High-performance inversion assembly structure for electric automobile

Abstract

The invention relates to a high-performance inversion assembly structure for an electric vehicle, which comprises a control driving logic board, a top-layer heat dissipation device, an inversion power board and a bottom-layer heat dissipation device, and is characterized in that the inversion power board is arranged between the top-layer heat dissipation device and the bottom-layer heat dissipation device and is connected with the control driving logic board; the bottom surface of the inversion power board is provided with a second heat conduction insulation sheet and a plurality of groups of power tubes, the top surface of the inversion power board is provided with a first heat conduction insulation sheet, the first heat conduction insulation sheet is in thermal connection with the second heat conduction insulation sheet through brazing, the power tubes are provided with GaN packaging shells, the GaN packaging shells are provided with heat conduction copper sheets used for reducing thermal resistance, and the heat conduction copper sheets are in thermal connection with the second heat conduction insulation sheet. Compared with the prior art, the two surfaces of the inverter power board are respectively provided with the first heat-conducting insulating sheet and the second heat-conducting insulating sheet, and the two sheets are thermally connected through brazing, so that on one hand, double-side efficient heat dissipation is realized, on the other hand, a fixing effect can be achieved, mechanical and thermal combined design is realized, the size is reduced, and the space is saved.

Description

Technical Field

[0001] The present invention relates to the field of electric drive, and in particular to a high-performance inverter component structure for electric vehicles. Background Art

[0002] As a key component of new energy vehicles, the inverter device for drive motor plays an important role in vehicle design. With the rapid development of new energy vehicle technology, the power density of the inverter device for drive motor is getting higher and higher. Most traditional motor controllers use packaged IGBT power modules to fix them on the box with bolts. The bottom of the power module has a heat dissipation pin that can be inserted into the water tank of the box. In this way, the power module will have a better heat dissipation effect, better performance, and more convenient structural implementation. However, some third-generation semiconductor power modules cannot be made into this fully encapsulated power module structure. They are more like patch-type single-chip package tubes. This single-chip tube is patched on the PCB board through reflow soldering. At this time, because the chip is small in size and has a large amount of heat, the high-power inverter device designed with many tubes in parallel needs to fully explore and improve the heat dissipation capacity to exert its performance. The heat generated by the high-power inverter directly affects the output performance of the inverter module. Multi-directional and efficient heat dissipation is an objective problem that cannot be avoided in the development of new energy vehicle inverter devices.

[0003] For inverters that use this type of power device in a patch-type design on a PCB, the heat dissipation method is to integrate a cooling circuit on the box body, and cover the inverter power device on the surface of the cooling circuit, so as to transfer the heat generated by the power device to the cooling circuit to maintain the stable operation of the power device. However, with the rapid development of inverters, the heat dissipation performance of this cooling solution for highly integrated and high-power power devices has gradually approached saturation. The common practice in the industry is to integrate an independent radiator in the inverter device, and separate the traditional heat dissipation system integrated in the box body, so as to use the upper and lower end surfaces of the radiator for cooling at the same time, further improve the utilization rate of the radiator surface, and realize the cooling of the power device. However, this method of cooling the power chip device by attaching it to the upper and lower surfaces of the radiator is double-sided cooling for the radiator, but from the perspective of the power chip device, it is still single-sided cooling. The heat conduction area of ​​the power device itself is still limited, and the heat dissipation efficiency of the power device cannot be maximized, which will result in the failure to bring out the best performance of the power inverter device. Summary of the invention

[0004] The purpose of the present invention is to provide a high-performance inverter component structure for electric vehicles. A first heat-conducting insulating sheet and a second heat-conducting insulating sheet are respectively arranged on the two surfaces of the inverter power board, and the two are thermally connected by brazing. On the one hand, the heat under the inverter power board can be transferred to the top-level heat dissipation device above to achieve efficient heat dissipation on both sides. On the other hand, it can play a fixing role, realizing a mechanical and thermal joint design, which is conducive to reducing the volume and saving space.

