Detection method for semiconductor device

Abstract

The invention relates to the technical field of semiconductor device detection, and discloses a semiconductor device detection method, which comprises the following steps: marking the surface of a welding pin in a sample to be detected as a welding surface; executing a pretreatment strategy on the detection group and the grinding surface to obtain all grinding lines on the grinding surface; recording a connecting line segment of the welding surface and the grinding surface as a reference line segment; marking two side edges, perpendicular to the reference line segment, on the grinding surface as a starting side edge and a terminating side edge respectively; obtaining a midpoint of the reference line segment, drawing a straight line parallel to the starting side edge through the midpoint, and recording the straight line as a bisecting straight line; obtaining a pin needing to be detected in the detection group, and recording the pin as a pin to be detected; marking a surface enclosed by the bisecting straight line and the starting side edge on the grinding surface as a first surface; a surface defined by the bisecting straight line and the terminating side edge on the grinding surface is marked as a second surface; and executing the grinding judgment strategy to obtain the grinding direction of the to-be-detected sample. And during grinding, the grinding direction is continuously changed, the grinding efficiency is improved, and time is saved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device detection, and in particular to a method for detecting a semiconductor device. Background Art

[0002] Semiconductor devices are an indispensable component of modern electronic devices. As the functions of integrated circuits become increasingly complex, the miniaturization of device sizes and the complexity of the production process are also increasing. Traditional visual and manual testing methods can no longer meet the needs of high precision and high efficiency, so automated and high-precision detection technologies have emerged. Modern semiconductor device detection technologies include but are not limited to optical detection, X-ray imaging, electron beam detection, and various electrical performance tests. Chip metallographic testing is a method of using microscopy technology to analyze the microstructure of semiconductor or metal materials. The key to this detection technology is to observe the crystal structure, defects, phase boundaries, etc. of the chip in detail to evaluate the quality and performance of the material. In the semiconductor manufacturing process, metallographic testing is used to identify possible problems in material processing, such as lattice dislocation, impurity aggregation or cracks, all of which may affect the electronic properties of the chip. Through metallographic analysis, the manufacturing process can be optimized, the output efficiency can be improved, and the reliability and performance of the final product can be ensured. This technology is one of the key steps to ensure the reliable operation of semiconductor equipment under high performance requirements.

[0003] The prior art requires metallographic sectioning to obtain the pins that need to be tested in the chip during sampling inspection, and grind the chip to the cross-section where the pins are located. The grinding direction is often unchanged. When there are multiple pins that need to be tested, the chip is only ground in one direction without considering the optimization of the direction during the grinding process, resulting in low grinding efficiency.

[0004] This solution proposes to continuously change the grinding direction during the grinding process by comparing the distances between the first mark execution line, the second mark execution line, the starting side edge and the ending side edge. Summary of the invention

[0005] The present invention provides a method for detecting a semiconductor device, which is used to facilitate solving the problems mentioned in the above background technology.

[0006] The present invention provides the following technical solution: a method for detecting a semiconductor device, comprising: Obtain the chip to be tested, which is recorded as the sample to be tested; The surface of the sample to be tested where the pins are welded is recorded as the welding surface; Obtain any two mutually parallel welding surfaces of the sample to be tested, and record them as a test group; Obtain any surface of the sample to be tested that does not have a soldered pin, and record it as the grinding surface; The connecting line segment between the welding surface and the grinding surface is recorded as the reference line segment; Execute the preprocessing strategy on the inspection group and the grinding surface to obtain all grinding lines on the grinding surface; The two sides perpendicular to the reference line segment on the grinding surface are respectively recorded as the starting side and the ending side; Get the midpoint of the reference line segment, and draw a straight line through the midpoint parallel to the starting side, which is recorded as the bisector line; Get the pins that need to be tested in the test group and record them as the pins to be tested; The surface enclosed by the bisector line and the starting side edge on the grinding surface is recorded as the first surface; The surface enclosed by the bisector line and the terminal side edge on the grinding surface is recorded as the second surface; The grinding line corresponding to the pin to be tested on the grinding surface is recorded as the execution line; Execute the determination grinding strategy to obtain the grinding direction of the sample to be tested.

