Cooling unit, flow control method, and vehicle

Abstract

The present disclosure relates to a cooling unit, a flow control method and a vehicle. The cooling unit comprises a liquid cooling circulation loop composed of a plurality of liquid supply pumps, a heat exchanger, a cooling module and a flow resistance device in series; a processor is communicatively connected with the flow resistance device and is configured to control the flow resistance device according to the flow of the liquid in the liquid cooling circulation loop, wherein: the plurality of liquid supply pumps are connected in parallel and are configured to drive the flow of the liquid in the liquid cooling circulation loop; the heat exchanger is configured to exchange heat between the liquid in the liquid cooling circulation loop and a device to be cooled; the cooling module is configured to cool the liquid in the liquid cooling circulation loop; and the flow resistance device is configured to apply resistance to the liquid flowing in the liquid cooling circulation loop according to the control of the processor, so that the flow of the liquid in the liquid cooling circulation loop is within a working range in both a case where all the plurality of liquid supply pumps are working normally and a case where part of the liquid supply pumps are faulty.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the field of refrigeration, and in particular, to a cooling unit, a flow control method and a vehicle. BACKGROUND

[0002] With the rapid development of communication technology, the heat density of various communication equipment is also increasing, and in some situations, the space available for the cooling unit to cool the communication equipment is limited. For example, for vehicle mobile communication equipment, due to the limited space and capacity of the vehicle, the space needs to be provided to the communication equipment to the greatest extent, in which case the space available for the cooling unit is very limited and is easily disturbed by the communication equipment.

[0003] In addition, in order to ensure the long-term reliable operation of the cooling unit, the situation of pump failure in the cooling unit needs to be considered to make alternative solutions.

[0004] One alternative solution in the related art includes using a backup pump, for example, arranging the pumps in the cooling unit as two working pumps and one backup pump or one working pump and one backup pump, and using the backup pump to operate in the case of working pump failure. The above-mentioned backup pump solution may cause the pipe structure to be complex or the pump itself to be large in size, which has the problem of occupying too much space and is not suitable for cooling of vehicle mobile communication equipment.

[0005] Another alternative solution in the related art includes using bypass regulation, while using multiple high-power pumps, an additional bypass branch is included. The bypass branch is configured to split the liquid when multiple pumps are working at the same time, and to disconnect and stop the splitting to ensure that the flow in the cooling unit meets the normal operation requirements when there is pump failure. In the above-mentioned bypass regulation solution, the pump needs to operate at high power all the time, which reduces the service life. SUMMARY

[0006] In the related art, the pump in the cooling unit has the problems of occupying too much space and reducing the service life.

[0007] In view of this, the present disclosure provides a cooling unit which can save installation space while ensuring the reliability of the cooling unit, and can reduce the operating load of the pump in the cooling unit and improve the service life of the pump.

[0008] According to one aspect of some embodiments of this disclosure, a cooling unit is provided, comprising: a liquid-cooled circulation loop consisting of a plurality of liquid supply pumps, a heat exchanger, a cooling module, and a flow resistance device connected in series; a processor, communicatively connected to the flow resistance device, configured to control the flow resistance device according to the flow rate of the liquid in the liquid-cooled circulation loop, wherein: the plurality of liquid supply pumps are connected in parallel and configured to drive the liquid flow in the liquid-cooled circulation loop; the heat exchanger is configured to exchange heat between the liquid in the liquid-cooled circulation loop and the equipment to be cooled, and the inlet of the heat exchanger is in fluid communication with the outlet of the plurality of liquid supply pumps; the cooling module is configured to cool the liquid in the liquid-cooled circulation loop, and the inlet of the cooling module is in fluid communication with the outlet of the heat exchanger, and the outlet of the cooling module is in fluid communication with the inlet of the plurality of liquid supply pumps; the flow resistance device is configured to apply resistance to the liquid flowing in the liquid-cooled circulation loop according to the control of the processor, such that the flow rate of the liquid in the liquid-cooled circulation loop remains within the operating range when all the plurality of liquid supply pumps are operating normally and when some of the liquid supply pumps fail.

[0009] In the technical solutions of the embodiments disclosed herein, space utilization is improved and installation space for the cooling unit is saved by eliminating the use of a backup pump. By using a flow resistance device to apply resistance to the liquid flowing in the liquid-cooled circulation loop of the cooling unit, the output flow rate of the liquid supply pump is reduced, thereby reducing the operating power of multiple liquid supply pumps. This allows multiple liquid supply pumps to operate at a lower load while all are working normally, extending their lifespan. Furthermore, by controlling the flow resistance device, the flow rate of the liquid in the liquid-cooled circulation loop can be maintained within the operating range, ensuring the reliability of the cooling unit.

[0010] In some embodiments, the flow resistance device includes: an adjustable valve configured to apply resistance to the liquid flowing in the liquid cooling circulation loop by adjusting its opening according to the control of the processor; or a pipe segment switching device configured to apply resistance to the liquid flowing in the liquid cooling circulation loop by selectively connecting a portion of the liquid cooling circulation loop to pipe segments with different diameters or different curvatures according to the control of the processor.

[0011] In the technical solutions of the embodiments of this disclosure, the flow resistance device can be implemented in the form of an adjustable regulating valve or a pipe section switching device. Specifically, by adjusting the opening of the regulating valve or adjusting the pipe diameter or curvature, the liquid flow area can be changed or the liquid flow can be blocked, thereby applying resistance to the liquid flowing in the liquid cooling circulation loop. The flow rate of the liquid in the liquid cooling circulation loop can be controlled by the resistance applied by the flow resistance device.

[0012] In some embodiments, the liquid supply pump is a constant frequency pump.

