Electronic equipment, heat dissipation device, heat dissipation framework and design method of heat dissipation framework

Abstract

The invention provides electronic equipment, a heat dissipation device, a heat dissipation framework and a design method of the heat dissipation framework. One side of the heat dissipation framework is used for exchanging heat with a heat source, the heat dissipation framework comprises a plurality of elements arranged in an array mode, the elements are provided with holes, and the holes of any two adjacent elements are communicated with each other. In the whole heat dissipation framework, the solid volume fractions of the multiple elements are gradually decreased in the first direction, the heat conduction resistance of the side, close to a heat source, of the heat dissipation framework is reduced, and therefore heat is rapidly absorbed and transferred, and the heat can be more rapidly conducted to the part away from the heat source; heat concentrated on one side close to a heat source is reduced, and convection heat exchange performance is improved. And the solid volume fractions of the plurality of elements are gradually increased along the second direction, so that the heat dissipation medium can gradually absorb more heat in the flowing process, the heat is prevented from being excessively concentrated in a certain area, and the temperature uniformity is improved. Therefore, the overall heat dissipation effect is improved; and the electronic equipment can be cooled in time.

Description

Technical Field

[0001] The present application relates to the field of heat dissipation technology, and in particular to an electronic device, a heat dissipation device, a heat dissipation frame and a design method thereof. Background Art

[0002] Electronic equipment refers to equipment that is composed of electronic components such as integrated circuits, transistors and electron tubes, and uses electronic technology software to function. Electronic equipment emits a lot of heat during operation. At present, the heat dissipation solution is not effective, which can easily cause electronic equipment to operate in a high-temperature environment, thus causing safety accidents. Summary of the invention

[0003] The present application provides an electronic device, a heat dissipation device, a heat dissipation frame and a design method thereof that are beneficial to improving the heat dissipation effect.

[0004] In a first aspect, an embodiment of the present application provides a heat dissipation skeleton, one side of which is used for exchanging heat with a heat source, the heat dissipation skeleton comprising a plurality of elements arranged in an array, the elements having pores, the pores of any two adjacent elements being interconnected; the solid volume fractions of the plurality of elements are arranged in a decreasing manner along a first direction, and the solid volume fractions of the plurality of elements are arranged in an increasing manner along a second direction, the first direction is a direction away from the heat source, the second direction is a flow direction of the heat dissipation medium, and the second direction is inconsistent with the first direction.

[0005] According to the first aspect, in a possible implementation manner, along the second direction, the average solid volume fraction of the unit cell gradually changes from 20% to 60%.

[0006] According to the first aspect, in a possible implementation manner, the surface of the primitive includes a curved surface with an average curvature of zero.

[0007] According to the first aspect, in a possible implementation manner, the implicit function expression of the heat dissipation skeleton is:

[0008]

[0009] Among them, lx, ly and lz are the sizes of the primitive in the X, Y and Z directions respectively, and a, b, c, d, Cy, Cz and C0 are variables.

[0010] According to the first aspect, in a possible implementation manner, the primitive is one of a Diamond primitive, a Gyroid primitive, a Primitive primitive, and an I-WP primitive.

[0011] In a second aspect, an embodiment of the present application further provides a heat dissipation device, which includes the heat dissipation skeleton according to the first aspect.

[0012] According to the second aspect, in a possible implementation, the heat dissipation device also includes a shell and a heat conducting plate, the shell forms a cavity with an opening on one side, the heat conducting plate cover is arranged on the opening, the heat dissipation frame is arranged in the cavity and connected to one side of the heat conducting plate, and the other side of the heat conducting plate is used to connect to a heat source; the shell is provided with connection ports connected to the cavity at both ends along the second direction to transport the heat dissipation medium into the cavity along the second direction.

[0013] According to the second aspect, in a possible implementation manner, a flow guiding protrusion that rises toward the heat conducting plate is provided on the housing, and the flow guiding protrusion is projected along the second direction to cover at least a portion of the connecting port.

[0014] According to the second aspect, in a possible implementation manner, the heat dissipation medium includes at least one of water and ethylene glycol.

[0015] According to the second aspect, in a possible implementation manner, the heat dissipation device further includes a sealing ring, which is clamped between the heat conducting plate and the housing, and the sealing ring is located at the periphery of the opening.

[0016] According to the second aspect, in a possible implementation manner, thermal conductive silicone grease is provided between the heat source and the heat conducting plate.

