Optical module

Abstract

The invention provides an optical module, in which a first differential output pin of a laser driving chip is connected with a first light emitting chip, and a second differential signal pin of the laser driving chip is connected with a second light emitting chip. The first temperature regulator is in heat conduction connection with the first light emitting chip and the second light emitting chip and is used for regulating the working temperature of the first light emitting chip and the second light emitting chip. The micro-control unit controls the power supply current of the first temperature regulator so as to achieve temperature regulation of the first temperature regulator and change the tuning wavelengths of the first light emitting chip and the second light emitting chip. According to the invention, one laser driving chip is connected with the modulation ends of the two light emitting chips, so that electronic devices are reduced, and miniaturization of a circuit board is facilitated. Moreover, by adopting the scheme of double light emitting chips, four-wavelength tuning can be realized by only adjusting the temperature difference of the light emitting chips to be 8 DEG C, and the power consumption of the temperature regulator is reduced.

Description

Technical Field

[0001] The present application relates to the field of communication technology, and in particular to an optical module. Background Art

[0002] Optical communication technology is used in new business models and application models such as cloud computing, mobile Internet, and video. In optical communication, optical modules are tools for converting photoelectric signals into each other and are one of the key components in optical communication equipment. With the rapid development of 5G networks, optical modules, which are at the core of optical communication, have made great progress. Summary of the invention

[0003] The present application provides an optical module to reduce the space occupied by the optical module and improve the utilization rate of the device.

[0004] In order to solve the above technical problems, the embodiments of the present application disclose the following technical solutions:

[0005] The present application embodiment discloses an optical module, including:

[0006] A laser driving chip, wherein the laser driving chip has a first differential output pin and a second differential output pin;

[0007] A first light emitting chip connected to the first differential output pin;

[0008] A second light emitting chip connected to the second differential output pin;

[0009] a first temperature regulator, thermally connected to the first light emitting chip and the second light emitting chip to adjust the wavelengths of the first light emitting chip and the second light emitting chip; and

[0010] A micro control unit, electrically connected to the first temperature regulator;

[0011] The first light emitting chip has a first power supply pin, a first modulation pin and a first ground pin, the first ground pin is electrically connected to the ground line, the first modulation pin is connected to the first differential output pin, and the first power supply pin is connected to the power supply circuit;

[0012] The micro control unit controls the operating temperature of the first temperature regulator to adjust the wavelengths of the first light emitting chip and the second light emitting chip.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] The present disclosure provides an optical module, including: a first light emitting chip, a second light emitting chip, a first temperature regulator, a laser driver chip and a micro control unit. The first differential output pin of the laser driver chip is connected to the first light emitting chip, and the second differential signal pin of the laser driver chip is connected to the second light emitting chip. The first temperature regulator is thermally connected to the first light emitting chip and the second light emitting chip, and is used to adjust the operating temperature of the first light emitting chip and the second light emitting chip. The micro control unit is electrically connected to the first temperature regulator, and is used to control the power supply current of the first temperature regulator to achieve temperature regulation of the first temperature regulator. The micro control unit changes the temperature of the first light emitting chip and the temperature of the second light emitting chip by adjusting the temperature of the first temperature regulator, and changes the tuning wavelength of the first light emitting chip and the second light emitting chip. For the light emitting chip, different temperatures correspond to signal lights of different wavelengths. The present disclosure uses a laser driver chip to connect the modulation ends of two light emitting chips, which reduces electronic devices and helps miniaturization of circuit boards. Moreover, the solution using dual light emitting chips only needs to adjust the temperature difference of the light emitting chips to 8°C, so that 4 wavelengths can be tuned, which reduces the power consumption of the temperature regulator. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the present disclosure, the following briefly introduces the drawings required to be used in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can also be obtained based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams, and are not limitations on the actual size of the product involved in the embodiments of the present disclosure, the actual process of the method, the actual timing of the signal, etc.

[0016] Figure 1 A partial architecture diagram of an optical communication system provided according to some embodiments of the present application;

[0017] Figure 2 A partial structural diagram of a host computer provided according to some embodiments of the present application;

[0018] Figure 3 A structural diagram of an optical module provided according to some embodiments of the present application;

[0019] Figure 4 An exploded view of an optical module provided according to some embodiments of the present application;

[0020] Figure 5 A schematic diagram of the structure of a light emitting component and a light receiving component provided according to some embodiments of the present application;

[0021] Figure 6A schematic diagram of the exploded structure of a light emitting component and a light receiving component provided according to some embodiments of the present application;

[0022] Figure 7 A schematic cross-sectional view of a light emitting component and a light receiving component provided according to some embodiments of the present application;

[0023] Figure 8 A schematic diagram of the structure of a light emitting component provided according to some embodiments of the present application;

[0024] Fig. 9 It is an exploded schematic diagram of a light emitting component provided according to some embodiments of the present application;

[0025] Fig.10 An assembly diagram of a transmitting housing and pins in an optical module provided according to some embodiments of the present disclosure;

[0026] Fig.11 A structure of a transmitting housing in an optical module provided according to some embodiments of the present disclosure Figure 1 ;

[0027] Fig.12 A partial schematic diagram of a light emitting component provided according to some embodiments of the present application;

[0028] Fig.13 A schematic diagram of an optical path of a light emitting component provided according to some embodiments of the present application Figure 1 ;

[0029] Fig.14 A schematic diagram of an optical path of a light emitting component provided according to some embodiments of the present application Figure 2 ;

[0030] Fig.15 A schematic diagram of an optical path of a light emitting component provided according to some embodiments of the present application Figure 3 ;

[0031] Fig.16 A schematic diagram of a light emitting component and a circuit board according to some embodiments of the present application Figure 1 ;

[0032] Fig.17 A schematic diagram of a light emitting component circuit provided according to some embodiments of the present application;

[0033] Fig.18 A schematic diagram of another circuit of a light emitting component provided according to some embodiments of the present application;

[0034] Fig.19 A schematic diagram of a light emitting component and a circuit board according to some embodiments of the present application Figure 2 ;

[0035] Fig. 20 A circuit diagram of a third light emitting component provided according to some embodiments of the present application;

[0036] Fig.21 A schematic diagram of a light emitting component and a circuit board according to some embodiments of the present application Figure 3 ;

[0037] Fig. 22 A fourth circuit diagram of a light emitting component provided according to some embodiments of the present application;

[0038] Fig.23 A schematic diagram of a light emitting component, a light receiving component and a circuit board provided according to some embodiments of the present application;

[0039] Fig.24 A schematic diagram of a circuit of a light emitting component and a light receiving component provided according to some embodiments of the present application;

[0040] Fig.25 A schematic diagram of the structure of a light receiving component provided according to some embodiments of the present application;

[0041] Fig.26 A cross-sectional schematic diagram of a light receiving component provided according to some embodiments of the present application;

[0042] Fig. 27 A partial schematic diagram of a light receiving component provided according to some embodiments of the present application;

[0043] Fig.28 A partial exploded schematic diagram of a light receiving component provided according to some embodiments of the present application Figure 1 ;

[0044] Fig.29 A partial exploded schematic diagram of a light receiving component provided according to some embodiments of the present application Figure 2 . DETAILED DESCRIPTION

[0045] Optical communication technology establishes information transmission between information processing devices. Optical communication technology loads information onto light and uses the propagation of light to achieve information transmission. Light loaded with information is an optical signal. When optical signals propagate in information transmission equipment, they can reduce the loss of optical power and achieve high-speed, long-distance, and low-cost information transmission. Information that can be processed by information processing equipment exists in the form of electrical signals. Optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing devices, and optical fibers and optical waveguides are common information transmission equipment.

[0046] The mutual conversion of optical signals and electrical signals between information processing equipment and information transmission equipment is realized through optical modules. For example, an optical fiber is connected to the optical signal input end and / or the optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and / or the electrical signal output end of the optical module; the first optical signal from the optical fiber is transmitted into the optical module, the optical module converts the first optical signal into a first electrical signal, and the optical module transmits the first electrical signal into the optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into a second optical signal, and the optical module transmits the second optical signal into the optical fiber. Since information processing devices can be connected to each other through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and it is not necessary for all types of information processing devices to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0047] Figure 1 FIG. 1 is a partial architecture diagram of an optical communication system provided according to some embodiments of the present application. Figure 1 As shown, the optical communication system is partially presented as a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0048] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101, and the optical signal from the direction of the remote information processing device 1000 is transmitted into the optical module 200, or the light from the optical module 200 is propagated toward the remote information processing device 1000, so as to realize long-distance and low-power-loss information transmission.

[0049] The number of optical fibers 101 may be one or more (two or more); the optical fiber 101 and the optical module 200 may be connected in a pluggable movable manner or in a fixed manner.

[0050] The host computer 100 has an optical module interface 102, which is configured to access the optical module 200, so that the host computer 100 establishes a unidirectional / bidirectional electrical signal connection with the optical module 200; the host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working status of the optical module 200.

[0051] The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104, which can be connected to an electrical signal network. For example, the network cable interface 104 is configured to connect to the network cable 103, so that the host computer 100 and the network cable 103 establish a unidirectional / bidirectional electrical signal connection.

[0052] Optical Network Unit (ONU), Optical Line Terminal (OLT), Optical Network Terminal (ONT) and data center server are common host computers. One end of the network cable 103 is connected to the local information processing device 2000, and the other end is connected to the host computer 100. The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100.

[0053] For example, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0054] For example, a first optical signal from the direction of a remote information processing device 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted into the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal into the host computer 100, the host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

[0055] The optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between optical signals and electrical signals, the information does not change, but the encoding and decoding method of the information can change.

[0056] Figure 2 1 is a partial structural diagram of a host computer according to some embodiments of the present application. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structures related to the host computer 100 and the optical module 200 are shown. Figure 2As shown, the host computer 100 also includes a PCB circuit board 105 arranged in the shell, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector (not shown in the figure) arranged inside the cage 106. The heat sink 107 has a protruding structure that increases the heat dissipation area, and the fin-shaped structure is a common protruding structure.

[0057] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 106.

[0058] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present application, Figure 4 FIG. 1 is an exploded view of an optical module provided according to some embodiments of the present application. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400 and a light receiving component 500. However, the present application is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0059] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0060] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate, which is covered on the two lower side plates of the lower shell 202 to form the above-mentioned shell.

[0061] In some embodiments, the lower shell 202 includes a bottom plate and two lower side plates located on both sides of the bottom plate and arranged perpendicularly to the bottom plate; the upper shell 201 includes a cover plate and two upper side plates located on both sides of the cover plate and arranged perpendicularly to the cover plate, and the two upper side plates are combined with the two lower side plates to achieve the upper shell 201 covering the lower shell 202.

[0062] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical interface, and the gold finger 301 of the circuit board 300 extends from the electrical interface and is inserted into the electrical connector of the host computer; the opening 205 is an optical port, which is configured to access the optical fiber 101 so that the optical fiber 101 is connected to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0063] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted, which facilitates the installation of components such as the circuit board 300, the light emitting component 400, and the light receiving component 500 into the above-mentioned shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the shapes of these components. In addition, when assembling components such as the circuit board 300, the light emitting component 400 and the light receiving component 500, it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these devices, which is conducive to the automated implementation of production.

[0064] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0065] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0066] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the snap-fit ​​fixed connection between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0067] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected together according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, triodes, metal-oxide-semiconductor field-effect transistors (Metal-Oxide-Semiconductor Field-Effect Transistor, MOSFET), etc. The chips may include microcontroller units (Microcontroller Unit, MCU), laser driver chips, transimpedance amplifiers (Transimpedance Amplifier, TIA), limiting driver chips (limiting amplifier), clock and data recovery chips (Clock and Data Recovery, CDR), power management chips, digital signal processing (Digital Signal Processing, DSP) chips.

[0068] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board is also easy to insert into the electrical connector in the upper computer cage.

[0069] The circuit board 300 further includes a gold finger 301 formed on the end surface thereof, and the gold finger 301 is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger 301 is connected to the electrical connector in the cage 106. The gold finger 301 can be provided on only one side of the circuit board 300 (e.g. Figure 4 The gold finger 301 is configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0070] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0071] The light emitting component 400 and / or the light receiving component 500 are located on a side of the circuit board 300 away from the gold finger 301; in some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors; in some embodiments, the light emitting component and / or the light receiving component can be directly set on the circuit board 300, can be set on the surface of the circuit board, and can also be set on the side of the circuit board.

[0072] The optical transmitting part of the optical module in the ONU needs to be able to transmit signal light of different wavelengths, but the optical module can only transmit signal light of one wavelength at the same time (under normal working conditions). The above function is also called time-division luminescence. The optical receiving part of the optical module in the ONU receives signal light of multiple different wavelengths, but only converts signal light of one wavelength into an electrical signal.

[0073] Figure 5 A schematic diagram of the structure of a light emitting component and a light receiving component provided according to some embodiments of the present application. Figure 6 The following is a schematic diagram of the exploded structure of a light emitting component and a light receiving component according to some embodiments of the present application. Figure 5 and Figure 6 As shown, the optical transceiver assembly includes an optical emitting component and an optical receiving component, and the optical module also includes a first housing 810 and an optical fiber adapter 700. In the embodiment of the present application, the optical transceiver assembly preferably uses an optical fiber adapter to connect the optical fiber, that is, the optical fiber adapter 700 is embedded in the first housing 810 for connecting the optical fiber. Specifically, the first housing 810 is provided with a third pipe opening 813 for inserting the optical fiber adapter 700, and the optical fiber adapter 700 is embedded in the third pipe opening 813. The optical emitting component 400 and the optical receiving component 500 respectively establish optical connections with the optical fiber adapter. The light emitted and the light received in the optical transceiver assembly are transmitted via the same optical fiber in the optical fiber adapter, that is, the same optical fiber in the optical fiber adapter is the transmission channel for the light entering and exiting the optical transceiver assembly, and the optical transceiver assembly realizes a single-fiber bidirectional optical transmission mode.

