Disassembling mechanism and method

Abstract

The invention discloses a disassembling mechanism and method used for disassembling a circuit board structure, and the disassembling mechanism comprises a feeding device and a disassembling device; the feeding device comprises a movable carrier plate, a first positioning module and a second positioning module, wherein the first positioning module is arranged on the carrier plate and used for forming a space capable of being adjusted in the longitudinal direction, and the second positioning module is arranged on the carrier plate and used for forming a space capable of being adjusted in the transverse direction. The disassembling device comprises a moving plate arranged in a lifting mode and a plurality of hook claw modules arranged in the circumferential direction of the moving plate, the moving plate and the carrier plate are oppositely arranged, and each hook claw module comprises a claw part capable of extending to the gap in a telescopic mode, so that the multiple claw parts act on a stress balance area of the first circuit board. According to the disassembling mechanism, the balanced stress of the circuit board can be kept in the disassembling process, the connector is accurately disassembled, and the connector is prevented from being damaged.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit board maintenance, and in particular relates to a disassembly mechanism and method. Background Art

[0002] As an indispensable component of electronic systems, high-speed connectors play an important role in data transmission and electrical connection. Connectors are fixedly connected on circuit boards by soldering. For the double-board structure of the circuit board structure, male and female connectors need to be plugged in and connected. When repairing, analyzing connector abnormalities, or testing connector plug-in performance, the male and female connectors need to be disassembled.

[0003] The disassembly process of high-speed connectors can be divided into several different levels, and the disassembly methods will vary depending on the type and complexity of the connector. The disassembly of entry-level low-speed connectors is relatively simple. The main steps include pushing the female connector to unlock, then pressing the lock with your fingers to release the locking state of the male and female connectors, and finally pulling outward to separate the male and female connectors; the above disassembly methods are applicable to connectors connected by locking parts.

[0004] However, for high-performance high-speed connectors, the high-speed connector is firmly connected to the circuit board, and the disassembly force needs to be controlled within a certain range. If the high-speed connector is disassembled manually in the traditional way, the force used to disassemble the high-speed connector is too large, or the disassembly force is skewed relative to the position of the high-speed connector, the high-speed connector is directly subjected to tension and damaged, resulting in the connection position with the circuit board being forced to loosen, the circuit board being contaminated by impurities, and the pins on the high-speed connector falling off or deforming. Therefore, a disassembly mechanism and disassembly method that does not damage the high-speed connector is needed. Summary of the invention

[0005] The purpose of the present invention is to solve the above technical problems and provide a disassembly mechanism and method, so that the disassembly mechanism can maintain balanced force on the circuit board during the disassembly process, the connector is accurately disassembled, and damage to the connector is avoided. In order to achieve the above purpose, the technical solution of the present invention is as follows:

[0006] A disassembly mechanism is used to disassemble a circuit board structure, the circuit board structure includes a first circuit board and a second circuit board, there is a gap between the first circuit board and the second circuit board, a connector is connected between the first circuit board and the second circuit board, the disassembly mechanism includes a feeding device and a disassembly device; the feeding device includes a movable carrier, a first positioning module arranged on the carrier for forming a longitudinally adjustable space, and a second positioning module arranged on the carrier for forming a transversely adjustable space, the first positioning module and the second positioning module locate the circumferential position of the circuit board structure,

[0007] The disassembly device includes a lifting movable plate and a plurality of hook modules arranged around the movable plate, the movable plate is arranged opposite to the carrier plate, the hook module is arranged to move around the movable plate, the hook module includes a claw portion that can be telescopically extended to the gap, so that the plurality of claw portions act on the force balance area around the first circuit board relative to the connector to separate the first circuit board and the second circuit board, and the connector is disassembled at the same time.

[0008] Specifically, the disassembly mechanism further includes a first detection module for identifying position information of the connector and a second detection module for identifying position height information of the circuit board structure.

[0009] Specifically, the first positioning module includes a plurality of first fixing blocks arranged at one end of the carrier plate and an adjustment component arranged at the other end of the carrier plate;

[0010] The adjustment assembly includes a first adjustment block and second adjustment blocks arranged on both sides of the first adjustment block;

[0011] The circuit board structure also includes a shell connected to the second circuit board, and the first adjusting block and the first fixing block relatively clamp and position two ends of the shell.

[0012] Specifically, the adjustment assembly also includes a guide member, which is arranged on the side of the second adjustment block and is used to guide the second adjustment block to slide longitudinally. One end of the second adjustment block is slidably matched with the guide member, and the other end of the second adjustment block extends out of the guide member and is provided with an extension portion. The extension portion is arranged horizontally, and the extension portion and the first fixed block are relatively clamped to position the two ends of the shell.

[0013] Specifically, the first positioning module further includes a plurality of second fixing blocks disposed on both sides of the carrier plate and arranged in the longitudinal direction, and the guide member, the extension portion and the second fixing blocks enclose a limiting space.

[0014] Specifically, the second positioning module includes side push assemblies arranged on both sides of the carrier plate;

[0015] The side push assembly includes a fixed seat, a side push block disposed on the fixed seat and moving in the lateral direction, and a crimping portion disposed on the side of the side push block;

[0016] The relative distance between the side push blocks located on both sides of the carrier plate is adjustable.

[0017] Specifically, the circuit board structure also includes a shell connected to the second circuit board, the shell and the second circuit board are spaced apart, the crimping portion extends between the shell and the second circuit board, the crimping portions located on both sides of the carrier plate relatively clamp and position the two sides of the shell, the side walls of the crimping portion abut against the side edges and / or top corners of the second circuit board, and the bottom of the crimping portion abuts against the surface of the shell.

[0018] Specifically, the hook module further includes a guide portion arranged in the circumferential direction of the movable plate, and a matching portion slidably connected to the guide portion, and the hook portion is mounted on the matching portion.

