Zinc oxide resistor disc, design method and manufacturing process

Abstract

The invention discloses a zinc oxide resistor disc, a design method and a manufacturing process, the zinc oxide resistor disc comprises a resistor disc green body and an electrode assembly, the center of the first end face of the resistor disc green body is recessed to form a first sinking space, and in the forming process, the stress of the center of the green body is consistent with that of the edge; the density uniformity of each area in the resistor disc blank is improved; the electrode assembly comprises a first electrode plate and a second electrode plate, the first electrode plate and the second electrode plate are arranged on the first end face and the second end face of the resistor disc blank in a one-to-one correspondence mode, a first protruding part extending into the first sinking space is formed on the first electrode plate, and a second protruding part extending into the second sinking space is formed between the two electrode plates. The body resistance of the central part of the resistor disc blank body is smaller than that of the edge part of the resistor disc blank body, and current tends to flow through the central part of the resistor disc blank body, so that a part of skin effect is counteracted; compared with a traditional resistor disc structure, the zinc oxide resistor disc provided by the invention has better through-current capability.

Description

Technical Field

[0001] The invention belongs to the technical field of electric device manufacturing, and in particular relates to a zinc oxide resistor, a design method and a manufacturing process. Background Art

[0002] Every year, lightning flashover tripping accounts for more than 40% of the total number of transmission and distribution line failures, which greatly affects the reliability of power supply. Line arresters are usually used to prevent transmission and distribution lines from tripping due to lightning strikes, but because the current carrying capacity of the core component of the existing line arrester, the zinc oxide resistor, is limited or insufficient, the actual effect is not good, and the lightning flashover tripping phenomenon is still relatively frequent. During the pressing and forming process of the zinc oxide resistor, the force in the center area and the edge area is inconsistent, resulting in uneven microstructure of its internal parts. The lightning current has only a very narrow discharge channel in the zinc oxide resistor, and under high-frequency lightning strikes, the current passing through the zinc oxide resistor shows a skin effect, and the current tends to concentrate on the edge of the zinc oxide resistor, resulting in insufficient actual current carrying capacity of the zinc oxide resistor. Summary of the invention

[0003] In view of the above defects or shortcomings, the present invention provides a zinc oxide resistor, a design method and a manufacturing process, aiming to solve the technical problems of uneven microstructure of various parts inside the existing zinc oxide resistor and the skin effect under strong current impact, resulting in insufficient actual current carrying capacity.

[0004] To achieve the above-mentioned purpose, the present invention provides a zinc oxide resistor, wherein the zinc oxide resistor comprises a resistor blank and an electrode assembly; a first sinking space is formed inwardly at the center of a first end surface of the resistor blank, and the electrode assembly comprises a first electrode sheet and a second electrode sheet, the first electrode sheet and the second electrode sheet are arranged on the first end surface and the second end surface of the resistor blank in a one-to-one correspondence, and the first electrode sheet is formed with a first protrusion extending into the first sinking space, and the first protrusion abuts against the bottom wall of the first sinking space.

[0005] In the embodiment of the present invention, the resistor sheet blank is cylindrical, and the blank diameter of the resistor sheet blank is between 30 mm and 100 mm, the blank height of the resistor sheet blank is between 20 mm and 50 mm, the cross-sectional shape of the resistor sheet blank at the first sinking space is a circular ring, and the space diameter of the first sinking space is between 10% and 81% of the blank diameter, and the space depth of the first sinking space is between 3% and 10% of the blank height;

[0006] And / or, the first end surface and the second end surface are respectively sprayed with aluminum electrodes to form a first electrode sheet and a second electrode sheet, and the spraying thickness of the first electrode sheet and the second electrode sheet is between 0.1 mm and 0.3 mm.

[0007] In the embodiment of the present invention, the diameter of the resistor sheet blank is smaller than the height of the blank, the second end surface is concave to form a second sunken space, a second protrusion extending into the second sunken space is formed on the second electrode sheet, and the second protrusion abuts against the bottom wall of the second sunken space.

[0008] In order to achieve the above object, the present invention also provides a design method of a zinc oxide resistor, the design method is used to design the above zinc oxide resistor, the design method comprises:

[0009] The spatial diameter of the sinking space is determined according to the green body height and green body diameter of the resistor sheet green body.