[0007] Optionally, the pre-processing strategy is performed on the detection group and the grinding surface, including: For any weld surface in the inspection group: Get the location point of each pin; Draw a straight line perpendicular to the reference line segment through each position point on the welding surface, and the intersection with the reference line segment is recorded as the reference point; Draw a straight line perpendicular to the reference line segment through each reference point on the grinding surface, which is recorded as the grinding line.

[0008] Optionally, the pre-processing strategy is performed on the detection group and the grinding surface, including: The two welding surfaces in the inspection group are respectively recorded as a first welding surface and a second welding surface; Obtaining grinding lines corresponding to the first welding surface on the grinding surface to form a first grinding line set; Obtaining grinding lines corresponding to the second welding surface on the grinding surface to form a second grinding line set; Traverse the elements in the first grinding line set and the second grinding line set; All elements in the union of the first grinding line set and the second grinding line set are obtained to obtain all grinding lines on the grinding surface.

[0009] Optionally, the executing and determining the grinding strategy includes: Get the execution line closest to the bisector line and record it as the execution end line; When only the first side has an execution line: Grind the sample to be tested from the starting side to the execution end line; When grinding passes through each execution line, the pins to be tested on the execution line are tested; When only the second side has an execution line: Grind the sample to be tested from the end side to the execution end line; When grinding passes through each execution line, the pin to be inspected on the execution line is inspected.

[0010] Optionally, the executing and determining the grinding strategy includes: When execution lines exist on both the first and second sides: Obtain the execution line closest to the bisector line in the first face, and record it as the first marked execution line; Measure the distance between the first marking execution line and the starting side edge, and record it as the first starting distance; Obtain the execution line closest to the bisector line in the second face, and record it as the second marked execution line; Measure the distance from the second marking execution line to the terminating side edge, and record it as the second starting distance.

[0011] Optionally, the executing and determining the grinding strategy includes: Compare the first starting distance to the second starting distance: When the first starting distance is smaller than the second starting distance: Grind the sample to be tested from the starting side to the first marked execution line; When grinding passes through each execution line, the pins to be tested on the execution line are tested; Measure the distance between the first marking execution line and the second marking execution line, and record it as the judgment distance; Compare the judged distance with the second starting distance: When the distance is judged to be greater than or equal to the second starting distance; Then, the sample to be tested is ground from the end side to the second marking execution line; When grinding passes through each execution line, the pins to be tested on the execution line are tested; When the judged distance is less than the second starting distance; Then, the first directional strategy is executed.

[0012] Optionally, the executing and determining the grinding strategy includes: When the second starting distance is smaller than the first starting distance: Grinding the sample to be tested from the end side to the second marking execution line; When grinding passes through each execution line, the pins to be tested on the execution line are tested; Compare the judged distance with the first starting distance: When the distance is judged to be greater than or equal to the first starting distance; Then, the sample to be tested is ground from the starting side to the first marking execution line; When grinding passes through each execution line, the pins to be tested on the execution line are tested; When the judged distance is less than the first starting distance; Then, execute the second directional strategy.

[0013] Optionally, executing the first directional strategy includes: Recording the execution lines corresponding to the undetected pins among the pins to be detected as the execution lines to be detected; S1, obtaining the execution line to be detected that is closest to the first marked execution line, and recording it as the first starting execution line; S2, measuring the distance between the first marking execution line and the first starting execution line, and recording it as the first orientation starting distance; S3, obtaining the execution line to be detected that is closest to the termination side edge, and recording it as the first termination execution line; S4, measuring the distance between the terminating side and the first terminating execution line, and recording it as the first orientation terminating distance; S5, when the first orientation starting distance is less than or equal to the first orientation ending distance; Grinding the sample to be tested from the first marked execution line to the first starting execution line, and testing the pins to be tested on each execution line when grinding through each execution line; Record the first starting execution line as a new first marked execution line; S6, when the first orientation end distance is less than or equal to the first orientation start distance; Grind the sample to be tested from the termination side to the first termination execution line, and test the pins to be tested on the execution line when grinding through each execution line; Record the first terminating execution line as the new terminating side; S7. Repeat S1-S6 until all the pins to be tested are tested.