[0019] A disassembly method, applied to the disassembly mechanism, comprises:

[0020] Acquire image information of the circuit board structure, and determine a force balance area at a circumferential position of the first circuit board relative to the connector according to the image information, wherein the force balance area is located on an end surface of the first circuit board facing the second circuit board;

[0021] Moving the hook module along the circumferential direction of the movable plate to adjust the hook module to correspond to the force balance area;

[0022] Determine the position information of components in the circuit board structure according to the image information;

[0023] In response to the position information of the component overlapping with the force balance area, and the relative distance between the position information of the component and the edge of the first circuit board is not within a preset range, obtaining the position height information of the hook module relative to the circuit board structure;

[0024] The descending stroke of the movable plate is determined according to the position height information and the image information, so that the claw of the hook module corresponds to the gap between the first circuit board and the second circuit board in the horizontal direction, the claw is positioned to the force balance area, and the movable plate rises to realize the disassembly of the first circuit board and the second circuit board, and at the same time realizes the disassembly of the connector.

[0025] Specifically, the step of moving the hook module along the circumferential direction of the movable plate to adjust the hook module to correspond to the force balance area includes:

[0026] Acquire first position information of the hook module on the mobile plate and second position information of the force balance area projected on the mobile plate;

[0027] Determining a correspondence between the first location information and the second location information;

[0028] In response to the deviation between the first position information and the second position information, the hook module is moved along the circumferential direction of the movable plate to adjust the first position information to correspond to the second position information;

[0029] The method further comprises:

[0030] In response to the position information of the component overlapping with the force balance area, and the relative distance between the position information of the component and the edge of the first circuit board is within a preset range;

[0031] Acquire third position information of the orthographic projection of the outward expansion area on the movable plate, move the hook module along the circumference of the movable plate, adjust the first position information to correspond to the third position information, and acquire position height information of the hook module relative to the circuit board structure, wherein the track of the first circuit board where the force balance area is located extends outward to form the outward expansion area;

[0032] The descending stroke of the movable plate is determined according to the position height information and the image information, so that the claw of the hook module corresponds to the gap between the first circuit board and the second circuit board in the horizontal direction, the claw is positioned to the outward expansion area, and the movable plate rises to realize the disassembly of the first circuit board and the second circuit board, and at the same time realizes the disassembly of the connector.

[0033] Compared with the prior art, the disassembly mechanism and method of the present invention have the following beneficial effects:

[0034] By setting a feeding device, the first positioning module and the second positioning module cooperate to position the circumferential position of the circuit board structure, and can be suitable for disassembling circuit board structures of different sizes and types. On the basis of the firm positioning of the circumferential position of the circuit board structure, the circuit board structure will not be misaligned on the carrier during the disassembly operation; the setting of the feeding device can also improve the convenience of feeding the overall disassembly mechanism; the force balance area on the circumferential position of the circuit board structure is determined according to the position of the connector in the circuit board structure, and the hook claw module in the disassembly device is moved and positioned to the force balance area, and the claw of the hook claw module accurately extends into the gap of the circuit board structure and acts on the force balance area. On the basis of the positioning of the circuit board structure by the carrier board, a balanced force is achieved on the first circuit board, and the first circuit board and the second circuit board are disassembled. The disassembly operation will not cause damage to the circuit board, nor will it cause damage to the connector in the circuit board structure, which greatly improves the use stability of the disassembly mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 A schematic diagram of a disassembly mechanism provided in an embodiment of the present application;

[0036] Figure 2A schematic diagram of a feeding device provided in an embodiment of the present application;

[0037] Figure 3 A schematic diagram of the structure of a carrier board provided in an embodiment of the present application;

[0038] Figure 4 A schematic diagram of a disassembly device provided in an embodiment of the present application;

[0039] Figure 5 A schematic diagram of the bottom surface of a first circuit board provided in an embodiment of the present application;

[0040] Figure 6 A partial side view schematic diagram of a circuit board structure provided in an embodiment of the present application.

[0041] Reference numerals:

[0042] Circuit board structure 1, first circuit board 11, second circuit board 12, housing 13, connector 14, male end 141, female end 142, components 15, force balance area 16, first area 161, second area 162, and external expansion area 17;

[0043] Carrier board 2;

[0044] A first positioning module 3, a first fixing block 31, a first adjusting block 32, a second adjusting block 33, a guide member 34, an extension portion 35, a second fixing block 36, and a first driving member 37;

[0045] The second positioning module 4, the fixing seat 41, the side push block 42, the crimping portion 43, the right-angle groove 431, and the second driving member 44;

[0046] Moving plate 5;

[0047] The hook module 6, the claw portion 61, and the fourth driving member 62;

[0048] Working box 7, linear module 71, mounting slot 72, side stopper 73;

[0049] Stand 8, table 81, column 82;

[0050] Lifting module 9, guide column and guide sleeve assembly 91, and third driving member 92. DETAILED DESCRIPTION

[0051] In order to make the technical solutions and advantages in the embodiments of the present application more clearly understood, the exemplary embodiments of the present application are further described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, rather than an exhaustive list of all the embodiments.

[0052] It should be noted that the terms "S21", "S31", etc. are only used for the purpose of describing the steps, and do not specifically refer to the order or sequence, nor are they used to limit the present application. They are only for the convenience of describing the method of the present application, and cannot be understood as indicating the order of the steps. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection required by the present application.

[0053] Embodiment 1

[0054] This embodiment provides a disassembly mechanism for disassembling a circuit board structure 1. The circuit board structure 1 may be a double-board structure or a multi-board structure. This embodiment uses the disassembly mechanism to disassemble a high-speed connector in a double-board structure as an example for explanation.