[0010] In the embodiment of the present invention, determining the spatial diameter of the sinking space according to the green body height and green body diameter of the resistor sheet green body includes:

[0011] Compare the height and diameter of the resistor chip blank;

[0012] When the green body height is less than the green body diameter, the spatial diameter is taken from the first diameter interval, where the expression of the first diameter interval is:

[0013] {d2|d1×(0.45+(h-d1) / d1)≤d2≤d1×(0.75+(h-d1) / d1)};

[0014] In the expression, d1 represents the diameter of the blank, d2 represents the space diameter, and h represents the height of the blank.

[0015] In the embodiment of the present invention, after taking a value of the space diameter from the first diameter interval, the method further includes:

[0016] Calculate the ratio of the sinking space to the cross-sectional area of ​​the resistor sheet blank;

[0017] When the ratio is less than the minimum preset ratio, the spatial diameter is re-valued from the first diameter interval, wherein the minimum preset ratio is set to 0.1.

[0018] In the embodiment of the present invention, after comparing the height of the green body and the diameter of the green body, the method further includes:

[0019] When the green body height is greater than or equal to the green body diameter, the spatial diameter is taken from the second diameter interval, where the expression of the second diameter interval is:

[0020] {d2|d1×(0.50+(h-d1) / d1)≤d2≤d1×(0.80+(h-d1) / d1)};

[0021] In the expression, d1 represents the diameter of the blank, d2 represents the space diameter, and h represents the height of the blank.

[0022] In the embodiment of the present invention, after taking a value of the space diameter from the second diameter interval, the method further includes:

[0023] Calculate the ratio of the sinking space to the cross-sectional area of ​​the resistor sheet blank;

[0024] When the ratio is greater than the maximum preset ratio, the spatial diameter is re-valued from the second diameter interval, wherein the maximum preset ratio is set to 0.81.

[0025] In an embodiment of the present invention, the design method further includes:

[0026] The spatial depth of the sinking space is taken within the depth interval, where the expression of the depth interval is:

[0027] {h1|0.03h

[0028] In the expression, h represents the height of the blank and h1 represents the spatial depth.

[0029] In order to achieve the above object, the present invention also provides a manufacturing process for manufacturing the above zinc oxide resistor, the manufacturing process comprising a pressing step, a pre-firing step, a side high resistance layer coating step, a sintering step, a side glaze layer coating step, a heat treatment step, a grinding step and an electrode spraying step performed in sequence;

[0030] The pressing step includes pressing the zinc oxide particles into a semi-finished product having the shape of a resistor sheet green body by bidirectional pressing, and degassing the semi-finished product three to five times during the pressing process.

[0031] Through the above technical solution, the zinc oxide resistor provided by the embodiment of the present invention has the following beneficial effects:

[0032] When the zinc oxide resistor is used, the current flows from one of the first electrode sheet and the second electrode sheet to the other. When the current passes through the resistor blank, the first end surface is concave to form a first sinking space. During the forming process, the force at the center of the blank is consistent with the edge, which improves the density uniformity of each area inside the resistor blank, which is beneficial to the uniformity of the microstructure of the final resistor blank and the improvement of the macroscopic current carrying capacity; and the body resistance of the central part of the resistor blank is smaller than the body resistance of the edge part of the resistor blank, and the current tends to flow through the central part of the resistor blank, thereby offsetting a part of the skin effect, increasing the cross-sectional area of ​​the resistor blank that actually withstands the impact current, and the current can pass through more discharge channels inside the resistor blank; compared with the traditional resistor structure, the present invention improves the actual current carrying capacity of the zinc oxide resistor by opening the first sinking space on the first end surface of the resistor blank and arranging the first protrusion on the first electrode sheet.

[0033] ​Other features and advantages of the present invention will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The accompanying drawings are used to provide an understanding of the present invention and constitute a part of the specification. Together with the following specific embodiments, they are used to explain the present invention, but do not constitute a limitation of the present invention. In the accompanying drawings:

[0035] Figure 1 is a longitudinal cross-sectional view of a zinc oxide resistor according to an embodiment of the present invention;

[0036] Figure 2 is a longitudinal cross-sectional view of a resistor sheet blank according to an embodiment of the present invention;

[0037] Figure 3 is a longitudinal cross-sectional view of another resistor chip blank according to an embodiment of the present invention;

[0038] Figure 4 is a flow chart of a design method of a zinc oxide resistor according to an embodiment of the present invention.

[0039] Description of Reference Numerals

[0040] 1 resistor chip blank 11 first end surface

[0041] 12 first sinking space 13 second end surface

[0042] 14 Second sinking space 2 First electrode sheet

[0043] 21 first protrusion 3 second electrode sheet DETAILED DESCRIPTION

[0044] The specific embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. It should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention, and are not used to limit the present invention.