[0013] In the technical solutions of the embodiments of this disclosure, the signal interference caused by variable frequency pumps can be avoided by using a fixed frequency pump. Furthermore, this disclosure achieves flow control of the liquid in the liquid cooling circulation loop through a flow resistance device, eliminating the need for a variable frequency pump. The technical solutions of this disclosure also ensure the reliability of the cooling unit.

[0014] In some embodiments, controlling the flow resistance device according to the flow rate of the liquid in the liquid cooling circulation loop includes: increasing the flow resistance of the liquid in the liquid cooling circulation loop when the flow rate of the liquid in the liquid cooling circulation loop is greater than the operating range; and reducing the flow resistance of the liquid in the liquid cooling circulation loop when the flow rate of the liquid in the liquid cooling circulation loop is less than the operating range.

[0015] In the technical solutions of the embodiments of this disclosure, the processor controls the flow resistance device according to the flow rate of the liquid in the liquid cooling circulation loop. By adjusting the resistance applied by the flow resistance device as described above, the flow rate of the liquid in the liquid cooling circulation loop can be controlled, keeping the flow rate within the operating range.

[0016] In some embodiments, the operating range includes a flow range from a first flow rate to a second flow rate, where the second flow rate is greater than the first flow rate. The step of controlling the flow resistance device based on the flow rate of the liquid in the liquid-cooled circulation loop further includes: when all the plurality of liquid supply pumps are operating normally and the flow rate of the liquid in the liquid-cooled circulation loop is greater than the second flow rate, controlling the flow resistance device to increase the flow resistance of the liquid in the liquid-cooled circulation loop, so that the flow rate of the liquid in the liquid-cooled circulation loop is less than or equal to the second flow rate; and when some liquid supply pumps fail and the flow rate of the liquid in the liquid-cooled circulation loop is less than the first flow rate, controlling the flow resistance device to reduce the flow resistance of the liquid in the liquid-cooled circulation loop, so that the flow rate of the liquid in the liquid-cooled circulation loop is greater than or equal to the first flow rate.

[0017] In the technical solutions of the embodiments of this disclosure, the above-described control enables the following: when all multiple liquid supply pumps are operating normally and the flow rate they provide is greater than the upper limit of the operating range, i.e., the second flow rate, the flow rate is controlled at or below the second flow rate by controlling the flow resistance device; conversely, when some liquid supply pumps fail and the flow rate provided by the remaining liquid supply pumps is less than the lower limit of the operating range, i.e., the first flow rate, the flow rate is controlled at or above the first flow rate by controlling the flow resistance device. This control ensures the operation of the cooling unit and improves its reliability.

[0018] In some embodiments, the operating range includes a third flow rate, which is greater than the first flow rate and less than the second flow rate. The step of controlling the flow resistance device based on the flow rate of the liquid in the liquid cooling circulation loop further includes: when all the plurality of liquid supply pumps are operating normally, controlling the flow resistance device such that the difference between the flow rate of the liquid in the liquid cooling circulation loop and the third flow rate is less than a threshold.

[0019] In the technical solutions of the embodiments of this disclosure, the third flow rate is, for example, the rated flow rate of the heat exchanger. By further setting the third flow rate and controlling the flow rate in the liquid cooling circulation loop to be near the third flow rate, the heat exchanger can have higher working efficiency, while avoiding the waste of excess flow, thereby improving the working efficiency of the cooling unit under normal working conditions.

[0020] In some embodiments, the liquid cooling circulation loop further includes: a flow sensor, communicatively connected to the processor, configured to sense the flow rate of liquid in the liquid cooling circulation loop; and / or at least one pressure sensor, communicatively connected to the processor, configured to sense the pressure of liquid in the liquid cooling circulation loop.

[0021] In the technical solutions of the embodiments of this disclosure, the flow rate and / or pressure of the liquid in the liquid cooling circulation loop of the cooling unit can be accurately measured through flow sensors and / or pressure sensors, which facilitates control by the processor in the cooling unit.

[0022] In some embodiments, the at least one pressure sensor includes: a first pressure sensor located at the inlet of the heat exchanger; and / or a second pressure sensor located at the outlet of the plurality of liquid supply pumps.

[0023] In the technical solutions of the embodiments of this disclosure, the first pressure sensor enables monitoring of the liquid pressure at the heat exchanger inlet, ensuring that the liquid flowing through the heat exchanger inlet does not exceed the safe pressure at the heat exchanger inlet, effectively protecting the relatively vulnerable interface. The second pressure sensor enables monitoring of the liquid pressure at the outlets of multiple liquid supply pumps, thereby accurately determining the operating status of the multiple liquid supply pumps.

[0024] In some embodiments, the liquid cooling circulation loop further includes a bypass branch connected in parallel with the heat exchanger, configured to divert liquid in the liquid cooling circulation loop when the pressure at the inlet of the heat exchanger is greater than a threshold.

[0025] In the technical solutions of the embodiments of this disclosure, by means of a bypass branch, the liquid in the liquid-cooled circulation loop can be diverted when the pressure of the liquid at the heat exchanger inlet is close to the safe pressure of the heat exchanger inlet, thereby reducing the pressure of the liquid in the loop and protecting the heat exchanger inlet.

[0026] In some embodiments, the bypass branch includes a bypass valve, the processor is communicatively connected to the bypass valve, and controls the bypass valve based on the pressure sensed by the first pressure sensor.

[0027] In the technical solutions of the embodiments of this disclosure, by controlling the bypass valve and the bypass valve by the processor, the bypass branch can be controlled to divert the flow when the pressure sensed by the first pressure sensor is greater than the threshold, thereby achieving accurate control of the bypass branch and protecting the heat exchanger inlet.

[0028] In some embodiments, the processor determines whether there is a malfunction in the plurality of liquid supply pumps based on the pressure sensed by the second pressure sensor.

[0029] In the technical solutions of the embodiments of this disclosure, the processor can make timely and accurate judgments when there is a failure of the liquid supply pump, resulting in insufficient pressure of the liquid at the outlet.

