Photosensitive resin composition, photosensitive resin layer using same, and color filter
The photosensitive resin composition with dipentaerythritol hexa(meth)acrylate and alkoxylated dipentaerythritol poly(meth)acrylate or dendritic polyester (meth)acrylate addresses the challenge of high resolution and pattern characteristics in color filters, enhancing image quality in display devices and image sensors.
Patent Information
- Application Number
- CN202380041839.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2022-08-30
- Filing Date
- 2023-04-25
- Publication Date
- 2024-12-31
AI Technical Summary
Existing technologies face challenges in achieving high resolution while maintaining pattern characteristics in color filters, particularly as pixel sizes decrease to 0.5μm, leading to deteriorating image quality in display devices and image sensors.
A photosensitive resin composition comprising a colorant, a photopolymerizable compound including dipentaerythritol hexa(meth)acrylate and alkoxylated dipentaerythritol poly(meth)acrylate or dendritic polyester (meth)acrylate, along with a photopolymerization initiator and solvent, enhances pattern filling characteristics and resolution.
The composition improves pattern filling and diagonal length, ensuring high resolution and excellent pattern characteristics, suitable for display devices like liquid crystal displays and image sensors.
Smart Images

Figure CN119234186A_ABST
Abstract
Description
Technical Field
[0001] The present disclosure relates to a photosensitive resin composition, a photosensitive resin layer produced using the same, and a color filter. Background Art
[0002] Liquid crystal display devices have the advantages of lightness, thinness, low cost, low operating power consumption and improved adhesion to integrated circuits among many types of displays, and have been more widely used in laptop computers, monitors and television screens. Liquid crystal display devices include: a lower substrate, a black matrix, a color filter and an ITO pixel electrode formed on the lower substrate; and an upper substrate, an active circuit portion including a liquid crystal layer, a thin film transistor and a capacitor layer and an ITO pixel electrode formed on the upper substrate.
[0003] On the other hand, image sensors, which are devices that read information about an object and convert it into an electrical image signal, are used in various electronic devices such as smartphones, cars, laptop computers, cameras, etc. Image sensors are classified into charge coupled device (CCD) image sensors and complementary metal oxide semiconductor (CMOS) image sensors according to manufacturing processes and usage methods. CMOS image sensors, which are non-memory semiconductors that convert images received by a camera into digital signals, are pixel components of color filters, photodiodes, amplifiers, etc.
[0004] A color filter, which is a common key component of display devices such as liquid crystal displays (LCDs), image sensors (CCDs, CMOSs, etc.), has the following structure: a black matrix layer and a pixel unit are stacked in sequence, wherein the black matrix layer is formed in a predetermined pattern on a transparent substrate to block light at the boundaries between pixels; and in the pixel unit, a plurality of colors (usually the three primary colors of red (R), green (G), and blue (B)) are arranged in a predetermined order to form each pixel.
[0005] In order to improve the image quality of display devices (such as liquid crystal displays (LCDs), image sensors (CCDs, CMOSs, etc.), high resolution is required to reduce the unit pixel size in color filters from the previous approximately 1μm to the nearest 0.5μm, but as the pixel size decreases, pattern characteristics may deteriorate. Summary of the invention
[0006] [Technical issues]
[0007] One embodiment provides a photosensitive resin composition that achieves high resolution while ensuring pattern characteristics.
[0008] Another embodiment provides a red photosensitive resin layer manufactured using the photosensitive resin composition.
[0009] Another embodiment provides a color filter manufactured using a photosensitive resin layer.
[0010]
Technical solution
[0011] In one embodiment, the photosensitive resin composition comprises: (A) a colorant; (B) a photopolymerizable compound; (C) a photopolymerization initiator; and (D) a solvent, wherein the photopolymerizable compound includes dipentaerythritol hexa(meth)acrylate as a first photopolymerizable compound; and alkoxylated dipentaerythritol poly(meth)acrylate, dendritic polyester (meth)acrylate, or a combination thereof as a second photopolymerizable compound.
[0012] The photopolymerizable compound may include the first photopolymerizable compound and the second photopolymerizable compound in a weight ratio of about 1:9 to about 9:1.
[0013] The photopolymerizable compound may include the first photopolymerizable compound and the second photopolymerizable compound in a weight ratio of about 4:6 to about 6:4.
[0014] The alkoxylated dipentaerythritol poly(meth)acrylate may be represented by Chemical Formula 1:
[0015] [Chemical formula 1]
[0016]
[0017] In Chemical Formula 1, R 1 are the same or different and are substituents represented by the chemical formula 2 or *-OH; and R 2 is a substituent represented by Chemical Formula 3;
[0018] [Chemical formula 2]
[0019]
[0020] In chemical formula 2, L 1 is a substituted or unsubstituted C1 to C10 alkylene group; and R 2 is a hydrogen atom or a substituted or unsubstituted C1 to C10 alkyl group; and x is an integer of 0 to 10.
[0021] R 1 The substituents may be the same or represented by Chemical Formula 2.
[0022] L 1 The C1 to C5 alkylene group may be substituted or unsubstituted.
[0023] The alkoxylated dipentaerythritol poly(meth)acrylate can be represented by Chemical Formula 1-1:
[0024] [Chemical formula 1-1]
[0025]
[0026] The dendritic polyester (meth)acrylate can be represented by Chemical Formula 3:
[0027] [Chemical formula 3]
[0028]
[0029] In chemical formula 3, L 2 are the same or different and are substituted or unsubstituted C1 to C10 alkylene; R 3 are the same or different and are hydrogen or substituted or unsubstituted C1 to C10 alkyl; R 4 are the same or different and are substituents represented by Chemical Formula 4; and y is an integer from 0 to 10;
[0030] [Chemical formula 4]
[0031]
[0032] In chemical formula 4, L 3 is a substituted or unsubstituted C1 to C10 alkylene group; R 5 is a hydrogen atom or a substituted or unsubstituted C1 to C10 alkyl group; and R 6 are the same or different and are C1-C10 alkyl groups substituted with (meth)acrylate at the terminal or C1-C10 alkyl groups substituted with hydroxyl groups at the terminal.