[0045] The zinc oxide resistor, design method and manufacturing process of the present invention are described below with reference to the accompanying drawings.

[0046] like Figure 1 and Figure 2 As shown, the present invention provides a zinc oxide resistor, wherein the zinc oxide resistor comprises:

[0047] The resistor chip body 1 has a first end surface 11 whose center is concave to form a first sinking space 12;

[0048] The electrode assembly includes a first electrode sheet 2 and a second electrode sheet 3. The first electrode sheet 2 and the second electrode sheet 3 are arranged one by one on the first end surface 11 and the second end surface 13 of the resistor sheet blank 1. The first electrode sheet 2 is formed with a first protrusion 21 extending into the first sinking space 12, and the first protrusion 21 abuts against the bottom wall of the first sinking space 12.

[0049] When the zinc oxide resistor is used, the current flows from one of the first electrode sheet 2 and the second electrode sheet 3 to the other. When the current passes through the resistor blank 1, the first sinking space 12 is formed at the center of the first end surface 11. During the forming process, the force at the center of the blank is consistent with the edge, which improves the uniformity of the density of each area inside the resistor blank 1, which is beneficial to the uniformity of the microstructure and the improvement of the macroscopic current carrying capacity of the final resistor blank 1. In addition, the body resistance of the central part of the resistor blank 1 is smaller than the body resistance of the edge part of the resistor blank 1, and the current tends to flow through the central part of the resistor blank 1, thereby offsetting a part of the skin effect, increasing the cross-sectional area of ​​the resistor blank that actually withstands the impact current, and the current can pass through more discharge channels inside the resistor blank. Compared with the traditional resistor structure, the present invention improves the actual current carrying capacity of the zinc oxide resistor by providing the first sinking space 12 on the first end surface 11 of the resistor blank 1 and arranging the first protrusion 21 on the first electrode sheet 2.

[0050] In the embodiment of the present invention, the resistor sheet blank 1 is cylindrical, and the blank diameter of the resistor sheet blank 1 is between 30mm-100mm, the blank height of the resistor sheet blank 1 is between 20mm-50mm, the cross-sectional shape of the resistor sheet blank 1 at the first sinking space 12 is a circular ring, and the space diameter of the first sinking space 12 is between 10%-81% of the blank diameter, and the space depth of the first sinking space 12 is between 3%-10% of the blank height. Referring to Table 1, within the above size range, the zinc oxide resistor has a relatively good current-carrying capacity.

[0051] In the embodiment of the present invention, aluminum electrodes are sprayed on the first end face 11 and the second end face 13 to form the first electrode sheet 2 and the second electrode sheet 3, and the spraying thickness of the first electrode sheet 2 and the second electrode sheet 3 is between 0.1 mm and 0.3 mm. The first electrode sheet 2 and the second electrode sheet 3 are covered on the first end face 11 and the second end face 13 by the spraying process, which can ensure that the electrode sheet is in full contact with the resistor sheet blank 1, so that the current passing through each unit area of ​​the first end face 11 and the second end face 13 is equal.

[0052] like Figure 3As shown, in the embodiment of the present invention, the body diameter of the resistor sheet blank 1 is smaller than the body height, the second end face 13 is concave to form a second sinking space 14, and a second protrusion extending into the second sinking space 14 is formed on the second electrode sheet 3, and the second protrusion abuts against the bottom wall of the second sinking space 14. Based on the actual use scenario, the size of the zinc oxide resistor sheet also varies. Since the resistance value of the resistor is proportional to the length of the conductor, as the height of the blank increases, the ratio of the body resistance in the central area to the body resistance in the edge area gradually increases, and the current conduction effect decreases. At this time, there are two solutions, one is to increase the spatial depth or spatial diameter of the first sinking space 12, and the other is to open a second sinking space 14 at the second end face 13. Although both solutions can improve the current conduction effect of the central area, considering that the zinc oxide resistor sheet itself is small in size, if the spatial diameter is blindly increased, it is easy to cause the structural strength of the end of the resistor sheet blank 1 to decrease and be easily damaged; and setting the value of the spatial depth to be larger is not conducive to spraying the electrode. Therefore, the present invention preferably opens a second sinking space 14 at the second end surface 13. By setting two sinking spaces, the current conduction effect of the central area of ​​the resistor body 1 can be improved, and the structural strength of the zinc oxide resistor can be guaranteed. It should be noted that the size parameters of the second sinking space 14 are the same as those of the first sinking space 12, and will not be repeated here.