[0030] In some embodiments, the liquid cooling circulation loop further includes: a ball valve, respectively connected to the inlet and outlet of the plurality of liquid supply pumps; and a flexible joint, respectively connected between the plurality of liquid supply pumps and the ball valve.

[0031] In the technical solutions of the embodiments of this disclosure, by installing ball valves and flexible joints at both ends of the liquid supply pump, the connection between the liquid supply pump and other parts of the liquid cooling circulation loop can be effectively cut off when the liquid supply pump fails, thereby enabling maintenance of the liquid supply pump and improving the convenience of the system.

[0032] In some embodiments, the liquid cooling circulation loop further includes a one-way valve configured to allow the liquid in the liquid cooling circulation loop to flow in one direction.

[0033] By installing a check valve at the outlet of the liquid supply pump, it can be ensured that the liquid in the liquid cooling circulation loop flows in one direction, preventing damage caused by liquid backflow into the liquid supply pump due to unexpected circumstances.

[0034] According to one aspect of other embodiments of this disclosure, a flow control method is provided for a cooling unit as described above, comprising: determining the flow rate of a liquid in a liquid-cooled circulation loop; and controlling a flow resistance device to apply resistance to the liquid flowing in the liquid-cooled circulation loop based on the flow rate of the liquid in the liquid-cooled circulation loop, such that the flow rate of the liquid in the liquid-cooled circulation loop is within the operating range when all of the multiple liquid supply pumps are operating normally and when some of the liquid supply pumps fail.

[0035] In the technical solutions of the embodiments of this disclosure, by determining the flow rate of the liquid and then controlling the cooling unit as described above, the flow rate of the liquid in the liquid cooling circulation loop can be maintained within the operating range, ensuring the reliability of the cooling unit. Furthermore, the cooling unit described above does not use a standby pump, improving space utilization and saving installation space. Simultaneously, it allows multiple liquid supply pumps to operate at lower loads even when all pumps are functioning normally, thus extending their lifespan.

[0036] According to one aspect of further embodiments of the present disclosure, a vehicle is provided, including: communication equipment; and a cooling unit as described above, configured to cool the communication equipment.

[0037] In the technical solutions of the embodiments of this disclosure, the cooling unit described above does not use a backup pump, which improves space utilization and saves installation space. Simultaneously, it allows multiple liquid supply pumps to operate at lower loads while all are functioning normally, thus extending their lifespan. Furthermore, by controlling the flow resistance device, the flow rate of the liquid in the liquid cooling circulation loop can be maintained within the operating range, ensuring the reliability of the cooling unit. The cooling unit described above, used for cooling communication equipment in vehicles, can save vehicle energy while ensuring effective cooling of the communication equipment. Attached Figure Description

[0038] The accompanying drawings, which form part of this specification, illustrate embodiments of this disclosure and, together with the specification, serve to explain the principles of this disclosure.

[0039] This disclosure will become clearer with reference to the accompanying drawings and the following detailed description, wherein:

[0040] Figure 1 This is a schematic diagram showing the structure of a cooling unit according to some embodiments of the present disclosure;

[0041] Figure 2 This is a graph illustrating the power-flow rate relationship of a liquid supply pump according to some embodiments of the present disclosure;

[0042] Figure 3 It is a graph showing the characteristic curves of the liquid supply pump and piping in a liquid cooling circulation loop according to some embodiments of the present disclosure;

[0043] Figure 4 This is a schematic diagram illustrating the structure of a cooling unit according to other embodiments of the present disclosure;

[0044] Figure 5 This is a flowchart illustrating a flow control method according to some embodiments of the present disclosure;

[0045] Figure 6This is a block diagram illustrating a computer system for implementing some embodiments of the present disclosure.

[0046] It should be understood that the dimensions of the various parts shown in the accompanying drawings are not drawn to actual scale. Furthermore, the same or similar reference numerals denote the same or similar components. Detailed Implementation

[0047] Various embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings. The descriptions of the embodiments are merely illustrative and are in no way intended to limit the scope of the disclosure or its application or use. The present disclosure may be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are provided so that this disclosure will be thorough and complete, and will fully express the scope of the disclosure to those skilled in the art. It should be noted that, unless otherwise specifically stated, the relative arrangement of components and steps set forth in these embodiments should be interpreted as merely illustrative and not as limiting.

[0048] The terms “first,” “second,” and similar words used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different parts. Words such as “including” mean that the element preceding the word covers the element listed after the word, and do not exclude the possibility of covering other elements as well.

[0049] It should also be understood that any component, data or structure mentioned in the embodiments of this disclosure can generally be understood as one or more unless expressly defined or given to the contrary in the context.

[0050] All terms used in this disclosure (including technical or scientific terms) have the same meaning as understood by one of ordinary skill in the art to which this disclosure pertains, unless otherwise specifically defined. It should also be understood that terms defined in a general dictionary, such as a dictionary, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art, and not as having an idealized or highly formalized meaning, unless expressly defined herein.

[0051] Techniques, methods, and equipment known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and equipment should be considered part of the specification.

[0052] In related technologies, cooling units suffer from problems such as excessively large pump footprint or reduced pump life.

[0053] In view of this, this disclosure proposes a cooling unit that can avoid the above-mentioned problems.

[0054] First, combined Figure 1 Some embodiments of the cooling unit in this disclosure are described. Figure 1This is a schematic diagram illustrating the structure of a cooling unit according to some embodiments of the present disclosure. For example... Figure 1 As shown, the cooling unit 1 includes: a liquid cooling circulation loop 10, which is composed of multiple liquid supply pumps, heat exchangers, cooling modules and flow resistance devices connected in series; and a processor 20, which is communicatively connected to the flow resistance device and configured to control the flow resistance device according to the flow rate of the liquid in the liquid cooling circulation loop.