[0055] Reference Figure 1-Figure 6 As shown, the double-board structure includes a first circuit board 11 and a second circuit board 12, and there is a gap between the first circuit board 11 and the second circuit board 12, and the first circuit board 11 and the second circuit board 12 can be located in a relatively parallel position. A connector 14 is arranged between the first circuit board 11 and the second circuit board 12, and the connector 14 needs to be disassembled to achieve the test of plug-in performance. The connector 14 includes a male end 141 and a female end 142, the male end 141 is arranged at the bottom of the first circuit board 11, and the female end 142 is arranged at the top of the second circuit board 12, and the male end 141 and the female end 142 are plugged through a number of PIN pins; compared with the traditional method of connecting the male end 141 and the female end 142 through a locker, the male end 141 and the female end 142 are connected by a number of PIN pins. The connection relationship is closer, the signal transmission is more stable, and it also brings the difficulty of disassembling the male end 141 and the female end 142. The above plugging and unplugging performance test of connector 14 is reflected in the need to carry out electrical performance test after the male end 141 and the female end 142 are plugged and unplugged. The circuit board is energized to see whether connector 14 on the dual-board structure can transmit signals stably, and whether the connection relationship between several PIN pins is stable. If the electrical performance test meets the set standards, it means that the assembly of connector 14 is stable; otherwise, it means that there is a deviation in the assembly of connector 14, or the PIN pin may be damaged during plugging.

[0056] The test of the plugging and unplugging performance of the connector 14 requires multiple pressing and disassembly actions on the connector 14. The present embodiment designs a disassembly mechanism for the disassembly action of the connector 14, which can achieve accurate disassembly of the connector 14 without damaging the components 15 on the circuit board and the connector 14, thereby avoiding traditional manual disassembly of the connector 14, which may cause damage to the circuit board or the connector 14 due to uneven force.

[0057] The double-board structure further includes a housing 13 disposed at the bottom of the second circuit board 12 . The second circuit board 12 and the housing 13 may be connected by screw connection or by other connection methods.

[0058] Similarly, the disassembly mechanism is applicable to a multi-board structure, which may include a plurality of circuit boards arranged at intervals, with connectors 14 arranged between adjacent circuit boards; the disassembly mechanism is required to disassemble the connectors 14 .

[0059] This embodiment provides a disassembling mechanism, including a feeding device and a disassembling device.

[0060] The feeding device includes a carrier plate 2 that can be moved and positioned to a designated station, a first positioning module 3 arranged on the carrier plate 2 for forming an adjustable space along the longitudinal direction, and a second positioning module 4 arranged on the carrier plate 2 for forming an adjustable space along the transverse direction. The first positioning module 3 and the second positioning module 4 position the circumferential position of the circuit board structure 1.

[0061] Among them, the adjustment space formed by the second positioning module 4 is located above the adjustment space formed by the first positioning module 3. On the one hand, the lower part of the circuit board structure 1 on the carrier 2 is positioned in the first positioning module 3, and the upper part of the circuit board structure 1 is positioned in the second positioning module 4. The circuit board structure 1 is in a stable state along the vertical direction. On the other hand, the second positioning module 4 is close to the position of the shell 13 and the second circuit board 12 in the circuit board structure 1. The second positioning module 4 has a lateral positioning function on the circuit board structure 1, which is beneficial to the subsequent disassembly operation of the circuit board structure 1. The first circuit board 11 and the second circuit board 12 are stably separated. It is understood that the position of the second positioning module 4 positioned at the circuit board structure 1 has an impact on the effect of the disassembly operation.

[0062] The disassembly device includes a movable plate 5 that is lifted and lowered and a plurality of hook modules 6 that are arranged around the movable plate 5. The movable plate 5 is arranged corresponding to the designated station where the carrier plate 2 is located, and the hook module 6 is arranged to move along the side of the movable plate 5. The hook module 6 includes a claw portion 61 that can be telescopically extended to the gap of the circuit board structure 1, so that the plurality of claw portions 61 act on the force balance area of ​​the circumference of the first circuit board 11 relative to the connector 14, so as to realize the disassembly of the circuit board structure 1 and the connector 14, and the male end 141 and the female end 142 are separated.

[0063] The hook module 6 can be moved along the side of the movable plate 5 by electric drive or pneumatic drive; the hook module 6 includes a claw portion 61 that can be extended to the gap of the circuit board structure 1, and the claw portion 61 can be extended by electric drive or pneumatic drive. The electric drive includes motor drive, and the pneumatic drive includes cylinder drive, which will not be described in detail below.

[0064] In order to ensure the movement stability and controllability of the hook module 6, the hook module 6 also includes a guide portion (not shown) arranged in the circumference of the moving plate 5, a matching portion slidably connected to the guide portion, and the claw portion 61 is installed on the matching portion. The specific guide portion can be a slide rail, and the corresponding matching portion is a slider. The matching portion is driven to move along the guide portion, and the driving method can be an electric drive method or a pneumatic drive method.

[0065] The disassembly mechanism also includes a first detection module for identifying the position of the connector 14 in the circuit board structure 1 and a second detection module for identifying the position height information of the circuit board structure 1. The first detection module identifies the position information of the connector 14 in the circuit board structure 1, can determine the coordinate parameters of the connector 14, and feed back the coordinate parameters of the connector 14 to the control system. The control system calculates the force balance area parameters around the circumferential position of the connector 14 on the circuit board structure 1. The claw module 6 can be adjusted to the specified position on the side of the movable plate 5 so that the claw portion 61 of the claw module 6 can extend to act on the force balance area on the circuit board structure 1. Under the premise of avoiding the position of the components 15 on the circuit board structure 1, the claw module 6 lifts the first circuit board 11 in the circuit board structure 1, separates the first circuit board 11 from the second circuit board 12, and then disassembles the connector 14. The second detection module identifies the position height of the first circuit board 11. Knowing the distance of the gap, the descent coordinate parameters of the movable plate 5 can be determined, so that the hook module 6 is accurately positioned in the gap in the circuit board structure 1, thereby realizing the action of the hook module 6 lifting the first circuit board 11 in the circuit board structure 1.

