Upper electrode arrangement and semiconductor process apparatus

Abstract

This invention discloses an upper electrode device and semiconductor process equipment. The upper electrode device includes: an inlet structure, which penetrates a chamber cover and is movably and sealingly connected to the chamber cover for introducing process gas into the process chamber; a first adjustment mechanism, including at least one first displacement guide component connected to one end of the inlet structure outside the chamber body, for guiding the inlet structure when it moves along a first horizontal direction; and a second adjustment mechanism, including at least one second displacement guide component connected to one end of the inlet structure outside the chamber body, for guiding the inlet structure when it moves along a second horizontal direction, wherein the first horizontal direction intersects the second horizontal direction. This invention improves the controllability and convenience of coaxiality adjustment between the upper electrode inlet structure and the wafer.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor equipment, and more specifically, relates to an upper electrode device and semiconductor process equipment. Background Technology

[0002] In IC (integrated circuit) manufacturing processes, edge etching machines are indispensable equipment. During the deposition and etching process of wafers, polymers of different compositions and thicknesses are generated at the edges. If these polymers are not removed in time, they can easily cause defects in integrated circuits in subsequent processes, especially at the wafer edges. This is one of the main reasons for reduced product yield. With the continuous development of advanced processes, it has become particularly important to improve product yield by using edge etching machines. The upper electrode structure of the machine is particularly critical. Since only the wafer edges need to be etched, the center position of the wafer and the upper gas outlet plate needs to be controllable. By adjusting the center position, different etching areas can be selected, ultimately achieving uniform edge etching and preventing over-etching of the wafer. This requires particularly good coaxiality between the gas outlet plate and the wafer, enabling adjustable functionality.

[0003] However, the current methods for adjusting the coaxiality between the wafer and the gas outlet have problems such as poor controllability and complicated operation. Summary of the Invention

[0004] The purpose of this invention is to provide an upper electrode device and semiconductor process equipment to improve the controllability and convenience of adjusting the coaxiality between the upper electrode gas inlet structure and the wafer.

[0005] To achieve the above objectives, in a first aspect, the present invention provides an upper electrode device applied to a process chamber of a semiconductor process equipment, wherein the process chamber includes a chamber body and a chamber cover plate disposed on the chamber body, and the upper electrode device includes:

[0006] An air intake structure is provided through the chamber cover plate and is movably and sealingly connected to the chamber cover plate for introducing process gas into the process chamber;

[0007] The first adjustment mechanism includes at least one first displacement guide component, which is connected to one end of the air intake structure located outside the chamber body, and is used to guide the air intake structure when the air intake structure moves along a first horizontal direction.

[0008] The second adjustment mechanism includes at least one second displacement guide component, which is connected to one end of the air intake structure located outside the chamber body, for guiding the air intake structure when the air intake structure moves along a second horizontal direction, wherein the first horizontal direction intersects the second horizontal direction.

[0009] Optionally, it also includes a movable bracket, which is disposed above the chamber cover, and the air intake structure is disposed on the movable bracket;

[0010] The first displacement guide component and the second displacement guide component are disposed on the movable bracket and are respectively located on adjacent sides of the air intake structure.

[0011] Optionally, the first displacement guiding component and the second displacement guiding component are guiding components with the same structure;

[0012] The guide assembly includes a fixing member and a connecting member. The air intake structure includes a guide structure. The fixing member is disposed on the movable bracket. One end of the connecting member is slidably connected to the fixing member, and the other end is guided and engaged with the guide structure.

[0013] Optionally, the fixing member includes a sliding bearing seat, and the connecting member includes a sliding shaft and a guide seat;

[0014] The sliding bearing seat is fixed to the movable bracket, and the sliding shaft passes through the sliding bearing seat and is slidably connected to the sliding bearing seat;

[0015] One end of the guide seat is fixedly connected to the sliding shaft, and the other end of the guide seat is guided and engaged with the guide structure.

[0016] When the air intake structure moves along the first horizontal direction, the sliding shaft in the second displacement guide assembly slides along the first horizontal direction;

[0017] When the air intake structure moves along the second horizontal direction, the sliding shaft in the first displacement guide assembly slides along the second horizontal direction.