[0055] The liquid cooling circulation loop 10 includes: multiple liquid supply pumps 11; heat exchanger 12; cooling module 13; and flow resistance device 14.

[0056] Multiple liquid supply pumps 11 are connected in parallel and configured to drive the liquid flow in the liquid cooling circulation loop; in other words, to provide power to the liquid in the liquid cooling circulation loop. The liquid supply pumps 11 can be, for example, centrifugal pumps or other pumps.

[0057] In some embodiments, the liquid supply pump 11 is a fixed-frequency pump. In the above embodiments, by using a fixed-frequency pump, signal interference caused by a variable-frequency pump can be avoided. Furthermore, the flow resistance device in this disclosure allows for control of the liquid flow rate in the liquid-cooled circulation loop, eliminating the need for a variable-frequency pump and ensuring the reliability of the cooling unit.

[0058] The power-flow rate relationship of the liquid supply pump 11 is as follows: Figure 2 As shown. Figure 2 This is a graph illustrating the power-flow rate relationship of a liquid supply pump according to some embodiments of the present disclosure. Figure 2 It can be seen that the power and flow rate of the liquid supply pump 11 are positively correlated; that is, the greater the flow rate through the liquid supply pump 11, the greater the power of the liquid supply pump 11.

[0059] The heat exchanger 12 is configured to exchange heat between the liquid in the liquid cooling loop and the equipment to be cooled, and the inlet of the heat exchanger is in fluid communication with the outlet of multiple liquid supply pumps 11. The heat exchanger 12 can be, for example, a plate heat exchanger, a heat pipe heat exchanger, etc., and can achieve cooling of the equipment to be cooled by the cooling liquid in the liquid cooling loop.

[0060] In some embodiments, the device to be cooled may be a communication device in a vehicle.

[0061] The cooling module 13 is configured to cool the liquid in the liquid cooling circulation loop. The inlet of the cooling module 13 is in fluid communication with the outlet of the heat exchanger 12, and the outlet of the cooling module 13 is in fluid communication with the inlets of multiple liquid supply pumps 11. The cooling module 13 can be a device capable of cooling liquids, such as an electric refrigerator, a chemical refrigerator, or a heat exchanger.

[0062] The flow resistance device 14 is configured to apply resistance to the liquid flowing in the liquid cooling circulation loop under the control of the processor 20, so that the flow rate of the liquid in the liquid cooling circulation loop is within the operating range when all the multiple liquid supply pumps 11 are working normally and when some liquid supply pumps fail.

[0063] In some embodiments, the flow resistance device 14 includes an adjustable regulating valve configured to apply resistance to the liquid flowing in the liquid-cooled circulation loop by adjusting the opening degree according to the control of the processor 20.

[0064] Specifically, when the flow resistance device 14 includes an adjustable regulating valve, the liquid flow area can be changed by adjusting the opening of the regulating valve, thereby applying resistance to the liquid flowing in the liquid cooling circulation loop.

[0065] In other embodiments, the flow resistance device 14 includes a pipe segment switching device configured to apply resistance to the liquid flowing in the liquid cooling circulation loop by selectively connecting a portion of the liquid cooling circulation loop to pipe segments with different diameters or different curvatures, as controlled by the processor 20.

[0066] Specifically, when the flow resistance device 14 includes a pipe section switching device, the flow of liquid can be blocked by adjusting the pipe diameter or curvature, thereby applying resistance to the liquid flowing in the liquid cooling circulation loop.

[0067] The above text first introduced the implementation method of the flow resistance device 14, showing that the flow resistance device 14 can apply resistance to the liquid flowing in the liquid cooling circulation loop. The following will combine... Figure 3 This section explains how the resistance exerted on a liquid by a flow resistance device affects the liquid's flow rate. Figure 3 It is a graph showing the characteristic curves of the liquid supply pump and piping in a liquid cooling circulation loop according to some embodiments of the present disclosure.

[0068] like Figure 3 As shown, curve 31 is the characteristic curve when a single liquid supply pump is working, curve 32 is the characteristic curve when two liquid supply pumps are working in parallel, curve 33 is the characteristic curve of the liquid cooling circulation loop when the flow resistance device does not apply resistance to the liquid flowing in the liquid cooling circulation loop, and curve 34 is the characteristic curve of the liquid cooling circulation loop when the flow resistance device applies resistance to the liquid flowing in the liquid cooling circulation loop.

[0069] The characteristic curve of the aforementioned liquid supply pump illustrates the relationship between the flow rate of the liquid flowing through the pump and the pressure provided by the pump. Taking point A as an example, point A on curve 31 means that when the flow rate of the liquid in the liquid cooling loop is Q1, the pressure provided by a single liquid supply pump is P1. The characteristic curve of the liquid supply pump reflects the pump's head at different flow rates.

[0070] The characteristic curves of the aforementioned pipeline illustrate the relationship between the flow rate and the required pressure of the liquid within the pipeline. Taking point B as an example, point B on curve 33 represents the pressure required for the liquid to achieve a flow rate of Q2 in the pipeline when the flow resistance device does not apply resistance to the liquid flowing in the liquid-cooled circulation loop. The pipeline characteristic curves reflect the resistance within the pipeline, including built-in resistance such as pipeline friction and / or the resistance applied to the liquid by the flow resistance device.

[0071] The intersection of the aforementioned characteristic curves signifies that, at a specific flow rate, the pressure provided by the liquid supply pump to the liquid is consistent with the pressure required for the liquid to flow in the pipeline. Taking point C as an example, intersection C means that when the liquid flow rate is Q3, according to curve 34, the liquid requires a pressure of P3, and according to curve 32, the flow rate provided by a single liquid supply pump is P3, which precisely meets the requirement. Therefore, when the flow resistance device does not impose resistance on the liquid flowing in the liquid-cooled circulation loop and a single liquid supply pump is operating, the liquid flow rate is Q3. Therefore, in actual operation, the intersection of the characteristic curves represents the operating point of the liquid-cooled circulation loop.