[0066] Among them, the first detection module can be a visual module, which determines the position of the connector 14 and the positions of other components 15 in the circuit board structure 1 by taking photos from multiple angles; the first detection module can be set on the carrier 2, and when the circuit board structure 1 is positioned on the carrier 2, the position detection of the connector 14 can be realized; the control system receives the image information of the first detection module, obtains the coordinate parameters of the connector 14, the thickness information of the first circuit board 11, the thickness information of the second circuit board 12, the coordinate parameters of other components 15 and the gap distance parameters from the image information, and determines the coordinate parameters of the force balance area around the circumferential position of the connector 14 on the first circuit board 11. The force balance area is set on the bottom surface of the first circuit board 11, and the coordinate parameters of other components 15 are reasonably avoided by calculation.

[0067] The second detection module can be a fiber optic ranging module, and the second detection module can be set on the hook module 6. When the movable plate 5 descends, the second detection module can detect the position height of the first circuit board 11 in the vertical direction. When the movable plate 5 continues to descend, the second detection module can detect the position height of the second circuit board 12 in the vertical direction. The control system receives the position height information of the first circuit board 11 and the position height information of the second circuit board 12 fed back by the first detection module and the second detection module. The thickness information of the first circuit board 11 and the thickness information of the second circuit board 12 are known, and the gap distance between the first circuit board 11 and the second circuit board 12 is calculated. The gap information identified by the first detection module can be reviewed, and the thickness size of the claw 61 is matched with the gap distance, so that the descending position height of the claw 61 of the hook module 6 corresponds to the gap position, and the claw 61 can extend into the gap to reach the force balance area. The surface of the claw 61 is in contact with the bottom surface of the first circuit board 11, and the disassembly device is driven to rise, thereby realizing the disassembly of the first circuit board 11 and the second circuit board 12.

[0068] In this embodiment, the X-axis direction of the disassembly mechanism is defined as the horizontal direction; the Y-axis direction of the disassembly mechanism is defined as the longitudinal direction; the X-axis direction and the Y-axis direction are both horizontal directions; the Z-axis direction of the disassembly mechanism is defined as the vertical direction, which is also the direction of the circuit board position height or the direction of the circuit board thickness.

[0069] In this embodiment, a feeding device is provided, and the first positioning module 3 and the second positioning module 4 cooperate to position the circumferential position of the circuit board structure 1, which can be suitable for disassembling circuit board structures 1 of different sizes and types. On the basis of the firm positioning of the circumferential position of the circuit board structure 1, the circuit board structure 1 will not be misplaced on the carrier board 2 during the disassembly operation. The provision of the feeding device can also improve the convenience of feeding the overall disassembly mechanism; the force balance area 16 of the first circuit board 11 is determined according to the position of the circuit board structure 1 where the connector 14 is located, and the hook module 6 in the disassembly device can be moved and positioned to the force balance area 16, and the claw portion 61 of the hook module 6 accurately extends into the gap of the circuit board structure 1 and acts on the force balance area 16. On the basis of the positioning of the circuit board structure 1 by the carrier board 2, a balanced force is achieved on the circuit board structure 1, and the first circuit board 11 and the second circuit board 12 are disassembled. The disassembly operation will not cause damage to the circuit board, nor will it cause damage to the connector 14 in the circuit board structure 1, which greatly improves the use stability of the disassembly mechanism.

[0070] Embodiment 2

[0071] This embodiment optimizes the disassembly mechanism on the basis of the above embodiment, and in particular provides a specific implementation method of a feeding device:

[0072] The feeding device comprises a carrier plate 2 which can be moved to a designated work station, a first positioning module 3 arranged on the carrier plate 2 for forming a longitudinally adjustable space, and a second positioning module 4 arranged on the carrier plate 2 for forming a transversely adjustable space.

[0073] like Figure 2 , Figure 3 As shown, the feeding device further comprises a working box 7, and the carrier plate 2 is arranged on the top of the working box 7. The top of the working box 7 is provided with a linear module 71 for driving the carrier plate 2 to move horizontally.

[0074] The linear module 71 includes a set of slide rails and a horizontal transfer cylinder disposed between the slide rails; a mounting slot 72 is disposed on the top of the working box 7, and a horizontal transfer cylinder is disposed in the mounting slot 72. The horizontal transfer cylinder is installed in the mounting slot 72 without affecting the use and does not occupy additional space on the top of the working box 7. The driving end of the horizontal transfer cylinder is connected to the bottom of the carrier plate 2, and both sides of the carrier plate 2 are respectively slidably matched with the slide rails. The slide rails are arranged in the longitudinal direction, so that the carrier plate 2 can be moved horizontally along the slide rails.

[0075] A side stopper 73 for limiting the moving stroke of the carrier plate 2 is provided at the end of the working box 7, and the side stopper 73 is driven to be extended and retracted in the lateral direction; when the carrier plate 2 moves along the slide rail to the designated work position, the side stopper 73 extends out to abut against the carrier plate 2, thereby realizing the positioning of the carrier plate 2.

[0076] The first positioning module 3 includes a plurality of first fixed blocks 31 arranged at one end of the carrier 2 and an adjustment component arranged at the other end of the carrier 2; the spacing of the adjustment component relative to the first fixed block 31 is adjustable. The adjustment component includes a first adjustment block 32 and a second adjustment block 33 arranged on both sides of the first adjustment block 32; the first adjustment block 32 can be a straight plate structure, and the second adjustment block 33 can be an L-shaped plate structure. The adjustment component also includes a guide member 34, which is arranged on both sides of the second adjustment block 33 and is used to guide the second adjustment block 33 to slide longitudinally, and the guide member 34 can be a groove-type structure. One end of the second adjustment block 33 is slidably matched with the guide member 34, and the other end of the second adjustment block 33 extends out of the guide member 34 and is provided with an extension portion 35, and the extension portion 35 is arranged in the transverse direction. The extension portion 35 and the first fixed block 31 clamp the two ends of the positioning shell 13 relative to each other.