[0018] Optionally, the guide assembly further includes an adjusting set screw, and the top end of the sliding bearing seat is provided with a first threaded hole, the adjusting set screw being able to engage with the first threaded hole to lock the sliding shaft.

[0019] Optionally, one end of the guide seat is provided with a first connecting part and a second connecting part, the first connecting part and the second connecting part are respectively disposed on both sides of the sliding bearing seat, the first connecting part is connected to one end of the sliding shaft, and the second connecting part is connected to the other end of the sliding shaft;

[0020] The distance between the first connecting part and the second connecting part is greater than the width of the sliding bearing seat.

[0021] Optionally, the air intake structure includes a pad, which is disposed on the movable bracket and detachably connected to the movable bracket;

[0022] The guide structure includes a blind hole on the side of the pad and a guide sleeve disposed in the blind hole. One end of the blind hole is provided with an annular groove, and a retaining spring is provided in the annular groove. The guide sleeve is fixed in the blind hole by the retaining spring, and the other end of the guide seat is inserted into the guide sleeve.

[0023] Optionally, the first adjustment mechanism further includes a first displacement adjustment component, and the second adjustment mechanism further includes a second displacement adjustment component, wherein the first displacement adjustment component and the second displacement adjustment component are disposed on the movable support;

[0024] The first displacement adjustment component is connected to the air intake structure and is used to drive the air intake structure to move along the first horizontal direction;

[0025] The second displacement adjustment component is connected to the air intake structure and is used to drive the air intake structure to move along the second horizontal direction.

[0026] Optionally, the first displacement adjusting component and the second displacement adjusting component are the same displacement adjusting element;

[0027] The displacement adjusting component includes a limiting support and an adjusting rod;

[0028] The limiting support is fixedly connected to the movable bracket, and one end of the adjusting rod passes through the limiting support and is threadedly connected to the air intake structure.

[0029] The axial direction of the adjusting rod in the first displacement adjusting assembly is parallel to the first horizontal direction, and the limiting support is provided with a groove extending along the second horizontal direction. The axial direction of the adjusting rod in the second displacement adjusting assembly is parallel to the second horizontal direction, and the limiting support is provided with a groove extending along the first horizontal direction.

[0030] Optionally, a first displacement guide component is provided on each side of the first displacement adjustment component, and a second displacement guide component is provided on each side of the second displacement adjustment component.

[0031] Optionally, it also includes a first horizontal displacement measuring element and a second horizontal displacement measuring element;

[0032] The first horizontal displacement measuring component is disposed opposite to the first displacement guiding component, and the second horizontal displacement measuring component is disposed opposite to the second displacement guiding component;

[0033] The first horizontal displacement measuring device is used to monitor the displacement of the air intake structure in the first horizontal direction in real time;

[0034] The second horizontal displacement measuring device is used to monitor the displacement of the air intake structure in the second horizontal direction in real time.

[0035] Optionally, both the first horizontal displacement measuring device and the second horizontal displacement measuring device are laser displacement sensors.

[0036] In a second aspect, the present invention provides a semiconductor process apparatus, comprising: a process chamber and an upper electrode device as described in any of the first aspects, wherein the interior of the process chamber is provided with a base for supporting a wafer, and a lifting drive mechanism is provided above the process chamber for driving the air intake structure to rise and fall.

[0037] The beneficial effects of this invention are as follows:

[0038] The upper electrode device of the present invention guides the horizontal displacement adjustment of the intake structure through a first adjustment mechanism and a second adjustment mechanism. The first adjustment mechanism includes at least one first displacement guiding component, and the second adjustment mechanism includes at least one second displacement guiding component. The first displacement guiding component is connected to one end of the intake structure located outside the chamber body and is used to guide the intake structure when it moves along a first horizontal direction. The second displacement guiding component is connected to one end of the intake structure located outside the chamber body and is used to guide the intake structure when it moves along a second horizontal direction. By using the first and second adjustment mechanisms, the intake structure can be guided when it moves horizontally, thereby ensuring that the intake structure can move accurately along the first or second horizontal direction, avoiding uncontrollable displacement adjustment caused by rotation of the intake structure along its axial direction, and thus accurately adjusting the coaxiality between the intake structure and the wafer.