[0033] R 6 The groups may be the same or different and may be C1 to C5 alkyl groups substituted with acrylate at the terminal; or C1 to C5 alkyl groups substituted with hydroxy at the terminal.
[0034] The dendritic polyester (meth)acrylate can be represented by Chemical Formula 3-1:
[0035] [Chemical formula 3-1]
[0036]
[0037] Colorants may include pigments.
[0038] The pigment may include a green pigment, a yellow pigment, or a combination thereof.
[0039] The photosensitive resin composition may include 5 wt % to 80 wt % of (A) a colorant; 0.1 wt % to 10 wt % of (B) a photopolymerizable compound; 0.1 wt % to 5 wt % of (C) a photopolymerization initiator; and the balance (D) a solvent, based on the total amount of the photosensitive resin composition.
[0040] The photosensitive resin composition may further include a polymerization inhibitor.
[0041] The polymerization inhibitor may be hydroquinone, methylhydroquinone or a mixture thereof.
[0042] The polymerization inhibitor may be included in an amount of about 0.001 wt % to about 5 wt % based on the total amount of the photosensitive resin composition.
[0043] The photosensitive resin composition may further include at least one additive selected from malonic acid, 3-amino-1,2-propanediol, a coupling agent containing a vinyl group or a (meth)acryloyloxy group, a leveling agent, a fluorine-based surfactant, and a free radical polymerization initiator.
[0044] Another embodiment provides a photosensitive resin layer manufactured using the photosensitive resin composition.
[0045] In another embodiment, a color filter including a photosensitive resin layer is provided.
[0046] In another embodiment, a display device including a color filter is provided.
[0047] Other embodiments of the invention are included in the detailed description below.
[0048]
Beneficial Effects
[0049] The photosensitive resin composition according to one embodiment (to which a mixture of alkoxylated dipentaerythritol poly(meth)acrylate having a long chain by introducing an alkylene oxide repeating unit therein and dipentaerythritol hexa(meth)acrylate is applied as a photopolymerizable compound) can improve pattern filling characteristics and enhance diagonal length, which are important factors in high-resolution pattern profiles.
[0050] Therefore, the photosensitive resin layer formed of the photosensitive resin composition according to one embodiment and the color filter including the same can not only achieve high resolution but also ensure excellent pattern characteristics, and thus can be appropriately applied to display devices such as liquid crystal displays (LCDs), image sensors (CCDs, CMOSs, etc.), etc. BRIEF DESCRIPTION OF THE DRAWINGS
[0051] Figure 1 The CD measurement results of the 0.8 μm pattern of Example 1 at an exposure dose of 200 ms are shown.
[0052] Figure 2 The CD measurement results of the 0.8 μm pattern of Example 1 at an exposure dose of 270 ms are shown.
[0053] Figure 3The CD measurement results of the 0.8 μm pattern of Example 1 at an exposure dose of 340 ms are shown.
[0054] Figure 4 The CD measurement results of the 0.8 μm pattern of Comparative Example 1 at an exposure dose of 200 ms are shown.
[0055] Figure 5 The CD measurement results of the 0.8 μm pattern of Comparative Example 1 at an exposure dose of 270 ms are shown.
[0056] Figure 6 The CD measurement results of the 0.8 μm pattern of Comparative Example 1 at an exposure dose of 340 ms are shown. DETAILED DESCRIPTION
[0057] [Best Mode]
[0058] Hereinafter, embodiments of the present invention are described in detail. However, these embodiments are exemplary, and the present disclosure is not limited thereto.
[0059] As used herein, when no specific definition is otherwise provided, "substituted" means that at least one hydrogen of the compound is replaced by a halogen atom (F, Cl, Br or I), a hydroxyl group, a C1 to C20 alkoxy group, a nitro group, a cyano group, an amine group, an imino group, an azido group, an amidino group, a hydrazine group, a hydrazone group, a carbonyl group, a carbamoyl group, a thiol group, an ester group, an ether group, a carboxyl group or a salt thereof, a sulfonic acid group or a salt thereof, a phosphoric acid or a salt thereof, a C1 to C20 alkyl group, a C2 to C20 alkenyl group, a C2 to C20 alkynyl group, a C6 to C30 aryl group, a C3 to C20 cycloalkyl group, a C3 to C20 cycloalkenyl group, a C3 to C20 cycloalkynyl group, a C2 to C20 heterocycloalkyl group, a C2 to C20 heterocycloalkenyl group, a C2 to C20 heterocycloalkynyl group, or a combination thereof.
[0060] As used herein, when no specific definition is otherwise provided, "heterocycloalkyl", "heterocycloalkenyl", "heterocycloalkynyl", and "heterocycloalkylene" refer to the presence of at least one N, O, S, or P in the cyclic compounds of cycloalkyl, cycloalkenyl, cycloalkynyl, and cycloalkylene.
[0061] As used herein, when no specific definition is otherwise provided, "(meth)acrylate" means both "acrylate" and "methacrylate".
[0062] In the chemical formulae in the present specification, unless a specific definition is otherwise provided, when a chemical bond is not drawn at a position where a chemical bond should be given, hydrogen is bonded to that position.
[0063] (Photosensitive resin composition)
[0064] One embodiment provides a photosensitive resin composition, comprising: (A) a colorant; (B) a photopolymerizable compound; (C) a photopolymerization initiator; and (D) a solvent, wherein the photopolymerizable compound includes dipentaerythritol hexa(meth)acrylate as a first photopolymerizable compound; and alkoxylated dipentaerythritol poly(meth)acrylate, dendritic polyester (meth)acrylate, or a combination thereof as a second photopolymerizable compound.
[0065] Specifically, alkoxylated dipentaerythritol poly(meth)acrylate and dendritic polyester (meth)acrylate, in which an alkylene oxide repeating unit is introduced into the molecule to have a long chain, may contribute not only to increasing the diagonal length but also to improving pattern filling properties.
[0066] However, when alkoxylated dipentaerythritol poly(meth)acrylate, dendritic polyester (meth)acrylate, or a combination thereof is used alone as a photopolymerizable compound, it is mixed with dipentaerythritol hexa(meth)acrylate, which is generally considered to be a photopolymerizable compound, because there is a compatibility problem with other components of the photosensitive resin composition.
