distance between two adjacent conductive substrates 2 can be determined according to actual application requirements and manufacturing process capabilities.

[0041] The test circuit 4 of the bending degree measuring device can be embedded in the flexible circuit board 1, and it can be bent. When the flexible circuit board 1 is used as a carrier of the bending degree measuring device, the bending degree of the object can be measured by attaching the flexible circuit board 1 to an object whose bending degree needs to be measured, which is conducive to the miniaturization and lightweight of the bending degree measuring device.

[0042] It should be noted that the material and size of the flexible circuit board 1 are determined according to actual application requirements. In an optional embodiment, the material of the flexible circuit board 1 is polyimide; the length of the flexible circuit board 1 is 500 mm, the width is 10 mm, and the thickness is 0.1 mm.

[0043] The material of the conductive substrate 2 may include but is not limited to a metal substrate. In an exemplary embodiment, the conductive substrate 2 is a copper substrate.

[0044] The size of the conductive substrate 2 can be set according to the requirements of the application scenario of the bending degree measuring device. In an optional embodiment, the thickness of the conductive substrate 2 is 0.1 mm, and the length of the conductive substrate 2 is 10 mm.

[0045] The measuring resistor 3 is a fixed value resistor. The resistance of each measuring resistor 3 may be equal or unequal. The resistance of the measuring resistor 3 may be determined according to actual needs. In an optional embodiment, the resistance of each measuring resistor 3 is 10Ω.

[0046] The connection state between the measuring resistors 3 may include, but is not limited to, two adjacent measuring resistors 3 being unconnected, two adjacent measuring resistors 3 being connected, and the like.

[0047] In an optional embodiment, the measuring resistor 3 is a chip resistor. Since the chip resistor is small in size, light in weight, and has strong anti-interference ability, it is beneficial to improve the anti-interference ability of the bending degree measuring device, and at the same time, it is beneficial to miniaturize the bending degree measuring device. Exemplarily, lead-free solder is used to solder each chip resistor one by one to each conductive substrate 2, the welding temperature is 200°C, and the welding time is 5 minutes; after the welding is completed, the welding quality of each chip resistor is checked to ensure that each chip resistor is firmly soldered without cold soldering.

[0048] The first power supply terminal 41 and the second power supply terminal 42 are two voltage source terminals that can provide different voltages, so that when the connection state of the measuring resistor 3 changes, the resistance value of the measuring node 44 changes, so that the controller R_TEST can determine the bending degree of the flexible circuit board 1 according to the obtained resistance value of the measuring node 44. In an optional embodiment, the first power supply terminal 41 is a positive voltage source terminal VCC, and the second power supply terminal 42 is a ground terminal, so that the structure of the bending degree measuring device can be simplified, which is conducive to further reducing costs.

[0049] Each conductive substrate 2 is sequentially attached to the flexible circuit board 1 along the first direction L1, and each measuring resistor 3 is arranged on each conductive substrate 2 in a one-to-one correspondence, so that when the flexible circuit board 1 is bent, the connection relationship between the adjacent conductive substrates 2 in the bending portion changes, resulting in a change in the connection state between each measuring resistor 3 on the corresponding conductive substrate 2. The greater the bending degree of the flexible circuit board 1, the more the number of conductive substrates 2 in the bending portion, and thus the more the number of measuring resistors 3 whose connection state changes. Since the voltage-dividing resistor 43 is connected to the first power supply terminal 41, the measuring resistor 3 at the first position of the arrangement is connected to the voltage-dividing resistor 43 through the measuring node 44, and the measuring resistor 3 at the last position of the arrangement is connected to the second power supply terminal 42, so that when the connection state between each measuring resistor 3 changes, the test circuit 4 changes, so that the resistance value of the measuring node 44 changes, so that the controller R_TEST can determine the bending degree of the flexible circuit board 1 according to the resistance value of the measuring node 44.