[0017] In a third aspect, an embodiment of the present application further provides an electronic device, wherein the electronic device comprises the heat dissipation device described in the second aspect.

[0018] In a fourth aspect, the embodiment of the present application further provides a heat dissipation skeleton design method for designing the heat dissipation skeleton as described in the first aspect, and the heat dissipation skeleton design method includes:

[0019] Based on the multi-scale homogenization theory and volume average theory, a macro-micro dual-scale calculation model of the overall heat dissipation skeleton is established according to the key evaluation indicators of different primitive heat transfer performances, and the mapping relationship between the macro equivalent coefficient and the primitive microstructure in the dual-scale model is constructed;

[0020] Based on the dual-scale calculation model, the three-dimensional size of the primitive and the gradual gradients in the first direction and the second direction are adjusted to carry out parameter iterative design of the heat dissipation skeleton.

[0021] The electronic device, heat dissipation device, heat dissipation skeleton and design method provided by the present application are formed by a plurality of primitive arrays, and in the whole heat dissipation skeleton, the solid volume fractions of the plurality of primitives are arranged in a decreasing manner along the first direction, so as to reduce the thermal resistance of the heat dissipation skeleton close to the heat source side so as to quickly absorb and transfer heat, so that the heat can be conducted to the part far away from the heat source more quickly; reduce the heat concentrated on the side close to the heat source, and improve the convective heat transfer performance. The solid volume fractions of the plurality of primitives are arranged in an increasing manner along the second direction, so that the heat dissipation medium can gradually absorb more heat during the flow process, avoid excessive concentration of heat in a certain area, and improve temperature uniformity. Thereby improving the overall heat dissipation effect; timely dissipating the heat of the electronic equipment, making the electronic equipment run at a suitable temperature, improving the stability of the operation of the electronic equipment, and reducing safety hazards. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the implementation methods of the present application or the technical solutions in the prior art, the drawings required for use in the implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some implementation methods of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0023] Figure 1 is a schematic structural diagram of a heat dissipation device in one embodiment of the present application;

[0024] Figure 2 is a schematic cross-sectional structural diagram of a heat dissipation device in one embodiment of the present application;

[0025] Figure 3 This is a schematic diagram of the structure of a heat dissipation frame in one embodiment of the present application;

[0026] Figure 4 This is the heat dissipation performance diagram of the Diamond minimal surface primitive heat dissipation skeleton;

[0027] Figure 5 This is the heat dissipation performance diagram of the pin radiator;

[0028] Figure 6 It is the heat dissipation performance diagram of the periodic heat dissipation skeleton;

[0029] Figure 7 This is the heat dissipation performance diagram of the gradient heat dissipation skeleton;

[0030] Figure 8 It is the relationship between the size and specific surface area of ​​Diamond minimal surface primitives;

[0031] Fig. 9 This is the relationship between the size of Diamond minimal surface primitive and the convective heat transfer coefficient;

[0032] Fig.10 It is a flow chart of the design method of the heat dissipation skeleton in the first embodiment of the present application.

[0033] Reference numerals:

[0034] 100-heat dissipation device; 10-housing; 11-cavity; 12-connection port; 13-flow guide protrusion; 20-heat conduction plate; 30-heat dissipation skeleton; 31-element; 40-sealing ring; 50-connector; 200-heat source; 300-needle radiator. DETAILED DESCRIPTION

[0035] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0036] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there can be a central component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there can be a central component at the same time.

[0037] Unless otherwise defined, all technical and scientific terms used in this application have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used in this application and in the specification are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used in this application includes any and all combinations of one or more of the related listed items.

[0038] In conjunction with the accompanying drawings, some embodiments of the present application are described in detail below. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0039] The present application provides an electronic device, which includes a heat dissipation device. When the electronic device is running, some components of the electronic device will generate a lot of heat when working, which can be dissipated outwards through the heat dissipation device, so that the electronic device can maintain a suitable temperature and run stably, thereby ensuring the service life.

[0040] Electronic devices include but are not limited to lithium-ion batteries, chips / semiconductors, MEMS / NEMS (micro / nano-electromechanical systems), advanced energy systems, and servers.