[0053] In order to achieve the above-mentioned objectives, the present invention also provides a design method for a zinc oxide resistor, the design method is used to design the above-mentioned zinc oxide resistor, and the design method comprises: determining the spatial diameter of the sinking space according to the blank height and blank diameter of the resistor blank 1. The cross-section of the resistor blank 1 and the sinking space are concentric circles, and the blank height refers to the height value of the edge portion of the resistor blank 1. The design method of the present invention designs the sinking space based on the height and diameter of the zinc oxide resistor in actual applications, which not only ensures its flow capacity, but also makes the zinc oxide resistor have better structural strength.

[0054] like Figure 4 As shown, in the embodiment of the present invention, determining the spatial diameter of the sinking space according to the green body height and green body diameter of the resistor sheet green body 1 includes:

[0055] Compare the height and diameter of the blank;

[0056] When the green body height is less than the green body diameter, the spatial diameter is taken from the first diameter interval, where the expression of the first diameter interval is:

[0057] {d2|d1×(0.45+(h-d1) / d1)≤d2≤d1×(0.75+(h-d1) / d1)};

[0058] In the expression, d1 represents the diameter of the blank, d2 represents the space diameter, and h represents the height of the blank.

[0059] Through the above expression, the spatial diameter can be quickly optimized to avoid repeated experiments, save costs, and further improve the current carrying capacity of the zinc oxide resistor.

[0060] In the embodiment of the present invention, after taking a value of the space diameter from the first diameter interval, the method further includes:

[0061] Calculate the ratio of the sinking space to the cross-sectional area of ​​the resistor sheet blank 1;

[0062] When the ratio is less than the minimum preset ratio, the space diameter is re-valued from the first diameter interval, wherein the minimum preset ratio is set to 0.1. That is to say, when the blank height h is less than the blank diameter d1, the space diameter d2 is firstly taken from the first diameter interval, and then the ratio of the sinking space and the cross-sectional area of ​​the resistor blank 1 is calculated to determine whether the ratio is less than the minimum preset ratio. If so, the space diameter d2 is continued to be taken from the first diameter interval until the size parameters that meet the requirements are obtained. Then, by further verifying the space diameter, the flow capacity of the central part of the resistor blank 1 is guaranteed.

[0063] In the embodiment of the present invention, after comparing the height of the green body and the diameter of the green body, the method further includes:

[0064] When the green body height is greater than or equal to the green body diameter, the spatial diameter is taken from the second diameter interval, where the expression of the second diameter interval is:

[0065] {d2|d1×(0.50+(h-d1) / d1)≤d2≤d1×(0.80+(h-d1) / d1)};

[0066] In the expression, d1 represents the diameter of the blank, d2 represents the space diameter, and h represents the height of the blank.

[0067] Through the above expression, the spatial diameter can be quickly optimized to avoid repeated experiments, save costs, and further improve the current carrying capacity of the zinc oxide resistor.

[0068] In the embodiment of the present invention, after taking a value of the space diameter from the second diameter interval, the method further includes:

[0069] Calculate the ratio of the sinking space to the cross-sectional area of ​​the resistor sheet blank 1;

[0070] When the ratio is greater than the maximum preset ratio, the space diameter is re-valued from the second diameter interval, wherein the maximum preset ratio is set to 0.81. That is to say, when the blank height h is greater than the blank diameter d1, the space diameter d2 is firstly taken from the second diameter interval, and then the ratio of the sinking space and the cross-sectional area of ​​the resistor blank 1 is calculated to determine whether the ratio is less than the minimum preset ratio. If so, the space diameter d2 is continued to be taken from the second diameter interval until the size parameters that meet the requirements are obtained. Then, by further verifying the space diameter, the flow energy of the edge portion of the resistor blank 1 is guaranteed.

[0071] In an embodiment of the present invention, the design method further includes:

[0072] The spatial depth of the sinking space is taken within the depth interval, where the expression of the depth interval is:

[0073] {h1|0.03h

[0074] In the expression, h represents the height of the blank and h1 represents the spatial depth.

[0075] Since the resistance of the zinc oxide resistor is proportional to its length, as the height of the resistor blank 1 increases, the ratio of the body resistance in the middle portion to the body resistance in the edge portion gradually increases. The above design method can further optimize the current carrying capacity of the zinc oxide resistor.

