Bamboo-wood floor hot-press forming mold and application thereof

By designing bamboo and wood floor hot-press molding molds, the simultaneous molding of paint-free and chamfer-free molding in the prior art is solved, and the problem of chamfering treatment damage to paint-free and increase costs is improved, and the weather resistance and stability of the product are improved.

CN119238666APending Publication Date: 2025-01-03SHANGHAI YIZHUYIDING BAMBOO TECH CO LTD
View PDF 0 Cites 1 Cited by

Patent Information

Application Number
CN202411509553.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-28
Publication Date
2025-01-03

AI Technical Summary

Technical Problem

Bamboo products require chamfering during processing, but the chamfering process in the prior art will damage the paint-free surface after hot pressing, affecting the aesthetics and protective effect, and secondary hot pressing will lead to cost increase and deformation problems.

Method used

Design a bamboo and wood floor hot press mold, including upper mold and lower mold, and rectangular grooves are set on the bottom of the upper mold to achieve integrated paint-free and chamfering. The paint-free processing and chamfering are completed simultaneously under high temperature and high pressure through the hot pressing procedure. deal with.

Benefits of technology

It achieves simultaneous molding without paint and chamfering, avoids cracking, water absorption and mold, saves processing costs, simplifies the process flow, and improves the weather resistance and stability of the product.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119238666A_ABST
    Figure CN119238666A_ABST
Patent Text Reader

Abstract

The invention provides a bamboo-wood floor hot-press forming die and application thereof.The bamboo-wood floor hot-press forming die comprises an upper die and a lower die, the upper die abuts against the top of a floor board, and the lower die abuts against the bottom of the floor board and fixes the floor board. The width of the rectangular groove is the same as that of the bamboo-wood floor, and inner chamfers are arranged on the bottom edges of the two sides of the rectangular groove. The mold has the beneficial effects that paint-free processing and chamfering processing are simultaneously carried out in hot-pressing paint-free treatment of a paint-free bamboo and wood floor product formed by using the mold, so that a paint-free surface and a chamfer are integrally formed, the phenomena of cracking, water absorption, mildewing and the like at the chamfer can be avoided, outdoor use is facilitated, the application range is expanded, and the production cost is reduced. And the material cost can be saved, the processing technology is simplified, the labor and equipment cost is reduced, the forming efficiency is improved, and the product quality is stable.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The present invention belongs to the field of bamboo processing, and particularly relates to a hot press forming mold for bamboo wood floors and its application. Background Art

[0002] Bamboo matures quickly and has a high yield. Compared with wood resources whose resources are rapidly depleting and have a long production cycle, and non-degradable plastic products, bamboo products are increasingly favored by the low-carbon environmental protection market. However, when bamboo products are used outdoors, there are many difficult problems such as easy decay, discoloration, mildew, and cracking. The traditional treatment method is to paint to avoid cracking and mildew. However, because bamboo products have a high density and it is difficult for paint to penetrate, the paint is easy to fall off and fade during use, and regular painting maintenance is required, which increases a large amount of labor costs.

[0003] Therefore, the commonly used technical means is to hot press and cure a film-free coating on the surface of bamboo products. For example, Chinese Patent CN202120924531.5 provides a recombined bamboo board that integrates concave-convex wood grain decoration and protection functions, including a recombined bamboo layer and a hot press cured film layer with concave-convex wood grain decoration on the surface of the recombined bamboo layer. Compared with the existing recombined bamboo grain processing technology, the recombined bamboo board of the present utility model that integrates concave-convex wood grain decoration and protection functions not only has the decorative property of wood grain patterns but also has anti-corrosion, anti-mildew, and weather resistance, can reduce material costs, simplify the processing process, reduce labor and equipment costs, improve the forming efficiency, and at the same time, the hot press cured film can be used as a dense protective layer, and no subsequent reprocessing such as planing, sanding, and painting is required during outdoor application, which is more convenient and fast. Tests show that the protection effect and durability are better than the paint effect of ordinary recombined bamboo boards.