[0041] See also Figures 1 to 3The heat dissipation device 100 includes a housing 10, a heat conducting plate 20 and a heat dissipation frame 30. The housing 10 forms a cavity 11 with an opening on one side, the heat conducting plate 20 covers the opening, and the heat dissipation frame 30 is arranged in the cavity 11 and connected to one side of the heat conducting plate 20. The other side of the heat conducting plate 20 is in direct contact with the heat source 200 to achieve rapid heat conduction. Connecting ports 12 are provided at both ends of the housing 10, and these connecting ports 12 can be connected to other external devices to form a loop system together. In the loop system, the heat dissipation medium is circulated into the cavity 11, heat exchanges with the heat dissipation frame 30, takes away the heat and dissipates it to the external environment. Compared with the direct radiation heat dissipation from the heat dissipation frame 30, the present application realizes efficient heat transfer and dissipation through the coordinated use of the heat conducting plate 20 and the heat dissipation frame 30, and the contact heat exchange between the circulating heat dissipation medium and the heat dissipation frame 30, ensuring that the electronic equipment operates at a stable operating temperature.

[0042] It can be understood that the external device at least includes a power device (such as a water pump) and a cooling device (such as a radiator). The heat dissipation medium in the loop system enters the cavity 11 through the connection port 12 under the drive of the pump or other power device, and exchanges heat with the heat dissipation frame 30. After the heat dissipation medium absorbs the heat from the heat dissipation frame 30, the temperature rises, and then flows out of the cavity 11 through another connection port 12, enters the radiator or other cooling device, and dissipates the heat to the external environment. The cooled heat dissipation medium is pumped back to the cavity 11 again, and the cycle repeats to achieve continuous transfer and dissipation of heat.

[0043] The heat conducting plate 20 and the heat dissipation frame 30 should be made of materials with high thermal conductivity to ensure that heat can be transferred quickly. Materials with high thermal conductivity can more effectively transfer heat from the heat source 200 to the heat dissipation surface, thereby improving the efficiency of the entire heat dissipation system. For example, copper, silver, aluminum, graphite composite materials and certain polymer materials can be used, and this application does not limit this.

[0044] The heat conducting plate 20 can be connected to the housing 10 by bolts, ensuring close contact between the heat conducting plate 20 and the housing 10, and allowing disassembly and maintenance when necessary. The heat dissipation frame 30 is welded to the heat conducting plate 20, ensuring a firm and stable connection between the heat dissipation frame 30 and the heat conducting plate 20, while ensuring that heat can be efficiently transferred between the two.

[0045] See also Figure 3 The heat dissipation skeleton 30 includes a plurality of primitives 31 arranged in an array. The primitives 31 have pores. The pores of any two adjacent primitives 31 are interconnected to form a channel for the heat dissipation medium to flow.

[0046] In the heat dissipation skeleton 30, the solid volume fractions of the plurality of primitives 31 can be arranged in a decreasing manner along the first direction (hereinafter referred to as the vertical gradient structure). The first direction is the direction away from the heat source 200, that is, the direction perpendicular to the heat conducting plate 20. The side of the heat dissipation skeleton 30 with a relatively large solid volume fraction is connected to the heat conducting plate 20, which increases the contact area between the skeleton and the heat conducting plate 20 and reduces the contact area between the heat conducting plate 20 and the heat dissipation medium. On the one hand, this vertical gradient structure design enables heat to be conducted more quickly to the part away from the heat source 200 to exchange heat with the heat dissipation medium. Specifically, since the heat dissipation skeleton 30 is a material with high thermal conductivity, it has a large solid volume fraction near the heat source 200, so that it can quickly absorb and conduct heat; and at a distance from the heat source 200, due to the reduction in the solid volume fraction of the heat dissipation skeleton 30, it is beneficial for the heat to be quickly taken away by the heat dissipation medium. On the other hand, the vertical gradient structure reduces the contact area between the top heat dissipation medium and the heat conducting plate 20. Since the thermal conductivity of the heat dissipation medium is much lower than the thermal conductivity of the heat dissipation skeleton 30, reducing the direct contact area between the heat dissipation medium and the heat conducting plate 20 helps to reduce the heat of the heat dissipation medium concentrated near the heat conducting plate 20 and the heat source 200. It is convenient for heat to be more evenly distributed to areas with high speed and thin velocity boundary layer, thereby improving the convective heat transfer performance. In addition, the vertical gradient structure increases the contact area between the heat dissipation skeleton 30 and the heat conducting plate 20. It can not only reduce local stress concentration and improve the overall stability of the structure, but also enhance the connection strength between the heat dissipation skeleton 30 and the heat conducting plate 20. The large contact area also reduces the difficulty of installing the heat dissipation skeleton 30 and improves the connection stability between the heat dissipation skeleton 30 and the heat conducting plate 20.