[0050] It should be noted that when each conductive substrate 2 is sequentially attached to the flexible circuit board 1 along the first direction L1, when the flexible circuit board 1 is not bent, there may be a gap between each adjacent two conductive substrates 2, or they may be in contact with each other. If there is a gap between each adjacent two conductive substrates 2 when the flexible circuit board 1 is not bent, when the flexible circuit board 1 is bent, the adjacent conductive substrates 2 in the bent portion are in contact, so that each measuring resistor 3 on the corresponding conductive substrate 2 is in contact. On the contrary, if each adjacent two conductive substrates 2 are in contact when the flexible circuit board 1 is not bent, when the flexible circuit board 1 is bent, there is a gap between the adjacent conductive substrates 2 in the bent portion, so that each measuring resistor 3 on the corresponding conductive substrate 2 is in contact.

[0051] In this embodiment, the bending degree measuring device includes a flexible circuit board, and n conductive substrates are sequentially attached to the flexible circuit board along a first direction, and n measuring resistors are arranged one by one on the side of each conductive substrate facing away from the flexible circuit board, and the test circuit includes a first power supply terminal, a second power supply terminal, a voltage-dividing resistor and a measuring node, the voltage-dividing resistor is connected to the first power supply terminal, the measuring resistor at the first position in the arrangement is connected to the voltage-dividing resistor through the measuring node, and the measuring resistor at the last position in the arrangement is connected to the second power supply terminal. When the flexible circuit board is bent, the connection state between the measuring resistors changes, so that the controller of the bending degree measuring device can determine the bending degree of the flexible circuit board according to the resistance value of the measuring node, thereby overcoming the shortcomings of inaccurate measurement results and high cost of the bending degree measuring device relying on the pressure-sensitive sensor, which is beneficial to reducing the cost of the bending degree measuring device and improving the anti-interference ability of the bending degree measuring device.

[0052] It should be noted that the flexible circuit board 1 includes a first surface S1 and a second surface S2 which are opposite to each other. Figure 1 The example only shows that each conductive substrate is attached to the first surface S1 of the flexible circuit board 1, and does not limit the relative position of each conductive substrate and the flexible circuit board 1. In an exemplary embodiment, each conductive substrate can also be attached to the second surface S2 of the flexible circuit board 1. In other embodiments, the first surface S1 and the second surface S2 of the flexible circuit board 1 are both attached with conductive substrates.

[0053] Optional, continue to refer to Figure 1-Figure 3As shown, each conductive substrate 2 is attached to the first surface S1 of the flexible circuit board 1. When the flexible circuit board 1 is not bent, there is a gap between adjacent conductive substrates 2. When the flexible circuit board 1 is bent toward the first surface S1, adjacent conductive substrates 2 are in contact in the bent portion. Along the first direction L1, the measuring resistors 3 arranged in sequence are the first measuring resistor to the nth measuring resistor. The end of each measuring resistor 3 close to the first power supply terminal 41 is the first end, and the end close to the second power supply terminal 42 is the second end; the first end of the first measuring resistor R1 is connected to the voltage dividing resistor 43, and the second end of the first measuring resistor R1 is connected to the second end of the second measuring resistor R2; the first end of the i-1th measuring resistor Ri-1 is connected to the second end of the i-th measuring resistor Ri, the first end of the i-th measuring resistor Ri is connected to the second end of the i+1th measuring resistor Ri+1, and the first end of the n-th measuring resistor Rn is connected to the second power supply terminal 42, so that when the flexible circuit board 1 is not bent, When the flexible circuit board 1 is bent toward the first surface S1, the measuring resistors 3 are connected in series. At this time, if the resistance values ​​of the measuring resistors 3 are equal, the second resistance value K2 of the measuring node is K2=nk. When the flexible circuit board 1 is bent toward the first surface S1, the adjacent conductive substrates 2 are in contact in the bent portion, so that the resistances corresponding to the conductive substrates 2 in contact with each other are short-circuited. At this time, the first resistance value K1 of the measuring node is K2=K2-jk=(nj)k, so that the controller R_TEST can determine the bending degree P=P=j / n of the flexible circuit board 1 when the first resistance value K1 of the measuring node is K1=(nj)k.