[0067] Therefore, the photosensitive resin composition according to one embodiment (to which the following mixture is applied as a photopolymerizable compound: an alkoxylated dipentaerythritol poly(meth)acrylate mixed with an alkoxylated dipentaerythritol poly(meth)acrylate, a dendritic polyester (meth)acrylate, or a combination thereof as a second photopolymerizable compound) can enhance the diagonal length, which is an important factor in a high-resolution pattern profile, and also improve pattern filling characteristics.
[0068] In addition, a photosensitive resin layer formed of the photosensitive resin composition of an embodiment and a color filter including the same can not only achieve high resolution but also ensure excellent pattern characteristics, and thus can be appropriately applied to display devices such as liquid crystal displays (LCDs), image sensors (CCDs, CMOSs, etc.), etc.
[0069] Hereinafter, each component included in the photosensitive resin composition of the embodiment is described in detail.
[0070] (B) Photopolymerizable compound
[0071] First, the photopolymerizable compound is described.
[0072] The photosensitive resin composition of one embodiment includes a photopolymerizable compound, wherein the photopolymerizable compound corresponds to a component that imparts curability to the photosensitive resin composition.
[0073] As described above, the photosensitive resin composition of one embodiment includes a photopolymerizable compound, and the photopolymerizable compound includes dipentaerythritol hexa(meth)acrylate as a first photopolymerizable compound; and alkoxylated dipentaerythritol poly(meth)acrylate, dendritic polyester (meth)acrylate, or a combination thereof as a second photopolymerizable compound.
[0074] In the second photopolymerizable compound, the alkoxylated dipentaerythritol poly(meth)acrylate may be represented by Chemical Formula 1:
[0075] [Chemical formula 1]
[0076]
[0077] In Chemical Formula 1, R 1 are the same or different and are substituents represented by the chemical formula 2 or *-OH;
[0078] [Chemical formula 2]
[0079]
[0080] In chemical formula 2, L 1 is a substituted or unsubstituted C1 to C10 alkylene group; R 2 is a hydrogen atom or a substituted or unsubstituted C1 to C10 alkyl group; and x is an integer of 0 to 10.
[0081] Specifically, R 1 may be the same and may be a substituent represented by Chemical Formula 2.
[0082] L 1 The C1 to C5 alkylene group may be substituted or unsubstituted.
[0083] For example, L 1 It may be a C2 alkylene group, i.e., ethylene group. And, x may be 1. Therefore, the alkoxylated dipentaerythritol poly(meth)acrylate may be an ethoxylated dipentaerythritol poly(meth)acrylate.
[0084] R 2 It can be all hydrogen atoms.
[0085] More specifically, the alkoxylated dipentaerythritol poly(meth)acrylate may be ethoxylated dipentaerythritol poly(meth)acrylate represented by Chemical Formula 1-1.
[0086] [Chemical formula 1-1]
[0087]
[0088] The ethoxylated dipentaerythritol poly(meth)acrylate represented by Chemical Formula 1-1 may have a viscosity of 300 to 500 mPa·s or 350 to 450 mPa·s at 25° C.
[0089] In addition, in the second photopolymerizable compound, the dendritic polyester (meth)acrylate may be represented by Chemical Formula 3:
[0090] [Chemical formula 3]
[0091]
[0092] In chemical formula 3, L 2 are the same or different and are substituted or unsubstituted C1 to C10 alkylene; R 3 are the same or different and are hydrogen or substituted or unsubstituted C1 to C10 alkyl; R 4 are the same or different and are substituents represented by Chemical Formula 4; and
[0093] y is an integer from 0 to 10;
[0094] [Chemical formula 4]
[0095]
[0096] In chemical formula 4, L 3 is a substituted or unsubstituted C1 to C10 alkylene group; R 5 is a hydrogen atom or a substituted or unsubstituted C1 to C10 alkyl group; R 6 The same or different, and are C1-C10 alkyl groups substituted with (meth)acrylate at the terminal or C1-C10 alkyl groups substituted with hydroxyl groups at the terminal.
[0097] Specifically, R 6 may be the same and may be a substituted or unsubstituted C1 to C5 alkylene group.
[0098] For example, R6 may be a C2 alkylene group (ie, ethylene group).
[0099] R 3 may be the same and may be a substituted or unsubstituted C1 to C5 alkyl group.
[0100] For example, R 3 may be the same and may be C1 alkyl (ie methyl).
[0101] L 3 The C1 to C5 alkylene group may be substituted or unsubstituted.
[0102] For example, L 3 It may be a C1 alkylene group (ie, a methylene group).
[0103] R 5 It may be a substituted or unsubstituted C1 to C5 alkyl group.
[0104] For example, R 5 It may be a C1 alkyl group (ie, a methyl group).
[0105] R 6 The groups may be the same or different and may be a C1-C5 alkyl group substituted with an acrylate at the terminal; or a C1-C5 alkyl group substituted with a hydroxyl group at the terminal.
[0106] For example, R 6 The groups may be the same or different and may be a C1 alkyl group substituted with acrylate at the terminal (ie, a methyl group substituted with acrylate at the terminal); or a C1 alkyl group substituted with hydroxy at the terminal (ie, a methyl group substituted with hydroxy at the terminal).
[0107] More specifically, the dendritic polyester (meth)acrylate may be a dendritic polyester acrylate represented by Chemical Formula 3-1:
[0108] [Chemical formula 3-1]
[0109]
[0110] As the second photopolymerizable compound, alkoxylated dipentaerythritol poly(meth)acrylate or dendritic polyester (meth)acrylate may be used alone, or a mixture of these may be used. In the latter case, alkoxylated dipentaerythritol poly(meth)acrylate and dendritic polyester (meth)acrylate may be contained in a weight ratio of 1:9 to 9:1, 2:8 to 8:2, 3:7 to 7:3, or 4:6 to 6:4.
[0111] As the first photopolymerizable compound, dipentaerythritol hexa(meth)acrylate is a generally known photopolymerizable compound and has excellent compatibility with other components in the photosensitive resin composition.