[0076] According to the above design method, three different sizes of zinc oxide resistors are designed in a specific embodiment of the present invention:

[0077] The body diameter d1 of the resistor No. 1 is 32 mm, the body height h is 40 mm, the first end face 11 and the second end face 13 are both formed with a sinking space, the space diameter d2 of the sinking space is 24 mm, and the cross-sectional area of ​​the sinking space accounts for 56.25% of the cross-sectional area of ​​the resistor body 1, and the depth of the sinking space is 4 mm;

[0078] The body diameter d1 of the second resistor is 42 mm, the body height h is 30 mm, and only the first end surface 11 is formed with a sinking space, the space diameter d2 of the sinking space is 18 mm, and the cross-sectional area of ​​the sinking space accounts for 18.37% of the cross-sectional area of ​​the resistor cylinder, and the depth of the sinking space is 3 mm;

[0079] The body diameter d1 of resistor No. 3 is 46mm, the body height h is 36mm, and only the first end face 11 is formed with a sinking space. The space diameter d2 of the sinking space is 15mm, and the cross-sectional area of ​​the sinking space accounts for 10.63% of the cross-sectional area of ​​the resistor cylinder. The depth of the sinking space is 3.6mm. ​

[0080] In order to verify the improvement effect of the current-carrying performance of the above-mentioned resistor, the above-mentioned resistor is set as an experimental group, and three control groups are set up accordingly. Except for the sinking space, the other parameters of the control group are exactly the same as those of the experimental group. The experimental group and the control group are subjected to a 4 / 10μs large current impulse withstand test, and the test results are shown in Table 1.

[0081] Table 1

[0082]

[0083] It can be seen from the results in Table 1 that the zinc oxide resistor provided by the present invention can withstand large current impacts of higher amplitudes, and its current conduction performance is improved.

[0084] In order to achieve the above object, the present invention also provides a manufacturing process for manufacturing the above zinc oxide resistor, the manufacturing process comprising a pressing step, a pre-firing step, a side high resistance layer coating step, a sintering step, a side glaze layer coating step, a heat treatment step, a grinding step and an electrode spraying step performed in sequence;

[0085] The pressing step includes pressing the zinc oxide particles into a semi-finished product having the shape of the resistor sheet body 1 by bidirectional pressing, and degassing the semi-finished product three to five times during the pressing process.

[0086] By optimizing the pressing process of the zinc oxide resistor, the stress on the middle and edge parts of the initial resistor blank 1 can be improved, so that the initial density of the resistor blank 1 is consistent. Then, through pre-firing, firing, etc., the resistor shrinks more evenly, so that the microstructure uniformity of the final resistor is improved, and the amplitude of the impact current that the resistor can withstand is also increased.

[0087] Specifically, the resistor chip blank 1 is formed by bidirectional pressing with a high-tonnage hydraulic forming machine and a matching forming mold. The bidirectional pressing makes the overall force of the resistor chip blank 1 more uniform. The degassing is performed 4 times during the forming process to discharge the gas between the resistor chip powder particles in time and reduce the residual pores inside the resistor chip blank 1. The upper filling head or the upper and lower filling heads of the forming mold are designed to be a cylindrical shape with a slight convexity in the middle, so that the resistor chip blank 1 is pressed into a cylindrical structure with a sinking space.

[0088] Specifically, the material of the first electrode sheet 2 and the second electrode sheet 3 is set to aluminum. In the electrode spraying step, the thickness of the first electrode sheet 2 and the second electrode sheet 3 is controlled within the range of 0.2 mm, and the surface roughness is controlled within 30 μm. The surfaces of the first electrode sheet 2 and the second electrode sheet 3 are not allowed to have small pits or less aluminum, and must be flat, not rough, and not black.

[0089] In the description of the present invention, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0090] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0091] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0092] Although the embodiments of the present invention have been shown and described above, it is to be understood that the above embodiments are exemplary and are not to be construed as limitations of the present invention. A person skilled in the art may change, modify, replace and vary the above embodiments within the scope of the present invention.

Claims

1. A zinc oxide resistor, characterized in that: The zinc oxide resistor comprises: A resistor chip blank (1), wherein the center of a first end surface (11) of the resistor chip blank (1) is concave to form a first sinking space (12); The electrode assembly comprises a first electrode sheet (2) and a second electrode sheet (3), wherein the first electrode sheet (2) and the second electrode sheet (3) are arranged one by one on a first end face (11) and a second end face (13) of the resistor sheet blank (1), and the first electrode sheet (2) is formed with a first protrusion (21) extending into the first sunken space (12), and the first protrusion (21) abuts against a bottom wall of the first sunken space (12).