[0077] In this embodiment, two first fixed blocks 31 arranged at intervals are provided at one end of the carrier 2; an adjustment component is provided at the middle of the other end of the carrier 2; the spacing between the two first fixed blocks 31 corresponds to the size of the circuit board structure 1. The first positioning module 3 also includes a plurality of second fixed blocks 36 arranged on both sides of the carrier 2 and arranged in the longitudinal direction, and a limiting space is formed between the second fixed blocks 36 and the adjustment component. The first fixed block 31 and the second fixed block 36 are both detachably connected to the carrier 2, and the installation positions of the first fixed block 31 and the second fixed block 36 can be adaptively adjusted on the carrier 2 according to the size of the circuit board structure 1.

[0078] The first adjustment block 32 is connected to a first driving member 37 that drives it to slide along the inner side of the guide member 34. A longitudinally adjustable space is formed between the adjustment assembly and the first fixed block 31, which can be used to clamp and position the two ends of the circuit board structure 1. Specifically, the first adjustment block 32 and the first fixed block 31 clamp and position the circuit board structure 1, and the second adjustment block 33 and the first fixed block 31 clamp and position the two ends of the housing 13; the limiting space enclosed by the guide member 34, the extension portion 35 and the second fixed block 36 accurately limits the bottom of the housing 13, and the housing 13 is positioned in the X-axis direction and the Y-axis direction respectively, which improves the stability of the positioning of the housing 13.

[0079] The second positioning module 4 includes a side push assembly disposed on both sides of the carrier 2, and the side push assembly includes a fixed seat 41, a side push block 42 disposed on the fixed seat 41 and moving in the lateral direction, and a crimping portion 43 disposed on the side of the side push block 42. The fixed seat 41 is detachably connected to the carrier 2; one side of the side push block 42 is connected to the second driving member 44, and the other side of the side push block 42 is provided with a crimping portion 43; a space that can be adjusted in the lateral direction is formed between the two crimping portions 43 disposed opposite to each other.

[0080] The side push block 42 is detachably connected to the crimping portion 43, and the height of the crimping portion 43 relative to the installation position of the side push block 42 can be adaptively adjusted so that the crimping portion 43 can correspond to the gap between the second circuit board 12 and the housing 13 in the circuit board structure 1. The crimping portion 43 can be an L-shaped structure, and the crimping portion 43 can be used to position the surface of the housing 13 and to position the side or top corner of the second circuit board 12. When the crimping portion 43 is located at the side of the circuit board structure 1, the side pushing block 42 is driven to move laterally close to the circuit board structure 1, the bottom of the crimping portion 43 abuts against the surface of the shell 13, and the side wall of the crimping portion 43 abuts against the side of the second circuit board 12; when the crimping portion 43 is located at the top corner of the circuit board structure 1, the side pushing block 42 is driven to move laterally close to the circuit board structure 1, the bottom of the crimping portion 43 abuts against the surface of the shell 13, and the side wall of the crimping portion 43 abuts against the top corner of the second circuit board 12, and the side wall of the crimping portion 43 is clamped with the top corner of the second circuit board 12. The side wall of the crimping portion 43 located near the top corner of the circuit board structure 1 is usually provided with a right-angle groove 431 to adapt and position the top corner of the second circuit board 12. The crimping portion 43 can position the surface of the shell 13 while positioning the side and / or top corner of the second circuit board 12, ensuring the stability of the connection between the second circuit board 12 and the shell 13. When the first circuit board 11 is subjected to the disassembly force of the disassembly device, the second circuit board 12 and the shell 13 will not be disassembled, thereby not affecting the disassembly force between the first circuit board 11 and the second circuit board 12. The first positioning module 3 and the second positioning module 4 position the circuit board structure 1 from multiple spatial orientations to ensure the accuracy of the positioning of the circuit board structure 1.

[0081] In this embodiment, the detachable connection method includes screw connection or clamping connection. The first driving member 37 and the second driving member 44 can be electric driving members, and the driving end of the first driving member 37 and the driving end of the second driving member 44 are respectively provided with a first sensor for detecting pressure, which is used to detect the force condition of the driving end. In the preset stroke of the first positioning module 3 and the second positioning module 4, when the first sensor obtains pressure feedback, it indicates that the movement stroke of the first driving member 37 and the second driving member 44 is in place.

[0082] Embodiment 3

[0083] This embodiment optimizes the disassembly mechanism on the basis of the above embodiment, and in particular provides a specific implementation method of a disassembly device:

[0084] The disassembling device comprises a lifting movable plate 5 and a plurality of hook modules 6 arranged around the movable plate 5. The disassembling device also comprises a stand 8 arranged above the working box 7 and a lifting module 9 arranged on the stand 8 and connected to the movable plate 5.

[0085] like Figure 4As shown, the stand 8 includes a table 81 and columns 82 arranged at the four corners of the table 81; the bottom of the column 82 is connected to the surface of the workbench to stably support the table 81, and the table 81 is arranged in the horizontal direction.

[0086] The lifting module 9 includes a plurality of guide pin and guide sleeve assemblies 91 disposed between the table 81 and the movable plate 5, and a third driving member 92 for driving the movable plate 5 to lift and lower; the third driving member 92 is installed on the top of the table 81, and the driving end of the third driving member 92 passes through the table 81, and the driving end of the third driving member 92 is connected to the top of the movable plate 5, specifically connected to the middle of the movable plate 5; the driving end of the third driving member 92 is connected to a second sensor for detecting tension. When the hook module 6 disassembles the circuit board structure 1, the movable plate 5 and the hook module 6 are subjected to tension together, and the second sensor detects the tension data. If it is within the tension range preset by the control system, it indicates that the disassembly operation is normal. If it deviates from the preset tension range, it indicates that the disassembly operation is abnormal, and there may be a disassembly position error or circuit board structure 1 abnormality.