[0074] The first housing 810 is used to carry the light emitting component and the light receiving component. In the embodiment of the present application, the first housing is made of metal material, which is conducive to electromagnetic shielding and heat dissipation. The first pipe opening 811, the second pipe opening 812 and the third pipe opening 813 are arranged on the round square tube body, and the first pipe opening 811 and the second pipe opening 812 are respectively arranged on the adjacent side walls of the round square tube body.

[0075] The first pipe opening 811 is disposed on the side wall of the round square tube in the width direction, and the second pipe opening 812 is disposed on the side wall of the first shell 810 in the length direction.

[0076] The light receiving component 500 is embedded in the first pipe opening 811, and the light emitting component 400 is in thermal contact with the first housing 810 through the first pipe opening 811; the light emitting component 400 is connected to the second pipe opening 812 through the connection seat 820. A heat conducting block 540 is provided outside the light receiving component 500, and the heat conducting block 540 is connected to the upper housing for heat dissipation, which is convenient for heat dissipation of the light receiving component 500.

[0077] The light emitting component 400 and the light receiving component 500 are directly pressed into the first housing 810, and the first housing 810 is in direct contact with the light emitting component 400 and the light receiving component 500 or through a heat conducting medium. In this way, the round square tube can be used for heat dissipation of the light emitting component 400 and the light receiving component 500, ensuring the heat dissipation effect of the light emitting component 400 and the light receiving component 500.

[0078] The first shell 810 may be a square tube or other internal hollow shell.

[0079] Figure 7 Schematic diagram of a cross-section of a light emitting component and a light receiving component provided according to some embodiments of the present application. Figure 7 As shown, a first lens 815 is provided in the first housing 810, and the first lens 815 is located between the optical fiber adapter 700 and the optical emitting component 400. The optical fiber adapter 700 includes a first optical signal and a second optical signal, wherein the first optical signal comes from the optical fiber, and the first optical signal enters the optical transceiver assembly from the optical fiber. The first optical signal comes from the optical emitting component, and enters the optical fiber from the optical emitting component.

[0080] The first lens 815 has a semi-transparent and semi-reflective coating, and reflects the first optical signal and transmits the second optical signal, that is, the first lens 815 reflects the light from the optical fiber adapter to the optical emitting component and transmits the light in the opposite direction.

[0081] The first optical signal enters the optical transceiver assembly from the optical fiber, and after being reflected by the first lens 815, it moves toward the first pipe opening and enters the optical receiving component. The first optical signal may contain signal light of one wavelength, or may contain signal light of two or more wavelengths. The optical receiving component filters the first optical signal, and the optical receiver of the optical receiving component only receives signal light of one wavelength and converts the signal light into an electrical signal.

[0082] A plano-convex lens is provided between the optical fiber adapter 700 and the first lens 815, and the plano-convex lens collimates the first optical signal, so that the first optical signal changes from a scattered light beam to a parallel light beam. At the same time, the plano-convex lens converges the second optical signal, and the converged second optical signal enters the optical fiber adapter 700. Or a plano-convex lens is provided inside the optical fiber adapter 700, so that the first optical signal changes from a scattered light beam to a parallel light beam. At the same time, the plano-convex lens converges the second optical signal, and the converged second optical signal enters the optical fiber adapter 700.

[0083] In some embodiments of the present application, in order to reduce the size of the first housing, a displacement prism 817 is further provided in the first housing. The displacement prism 817 is located between the first lens 815 and the light receiving component 500, and displaces the first light signal reflected by the first lens 815 to the emission light window 415 of the light receiving component 500.

[0084] A connection base is provided between the light receiving component and the first housing 810. Exemplarily, one end of the connection base 820 is connected to the first housing 810, and the other end is connected to the second housing 411, and the connection base 820 is connected to the second nozzle, so that the first housing 810 and the second housing 411 are connected through the connection base 820. In some embodiments, the cross-sectional area of ​​the connection base 820 is smaller than the area of ​​the outer side wall of the first housing, and the cross-sectional area of ​​the connection base 820 is smaller than the area of ​​one side of the second housing 411, which can facilitate the connection between the second housing 411 and the first housing 810, and can also facilitate the sealing effect of the second cavity 4110.

[0085] In some embodiments, the outer contour of the connection seat 820 is cylindrical. When the connection seat 820 is connected to the first shell 810 by laser welding, the cylindrical connection seat 820 facilitates the operation of the laser welding process, thereby facilitating the connection between the connection seat 820 and the first shell 810.

[0086] For example, a single optical module in an ONU can provide four emission wavelengths to the outside, but at the same time, the optical module only emits signal light of one wavelength.

[0087] Figure 8 This is a schematic diagram of the structure of a light emitting component provided according to some embodiments of the present application. Fig. 9 FIG. 1 is a schematic diagram of an exploded view of a light emitting component provided according to some embodiments of the present application. Figure 8 and Fig. 9 As shown, the light emitting component includes a second cavity 4110, and the second cavity 4110 includes a second shell 411 and a second upper cover 412. The second shell 411 forms an inner cavity, and the second upper cover 412 covers and connects the second shell 411 to form a relatively sealed cavity structure.

[0088] A connecting seat 820 is disposed on the side of the second cavity 4110 , and the second cavity 4110 is connected to the first shell 810 via the connecting seat 820 , so as to facilitate the connection between the second cavity 4110 and the first shell 810 through the connecting seat 820 .

[0089] like Fig. 9 As shown, a fixing surface 4101 is provided on the top of the second shell 411, and the second upper cover 412 is fixedly connected to the fixing surface 4101; a first through hole 4103 is provided on the second shell 411, and the first through hole 4103 is connected to the inner cavity of the second shell 411, and the first through hole 4103 is connected to the connecting seat 820, and the first through hole 4103 is connected to the second pipe mouth through the connecting seat 820, and the first through hole 4103 is used to output optical signals.

[0090] Fig.10 This is an assembly diagram of a transmitting housing and pins in an optical module provided according to some embodiments of the present disclosure. Fig.11 A structure of a transmitting housing in an optical module provided according to some embodiments of the present disclosure Figure 1 .like Fig.10 and Fig.11 As shown, the second shell 411 includes a bottom plate 4010, a first side plate 4011, a second side plate 4012, a third side plate 4013 and a fourth side plate 4014, the first side plate 4011, the second side plate 4012, the third side plate 4013 and the fourth side plate 4014 are all connected to the bottom plate 4010, the first side plate 4011 and the third side plate 4013 are arranged opposite to each other, and the second side plate 4012 and the fourth side plate 4014 are arranged opposite to each other, so that the bottom plate 4010, the first side plate 4011, the second side plate 4012, the third side plate 4013 and the fourth side plate 4014 form a shell with a top opening.

[0091] A plurality of insertion holes 4016 are formed on the third side plate 4013 , and the transmitting pin 413 is inserted into the second shell 411 through the insertion holes 4016 , and the transmitting pin 413 and the insertion holes 4016 are sealed and connected via an insulating member 4017 to achieve a sealed connection between the transmitting pin 413 and the second shell 411 .

[0092] In some embodiments, since glass PIN packaging is the lowest-cost packaging form in optical devices, the insulating member 4017 is a glass member, and the emission pin 413 is connected to the second housing 411 through a glass seal.

[0093] In some embodiments, in order to avoid signal crosstalk, the spacing between adjacent sockets 4016 needs to be greater than 0.2 mm. When the optical emission component includes multiple laser groups, multiple laser chips need to be connected to more emission pins 413. There are a large number of sockets 4016 on the third side panel 4013 of the second shell 411. In order to ensure the spacing between adjacent sockets 4016, the inner side surface of the third side panel 4013 is arranged in a stepped shape, that is, the inner side surface of the third side panel 4013 includes a first surface and a second surface, and the second surface can protrude from the first surface, so that the distance between the second surface and the first side panel 4011 is smaller than the distance between the first surface and the first side panel 4011, and sockets 4016 are respectively formed on the first surface and the second surface, thereby increasing the spacing between adjacent sockets 4016 so that more sockets 4016 can be arranged on the third side panel 4013.

[0094] After the transmitting pin 413 is inserted into the second housing 411 through the jack 4016 , the transmitting pin 413 is connected to the laser group in the second housing 411 by bonding, and the signal transmitted by the transmitting pin 413 drives the laser group to generate signal light.

[0095] In some embodiments, the transmitting pin 413 includes a high-speed pin group and a low-speed pin group, and the high-speed pin group is located below the low-speed pin group. The high-speed pin group provides a high-speed signal to the laser group in the second housing 411, and the low-speed signal group provides a low-frequency power supply to the laser group. The high-speed pin group and the laser are located at the same height, which reduces the length of the wire between the high-speed pin group and the laser and reduces signal loss.

[0096] In some embodiments, a first through hole 4103 is formed on the first side plate 4011 , and the first through hole 4103 penetrates the first side plate 4011 so that the first through hole 4103 is connected to the inner cavity of the second shell 411 , and the signal light generated by the laser group is emitted from the second shell 411 through the first through hole 4103 .

[0097] In some embodiments, the light emitting component 400 further includes an emission light window 415, which is used to transmit the emission light signal and seal the light hole on the second housing 411. Exemplarily, the emission light window 415 is embedded in the first through hole 4103, and the emission light window 415 is used to relatively seal the first through hole 4103, so as to allow the emission light signal to pass through and seal the first through hole 4103 to ensure the sealing performance of the second housing 411. In some embodiments, the emission light window 415 is transparent glass.

[0098] In some embodiments, the emission light window 415 can be tilted in the first through hole 4103. By arranging the emission light window 415 and the first through hole 4103 in a non-coaxial manner, the emission light signal reflected by the emission light window 415 can be reduced from returning to the transmission light path of the emission light signal, thereby avoiding the reflected light from affecting the luminescence performance of the laser group.

[0099] In some embodiments, the optical emission component includes at least one laser group, and the laser groups are respectively connected to corresponding emission pins 413 through wire bonding. The emission pins 413 transmit electrical signals and data signals to the laser chip to drive the laser chip to generate signal light.

[0100] Reference Fig.10 The transmitting pin 413 includes a high-speed signal transmitting pin 4130, a ground transmitting pin 4131 and a power transmitting pin 4132. When the laser group in the second shell 411 is connected to the transmitting pin 413 inserted into the jack 4016 by bonding, the laser chip is connected to the high-speed signal transmitting pin 4130, the power transmitting pin 4132 and the ground transmitting pin 4131 by bonding, and the laser chip is powered by the power transmitting pin 4132 so that the laser chip generates light; the light generated by the laser chip is modulated by the data signal transmitted by the high-speed signal transmitting pin 4130, so that the laser chip generates a modulated optical signal under the action of the electrical signal and the data signal.

[0101] In some embodiments, a transmitting pin 413 is provided at the other end of the second housing 411, and the transmitting pin 413 is used to realize the electrical connection between the electrical components in the second cavity 4110 and the circuit board 300. Exemplarily, the transmitting pin 413 is embedded at the other end of the second housing 411, so that one end of the circuit board 300 extends into the second housing 411, and the other end of the transmitting pin 413 is located outside the second housing 411, and the transmitting pin 413 is electrically connected to the circuit board 300 through the flexible circuit board. The transmitting pin 413 can also be welded to the circuit board 300.

[0102] Fig.12 FIG. 1 is a partial schematic diagram of a light emitting component provided according to some embodiments of the present application. Fig.12 As shown, a light emitting assembly and a beam combiner are arranged inside the second housing. The light emitting assembly includes: a semiconductor refrigerator, a light emitting chip and a beam combiner.

[0103] In some embodiments, the optical transmission component includes: a beam combiner 416, a first optical transmission chip 410 and a second optical transmission chip 420. The first optical transmission chip 410 is used to emit a first wavelength signal light and a second wavelength signal light; the second optical transmission chip 420 is used to emit a third wavelength signal light and a fourth wavelength signal light.

[0104] The beam combiner 416 combines the light emitted by the first light emitting chip 410 and the second light emitting chip 420 into one beam. For example, the beam combiner may be a polarization beam combining component that changes the polarization direction of the signal light of the second light emitting chip 420 and the first light emitting chip 410, and combines the light emitted by the first light emitting chip and the second light emitting chip into one beam.

[0105] The signal light emitted by the first optical emission chip 410 passes through the polarization beam combiner and then enters the optical fiber adapter through the first housing. The signal light emitted by the second optical emission chip is polarized by the polarization beam combiner and then emitted toward the optical fiber adapter.

[0106] In some examples, the polarization beam combining component includes a polarization wave plate and a polarization light combiner, and the polarization wave plate is located between the second light emitting chip and the polarization light combiner. The polarization beam combining component includes a second isolator 4161 and a third isolator 4162, wherein the second isolator 4161 is located on the light output path of the first light emitting chip 410, and the third isolator 4162 is located on the light output path of the second light emitting chip 420. A first polarization wave plate 41611 is provided on the light output side of the second isolator 4161, and a second polarization wave plate 41621 is provided on the light output side of the third isolator 4162. In some examples, the signal light emitted by the first light emitting chip is parallel to the direction of the circuit board, and the signal light is deflected by 45° after passing through the second isolator 4161. The signal light emitted by the second light emitting chip is parallel to the direction of the circuit board, and the signal light is deflected by 45° after passing through the third isolator. To facilitate beam combining, the difference between the deflection angle of the signal light emitted by the first light emitting chip passing through the first polarization plate and the deflection angle of the signal light emitted by the second light emitting chip passing through the second polarization plate is 90°.

[0107] In some embodiments of the present application, in order to make the optical axes of the first light emitting chip, the second light emitting chip and the polarization beam combining assembly be located in the same plane, a beam combining substrate 4165 is provided under the polarization beam combining assembly.

[0108] A beam combining platform is provided between the beam combining substrate 4165 and the beam combiner, providing a flat surface with high flatness for the beam combiner, the second isolator, and the third isolator, thereby improving the optical coupling accuracy. The cross-sectional area of ​​the beam combining platform is larger than the area of ​​the beam combining substrate 4165, and the beam combining platform provides installation space for the beam combiner, the second isolator, and the third isolator.

[0109] For easy installation, a connecting portion 4163 is provided between the second isolator 4161 and the third isolator 4162. One end of the connecting portion 4163 is fixedly connected to the second isolator 4161, and the other end of the connecting portion 4163 is fixedly connected to the third isolator 4162, so that the connecting portion 4163, the second isolator 4161, and the third isolator 4162 are integrated as a whole, and the second isolator 4161 and the third isolator 4162 can be installed and positioned at the same time by positioning only once, which is convenient for installation.