[0014] Optionally, executing the second directional strategy includes: S8, obtaining the execution line to be detected that is closest to the starting side edge, and recording it as the second starting execution line; S9, measuring the distance between the starting side and the second starting execution line, and recording it as the second orientation starting distance; S10, obtaining the execution line to be detected that is closest to the second marked execution line, and recording it as the second termination execution line; S11, measuring the distance between the second marking execution line and the second termination execution line, and recording it as the second orientation termination distance; S12, when the second orientation starting distance is less than or equal to the second orientation ending distance; Grind the sample to be tested from the starting side to the second starting execution line, and test the pins to be tested on the execution line when grinding through each execution line; Record the second starting execution line as the new starting side; S13, when the second orientation end distance is less than or equal to the second orientation start distance; Grinding the sample to be tested from the second marking execution line to the second termination execution line, and testing the pins to be tested on the execution line when grinding through each execution line; Record the second terminated execution line as a new second marked execution line; S14. Repeat S8-S13 until all the pins to be tested are tested.

[0015] The present invention has the following beneficial effects: 1. The detection method for semiconductor devices obtains the position point of each pin, draws a straight line perpendicular to the reference line segment through each position point on the welding surface to obtain the reference point, and draws a straight line perpendicular to the reference line segment through each reference point on the grinding surface to obtain the grinding line. The grinding line represents the path to be actually physically inspected, which can simplify the calculation of subsequent steps.

[0016] 2. For the detection method of semiconductor devices, for the detection group, each welding surface corresponds to multiple grinding lines, and a first grinding line set corresponding to the first welding surface is obtained, a second grinding line set corresponding to the second welding surface is obtained, and all elements in the union of the first grinding line set and the second grinding line set are obtained. When the grinding lines corresponding to the two welding surfaces overlap, the overlapping grinding lines are regarded as one grinding line, and all the grinding lines on the grinding surface are obtained, and all the grinding lines that need to be checked are confirmed to ensure that no pin to be inspected is missed.

[0017] 3. The inspection method for semiconductor devices is that when only the first side has an execution line, the sample to be inspected is ground from the starting side to the execution end line; when only the second side has an execution line: the sample to be inspected is ground from the ending side to the execution end line. When grinding through each execution line, the pin to be inspected on the execution line is inspected to ensure that the grinding work starts from the most appropriate end, minimize the grinding path, and improve efficiency. Perform inspections systematically during the grinding process, find problems and make adjustments.

[0018] 4. The inspection method for semiconductor devices, obtain the first mark execution line: determine the important inspection point closest to the center, which helps to optimize the inspection process and reduce the grinding range, thereby protecting the sample from over-processing. Measuring the distance from the first mark execution line to the starting side edge: Accurately measuring the distance helps to plan the starting and ending points of grinding. Obtaining the second mark execution line: Similarly, this helps to accurately locate the area on the other side to ensure the integrity and effectiveness of the inspection. Measuring the distance from the second mark execution line to the terminating side edge: Provides accurate measurement data on the other side for coordinating and balancing the double-sided inspection strategy.

[0019] 5. The detection method for semiconductor devices is as follows: when the first starting distance is less than the second starting distance, the sample to be detected is ground from the starting side to the first marked execution line; when the judgment distance is greater than or equal to the second starting distance, the sample to be detected is ground from the terminating side to the second marked execution line; when the second starting distance is less than the first starting distance: the sample to be detected is ground from the terminating side to the second marked execution line; when the judgment distance is greater than or equal to the first starting distance; the sample to be detected is ground from the starting side to the first marked execution line; compare the first starting distance, the second starting distance and the judgment distance: determine which side's execution line is closer to the edge, which helps to prioritize processing, reduce unnecessary grinding, save time and protect samples.