[0005] The purpose of the present invention can be achieved by the following technical solutions:

[0006] A high-performance inverter assembly structure for electric vehicles, comprising a control drive logic board, a top heat sink, an inverter power board and a bottom heat sink, wherein the inverter power board is arranged between the top heat sink and the bottom heat sink and connected to the control drive logic board;

[0007] The bottom surface of the inverter power board is provided with a second thermally conductive insulating sheet and multiple groups of power tubes, the top surface is provided with a first thermally conductive insulating sheet, the first thermally conductive insulating sheet is thermally connected to the second thermally conductive insulating sheet by brazing, a GaN packaging shell is provided on the power tube, a thermally conductive copper sheet for reducing thermal resistance is provided on the GaN packaging shell, and the thermally conductive copper sheet is thermally connected to the second thermally conductive insulating sheet.

[0008] A bottom heat dissipation plane is provided on one side of the upper surface of the bottom heat dissipation device, and the bottom heat dissipation plane is thermally connected to the second heat-conducting insulation sheet. A plurality of voltage compensation modules are provided on the other side of the upper surface of the bottom heat dissipation device. Water dividing bosses and water collecting bosses are provided at both ends of the bottom heat dissipation plane, and a bottom heat dissipation water trough is provided on the lower surface of the bottom heat dissipation device. The bottom heat dissipation water trough is connected to the water dividing bosses and the water collecting bosses respectively, and the voltage compensation module is connected to the inverter power board.

[0009] Thermally conductive silicone grease is provided between the bottom heat dissipation plane and the second thermally conductive insulating sheet.

[0010] The bottom heat dissipation water tank is provided with a rib plate for dividing the inner cavity of the bottom heat dissipation water tank into a plurality of parallel flow channels, and each flow channel is provided with a plurality of S-shaped heat dissipation ribs.

[0011] The inner cavity of the bottom heat dissipation water tank is divided into two flow channels.

[0012] All voltage compensation modules are arranged to form a compensation module array. A DC power terminal is provided at the edge of the compensation module array. Safety capacitors are provided on both sides of the DC power terminal.

[0013] A top heat dissipation plane is provided on the lower surface of the top heat dissipation device, the top heat dissipation plane is thermally connected to the first heat-conducting insulating sheet, and a water dividing groove and a water collecting groove are respectively provided at both ends. A top heat dissipation water tank is provided on the upper surface of the top heat dissipation device, and the top heat dissipation water tank is respectively connected to the water dividing groove and the water collecting groove.

[0014] The lower surface of the top heat sink is provided with a top heat sink plane, the top heat sink is thermally connected to the first heat conductive insulating sheet, and two ends are provided with a water dividing groove and a water collecting groove, respectively, and the upper surface of the top heat sink is provided with a top heat sink, and the top heat sink is communicated with the water dividing groove and the water collecting groove respectively;

[0015] The water-dividing groove is communicated with the water-dividing boss, and the water-collecting groove is communicated with the water-collecting boss.

[0016] The top heat dissipation water tank is provided with isolation ribs for dividing the inner cavity of the top heat dissipation water tank into a plurality of flow channels, and each flow channel is provided with a plurality of wavy heat dissipation ribs.

[0017] The inner cavity of the top heat dissipation water tank is divided into three flow channels.

[0018] Compared with the prior art, the present invention has the following beneficial effects:

[0019] 1. The first thermally conductive insulating sheet and the second thermally conductive insulating sheet are respectively arranged on the two surfaces of the inverter power board, and the two are thermally connected by brazing. On the one hand, the heat under the inverter power board can be transferred to the top-level heat dissipation device above to achieve efficient heat dissipation on both sides. On the other hand, it can play a fixing role, realizing the mechanical and thermal joint design, which is conducive to reducing the volume and saving space.