[0112] Specifically, the dipentaerythritol hexa(meth)acrylate may be dipentaerythritol hexaacrylate represented by Chemical Formula 5:
[0113] [Chemical formula 5]
[0114]
[0115] The dipentaerythritol hexaacrylate represented by Chemical Formula 5 may have a viscosity of 300 to 500 mPa·s or 350 to 450 mPa·s at 25° C.
[0116] The photopolymerizable compound may include the first photopolymerizable compound and the second photopolymerizable compound in a weight ratio of 1:9 to 9:1, 2:8 to 8:2, 3:7 to 7:3, or 4:6 to 6:4.
[0117] When the weight ratio of the first photopolymerizable compound to the second photopolymerizable compound is close to 4:6 to 6:4, the effects of the two materials are synergistic, which is advantageous for manufacturing a photosensitive resin layer and a color filter including the same that ensure excellent pattern characteristics while achieving high resolution.
[0118] The photosensitive resin composition of one embodiment may further include, in addition to the first photopolymerizable compound and the second photopolymerizable compound, a third photopolymerizable compound different from them.
[0119] As the third photopolymerizable compound, a monofunctional or polyfunctional ester of (meth)acrylic acid having at least one ethylenically unsaturated double bond may additionally be used.
[0120] The second photopolymerizable compound has an ethylenically unsaturated double bond, so that it can form a pattern having excellent heat resistance, light resistance, and chemical resistance by causing sufficient polymerization during exposure in the pattern formation process.
[0121] Specific examples of the added photopolymerizable compound may include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, bisphenol A di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, pentaerythritol hexa(meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, bisphenol A epoxy (meth)acrylate, ethylene glycol monomethyl ether (meth)acrylate, trimethylolpropane tri(meth)acrylate, tri(meth)acryloyloxyethyl phosphate, novolac epoxy (meth)acrylate, and the like.
[0122] Examples of commercially available products of the third photopolymerizable compound are as follows. Monofunctional (meth)acrylates may include Aronix (Toagosei Chemistry Industry Co., Ltd.); KAYARAD KAYARAD (Nippon Kayaku Co.,Ltd.); (Osaka Organic Chemical Ind., Ltd.), etc. Examples of difunctional (meth)acrylates may include Aronix (Toagosei Chemistry Industry Co., Ltd.), KAYARAD KAYARAD KAYARAD (Nippon Kayaku Co.,Ltd.)、 (Osaka Organic Chemical Ind., Ltd.), etc. Examples of trifunctional (meth)acrylates may include Aronix (Toagosei Chemistry Industry Co., Ltd.); KAYARAD (Nippon Kayaku Co.,Ltd.); (Osaka YukiKayaku Kogyo Co. Ltd.) etc. These may be used alone or as a mixture of two or more.
[0123] The third photopolymerizable compound may be treated with an anhydride to improve developability.
[0124] The third photopolymerizable compound exhibits similar effects due to structural similarity to the first photopolymerizable compound, and thus when the third photopolymerizable compound is further included, the content of the first photopolymerizable compound may be relatively reduced.
[0125] For example, the weight ratio of the total amount of the first photopolymerizable compound and the third photopolymerizable compound to the second photopolymerizable compound may be 1:9 to 9:1, 2:8 to 8:2, 3:7 to 7:3, or 4:6 to 6:4. In addition, the weight ratio of the first photopolymerizable compound to the third photopolymerizable compound may be 1:9 to 9:1, 2:8 to 8:2, 3:7 to 7:3, or 4:6 to 6:4.
[0126] However, as can be seen from the evaluation described below, replacing the second photopolymerizable compound with the third photopolymerizable compound and mixing it with the first photopolymerizable compound results in inferior effects, no different from using the first photopolymerizable compound alone.
[0127] The total amount of the photopolymerizable compound may be 0.1 wt % to 10 wt %, specifically 0.5 wt % to 8 wt %, for example 1 wt % to 5 wt %, based on the total amount of the photosensitive resin composition. If the photopolymerizable compound is included within the above range, sufficient curing occurs during exposure during pattern formation, resulting in excellent reliability and excellent developability using an alkaline developing solution.
[0128] (A) Colorants
[0129] The photosensitive resin composition of one embodiment may include a pigment as a colorant.
[0130] The pigment may include green pigment, blue pigment, red pigment, violet pigment, yellow pigment, black pigment, and the like.
[0131] The red pigment may be CI red pigment 254, CI red pigment 255, CI red pigment 264, CI red pigment 270, CI red pigment 272, CI red pigment 177, CI red pigment 89, etc. in the color index, which may be used alone or in a mixture of two or more, but the present invention is not limited thereto.
[0132] The violet pigment may be CI violet pigment 23 (V.23), CI violet pigment 29, dioxazine violet, first violet B, methyl violet lake, indanethrene brilliant violet, etc. in the color index, which may be used alone or in a mixture of two or more, but the present invention is not limited thereto.
[0133] The green pigment may be CI green pigment 7, CI green pigment 36, CI green pigment 58, CI green pigment 59, etc. in the color index, which may be used alone or in a mixture of two or more, but the present invention is not limited thereto.
[0134] The blue pigment may be a copper phthalocyanine pigment in the color index such as CI blue pigment 15:6, CI blue pigment 15, CI blue pigment 15:1, CI blue pigment 15:2, CI blue pigment 15:3, CI blue pigment 15:4, CI blue pigment 15:5, CI blue pigment 15:6, CI blue pigment 16, which may be used alone or in a mixture of two or more, but the present invention is not limited thereto.
[0135] The yellow pigment may be an isoindoline pigment in the color index, such as CI yellow pigment 185, CI yellow pigment 139, etc., a quinophthalone pigment such as CI yellow pigment 138, a nickel complex pigment such as CI yellow pigment 150, which may be used alone or in a mixture of two or more, but the present invention is not limited thereto.
[0136] The black pigment may be aniline black, perylene black, titanium black, carbon black, etc. in the color index, which may be used alone or in a mixture of two or more, but the present invention is not limited thereto.