[0047] The solid volume fraction of the part of the unit cell 31 in contact with the heat conducting plate 20 is V0, and the solid volume fraction of the unit cell 31 farthest from the heat conducting plate is V1. When V1 / V0 changes from 1 / 5 to 5 / 1, the maximum temperature of the heat source 200 will decrease by about 10.5°C, and the heat exchange performance will be significantly enhanced.

[0048] In the heat dissipation skeleton 30, the solid volume fraction of the plurality of primitives 31 can be set in an increasing manner along the second direction. The second direction is the flow direction of the heat dissipation medium. By designing a gradual structure along the flow direction, when the heat dissipation medium flows through the heat dissipation skeleton 30, the heat dissipation medium will encounter gradually increasing thermal resistance during the flow process. This design enables the heat dissipation medium to gradually absorb more heat during the flow process, thereby avoiding excessive concentration of heat in a certain area, and can significantly improve the temperature uniformity of the heat source 200 and the heat conducting plate 20.

[0049] In the heat dissipation skeleton 30, the solid volume fraction of the plurality of primitives 31 can be set to decrease along the first direction (hereinafter referred to as the vertical gradient structure), and at the same time, the solid volume fraction of the plurality of primitives 31 can also be set to increase along the second direction. The first direction is the direction away from the heat source 200, that is, the direction perpendicular to the heat conducting plate 20, and the second direction is the flow direction of the heat dissipation medium. Thus, the above-mentioned properties are simultaneously possessed, and the temperature uniformity of the heat source 200 and the heat conducting plate 20 is further improved.

[0050] The surface of the primitive 31 includes a curved surface with an average curvature of zero, that is, the primitive 31 can be a minimal curved surface primitive. Minimal curved surface primitives can effectively utilize space. Compared with traditional needle-shaped or fin-shaped heat dissipation structures, the heat dissipation skeleton 30 in the present application can provide a larger specific surface area, thereby increasing the heat exchange area between the heat dissipation skeleton 30 and the heat dissipation medium; and the heat dissipation medium can form a turbulent flow when flowing through the channel in the heat dissipation skeleton 30. The turbulent flow can destroy the laminar flow state of the heat dissipation medium, so that the heat dissipation medium forms more eddies and turbulence on the surface of the heat dissipation skeleton 30. Therefore, the heat dissipation skeleton 30 can thin the velocity and temperature boundary layers, so that the heat exchange between the heat dissipation medium and the heat dissipation skeleton 30 is more sufficient, thereby improving the intensity and efficiency of the heat exchange.

[0051] Figure 6 It is the heat dissipation performance diagram of the periodic heat dissipation skeleton. Figure 7 This is the heat dissipation performance diagram of the gradient heat dissipation skeleton. Figure 6 and Figure 7 In the figure, the colors on the heat conducting plate 20, the heat dissipation frame 30 and the heat source 200 determine the temperature distribution of the heat conducting plate 20, the heat dissipation frame 30 and the heat source 200 through the color temperature comparison relationship on the right. In the color temperature comparison relationship, the color changes from blue to red from low to high temperature.

[0052] Figure 6 The temperature field distribution of the heat conducting plate 20 , the heat dissipation skeleton 30 and the heat source 200 is shown. Figure 6 The heat dissipation skeleton 30 adopts a periodic minimal surface primitive, and the solid volume fraction of the heat dissipation skeleton 30 is 30%. Figure 6 As shown, the color of one heat source 200 is yellow-orange, and the color of the other heat source 200 is red, which can reflect the large temperature difference between the two heat sources 200. In addition, the color of the heat conducting plate 20 gradually changes from light blue to yellow, which can reflect that the temperature distribution along the second direction on the heat conducting plate 20 is also extremely uneven.