[0020] 2. The top-layer heat sink and the bottom-layer heat sink adopt a parallel multi-channel design, which improves the uniformity of coolant flow, is beneficial to improving thermal balance, avoids inconsistent thermal expansion and contraction of materials caused by excessive surface temperature difference, and improves service life and safety.

[0021] 3. S-shaped heat dissipation ribs are designed in the flow channel, which is beneficial to increase the coolant stroke under the same flow rate and displacement, thereby improving the cooling effect.

[0022] 4. The core components of the traditional drive motor controller are integrated into a modular inverter device, eliminating the box body, box cover and other parts of the traditional controller, and can be adapted to the new energy electric drive system assembly with a common shell. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a structural schematic diagram of the present invention;

[0024] Figure 2 It is a schematic diagram of the explosion structure of the present invention;

[0025] Figure 3 This is a schematic diagram of the exploded structure from the perspective of the upper surface of the inverter power board;

[0026] Figure 4 The exploded structure diagram of the inverter power board from the bottom surface perspective;

[0027] Figure 5 A schematic diagram of the structure from the perspective of the upper surface of the bottom heat dissipation device;

[0028] Figure 6 It is a structural schematic diagram from the perspective of the bottom surface of the bottom heat dissipation device;

[0029] Figure 7 A schematic diagram of the bottom heat sink structure of the bottom heat dissipation device;

[0030] Figure 8 A schematic diagram showing the top surface perspective of the top heat sink;

[0031] Fig. 9 A schematic diagram showing the bottom surface perspective of the top heat sink;

[0032] Fig.10 It is a schematic diagram of the structure of the top-layer heat dissipation water tank of the top-layer heat dissipation device of the present invention;

[0033] Fig.11 It is a schematic diagram of the structure of the overall heat dissipation water path from a top-down perspective;

[0034] Fig.12 It is a schematic diagram of the structure of the overall heat dissipation water path from an upward perspective;

[0035] Among them: 1. drive logic board, 2. top heat sink, 3. inverter power board, 4. bottom heat sink, 21. top heat sink plane, 22. water dividing groove, 23. water collecting groove, 24. top heat sink, 31. first thermal insulation sheet, 32. second thermal insulation sheet, 33. power tube, 34. tin paste welding area, 35. drive pin, 41. bottom heat sink plane, 42. voltage compensation module, 43. water dividing boss, 44. water collecting boss, 45. bottom heat sink, 46. DC power terminal, 47. safety capacitor, 48. welding cover, 49. water inlet, 410. water outlet, 241. isolation rib, 242. wavy heat sink, 331. GaN package shell, 332. thermal copper sheet, 333. inverter pin, 451. rib plate, 452. S-shaped heat sink. DETAILED DESCRIPTION

[0036] The present invention is described in detail below in conjunction with the accompanying drawings and specific embodiments. This embodiment is implemented based on the technical solution of the present invention, and provides a detailed implementation method and specific operation process, but the protection scope of the present invention is not limited to the following embodiments.

[0037] A high performance inverter assembly structure for electric vehicles, such as Figure 1 and Figure 2 As shown, it includes a control driving logic board 1, a top heat sink 2, an inverter power board 3 and a bottom heat sink 4. The bottom heat sink 1, the inverter power board 3, the top heat sink 2 and the control driving logic board 1 are stacked from bottom to top in sequence. The inverter power board 3 is arranged between the top heat sink 2 and the bottom heat sink 4. The driving pins 35 on the inverter power board 3 pass through the reserved holes on the top heat sink 2 and are connected to the control driving logic board 1. The control driving logic board 1 is fixed on the upper surface of the top heat sink 2.