[0054] Wherein, 3≤i≤n-1, and i is an integer; j is the number of short-circuited measuring resistors 3; and k is the resistance value of each measuring resistor 3.

[0055] Optional, Figure 4 Another schematic diagram of a test circuit when the flexible circuit board is not bent provided by the embodiment of the present invention, combined with reference Figure 1 , Figure 2 and Figure 4As shown, each conductive substrate 2 is attached to the first surface S1 of the flexible circuit board 1. When the flexible circuit board 1 is not bent, there is a gap between adjacent conductive substrates 2. When the flexible circuit board 1 is bent toward the first surface S1, the adjacent conductive substrates 2 in the bent portion are in contact. Along the first direction L1, the measuring resistors 3 arranged in sequence are the first measuring resistor R1 to the nth measuring resistor Rn. The end of each measuring resistor 3 close to the first power supply terminal 41 is the first end, and the end close to the second power supply terminal 42 is the second end; the first end of the first measuring resistor R1 is connected to the voltage dividing resistor 43; the first end of the i-th measuring resistor Ri is connected to the first end of the i+1-th measuring resistor Ri+1 through a constant value resistor R, and the first end of the n-th measuring resistor Rn is connected to the second power supply terminal 42 through a constant value resistor R, so that when the flexible circuit board 1 is not bent, since the second end of each measuring resistor 3 is empty, each measuring resistor 3 is disconnected. At this time, each fixed value resistor R is connected in series with the voltage dividing resistor 43 and the second power supply terminal 42, so that the measuring node The second resistance K=nr, and when the flexible circuit board 1 bends toward the first surface S1, the adjacent conductive substrates 2 in the bending portion are in contact, so that the measuring resistors 3 corresponding to the mutually contacting conductive substrates 2 are in contact, and the contacting measuring resistors 3 are connected to the test circuit 4. At this time, the measuring resistor 3 connected to the test circuit 4 is connected in parallel with its corresponding fixed resistor R, so that the first resistance K of the measuring node is K=(nj)r+j[rk / (r+k)]; thus, the controller R_TEST can determine the bending degree P=j / n of the flexible circuit board 1 when the first resistance K=(nj)r+j[rk / (r+k)] at the measuring node 44 is K=(nj)r+j[rk / (r+k)].

[0056] Wherein, 2≤i≤n-1, and i is an integer; r is the resistance value of each fixed resistor R; k is the resistance value of each measuring resistor 3; and j is the number of the conductive substrates 2 in contact.

[0057] Optional, Figure 5 A partial side view of another bending degree measuring device provided by an embodiment of the present invention, Figure 6 A schematic diagram of a test circuit when another flexible circuit board is not bent provided by an embodiment of the present invention, combined with reference to Figure 5 and Figure 6As shown, each conductive substrate 2 is attached to the second surface S2 of the flexible circuit board 1. When the flexible circuit board 1 is not bent, the adjacent conductive substrates 2 are in contact. When the flexible circuit board 1 is bent toward the first surface S1, there is a gap between the adjacent conductive substrates 2 in the bent portion. Along the first direction L1, the measuring resistors 3 arranged in sequence are the first measuring resistor R1 to the nth measuring resistor Rn. The end of each measuring resistor 3 close to the first power supply terminal 41 is the first end, and the end close to the second power supply terminal 42 is the second end; the first end of the first measuring resistor R1 is connected to the voltage divider resistor 43, the first end of the i-th measuring resistor Ri is connected to the first end of the i+1-th measuring resistor Ri+1 through a constant value resistor R, and the first end of the n-th measuring resistor is connected to the second power supply terminal 42 through a constant value resistor R, so that when the flexible circuit board 1 is not bent, due to the contact of the adjacent conductive substrates 2, each measuring resistor 3 is connected in parallel with its corresponding constant value resistor R and then connected in series with each other. At this time, the second resistance K2 of the measuring node is equal to nrk / (r+k), and when the flexible circuit board 1 is bent toward the first surface S1, due to the gap between the adjacent conductive substrates 2 in the bending portion, the second ends of the measuring resistors 3 located at the bending portion are left empty, so that the measuring resistors 3 located in the outer area are disconnected. Therefore, when the flexible circuit board 1 is bent toward the first surface S1, the first resistance value K1 of the measuring node 44 is measured to be (nj)rk / (r+k)+jr, so that the controller R_TEST can determine the bending degree P=j / n of the flexible circuit board 1 when the first resistance value K1 of the measuring node 44 is measured to be (nj)rk / (r+k)+jr.