[0039] The system of the present invention has other features and advantages that will be apparent from or will be set forth in detail in the accompanying drawings and following detailed description, which together serve to explain the particular principles of the invention. Attached Figure Description

[0040] The above and other objects, features and advantages of the present invention will become more apparent from the accompanying drawings, in which like reference numerals generally denote like parts.

[0041] Figure 1 A top view of the upper electrode of the existing edge etching chamber is shown.

[0042] Figure 2 A top view of a semiconductor process chamber according to Embodiment 1 of the present invention is shown.

[0043] Figure 3 It shows along Figure 2 Longitudinal sectional view of BB.

[0044] Figure 4 It shows Figure 4 A magnified view of the guide component at point II.

[0045] Figure 5 It shows along Figure 4 Longitudinal sectional view along the AA direction.

[0046] Figure 6 An enlarged view of a horizontal displacement adjustment element in a semiconductor process chamber according to Embodiment 1 of the present invention is shown. Detailed Implementation

[0047] The upper electrode structure of the edge etching machine is as follows Figure 1 As shown, the system includes an altimeter 4, an air intake structure, a movable support 7, and a connecting assembly 14. The air intake structure includes a pad, a leveling plate 6, an air passage connecting cylinder, and an air outlet plate. The pad is located below the leveling plate 6 and is fixed to it via the connecting assembly 14. The pad is fixed to the movable support 7 by fastening screws 5. The movable support 7 moves the air intake structure up and down via the pad. Due to machining accuracy and installation errors, the wafer (base or lower electrode) and the air outlet plate in the process chamber cannot be coaxial in the initial state. Therefore, the leveling plate 6 needs to be adjusted by a first coaxial adjustment mechanism 17 and a second coaxial adjustment mechanism 18, thereby causing the air intake and exhaust plates to move horizontally.

[0048] Both the first coaxial adjustment mechanism 17 and the second coaxial adjustment mechanism 18 include an adjustment knob and a limiting support. The adjustment knob is connected to the pad by a thread. The limiting support can restrict the adjustment knob from moving back and forth in the corresponding direction, but it can move left and right. Since the back and forth movement of the adjustment knob is restricted, rotating the adjustment knob can drive the pad to move back and forth through the thread. The adjustment amount in the corresponding direction can be obtained by the change in the reading of the altimeter 4 fixed on the moving bracket 7 in the corresponding direction (the altimeter 4 has a retractable reading head. The movement of the pad will press the reading head to retract. The altimeter is fixed on the moving bracket 7, and the reading head abuts against the pad). Since the horizontal adjustment plate 6 and the pad are fastened together by the connecting assembly 14, the air outlet plate also undergoes the same displacement.

[0049] Current coaxial adjustment mechanisms have the following problems:

[0050] 1. The pad is a ring-shaped part, which is naturally placed on the movable bracket 7. Due to the lack of installation positioning guide reference for the pad and the gap between the threaded transmission, the adjustment knobs in the X and Y directions are not perpendicular to each other. When adjusting the displacement, the pad may rotate around the Z direction (i.e., the axis of the air outlet plate), resulting in uncontrollable changes.

[0051] 2. When adjusting the X-direction displacement, the Y-direction displacement will also change due to the gap between the threaded drives. This requires restoring the Y-direction change, and unnecessary repetitive actions will prolong the maintenance time.

[0052] 3. During normal operation of the machine, the actual position of the air outlet plate is constantly changing due to vibration and other reasons. However, the existing structure cannot monitor the status of the air outlet plate in real time. As a result, when the amount of change accumulates to a certain extent, the uniformity of etching will not meet the requirements, but it cannot be detected and dealt with in time.

[0053] This invention provides a semiconductor process chamber and semiconductor process equipment. The coaxial adjustment mechanism incorporates guiding functions in two horizontal directions, improving the controllability of the displacement direction and preventing the exhaust plate from rotating along its axial direction (Z-axis). Simultaneously, a real-time monitoring function for the exhaust plate's center position is added, recording the positional change between the exhaust plate and the wafer in real time.