[0087] One end of the guide post and guide sleeve assembly 91 is connected to the table 81, and the other end of the guide post and guide sleeve assembly 91 is connected to the top of the movable plate 5. The guide post and guide sleeve in the guide post and guide sleeve assembly 91 are sleeved and coaxial, and can achieve relative movement, have a guiding effect, and maintain the stability of the movable plate 5 when it is driven by the third driving member 92.

[0088] When the carrier plate 2 moves along the workbench to the designated workstation, that is, the position directly below the disassembly device, the movable plate 5 can be raised and lowered, and the hook module 6 positions the circuit board structure 1 and performs the disassembly operation. The second sensor can detect the tension data of the movable plate 5, which is used to feedback the force condition of the hook module 6 of the control system.

[0089] In this embodiment, the moving plate 5 is a rectangular plate structure, and the plurality of hook claw modules 6 include two first hook claw modules 6 arranged at one end of the moving plate 5 and a second hook claw module 6 arranged at both sides of the moving plate 5. The claw portion 61 of the hook claw module 6 is connected to a fourth driving member 62 for driving its extension and retraction, and the driving end of the fourth driving member 62 is connected to a third sensor for detecting pressure. Before the claw portion 61 of the hook claw module 6 extends into the gap between the first circuit board 11 and the second circuit board 12 and starts the disassembly operation, the third sensor detects the pressure data. If the claw portion 61 can smoothly enter the gap, the pressure data comes from the friction force or no pressure of the claw portion 61 contacting the bottom surface of the first circuit board 11, which is understood to be a small pressure at this time. If the detection pressure is large, the claw portion 61 may touch the components 15 of the circuit board structure 1, and a large pressure is generated, indicating that the position of the claw portion 61 positioned to the gap is deviated. In this embodiment, the fourth driving member 62 is a cylinder, and the cylinder has a magnetic switch inside, which is used to feedback the moving stroke position of the driving end of the cylinder, which will not be repeated here.

[0090] Embodiment 4

[0091] This embodiment provides a disassembly method, which is applied to the disassembly mechanism in the above embodiment, such as Figure 1-Figure 6 As shown, the method includes:

[0092] S21 , the circuit board structure 1 is placed on the feeding device, the first positioning module 3 adjusts and positions the two ends of the circuit board structure 1 along the longitudinal direction, and the second positioning module 4 adjusts and positions the two sides of the circuit board structure 1 along the transverse direction.

[0093] Among them, when the first positioning module 3 is adjusted into place along the longitudinal direction and the second positioning module 4 is adjusted into place along the transverse direction, the first sensor feedback controls the pressure information of the first driving member 37 and the second driving member 44 of the system, and judges whether the circuit board structure 1 is positioned in place on the feeding device according to the pressure information. During the preset stroke of the first positioning module 3 and the second positioning module 4, when the first sensor obtains pressure feedback, it indicates that the moving stroke of the first driving member 37 and the second driving member 44 is in place; otherwise, the moving stroke is not in place.

[0094] S31, acquiring image information of the circuit board structure 1, and determining a force balancing area 16 of the first circuit board 11 in a circumferential position relative to the connector 14 according to the image information, wherein the force balancing area 16 is located on the end surface of the first circuit board 11 facing the second circuit board 12.

[0095] In this embodiment, the image information of the circuit board structure 1 is obtained by the first detection module. The circuit board is a regular rectangular plate structure. The force balance area 16 includes a first area 161 extending in the horizontal direction from the position of the first circuit board 11 where the connector 14 is located, and a second area 162 extending in the longitudinal direction from the position of the first circuit board 11 where the connector 14 is located. Among them, the first area 161 is parallel to the side of the first circuit board 11, and the second area 162 is parallel to the end of the first circuit board 11.

[0096] In another embodiment, the circuit board has an irregular structure, and the force balance area 16 can be determined by using a mechanical analysis method, which will not be described in detail here.

[0097] The image information includes the appearance feature information of the circuit board structure 1, the gap distance parameters between the first circuit board 11 and the second circuit board 12, the position coordinate parameters of the connector 14, the position coordinate parameters of the components 15 in the circuit board structure 1, the thickness of the first circuit board 11 and the thickness of the second circuit board 12.

[0098] S41, moving the hook module 6 along the circumferential direction of the movable plate 5, and adjusting the hook module 6 to correspond to the force balance area 16;

[0099] Among them, according to the image information, the force balance area 16 of the circumferential position of the first circuit board 11 relative to the connector 14 can be determined, and the control system can control the hook module 6 to move to the corresponding coordinate position through the position information of the force balance area 16, and accurately control the hook module 6 to be positioned at the force balance area 16.

[0100] S51, determining the position information of the component 15 in the circuit board structure 1 according to the image information;

[0101] S61, in response to the position information of the component 15 overlapping with the force balance area 16, and the relative distance between the position information of the component 15 and the edge of the first circuit board 11 is not within a preset range, obtaining the position height information of the hook module 6 relative to the circuit board structure 1;

[0102] S71, determine the descending stroke of the movable plate 5 according to the position height information and the image information, so that the claw portion 61 of the hook module 6 corresponds to the gap between the first circuit board 11 and the second circuit board 12 in the horizontal direction, and the claw portion 61 is positioned to the force balance area 16. The movable plate 5 rises to realize the disassembly of the first circuit board 11 and the second circuit board 12, and at the same time realizes the disassembly of the connector 14.

[0103] Among them, the position height information is obtained through the second detection module. During the descent of the movable plate 5, the second detection module detects the position height of the first circuit board 11. The feedback control system can determine the descending position height of the hook module 6 according to the gap position parameters between the first circuit board 11 and the second circuit board 12 in the image information, so that the claw 61 of the hook module 6 corresponds to the gap, and then the claw 61 is extended and positioned to the force balance area 16.