[0072] from Figure 3 It can be seen that the resistance applied to the liquid by the flow resistance device will cause the characteristic curve of the pipeline to change from curve 33 to curve 34. As mentioned above, the operating point of the liquid cooling circulation loop is the intersection of the characteristic curve of the liquid supply pump and the characteristic curve of the pipeline. Therefore, as the resistance applied to the liquid by the flow resistance device, the flow rate of the liquid in the liquid cooling circulation loop will also decrease.

[0073] In some embodiments, the operating range of the liquid flow rate in the liquid cooling circulation loop is within a certain range of the rated flow rate of the heat exchanger, for example, 80% to 120% of the rated flow rate, thereby ensuring the normal operation of the heat exchanger, that is, the normal cooling operation of the equipment to be cooled.

[0074] Based on the above principle, the flow resistance device 14 in this disclosure ensures that the flow rate of the liquid in the liquid cooling circulation loop is within the working range when all the multiple liquid supply pumps 11 are working normally and when some liquid supply pumps fail. That is, the flow rate corresponding to the intersection point of the characteristic curve when all the liquid supply pumps are working normally and the characteristic curve when some liquid supply pumps fail with the characteristic curve of the pipeline is within the working range.

[0075] For example, in Figure 3 In the corresponding embodiment, the rated flow rate is Q0, and the operating range is 80% to 120% of the rated flow rate, i.e. Figure 3The range shown is as follows. When all the supply pumps are working normally, the characteristic curve of the supply pump is curve 32. The flow resistance control device applies resistance to the liquid, which makes the operating point C mentioned above, within the operating range. When one supply pump fails, the characteristic curve of the supply pump becomes curve 31. The flow resistance control device reduces the resistance applied to the liquid, which makes the operating point, for example, become point D, also within the operating range.

[0076] In some embodiments, the processor 20 controls the flow resistance device 14 according to the flow rate of the liquid in the liquid cooling circulation loop, including: increasing the flow resistance of the liquid in the liquid cooling circulation loop when the flow rate of the liquid in the liquid cooling circulation loop is greater than the working range; and decreasing the flow resistance of the liquid in the liquid cooling circulation loop when the flow rate of the liquid in the liquid cooling circulation loop is less than the working range.

[0077] The above embodiments provide a method for the processor 20 to specifically control the flow resistance device 14 based on the principle of the flow resistance device. By adjusting the resistance applied by the flow resistance device according to the flow rate of the liquid in the liquid cooling circulation loop as described above, the flow rate of the liquid in the liquid cooling circulation loop can be controlled and kept within the working range.

[0078] In some embodiments, the control of the processor described above can be to increase or decrease the flow resistance of the liquid in the liquid cooling circulation loop by a certain margin. For example, the resistance provided by the flow resistance device can be adjusted by a margin of 1%. Specifically, for example, if the flow resistance device includes an adjustable regulating valve, the opening of the regulating valve can be adjusted by a margin of 1%, thereby adjusting the resistance provided by the flow resistance device.

[0079] By adjusting the flow rate of the liquid in the liquid cooling loop at a certain level, the flow rate can be controlled more quickly or more accurately based on a preset range, thereby improving the control efficiency of the processor.

[0080] After the above adjustments, when all the liquid supply pumps are working normally, the flow resistance device applies a first resistance to the liquid in the liquid cooling circulation loop. When some of the liquid supply pumps fail, the flow resistance device applies a second resistance to the liquid in the liquid cooling circulation loop or does not apply any resistance. The second resistance is less than the first resistance.

[0081] By applying a first resistance and a second resistance, or by not applying any resistance, in both cases, the liquid flow rate can be kept within the operating range in both situations. Simultaneously, with all supply pumps operating normally, the flow rate provided by the supply pumps is reduced by the applied resistance. Since the power of the supply pumps and the flow rate through them are positively correlated, the flow rate control in this embodiment can reduce the power of the supply pumps while all supply pumps are operating normally, thereby increasing the service life of the supply pumps.

[0082] Based on the processor control described above, further refinement is possible. In some embodiments, the operating range includes a flow range from a first flow rate to a second flow rate, where the second flow rate is greater than the first flow rate. In other words, the first flow rate is the lower limit of the operating range, and the second flow rate is the upper limit of the operating range.

[0083] The above-mentioned flow resistance control device based on the flow rate of the liquid in the liquid cooling circulation loop further includes: when all the multiple liquid supply pumps are working normally and the flow rate of the liquid in the liquid cooling circulation loop is greater than the second flow rate, the flow resistance control device increases the flow resistance of the liquid in the liquid cooling circulation loop so that the flow rate of the liquid in the liquid cooling circulation loop is less than or equal to the second flow rate.

[0084] In the event of partial liquid supply pump failure or liquid flow rate in the liquid cooling circulation loop being less than the first flow rate, a flow resistance control device is used to reduce the flow resistance of the liquid in the liquid cooling circulation loop, thereby ensuring that the liquid flow rate in the liquid cooling circulation loop is greater than or equal to the first flow rate.

[0085] Through the above control, the following can be achieved: when all multiple liquid supply pumps are operating normally and the flow rate they provide is greater than the upper limit of the operating range (i.e., the second flow rate), the flow rate can be controlled at or below the second flow rate by controlling the flow resistance device; conversely, when some liquid supply pumps fail and the flow rate provided by the remaining liquid supply pumps is less than the lower limit of the operating range (i.e., the first flow rate), the flow resistance device can be controlled to control the flow rate at or above the first flow rate. This control ensures the operation of the cooling unit and improves its reliability.