[0058] Wherein, 2≤i≤n-1, and i is an integer; r is the resistance value of each fixed resistor R; k is the resistance value of each measuring resistor 3; and j is the number of conductive substrates 2 with gaps.

[0059] Optionally, the flexible circuit board 1 includes at least one critical position and a non-critical position, the resistance value of the resistor set on each conductive substrate 2 attached to the critical position is k1, and the resistance value of the measuring resistor set on each conductive substrate 2 attached to the non-critical position is k2.

[0060] Among them, the key position can be understood as the position where the bending degree needs to be focused on, and the non-key position can be understood as the position other than the position where the bending degree needs to be focused on. By setting the resistance value of the measuring resistor 3 on each conductive substrate 2 attached to the key position of the flexible circuit board 1 to k1, and setting the resistance value of the measuring resistor 3 on each conductive substrate 2 attached to the non-key position of the flexible circuit board 1 to k2, the first resistance value of the measuring node can reflect the bending degree of the key position and the non-key position, so that it can be determined whether the key position of the flexible circuit board 1 is bent according to the first resistance value of the measuring node.

[0061] Based on the same concept, the present embodiment also provides a rib frame, which includes a plurality of rib strips and a bending degree measuring device provided by any embodiment of the present invention arranged on at least one rib strip. Therefore, the rib frame provided by the present embodiment has the corresponding structure and characteristics of the bending degree measuring device provided by any of the above embodiments, and can achieve the beneficial effects of the bending degree measuring device provided by any of the above embodiments. The similarities can be referred to the above description.

[0062] The above specific implementations do not constitute a limitation on the protection scope of the present invention. It should be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions can be made according to design requirements and other factors. Any modification, equivalent substitution and improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims

1. A bending degree measuring device, characterized in that: include: Flexible circuit boards; n conductive substrates sequentially attached to the flexible circuit board along a first direction; The distance d between two adjacent conductive substrates is ≥ 0; the first direction is the length direction of the flexible circuit board; n is ≥ 2; n measuring resistors are arranged one by one on a side of each conductive substrate away from the flexible circuit board; when the flexible circuit board is bent, the connection state between the measuring resistors changes; The test circuit comprises a first power supply terminal, a second power supply terminal, a voltage-dividing resistor and a measuring node; the voltage-dividing resistor is connected to the first power supply terminal, the measuring resistor at the first position is connected to the voltage-dividing resistor through the measuring node; the measuring resistor at the last position is connected to the second power supply terminal; A controller is connected to the test circuit; the controller is used to obtain the resistance value of the measurement node and determine the bending degree of the flexible circuit board according to the resistance value.

2. The bending degree measuring device according to claim 1, characterized in that: Each of the conductive substrates is attached to the first surface of the flexible circuit board. When the flexible circuit board is not bent, there is a gap between adjacent conductive substrates. When the flexible circuit board is bent toward the first surface, adjacent conductive substrates are in contact at the bent portion. Along the first direction, the measurement resistors arranged in sequence are respectively the first measurement resistor to the nth measurement resistor; an end of each measurement resistor close to the first power supply end is a first end, and an end of each measurement resistor close to the second power supply end is a second end; The first end of the first measuring resistor is connected to the voltage-dividing resistor, and the second end of the first measuring resistor is connected to the second end of the second measuring resistor; the first end of the i-1th measuring resistor is connected to the second end of the i-th measuring resistor, and the first end of the i-th measuring resistor is connected to the second end of the i+1th measuring resistor; the first end of the nth measuring resistor is connected to the second power supply end; wherein 3≤i≤n-1, and i is an integer.