[0137] Specifically, the colorant may be a pigment dispersion including a green pigment, a yellow pigment, or a combination thereof.
[0138] More specifically, the colorant may be a pigment dispersion that realizes green color through a mixture of a green pigment and a yellow pigment.
[0139] More specifically, the colorant may be a mixture of a green pigment and a yellow pigment in a weight ratio of 90:10 to 50:50, 80:20 to 55:45, or 75:25 to 60:40.
[0140] The pigment may be contained in the near infrared absorbing resin composition in the form of a dispersion. Such a pigment dispersion may be composed of a pigment, a solvent, a dispersant, a dispersing resin, and the like.
[0141] The solvent may be ethylene glycol acetate, ethyl celulose, propylene glycol methyl ether acetate, ethyl lactate, polyethylene glycol, cyclohexanone, propylene glycol methyl ether, and the like, and among them, propylene glycol methyl ether acetate, propylene glycol methyl ether, and the like may be preferably used.
[0142] Dispersants help pigments to be uniformly dispersed in the dispersion, and nonionic, anionic or cationic dispersants can be used. Specifically, polyalkylene glycols or their esters, polyoxyalkylenes, polyol ester alkylene oxide adducts, alcohol alkylene oxide adducts, sulfonic acid esters, sulfonates, carboxylates, carboxylates, alkylamide alkylene oxide adducts, alkylamines, etc. can be used, and these can be used alone or in combination of two or more.
[0143] As the dispersing resin, an acrylic resin including a carboxyl group may be used, which can improve the stability of the pigment dispersion and the patterning ability of the pixel.
[0144] In the photosensitive resin composition, the pigment solid content may be included in an amount of 5 wt % to 80 wt %, specifically 10 wt % to 40 wt %.
[0145] Recently, there is a trend to manufacture photosensitive resin compositions with high pigment contents to ensure coloring power while manufacturing thin color filters. Although conventionally known photosensitive resin compositions use a total pigment solid content of less than 5 wt %, a photosensitive resin composition of an embodiment has a higher pigment solid content than that.
[0146] In addition, the photosensitive resin composition may include a pigment dispersion as a colorant in an amount of 50 wt % to 90 wt %, specifically 60 wt % to 80 wt %, based on the total amount of the photosensitive resin composition. If the pigment dispersion is used as the colorant within the above range, high brightness and contrast can be expressed on a desired color coordinate.
[0147] (C) Photopolymerization initiator
[0148] The photopolymerization initiator may be an initiator commonly used in a photosensitive resin composition, such as an acetophenone compound, a benzophenone compound, a thioxanthone compound, a benzoin compound, a triazine compound, an oxime compound, or a combination thereof.
[0149] Examples of acetophenone compounds may include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, p-tert-butyltrichloroacetophenone, p-tert-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-morpholinopropan-1-one, 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butan-1-one, and the like.
[0150] Examples of benzophenone compounds may include benzophenone, benzoyl benzoate, benzoyl benzoate methyl ester, 4-phenylbenzophenone, hydroxybenzophenone, acrylated benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, 3,3'-dimethyl-2-methoxybenzophenone, and the like.
[0151] Examples of the thioxanthone compounds may include thioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, 2-chlorothioxanthone, and the like.
[0152] Examples of the benzoin-based compound may include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzyl dimethyl ketal, and the like.
[0153] Examples of the triazine compound may include 2,4,6-trichloro-s-triazine, 2-phenyl 4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine, and 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-triazine. -triazine, 2-biphenyl-4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-phenylvinyl-s-triazine, 2-(naphthol-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphthol-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2,4-bis(trichloromethyl)-6-sunflower-s-triazine, 2,4-bis(trichloromethyl)-6-(4-methoxyphenylvinyl)-s-triazine, etc.
[0154] Examples of oxime compounds may be free radical compounds of benzoyl, phenyl and methyl, respectively, O-acyloxime compounds, 2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazol-3-yl]ethanone, O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one, and the like. Specific examples of O-acyloxime compounds can be 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholin-4-yl-phenyl)-butan-1-one, 1-(4-phenylsulfanylphenyl)-butane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1-one oxime-O-acetate, 1-(4-phenylsulfanylphenyl)-butan-1-one oxime-O-acetate, and the like.
[0155] In addition to these compounds, the photopolymerization initiator may include carbazole compounds, diketone compounds, sulfonium borate compounds, diazo compounds, imidazole compounds, biimidazole compounds, fluorene compounds, and the like.
[0156] The photopolymerization initiator may be used together with a photosensitizer that can cause a chemical reaction by absorbing light and being excited and then transferring its energy.
[0157] Examples of the photosensitizer may be tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, dipentaerythritol tetrakis-3-mercaptopropionate, and the like.
[0158] The photopolymerization initiator may be included in an amount of 0.1 wt % to 5 wt %, specifically 0.5 wt % to 3 wt %, for example 0.1 wt % to 2 wt %, based on the total amount of the photosensitive resin composition. If the photopolymerization initiator is included within this range, sufficient photopolymerization occurs during exposure in a pattern forming process, excellent reliability may be achieved, heat resistance, light resistance and chemical resistance, resolution and close contact characteristics of the pattern may be improved, and a reduction in transmittance due to a non-reactive initiator may be prevented.
[0159] (D) Solvent
[0160] The solvent is a material that has compatibility with the colorant, the photopolymerizable compound, and the photopolymerization initiator but does not react with the above materials.
