Satellite-borne camera high-adaptability and modularized thermal control device and satellite-borne camera

Abstract

According to the high-adaptability and modularized thermal control device for the spaceborne camera and the spaceborne camera, on one hand, a three-dimensional heat pipe network is used for building an efficient heat dissipation channel for a power assembly of a rear light path module of the camera, and the low-temperature requirement of the rear light path module of the camera is met; on the other hand, the scanning mechanism module, the ray machine assembly module and the rear light path module are installed on the camera bottom plate in a heat insulation mode, meanwhile, the scanning mechanism module and the ray machine assembly module independently wrap multiple layers of assemblies, thermal decoupling is carried out on all the modules of the camera, differential partition independent temperature control of all the modules of the camera is achieved, and the adaptability of the camera thermal control system is remarkably improved.

Description

Technical Field

[0001] The present invention relates to the technical field of satellite-borne cameras and temperature control devices, and in particular to a highly adaptable and modular thermal control device for satellite-borne cameras and a satellite-borne camera. Background Art

[0002] With the continuous development of satellite camera technology, the structure of satellite cameras is becoming more and more complex, the integration is getting higher and higher, and the power consumption is getting higher and higher. The challenges faced by camera thermal control are becoming more and more arduous. The traditional thermal control method couples the scanning mechanism module, the optical-mechanical component module, and the rear optical path module for thermal control. On the one hand, this thermal control idea leads to thermal coupling of the camera's component modules, increasing the difficulty of camera thermal control; on the other hand, the component modules affect each other and cannot meet the new demand for differentiated independent temperature control of the camera's modules, while also causing a waste of camera thermal compensation power consumption.

[0003] The present invention makes design improvements to the above-mentioned problems. The camera scanning mechanism module, the optical-mechanical component module, and the rear optical path module are heat-insulated and installed on the camera base plate. Each component module is independently covered with a multi-layer insulation component and a temperature-controlled heater is attached to each partition to achieve differentiated and independent temperature control of each component module. At the same time, a three-dimensional heat pipe network is built to dissipate heat for the rear optical path power component. Summary of the invention

[0004] In view of the defects in the prior art, an object of the present invention is to provide a highly adaptable and modular thermal control device for a spaceborne camera and a spaceborne camera.

[0005] The highly adaptable and modular thermal control device for a satellite-borne camera provided by the present invention comprises: a thermal insulation pad for a scanning mechanism module, a multi-layer thermal insulation component for a scanning mechanism module, a heater for a scanning mechanism module, a multi-layer thermal insulation component for an optomechanical component module, a heater for an optomechanical component module, a thermal insulation pad for an optomechanical component module, and a three-dimensional heat pipe network for a rear optical path module;

[0006] The scanning mechanism module, the optical-mechanical assembly module, and the rear optical path module are all heat-insulated and installed on the camera bottom plate, wherein a scanning mechanism module heat-insulating pad is installed between the scanning mechanism module and the camera bottom plate, and an optical-mechanical assembly module heat-insulating pad is installed between the optical-mechanical assembly module and the camera bottom plate;

[0007] After the scanning mechanism module is attached with the scanning mechanism module heater, and after the optical-mechanical module is attached with the optical-mechanical component module heater, the scanning mechanism module multi-layer heat insulation component and the optical-mechanical component module multi-layer heat insulation component are respectively and independently coated to achieve thermal decoupling of the scanning mechanism module and the optical-mechanical component module;

[0008] One end of the three-dimensional heat pipe network of the rear optical path module is heat-conductingly installed on the surface of the power component of the rear optical path module, and the other end is heat-conductingly installed on the heat dissipation surface to conduct the heat generated by the rear optical path module to the heat dissipation surface.

[0009] Preferably, the thermal insulation pad of the scanning mechanism module and the thermal insulation pad of the optical-mechanical component module are made of polyimide.

[0010] Preferably, the scanning mechanism module multilayer thermal insulation component and the optical-mechanical component module multilayer thermal insulation component are low-temperature multilayer thermal insulation components, which suppress the influence of external heat flow on each module and the mutual influence between each module.

[0011] Preferably, the scanning mechanism module heater and the optical-mechanical component module heater are polyimide film electric heaters, which are used to perform temperature compensation on the scanning mechanism module and the optical-mechanical component module, respectively.

[0012] Preferably, the three-dimensional heat pipe network of the rear optical path module is an aluminum-ammonia groove heat pipe.