[0020] 6. The detection method for semiconductor devices, when the first starting distance is less than the second starting distance and the judgment distance is less than the second starting distance, obtain the first starting execution line and the first termination execution line, calculate the first orientation starting distance and the first orientation termination distance, compare the first orientation starting distance and the first orientation termination distance, when the first orientation starting distance is less than or equal to the first orientation termination distance, grind the sample to be detected from the first marking execution line to the first starting execution line; when the first orientation termination distance is less than or equal to the first orientation starting distance, grind the sample to be detected from the termination side to the first termination execution line, and continuously update the first orientation starting distance and the first orientation termination distance. Similarly, when the second starting distance is less than the first starting distance and the judgment distance is less than the first starting distance, execute the second orientation strategy. Through this dynamic adjustment of the grinding direction, each time the grinding starts from the end closest to the execution line to be detected, the grinding efficiency is improved and time is saved. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a schematic diagram of the method of the present invention; Figure 2 A schematic diagram of a grinding surface for executing a first orientation strategy; Figure 3 Schematic diagram of the polishing surface for executing the second orientation strategy. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] Embodiment 1, refer to Figure 1 , a method for detecting a semiconductor device; Obtain the chip to be tested, which is recorded as the sample to be tested; The shape of the sample to be tested is a cuboid; The surface of the sample to be tested where the pins are welded is recorded as the welding surface; Obtain any two mutually parallel welding surfaces of the sample to be tested, and record them as a test group; Obtain any surface of the sample to be tested that does not have a soldered pin, and record it as the grinding surface; The connecting line segment between the welding surface and the grinding surface is recorded as the reference line segment; Execute the preprocessing strategy on the inspection group and the grinding surface to obtain all grinding lines on the grinding surface; The two sides perpendicular to the reference line segment on the grinding surface are respectively recorded as the starting side and the ending side; Get the midpoint of the reference line segment, and draw a straight line through the midpoint parallel to the starting side, which is recorded as the bisector line; Get the pins that need to be tested in the test group and record them as the pins to be tested; The surface enclosed by the bisector line and the starting side edge on the grinding surface is recorded as the first surface; The surface enclosed by the bisector line and the terminal side edge on the grinding surface is recorded as the second surface; The grinding line corresponding to the pin to be inspected on the grinding surface is recorded as the execution line; Execute the grinding strategy to determine the grinding direction of the sample to be tested.

[0024] The pre-processing strategy for the detection group and the grinding surface includes: For any weld surface in the inspection group: Get the location point of each pin; Draw a straight line perpendicular to the reference line segment through each position point on the welding surface, and the intersection with the reference line segment is recorded as the reference point; Draw a straight line perpendicular to the reference line segment through each reference point on the grinding surface, which is recorded as the grinding line.

[0025] Get the position point of each pin, draw a straight line perpendicular to the reference line segment through each position point on the welding surface to obtain the reference point, draw a straight line perpendicular to the reference line segment through each reference point on the grinding surface to obtain the grinding line. The grinding line represents the path for actual physical inspection to simplify the calculation of subsequent steps.

[0026] The pre-processing strategy for the detection group and the grinding surface includes: The two welding surfaces in the inspection group are respectively recorded as a first welding surface and a second welding surface; Obtaining grinding lines corresponding to the first welding surface on the grinding surface to form a first grinding line set; Obtaining grinding lines corresponding to the second welding surface on the grinding surface to form a second grinding line set; Traverse the elements in the first grinding line set and the second grinding line set; All elements in the union of the first grinding line set and the second grinding line set are obtained to obtain all grinding lines on the grinding surface.

[0027] For the inspection group, each welding surface corresponds to multiple grinding lines. The first grinding line set corresponding to the first welding surface is obtained, the second grinding line set corresponding to the second welding surface is obtained, and all elements in the union of the first grinding line set and the second grinding line set are obtained. When the grinding lines corresponding to the two welding surfaces overlap, the overlapping grinding lines are regarded as one grinding line, and all the grinding lines on the grinding surface are obtained. All the grinding lines that need to be checked are confirmed to ensure that no pin to be inspected is missed.

[0028] The execution and determination of the grinding strategy comprises: Get the execution line closest to the bisector line and record it as the execution end line; When only the first side has an execution line: Grind the sample to be tested from the starting side to the execution end line; When grinding passes through each execution line, the pins to be tested on the execution line are tested; When only the second side has an execution line: Grind the sample to be tested from the end side to the execution end line; When grinding passes through each execution line, the pin to be inspected on the execution line is inspected.

[0029] When only the first side has an execution line, the sample to be tested is ground from the starting side to the execution end line; when only the second side has an execution line: the sample to be tested is ground from the ending side to the execution end line. When grinding through each execution line, the pins to be tested on the execution line are tested to ensure that the grinding work starts from the most appropriate end, minimize the grinding path, and improve efficiency. Perform inspections systematically during the grinding process to find problems and make adjustments.