[0161] Examples of the solvent may include alcohols such as methanol, ethanol, etc.; ethers such as dichloroethyl ether, n-butyl ether, diisoamyl ether, methyl phenyl ether, tetrahydrofuran, etc.; glycol ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, propylene glycol methyl ether, etc.; ceilulose acetate such as methyl ceilulose acetate, ethyl ceilulose acetate, diethyl ceilulose acetate, etc.; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, diethylene glycol diethyl ether, etc.; propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether, propylene glycol monoethyl ether, etc. glycol methyl ether acetate, propylene glycol propyl ether acetate, etc.; aromatic hydrocarbons such as toluene, xylene, etc.; ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl n-propyl ketone, methyl n-butyl ketone, methyl n-amyl ketone, 2-heptanone, etc.; saturated aliphatic monocarboxylic acid alkyl esters such as ethyl acetate, n-butyl acetate, isobutyl acetate, etc.; lactic acid esters such as methyl lactate, ethyl lactate, etc.; oxyacetic acid alkyl esters such as methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, etc.; alkoxyacetic acid alkyl esters such as methoxyacetic acid methyl, methoxyacetic acid alkyl Ethyl acetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, etc.; 3-oxypropionic acid alkyl esters such as methyl 3-oxypropionate, ethyl 3-oxypropionate, etc.; 3-alkoxypropionic acid alkyl esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, methyl 3-ethoxypropionate, etc.; 2-oxypropionic acid alkyl esters such as methyl 2-oxypropionate, ethyl 2-oxypropionate, propyl 2-oxypropionate, etc.; 2-alkoxypropionic acid alkyl esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, 2- Ethoxypropionic acid ethyl ester, 2-ethoxypropionic acid methyl ester, etc.; 2-oxy-2-methylpropionic acid esters, such as 2-oxy-2-methylpropionic acid methyl ester, 2-oxy-2-methylpropionic acid ethyl ester, etc.; monooxymonocarboxylic acid alkyl esters of 2-alkoxy-2-methylpropionic acid alkyl esters, such as 2-methoxy-2-methylpropionic acid methyl ester, 2-ethoxy-2-methylpropionic acid ethyl ester, etc.; esters, such as 2-hydroxyethyl propionate, 2-hydroxy-2-methylethyl propionate, hydroxyethyl acetate, 2-hydroxy-3-methyl butyrate, etc.; keto acid esters, such as ethyl pyruvate, etc. In addition, high boiling point solvents such as N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caprylic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, phenyl celulose acetate, etc. can also be used.
[0162] Among them, considering compatibility and reactivity, ketones such as cyclohexanone; glycol ethers such as ethylene glycol monoethyl ether; ethylene glycol alkyl ether acetates such as ethyl celulose acetate; esters such as 2-hydroxyethyl propionate; carbitols such as diethylene glycol monomethyl ether; and propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate, as well as ketones such as cyclohexanone can be used.
[0163] The solvent may be contained in an amount of 5 wt % to 30 wt %, more specifically 10 wt % to 25 wt %, for example 15 wt % to 20 wt %, based on the total amount of the photosensitive resin composition. If the solvent is contained within the above range, a coating film having excellent coatability of the photosensitive resin composition and excellent flatness may be obtained.
[0164] (E) Binder resin
[0165] The photosensitive resin composition according to one embodiment may further include a commercially available binder resin, such as an acrylic binder resin or an epoxy binder resin. Here, the commercially available binder resin is well known in the art.
[0166] However, as described above, there is a tendency to increase the pigment content in the photosensitive resin composition while relatively reducing the binder resin content. Therefore, the photosensitive resin composition of one embodiment may not use a separate binder resin different from the dispersion resin contained in the pigment dispersion.
[0167] (F) Polymerization inhibitor (free radical scavenger)
[0168] The photosensitive resin composition according to one embodiment may further include a polymerization inhibitor.
[0169] The polymerization inhibitor may include a hydroquinone compound, a catechol compound, or a combination thereof, but is not necessarily limited thereto. According to one embodiment, since the composition further includes a hydroquinone compound, a catechol compound, or a combination thereof, crosslinking at room temperature can be prevented during exposure after printing (coating) the composition.
[0170] Specifically, the polymerization inhibitor may include a hydroquinone compound, a catechol compound, or a combination thereof, such as hydroquinone, methyl hydroquinone, methoxy hydroquinone, tert-butyl hydroquinone, 2,5-di-tert-butyl hydroquinone, 2,5-bis(1,1-dimethylbutyl) hydroquinone, 2,5-bis(1,1,3,3-tetramethylbutyl) hydroquinone, catechol, tert-butyl catechol, 4-methoxyphenol, pyrogallol, 2,6-di-tert-butyl-4-methylphenol, 2-naphthol, tris(N-hydroxy-N-nitrosophenylaminato-O,O')aluminum, or a combination thereof, but is not necessarily limited thereto.
[0171] For example, the polymerization inhibitor may be a hydroquinone compound, such as hydroquinone, methyl hydroquinone, or a mixture thereof.
[0172] The hydroquinone compound may be used in the form of a dispersion, and the polymerization inhibitor in the form of a dispersion may be included in an amount of 0.001 wt % to 5 wt %, for example, 0.01 wt % to 3 wt %, based on the total amount of the composition. If the polymerization inhibitor is included within the above range, the problem of aging at room temperature may be solved while preventing sensitivity reduction and surface delamination phenomena.
[0173] (G) Other additives
[0174] The photosensitive resin composition may further include at least one additive selected from malonic acid, 3-amino-1,2-propanediol, a coupling agent containing a vinyl or (meth)acryloyloxy group, a leveling agent, a surfactant, and a free radical polymerization initiator to prevent stains or spots during coating, adjust leveling, or prevent pattern residue due to non-development.
[0175] The additives can be easily adjusted depending on the desired physical properties.
[0176] The coupling agent may be a silane-based coupling agent, and examples of the silane-based coupling agent may include a silane coupling agent containing a (meth)acryloyloxy group, trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatepropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, β-epoxycyclohexyl)ethyltrimethoxysilane, which may be used alone or in a mixture of two or more types.
[0177] The silane-based coupling agent may be specifically used in an amount of 0.01 parts by weight to 1 parts by weight based on 100 parts by weight of the photosensitive resin composition.
[0178] Furthermore, the photosensitive resin composition for a color filter may further include a surfactant, such as a fluorine-based surfactant, if necessary.
[0179] Examples of the fluorine-based surfactant may include F-563, F-482, F-484, and F-478 from DIC Co., Ltd., but are not limited thereto.
[0180] The surfactant may be desirably included in an amount of 0.01 wt % to 5 wt %, and more desirably 0.01 wt % to 2 wt %, based on the total amount of the photosensitive resin composition. If not falling within the above range, a problem of generating foreign matter after development is undesirably caused.