[0110] Fig.13 A schematic diagram of an optical path of a light emitting component provided according to some embodiments of the present application Figure 1 .like Fig.13 As shown, in some embodiments, the light emitting component includes: a first collimating lens 4104 located between the first light emitting chip 410 and the polarization beam combining assembly. The first collimating lens 4104 collimates the signal light emitted by the first light emitting chip 410.

[0111] The second collimating lens 4105 is located between the second light emitting chip 420 and the polarization beam combining assembly. The second collimating lens 4105 collimates the signal light emitted by the second light emitting chip 420 .

[0112] In some embodiments, the light emitting component includes: a second isolator 4161. The second isolator 4161 is located between the first collimating lens 4104 and the polarization beam combining assembly to prevent the light reflected by the polarization beam combining assembly from entering the first light emitting chip.

[0113] In some embodiments, the light emitting component includes: a third isolator 4162. The third isolator 4162 is located between the second collimating lens and the polarization beam combining assembly to prevent the light reflected by the polarization beam combining assembly from entering the second light emitting chip.

[0114] The first polarization plate 41611 is located between the second isolator 4161 and the polarization light combiner; the second polarization plate 41621 is located between the third isolator 4162 and the polarization light combiner. For example, the first polarization plate is located at the light exit side of the second isolator 4161, and the first polarization plate is located between the second isolator 4161 and the polarization light combiner 4164. The second polarization plate is located at the light exit side of the third isolator 4162, and the second polarization plate is located between the third isolator 4162 and the polarization light combiner.

[0115] In some embodiments, the light emitting component may be provided with two light emitting chips, three light emitting chips, or even more light emitting chips. The number of wavelengths that can be tuned by the light emitting component is greater than the number of light emitting chips. The number of light emitting chips in the light emitting component is not 1.

[0116] In this example, the light emitting component is provided with a first light emitting chip 410, a second light emitting chip 420, a first collimating lens 4104, a second collimating lens 4105, a semiconductor refrigerator 4106, a polarizer and a polarization light combiner. The semiconductor refrigerator is thermally connected to the first light emitting chip and the second light emitting chip, and the semiconductor refrigerator changes the temperature of the first light emitting chip or the second light emitting chip to adjust the tuning wavelength of the first light emitting chip or the second light emitting chip. The light emitted by the first light emitting component forms collimated light after passing through the first collimating lens 4104, and then transmits through the polarization light combiner to enter the first housing, and enters the optical fiber adapter through the first housing. The temperature of the first light emitting chip or the second light emitting chip is changed by the semiconductor cooler to adjust the tuning wavelength of the first light emitting chip or the second light emitting chip. Compared with the single-chip multi-wavelength second light emitting component, the light emitted by the second light emitting component forms collimated light after passing through the second collimating lens, and after being rotated by a certain angle by the polarizer, it is reflected by the polarization light combiner into the first housing, and enters the optical fiber adapter through the first housing.

[0117] In the normal working state of the ONU optical module, when the first light emitting chip 410 emits light, the second light emitting chip 420 does not emit light; when the second light emitting chip 420 emits light, the first light emitting chip 410 does not emit light. This characteristic is called time-division emission.

[0118] In the ONU, the wavelength of the signal light emitted by the optical transmitter is adjusted by adjusting the temperature of the optical transmitter chip. The present application provides an optical module, including a first optical transmitter chip 410, a second optical transmitter chip 420, a first temperature regulator, a second temperature regulator, a laser driver chip and a micro control unit 460. For example, the first optical transmitter chip 410 and the second optical transmitter chip 420 are electro-absorption modulated lasers. The laser driver chip includes: a first differential output pin 451 and a second differential output pin. The first differential output pin 451 is connected to the first optical transmitter chip 410, and the second differential output pin 452 is connected to the second optical transmitter chip 420. The micro control unit controls the temperature of the first temperature regulator and the second temperature regulator to control the coordinated wavelengths of the first optical transmitter chip 410 and the second optical transmitter chip 420 respectively.

[0119] Fig.14 A schematic diagram of an optical path of a light emitting component provided according to some embodiments of the present application Figure 2 .like Fig.14 As shown, in some embodiments, the light emitting component includes: a first collimating lens 4104, located between the first light emitting chip and the optical wavelength division multiplexer 4165. The first collimating lens 4104 collimates the signal light emitted by the first light emitting chip. A second collimating lens, located between the second light emitting chip and the beam combiner, collimates the signal light emitted by the second light emitting chip.

[0120] The combiner includes: an optical wavelength division multiplexer 4165 and a fourth isolator 4166, wherein the optical wavelength division multiplexer 4165 is located between the fourth isolator 4166 and the first light emitting chip and the second light emitting chip, and the optical wavelength division multiplexer combines the light emitted by the first light emitting chip and the second light emitting chip into one beam.

[0121] The optical wavelength division multiplexer 4165 has a first light inlet, and the signal light emitted by the first optical emission chip 410 enters the optical wavelength division multiplexer 4165 through the first light inlet, is reflected by the first reflection surface to the second transmission reflection surface, and is emitted from the light outlet after being reflected by the second transmission reflection surface. The signal light emitted by the second optical emission chip enters the optical wavelength division multiplexer 4165 through the second light inlet, is transmitted through the second transmission reflection surface, and is emitted from the light outlet.

[0122] Fig.15 A schematic diagram of an optical path of a light emitting component provided according to some embodiments of the present application Figure 3 .like Fig.15As shown, the first emission light emitted by the first light emitting chip 410 directly passes through the second lens 4045, and the first emission light beam passing through the second lens 4045 is incident on the incident light surface of the third lens 4046; a reflective film is provided on the second incident light surface 4073 of the fourth lens 4047, and the second emission light emitted by the second light emitting chip is reflected at the reflective film on the incident light surface of the fourth lens 4047, thereby changing the emission direction of the second emission light, so that the second emission light is reflected to the third lens 4046 via the fourth lens 4047. The first emitted light can be directly transmitted on the first incident light surface 4072 of the third lens 4046, and the reflected second emitted light is reflected on the first incident light surface 4072 of the third lens 4046, so that the reflected second emitted light is reflected again to the second lens 4045 via the third lens 4046; the second emitted light reflected by the third lens 4046 to the exit light surface 4071 of the second lens 4045 is reflected again on the exit light surface 4071 of the second lens 4045, so that the second emitted light is reflected to the third lens 4046 via the second lens 4045, and the second emitted light reflected again to the third lens 4046 can be directly transmitted on the first incident light surface 4072 of the third lens 4046.

[0123] Specifically, an angle selection film may be provided on the first incident light surface 4072 of the third lens 4046, and the angle selection film may selectively transmit the incident light incident to the first incident light surface 4072, that is, the angle selection film is provided with a preset incident light angle, and when the incident angle of the light incident to the first incident light surface 4072 satisfies the preset incident light angle, the light beam may directly transmit the third lens 4046; when the incident angle of the light incident to the first incident light surface 4072 does not satisfy the preset incident light angle, the light beam is reflected at the first incident light surface 4072 to change the incident angle of the incident light beam until the incident angle of the light beam satisfies the preset incident light angle of the first incident light surface 4072.

[0124] In the embodiment of the present application, the incident angle of the first emitted light transmitted by the second lens 4045 meets the preset incident light angle of the first incident light surface 4072 of the third lens 4046, so the first emitted light can be directly transmitted through the third lens 4046. The incident angle of the second emitted light reflected by the fourth lens 4047 to the first incident light surface 4072 of the third lens 4046 is greater than the preset incident light angle of the first incident light surface 4072 of the third lens 4046, so the second emitted light is reflected again at the first incident light surface 4072, and the reflected second emitted light is emitted to the exit light surface 4071 of the second lens 4045.

[0125] In the embodiment of the present application, the preset incident light angle of the angle selection film set on the first incident light surface 4072 of the third lens 4046 can be 0~45°, and the incident angle of the first emitted light passing through the second lens 4045 to the first incident light surface 4072 of the third lens 4046 is 37°, which meets the preset incident light angle of the angle selection film, so the first emitted light can be directly transmitted through the angle selection film; the incident angle of the second emitted light reflected by the fourth lens 4047 to the first incident light surface 4072 of the third lens 4046 is 57°, which exceeds the preset incident light angle of the angle selection film, so the second emitted light is reflected at the angle selection film.

[0126] The first incident light surface 4072 of the third lens 4046 provided in the embodiment of the present application is not limited to being provided with an angle selection film, and other films may also be provided. As long as the film can achieve the first emitted light to directly transmit through the first incident light surface 4072 and the second emitted light to be reflected at the first incident light surface 4072, it belongs to the protection scope of the embodiment of the present application.

[0127] In order to allow the second emitted light to pass through the third lens 4046, it is necessary to reduce the incident angle of the second emitted light to the first incident light surface 4072 of the third lens 4046. Therefore, the second emitted light reflected at the first incident light surface 4072 of the third lens 4046 can be reflected again. When the re-reflected second emitted light reaches the first incident light surface 4072 of the third lens 4046, its incident angle is reduced, which can meet the preset incident light angle of the angle selection film.

[0128] A semi-transparent and semi-reflective film is provided on the light-emitting surface 4071 of the second lens 4045, and the semi-transparent and semi-reflective film can select wavelengths, that is, a light beam in a certain wavelength range can directly pass through the semi-transparent and semi-reflective film, and a light beam exceeding the wavelength range is reflected at the semi-transparent and semi-reflective film. In the embodiment of the present application, the wavelength of the first emitted light meets the wavelength range of the semi-transparent and semi-reflective film, so the first emitted light can directly pass through the light-emitting surface 4071 of the second lens 4045; while the wavelength of the second emitted light does not meet the wavelength range of the semi-transparent and semi-reflective film, so the second emitted light reflected from the third lens 4046 to the light-emitting surface 4071 of the second lens 4045 is reflected at the semi-transparent and semi-reflective film, so that the second emitted light is reflected again from the light-emitting surface 4071 of the second lens 4045 to the first incident light surface 4072 of the third lens 4046.

[0129] After being reflected by the first incident light surface 4072 of the third lens 4046 and reflected again by the exit light surface 4071 of the second lens 4045, the incident angle of the second emitted light entering the first incident light surface 4072 of the third lens 4046 becomes smaller, so that the incident angle of the second emitted light can meet the preset incident light angle of the angle selection film, so that the reflected second emitted light can be transmitted through the third lens 4046.

[0130] The first emitted light and the second emitted light that enters the third lens 4046 again after reflection can be combined in the third lens 4046, that is, the first emitted light and the second emitted light are combined into a light beam in the third lens 4046, and the light beam is emitted from the third lens 4046 and coupled to the optical fiber adapter.

[0131] In some embodiments of the present application, a second isolator and a third isolator may be further provided. The second isolator is located between the first light emitting chip and the second lens. The third isolator is located between the second light emitting chip and the fourth lens.

[0132] In some embodiments of the present application, a first collimating lens and a second collimating lens may be provided between the first light emitting chip and the second lens; and the second collimating lens may be provided between the second light emitting chip and the fourth lens.

[0133] Fig.16 A schematic diagram of a light emitting component and a circuit board according to some embodiments of the present application Figure 1 . Fig.17 FIG. 1 is a schematic diagram of a light emitting component circuit according to some embodiments of the present application. Fig.14 As shown, in some embodiments of the present application, the optical module includes: a first light emitting chip 410 , a second light emitting chip 420 , a first temperature regulator 440 , a second temperature regulator 430 , a laser driving chip 450 , and a micro control unit 460 .

[0134] In this example, the first light emitting chip 410 and the second light emitting chip 420 are electro-absorption modulated lasers.

[0135] The laser driver chip 450 outputs differential signals, that is, the laser driver chip 450 includes: a first differential output pin 451 and a second differential output pin 452. The first differential output pin 451 is connected to the first light emitting chip 410, and the second differential output pin 452 is connected to the second light emitting chip 420. The first differential output pin 451 outputs a first differential signal, and the second differential output pin 452 outputs a second differential signal. The first differential signal and the second differential signal are a set of differential signals. In differential transmission, the amplitudes of the first differential signal and the second differential signal are equal, the phases differ by 180 degrees, and the polarities are opposite.

[0136] The first temperature regulator is thermally connected to the first light emitting chip 410 and is used to adjust the operating temperature of the first light emitting chip 410. The second temperature regulator is thermally connected to the second light emitting chip 420 and is used to adjust the operating temperature of the second light emitting chip 420.

[0137] The micro control unit 460 is electrically connected to the first temperature regulator and the second temperature regulator respectively, and is used to control the power supply current of the first temperature regulator and the second temperature regulator to achieve temperature regulation of the first temperature regulator and the second temperature regulator.

[0138] In order to achieve temperature control of the first temperature regulator, a first temperature sensor is also included. The first temperature sensor senses the current operating temperature of the first light emitting chip 410, and transmits the current operating temperature of the first light emitting chip 410 to the micro control unit 460. The micro control unit 460 adjusts the power supply current to the first temperature regulator according to the current operating temperature. In order to achieve temperature control of the second temperature regulator, a second temperature sensor is also included. The second temperature sensor senses the current operating temperature of the second light emitting chip 420, and transmits the current operating temperature of the second light emitting chip 420 to the micro control unit 460. The micro control unit 460 adjusts the power supply current to the second temperature regulator according to the current operating temperature.

[0139] The first light emitting chip 410 has a first power supply pin, a first modulation pin and a first ground pin. The first ground pin is electrically connected to the ground line, the first modulation pin is connected to the laser driving chip 450, and the first power supply pin is connected to the first power supply circuit to provide a bias voltage for the first light emitting chip 410. The first power supply pin is a light emitting pin (Laser Diode, LD) of the first light emitting chip 410. The first modulation pin is an electrical modulation absorption pin (Electroabsorption, EA) of the first light emitting chip 410, which receives a first control signal of the laser driving chip 450. The first modulation pin is connected to the first differential output pin 451 of the laser driving chip 450, and receives the first control signal of the laser driving chip 450 to realize the modulation of the first light emitting chip 410.