[0053] Figure 7 The temperature field distribution of the heat conducting plate 20 , the heat dissipation skeleton 30 and the heat source 200 is shown. Figure 7The heat dissipation skeleton 30 adopts a gradient minimal surface primitive. In the heat dissipation skeleton, the average solid volume fraction of the minimal surface primitive gradually changes from 20% at the inlet to 60% at the outlet. The colors of the two heat sources 200 are both orange-red, which can reflect that the temperatures of the two heat sources 200 tend to be consistent and evenly distributed; and the color of the heat conducting plate 20 is yellow as a whole, which can reflect that the temperature distribution of the heat conducting plate 20 is even. And compared with Figure 6 , the maximum temperature of the overall structure is also reduced accordingly, which has an obvious effect on improving local hot spot heating and local thermal stress concentration. Therefore, designing the periodic minimal surface as a gradient minimal surface can improve temperature uniformity and reduce the local temperature gradient of each component.

[0054] In other embodiments, the solid volume fraction at the inlet and the solid volume fraction at the outlet may be adjusted according to the number of heat sources 200 and the temperature difference between the heat sources 200, which is not limited in the present application.

[0055] Primitive 31 may be one of Diamond minimal surface primitive, Gyroid minimal surface primitive, Primitive minimal surface primitive, and I-WP minimal surface primitive. The implicit function expression of Diamond minimal surface primitive is:

[0056] sin(2πx / l x )sin(2πy / l y )sin(2πz / l z )+sin(2πx / l x )cos(2πy / l y )cos(2πz / l z )+cos(2πx / l x )sin(2πy / l y )cos(2πz / l z )+cos(2πx / l x )cos(2πy / l y )sin(2πz / l z )=C

[0057] The implicit function expression of the Gyroid minimal surface primitive is:

[0058] cos(2πx / l x )sin(2πy / l y )+cos(2πy / l y )sin(2πz / l z )+cos(2πz / l z )sin(2πx / l x )=C

[0059] The implicit function expression of the primitive minimal surface primitive is:

[0060] cos(2πx / l x )+cos(2πy / l y )+cos(2πz / l z )=C

[0061] The implicit function expression of the I-WP minimal surface primitive is:

[0062] 2[cos(2πx / l x )cos(2πy / l y )+cos(2πy / l y )cos(2πz / l z )+cos(2πz / l z )cos(2πx / l x )]-[cos(4πx / l x )+cos(4πy / l y )+cos(4πz / l z )]=C

[0063] Among them, l x , l y and l z They are the sizes of the unit 31 in the three directions of X, Y, and Z, and are also the periods of the periodic minimal surface microchannel structure in three directions. The variable parameter C can control the solid volume fraction. The larger C is, the larger the solid volume fraction of the unit 31 is and the smaller the porosity is.

[0064] The heat dissipation skeleton 30 structure in the present application is realized by controlling the spatial variation of C. In the present application, the flow direction along the heat dissipation medium is the z direction, the direction perpendicular to the flow direction is the y direction, and the remaining x direction is the periodic direction. Then the implicit function expression of the heat dissipation skeleton 30 structure based on the Diamond primitive 31 is:

[0065]

[0066] Among them, l x , l y and l z are the sizes of the primitive 31 in the X, Y, and Z directions, a, b, c, d, and C respectively. y , C z , C0 is a variable. The first term on the right side is (a+bz) / C z* (c+dy) / C y Control the structure of the heat dissipation skeleton 30, specifically, (a+bz) / C zControl the gradient along the flow direction, (c+dy) / C y Controls the gradient of the vertical flow direction, while the structure in the x direction does not change gradually, so the right-hand side term is not related to the x coordinate. C0≥0 controls the minimum volume fraction of the overall structure, ensuring that the STL face of the primitive can be generated smoothly without broken faces under a certain mesh density. Parameter a / C z and c / C y Control the minimum volume fraction in the z and y directions respectively, while b / C z and d / C y Control the gradient size. The larger the value, the larger the gradient. y , C z , C0, these seven parameters can achieve different gradient effects and anisotropic characteristics in two directions; changing l x , l y and l z , you can adjust the size of primitive 31 in three directions, l x , l y and l z The larger it is, the larger the size of the primitive 31 is.

[0067] In other implementations, the gradient structures of different minimal surfaces can be obtained by changing the expression on the left side of the above expression.