[0181] Furthermore, a certain amount of other additives such as antioxidants, stabilizers, etc. may be added to the photosensitive resin composition within a range that does not impair physical properties.
[0182] The photosensitive resin composition may be applied to a photosensitive resin composition for a color filter of a CMOS image sensor, specifically, a photosensitive resin composition for a green color filter of a CMOS image sensor.
[0183] (Photosensitive resin layer, color filter, and display device)
[0184] Another embodiment provides a photosensitive resin layer manufactured using the photosensitive resin composition. In another embodiment, a red color filter manufactured using the photosensitive resin layer is provided.
[0185] The method of manufacturing the color filter is as follows.
[0186] The above-mentioned photosensitive resin composition is coated on a glass substrate to a thickness of, for example, 0.5 μm to 10 μm using a suitable method such as spin coating, roll coating, or spray coating to form a photosensitive resin composition layer.
[0187] Subsequently, a substrate with a photosensitive resin composition layer is irradiated with light to form a pattern required for a color filter. It can be irradiated by using UV, electron beams or X-rays as a light source, and can be irradiated with UV in a region of, for example, 190nm to 450nm, and, for example, 200nm to 400nm. It can be irradiated by further using a photoresist mask. After the radiation process is performed in this way, the photosensitive resin composition layer exposed to the light source is treated with a developer. In this article, the unexposed area in the photosensitive resin composition layer is dissolved and a pattern for a color filter is formed. This process can be repeated many times according to the number of desired colors, thereby obtaining a color filter with a desired pattern. In addition, if the image pattern obtained by developing in the above process is cured by reheating or radiating actinic rays thereto, crack resistance, solvent resistance, etc. can be improved.
[0188] In another embodiment, a display device including a color filter is provided. The display device can be, for example, a liquid crystal display (LCD), a solid state image sensor (charge coupled device, CCD) image sensor, a complementary metal oxide semiconductor (CMOS) image sensor, etc.
[0189] [Invention Mode]
[0190] Hereinafter, the present invention will be described in more detail with reference to Examples. However, the following Examples are merely preferred examples of the present invention, and the present invention is not limited to the following Examples.
[0191] (Preparation of photosensitive resin composition)
[0192] Examples 1 to 14 and Comparative Examples 1 to 2
[0193] Each photosensitive resin composition was prepared by mixing components according to the compositions shown in Tables 1 to 3.
[0194] Specifically, a photopolymerizable compound, a polymerization inhibitor and an additive are added to a solvent, followed by stirring at room temperature for 60 minutes. Then, a pigment dispersion as a colorant is added to the obtained reactant and stirred at room temperature for 30 minutes. Subsequently, a photopolymerization initiator is dissolved therein, then, stirred at room temperature for 30 minutes, and the product obtained therefrom is filtered to remove impurities, thereby preparing a photosensitive resin composition.
[0195] (Table 1)
[0196] (Unit: wt%)
[0197]
[0198] (Table 2)
[0199] (Unit: wt%)
[0200]
[0201]
[0202] (Table 3)
[0203] (Unit: wt%)
[0204]
[0205] The components used in Tables 1 and 2 above are as follows.
[0206] (A) Colorants
[0207] (A-1) Pigment dispersion containing green pigment (product name: G58, manufacturer: Sanyo)
[0208] (A-2) Pigment dispersion containing yellow pigment (product name: Y185, manufacturer: Sanyo)
[0209] (B) Photopolymerizable compound
[0210] (B-1) Dipentaerythritol hexaacrylate (DPHA, manufacturer: Nippon Kayaku Co. Ltd.)
[0211] (B-2) Ethoxylated dipentaerythritol polyacrylate (product name: A-DPH-6E, manufacturer: Shin-Nakamura)
[0212] (B-3) Resinous polyester acrylate (product name: V1000, manufacturer: Osaka Yuki Kagaku Kogyo Co., Ltd.)
[0213] (C) Photopolymerization initiator
[0214] (C-1) Oxime initiator (product name: SPI-03, manufacturer: Samyang Corporation)
[0215] (C-2) Oxime initiator (product name: SPI-02, manufacturer: Samyang Corporation)
[0216] (D) Solvent
[0217] (D-1) Propylene glycol monomethyl ether acetate (PGMEA, manufacturer: Sigma-Aldrich)
[0218] (F) Polymerization inhibitor
[0219] (F-1) Hydroquinone monomethyl ether
[0220] (G) Additives
[0221] (G-1) Fluorine-based surfactant (F-563, manufacturer: DIC (use 10% dilution))
[0222] (G-2) Silane coupling agent (product name: KBM-503 (methacryloyloxy, manufacturer: ShinEtsu))
[0223] (Evaluation: Residual evaluation)
[0224] Each photosensitive resin composition was spin-coated to a thickness of about 0.6 μm on an 8-inch silicon wafer and pre-baked at about 100° C. for 3 minutes. Subsequently, after cooling at room temperature for 60 seconds, a photocurable reaction was induced in the range of 200 to 760 ms by using an i-line stepper (NSR-2005i10C, Nikon Corp.).
[0225] The exposed substrate was developed in a 0.3% TMAH aqueous solution by a puddle method at room temperature and then washed with a pure solvent for 120 seconds. Then, the developed substrate was dried at room temperature and post-baked at 230° C. for 5 minutes to obtain a pattern sample. After forming the pattern sample, the sample was measured by using a CD-SEM (S-9380-2, Hitachi Ltd.) relative to a 0.8 um pattern CD.
[0226] The pattern regularity and residue (scum) of the 0.8 um pattern CD measurement results were evaluated according to the following criteria, and the evaluation results are shown in Table 3.
[0227] The connection level between the two patterns is numerically expressed in the range of 0 to 5, and if the two different patterns are completely connected, 5 is given, and if the two different patterns are not completely connected, 0 is given. Here, when the evaluation result is 0 to 1, it is evaluated that the residue is excellently suppressed.
[0228] (Table 4)
[0229]
[0230] In addition, Figures 1 to 6 The 0.8 um pattern CD results per exposure dose of Example 1 and Comparative Example 1 are representatively shown in Table 5.