[0140] The second light emitting chip 420 has a second power supply pin, a second modulation pin and a second ground pin. The second ground pin is electrically connected to the ground line, the second modulation pin is connected to the laser driving chip 450, and the second power supply pin is connected to the second power supply circuit. The second modulation pin is an electrical absorption pin of the second light emitting chip 420, which receives the second control signal of the laser driving chip 450. The second modulation pin is connected to the second differential output pin of the laser driving chip 450, and receives the second control signal of the laser driving chip 450 to realize the modulation of the second light emitting chip 420. The first power supply circuit and the second power supply circuit provide bias voltage.

[0141] The optical emission component circuit also includes: a first straight wave filter 401. The first straight wave filter 401 is located between the laser driving chip 450 and the first optical emission chip 410. The first end of the first straight wave filter 401 is connected to the first differential output pin 451, and the second end of the first straight wave filter 401 is connected to the first optical emission chip 410. The first straight wave filter 401 filters out the DC signal of the laser driving chip 450, allows the AC signal of the laser driving chip 450 to pass, filters out clutter, and improves the stability of optical communication.

[0142] The optical emission component circuit also includes: a second straight wave filter 402402. The second straight wave filter 402 is located between the laser driving chip 450 and the second optical emission chip 420. The first end of the second straight wave filter 402 is connected to the second differential output pin, and the second end of the first straight wave filter 401 is connected to the second optical emission chip 420. The second straight wave filter 402 filters out the DC signal of the laser driving chip 450, allows the AC signal of the laser driving chip 450 to pass, filters out clutter, and improves the stability of optical communication.

[0143] In some embodiments, the first straight wave filter and the second straight wave filter may be capacitors.

[0144] In some embodiments of the present application, the microcontroller unit 460 changes the temperature of the first light emitting chip 410 by adjusting the temperature of the first temperature regulator and the second temperature regulator to adjust the temperature of the first light emitting chip 410. For the light emitting chip, different temperatures correspond to signal lights of different wavelengths. For example, the first light emitting chip 410 emits a first wavelength signal light at a first temperature, and the first light emitting chip 410 emits a second wavelength signal light at a second temperature. The second light emitting chip 420 emits a third wavelength signal light at the first temperature, and the second light emitting chip 420 emits a fourth wavelength signal light at the second temperature.

[0145] In some embodiments of the present application, the tuning wavelength of the first optical emission chip 410 is the first wavelength signal light and the second wavelength signal light, and the tuning wavelength of the second optical emission chip 420 is the third wavelength signal light and the fourth wavelength signal light. For example, the tuning wavelength of the first optical emission chip 410 is 1532.68nm or 1533.47nm, and the tuning wavelength of the second optical emission chip 420 is 1534.25nm or 1535.04nm; or, the tuning wavelength of the first optical emission chip 410 is 1534.25nm or 1535.04nm, and the tuning wavelength of the second optical emission chip 420 is 1532.68nm or 1533.47nm.

[0146] The wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light, and the fourth wavelength signal light are different, and the difference between the first wavelength signal light and the second wavelength signal light is less than a minimum threshold, and the difference between the third wavelength signal light and the fourth wavelength signal light is less than a minimum threshold. In some embodiments of the present application, the difference between the first wavelength signal light and the second wavelength signal light is less than 1 nm, and the difference between the third wavelength signal light and the fourth wavelength signal light is less than 1 nm.

[0147] Generally, the wavelength of the light emitting chip can be changed by adjusting the temperature by 8-10℃. Therefore, in the light emitting component, the adjustment of four wavelengths can be achieved by adjusting the temperature difference by only 8℃. At high commercial and industrial temperatures, the temperature regulator only needs to reach a cooling temperature of 30℃ or even lower, which greatly reduces the power consumption of the temperature regulator.

[0148] The first temperature and the second temperature are adjacent to the highest temperature of the operating temperature of the optical module. In some embodiments of the present disclosure, the ambient temperature of the optical module is greater than or equal to the lowest ambient temperature, and the ambient temperature of the optical module is less than or equal to the highest ambient temperature. The ambient temperature threshold is the difference between the highest ambient temperature and the lowest ambient temperature. The difference between the highest ambient temperature and the operating temperature of the current optical transmitter chip is the high temperature difference, and the ratio of the high temperature difference to the ambient temperature threshold is less than or equal to 40%.

[0149] The high temperature difference is the temperature difference that the temperature regulator needs to cool, and the ratio of the high temperature difference to the ambient temperature threshold is less than or equal to 40%, which is beneficial to reducing the power consumption of the temperature regulator.

[0150] For example, the ambient temperature of the optical module is 85°C to -40°C, the ambient temperature threshold is 125°C, the first temperature can be set to 40°C, the maximum ambient temperature of the optical module is 85°C, the difference between the maximum ambient temperature and the first temperature is 45°C, at this time, the ratio of the high temperature difference to the ambient temperature threshold is 36%. The second temperature can be set to 50°C, the maximum ambient temperature of the optical module is 85°C, the difference between the maximum ambient temperature and the first temperature is 35°C, at this time, the ratio of the high temperature difference to the ambient temperature threshold is 28%.

[0151] In some embodiments of the present application, the first temperature is set to 40±3°C, and the second temperature is set to 50±3°C.

[0152] In some embodiments of the present disclosure, the ambient temperature of the optical module is greater than or equal to the minimum ambient temperature, and the ambient temperature of the optical module is less than or equal to the maximum ambient temperature. The ambient temperature threshold is the difference between the maximum ambient temperature and the minimum ambient temperature. The difference between the operating temperature of the transmitting chip and the minimum ambient temperature is a low temperature difference, the ratio of the low temperature difference to the ambient temperature threshold is less than or equal to 80%, and the ratio of the low temperature difference to the ambient temperature threshold is greater than or equal to 60%.

[0153] For example, the ambient temperature of the optical module is 85°C to -40°C, the ambient temperature threshold is 125°C, the first temperature can be set to 40°C, the lowest ambient temperature of the optical module is -40°C, the difference between the first temperature and the lowest ambient temperature is 80°C, at this time, the ratio of the high temperature difference to the ambient temperature threshold is 64%. The second temperature can be set to 50°C, the lowest ambient temperature of the optical module is -40°C, the difference between the first temperature and the lowest ambient temperature is 90°C, at this time, the ratio of the high temperature difference to the ambient temperature threshold is 72%.

[0154] The low temperature difference is the temperature difference that the temperature regulator needs to heat, the ratio of the high temperature difference to the ambient temperature threshold is less than or equal to 40%, the ratio of the low temperature difference to the ambient temperature threshold is less than or equal to 80%, and the ratio of the low temperature difference to the ambient temperature threshold is greater than or equal to 60%, which helps to reduce the power consumption of the temperature regulator.

[0155] Table 1 is a table of temperature differences that need to be adjusted for the first light emitting component, and Table 2 is a table of temperature differences that need to be adjusted for the second light emitting component. As shown in Table 1, D1 represents: the operating temperature of the light emitting chip of the first light emitting component. The first light emitting component is a light emitting chip that emits signal light of different wavelengths at four different temperatures. T1 is the adjustment temperature difference of the temperature regulator when the ambient temperature is 85°C. T2 is the adjustment temperature difference of the temperature regulator when the ambient temperature is -40°C. In Table 2, D2 represents: the operating temperature of the second light emitting component. The second light emitting component is when two light emitting chips emit signal light of different wavelengths at two different temperatures. T1 is the adjustment temperature difference of the temperature regulator when the ambient temperature is 85°C, which is called the cooling temperature difference. T2 is the adjustment temperature difference of the temperature regulator when the ambient temperature is -40°C, which is called the heating temperature difference.

[0156] As shown in Table 1, the maximum cooling temperature difference is 55°C and the maximum heating temperature difference is 100°C; as shown in Table 2, the maximum cooling temperature difference is 45°C and the maximum heating temperature difference is 90°C, which helps to reduce power consumption.

[0157] The temperature difference of the light emitting component that needs to be adjusted can actually reflect the power consumption of the temperature regulator. The greater the temperature difference, the greater the power consumption of the temperature regulator. Under the same temperature difference, the power consumption required for cooling is greater than the power consumption required for heating.

[0158] By comparing Table 1 and Table 2, it can be seen that when two optical emitting chips are provided in the optical module, and at the first temperature, the first optical emitting chip emits a first wavelength signal light, and the second optical emitting chip emits a third wavelength signal light. At the second temperature, the first optical emitting chip emits a second wavelength signal light, and the second optical emitting chip emits a fourth wavelength signal light, and the wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light, and the fourth wavelength signal light increase in sequence. When the operating temperature of the optical emitting chip is the first temperature and the second temperature, the ratio of the low temperature difference to the ambient temperature threshold is less than or equal to 80%, and the ratio of the low temperature difference to the ambient temperature threshold is greater than or equal to 60%; the ratio of the high temperature difference to the ambient temperature threshold is less than or equal to 40%.

[0159]

[0160]

[0161] In some embodiments of the present application, the first temperature regulator and the second temperature regulator are semiconductor refrigerators.

[0162] The present application provides an optical module, including: a first light emitting chip 410, a second light emitting chip 420, a first temperature regulator, a second temperature regulator, a laser driving chip 450 and a micro control unit 460. The first differential output pin 451 of the laser driving chip 450 is connected to the first light emitting chip 410, and the second differential output pin 452 of the laser driving chip 450 is connected to the second light emitting chip 420. The first temperature regulator is thermally connected to the first light emitting chip 410, and is used to adjust the operating temperature of the first light emitting chip 410. The second temperature regulator is thermally connected to the second light emitting chip 420, and is used to adjust the operating temperature of the second light emitting chip 420. The micro control unit 460 is electrically connected to the first temperature regulator and the second temperature regulator, respectively, and is used to control the power supply current of the first temperature regulator and the second temperature regulator to achieve temperature adjustment of the first temperature regulator and the second temperature regulator. The microcontrol unit 460 changes the temperature of the first light emitting chip 410 and the temperature of the second light emitting chip 420 by adjusting the temperature of the first temperature regulator and the second temperature regulator, thereby changing the tuning wavelengths of the first light emitting chip 410 and the second light emitting chip 420. For light emitting chips, different temperatures correspond to signal lights of different wavelengths. The present application uses a laser driver chip 450 connected to the modulation ends of two light emitting chips, which reduces electronic devices and contributes to the miniaturization of circuit boards. Moreover, the solution using dual light emitting chips only requires adjusting the temperature difference of the light emitting chips to 8°C to achieve 4-wavelength tunability, reducing the power consumption of the temperature regulator.

[0163] Fig.18 FIG. 1 is another schematic diagram of a light emitting component circuit according to some embodiments of the present application. Fig.18 As shown, in some embodiments of the present application, the optical module includes: a first light emitting chip 410, a second light emitting chip 420, a first temperature regulator, a laser driving chip 450, and a micro control unit 460. When the first light emitting chip 410 and the second light emitting chip 420 are electro-absorption modulated lasers, the laser driving chip 450 is a differential signal output, that is, the laser driving chip 450 includes: a first differential output pin 451 and a second differential output pin 452. The first differential output pin 451 is connected to the first light emitting chip 410, and the second differential output pin 452 is connected to the second light emitting chip 420.

[0164] The first temperature regulator is thermally connected to the first light emitting chip 410 for regulating the operating temperature of the first light emitting chip 410. The first temperature regulator is also thermally connected to the second light emitting chip 420 for regulating the operating temperature of the second light emitting chip 420.

[0165] The micro control unit 460 is electrically connected to the first temperature regulator, and is used to control the power supply current of the first temperature regulator to achieve temperature regulation of the first temperature regulator.

[0166] In order to realize the temperature control of the first temperature regulator, a first temperature sensor is also included. The first temperature sensor senses the current operating temperature of the first light emitting chip 410 and transmits the current operating temperature of the first light emitting chip 410 to the micro control unit 460. The micro control unit 460 adjusts the power supply current to the first temperature regulator according to the current operating temperature.

[0167] The first light emitting chip 410 has a first power supply pin, a first modulation pin and a first ground pin. The first ground pin is electrically connected to the ground line, the first modulation pin is connected to the laser driving chip 450, and the first power supply pin is connected to the first power supply circuit. The first modulation pin is an electrical absorption pin of the first light emitting chip 410, and receives a first control signal of the laser driving chip 450. The first modulation pin is connected to the first differential output pin 451 of the laser driving chip 450, and receives the first control signal of the laser driving chip 450 to realize the modulation of the first light emitting chip 410.

[0168] The second light emitting chip 420 has a second power supply pin, a second modulation pin and a second ground pin. The second ground pin is electrically connected to the ground line, the second modulation pin is connected to the laser driving chip 450, and the second power supply pin is connected to the second power supply circuit. The second modulation pin is an electrical absorption pin of the second light emitting chip 420, and receives the second control signal of the laser driving chip 450. The second modulation pin is connected to the second differential output pin of the laser driving chip 450, and receives the second control signal of the laser driving chip 450 to realize the modulation of the second light emitting chip 420.

[0169] The optical emission component circuit also includes: a first straight wave filter 401. The first straight wave filter 401 is located between the laser driving chip 450 and the first optical emission chip 410. The first end of the first straight wave filter 401 is connected to the first differential output pin 451, and the second end of the first straight wave filter 401 is connected to the first optical emission chip 410. The first straight wave filter 401 filters out the DC signal of the laser driving chip 450, allows the AC signal of the laser driving chip 450 to pass, filters out clutter, and improves the stability of optical communication.

[0170] The optical emission component circuit also includes: a second straight wave filter 402. The second straight wave filter 402 is located between the laser driving chip 450 and the second optical emission chip 420. The first end of the second straight wave filter 402 is connected to the second differential output pin, and the second end of the first straight wave filter 401 is connected to the second optical emission chip 420. The second straight wave filter 402 filters out the DC signal of the laser driving chip 450, allows the AC signal of the laser driving chip 450 to pass, filters out clutter, and improves the stability of optical communication.