[0068] Taking the heat dissipation skeleton 30 composed of Diamond minimal surface primitives as an example, compared with the conventional IGBT pin-column heat dissipation structure, the heat dissipation skeleton 30 in the present application has great advantages in terms of convection heat transfer coefficient and specific surface area. Figure 4 This is the heat dissipation performance diagram of the Diamond minimal surface primitive heat dissipation skeleton. Figure 4 (a) in the figure is the Diamond minimal surface primitive structure diagram. Figure 4 (b) shows the temperature field distribution of the heat source 200 and the element 31; Figure 5 (a) is a structural diagram of the pin-shaped heat sink 300. Figure 5 (b) in FIG. 1 shows the temperature field distribution of the heat source 200 and the pin-shaped heat sink 300. Figure 4 and Figure 5 As shown. Under the same heat source power of 200, boundary conditions and working conditions, Figure 4 The maximum temperature of the medium heat source 200 is close to 322K. Figure 5The maximum temperature of the medium heat source 200 is close to 339K, that is, the maximum temperature of the heat source 200 on the Diamond minimal surface primitive heat sink skeleton is about 17°C lower than the maximum temperature of the heat source 200 on the needle-shaped heat sink. When the inlet velocity is 0.01m / s (laminar flow), the convection heat transfer coefficient of the Diamond minimal surface primitive is 34.5% higher than that of the needle-shaped channel, and the specific surface area is 351% higher. The overall heat transfer performance of the Diamond minimal surface primitive is 472.1% higher than that of the needle-shaped channel, and the pressure drop increases by 292%. With the increase of the inlet velocity and Reynolds number, the heat transfer performance of the Diamond minimal surface primitive will be further enhanced.

[0069] Figure 8 The horizontal axis is the unit size, and the vertical axis is the specific surface area. Figure 8 As shown in Figure 2, as the size of the Diamond minimal surface primitive is reduced, the specific surface area increases significantly. Fig. 9 The horizontal axis is the element size, and the vertical axis is the convective heat transfer coefficient. Fig. 9 As shown, as the size of the unit cell 31 decreases, the convective heat transfer performance is significantly improved. Therefore, by adjusting the size of the unit cell 31, the convective heat transfer performance can be improved by several orders of magnitude, and efficient and rapid heat dissipation of different high power density devices can be achieved.

[0070] The housing 10 is provided with a flow-guiding protrusion that is raised toward the heat-conducting plate 20, and the flow-guiding protrusion 13 is projected along the second direction to at least partially cover the connecting port 12. The flow-guiding protrusion 13 plays a role in guiding the heat-dissipating medium flowing horizontally at the inlet into the heat-dissipating skeleton 30 structure closer to the heat-conducting plate 20, which helps to reduce the heat conduction resistance and the convection resistance, and realizes enhanced heat transfer.

[0071] In other embodiments, a buffer cavity may be provided in the housing 10, and the buffer cavity and the cavity 11 where the heat dissipation hardware is located may be separated by a partition, and a flow channel may be opened on the partition for conveying the heat dissipation medium to a designated position.

[0072] The heat dissipation medium can be water. Water has a high specific heat capacity and can absorb a large amount of heat under a small temperature change, which helps to maintain a stable cooling effect during the heat dissipation process. The heat dissipation medium can also be ethylene glycol. Ethylene glycol has good corrosion resistance to metals and many other materials, and can extend the service life of the heat dissipation system. In addition, ethylene glycol can still maintain stable performance at higher temperatures and is not easy to decompose or produce harmful substances. Of course, the heat dissipation medium can also be a heat dissipation medium commonly used in the art, or a mixture of multiple heat dissipation media.

[0073] The heat sink 100 further includes a sealing ring 40, which is clamped between the heat conducting plate 20 and the housing 10, and is located at the periphery of the opening. The sealing ring 40 can effectively prevent the coolant from leaking from the gap between the heat conducting plate 20 and the housing 10, thereby ensuring the normal operation of the heat sink 100 and preventing damage to the heat sink 100 or safety hazards caused by leakage.

[0074] Thermal grease is provided between the heat source 200 and the heat conducting plate 20 , and the thermal grease can remove air in the gap between the heat source 200 and the heat conducting plate 20 , thereby improving heat dissipation efficiency.

[0075] The two connection ports 12 at both ends of the housing 10 can be connected to two adapters 50 through internal threads, and the adapter 50 can be connected to a hose or a steel pipe to connect to an external device. The design of the internal thread ensures a tight fit with the external thread of the adapter 50 to prevent leakage or loosening during the connection process. The adapter 50 serves as a bridge connecting the housing 10 with external equipment and can adapt to different pipe sizes and types. For hose connection, a clamp connection, a ferrule connection, a quick connector connection or an insertion connection can be used; for steel pipe connection, common connection methods include welding, screwing and nut tightening.