[0086] For example, in Figure 3 In the embodiment shown, the first flow rate is the lower limit of the operating range, i.e., 80% of the rated flow rate Q0, and the second flow rate is the upper limit of the operating range, i.e., 120% of the rated flow rate Q0.

[0087] With all the liquid supply pumps operating normally, without the resistance applied by the flow resistance device, the operating point of the liquid cooling circulation pipeline should be the intersection of curves 32 and 33. The flow provided by multiple liquid supply pumps would exceed the upper limit of the operating range, causing it to malfunction. Therefore, by increasing the flow resistance of the flow resistance device, the characteristic curve of the pipeline is changed, and the operating point is changed to the intersection of curves 32 and 34, C. That is, the flow rate of the liquid cooling circulation pipeline is controlled at Q3, which is less than 120% of Q0, thus ensuring the operation of the cooling unit.

[0088] Similarly, in the event of a partial supply pump failure, if the resistance applied by the flow resistance device is not reduced, the operating point of the liquid cooling circulation pipeline should be the intersection of curves 31 and 34, and the flow rate provided by the remaining supply pumps will be less than the lower limit of the operating range. Therefore, by reducing the resistance of the flow resistance device, the characteristic curve of the pipeline can be changed to the intersection point D of curves 31 and 34, that is, the flow rate of the liquid cooling circulation pipeline can be controlled at Q4, which is greater than 80% of Q0, thus ensuring the operation of the cooling unit.

[0089] In some embodiments, the operating range includes a third flow rate, which is greater than the first flow rate and less than the second flow rate. The step of controlling the flow resistance device based on the flow rate of the liquid in the liquid cooling circulation loop further includes: when all the plurality of liquid supply pumps are operating normally, controlling the flow resistance device such that the difference between the flow rate of the liquid in the liquid cooling circulation loop and the third flow rate is less than a threshold.

[0090] The aforementioned third flow rate can be, for example, the rated flow rate Q0 of the heat exchanger, and the threshold of the aforementioned difference can be, for example, 5% of Q0. By further setting the third flow rate and controlling the flow rate in the liquid cooling circulation loop to be near the third flow rate, i.e., within the range of 95% to 105% of the rated flow rate, the heat exchanger can have a higher working efficiency, while avoiding the waste of excess flow, thereby improving the working efficiency of the cooling unit under normal working conditions.

[0091] Based on the above Figures 1-3 This disclosure introduces some basic embodiments and operating principles. The following will be based on... Figure 4 Some further embodiments of this disclosure are presented. Figure 4 This is a schematic diagram illustrating the structure of a cooling unit according to other embodiments of the present disclosure.

[0092] like Figure 4As shown, in some embodiments of this disclosure, the liquid cooling circulation loop 10 further includes: a flow sensor 15, communicatively connected to the processor 20, configured to sense the flow rate of the liquid in the liquid cooling circulation loop; and / or at least one pressure sensor 16, communicatively connected to the processor 20, configured to sense the pressure of the liquid in the liquid cooling circulation loop.

[0093] The flow sensor 15 and pressure sensor 16 enable accurate measurement of the flow rate and pressure of the liquid in the liquid cooling circulation loop 10, facilitating corresponding control by the processor 20, including controlling the flow resistance device 14 based on the flow rate of the liquid in the liquid cooling circulation loop.

[0094] In some embodiments, at least one pressure sensor 16 includes: a first pressure sensor 161 located at the inlet of the heat exchanger; and / or a second pressure sensor 162 located at the outlet of the plurality of liquid supply pumps.

[0095] The first pressure sensor 161 mentioned above can monitor the pressure of the liquid at the inlet of the heat exchanger, ensuring that the liquid flowing through the inlet of the heat exchanger does not exceed the safe pressure at the inlet of the heat exchanger, effectively protecting the relatively vulnerable interface.

[0096] The second pressure sensor 162 mentioned above enables monitoring of the liquid pressure at the outlets of multiple liquid supply pumps, thereby enabling accurate judgment of the operating status of multiple liquid supply pumps.

[0097] For example, the processor 20 can determine whether there is a fault among the multiple liquid supply pumps based on the pressure sensed by the second pressure sensor 162. Specifically, when a liquid supply pump fails, the pressure of the liquid at the outlet of the liquid supply pump will be insufficient. Through the real-time sensing of the second pressure sensor 162, the processor can make a timely and accurate judgment on the above situation.

[0098] like Figure 4 As shown, the liquid cooling circulation loop 10 may further include a bypass branch 100, which is connected in parallel with the heat exchanger 12 and is configured to divert the liquid in the liquid cooling circulation loop when the pressure at the inlet of the heat exchanger 12 is greater than a threshold.

[0099] By using the bypass branch 100, the liquid in the liquid-cooled circulation loop can be diverted when the liquid pressure at the heat exchanger inlet is close to the safe pressure at the heat exchanger inlet, thereby reducing the liquid pressure in the loop and protecting the heat exchanger inlet.

[0100] In some embodiments, the bypass branch 100 includes a bypass valve 101, the processor 20 is communicatively connected to the bypass valve 101, and controls the bypass valve according to the pressure sensed by the first pressure sensor.

[0101] The bypass valve described above allows for control of the bypass branch's flow. When the first pressure sensor detects that the pressure at the heat exchanger inlet exceeds a threshold, the processor controls the bypass valve to divert the liquid. This configuration achieves accurate control of the bypass branch, thereby protecting the heat exchanger inlet.

[0102] like Figure 4 As shown, the liquid cooling circulation loop 10 may further include: a ball valve 17, which is connected to the inlet and outlet of a plurality of liquid supply pumps 11 respectively; and a flexible joint 18, which is connected between the plurality of liquid supply pumps 11 and the ball valve 17 respectively.

[0103] By installing ball valves and flexible joints at both ends of the liquid supply pump, the connection between the liquid supply pump and other parts of the liquid cooling circulation loop can be effectively cut off when the liquid supply pump fails, thereby enabling maintenance of the liquid supply pump and improving the convenience of the system.