[0013] Preferably, thermal conductive silicone grease is applied between the three-dimensional heat pipe network of the rear optical path module and the rear optical path module and the heat dissipation surface for heat conduction installation.

[0014] Preferably, temperature control thresholds are set for the scanning mechanism module heater and the optomechanical component module heater according to usage requirements, thereby achieving differentiated temperature control of the scanning mechanism module and the optomechanical component module.

[0015] The satellite-borne camera provided according to the present invention comprises the highly adaptable and modular thermal control device for the satellite-borne camera.

[0016] Compared with the prior art, the present invention has the following beneficial effects:

[0017] 1) By installing the scanning mechanism module, the optical-mechanical component module, and the rear optical path module in a heat-insulated manner, each component module can be thermally decoupled, significantly reducing the difficulty of thermal control of each component module;

[0018] 2) By independently covering the scanning mechanism module and the optical-mechanical component module with multi-layer components and attaching a temperature-controlled heater, the temperature control freedom of the scanning mechanism module and the optical-mechanical component module can be effectively improved, and the adaptability of the camera thermal control can be significantly improved;

[0019] 3) Through thermal decoupling of the scanning mechanism module and the optical-mechanical component module, and independent temperature control of differentiated partitions, the thermal compensation power consumption of the camera can be effectively reduced;

[0020] 4) By building a three-dimensional heat pipe network to dissipate heat for the power components of the camera's rear optical path module, the impact of the power components on other modules of the camera can be significantly reduced, significantly reducing the camera's temperature level. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0022] Figure 1is a schematic diagram of a highly adaptable, modular thermal control method for a spaceborne camera of the present invention;

[0023] Among them: 1-scanning mechanism module thermal insulation pad, 2-scanning mechanism module heater, 3-scanning mechanism module multi-layer thermal insulation assembly, 4-optical component module multi-layer thermal insulation assembly, 5-optical component module heater, 6-optical component module thermal insulation pad, 7-rear optical path module three-dimensional heat pipe network. DETAILED DESCRIPTION

[0024] The present invention is described in detail below in conjunction with specific embodiments. The following embodiments will help those skilled in the art to further understand the present invention, but are not intended to limit the present invention in any form. It should be noted that, for those of ordinary skill in the art, several changes and improvements can also be made without departing from the concept of the present invention. These all belong to the protection scope of the present invention.

[0025] Example

[0026] like Figure 1 The present invention provides a highly adaptable and modular thermal control device for a satellite-borne camera, comprising: a scanning mechanism module thermal insulation pad 1, a scanning mechanism module heater 2, a scanning mechanism module multi-layer thermal insulation component 3, an optomechanical component module multi-layer thermal insulation component 4, an optomechanical component module heater 5, an optomechanical component module thermal insulation pad 6, and a rear optical path module three-dimensional heat pipe network 7;

[0027] The scanning mechanism module, the optical-mechanical assembly module, and the rear optical path module are all heat-insulated and installed on the camera bottom plate. A scanning mechanism module heat-insulating pad 1 is installed between the scanning mechanism module and the camera bottom plate, and an optical-mechanical assembly module heat-insulating pad 6 is installed between the optical-mechanical assembly module and the camera bottom plate;

[0028] After the scanning mechanism module is attached with the scanning mechanism module heater 3, and after the optical-mechanical module is attached with the optical-mechanical component module heater 5, the scanning mechanism module multilayer heat insulation component 2 and the optical-mechanical component module multilayer heat insulation component 4 are respectively and independently coated to achieve thermal decoupling of the scanning mechanism module and the optical-mechanical component module;

[0029] One end of the three-dimensional heat pipe network 7 of the rear optical path module is heat-conductingly installed on the surface of the power component of the rear optical path module, and the other end is heat-conductingly installed on the heat dissipation surface to conduct the heat generated by the rear optical path module to the heat dissipation surface.

[0030] The thermal insulation pad 1 of the scanning mechanism module and the thermal insulation pad 6 of the optical-mechanical component module are made of polyimide material with a low thermal conductivity, and their quantity and dimensions can be determined according to the mounting feet of each module;

[0031] The scanning mechanism module multilayer insulation component 2 and the optical-mechanical component module multilayer insulation component 4 are low-temperature multilayer insulation components for spacecraft, which can suppress the influence of external heat flow on each module and the mutual influence between each module, and their shape and size can be designed according to the adaptability of the module appearance;

[0032] The scanning mechanism module heater 3 and the optical-mechanical component module heater 5 are polyimide film electric heaters for spacecraft, which are used to perform temperature compensation on the scanning mechanism module and the optical-mechanical component module. The heating power and circuit assembly mode thereof can be specifically designed according to the needs.