[0104] In some embodiments, moving the hook module 6 along the circumferential direction of the movable plate 5 to adjust the first position information to correspond to the second position information includes:

[0105] S411, obtain the first position information of the hook module 6 on the mobile plate 5 where the hook module 6 is located and the second position information of the force balance area 16 projected onto the mobile plate 5, determine the correspondence between the first position information and the second position information, and in response to the deviation between the first position information and the second position information, move the hook module 6 along the circumferential direction of the mobile plate 5 to adjust the correspondence between the first position information and the second position information.

[0106] Exemplarily, the above correspondence relationship indicates that the hook module 6 can move to a position corresponding to the first area 161 close to the edge of the first circuit board 11, and can also move to a position corresponding to the second area 162 close to the edge of the first circuit board 11. It is understood that the claw portion 61 of the hook module 6 is not extended at this time, and the mobile plate 5 does not interfere with the circuit board structure 1 in terms of position height during the descent process. The control system can calculate the force balance area 16 based on the image information, and adjust the coordinate parameters of the hook module 6 on the mobile plate 5, so that the first position information corresponds to the second position information. If the first position information corresponds to the second position information, there is no need to adjust the first position information of the hook module 6.

[0107] In some embodiments, the method further comprises:

[0108] S81, in response to the position information of the component 15 overlapping with the force balance area 16, and the relative distance between the position information of the component 15 and the edge of the first circuit board 11 is within a preset range;

[0109] S82, obtain the third position information of the outward expansion area 17 projected on the movable plate 5, move the hook module 6 along the circumferential direction of the movable plate 5, adjust the first position information of the hook module 6 to correspond to the third position information, and obtain the position height information of the hook module 6 relative to the circuit board structure 1.

[0110] The track of the first circuit board 11 where the force balancing area 16 is located extends outward to form an outward expansion area 17. Specifically, both sides of the first area 161 extend longitudinally to form the outward expansion area 17, and both sides of the second area 162 extend transversely to form the outward expansion area 17.

[0111] Exemplarily, the preset range is determined according to the retractable length of the claw 61 of the hook module 6, which means that if the position of the component 15 overlaps with the force balance area 16, and the distance between the component 15 and the edge of the first circuit board 11 is small, when the claw 61 is positioned to the force balance area 16, it will interfere with the component 15, causing collision damage. The hook module 6 changes its moving path and is positioned to the outward expansion area 17. The claw 61 can effectively avoid the component 15 when it is extended. At the same time, the outward expansion area 17 is close to the force balance area 16, and the hook module 6 can still maintain a balanced effect on the first circuit board 11.

[0112] In this embodiment, the connector 14 is a square column structure, the width of the first area 161 is the same as the width of the second area 162, and is the same as the width of the connector 14; the outward expansion area 17 is connected to the force balance area 16, and the width of the outward expansion area 17 located on one side of the first area 161 or the second area 162 is not greater than the width of the connector 14; it is understood that the hook module 6 can be positioned to the outward expansion area 17 on one side of the force balance area 16, or it can be positioned to the outward expansion area 17 on the other side of the force balance area 16, thereby increasing the selectivity of positioning the hook module 6 to the outward expansion area 17, and can effectively avoid the components 15 located in the force balance area 16.

[0113] If the position information of the component 15 overlaps with the force balance area 16, and the relative distance between the position of the component 15 and the edge of the first circuit board 11 is outside the preset range, the hook module 6 moves along the circumference of the movable plate 5 to correspond to the second position information without being positioned to the third position information.

[0114] If the position information of the component 15 partially overlaps with the force balance area 16 and the outward expansion area 17, and the relative distance between the position of the component 15 and the edge of the first circuit board 11 is outside the preset range, the hook module 6 moves along the circumference of the movable plate 5 to correspond to the second position information without being positioned to the third position information.

[0115] If the position information of the component 15 partially overlaps with the force balance area 16 and the expansion area 17 located on one side of the force balance area 16, and the relative distance between the position of the component 15 and the edge of the first circuit board 11 is within the preset range, the expansion area 17 located on the other side of the force balance area 16 away from the position information of the component 15 is determined as the candidate area according to the position information of the component 15, and the hook module 6 is moved along the circumferential direction of the movable plate 5 to avoid the position information of the component 15, and the first position information of the hook module 6 is adjusted to correspond to the third position information, and the third position information is the position information of the candidate area projected on the first circuit board 11. The above preset range is the range in which the claw portion 61 can extend into the bottom surface of the first circuit board 11.

[0116] Exemplarily, two first hook modules 6 are provided at one end of the movable plate 5, and a second hook module 6 is provided on each side of the movable plate 5; a second hook module 6 moves to the side of the movable plate 5, which is outside the position where the first area 161 is projected, and the claw portion 61 of the second hook module 6 is extended to directly correspond to the first area 161; and the two first hook modules 6 move to the end of the movable plate 5, which is outside the position where the second area 162 is projected, or there is a situation where the claw portions 61 of the two first hook modules 6 exceed the second area 162, the two first hook modules 6 can be moved to the symmetrical positions on both sides of the corresponding second area 162 along the longitudinal center line, or one first hook module 6 is in operation and the other first hook module 6 is idle; if there are multiple hook modules 6, the force balance area 16 and / or the expansion area are projected on the edge position of the movable plate 5 and are equally divided, and a plurality of hook modules 6 are arranged according to the equally divided points of the equally divided treatment.

[0117] S83, determine the descending stroke of the movable plate 5 according to the position height information and the image information, so that the claw portion 61 of the hook module 6 corresponds to the gap between the first circuit board 11 and the second circuit board 12 in the horizontal direction, and the claw portion 61 is positioned to the outward expansion area 17. The movable plate 5 rises to realize the disassembly of the first circuit board 11 and the second circuit board 12, and at the same time realizes the disassembly of the connector 14.

[0118] Among them, the position height information is obtained through the second detection module. During the descending process of the movable plate 5, the second detection module detects the position height of the first circuit board 11. The feedback control system can determine the descending position height of the hook module 6 according to the gap position parameters between the first circuit board 11 and the second circuit board 12 in the image information, so that the claw part 61 of the hook module 6 corresponds to the gap, and then the claw part 61 is extended and positioned to the outward expansion area 17.