[0030] The execution and determination of the grinding strategy comprises: When execution lines exist on both the first and second sides: Obtain the execution line closest to the bisector line in the first face, and record it as the first marked execution line; Measure the distance between the first marking execution line and the starting side edge, and record it as the first starting distance; Obtain the execution line closest to the bisector line in the second face, and record it as the second marked execution line; Measure the distance from the second marking execution line to the terminating side edge, and record it as the second starting distance.

[0031] Get the first mark execution line: Identify the important inspection points closest to the center, which helps optimize the inspection process and reduce the grinding range, thereby protecting the sample from over-processing. Measure the distance from the first mark execution line to the starting side edge: Accurately measuring the distance helps plan the starting and ending points of the grinding, ensuring that all important parts are inspected. Get the second mark execution line: Similarly, this helps with precise area positioning on the other side to ensure the completeness and effectiveness of the inspection. Measure the distance from the second mark execution line to the ending side edge: Provides accurate measurement data of the other side for coordinating and balancing the two-sided inspection strategy.

[0032] The execution and determination of the grinding strategy comprises: Compare the first starting distance to the second starting distance: When the first starting distance is smaller than the second starting distance: Grind the sample to be tested from the starting side to the first marked execution line; When grinding passes through each execution line, the pins to be tested on the execution line are tested; Measure the distance between the first marking execution line and the second marking execution line, and record it as the judgment distance; Compare the judged distance with the second starting distance: When the distance is judged to be greater than or equal to the second starting distance; Then, the sample to be tested is ground from the end side to the second marking execution line; When grinding passes through each execution line, the pins to be tested on the execution line are tested; When the judged distance is less than the second starting distance; Then, the first directional strategy is executed.

[0033] The execution and determination of the grinding strategy comprises: When the second starting distance is smaller than the first starting distance: Grinding the sample to be tested from the end side to the second marking execution line; When grinding passes through each execution line, the pins to be tested on the execution line are tested; Compare the judged distance with the first starting distance: When the distance is judged to be greater than or equal to the first starting distance; Then, the sample to be tested is ground from the starting side to the first marking execution line; When grinding passes through each execution line, the pins to be tested on the execution line are tested; When the judged distance is less than the first starting distance; Then, execute the second directional strategy.

[0034] In this embodiment, Figure 2As shown, the first starting distance is smaller than the second starting distance, and the sample to be tested is ground from the starting side to the first marking execution line; and if it is determined that the distance is less than the second starting distance, the first directional grinding strategy is executed; In this embodiment, Figure 3 As shown, the second starting distance is smaller than the first starting distance, and the sample to be tested is ground from the end side edge to the second marking execution line; If the distance is less than the first starting distance, the second orientation strategy is executed.

[0035] When the first starting distance is less than the second starting distance, grind the sample to be tested from the starting side to the first marked execution line; when the judgment distance is greater than or equal to the second starting distance, grind the sample to be tested from the terminating side to the second marked execution line; when the second starting distance is less than the first starting distance: grind the sample to be tested from the terminating side to the second marked execution line; when the judgment distance is greater than or equal to the first starting distance; grind the sample to be tested from the starting side to the first marked execution line; compare the first starting distance, the second starting distance and the judgment distance: determine which side's execution line is closer to the edge, which helps to prioritize processing, reduce unnecessary grinding, save time and protect samples.

[0036] The executing the first directional strategy includes: Recording the execution lines corresponding to the undetected pins among the pins to be detected as the execution lines to be detected; S1, obtaining the execution line to be detected that is closest to the first marked execution line, and recording it as the first starting execution line; S2, measuring the distance between the first marking execution line and the first starting execution line, and recording it as the first orientation starting distance; S3, obtaining the execution line to be detected that is closest to the termination side edge, and recording it as the first termination execution line; S4, measuring the distance between the terminating side and the first terminating execution line, and recording it as the first orientation terminating distance; S5, when the first orientation starting distance is less than or equal to the first orientation ending distance; Grinding the sample to be tested from the first marked execution line to the first starting execution line, and testing the pins to be tested on each execution line when grinding through each execution line; Record the first starting execution line as a new first marked execution line; S6, when the first orientation end distance is less than or equal to the first orientation start distance; Grind the sample to be tested from the termination side to the first termination execution line, and test the pins to be tested on the execution line when grinding through each execution line; Record the first terminating execution line as the new terminating side; S7. Repeat S1-S6 until all the pins to be tested are tested.