3. The bending degree measuring device according to claim 2, characterized in that: The resistance values ​​of the measuring resistors are equal; the controller is used to determine the bending degree P=j / n of the flexible circuit board when the first resistance value K=(nj)k of the measuring node; wherein j is the number of the measuring resistors that are short-circuited; and k is the resistance value of each measuring resistor.

4. The bending degree measuring device according to claim 1, characterized in that: Each of the conductive substrates is attached to the first surface of the flexible circuit board. When the flexible circuit board is not bent, there is a gap between adjacent conductive substrates. When the flexible circuit board is bent toward the first surface, adjacent conductive substrates are in contact at the bent portion. Along the first direction, the measurement resistors arranged in sequence are respectively the first measurement resistor to the nth measurement resistor; an end of each measurement resistor close to the first power supply end is a first end, and an end of each measurement resistor close to the second power supply end is a second end; The first end of the first measuring resistor is connected to the voltage dividing resistor; the first end of the i-th measuring resistor is connected to the first end of the i+1-th measuring resistor through a resistor of a certain value; the first end of the n-th measuring resistor is connected to the second power supply end through a resistor of a certain value; wherein 2≤i≤n-1, and i is an integer.

5. The bending degree measuring device according to claim 4, characterized in that: The resistance values ​​of the measuring resistors are equal; the controller is used to determine the bending degree P = j / n of the flexible circuit board when the measured first resistance value K = (nj)r + j [rk / (r + k)]; wherein r is the resistance value of each of the fixed resistors; k is the resistance value of each of the measuring resistors; and j is the number of the conductive substrates in contact.

6. The bending degree measuring device according to claim 1, characterized in that: Each of the conductive substrates is attached to the second surface of the flexible circuit board. When the flexible circuit board is not bent, the adjacent conductive substrates are in contact. When the flexible circuit board is bent toward the first surface, there is a gap between the adjacent conductive substrates in the bent portion. The first surface and the second surface are two opposite surfaces of the flexible circuit board. Along the first direction, the measurement resistors arranged in sequence are respectively the first measurement resistor to the nth measurement resistor; an end of each measurement resistor close to the first power supply end is a first end, and an end of each measurement resistor close to the second power supply end is a second end; The first end of the first measuring resistor is connected to the voltage dividing resistor; the first end of the i-th measuring resistor is connected to the first end of the i+1-th measuring resistor through a resistor of a certain value; the first end of the n-th measuring resistor is connected to the second power supply end through a resistor of a certain value; wherein 2≤i≤n-1, and i is an integer.

7. The bending degree measuring device according to claim 6, characterized in that: The controller is used to determine the bending degree P=j / n of the flexible circuit board when the first resistance value K=(nj)rk / (r+k)+jr of the measuring node, wherein r is the resistance value of each of the fixed resistors; k is the resistance value of each of the measuring resistors; and j is the number of the conductive substrates with gaps.

8. The bending degree measuring device according to claim 1, characterized in that: The flexible circuit board includes at least one critical position and a non-critical position, the resistance value of the measuring resistor set on each of the conductive substrates attached to the critical position is k1, and the resistance value of the measuring resistor set on each of the conductive substrates attached to the non-critical position is k2.

9. The bending degree measuring device according to any one of claims 1 to 8, characterized in that: The measuring resistor is a chip resistor.

10. A rib frame, characterized in that: include: A plurality of bone ribs and a bending degree measuring device as described in any one of claims 1 to 9 arranged on at least one of the bone ribs.