[0054] The invention will now be described in more detail with reference to the accompanying drawings. While preferred embodiments of the invention are shown in the drawings, it should be understood that the invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the invention will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.

[0055] Example 1

[0056] like Figure 2 and Figure 3 As shown, an upper electrode device is applied to a process chamber of a semiconductor process equipment. The process chamber includes a chamber body and a chamber cover plate 101 covering the chamber body. The upper electrode device includes:

[0057] An air intake structure is provided through the chamber cover plate 101 and is movably and sealingly connected to the chamber cover plate 101 for introducing process gas into the process chamber.

[0058] The first adjustment mechanism includes at least one first displacement guide component 201, which is connected to one end of the air intake structure located outside the chamber body, and is used to guide the air intake structure when the air intake structure moves along the first horizontal direction.

[0059] The second adjustment mechanism includes at least one second displacement guide component 202, which is connected to one end of the intake structure located outside the chamber body, for guiding the intake structure when the intake structure moves along a second horizontal direction, wherein the first horizontal direction intersects the second horizontal direction.

[0060] refer to Figure 3 In this embodiment, the upper electrode device further includes a movable support 102, which is disposed above the chamber cover 101, and an air intake structure is disposed on the movable support 102. A first displacement guide assembly 201 and a second displacement guide assembly 202 are disposed on the movable support 102 and located on adjacent sides of the air intake structure, respectively. The air intake structure includes a pad 103, which is disposed on the movable support 102 and detachably connected to it.

[0061] Specifically, the movable bracket 102 is positioned above the process chamber and is used to drive the intake structure to rise and fall. The top of the movable bracket 102 has a supporting plane; the pad 103 is annular and is positioned on the supporting plane; the first displacement guide assembly 201 and the second displacement guide assembly 202 are both positioned on the supporting plane and are located on adjacent sides of the intake structure, respectively. Preferably, the first horizontal direction is perpendicular to the second horizontal direction.

[0062] In this embodiment, the air intake structure also includes a horizontal adjustment plate 105, an air passage connecting cylinder 106, an air outlet plate 107, and a bellows 108.

[0063] The top edge of the horizontal adjustment plate 105 is provided with an annular connecting part, the bottom surface of the annular connecting part overlaps and is fixed with the top surface of the pad 103, and the horizontal adjustment plate 105 and the pad 103 are coaxially arranged; the horizontal adjustment plate 105 and the pad 103 are fixedly connected by a connecting component 113.

[0064] The bottom of the air outlet plate 107 extends into the chamber body, the top of the air passage connecting cylinder 106 is fixedly connected to the bottom of the horizontal adjustment plate 105, and the bottom of the air passage connecting cylinder 106 penetrates the top wall of the process chamber and is fixedly connected to the top of the air outlet plate 107.

[0065] The pad 103, the horizontal adjustment plate 105, the air passage connecting cylinder 106 and the air outlet plate 107 are coaxially arranged; the horizontal adjustment plate 105 has an air inlet 111 in the center, the air passage connecting cylinder 106 has a gas passage, and the air outlet plate 107 has an air channel. The air inlet 111, the gas passage and the air channel are connected in sequence.

[0066] The air passage includes an air inlet located at the center of the top of the air outlet plate 107 and an air outlet located at the bottom edge of the air outlet plate 107;

[0067] The bellows 108 is disposed outside the gas connection cylinder 106. The top end of the bellows 108 is sealed to the bottom end of the horizontal adjustment plate 105, and the bottom end of the bellows 108 is sealed to the top wall of the process chamber.

[0068] The chamber body has a base 110 for supporting the wafer inside. The base 110 is located directly below the vent plate 107. The bottom of the chamber body has an vent 112.

[0069] In this embodiment, the first displacement guide component 201 and the second displacement guide component 202 are guide components with the same structure; the guide component includes a fixing member and a connecting member, the air intake structure includes a guide structure, the fixing member is disposed on the movable bracket 102, one end of the connecting member is slidably connected to the fixing member, and the other end is guided and cooperated with the guide structure.