[0038] like Figure 3 and Figure 4 As shown, the bottom surface of the inverter power board 3 is provided with a second thermally conductive insulating sheet 32 ​​and a plurality of power tubes 33, the top surface is provided with a first thermally conductive insulating sheet 31, the first thermally conductive insulating sheet 31 is thermally connected to the second thermally conductive insulating sheet 32 ​​by brazing, a GaN packaging shell 331 is provided on the power tube 33, the GaN packaging shell 331 is provided with a thermally conductive copper sheet 332 for reducing thermal resistance, and the thermally conductive copper sheet 332 is thermally connected to the second thermally conductive insulating sheet 32.

[0039] A first heat-conducting insulating sheet 31 and a second heat-conducting insulating sheet 32 ​​are respectively arranged on two surfaces of the inverter power board 3, and the two are thermally connected by brazing. On the one hand, the heat below the inverter power board 3 can be transferred to the top-layer heat dissipation device 2 above to achieve efficient heat dissipation on both sides. On the other hand, it can play a fixing role, realizing a mechanical and thermal joint design, which is conducive to reducing the volume and saving space.

[0040] In this embodiment, a total of three groups of power tubes 33 are provided on the inverter power board 3, each group includes 12 power tubes 33, and the GaN package shell 331 is provided with a low thermal resistance thermal conductive copper sheet on the surface, and six inverter pins 333 are provided on both sides. The thermal conductive copper sheet 332 on the power tube 33 is closely connected with the second thermal conductive insulating sheet 32 ​​by brazing and forms a thermal connection, so that the heat of the power tube 33 is quickly transferred to the second thermal conductive insulating sheet 32 ​​through the thermal conductive copper sheet 332, and then the second thermal conductive insulating sheet 32 ​​transfers the heat to the bottom heat dissipation device 4, thereby realizing efficient and stable thermal control of one side of the power tube 33. On the other hand, through the thermal connection between the second thermal conductive insulating sheet 32 ​​and the first thermal conductive insulating sheet 31, the heat can be transferred to the first thermal conductive insulating sheet 31, and then to the top heat dissipation device 2, thereby realizing efficient and stable thermal control of the other side of the power tube 33. In addition, in this embodiment, the second thermal conductive insulating sheet 32 ​​adopts a three-piece structure, and the first thermal conductive insulating sheet 31 adopts a single-piece structure.

[0041] like Figure 3 As shown, a tin paste welding area 34 is provided on the inverter power board 3, and the second thermally conductive insulating sheet 32 ​​and the first thermally conductive insulating sheet 31 are thermally connected at the tin paste welding area 34. While achieving heat dissipation, on the other hand, the first thermally conductive insulating sheet 31 also achieves electrical insulation between the top heat sink 2 and the inverter power board 3. Similarly, the second thermally conductive insulating sheet 32 ​​also achieves electrical insulation between the bottom heat sink 4 and the inverter power board 3.

[0042] Six groups of driving pins 35 are also provided on the upper surface of the inverter power board 3 . Each group of driving pins 35 has six PIN pins and is covered with a circular sheath.

[0043] like Figures 5 to 7 As shown, the bottom heat sink 4 is a substantially square aluminum alloy heat conducting plate as a whole, and a bottom heat sink plane 41 is provided on one side of its upper surface, and the bottom heat sink plane 41 is thermally connected to the second heat conductive insulating sheet 32, and a plurality of voltage compensation modules 42 are provided on the other side of the upper surface of the bottom heat sink 4, and a water dividing boss 43 and a water collecting boss 44 are provided at both ends of the bottom heat sink plane 41, and a bottom heat sink 45 is provided on the lower surface of the bottom heat sink 4, and the bottom heat sink 45 is connected to the water dividing boss 43 and the water collecting boss 44, respectively, and the voltage compensation module 42 is connected to the inverter power board 3, and a plurality of through holes are provided on the water dividing boss 43 and the water collecting boss 44, respectively. After the bottom heat sink 4 is assembled with the inverter power board 3, the pins of the voltage compensation module 42 are electrically connected to the inverter power board 3, and the second heat conductive insulating sheet 32 ​​of the inverter power board 3 is in seamless contact with the bottom heat sink plane 41 of the bottom heat sink 4 through thermal conductive silicone grease for heat conduction.