[0076] Please refer to Fig.10 . Fig.10 This is a flow chart of the design method of the heat dissipation skeleton in the first embodiment of the present application.

[0077] The design methods of heat dissipation skeleton include:

[0078] S10. Based on the multi-scale homogenization theory and volume average theory, a macro-micro dual-scale calculation model of the overall heat dissipation skeleton is established according to the key evaluation indicators of different primitive heat transfer performances, and a mapping relationship between the macro equivalent coefficient and the primitive microstructure in the dual-scale model is constructed;

[0079] The CFD software Comsol is used to carry out the flow heat transfer simulation and heat transfer performance analysis in different primitives, calculate the temperature field, pressure field and velocity field in the primitive, and reveal the primitive heat dissipation performance and flow resistance evolution characteristics under different Reynolds numbers. The primitive can be a minimal surface primitive. By studying the influence of minimal surface type (such as Primitive, Gyroid, Diamond, I-WP, etc.), primitive size, inlet velocity, solid volume fraction / porosity, anisotropy and other factors on key evaluation indicators such as minimal surface pressure drop / friction factor, convective heat transfer coefficient, and maximum temperature of heat source, a database of heat and mass transport of different types of three-period minimal surfaces under complex flow conditions is established. The establishment of this database provides a large amount of data resources for reference for the subsequent simulation and iterative optimization design of double-gradient anisotropic microchannel radiators.

[0080] The minimal surface geometry and patch meshes are extremely complex. The memory and computing resources required to calculate the entire heat and mass transport process in the minimal surface microchannel heat sink based on the pore-scale CFD simulation in step S10 are very large. In addition, the geometry repair / mesh optimization in the pre-processing process and the adjustment of model convergence in the solution process also consume a lot of human resources and time costs. The number of grids corresponding to the minimal surface microchannel structure of 100 periodic arrays is on the order of 100 million. It is necessary to use supercomputers to carry out the heat flow simulation analysis in the structure. It is very difficult to iteratively optimize and design a better heat dissipation skeleton in a short time. This scheme combines the multi-scale homogenization method and the volume average theory, giving full play to the respective advantages of the two theories, and establishing a dual-scale calculation model for heat and mass transport in minimal surface porous microstructures, such as Figure 3 The volume average theory has a clear physical background and a clear modeling idea, which can accurately establish the macroscopic equivalent equation of the heat and mass transport process in the minimal surface microchannel radiator; the multi-scale homogenization method has a very rigorous mathematical theoretical basis, which can establish the mapping relationship between each equivalent coefficient (fluid / solid equivalent thermal conductivity, convection heat transfer coefficient, permeability, inertial resistance coefficient, etc.) in the macroscopic control equation and the microstructure.

[0081] S20. Based on the dual-scale calculation model, adjust the three-dimensional size of the primitive and the gradual gradients in the first direction and the second direction to carry out parameter iterative design of the heat dissipation skeleton.

[0082] Assuming that different regions in the overall structure of the minimal surface microchannel heat sink are filled with different primitives, the equivalent transfer coefficients of the primitives in the corresponding regions are substituted into the dual-scale calculation model in combination with the primitive heat and mass transport database established in step S10 and the heat and mass transport dual-scale calculation model established in step 20, and the temperature evolution law of the overall structure including various structures such as heat source, thermal grease material, base plate, microchannel structure, etc. is quickly evaluated, and the key parameters such as temperature uniformity, maximum temperature, thermal stress, etc. of the heat source and auxiliary structures are calculated. If the various key performance parameters of the initial design structure of the heat sink meet the design requirements, then the iterative optimization design ends. If the relevant performance indicators do not meet the requirements, then it is necessary to adjust the primitive structure of the corresponding region in combination with the established heat and mass transport database, and carry out the next iterative optimization until each performance indicator meets the design requirements. The advantage of this optimization design method is that designers can carry out a large number of iterative optimization designs and parameter optimizations in a short period of time, and even provide the optimal structural design solution for a given problem.