[0171] In some embodiments of the present application, the microcontroller unit 460 changes the temperature of the first light emitting chip 410 by adjusting the temperature of the first temperature regulator to adjust the temperature of the first light emitting chip 410. For the light emitting chip, different temperatures correspond to signal lights of different wavelengths. For example, the first light emitting chip 410 emits a first wavelength signal light at a first temperature, and the first light emitting chip 410 emits a second wavelength signal light at a second temperature. The second light emitting chip 420 emits a third wavelength signal light at the first temperature, and the second light emitting chip 420 emits a fourth wavelength signal light at the second temperature. Therefore, in the light emitting component, the adjustment of four wavelengths can be achieved by changing the temperature value only once.

[0172] The temperature regulator may be a semiconductor refrigerator.

[0173] Generally, the wavelength of the light emitting chip can be changed by adjusting the temperature by 8°C. Therefore, in the light emitting component, the adjustment of four wavelengths can be achieved by adjusting the temperature difference by only 8°C. At high commercial and industrial temperatures, the cooling temperature value required by the temperature regulator only needs to reach 30°C or even lower, which greatly reduces the power consumption of the temperature regulator.

[0174] The cooling temperature value required by the temperature regulator represents the difference between the ambient temperature of the optical module and the operating temperature of the optical transmitter chip.

[0175] The present application provides an optical module, including: a first light emitting chip 410, a second light emitting chip 420, a first temperature regulator, a laser driving chip 450 and a micro control unit 460. The first differential output pin 451 of the laser driving chip 450 is connected to the first light emitting chip 410, and the second differential output pin 452 of the laser driving chip 450 is connected to the second light emitting chip 420. The first temperature regulator is thermally connected to the first light emitting chip 410 and the second light emitting chip 420, and is used to adjust the operating temperature of the first light emitting chip 410 and the second light emitting chip 420. The micro control unit 460 is electrically connected to the first temperature regulator, respectively, and is used to control the power supply current of the first temperature regulator to achieve temperature regulation of the first temperature regulator. The micro control unit 460 changes the temperature of the first light emitting chip 410 and the temperature of the second light emitting chip 420 by adjusting the temperature of the first temperature regulator, and changes the tuning wavelength of the first light emitting chip 410 and the second light emitting chip 420. For the light emitting chip, different temperatures correspond to signal light of different wavelengths. The present application uses a laser driver chip 450 to connect the modulation ends of two light emitting chips, which reduces the number of electronic devices and helps miniaturize the circuit board. Moreover, the solution using dual light emitting chips only requires adjusting the temperature difference of the light emitting chips to 8°C to achieve 4-wavelength tunability, reducing the power consumption of the temperature regulator.

[0176] Fig.19 A schematic diagram of a light emitting component and a circuit board according to some embodiments of the present application Figure 2 . Fig. 20 FIG. 1 is a circuit diagram of a third light emitting component provided according to some embodiments of the present application. Fig.19 and Fig. 20 As shown, in some embodiments of the present application, the optical module further includes: a first power supply switch 480 and a second channel switch 470. The first input end of the first power supply switch 480 is connected to the optical emission power supply circuit, and the first input end provides a light emitting current for the optical emission chip. The second input end of the first power supply switch 480 is connected to the burst pulse circuit, and the burst pulse circuit provides a burst pulse signal. The first power supply switch 480 has a first output end and a second output end, wherein the first output end of the first power supply switch 480 is connected to the second channel switch 470. The optical emission power supply circuit provides a bias voltage.

[0177] In some embodiments, the first power switch 480 may further include a second output terminal, and the second output terminal of the first power switch 480 is grounded.

[0178] In order to reduce the current flowing through the second output terminal of the first power switch 480 and reduce electromagnetic radiation, a first resistor 403 is further provided between the first output terminal of the first power switch 480 and the ground line. The burst pulse signal provided by the burst pulse circuit controls whether the first power switch 480 is connected to channel A or channel B, that is, the burst pulse signal controls the first input terminal of the first power switch 480 to be connected to the first output terminal or the second output terminal. When the first input terminal of the first power switch 480 is connected to the second output terminal of the first switch, the current is connected to the ground line after passing through the first resistor 403, thereby reducing the current flowing through the first power switch 480.

[0179] The first power switch 480 controls the on and off of the bias voltage, and the second channel switch controls the light emission selection of the first light emitting chip and the second light emitting chip. When the first input end of the first power switch 480 is connected to the second output end of the first power switch 480, the bias voltage is not provided to the first light emitting chip 410 and the second light emitting chip 420, that is, the first light emitting chip 410 or the second light emitting chip 420 does not emit light, so that the light emitting component is turned off.

[0180] The light emission power supply circuit may be a power supply pin on a gold finger, and the light emission power supply circuit usually provides a stable light emission voltage.

[0181] When the first input end of the first power switch 480 is connected to the first output end of the first power switch 480, the bias voltage is provided to the second channel switch 470. In the ONU, the optical transmission component only needs to transmit a signal light of one wavelength at the same time, and the second channel switch 470 is configured to select power supply to the first optical transmission chip 410 or the second optical transmission chip 420 according to the control signal of the micro control unit 460.

[0182] The second channel switch 470 has a power supply input terminal, a control input terminal, a third output terminal and a fourth output terminal, wherein the power supply input terminal is electrically connected to the first power supply switch 480, the control input terminal is electrically connected to the micro control unit 460, the third output terminal is electrically connected to the first light emitting chip 410, and the fourth output terminal is connected to the second light emitting chip 420.

[0183] In some embodiments of the present application, the power supply input terminal is electrically connected to the first output terminal of the first power supply switch 480. When the first input terminal of the first power supply switch 480 is connected to the first output terminal of the first power supply switch 480, the bias voltage of the light emission power supply circuit is provided to the second channel switch 470. The micro control unit 460 controls the second channel switch 470 to connect to the first light emission chip 410 or the second light emission chip 420.

[0184] The power supply input terminal of the second channel switch 470 is connected to the third output terminal, and the light emission power supply circuit is electrically connected to the first light emission chip 410, at which time the first light emission chip 410 emits light; the light emission power supply circuit is connected to the second light emission chip 420, and the power supply input terminal of the second channel switch 470 is connected to the fourth output terminal, and the second light emission chip 420 emits light.

[0185] In some embodiments of the present application, the first power supply pin of the first light emitting chip 410 is connected to the third output terminal of the second channel switch 470 , and the second power supply pin of the second light emitting chip 420 is connected to the fourth output terminal of the second channel switch 470 .

[0186] The first light emitting chip 410 has a first power supply pin, a first modulation pin and a first ground pin. The first ground pin is electrically connected to the ground line, the first modulation pin is connected to the laser driving chip 450, and the first power supply pin is connected to the third output terminal of the second channel switch 470. The first modulation pin is an electrical absorption pin of the first light emitting chip 410, and receives the first control signal of the laser driving chip 450. The first modulation pin is connected to the first differential output pin 451 of the laser driving chip 450, and receives the first control signal of the laser driving chip 450 to realize the modulation of the first light emitting chip 410.

[0187] The second light emitting chip 420 has a second power supply pin, a second modulation pin and a second ground pin. The second ground pin is electrically connected to the ground line, the second modulation pin is connected to the laser driving chip 450, and the second power supply pin is connected to the fourth output end of the second channel switch 470. The second modulation pin is an electrical absorption pin of the second light emitting chip 420, and receives the second control signal of the laser driving chip 450. The second modulation pin is connected to the second differential output pin of the laser driving chip 450, and receives the second control signal of the laser driving chip 450 to realize the modulation of the second light emitting chip 420.

[0188] The microcontrol unit 460 has a preset power supply algorithm, and selects the channel of the second channel switch 470 according to the data signal of the host computer. For example, the microcontrol unit 460 outputs a first control signal, and the power supply input terminal of the second channel switch 470 is connected to the third output terminal; the microcontrol unit 460 outputs a second control signal, and the power supply input terminal of the second channel switch 470 is connected to the fourth output terminal.

[0189] For the convenience of description, the micro control unit 460 has a first control pin and a second control pin, wherein the first control pin is connected to the second channel switch 470, and the signal output by the first control pin is used to control the channel of the second channel switch 470. The second control pin is electrically connected to the first temperature thermostat, and the signal output by the second control pin is used to control the temperature of the first temperature thermostat.

[0190] In some embodiments of the present application, the tuning wave of the first optical emission chip 410 is the first wavelength signal light and the second wavelength signal light, and the tuning wave of the second optical emission chip 420 is the third wavelength signal light and the fourth wavelength signal light. For example, the tuning wavelength of the first optical emission chip 410 is 1532.68nm or 1533.47nm, and the tuning wavelength of the second optical emission chip 420 is 1534.25nm or 1535.04nm; or, the tuning wavelength of the first optical emission chip 410 is 1534.25nm or 1535.04nm, and the tuning wavelength of the second optical emission chip 420 is 1532.68nm or 1533.47nm.

[0191] The wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light, and the fourth wavelength signal light are different, and the difference between the first wavelength signal light and the second wavelength signal light is less than a minimum threshold, and the difference between the third wavelength signal light and the fourth wavelength signal light is less than the minimum threshold. In some embodiments of the present application, the difference between the first wavelength signal light and the second wavelength signal light is less than 1 nm, and the difference between the third wavelength signal light and the fourth wavelength signal light is less than 1 nm.

[0192] When the first temperature controller is thermally connected to the first light emitting chip 410 and the second light emitting chip 420, the difference between the first wavelength and the second wavelength is less than the minimum threshold value, and when the emission wavelength of the first light emitting chip is adjusted from the first wavelength signal light to the second wavelength signal light, the wavelength adjustment can be achieved by controlling the temperature of the first temperature controller by the micro control unit 460. When the first wavelength needs to be adjusted to the second wavelength, the wavelength adjustment can be achieved by controlling a temperature gradient of the first light emitting chip 410 by the micro control unit 460.

[0193] When the first temperature controller is thermally connected to the first light emitting chip 410 and the second light emitting chip 420, the difference between the third wavelength and the fourth wavelength is less than the minimum threshold value, and when the third wavelength of the second light emitting chip 420 is adjusted to the fourth wavelength, the wavelength adjustment can be achieved by controlling the temperature of the first temperature controller by the micro control unit 460. And the wavelength adjustment can be achieved by controlling a temperature gradient of the second light emitting chip 420 by the micro control unit 460.

[0194] The temperature gradient is the temperature difference when the light emitting chip tunes light of different wavelengths. For example, the temperature when the first light emitting chip 410 tunes light of the first wavelength is the first temperature, and the temperature when the first light emitting chip 410 tunes light of the second wavelength is the second temperature. When the difference between the first wavelength and the second wavelength is less than the minimum threshold, the difference between the first temperature and the second temperature is the temperature gradient. Generally, the wavelength of the light emitting chip can be changed by adjusting the temperature by 6-10°C. The temperature gradient can be 6-10°C. In some embodiments of the present application, the temperature gradient is 8°C.

[0195] The first temperature and the second temperature are adjacent to the highest temperature of the operating temperature of the optical module. In some embodiments of the present disclosure, the ambient temperature of the optical module is greater than or equal to the minimum ambient temperature, and the ambient temperature of the optical module is less than or equal to the maximum ambient temperature. The ambient temperature threshold is the difference between the maximum ambient temperature and the minimum ambient temperature. The difference between the maximum ambient temperature and the operating temperature of the optical emission chip is a high temperature difference, and the ratio of the high temperature difference to the ambient temperature threshold is less than or equal to 40%. The difference between the operating temperature of the optical emission chip and the minimum ambient temperature is a low temperature difference, and the ratio of the low temperature difference to the ambient temperature threshold is less than or equal to 80%, and the ratio of the low temperature difference to the ambient temperature threshold is greater than or equal to 60%.

[0196] For light emitting components, the operating temperature of the light emitting chip plus the high temperature difference is the maximum ambient temperature; the operating temperature of the light emitting chip minus the low temperature difference is the minimum ambient temperature.

[0197] The present application provides an optical module, including: a first light emitting chip 410, a second light emitting chip 420, a first temperature regulator, a laser driving chip 450, a first power supply switch 480, a second channel switch 470 and a micro control unit 460. The first input end of the first power supply switch 480 is connected to the light emitting power supply circuit, the second input end of the first power supply switch 480 is connected to the burst pulse circuit, the first output end of the first power supply switch 480 is connected to the second channel switch 470, and the second output end of the first power supply switch 480 is grounded. The second channel switch 470 has a power supply input end, a control input end, a third output end and a fourth output end, wherein the power supply input end is electrically connected to the first power supply switch 480, the control input end is electrically connected to the micro control unit 460, the third output end is electrically connected to the first light emitting chip 410, and the fourth output end is connected to the second light emitting chip 420. The micro control unit 460 controls the channel of the first power supply switch 480. The present application adopts a laser driving chip 450 connected to the modulation end of two light emitting chips, which reduces electronic devices and helps to miniaturize the circuit board. The first power switch 480 controls the switch of the light emitting chip, the second channel switch 470 controls the selection of the first light emitting chip 410 or the second light emitting chip 420 channel, and then the temperature of the light emitting chip is controlled by the temperature regulator. The temperature difference of the light emitting chip needs to be adjusted to a temperature gradient, so that 4 wavelengths can be tunable, which reduces the power consumption of the temperature regulator.

[0198] Fig.21 A schematic diagram of a light emitting component and a circuit board according to some embodiments of the present application Figure 3 . Fig. 22 FIG. 4 is a schematic diagram of a fourth light emitting component circuit according to some embodiments of the present application. Fig.21 and Fig. 22 As shown, the optical module includes: a first light emitting chip 410, a second light emitting chip 420, a third switch 490, a first limit driving chip 491, and a second limit driving chip 492. In this example, the first light emitting chip 410 and the second light emitting chip 420 are distributed feedback (DFB) lasers. The distributed feedback laser has a positive electrode and a negative electrode.

[0199] The first limiting driving chip 491 has a first pad and a second pad. The first pad is connected to the first transmitting pin on the gold finger to receive the first differential signal from the host computer. The second pad is connected to the second transmitting pin on the gold finger to receive the second differential signal from the host computer. The first differential signal and the second differential signal are a set of differential signals, which are transmitting signals.