[0070] Specifically, such as Figure 4 and Figure 5 As shown, the guide assembly includes a fixing component and a connecting component. The fixing component includes a sliding bearing seat 401, and the connecting component includes a sliding shaft 403 and a guide seat 402. The sliding bearing seat 401 is fixed to the support surface at the top of the movable bracket 102, and the sliding shaft 403 passes through the sliding bearing seat 401 and is slidably connected to the sliding bearing seat 401. One end of the guide seat 402 is fixedly connected to the sliding shaft 403, and the other end of the guide seat 402 is guided and engaged with the guide structure on the side of the pad 103. When the air intake structure moves along the first horizontal direction, the sliding shaft 403 in the second displacement guide assembly slides along the first horizontal direction. When the air intake structure moves along the second horizontal direction, the sliding shaft 403 in the first displacement guide assembly slides along the second horizontal direction.

[0071] Preferably, one end of the guide seat 402 is provided with a first connecting portion and a second connecting portion. The first connecting portion and the second connecting portion are respectively disposed on both sides of the sliding bearing seat 401. The first connecting portion is connected to one end of the sliding shaft 403, and the second connecting portion is connected to the other end of the sliding shaft 403. The distance between the first connecting portion and the second connecting portion is greater than the width of the sliding bearing seat 401. Compared with a single-end connection, the connection method using the first connecting portion and the second connecting portion can prevent the guide seat from shaking and improve the stability of the guiding process.

[0072] The air intake structure has a blind hole on the side of the pad 103 and a guide sleeve 404 inside the blind hole. One end of the blind hole has an annular groove, and a retaining spring 405 is provided in the annular groove. The guide sleeve 404 is fixed in the blind hole by the retaining spring 405.

[0073] The other end of the guide seat 402 is provided with a guide post, the axial direction of which is perpendicular to the sliding shaft 403; the side of the pad 103 is provided with a blind hole corresponding to the guide post, the guide sleeve 404 is fixed in the round hole by a snap ring 405, and the guide post is inserted into the guide sleeve 404.

[0074] The axial direction of the guide post in the first displacement guide assembly 201 is parallel to the first direction, and the sliding shaft 403 in the first displacement guide assembly 201 can slide in the sliding bearing seat 401 along the second horizontal direction; the axial direction of the guide post in the second displacement guide assembly 202 is parallel to the second direction, and the sliding shaft 403 in the second displacement guide assembly 202 can slide in the sliding bearing seat 401 along the first horizontal direction.

[0075] The horizontal displacement guide uses a guide bushing 404 to cooperate with the guide post on the guide seat 402, and there can be a very small clearance between the two; at the same time, a sliding shaft 403 is slidably engaged with a sliding bearing seat 401, and there can also be a very small clearance between the two. Therefore, the installation accuracy of the moving parts can be improved and the friction loss inside the coaxial adjustment structure can be reduced.

[0076] Preferably, in this embodiment, the first adjustment mechanism includes two first displacement guide components 201 disposed on the same side of the movable support, and the second adjustment mechanism includes two second displacement guide components 202 disposed on the other side of the movable support adjacent to the first adjustment mechanism. Using two horizontal displacement guide components on each side simultaneously can improve the stability of the support during the translational sliding of the pad 103.

[0077] like Figure 5 As shown, in this embodiment, the guide assembly also includes an adjusting screw 406. The top end of the sliding bearing seat 401 is provided with a first threaded hole. The adjusting screw 406 can cooperate with the first threaded hole to lock the sliding shaft 403.

[0078] For example, when adjusting the displacement of the air outlet disc 107 in the first horizontal direction, first tighten the adjusting screws 406 of the two first displacement guide components 201 to lock the sliding shaft 403 of the first displacement guide component 201, thereby preventing the guide seat 402 from sliding relative to the sliding bearing seat 401 in the second horizontal direction. Then loosen the adjusting screws 406 of the two second displacement guide components 202, and then rotate the knob of the first displacement adjustment component 301 located on the first side. This allows the guide seats 402 in the two first displacement guide components 201 to be guided along the first direction, and the guide seats 402 and sliding shaft 403 of the two second displacement guide components 202 to slide on the sliding bearing seat 401. The maximum sliding distance is... Figure 4 As shown in 2a.