[0231] (Table 5)
[0232] Exposure dose (ms) 200 270 340 Comparative Example 1 1.3013 1.3235 1.3677 Example 1 1.2826 1.3342 1.3448
[0233] With reference to Tables 4 and 5, the effect according to the photopolymerizable compound is confirmed. Specifically, the higher the connection level between different patterns, the better the filling characteristics. Compared with Comparative Examples 1 and 2 using any one of the first and second photopolymerizable compounds, Examples 1 to 14 using a mixture of the first and second photopolymerizable compounds as the photopolymerizable compound show a high connection level between the patterns. Therefore, when the diagonal length (which is an important factor in the high-resolution pattern profile) is improved, the filling characteristics of the pattern are improved. In addition, as in Examples 1 to 14, the photopolymerizable compound contains the first photopolymerizable compound and the second photopolymerizable compound in a weight ratio of 1:9 to 9:1, 2:8 to 8:2, 3:7 to 7:3, or 4:6 to 6:4.
[0234] When the weight ratio of the first photopolymerizable compound and the second photopolymerizable compound is closer to 4:6 to 6:4, the effects of the two materials are more synergistic, and thus, it is beneficial to manufacture a photosensitive resin layer and a color filter including the photosensitive resin layer that ensure excellent pattern characteristics and achieve high resolution.
[0235] While the invention has been described in conjunction with what are presently considered to be practical exemplary embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but on the contrary, the invention is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
Claims
1. A photosensitive resin composition comprising: (A) coloring agent; (B) a photopolymerizable compound; (C) a photopolymerization initiator; as well as (D) a solvent, Wherein, the photopolymerizable compound comprises: dipentaerythritol hexa(meth)acrylate as a first photopolymerizable compound; and Alkoxylated dipentaerythritol poly(meth)acrylate, dendritic polyester (meth)acrylate, or a combination thereof as the second photopolymerizable compound.
2. The photosensitive resin composition according to claim 1, wherein The photopolymerizable compound includes the first photopolymerizable compound and the second photopolymerizable compound in a weight ratio of 1:9 to 9:
1.
3. The photosensitive resin composition according to claim 2, wherein The photopolymerizable compound includes the first photopolymerizable compound and the second photopolymerizable compound in a weight ratio of 4:6 to 6:
4.
4. The photosensitive resin composition according to claim 1, wherein The alkoxylated dipentaerythritol poly(meth)acrylate is represented by Chemical Formula 1: [Chemical formula 1] In Chemical Formula 1, R 1 are the same or different and are substituents represented by Chemical Formula 2 or *-OH; [Chemical formula 2] In chemical formula 2, L 1 is a substituted or unsubstituted C1 to C10 alkylene group; R 2 is a hydrogen atom or a substituted or unsubstituted C1 to C10 alkyl group; and x is an integer from 0 to 10.
5. The photosensitive resin composition according to claim 4, wherein R 1 are the same and are substituents represented by Chemical Formula 2.
6. The photosensitive resin composition according to claim 4, wherein L 1 It is a substituted or unsubstituted C1 to C5 alkylene group.
7. The photosensitive resin composition according to claim 4, wherein The alkoxylated dipentaerythritol poly(meth)acrylate is represented by Chemical Formula 1-1: [Chemical formula 1-1] 8. The photosensitive resin composition according to claim 1, wherein The dendritic polyester (meth)acrylate is represented by Chemical Formula 3: [Chemical formula 3] In chemical formula 3, L 2 are the same or different and are substituted or unsubstituted C1 to C10 alkylene; R 3 are the same or different and are hydrogen or substituted or unsubstituted C1 to C10 alkyl; R 4 are the same or different and are substituents represented by Chemical Formula 4; and y is an integer from 0 to 10; [Chemical formula 4] In chemical formula 4, L 3 is a substituted or unsubstituted C1 to C10 alkylene group; R 5 is a hydrogen atom or a substituted or unsubstituted C1 to C10 alkyl group; and R 6 are the same or different, and are C1 to C10 alkyl groups substituted with a (meth)acrylate at the terminal or C1 to C10 alkyl groups substituted with a hydroxyl group at the terminal.
9. The photosensitive resin composition according to claim 8, wherein R 6 are the same or different and are C1 to C5 alkyl groups substituted with acrylate at the terminal; or C1 to C5 alkyl groups substituted with hydroxy at the terminal.
10. The photosensitive resin composition according to claim 8, wherein The dendritic polyester (meth)acrylate is represented by Chemical Formula 4-1: [Chemical formula 3-1] 11. The photosensitive resin composition according to claim 1, wherein The colorant includes a pigment.
12. The photosensitive resin composition according to claim 11, wherein The pigment includes a green pigment, a yellow pigment or a combination thereof.
13. The photosensitive resin composition according to claim 1, wherein Based on the total amount of the photosensitive resin composition, the photosensitive resin composition comprises: 5wt% to 80wt% of the (A) colorant; 0.1 wt % to 10 wt % of the (B) photopolymerizable compound; 0.1 to 5 wt % of the (C) photopolymerization initiator; and The balance is the (D) solvent.
14. The photosensitive resin composition according to claim 13, wherein The photosensitive resin composition further includes a polymerization inhibitor.
15. The photosensitive resin composition according to claim 14, wherein The polymerization inhibitor includes hydroquinone, methyl hydroquinone or a mixture thereof.
16. The photosensitive resin composition according to claim 14, wherein The polymerization inhibitor may be included in an amount of about 0.001 wt % to about 5 wt % based on the total amount of the photosensitive resin composition.
17. The photosensitive resin composition according to claim 13, wherein The photosensitive resin composition further includes at least one additive selected from the group consisting of malonic acid, 3-amino-1,2-propanediol, a coupling agent containing a vinyl group or a (meth)acryloyloxy group, a leveling agent, a fluorine-based surfactant, and a free radical polymerization initiator. 18 . A photosensitive resin layer produced using the photosensitive resin composition according to claim 1 .
19. A color filter comprising the photosensitive resin layer according to claim 18.
20. A display device comprising the color filter according to claim 19.