[0083] This application conducts flow heat transfer simulation and heat transfer performance analysis in different primitives, calculates the temperature field, pressure field and velocity field in the primitive, and reveals the evolution characteristics of the primitive heat dissipation performance and flow resistance under different Reynolds numbers. Combining the multi-scale homogenization method and volume average theory, a dual-scale calculation model of heat and mass transport in minimal surface porous microstructures is established, and an efficient iterative optimization design method for microchannel heat dissipation skeletons is developed. This efficient iterative design method is combined with the minimal surface structure to optimize the structure of the heat dissipation skeleton according to different heat source distributions and the temperature difference between the heat sources, ensuring that the heat dissipation device has superiority in heat dissipation performance, temperature uniformity, and design freedom.

[0084] In the description of the embodiments of the present application, it should be noted that the orientation or positional relationship of terms such as "center", "up", "down", "left", "right", "vertical", "horizontal", "inside" and "outside" are based on the orientation or positional relationship described in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0085] What is disclosed above is only a preferred embodiment of the present application, and it certainly cannot be used to limit the scope of rights of the present application. Ordinary technicians in this field can understand that all or part of the processes of implementing the above embodiment and equivalent changes made according to the claims of the present application are still within the scope covered by the present application.

Claims

1. A heat dissipation frame, characterized in that: One side of the heat dissipation skeleton is used for exchanging heat with a heat source. The heat dissipation skeleton includes a plurality of elements arranged in an array, the elements having pores, and the pores of any two adjacent elements are interconnected; the solid volume fractions of the plurality of elements are arranged in a decreasing manner along a first direction, and the solid volume fractions of the plurality of elements are arranged in an increasing manner along a second direction, the first direction is a direction away from the heat source, the second direction is a flow direction of the heat dissipation medium, and the second direction is inconsistent with the first direction.

2. The heat dissipation frame according to claim 1, characterized in that: Along the second direction, the average solid volume fraction of the unit cell changes gradually from 20% to 60%.

3. The heat dissipation frame according to claim 1 or 2, characterized in that: The surface of the primitive comprises a curved surface with a mean curvature of zero.

4. The heat dissipation frame according to claim 3, characterized in that: The implicit function expression of the heat dissipation skeleton is: Among them, lx, ly and lz are the sizes of the primitive in the X, Y and Z directions respectively, and a, b, c, d, Cy, Cz and C0 are variables.

5. The heat dissipation frame according to claim 3, characterized in that: The primitive is one of the Diamond minimal surface primitive, the Gyroid minimal surface primitive, the Primitive minimal surface primitive, and the I-WP minimal surface primitive.

6. A heat dissipation device, characterized in that: The heat dissipation device comprises a heat dissipation frame as claimed in any one of claims 1 to 5.

7. The heat dissipation device according to claim 6, characterized in that: The heat dissipation device also includes a shell and a heat conducting plate, the shell forms a cavity with an opening on one side, the heat conducting plate cover is arranged on the opening, the heat dissipation frame is arranged in the cavity and connected to one side of the heat conducting plate, and the other side of the heat conducting plate is used to connect to a heat source; the shell is provided with connection ports connected to the cavity at both ends along the second direction so as to transport the heat dissipation medium into the cavity along the second direction.

8. The heat dissipation device according to claim 7, characterized in that: The outer shell is provided with a flow-guiding protrusion which is raised toward the heat-conducting plate, and the flow-guiding protrusion is projected along the second direction to at least cover a portion of the connecting port.

9. The heat dissipation device according to claim 7, characterized in that: The heat dissipation medium includes at least one of water and ethylene glycol.

10. The heat dissipation device according to claim 7, characterized in that: The heat dissipation device further comprises a sealing ring, which is clamped between the heat conducting plate and the housing and is located at the periphery of the opening.

11. The heat dissipation device according to claim 7, characterized in that: Thermally conductive silicone grease is provided between the heat source and the heat conducting plate.

12. An electronic device, characterized in that: The electronic device comprises the heat dissipation device according to any one of claims 6 to 11.

13. A heat dissipation framework design method, characterized in that: Used to design a heat dissipation skeleton as claimed in any one of claims 1 to 5, the heat dissipation skeleton design method comprising: Based on the multi-scale homogenization theory and volume average theory, a macro-micro dual-scale calculation model of the overall heat dissipation skeleton is established according to the key evaluation indicators of different primitive heat transfer performances, and the mapping relationship between the macro equivalent coefficient and the primitive microstructure in the dual-scale model is constructed; Based on the dual-scale calculation model, the three-dimensional size of the primitive and the gradual gradients in the first direction and the second direction are adjusted to carry out parameter iterative design of the heat dissipation skeleton.

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