[0200] The first limit driving chip 491 has a third pad and a fourth pad. The first group of differential signals are amplified by the first limit driving chip 491 and then outputted by the third pad and the fourth pad. The third pad and the fourth pad are connected to the third switch, and the amplified first group of differential signals enter the third switch 490. The first limit driving chip 491 amplifies the first group of differential signals, and the amplified signals enter the third switch 490.

[0201] The third switch is a single-pole double-throw switch. The first input end of the third switch includes: a first port and a second port, the first port is connected to the third pad, and the second port is connected to the fourth pad.

[0202] The second input end of the third switch is connected to the microcontroller chip, and the second input end receives a control signal from the microcontroller chip, and selects an output channel according to the control signal.

[0203] The first output end of the third switch is connected to the second limiting driving chip 492, and the second output end of the third switch is connected to the first limiting driving chip 491. When the third switch selects the first output end, the first light emitting chip 410 emits light; when the third switch selects the second output end, the second light emitting chip 420 emits light.

[0204] The first output end of the third switch includes a third port and a fourth port, and the second output end of the third switch includes a fifth port and a sixth port.

[0205] The emission input end of the second limiting driver chip 492 includes a first drive pin and a second drive pin, the first drive pin is connected to the third port, and the second drive pin is connected to the fourth port. The second limiting driver chip 492 receives the electrical signal from the first output end, converts the signal into a drive signal, and drives the first light emitting chip 410. In this example, the first light emitting chip 410 and the second light emitting chip 420 are distributed feedback lasers, which need to receive differential signals to achieve light emission. Therefore, the emission output end of the second limiting driver chip 492 includes: a third drive pin and a fourth drive pin, the third drive pin is connected to the positive electrode of the first light emitting chip 410, and the fourth drive pin is connected to the negative electrode of the first light emitting chip 410.

[0206] The third driving pin of the second amplitude limiting driving chip 492 is also connected to the first power supply circuit, and the cathode of the first light emitting chip 410 is also connected to the cathode port of the second amplitude limiting driving chip 492. The first power supply circuit and the ground output terminal of the second amplitude limiting driving chip 492 form a loop to provide bias current for the first light emitting chip 410.

[0207] The fifth port of the third switch is connected to the fifth pad of the first limiting driver chip 491, and the sixth port of the third switch is connected to the sixth pad of the first limiting driver chip 491. When the third switch selects the second output terminal, the differential signal is transmitted to the first limiting driver chip 491. In this example, the first limiting driver chip 491 integrates an optical driving circuit and a limiting amplifier circuit to convert the signal from the third switch into a driving signal. The first limiting driver chip 491 also has a seventh pad and an eighth pad, which transmits the converted driving signal to the second light emitting chip 420. The seventh pad of the first limiting driver chip 491 is connected to the positive electrode of the second light emitting chip 420, and the eighth pad of the first limiting driver chip 491 is connected to the negative electrode of the second light emitting chip 420. In this example, the second light emitting chip 420 is a distributed feedback laser, which needs to receive a differential signal to achieve light emission. Therefore, the seventh pad of the first amplitude limiting driving chip 491 is connected to the positive electrode of the second light emitting chip 420 , and the eighth pad of the first amplitude limiting driving chip 491 is connected to the negative electrode of the second light emitting chip 420 .

[0208] The first amplitude limiting driving chip 491 further has a cathode pad, and the cathode pad of the first amplitude limiting driving chip 491 is connected to the cathode of the second light emitting chip 420 .

[0209] In the example of the present application, the wavelengths of the first light emitting chip 410 and the second light emitting chip 420 can be adjusted by temperature. The tuning wavelengths of the first light emitting chip 410 are the first wavelength signal light and the second wavelength signal light, and the tuning wavelengths of the second light emitting chip 420 are the third wavelength signal light and the fourth wavelength signal light. For example, the tuning wavelength of the first light emitting chip 410 is 1532.68nm or 1533.47nm, and the tuning wavelength of the second light emitting chip 420 is 1534.25nm or 1535.04nm; or, the tuning wavelength of the first light emitting chip 410 is 1534.25nm or 1535.04nm, and the tuning wavelength of the second light emitting chip 420 is 1532.68nm or 1533.47nm.

[0210] The wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light, and the fourth wavelength signal light are different, and the difference between the first wavelength signal light and the second wavelength signal light is less than a minimum threshold, and the difference between the third wavelength signal light and the fourth wavelength signal light is less than the minimum threshold. In some embodiments of the present application, the difference between the first wavelength signal light and the second wavelength signal light is less than 1 nm, and the difference between the third wavelength signal light and the fourth wavelength signal light is less than 1 nm.

[0211] Generally, a temperature adjustment of 8°C can change the wavelength of the light emitting chip. Therefore, in the light emitting component, the adjustment of four wavelengths can be achieved by adjusting the temperature difference to 8°C. At high commercial and industrial temperatures, the cooling temperature value required by the temperature regulator only needs to reach 30°C or even lower, which greatly reduces the power consumption of the temperature regulator. In some embodiments of the present application, the wavelength of light emitted by the first light emitting chip 410 and the second light emitting chip at the same temperature is inconsistent. For example, at the first temperature, the wavelength of the signal light emitted by the first light emitting chip 410 is the first wavelength; at the first temperature, the wavelength of the signal light emitted by the second light emitting chip is the third wavelength. At the second temperature, the wavelength of the signal light emitted by the first light emitting chip 410 is the second wavelength; at the second temperature, the wavelength of the signal light emitted by the second light emitting chip is the fourth wavelength.

[0212] The first temperature and the second temperature are adjacent to the highest temperature of the operating temperature of the optical module. In some embodiments of the present disclosure, the ambient temperature of the optical module is greater than or equal to the lowest ambient temperature, and the ambient temperature of the optical module is less than or equal to the highest ambient temperature. The ambient temperature threshold is the difference between the highest ambient temperature and the lowest ambient temperature. The difference between the highest ambient temperature and the operating temperature of the optical transmitter chip is the high temperature difference, and the ratio of the high temperature difference to the ambient temperature threshold is less than or equal to 40%.

[0213] For example, the ambient temperature of the optical module is 85°C to -40°C, the ambient temperature threshold is 125°C, the first temperature can be set to 45°C, the maximum ambient temperature of the optical module is 85°C, the difference between the maximum ambient temperature and the first temperature is 40°C, at this time, the ratio of the high temperature difference to the ambient temperature threshold is 32%. The second temperature can be set to 55°C, the maximum ambient temperature of the optical module is 85°C, the difference between the maximum ambient temperature and the first temperature is 30°C, at this time, the ratio of the high temperature difference to the ambient temperature threshold is 24%.

[0214] In some embodiments of the present disclosure, the ambient temperature of the optical module is greater than or equal to the minimum ambient temperature, and the ambient temperature of the optical module is less than or equal to the maximum ambient temperature. The ambient temperature threshold is the difference between the maximum ambient temperature and the minimum ambient temperature. The difference between the operating temperature of the transmitting chip and the minimum ambient temperature is a low temperature difference, the ratio of the low temperature difference to the ambient temperature threshold is less than or equal to 80%, and the ratio of the low temperature difference to the ambient temperature threshold is greater than or equal to 60%.

[0215] For example, the ambient temperature of the optical module is 85°C to -40°C, the ambient temperature threshold is 125°C, the first temperature can be set to 45°C, the lowest ambient temperature of the optical module is -40°C, the difference between the first temperature and the lowest ambient temperature is 85°C, at this time, the ratio of the high temperature difference to the ambient temperature threshold is 68%. The second temperature can be set to 55°C, the lowest ambient temperature of the optical module is -40°C, the difference between the first temperature and the lowest ambient temperature is 95°C, at this time, the ratio of the high temperature difference to the ambient temperature threshold is 76%.

[0216] In the optical module provided in the present application, the microcontroller chip controls the channel of the third switch, and the power supply algorithm is preset in the microcontroller chip, and the channel of the third switch is selected according to the data signal of the host computer. For example, the microcontroller unit 460 outputs a first control signal, and the first input end of the third switch is connected to the first output end of the third switch, and the first light emitting chip 410 emits light; the microcontroller unit 460 outputs a second control signal, and the first input end of the third switch is connected to the second output end of the third switch, and the second light emitting chip 420 emits light.

[0217] In some embodiments of the present application, in order to improve the stability of high-speed signals, a plurality of DC filters are provided in the differential signal circuit to isolate direct wave signals. The DC filter can be a capacitor. For example, a capacitor is provided between the gold finger and the first limit driving chip 491, a capacitor is provided between the first limit driving chip 491 and the third switch, a capacitor is provided between the second limit driving chip 492 and the first light emitting chip 410, and a capacitor is provided between the first limit driving chip 491 and the second light emitting chip 420.

[0218] For example, a third capacitor 4111 is provided between the first transmitting pin and the first pad of the first amplitude limiting driving chip 491, and a fourth capacitor 4112 is provided between the second transmitting pin and the second pad of the first amplitude limiting driving chip 491. A fifth capacitor 4113 is provided between the first port of the third switch and the third pad of the first amplitude limiting driving chip 491. A sixth capacitor 4114 is provided between the second port of the third switch and the fourth pad of the first amplitude limiting driving chip 491.

[0219] A seventh capacitor 1445 is provided between the third driving pin of the second limiting driving chip 492 and the positive electrode of the first light emitting chip 410 , and an eighth capacitor 4116 is provided between the fourth driving pin of the second limiting driving chip 492 and the negative electrode of the first light emitting chip 410 .

[0220] A ninth capacitor 4117 is provided between the seventh pad of the first limit driving chip 491 and the positive electrode of the second light emitting chip 420 , and a tenth capacitor 4118 is provided between the eighth pad of the first limit driving chip 491 and the negative electrode of the second light emitting chip 420 .

[0221] In some embodiments of the present application, the bias circuits of the first light emitting chip 410 and the second light emitting chip 420 are further provided with an AC filter, which may be a resistor or an inductor.

[0222] For example, an AC filter is provided between the bias circuit and the differential circuit. A first AC filter and a seventh capacitor are provided between the first power supply circuit and the third drive pin of the second amplitude limiting drive chip 492. A second AC filter and an eighth capacitor are provided between the ground output terminal of the second amplitude limiting drive chip 492 and the fourth drive pin of the second amplitude limiting drive chip 492.

[0223] A third AC filter and a ninth capacitor are provided between the second power supply circuit and the seventh pad of the first amplitude limiting driving chip 491. A fourth AC filter and a tenth capacitor are provided between the negative pad of the first amplitude limiting driving chip 491 and the eighth pad of the first amplitude limiting driving chip 491.

[0224] In some examples of the present application, the first limiting driver chip 491 integrates an optical driving circuit and a signal amplifying circuit. The second limiting driver chip 492 also integrates an optical driving circuit and a signal amplifying circuit. Among them, the optical driving circuit of the second limiting driver chip 492 is connected to the first light emitting chip 410, and is used to drive the first light emitting chip 410. The signal amplifying circuit of the second limiting driver chip 492 is connected to the optical receiving component, and the optical receiving component converts the received optical signal into a received electrical signal, which is amplified by the signal amplifying circuit of the second limiting driver chip 492 and transmitted to the host computer through the gold finger.

[0225] Fig.23 A schematic diagram of a light emitting component, a light receiving component and a circuit board provided according to some embodiments of the present application. Fig.24 FIG. 1 is a schematic diagram of a circuit of a light emitting component and a light receiving component provided according to some embodiments of the present application. Fig.23 and Fig.24 As shown, the first receiving pin of the optical receiving component is connected to the fifth pad of the second amplitude limiting driving chip 492, and the second receiving pin of the optical receiving component is connected to the sixth pad of the second amplitude limiting driving chip 492. The received electrical signal is input into the second amplitude limiting driving chip 492 via the fifth pad of the second amplitude limiting driving chip 492 and the sixth pad of the second amplitude limiting driving chip 492. After being amplified by the second amplitude limiting driving chip 492, the received electrical signal is output via the seventh pad of the second amplitude limiting driving chip 492 and the eighth pad of the second amplitude limiting driving chip 492.

[0226] The seventh pad of the second limit driving chip 492 is connected to the first receiving pin of the gold finger, and the seventh pad of the second limit driving chip 492 is connected to the second receiving pin of the gold finger to transmit the received electrical signal to the gold finger.

[0227] In some embodiments of the present application, the light emitting chip may also be a broadband tunable sampled grating laser, and tuning of different wavelengths may be achieved by adjusting the power supply voltage or power supply current of the light emitting chip.

[0228] In some embodiments of the present application, when the first light emitting chip 410 and the second light emitting chip are broadband tunable sampled grating lasers, the optical module is provided with a voltage control circuit to achieve tuning of different wavelengths by adjusting the power supply voltage or current of the light emitting chip.

[0229] Fig.25 This is a schematic diagram of the structure of a light receiving component provided according to some embodiments of the present application. Fig.26 It is a cross-sectional schematic diagram of a light receiving component provided according to some embodiments of the present application. Fig. 27 FIG. 1 is a partial schematic diagram of a light receiving component provided according to some embodiments of the present application. Fig.25 , Fig.26 and Fig. 27 As shown, the light receiving component includes: a tube base 510, a tube cap 520, and other components arranged in the tube cap 520 and the tube base 510. The tube cap 520 is covered at one end of the tube base 510. The tube base 510 includes a plurality of receiving pins 530, which are used to realize the electrical connection between the flexible circuit board and other electrical components in the light receiving component 500, and further realize the electrical connection between the light receiving component 500 and the circuit board 300. This embodiment is only based on Fig. 22 The structure shown is taken as an example.

[0230] The tube cap 520 is buckled on the tube base 510 to form a light receiving space, and the filter support 512, the third temperature regulator 511, the adjustable filter 514, the thermistor 513, the converging lens 515, the light receiving chip 516, and the transimpedance amplifier chip 517 are located in the light receiving space. The centers of the adjustable filter 514, the converging lens 515, and the light receiving chip 516 are on the same vertical line and are coaxially arranged.