[0044] The bottom heat sink 45 is provided with a rib plate 451 for dividing the inner cavity of the bottom heat sink 45 into a plurality of parallel flow channels, and each flow channel is provided with a plurality of S-shaped heat dissipation ribs 452. The parallel multi-flow channel design improves the uniformity of the coolant flow, is conducive to improving the thermal balance, avoids the inconsistent thermal expansion and contraction of the material caused by the large surface temperature difference, and improves the life and safety. In addition, the S-shaped heat dissipation ribs 452 are designed in the flow channel, which is conducive to increasing the stroke of the coolant under the condition of the same flow rate and displacement, thereby improving the cooling effect.

[0045] The surface of the bottom heat sink 45 is provided with a welding cover plate 48 to seal the heat sink of the bottom heat sink. The welding cover plate is provided with a water inlet 49 and a water outlet 410 to allow the coolant to enter and exit the bottom heat sink 45.

[0046] In this embodiment, the inner cavity of the bottom heat dissipation water tank 45 is divided into two flow channels, and the number of through holes on the water-dividing boss 43 and the water-collecting boss 44 are both two, corresponding to the two flow channels respectively.

[0047] All the voltage compensation modules 42 are arranged to form a compensation module array. A DC power terminal 46 is provided at the edge of the compensation module array. Safety capacitors 47 are provided on both sides of the DC power terminal 46 .

[0048] like Figures 8 to 10 As shown, the top heat sink 2 is a rectangular aluminum alloy heat conducting plate, with a top heat sink plane 21 provided on the lower surface, the top heat sink plane 21 is thermally connected to the first heat conducting insulating sheet 31, and a water dividing groove 22 and a water collecting groove 23 are provided at both ends, and a top heat sink 24 is provided on the upper surface of the top heat sink 2, which is connected to the water dividing groove 22 and the water collecting groove 23. A top heat sink 25 is provided on the upper surface of the top heat sink 2 to achieve sealing of the top heat sink 24 of the top heat sink 2.

[0049] The top heat sink 24 is provided with a separation rib 241 for dividing the inner cavity of the top heat sink 24 into a plurality of flow channels, and each flow channel is provided with a plurality of wavy heat dissipation ribs 242. The parallel multi-flow channel design improves the uniformity of the coolant flow, is conducive to improving the thermal balance, avoids the inconsistent thermal expansion and contraction of the material caused by the large surface temperature difference, and improves the life and safety. For example, in this embodiment, the inner cavity of the top heat sink 24 is divided into three flow channels.

[0050] In addition, in some embodiments, the water diversion groove 22 is connected to the water diversion boss 43, and the water collection groove 23 is connected to the water collection boss 44, so that a set of water inlet 49 and water outlet 410 can be shared. Fig.11 and Fig.12As shown, a more integrated double-sided cooling water channel structure can be formed. The inverter power board 3 is located between the top water channel and the bottom water channel, and conducts heat with the top water channel and the bottom water channel respectively through the first thermal conductive insulation sheet 31 on the top layer and the second thermal conductive insulation sheet 32 ​​on the top layer.

Claims

1. A high-performance inverter assembly structure for electric vehicles, characterized in that: It comprises a control driving logic board (1), a top-layer heat sink (2), an inverter power board (3) and a bottom-layer heat sink (4), wherein the inverter power board (3) is arranged between the top-layer heat sink (2) and the bottom-layer heat sink (4) and is connected to the control driving logic board (1); The bottom surface of the inverter power board (3) is provided with a second heat-conducting insulating sheet (32) and a plurality of groups of power tubes (33), and the top surface is provided with a first heat-conducting insulating sheet (31), the first heat-conducting insulating sheet (31) is thermally connected to the second heat-conducting insulating sheet (32) by brazing, a GaN packaging shell (331) is provided on the power tube (33), a heat-conducting copper sheet (332) for reducing thermal resistance is provided on the GaN packaging shell (331), and the heat-conducting copper sheet (332) is thermally connected to the second heat-conducting insulating sheet (32).