[0079] In this embodiment, the first adjustment mechanism further includes a first displacement adjustment component 301, and the second adjustment mechanism further includes a second displacement adjustment component 302. The first displacement adjustment component 301 and the second displacement adjustment component 302 are disposed on the movable bracket 102. The first displacement adjustment component 301 is connected to the air intake structure and is used to drive the air intake structure to move along a first horizontal direction. The second displacement adjustment component 302 is connected to the air intake structure and is used to drive the air intake structure to move along a second horizontal direction.

[0080] like Figure 6 As shown, in this embodiment, the first displacement adjustment component 301 and the second displacement adjustment component 302 are the same displacement adjustment component; the displacement adjustment component includes a limiting support 501 and an adjusting rod 502; the limiting support 501 is fixedly connected to the movable bracket 102, and one end of the adjusting rod 502 passes through the limiting support 501 and is threadedly connected to the air intake structure.

[0081] The adjusting rod 502 in the first displacement adjusting assembly 301 has its axis parallel to the first horizontal direction, and the limiting support 501 is provided with a groove extending along the second horizontal direction. The adjusting rod 502 in the second displacement adjusting assembly 302 has its axis parallel to the second horizontal direction, and the limiting support 501 is provided with a groove extending along the first horizontal direction.

[0082] Specifically, the limiting support 501 is fixed to the support surface of the movable bracket 102. The limiting support 501 has a sliding groove, and the adjusting rod 502 has a central annular protrusion located within the sliding groove. One end of the adjusting rod 502 has a handle, and the other end has a thread. The side of the pad 103 has a corresponding threaded hole. The adjusting rod 502 and the pad 103 are threaded together. Adjustment of the pad 103 in the horizontal displacement direction is achieved by rotating the adjusting rod 502. The axial direction of the adjusting rod 502 in the first displacement adjusting assembly 301 is parallel to the first horizontal direction, and the sliding groove in the limiting support 501 extends along the second horizontal direction. The axial direction of the adjusting rod 502 in the second displacement adjusting assembly 302 is parallel to the second horizontal direction, and the sliding groove in the limiting support 501 extends along the first horizontal direction. When the adjusting rod 502 in the first displacement adjusting assembly 301 is rotated, the air intake structure moves along the first horizontal direction. At this time, the adjusting rod 502 in the second displacement adjusting assembly 302 can slide along the first horizontal direction within the limiting support 501. When the adjusting rod 502 in the second displacement adjusting assembly 302 is rotated, the air intake structure moves along the second horizontal direction. At this time, the adjusting rod 502 in the first displacement adjusting assembly 301 can slide along the first horizontal direction within the limiting support 501.

[0083] In other embodiments, the displacement adjustment member can also be implemented in other ways, such as by setting a groove on the support surface, setting the limiting support 501 in the groove, and setting a bearing in the limiting support 501. The adjusting rod 502 passes through the bearing, that is, the adjusting rod 502 can rotate in the limiting support 501, and the limiting support 501 can slide on the support surface in an axial direction perpendicular to the adjusting rod 502.

[0084] Preferably, in this embodiment, a first displacement guide component 201 is provided on each side of the first displacement adjustment component 301, and a second displacement guide component 202 is provided on each side of the second displacement adjustment component 302.

[0085] In this embodiment, the upper electrode device further includes a first horizontal displacement measuring element 303 and a second horizontal displacement measuring element 304; the first horizontal displacement measuring element 303 is disposed opposite to the first displacement guiding assembly 201, and the second horizontal displacement measuring element 304 is disposed opposite to the second displacement guiding assembly 202; the first horizontal displacement measuring element 303 is used to monitor the displacement of the intake structure in the first horizontal direction in real time; the second horizontal displacement measuring element 304 is used to monitor the displacement of the intake structure in the second horizontal direction in real time. Preferably, both the first horizontal displacement measuring element 303 and the second horizontal displacement measuring element 304 are laser displacement sensors.