[0119] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0120] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0121] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or can communicate with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0122] Although the preferred embodiments of the present application have been described, those skilled in the art may make other changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications falling within the scope of the present application.

[0123] Obviously, those skilled in the art can make various changes and modifications to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is also intended to include these modifications and variations.

Claims

1. A disassembly mechanism for disassembling a circuit board structure, the circuit board structure comprising a first circuit board and a second circuit board, a gap being provided between the first circuit board and the second circuit board, a connector being connected between the first circuit board and the second circuit board, characterized in that: The disassembling mechanism comprises a feeding device and a disassembling device; The feeding device includes a movable carrier plate, a first positioning module arranged on the carrier plate for forming a longitudinally adjustable space, and a second positioning module arranged on the carrier plate for forming a transversely adjustable space, wherein the first positioning module and the second positioning module locate the circumferential position of the circuit board structure. The disassembly device includes a movable plate arranged for lifting and lowering and a plurality of hook modules arranged around the movable plate, the movable plate is arranged opposite to the carrier plate, the hook module is arranged to move around the movable plate, the hook module includes a claw portion that can be telescopically extended to the gap, so that the plurality of claw portions act on the circumferential force balance area of ​​the first circuit board relative to the connector, so as to separate the first circuit board and the second circuit board, and disassemble the connector at the same time.

2. The disassembly mechanism according to claim 1, characterized in that: The disassembly mechanism further includes a first detection module for identifying position information of the connector and a second detection module for identifying position height information of the circuit board structure.

3. The disassembly mechanism according to claim 1, characterized in that: The first positioning module includes a plurality of first fixing blocks arranged at one end of the carrier plate and an adjustment component arranged at the other end of the carrier plate; The adjustment assembly includes a first adjustment block and second adjustment blocks arranged on both sides of the first adjustment block; The circuit board structure also includes a shell connected to the second circuit board, and the first adjusting block and the first fixing block relatively clamp and position two ends of the shell.

4. The disassembly mechanism according to claim 3, characterized in that: The adjustment assembly also includes a guide member, which is arranged on the side of the second adjustment block and is used to guide the second adjustment block to slide in the longitudinal direction. One end of the second adjustment block is slidably matched with the guide member, and the other end of the second adjustment block extends out of the guide member and is provided with an extension portion. The extension portion is arranged in the transverse direction, and the extension portion and the first fixed block relatively clamp and position the two ends of the shell.

5. The disassembly mechanism according to claim 4, characterized in that: The first positioning module also includes a plurality of second fixing blocks disposed on both sides of the carrier plate and arranged in the longitudinal direction. The guide member, the extension portion and the second fixing blocks enclose a limiting space.

6. The disassembly mechanism according to claim 1, characterized in that: The second positioning module includes side thrust assemblies arranged on both sides of the carrier plate; The side push assembly includes a fixed seat, a side push block disposed on the fixed seat and moving in the lateral direction, and a crimping portion disposed on the side of the side push block; The relative distance between the side push blocks located on both sides of the carrier plate is adjustable.

7. The disassembling mechanism according to claim 6, characterized in that: The circuit board structure also includes a shell connected to the second circuit board, the shell and the second circuit board are spaced apart, the crimping portion extends between the shell and the second circuit board, the crimping portions located on both sides of the carrier relatively clamp and position the two sides of the shell, the side walls of the crimping portion abut against the side edges and / or top corners of the second circuit board, and the bottom of the crimping portion abuts against the surface of the shell.

8. The disassembling mechanism according to claim 1, characterized in that: The hook module also includes a guide portion arranged in the circumferential direction of the movable plate and a matching portion slidably connected to the guide portion, and the claw portion is mounted on the matching portion.

9. A disassembly method, applied to the disassembly mechanism according to claim 1, characterized in that: include: Acquire image information of the circuit board structure, and determine a force balance area at a circumferential position of the first circuit board relative to the connector according to the image information, wherein the force balance area is located on an end surface of the first circuit board facing the second circuit board; Moving the hook module along the circumferential direction of the movable plate to adjust the hook module to correspond to the force balance area; Determine the position information of components in the circuit board structure according to the image information; In response to the position information of the component overlapping with the force balance area, and the relative distance between the position information of the component and the edge of the first circuit board is not within a preset range, obtaining the position height information of the hook module relative to the circuit board structure; The descending stroke of the movable plate is determined according to the position height information and the image information, so that the claw of the hook module extends out to the gap between the first circuit board and the second circuit board, the claw is positioned to the force balance area, and the movable plate rises to realize the disassembly of the first circuit board and the second circuit board, and at the same time realizes the disassembly of the connector.

10. The disassembly method according to claim 9, characterized in that: The step of moving the hook module along the circumferential direction of the movable plate and adjusting the hook module to correspond to the force balance area includes: Acquire first position information of the hook module on the mobile plate and second position information of the force balance area projected on the mobile plate; Determining a correspondence between the first location information and the second location information; In response to the deviation between the first position information and the second position information, the hook module is moved along the circumferential direction of the movable plate to adjust the first position information to correspond to the second position information; The method further comprises: In response to the position information of the component overlapping with the force balance area, and the relative distance between the position information of the component and the edge of the first circuit board is within a preset range; Acquire third position information of the orthographic projection of the outward expansion area on the movable plate, move the hook module along the circumference of the movable plate, adjust the first position information to correspond to the third position information, and acquire position height information of the hook module relative to the circuit board structure, wherein the track of the first circuit board where the force balance area is located extends outward to form the outward expansion area; The descending stroke of the movable plate is determined according to the position height information and the image information, so that the claw of the hook module extends out to the gap between the first circuit board and the second circuit board, the claw is positioned to the outward expansion area, and the movable plate rises to realize the disassembly of the first circuit board and the second circuit board, and at the same time realizes the disassembly of the connector.

Images