2. A high-performance inverter assembly structure for electric vehicles according to claim 1, characterized in that: A bottom heat dissipation plane (41) is provided on one side of the upper surface of the bottom heat dissipation device (4), and the bottom heat dissipation plane (41) is thermally connected to the second heat-conducting insulating sheet (32). A plurality of voltage compensation modules (42) are provided on the other side of the upper surface of the bottom heat dissipation device (4). Water dividing bosses (43) and water collecting bosses (44) are provided at both ends of the bottom heat dissipation plane (41). A bottom heat dissipation water trough (45) is provided on the lower surface of the bottom heat dissipation device (4), and the bottom heat dissipation water trough (45) is connected to the water dividing bosses (43) and the water collecting bosses (44) respectively. The voltage compensation module (42) is connected to the inverter power board (3).

3. A high-performance inverter assembly structure for electric vehicles according to claim 2, characterized in that: Thermally conductive silicone grease is provided between the bottom heat dissipation plane (41) and the second thermally conductive insulating sheet (32).

4. A high-performance inverter assembly structure for electric vehicles according to claim 2, characterized in that: The bottom heat dissipation water tank (45) is provided with a rib plate (451) for dividing the inner cavity of the bottom heat dissipation water tank (45) into a plurality of parallel flow channels, and each flow channel is provided with a plurality of S-shaped heat dissipation ribs (452).

5. A high-performance inverter assembly structure for electric vehicles according to claim 4, characterized in that: The inner cavity of the bottom heat dissipation water tank (45) is divided into two flow channels.

6. A high-performance inverter assembly structure for electric vehicles according to claim 2, characterized in that: All voltage compensation modules (42) are arranged to form a compensation module array, a DC power terminal (46) is provided at the edge of the compensation module array, and safety capacitors (47) are provided on both sides of the DC power terminal (46).

7. A high-performance inverter assembly structure for electric vehicles according to claim 1, characterized in that: The lower surface of the top heat dissipation device (2) is provided with a top heat dissipation plane (21), the top heat dissipation plane (21) is thermally connected to the first heat-conducting insulating sheet (31), and two ends are respectively provided with a water dividing groove (22) and a water collecting groove (23), and the upper surface of the top heat dissipation device (2) is provided with a top heat dissipation water groove (24), and the top heat dissipation water groove (24) is respectively connected to the water dividing groove (22) and the water collecting groove (23).

8. A high-performance inverter assembly structure for electric vehicles according to claim 2, characterized in that: The lower surface of the top heat sink (2) is provided with a top heat sink plane (21), the top heat sink plane (21) is thermally connected to the first heat-conducting insulating sheet (31), and two ends thereof are respectively provided with a water dividing groove (22) and a water collecting groove (23); the upper surface of the top heat sink (2) is provided with a top heat sink (24), and the top heat sink (24) is respectively connected to the water dividing groove (22) and the water collecting groove (23); The water-dividing groove (22) is in communication with the water-dividing boss (43), and the water-collecting groove (23) is in communication with the water-collecting boss (44).

9. A high-performance inverter assembly structure for electric vehicles according to claim 7 or 8, characterized in that: The top heat dissipation water tank (24) is provided with isolation ribs (241) for dividing the inner cavity of the top heat dissipation water tank (24) into a plurality of flow channels, and each flow channel is provided with a plurality of wavy heat dissipation ribs (242).

10. A high-performance inverter assembly structure for electric vehicles according to claim 9, characterized in that: The inner cavity of the top heat dissipation water tank (24) is divided into three flow channels.

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