[0033] The three-dimensional heat pipe network 7 of the rear optical path module is an aluminum-ammonia groove heat pipe for spacecraft, which is used to quickly and efficiently transfer the heat loss of the rear optical path module to the heat dissipation surface. The number, length and direction of the heat pipes need to be carefully designed according to the layout of the rear optical path module and the heat dissipation surface.

[0034] Temperature control thresholds can be set for the scanning mechanism module heater 3 and the optical-mechanical component module heater 5 according to usage requirements, thereby achieving differentiated temperature control of the scanning mechanism module and the optical-mechanical component module.

[0035] Thermally conductive silicone grease is applied between the three-dimensional heat pipe network 7 of the rear optical path module and the rear optical path module and the heat dissipation surface for heat conduction installation.

[0036] In the description of the present application, it should be understood that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0037] The above describes the specific embodiments of the present invention. It should be understood that the present invention is not limited to the above specific embodiments, and those skilled in the art can make various changes or modifications within the scope of the claims, which does not affect the essence of the present invention. In the absence of conflict, the embodiments of the present application and the features in the embodiments can be combined with each other arbitrarily.

Claims

1. A highly adaptable, modular thermal control device for a spaceborne camera, characterized in that: include: Scanning mechanism module thermal insulation pad (1), scanning mechanism module multilayer thermal insulation component (2), scanning mechanism module heater (3), optical-mechanical component module multilayer thermal insulation component (4), optical-mechanical component module heater (5), optical-mechanical component module thermal insulation pad (6) and rear optical path module three-dimensional heat pipe network (7); The scanning mechanism module, the optical-mechanical assembly module, and the rear optical path module are all heat-insulated and installed on the camera bottom plate, wherein a scanning mechanism module heat-insulating pad (1) is installed between the scanning mechanism module and the camera bottom plate, and an optical-mechanical assembly module heat-insulating pad (6) is installed between the optical-mechanical assembly module and the camera bottom plate; After the scanning mechanism module is attached with the scanning mechanism module heater (3), and after the optical machine module is attached with the optical machine component module heater (5), the scanning mechanism module multilayer heat insulation component (2) and the optical machine component module multilayer heat insulation component (4) are respectively and independently coated to achieve thermal decoupling of the scanning mechanism module and the optical machine component module; One end of the three-dimensional heat pipe network (7) of the rear optical path module is heat-conductingly installed on the surface of the power component of the rear optical path module, and the other end is heat-conductingly installed on the heat dissipation surface, so as to conduct the heat generated by the rear optical path module to the heat dissipation surface.

2. The highly adaptable, modular thermal control device for a spaceborne camera according to claim 1, characterized in that: The scanning mechanism module thermal insulation pad (1) and the optical machine component module thermal insulation pad (6) are made of polyimide.

3. The highly adaptable, modular thermal control device for a spaceborne camera according to claim 1, characterized in that: The scanning mechanism module multilayer heat insulation component (2) and the optical-mechanical component module multilayer heat insulation component (4) are low-temperature multilayer heat insulation components, which suppress the influence of external heat flow on each module and the mutual influence between each module.

4. The highly adaptable, modular thermal control device for a spaceborne camera according to claim 1, characterized in that: The scanning mechanism module heater (3) and the optical-mechanical component module heater (5) are polyimide film-type electric heaters, and are used to perform temperature compensation on the scanning mechanism module and the optical-mechanical component module, respectively.

5. The highly adaptable, modular thermal control device for a spaceborne camera according to claim 1, characterized in that: The three-dimensional heat pipe network (7) of the rear optical path module is an aluminum-ammonia channel heat pipe.

6. The highly adaptable, modular thermal control device for a spaceborne camera according to claim 1, characterized in that: Thermally conductive silicone grease is applied between the three-dimensional heat pipe network (7) of the rear optical path module and the rear optical path module and the heat dissipation surface for heat conduction installation.

7. The highly adaptable, modular thermal control device for a spaceborne camera according to claim 1, characterized in that: Temperature control thresholds are set for the scanning mechanism module heater (3) and the optical-mechanical component module heater (5) according to usage requirements, thereby achieving differentiated temperature control of the scanning mechanism module and the optical-mechanical component module.

8. A satellite-borne camera, characterized in that: A highly adaptable, modular thermal control device for a spaceborne camera comprising any one of claims 1 to 7.

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