[0037] The executing the second directional strategy comprises: S8, obtaining the execution line to be detected that is closest to the starting side edge, and recording it as the second starting execution line; S9, measuring the distance between the starting side and the second starting execution line, and recording it as the second orientation starting distance; S10, obtaining the execution line to be detected that is closest to the second marked execution line, and recording it as the second termination execution line; S11, measuring the distance between the second marking execution line and the second termination execution line, and recording it as the second orientation termination distance; S12, when the second orientation starting distance is less than or equal to the second orientation ending distance; Grind the sample to be tested from the starting side to the second starting execution line, and test the pins to be tested on the execution line when grinding through each execution line; Record the second starting execution line as the new starting side; S13, when the second orientation end distance is less than or equal to the second orientation start distance; Grinding the sample to be tested from the second marking execution line to the second termination execution line, and testing the pins to be tested on the execution line when grinding through each execution line; Record the second terminated execution line as a new second marked execution line; S14. Repeat S8-S13 until all the pins to be tested are tested.

[0038] When the first starting distance is less than the second starting distance and the judgment distance is less than the second starting distance, the first starting execution line and the first ending execution line are obtained, the first orientation starting distance and the first orientation ending distance are calculated, and the first orientation starting distance and the first orientation ending distance are compared. When the first orientation starting distance is less than or equal to the first orientation ending distance, the sample to be detected is ground from the first marking execution line to the first starting execution line; when the first orientation ending distance is less than or equal to the first orientation starting distance, the sample to be detected is ground from the ending side to the first ending execution line, and the first orientation starting distance and the first orientation ending distance are continuously updated. Similarly, when the second starting distance is less than the first starting distance and the judgment distance is less than the first starting distance, the second orientation strategy is executed. By dynamically adjusting the grinding direction, grinding starts from the end closest to the execution line to be detected each time, improving grinding efficiency and saving time.

[0039] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0040] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A method for detecting a semiconductor device, comprising: Obtain the chip to be tested, which is recorded as the sample to be tested; The surface of the sample to be tested where the pins are welded is recorded as the welding surface; Obtain any two mutually parallel welding surfaces of the sample to be tested, and record them as a test group; Obtain any surface of the sample to be tested that does not have a soldered pin, and record it as the grinding surface; The connecting line segment between the welding surface and the grinding surface is recorded as the reference line segment; Execute the preprocessing strategy on the inspection group and the grinding surface to obtain all grinding lines on the grinding surface; The two sides perpendicular to the reference line segment on the grinding surface are respectively recorded as the starting side and the ending side; Get the midpoint of the reference line segment, and draw a straight line through the midpoint parallel to the starting side, which is recorded as the bisector line; Get the pins that need to be tested in the test group and record them as the pins to be tested; The surface enclosed by the bisector line and the starting side edge on the grinding surface is recorded as the first surface; The surface enclosed by the bisector line and the terminal side edge on the grinding surface is recorded as the second surface; The grinding line corresponding to the pin to be inspected on the grinding surface is recorded as the execution line; Execute the grinding strategy to determine the grinding direction of the sample to be tested.

2. The method for detecting a semiconductor device according to claim 1, wherein: The pre-processing strategy for the detection group and the grinding surface includes: For any weld surface in the inspection group: Get the location point of each pin; Draw a straight line perpendicular to the reference line segment through each position point on the welding surface, and the intersection with the reference line segment is recorded as the reference point; Draw a straight line perpendicular to the reference line segment through each reference point on the grinding surface, which is recorded as the grinding line.

3. The method for detecting a semiconductor device according to claim 2, wherein: The pre-processing strategy for the detection group and the grinding surface includes: The two welding surfaces in the inspection group are respectively recorded as a first welding surface and a second welding surface; Obtaining grinding lines corresponding to the first welding surface on the grinding surface to form a first grinding line set; Obtaining grinding lines corresponding to the second welding surface on the grinding surface to form a second grinding line set; Traverse the elements in the first grinding line set and the second grinding line set; All elements in the union of the first grinding line set and the second grinding line set are obtained to obtain all grinding lines on the grinding surface.