[0104] like Figure 4 As shown, the liquid cooling circulation loop 10 may also include: a check valve 19, which is connected to the outlet of a plurality of liquid supply pumps 11 respectively.

[0105] By installing a check valve at the outlet of the liquid supply pump, it can be ensured that the liquid in the liquid cooling circulation loop flows in one direction, preventing damage caused by liquid backflow into the liquid supply pump due to unexpected circumstances.

[0106] The cooling unit and its operation process according to some embodiments of this disclosure have been described above. The cooling unit proposed in this disclosure can avoid the problems of excessive pump footprint or reduced pump life while ensuring reliability. The following will be combined with... Figure 5 The flow control method proposed in this disclosure and applied to the cooling unit as described above is introduced.

[0107] Figure 5 This is a flowchart illustrating a flow control method according to some embodiments of the present disclosure. Figure 5 As shown, the flow control method includes steps S51 to S52.

[0108] In step S51, the flow rate of the liquid in the liquid-cooled circulation loop is determined. The processor determines the flow rate of the liquid in the liquid-cooled circulation loop before controlling the flow resistance device.

[0109] In step S52, based on the flow rate of the liquid in the liquid cooling circulation loop, the flow resistance device is controlled to apply resistance to the liquid flowing in the liquid cooling circulation loop, so that the flow rate of the liquid in the liquid cooling circulation loop is within the working range when all multiple liquid supply pumps are working normally and when some liquid supply pumps fail.

[0110] In the technical solutions of the embodiments of this disclosure, by determining the flow rate of the liquid and then controlling the cooling unit as described above, the flow rate of the liquid in the liquid cooling circulation loop can be maintained within the operating range, ensuring the reliability of the cooling unit. Furthermore, the cooling unit described above does not use a standby pump, improving space utilization and saving installation space. Simultaneously, it allows multiple liquid supply pumps to operate at lower loads even when all pumps are functioning normally, thus extending their lifespan.

[0111] Figure 6 This is a block diagram illustrating a computer system for implementing some embodiments of the present disclosure.

[0112] like Figure 6 As shown, computer system 6 can be represented in the form of a general computing device. Computer system 6 includes memory 61, processor 62, and bus 60 connecting different system components.

[0113] Memory 61 can be various forms of computer-readable storage media, such as system memory, non-volatile storage media, etc. System memory may store, for example, an operating system, application programs, a bootloader, and other programs. System memory may include volatile storage media, such as random access memory (RAM) and / or cache memory. Non-volatile storage media may store, for example, instructions for executing corresponding embodiments of the flow control method. Non-volatile storage media include, but are not limited to, disk storage, optical storage, flash memory, etc.

[0114] The processor 62 can be implemented using a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete hardware components such as discrete gates or transistors. Accordingly, each module can be implemented by executing instructions in the central processing unit (CPU) memory to perform the corresponding steps, or by implementing dedicated circuitry to perform the corresponding steps.

[0115] Bus 60 can use any of the various bus architectures. For example, bus architectures include, but are not limited to, Industry Standard Architecture (ISA) bus, Micro Channel Architecture (MCA) bus, and Peripheral Component Interconnect (PCI) bus.

[0116] Computer system 6 may also include input / output interface 63, network interface 64, and storage interface 65. These interfaces 63, 64, and 65, as well as memory 61 and processor 62, can be connected via bus 60. Input / output interface 63 provides a connection interface for input / output devices such as monitors, mice, and keyboards. Network interface 64 provides a connection interface for various networked devices. Storage interface 65 provides a connection interface for external storage devices such as floppy disks, USB flash drives, and SD cards.

[0117] According to embodiments of this disclosure, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, some embodiments of this disclosure include a computer program product that, when run on a computer, causes the computer to implement the flow control method described in any of the foregoing embodiments. The computer program product includes a computer program carried on a computer-readable medium, the computer program containing program code for performing the methods shown in the flowcharts.

[0118] Embodiments of this disclosure also provide a vehicle including communication equipment; and a cooling unit as described above, configured to cool the communication equipment.

[0119] As mentioned above, the cooling unit does not use a standby pump, improving space utilization and saving installation space. Simultaneously, it allows multiple liquid supply pumps to operate at lower loads while all are functioning normally, extending their lifespan. Furthermore, by controlling the flow resistance device, the liquid flow rate in the liquid cooling circulation loop can be maintained within the operating range, ensuring the reliability of the cooling unit.

[0120] The cooling units described above are used to cool communication equipment in vehicles, which can save vehicle space.

[0121] The specific type of vehicle disclosed in this embodiment is not limited, for example, it can be a sedan, SUV, van, sports car or special vehicle, etc.

[0122] Various embodiments of this disclosure have now been described in detail. To avoid obscuring the concept of this disclosure, some details known in the art have not been described. Those skilled in the art will fully understand how to implement the technical solutions disclosed herein based on the above description.

[0123] While specific embodiments of this disclosure have been described in detail by way of examples, those skilled in the art should understand that the examples are for illustrative purposes only and not intended to limit the scope of this disclosure. Those skilled in the art should understand that modifications can be made to the above embodiments or equivalent substitutions can be made to some technical features without departing from the scope and spirit of this disclosure. The scope of this disclosure is defined by the appended claims.