[0231] The third temperature regulator 511 can be a thermoelectric cooler (TEC). The temperature of the tunable filter is controlled by adjusting the third temperature regulator 511. When the temperature of the tunable filter changes, the molecular kinetic energy in the tunable filter changes, that is, the tunable filter undergoes thermal expansion and contraction, or the molecular structure in the tunable filter undergoes a reversible change, thereby changing the refractive index emission of the tunable filter. This causes the wavelength of the optical signal passing through the tunable filter and the wavelength of the optical signal cut off by the tunable filter to change, thereby allowing the optical signal with the wavelength corresponding to the changed temperature to pass through the tunable filter, and the optical signals of other wavelengths to be cut off. Therefore, by making the tunable filter at different temperatures through the third temperature regulator 511, optical signals of different wavelengths can all pass through the tunable filter.

[0232] Fig.28 A partial exploded schematic diagram of a light receiving component provided according to some embodiments of the present application Figure 1 . Fig.29 A partial exploded schematic diagram of a light receiving component provided according to some embodiments of the present application Figure 2 . Fig.28 and Fig.29 The disassembled light receiving components are displayed from different angles. Fig.28 and Fig.29 As shown, the third temperature regulator 511 is located on the tube base 510, and the filter holder 512 is located above the third temperature regulator 511. Specifically, the lower surface of the third temperature regulator 511 is attached to the surface of the tube base 510, wherein the lower surface of the third temperature regulator 511 is the negative electrode of the third temperature regulator 511, that is, the negative electrode of the third temperature regulator 511 in the present application is connected to the surface of the vertical tube base 510; the upper surface of the third temperature regulator 511 is the positive electrode of the third temperature regulator 511, the surface of the tube base has a TEC pin, and the positive electrode of the TEC is electrically connected to the TEC pin; the upper surface of the TEC is vertically provided with a filter holder 512, and the filter holder 512 is used to support the adjustable filter 514 and the thermistor 513.

[0233] The filter support 512 has step surfaces of different heights for carrying different optoelectronic devices. The filter support 512 includes: a first frame and a second frame, wherein the height of the upper surface of the first frame is lower than the height of the upper surface of the second frame. The lower surface of the first frame is connected to the upper surface of the third temperature regulator 511, and the upper surface of the second frame is higher than the upper surface of the first frame. The converging lens 515 and the light receiving chip 516 are sequentially located below the second frame.

[0234] The upper surface of the filter holder 512 may be a plane or may have different heights.

[0235] The second frame plate is provided with a through hole 5123 , and the first optical signal is reflected to the displacement prism by the first lens 815 , and enters the converging lens 515 through the receiving light window and the through hole of the adjustable filter 514 .

[0236] The surface temperature of the adjustable filter 514 is collected in real time through the thermistor 513, and the collected surface temperature of the adjustable filter 514 is fed back to the thermoelectric cooler driving circuit. The thermoelectric cooler driving circuit determines the heating or cooling current input into the third temperature regulator according to the received surface temperature of the adjustable filter 514, so as to achieve heating or cooling of the adjustable filter 514, so that the adjustable filter 514 presents different temperatures to receive signal light of different wavelengths.

[0237] The thermistor 513 is located on the upper surface of the first frame 5121, and the thermistor 513 is arranged adjacent to the adjustable filter 514. In order to more accurately reflect the temperature of the adjustable filter 514, a gasket 5131 is also provided. The gasket 5131 is located between the thermistor 513 and the first frame 5121, and the upper surface of the gasket is flush with the upper surface of the second frame 5122, so that the thermistor 513 and the adjustable filter 514 are located at the same height, and the thermistor 513 is against the side wall of the adjustable filter 514. The thermal conductivity of the gasket is smaller than the thermal conductivity of the filter support 512.

[0238] In order to facilitate the electrical connection between the thermistor 513 and the outside of the light receiving cavity, a thermistor signal line is provided on the gasket 5131 and connected to the receiving pin. In order to reduce the length of the wire bonding, the light receiving component is provided with a thermistor positive pin 531 and a thermistor negative pin 532. The thermistor positive pin 531 and the thermistor negative pin 532 protrude above the tube holder 510, and the surfaces of the thermistor positive pin 531 and thermistor negative pin 532 are higher than the upper surface of the third temperature regulator 511, shortening the distance between the pin and the thermistor 513.

[0239] The convergent lens 515 can converge the signal light from the adjustable filter 514, and then transmit it to the optical receiving chip 516 after convergence. In order to realize the installation of the convergent lens 515, the optical receiving component is also provided with an optical receiving chip 516 and a transimpedance amplifier chip 517 located on the surface of the tube seat 510, and the convergent lens 515 is covered above the optical receiving chip 516. In order to facilitate the installation of the convergent lens 515, the optical receiving component is provided with a lens bracket 518, and the lens bracket 518 supports the convergent lens 515. In some embodiments, the lens bracket 518 includes: a first lens support 5181 and a second lens support 5182. One end of the first lens support 5181 is connected to the tube seat 510, and the other end of the first lens support 5181 is connected to the convergent lens 515. One end of the second lens support 5182 is connected to the tube seat 510, and the other end of the second lens support 5182 is connected to the convergent lens 515. The first lens support and the second lens support are respectively located on both sides of the light receiving chip 516 , so that light can enter the light receiving chip 516 through the converging lens 515 .

[0240] The optical receiving chip 516 can receive the signal light from the converging lens 515. The commonly used optical receiving chip 516 is a photodetector APD, which is used to receive the optical signal sent by the external device and convert the optical signal sent by the external device into an electrical signal; the input pin of the transimpedance amplifier chip 517 is connected to the output pin of the optical receiving chip 516, which is used to convert the electrical signal output by the optical receiving chip 516 into a voltage signal; the high-frequency signal input pin of the limiting amplifier chip is connected to the output pin of the transimpedance amplifier chip 517, which is used to amplify the voltage signal output by the transimpedance amplifier chip 517; the input pin of the clock data recovery chip is connected to the high-frequency signal output pin of the limiting amplifier chip, which is used to shape the voltage signal output by the limiting amplifier chip, and the output pin of the clock data recovery chip is connected to the gold finger. The signal received by the optical receiving device can be sent to the host computer through the gold finger.

[0241] In the application example, the converging lens 515 and the light receiving chip 516 are not thermally connected to the upper surface of the third temperature regulator 511, which can effectively reduce the deformation of the converging lens 515 and the light receiving chip 516 during the temperature adjustment process of the third temperature regulator 511 and improve the light coupling efficiency.

[0242] In some embodiments of the present application, the tunable filter 514 may be a single-cavity filter or a dual-cavity filter.

[0243] In the embodiment of the present application, the optical module includes an adjustable filter 514, and the adjustable filter 514 is a wavelength tunable filter 514. The third temperature regulator 511 can adjust the surface temperature of the adjustable filter 514 so that the adjustable filter 514 exhibits different surface temperatures, so that the adjustable filter has the ability to receive signal lights of different wavelengths. For example, TEC adjusts the surface temperature of the adjustable filter 514 to a first temperature. At the first temperature, the first wavelength signal light can pass through the adjustable filter 514. TEC can also adjust the surface temperature of the adjustable filter 514 to a second temperature. At the second temperature, the second wavelength signal light can pass through the adjustable filter 514. Therefore, in the present application, the surface temperature of the adjustable filter 514 is adjusted so that signal lights of different wavelengths can pass through the adjustable filter 514. The adjustable filter 514 in the present application can replace multiple filters of the traditional optical module structure.

[0244] In some embodiments of the present application, the first optical signal includes signal light of at least two wavelengths. For example, the first optical signal includes a fifth wavelength signal light, a sixth wavelength signal light, a seventh wavelength signal light, and an eighth wavelength signal light. The wavelengths of the fifth wavelength signal light, the sixth wavelength signal light, the seventh wavelength signal light, and the eighth wavelength signal light are inconsistent, and the wavelengths of the fifth wavelength signal light, the sixth wavelength signal light, the seventh wavelength signal light, the eighth wavelength signal light, the first wavelength signal light, the second wavelength signal light, the third wavelength signal light, and the fourth wavelength signal light are all inconsistent. The wavelength of the second optical signal includes 1532.68nm, 1533.47nm, 1534.25nm, and 1535.04nm; the wavelength of the first optical signal includes two or more of 1596.34nm, 1597.19nm, 1598.04nm, and 1598.89nm; or the wavelength of the second optical signal includes 1596.34nm, 1597.19nm, 1598.04nm, and 1598.89nm, and the wavelength of the first optical signal includes two or more of 1532.68nm, 1533.47nm, 1534.25nm, and 1535.04nm.

[0245] The optical receiving component filters the first optical signal, and the optical receiver of the optical receiving component receives only signal light of one wavelength and converts the signal light into an electrical signal. The tunable filter 514 filters the first optical signal by changing the temperature of the filter, that is, the tunable filter 514 filters the first optical signal by changing the thermoelectric cooler.

[0246] In some embodiments of the present application, the filter temperature of the light receiving component is designed based on the temperature-wavelength of the light emitting component to avoid the simultaneous occurrence of the peak power of the transmitting end and the peak power of the receiving end. The higher the temperature, the larger the corresponding wavelength. The greater the adjustment temperature difference, the higher the power consumption of the optical module. Generally, the base temperature of the optical module is higher than the temperature of the filter, so when the temperature of the adjustable filter 514 is lower, the power consumption of the temperature regulator is greater.

[0247] According to the communication protocol of the optical module, the wavelength of the optical emitting component corresponds one-to-one to the wavelength of the optical receiving component. For example, the wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light and the fourth wavelength signal light increase sequentially, and the wavelengths of the fifth wavelength signal light, the sixth wavelength signal light, the seventh wavelength signal light and the eighth wavelength signal light increase sequentially.

[0248] The light emitted by the optical emitting component is a first wavelength signal light, and the corresponding light received by the optical receiving component is a sixth wavelength signal light. Correspondingly, the light emitted by the optical emitting component is a second wavelength signal light, and the corresponding light received by the optical receiving component is a seventh wavelength signal light; the light emitted by the optical emitting component is a third wavelength signal light, and the corresponding light received by the optical receiving component is an eighth wavelength signal light; the light emitted by the optical emitting component is a fourth wavelength signal light, and the corresponding light received by the optical receiving component is an eighth wavelength signal light.

[0249] This application designs the filter temperature of the light receiving component based on the temperature-wavelength of the light emitting component to avoid the peak power of the transmitting end and the peak power of the receiving end appearing at the same time. When the high temperature difference of the light emitting component is the largest, the high temperature difference of the light receiving component is not the largest; when the high temperature difference of the light emitting component is the smallest, the high temperature difference of the light receiving component is not the smallest.

[0250] The light emitted by the optical emitting component is a first wavelength signal light, and the corresponding high temperature difference value of the optical emitting component is a first high temperature difference value; the light emitted by the optical emitting component is a second wavelength signal light, and the corresponding high temperature difference value of the optical emitting component is a second high temperature difference value; the light emitted by the optical emitting component is a third wavelength signal light, and the corresponding high temperature difference value of the optical emitting component is a third high temperature difference value; the light emitted by the optical emitting component is a fourth wavelength signal light, and the corresponding high temperature difference value of the optical emitting component is a fourth high temperature difference value.

[0251] For the light receiving component, the high temperature difference plus the operating temperature of the adjustable filter is the maximum ambient temperature; the operating temperature of the adjustable filter minus the low temperature difference is the minimum ambient temperature. The operating temperature of the adjustable filter can also be called the temperature of the light receiving component.

[0252] The accumulated temperature difference is the temperature value that the optical transmitting component and the optical receiving component need to adjust. The larger the accumulated temperature difference is, the higher the power consumption of the optical module is.

[0253] The received light of the optical receiving component is the fifth wavelength signal light, and the corresponding high temperature difference value of the optical emitting component is the fifth high temperature difference value; the received light of the optical receiving component is the sixth wavelength signal light, and the corresponding high temperature difference value of the optical emitting component is the sixth high temperature difference value; the received light of the optical receiving component is the seventh wavelength signal light, and the corresponding high temperature difference value of the optical emitting component is the seventh high temperature difference value; the received light of the optical receiving component is the eighth wavelength signal light, and the corresponding high temperature difference value of the optical emitting component is the eighth high temperature difference value.

[0254] For example, the first high temperature difference, the second high temperature difference, the third high temperature difference, and the fourth high temperature difference decrease in sequence, and the seventh high temperature difference, the eighth high temperature difference, the fifth high temperature difference, and the sixth high temperature difference increase in sequence.

[0255] Table 3 is a table showing the corresponding working temperatures of the optical emitting component and the optical receiving component of the first optical module. As shown in Table 3, the maximum ambient temperature of the optical module is 85°C, the wavelength of the light emitted by the optical emitting component is 1562.68nm, the corresponding optical chip temperature is 25°C, and the high temperature difference of the emission is 60°C; the wavelength of the light received by the optical receiving component is 1596.34nm, the corresponding working temperature of the adjustable filter is 47°C, and the high temperature difference of the reception is 38°C. At this time, the cumulative temperature difference of the optical module is 98°C.

[0256] The wavelength of the light emitted by the optical transmitting component is 1533.47nm, the corresponding optical chip temperature is 35℃, and the high temperature difference of the emission is 50℃; the wavelength of the light received by the optical receiving component is 1597.19nm, the corresponding operating temperature of the adjustable filter is 57℃, and the high temperature difference of the reception is 28℃. At this time, the cumulative temperature difference of the optical module is 78℃.

[0257] The wavelength of the light emitted by the optical emitting component is 1534.25nm, the corresponding optical chip temperature is 45℃, and the high temperature difference of the emission is 40℃; the wavelength of the light received by the optical receiving component is 1598.04nm, the corresponding working temperature of the adjustable filter is 25℃, and the high temperature difference of the reception is 60℃. At this time, the cumulative temperature difference of the optical module is 100℃.

[0258] The wavelength of the light emitted by the optical transmitting component is 1535.04nm, the corresponding optical chip temperature is 55℃, and the high temperature difference of the emission is 30℃; the wavelength of the light received by the optical receiving component is 1598.59nm, the corresponding operating temperature of the adjustable filter is 35℃, and the high temperature difference of the reception is 50℃. At this time, the cumulative temperature difference of the optical module is 80℃.