4. The method for detecting a semiconductor device according to claim 3, wherein: The execution and determination of the grinding strategy comprises: Get the execution line closest to the bisector line and record it as the execution end line; When only the first side has an execution line: Grind the sample to be tested from the starting side to the execution end line; When grinding passes through each execution line, the pins to be tested on the execution line are tested; When only the second side has an execution line: Grind the sample to be tested from the end side to the execution end line; When grinding passes through each execution line, the pin to be inspected on the execution line is inspected.

5. The method for detecting a semiconductor device according to claim 4, wherein: The execution and determination of the grinding strategy comprises: When execution lines exist on both the first and second sides: Obtain the execution line closest to the bisector line in the first face, and record it as the first marked execution line; Measure the distance between the first marking execution line and the starting side edge, and record it as the first starting distance; Obtain the execution line closest to the bisector line in the second face, and record it as the second marked execution line; Measure the distance from the second marking execution line to the terminating side edge, and record it as the second starting distance.

6. The method for detecting a semiconductor device according to claim 5, wherein: The execution and determination of the grinding strategy comprises: Compare the first starting distance to the second starting distance: When the first starting distance is smaller than the second starting distance: Grind the sample to be tested from the starting side to the first marked execution line; When grinding passes through each execution line, the pins to be tested on the execution line are tested; Measure the distance between the first marking execution line and the second marking execution line, and record it as the judgment distance; Compare the judged distance with the second starting distance: When the distance is judged to be greater than or equal to the second starting distance; Then, the sample to be tested is ground from the end side to the second marking execution line; When grinding passes through each execution line, the pins to be tested on the execution line are tested; When the judged distance is less than the second starting distance; Then, the first directional strategy is executed.

7. The method for detecting a semiconductor device according to claim 5, wherein: The execution and determination of the grinding strategy comprises: When the second starting distance is smaller than the first starting distance: Grinding the sample to be tested from the end side to the second marking execution line; When grinding passes through each execution line, the pins to be tested on the execution line are tested; Compare the judged distance with the first starting distance: When the distance is judged to be greater than or equal to the first starting distance; Then, the sample to be tested is ground from the starting side to the first marking execution line; When grinding passes through each execution line, the pins to be tested on the execution line are tested; When the judged distance is less than the first starting distance; Then, execute the second directional strategy.

8. The method for detecting a semiconductor device according to claim 6, wherein: The executing the first directional strategy includes: Recording the execution lines corresponding to the undetected pins among the pins to be detected as the execution lines to be detected; S1, obtaining the execution line to be detected that is closest to the first marked execution line, and recording it as the first starting execution line; S2, measuring the distance between the first marking execution line and the first starting execution line, and recording it as the first orientation starting distance; S3, obtaining the execution line to be detected that is closest to the termination side edge, and recording it as the first termination execution line; S4, measuring the distance between the terminating side and the first terminating execution line, and recording it as the first orientation terminating distance; S5, when the first orientation starting distance is less than or equal to the first orientation ending distance; Grinding the sample to be tested from the first marked execution line to the first starting execution line, and testing the pins to be tested on each execution line when grinding through each execution line; Record the first starting execution line as a new first marked execution line; S6, when the first orientation end distance is less than or equal to the first orientation start distance; Grind the sample to be tested from the termination side to the first termination execution line, and test the pins to be tested on the execution line when grinding through each execution line; Record the first terminating execution line as the new terminating side; S7. Repeat S1-S6 until all the pins to be tested are tested.

9. The method for detecting a semiconductor device according to claim 7, wherein: The executing the second directional strategy comprises: S8, obtaining the execution line to be detected that is closest to the starting side edge, and recording it as the second starting execution line; S9, measuring the distance between the starting side and the second starting execution line, and recording it as the second orientation starting distance; S10, obtaining the execution line to be detected that is closest to the second marked execution line, and recording it as the second termination execution line; S11, measuring the distance between the second marking execution line and the second termination execution line, and recording it as the second orientation termination distance; S12, when the second orientation starting distance is less than or equal to the second orientation ending distance; Grind the sample to be tested from the starting side to the second starting execution line, and test the pins to be tested on the execution line when grinding through each execution line; Record the second starting execution line as the new starting side; S13, when the second orientation end distance is less than or equal to the second orientation start distance; Grinding the sample to be tested from the second marking execution line to the second termination execution line, and testing the pins to be tested on the execution line when grinding through each execution line; Record the second terminated execution line as a new second marked execution line; S14. Repeat S8-S13 until all the pins to be tested are tested.

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