Claims

1. A cooling unit, comprising: A liquid-cooled circulation loop consisting of multiple liquid supply pumps, heat exchangers, cooling modules, and flow resistance devices connected in series; A processor, communicatively connected to the flow resistance device, is configured to control the flow resistance device based on the flow rate of the liquid in the liquid cooling circulation loop, the piping characteristics of the liquid cooling circulation loop, and the characteristics of the liquid supply pump, wherein: The plurality of liquid supply pumps are connected in parallel and configured to drive the liquid flow in the liquid cooling circulation loop; The heat exchanger is configured to allow the liquid in the liquid cooling circulation loop to exchange heat with the equipment to be cooled, and the inlet of the heat exchanger is in fluid communication with the outlet of the plurality of liquid supply pumps. The cooling module is configured to cool the liquid in the liquid cooling circulation loop. The inlet of the cooling module is in fluid communication with the outlet of the heat exchanger, and the outlet of the cooling module is in fluid communication with the inlet of the plurality of liquid supply pumps. The flow resistance device is configured to apply resistance to the liquid flowing in the liquid cooling circulation loop under the control of the processor, so that the flow rate of the liquid in the liquid cooling circulation loop is within the operating range when all of the multiple liquid supply pumps are working normally and when some liquid supply pumps fail.

2. The cooling unit according to claim 1, wherein, The flow resistance device includes: An adjustable regulating valve is configured to apply resistance to the liquid flowing in the liquid-cooled circulation loop by adjusting its opening according to the control of the processor; or The pipe segment switching device is configured to apply resistance to the liquid flowing in the liquid cooling circulation loop by selectively connecting a portion of the liquid cooling circulation loop to pipe segments with different diameters or different curvatures, under the control of the processor.

3. The cooling unit according to claim 1, wherein, The liquid supply pump is a fixed-frequency pump.

4. The cooling unit according to claim 1, wherein, The flow resistance control device, based on the liquid flow rate in the liquid cooling circulation loop, the piping characteristics of the liquid cooling circulation loop, and the characteristics of the liquid supply pump, includes: When the flow rate of the liquid in the liquid cooling circulation loop is greater than the working range, the flow resistance device is controlled to increase the flow resistance of the liquid in the liquid cooling circulation loop. When the flow rate of the liquid in the liquid cooling circulation loop is less than the operating range, a flow resistance control device is used to reduce the flow resistance of the liquid in the liquid cooling circulation loop.

5. The cooling unit according to claim 4, wherein, The operating range includes a flow rate range from a first flow rate to a second flow rate, where the second flow rate is greater than the first flow rate. The device for controlling the flow resistance based on the flow rate of the liquid in the liquid-cooled circulation loop, the piping characteristics of the liquid-cooled circulation loop, and the characteristics of the liquid supply pump further includes: When all the multiple liquid supply pumps are working normally and the flow rate of the liquid in the liquid cooling circulation loop is greater than the second flow rate, the flow resistance device is controlled to increase the flow resistance of the liquid in the liquid cooling circulation loop, so that the flow rate of the liquid in the liquid cooling circulation loop is less than or equal to the second flow rate. In the event of a partial failure of the liquid supply pump and a liquid flow rate in the liquid cooling circulation loop being less than the first flow rate, a flow resistance control device is used to reduce the flow resistance of the liquid in the liquid cooling circulation loop, thereby ensuring that the liquid flow rate in the liquid cooling circulation loop is greater than or equal to the first flow rate.

6. The cooling unit according to claim 5, wherein, The operating range includes a third flow rate, which is greater than the first flow rate and less than the second flow rate. The device for controlling the flow resistance based on the flow rate of the liquid in the liquid-cooled circulation loop, the piping characteristics of the liquid-cooled circulation loop, and the characteristics of the liquid supply pump further includes: With all the liquid supply pumps operating normally, the flow resistance device is controlled so that the difference between the liquid flow rate in the liquid cooling circulation loop and the third flow rate is less than a threshold.

7. The cooling unit according to claim 1, wherein, The liquid cooling circulation loop also includes: A flow sensor, communicatively connected to the processor, is configured to sense the flow rate of the liquid in the liquid-cooled circulation loop; and / or At least one pressure sensor, communicatively connected to the processor, is configured to sense the pressure of the liquid in the liquid-cooled circulation loop.

8. The cooling unit according to claim 7, wherein, The at least one pressure sensor includes: A first pressure sensor located at the inlet of the heat exchanger; and / or A second pressure sensor is located at the outlet of the plurality of liquid supply pumps.

9. The cooling unit according to claim 8, wherein, The liquid cooling circulation loop also includes: A bypass branch, connected in parallel with the heat exchanger, is configured to divert the liquid in the liquid-cooled circulation loop when the pressure at the inlet of the heat exchanger exceeds a threshold.

10. The cooling unit according to claim 9, wherein, The bypass branch includes a bypass valve, the processor is communicatively connected to the bypass valve, and controls the bypass valve according to the pressure sensed by the first pressure sensor.

11. The cooling unit according to claim 9, wherein, The processor determines whether there is a fault among the plurality of liquid supply pumps based on the pressure sensed by the second pressure sensor.

12. The cooling unit according to claim 1, wherein, The liquid cooling circulation loop also includes: Ball valves are respectively connected to the inlet and outlet of the plurality of liquid supply pumps; Flexible joints are respectively connected between the plurality of liquid supply pumps and the ball valve.

13. The cooling unit according to claim 1, wherein, The liquid cooling circulation loop also includes: A one-way valve is configured to allow the liquid in the liquid-cooled circulation loop to flow in one direction.

14. A flow control method applied to a cooling unit according to any one of claims 1 to 13, comprising: Determine the flow rate of the liquid in the liquid cooling circulation loop; Based on the flow rate of the liquid in the liquid cooling circulation loop, the pipeline characteristics of the liquid cooling circulation loop, and the characteristics of the liquid supply pump, a flow resistance device is controlled to apply resistance to the liquid flowing in the liquid cooling circulation loop, so that the flow rate of the liquid in the liquid cooling circulation loop remains within the operating range when all multiple liquid supply pumps are working normally and when some liquid supply pumps fail.

15. A vehicle comprising: Communication equipment; The cooling unit according to any one of claims 1 to 13 is configured to cool the communication equipment.

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