[0259]

[0260] This application designs the filter temperature of the light receiving component based on the temperature-wavelength of the light emitting component to avoid the peak power of the transmitting end and the peak power of the receiving end appearing at the same time. When the low temperature difference of the light emitting component is the largest, the low temperature difference of the light receiving component is not the largest; when the low temperature difference of the light emitting component is the smallest, the low temperature difference of the light receiving component is not the smallest.

[0261] The light emitted by the optical emitting component is a first wavelength signal light, and the corresponding low temperature difference of the optical emitting component is a first low temperature difference; the light emitted by the optical emitting component is a second wavelength signal light, and the corresponding low temperature difference of the optical emitting component is a second low temperature difference; the light emitted by the optical emitting component is a third wavelength signal light, and the corresponding low temperature difference of the optical emitting component is a third low temperature difference; the light emitted by the optical emitting component is a fourth wavelength signal light, and the corresponding low temperature difference of the optical emitting component is a fourth low temperature difference.

[0262] The received light of the optical receiving component is the fifth wavelength signal light, and the corresponding low temperature difference of the optical emitting component is the fifth low temperature difference; the received light of the optical receiving component is the sixth wavelength signal light, and the corresponding low temperature difference of the optical emitting component is the sixth low temperature difference; the received light of the optical receiving component is the seventh wavelength signal light, and the corresponding low temperature difference of the optical emitting component is the seventh low temperature difference; the received light of the optical receiving component is the eighth wavelength signal light, and the corresponding low temperature difference of the optical emitting component is the eighth low temperature difference.

[0263] For example, the first low temperature difference, the second low temperature difference, the third low temperature difference, and the fourth low temperature difference increase in sequence, and the seventh high temperature difference, the eighth high temperature difference, the fifth high temperature difference, and the sixth high temperature difference decrease in sequence.

[0264]

[0265] Table 4 is a table showing the corresponding working temperatures of the optical emitting component and the optical receiving component of the second optical module. As shown in Table 4, the lowest ambient temperature of the optical module is -40°C, the wavelength of the emitted light of the optical emitting component is 1562.68nm, the corresponding optical chip temperature is 25°C, and the emission low temperature difference is 65°C; the wavelength of the received light of the optical receiving component is 1596.34nm, the corresponding adjustable filter temperature is 47°C, and the reception low temperature difference is 87°C. At this time, the cumulative temperature difference of the optical module is 152°C.

[0266] The wavelength of the light emitted by the optical emitting component is 1533.47nm, the corresponding optical chip temperature is 35℃, and the emission low temperature difference is 75℃; the wavelength of the light received by the optical receiving component is 1597.19nm, the corresponding adjustable filter temperature is 57℃, and the reception low temperature difference is 97℃. At this time, the cumulative temperature difference of the optical module is 172℃.

[0267] The wavelength of the light emitted by the optical emitting component is 1534.25nm, the corresponding optical chip temperature is 45℃, and the emission high temperature difference is 85℃; the wavelength of the light received by the optical receiving component is 1598.04nm, the corresponding adjustable filter temperature is 25℃, and the reception low temperature difference is 65℃. At this time, the cumulative temperature difference of the optical module is 150℃.

[0268] The wavelength of the light emitted by the optical emitting component is 1535.04nm, the corresponding optical chip temperature is 55℃, and the emission high temperature difference is 95℃; the wavelength of the light received by the optical receiving component is 1598.59nm, the corresponding adjustable filter temperature is 35℃, and the reception low temperature difference is 75℃. At this time, the cumulative temperature difference of the optical module is 170℃.

[0269] By staggering the low temperature difference of the optical emitting component and the low temperature difference of the optical receiving component, the peak power at the transmitting end and the peak power at the receiving end are avoided from occurring at the same time, thereby reducing power consumption. This application designs the filtering temperature of the optical receiving component based on the temperature-wavelength of the optical emitting component to avoid the peak power at the transmitting end and the peak power at the receiving end occurring at the same time. When the low temperature difference of the optical emitting component is the largest, the low temperature difference of the optical receiving component is not the largest; when the low temperature difference of the optical emitting component is the smallest, the low temperature difference of the optical receiving component is not the smallest. Avoid the peak power at the transmitting end and the peak power at the receiving end occurring at the same time, thereby reducing power consumption.

[0270] In another example of the present application, an optical emitting component includes a first optical emitting chip and a second optical emitting chip, wherein: at a first temperature, the first optical emitting chip emits a first wavelength signal light, and the second optical emitting chip emits a third wavelength signal light; at a second temperature, the first optical emitting chip emits a second wavelength signal light, and the second optical emitting chip emits a fourth wavelength signal light; the first temperature is lower than the second temperature; the wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light, and the fourth wavelength signal light increase sequentially.

[0271] The ratio of the high temperature difference of the light emitting component to the ambient temperature threshold is less than or equal to 40%; the ambient temperature threshold is the difference between the highest ambient temperature and the lowest ambient temperature, and the high temperature difference of the light emitting component is the difference between the highest ambient temperature and the working temperature of the light emitting component. The ratio of the low temperature difference of the light emitting component to the ambient temperature threshold is less than or equal to 80%, wherein the low temperature difference of the light emitting component is the difference between the working temperature of the light emitting component and the lowest ambient temperature. In this embodiment, the working temperature of the light emitting component is the first temperature and the second temperature.

[0272] The light received by the optical receiving component includes the fifth wavelength signal light, the sixth wavelength signal light, the seventh wavelength signal light, and the eighth wavelength signal light with increasing wavelengths. The operating temperatures of the optical receiving component corresponding to the fifth wavelength signal light, the eighth wavelength signal light, the seventh wavelength signal light, and the sixth wavelength signal light decrease in sequence. The operating temperature of the adjustable filter is the operating temperature of the optical receiving component.

[0273]

[0274] Table 5 is a table showing the corresponding working temperature of the optical emitting component and the optical receiving component of another optical module. As shown in Table 5, the maximum ambient temperature of the optical module is 85°C, the wavelength of the light emitted by the optical emitting component is 1562.68nm, the corresponding optical chip temperature is 35°C, and the high temperature difference of the emission is 50°C; the wavelength of the light received by the optical receiving component is 1596.34nm, the corresponding working temperature of the adjustable filter is 57°C, and the high temperature difference of the reception is 28°C. At this time, the cumulative temperature difference of the optical module is 88°C.

[0275] The wavelength of the light emitted by the optical emitting component is 1533.47nm, the corresponding optical chip temperature is 45℃, and the high temperature difference of the emission is 40℃; the wavelength of the light received by the optical receiving component is 1597.19nm, the corresponding operating temperature of the adjustable filter is 25℃, and the high temperature difference of the reception is 60℃. At this time, the cumulative temperature difference of the optical module is 100℃.

[0276] The wavelength of the light emitted by the optical emitting component is 1534.25nm, the corresponding optical chip temperature is 35℃, and the high temperature difference of the emission is 50℃; the wavelength of the light received by the optical receiving component is 1598.04nm, the corresponding operating temperature of the adjustable filter is 35℃, and the high temperature difference of the reception is 50℃. At this time, the cumulative temperature difference of the optical module is 85℃.

[0277] The wavelength of the light emitted by the optical transmitting component is 1535.04nm, the corresponding optical chip temperature is 45℃, and the high temperature difference of the emission is 40℃; the wavelength of the light received by the optical receiving component is 1598.59nm, the corresponding operating temperature of the adjustable filter is 47℃, and the high temperature difference of the reception is 38℃. At this time, the cumulative temperature difference of the optical module is 78℃.

[0278] Or as shown in Table 6, the optical emitting component includes a first optical emitting chip and a second optical emitting chip, wherein: at a first temperature, the first optical emitting chip emits a first wavelength signal light, and the second optical emitting chip emits a third wavelength signal light; at a second temperature, the first optical emitting chip emits a second wavelength signal light, and the second optical emitting chip emits a fourth wavelength signal light; the first temperature is less than the second temperature; the wavelengths of the first wavelength signal light, the second wavelength signal light, the third wavelength signal light, and the fourth wavelength signal light increase in sequence. The light received by the optical receiving component includes the fifth wavelength signal light, the sixth wavelength signal light, the seventh wavelength signal light, and the eighth wavelength signal light with increasing wavelengths in sequence. The operating temperatures of the optical receiving components corresponding to the seventh wavelength signal light, the sixth wavelength signal light, the fifth wavelength signal light, and the eighth wavelength signal light decrease in sequence. The operating temperature of the adjustable filter is the operating temperature of the optical receiving component.

[0279]

[0280] By staggering the high temperature difference of the optical emitting component and the high temperature difference of the optical receiving component, the peak power at the transmitting end and the peak power at the receiving end are avoided from occurring at the same time, thereby reducing power consumption. This application designs the filtering temperature of the optical receiving component based on the temperature-wavelength of the optical emitting component to avoid the peak power at the transmitting end and the peak power at the receiving end occurring at the same time. When the high temperature difference of the optical emitting component is the largest, the high temperature difference of the optical receiving component is not the largest; when the low temperature difference of the optical emitting component is the smallest, the high temperature difference of the optical receiving component is not the smallest. Avoid the peak power at the transmitting end and the peak power at the receiving end occurring at the same time, thereby reducing power consumption.

[0281] Since the above embodiments are all described by citing and combining with other embodiments, different embodiments have the same parts, and the same and similar parts between the embodiments in this specification can be referred to each other. No further detailed description is given here.

[0282] It should be noted that, in this specification, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a circuit structure, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such circuit structure, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the existence of other identical elements in the circuit structure, article or device including the element.

[0283] Those skilled in the art will readily appreciate other embodiments of the present application after considering the specification and practicing the disclosure of the present application. The present application is intended to cover any variation, use or adaptation of the present application, which follows the general principles of the present application and includes common knowledge or customary techniques in the art that are not disclosed in the present application. The specification and examples are intended to be exemplary only, and the true scope and spirit of the present application are indicated by the content of the claims.

[0284] The above-described embodiments of the present application do not constitute a limitation on the protection scope of the present application.

Claims

1. An optical module, characterized in that: include: A laser driving chip, wherein the laser driving chip has a first differential output pin and a second differential output pin, wherein the signal carried by the first differential output pin and the signal carried by the second differential output pin are a group of differential mode signals; A first light emitting chip connected to the first differential output pin; a second light emitting chip connected to the second differential output pin; the first light emitting chip and the second light emitting chip are electro-absorption modulated lasers; A first temperature regulator is thermally connected to the first light emitting chip and the second light emitting chip to adjust the wavelengths of the first light emitting chip and the second light emitting chip; as well as, A micro control unit, electrically connected to the first temperature regulator; The first light emitting chip has a first light emitting pin, a first modulation pin and a first ground pin, the first ground pin is electrically connected to the ground line, the first modulation pin is connected to the first differential output pin, and the first light emitting pin is connected to the power supply circuit; The micro control unit controls the operating temperature of the first temperature regulator to adjust the wavelengths of the first light emitting chip and the second light emitting chip; At a first temperature, a tuning wavelength of the first light emitting chip is different from a tuning wavelength of the second light emitting chip.

2. The optical module according to claim 1, characterized in that: A first straight wave filter is provided between the first modulation pin and the first differential output pin.

3. The optical module according to claim 1, characterized in that: The second light emitting chip has a second light emitting pin, a second electrical modulation absorption pin and a second ground pin, the second ground pin is electrically connected to the ground line, the second electrical modulation absorption pin is connected to the second differential output pin, and the second light emitting pin is connected to the power supply circuit.

4. The optical module according to claim 1, characterized in that: Also includes: A temperature sensor is thermally connected to the first temperature regulator; the temperature sensor is also connected to the micro control unit, and the micro control unit adjusts the operating voltage of the first temperature regulator according to the temperature of the temperature sensor.

5. The optical module according to claim 1, characterized in that: The first temperature regulator is a semiconductor refrigerator.

6. The optical module according to claim 1, characterized in that: The tuning wavelengths of the first light emitting chip are the first wavelength and the second wavelength; the tuning wavelengths of the first light emitting chip are the third wavelength and the fourth wavelength, the first wavelength, the second wavelength, the third wavelength and the fourth wavelength are different, and the first wavelength, the second wavelength, the third wavelength and the fourth wavelength increase or decrease sequentially.

7. An optical module, characterized in that: include: A laser driving chip, wherein the laser driving chip has a first differential output pin and a second differential output pin, wherein the signal carried by the first differential output pin and the signal carried by the second differential output pin are a group of differential mode signals; A first light emitting chip connected to the first differential output pin; a second light emitting chip connected to the second differential output pin; the first light emitting chip and the second light emitting chip are electro-absorption modulated lasers; A first temperature regulator is thermally connected to the first light emitting chip to adjust the wavelength of the first light emitting chip; A second temperature regulator is thermally connected to the second light emitting chip to adjust the wavelength of the second light emitting chip; as well as, A micro control unit, electrically connected to the first temperature regulator and the second temperature regulator; The first light emitting chip has a first light emitting pin, a first modulation pin and a first ground pin, the first ground pin is electrically connected to the ground line, the first modulation pin is connected to the first differential output pin, and the first light emitting pin is connected to the power supply circuit; The micro control unit controls the operating temperatures of the first temperature regulator and the second temperature regulator.

8. The optical module according to claim 7, characterized in that: The tuning wavelengths of the first light emitting chip are the first wavelength and the second wavelength; the tuning wavelengths of the first light emitting chip are the third wavelength and the fourth wavelength, the first wavelength, the second wavelength, the third wavelength and the fourth wavelength are different, and the first wavelength, the second wavelength, the third wavelength and the fourth wavelength increase or decrease sequentially.

9. The optical module according to claim 7, characterized in that: The first light emitting chip and the second light emitting chip are electro-absorption modulated lasers.

10. The optical module according to claim 7, characterized in that: Also includes: A first temperature sensor, wherein the first temperature sensor is thermally connected to the first temperature regulator; the first temperature sensor is also connected to the micro control unit, and the micro control unit is configured to generate a temperature signal according to the first temperature sensor; a second temperature sensor, the second temperature sensor being thermally connected to the second temperature regulator; The second temperature sensor is also connected to the micro control unit, and the micro control unit adjusts the operating voltage of the second temperature regulator according to the temperature of the second temperature sensor.

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