2. The zinc oxide resistor according to claim 1, characterized in that: The resistor sheet blank (1) is cylindrical, and the blank diameter of the resistor sheet blank (1) is between 30 mm and 100 mm, the blank height of the resistor sheet blank (1) is between 20 mm and 50 mm, the cross-sectional shape of the resistor sheet blank (1) at the first sinking space (12) is a circular ring, and the space diameter of the first sinking space (12) is between 10% and 81% of the blank diameter, and the space depth of the first sinking space (12) is between 3% and 10% of the blank height; And / or, the first end surface (11) and the second end surface (13) of the resistor sheet blank (1) are respectively sprayed with aluminum electrodes to form the first electrode sheet (2) and the second electrode sheet (3), and the spraying thickness of the first electrode sheet (2) and the second electrode sheet (3) is between 0.1 mm and 0.3 mm.

3. The zinc oxide resistor according to claim 1, characterized in that: The diameter of the resistor sheet blank (1) is smaller than the height of the blank, the second end surface (13) is concave to form a second sunken space (14), the second electrode sheet (3) is formed with a second protruding portion extending into the second sunken space (14), and the second protruding portion abuts against the bottom wall of the second sunken space (14).

4. A design method for a zinc oxide resistor, characterized in that: The design method is used to design the zinc oxide resistor according to any one of claims 1 to 3, and the design method comprises: The spatial diameter of the sinking space is determined according to the green body height and green body diameter of the resistor sheet green body (1).

5. The design method of zinc oxide resistor according to claim 4, characterized in that: The step of determining the spatial diameter of the sinking space according to the green body height and green body diameter of the resistor sheet green body (1) comprises: Comparing the height of the green body and the diameter of the green body; When the green body height is smaller than the green body diameter, the spatial diameter is taken from a first diameter interval, wherein the expression of the first diameter interval is: {d2|d1×(0.45+(h-d1) / d1)≤d2≤d1×(0.75+(h-d1) / d1)}; In the expression, d1 represents the diameter of the blank, d2 represents the space diameter, and h represents the height of the blank.

6. The design method of zinc oxide resistor according to claim 5, characterized in that: After taking a value of the space diameter from the first diameter interval, the method further includes: Calculating the ratio of the sinking space to the cross-sectional area of ​​the resistor sheet blank (1); When the ratio is less than a minimum preset ratio, the spatial diameter is revalued from within the first diameter interval, wherein the minimum preset ratio is set to 0.

1.

7. The design method of zinc oxide resistor according to claim 5, characterized in that: After comparing the height of the green body and the diameter of the green body, the following step is further included: When the height of the blank is greater than or equal to the diameter of the blank, the spatial diameter is taken from the second diameter interval, wherein the expression of the second diameter interval is: {d2|d1×(0.50+(h-d1) / d1)≤d2≤d1×(0.80+(h-d1) / d1)}; In the expression, d1 represents the diameter of the blank, d2 represents the space diameter, and h represents the height of the blank.

8. The design method of zinc oxide resistor according to claim 7, characterized in that: After taking a value of the space diameter from the second diameter interval, the method further includes: Calculating the ratio of the sinking space to the cross-sectional area of ​​the resistor sheet blank (1); When the ratio is greater than a maximum preset ratio, the spatial diameter is revalued from within the second diameter interval, wherein the maximum preset ratio is set to 0.

81.

9. The design method of zinc oxide resistor according to claim 4, characterized in that: The design method further comprises: The spatial depth of the sinking space is taken within a depth interval, wherein the expression of the depth interval is: {h1|0.03h <h1<0.15h}; In the expression, h represents the height of the blank, and h1 represents the spatial depth.

10. A manufacturing process of a zinc oxide resistor, characterized in that: The manufacturing process is used to manufacture the zinc oxide resistor according to any one of claims 1 to 3, and the manufacturing process comprises a pressing step, a pre-firing step, a side high resistance layer coating step, a firing step, a side glaze layer coating step, a heat treatment step, a grinding step and an electrode spraying step, which are performed in sequence; The pressing step comprises using bidirectional pressing to press the zinc oxide particles into a semi-finished product having the shape of the resistor sheet blank (1), and degassing the semi-finished product three to five times during the pressing process.

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