[0086] Specifically, the laser displacement sensor can be connected to a host computer. By collecting the movement of the horizontal adjustment plate 105 in the first and second horizontal directions in real time and uploading it to the host computer, the displacement change during the adjustment process can be calculated and read out, or the calculated change can be recorded during monitoring, so as to dynamically understand the center position of the air outlet plate 107.

[0087] Compared to existing displacement measurement methods, replacing the altimeter with a laser displacement sensor, also fixed on the movable bracket 102, allows for real-time acquisition of displacement data in both the first and second horizontal directions. It also enables the calculation and reading of displacement changes during adjustment, or the recording of calculated changes during monitoring, thereby dynamically determining the center position of the air disc 107. It should be noted that this embodiment does not limit the specific location of the laser displacement sensor, as long as it can detect displacement changes.

[0088] Taking the etching machine as an example, during the process debugging stage, the machine will initially etch a wafer. By calculating the morphology data of the edge etching, the offset of the gas outlet plate 107 is obtained. After changing the position of the gas outlet plate 107, the latest process results are used to determine whether the relative positions of the gas outlet plate 107 and the wafer on the base 110 are coaxial. The real-time monitoring function of the center position of the gas outlet plate 107 is added, and the relative position change of the two can be recorded in real time.

[0089] In summary, the upper electrode device of this embodiment has the following advantages:

[0090] 1. Adding a guide mechanism to the coaxial adjustment mechanism makes the unidirectional adjustment more stable and avoids rotational motion other than linear displacement in the first and second horizontal directions.

[0091] 2. Improved the installation accuracy of the coaxial adjustment mechanism and reduced internal frictional losses;

[0092] 3. A real-time monitoring function for the center position of the venting plate 107 has been added to promptly understand the coaxiality of the venting plate 107 and the wafer, thus avoiding over-etching.

[0093] 4. Unidirectional adjustment is more stable and effectively reduces the maintenance time of coaxial adjustment.

[0094] Example 2

[0095] refer to Figure 3 This embodiment provides a semiconductor process equipment, including: a process chamber and the upper electrode device described in Embodiment 1. The process chamber is provided with a base for supporting the wafer, and a lifting drive mechanism is provided above the process chamber for driving the air intake structure to lift.

[0096] Specifically, the lifting drive mechanism drives the intake structure to rise and fall through the movable bracket 102. The power input for the lifting drive can be transmitted by a lead screw structure. The specific lifting drive can include a support fixed on the top surface of the chamber cover 101. The lower end of the support is fixed with a lead screw, so that the lead screw can only rotate. The lead screw nut is fixed on the movable bracket 102, thus realizing the lifting and falling of the intake structure.

[0097] The various embodiments of the present invention have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments.

Claims

1. An upper electrode device, applied in a process chamber of semiconductor process equipment, wherein, The process chamber includes a chamber body and a chamber cover plate disposed on the chamber body, characterized in that the upper electrode device includes: An air intake structure is provided through the chamber cover plate and is movably and sealingly connected to the chamber cover plate for introducing process gas into the process chamber; The first adjustment mechanism includes at least one first displacement guide component, which is connected to one end of the air intake structure located outside the chamber body, and is used to guide the air intake structure when the air intake structure moves along a first horizontal direction. The second adjustment mechanism includes at least one second displacement guide component, which is connected to one end of the air intake structure located outside the chamber body, and is used to guide the air intake structure when the air intake structure moves along a second horizontal direction, wherein the first horizontal direction intersects the second horizontal direction; A movable bracket is disposed above the chamber cover, and the air intake structure is disposed on the movable bracket; The first displacement guiding component and the second displacement guiding component are guiding components with the same structure; The guide assembly includes a fixing member and a connecting member, the air intake structure includes a guide structure, the fixing member is disposed on the movable bracket, one end of the connecting member is slidably connected to the fixing member, and the other end is guided and engaged with the guide structure. The fixing component includes a sliding bearing seat, and the connecting component includes a sliding shaft and a guide seat; The sliding bearing seat is fixed to the movable bracket, and the sliding shaft passes through the sliding bearing seat and is slidably connected to the sliding bearing seat; One end of the guide seat is fixedly connected to the sliding shaft, and the other end of the guide seat is guided and engaged with the guide structure. The guide assembly further includes an adjusting set screw, and the top end of the sliding bearing seat is provided with a first threaded hole. The adjusting set screw can cooperate with the first threaded hole to lock the sliding shaft. The air intake structure includes a pad, which is disposed on the movable bracket and detachably connected to the movable bracket; The guide structure includes a blind hole on the side of the pad and a guide sleeve disposed in the blind hole, and the other end of the guide seat is inserted into the guide sleeve.

2. The upper electrode device according to claim 1, characterized in that, The first displacement guide component and the second displacement guide component are disposed on the movable bracket and are respectively located on adjacent sides of the air intake structure.

3. The upper electrode device according to claim 1, characterized in that, When the air intake structure moves along the first horizontal direction, the sliding shaft in the second displacement guide assembly slides along the first horizontal direction; When the air intake structure moves along the second horizontal direction, the sliding shaft in the first displacement guide assembly slides along the second horizontal direction.

4. The upper electrode device according to claim 1, characterized in that, The guide seat has a first connecting part and a second connecting part at one end. The first connecting part and the second connecting part are respectively disposed on both sides of the sliding bearing seat. The first connecting part is connected to one end of the sliding shaft, and the second connecting part is connected to the other end of the sliding shaft. The distance between the first connecting part and the second connecting part is greater than the width of the sliding bearing seat.

5. The upper electrode device according to claim 1, characterized in that, One end of the blind hole is provided with an annular groove, and a retaining spring is provided in the annular groove. The guide sleeve is fixed in the blind hole by the retaining spring.

6. The upper electrode device according to claim 1, characterized in that, The first adjustment mechanism further includes a first displacement adjustment component, and the second adjustment mechanism further includes a second displacement adjustment component, wherein the first displacement adjustment component and the second displacement adjustment component are disposed on the movable support; The first displacement adjustment component is connected to the air intake structure and is used to drive the air intake structure to move along the first horizontal direction; The second displacement adjustment component is connected to the air intake structure and is used to drive the air intake structure to move along the second horizontal direction.

7. The upper electrode device according to claim 6, characterized in that, The first displacement adjusting component and the second displacement adjusting component are the same displacement adjusting element; The displacement adjusting component includes a limiting support and an adjusting rod; The limiting support is fixedly connected to the movable bracket, and one end of the adjusting rod passes through the limiting support and is threadedly connected to the air intake structure. The axial direction of the adjusting rod in the first displacement adjusting assembly is parallel to the first horizontal direction, and the limiting support is provided with a groove extending along the second horizontal direction. The axial direction of the adjusting rod in the second displacement adjusting assembly is parallel to the second horizontal direction, and the limiting support is provided with a groove extending along the first horizontal direction.

8. The upper electrode device according to claim 6, characterized in that, The first displacement adjustment component is provided with a first displacement guide component on each side, and the second displacement adjustment component is provided with a second displacement guide component on each side.

9. The upper electrode device according to claim 1, characterized in that, It also includes a first horizontal displacement measuring element and a second horizontal displacement measuring element; The first horizontal displacement measuring component is disposed opposite to the first displacement guiding component, and the second horizontal displacement measuring component is disposed opposite to the second displacement guiding component; The first horizontal displacement measuring device is used to monitor the displacement of the air intake structure in the first horizontal direction in real time; The second horizontal displacement measuring device is used to monitor the displacement of the air intake structure in the second horizontal direction in real time.

10. The upper electrode device according to claim 9, characterized in that, Both the first horizontal displacement measuring device and the second horizontal displacement measuring device are laser displacement sensors.

11. A semiconductor process apparatus, characterized in that, include: The process chamber and the upper electrode device according to any one of claims 1-10, wherein the process chamber is provided with a base for supporting the wafer, and a lifting drive mechanism is provided above the process chamber for driving the air intake structure to rise and fall.

Images