[0004] It is also possible to lay a plastic film paper on the surface of bamboo products and hot press and cure it. For example, Chinese Patent CN202410459699.1 provides a plastic film bamboo plywood and its production method, including the following steps: weaving bamboo slices into a bamboo mat, drying, soaking in a flame retardant solution, sealing and storing at 70 - 90°C for 1 - 2 h, impregnating with an aqueous phenolic resin solution for 1 - 2 h, fishing out and draining to obtain an impregnated bamboo mat; coloring the plastic film paper with phenolic resin, and the amount of phenolic resin used is 0.3 - 0.45 kg / m<supgt;2< / supgt>; forming a blank in the order of impregnated plastic film paper, multiple layers of impregnated bamboo mats, and impregnated plastic film paper, where the multiple layers of impregnated bamboo mats are 5 - 7 layers, and adjacent two layers of impregnated bamboo mats are stacked crosswise, feeding into a board machine, the temperature at the time of feeding the blank is 40 - 50°C, and after programmed hot pressing, it returns to normal pressure and room temperature to obtain a plastic film bamboo plywood. The present invention has good flame retardant effect, and the flame retardant performance of the product reaches A2 level. At the same time, the flame retardant has good compatibility with phenolic resin glue, and the bonding is more firm.

[0005] However, during the processing of bamboo products, the edges must be chamfered to prevent the sharp edges from cutting hands, feet and causing harm to the human body. The existing technology adopts a process of hot pressing first, and then chamfering with a tool after cooling. If a paint-free surface is added during hot pressing, the paint-free surface will inevitably be damaged in the subsequent chamfering process, affecting the appearance and protective effect of the paint-free surface. If the chamfered area is not regularly maintained and painted, cracking, water absorption and mildew will still occur; but if the chamfering is first turned and then the paint-free surface is added, it is necessary to hot press again, which not only greatly increases the processing cost, but also causes deformation of the chamfered area due to the secondary hot pressing, which is not feasible in terms of technology. Summary of the invention

[0006] In order to solve the above problems, the purpose of the present invention is to provide a bamboo and wood floor hot pressing forming mold, which can simultaneously perform paint-free processing and chamfering processing in the hot pressing forming process, so that the paint-free surface and the chamfer are formed in one piece, which can not only avoid cracking, water absorption and mildew at the chamfer, but also save processing costs.

[0007] To achieve the above-mentioned purpose, the present invention provides a bamboo and wood floor hot pressing forming mold, comprising an upper mold and a lower mold, the upper mold abuts against the top of the floor board, and the lower mold abuts against the bottom of the floor board and fixes the floor board, wherein the bottom surface of the upper mold is provided with at least one rectangular groove, the width of the rectangular groove is the same as the width of the bamboo and wood floor, and the bottom edges of both sides of the rectangular groove are provided with inner chamfers.

[0008] Based on the above solution, the bottom surface of the upper mold is provided with at least two rectangular grooves, and the spacing distances between adjacent rectangular grooves are the same.

[0009] On the basis of the above scheme, the upper mold is formed by transversely splicing and fixing at least two sub-upper molds, and the bottom surface of each sub-upper mold is provided with at least one rectangular groove, and the spacing distances between adjacent rectangular grooves are the same.

[0010] Based on the above solution, the inner chamfer is a round chamfer, an elliptical chamfer, an oblique chamfer or a stepped round chamfer.

[0011] Preferably, the width L of the upper mold is 55 to 2550 mm, the height H of the upper mold is 2 to 25 mm, the width a of the rectangular groove is 50 to 2500 mm, the depth b of the rectangular groove is 0.1 to 20 mm, and the inner chamfer is a round chamfer with a radius r of 0.1 to 10 mm and a central angle of 30 to 90 degrees, or a bevel chamfer with a slope height c of 0.1 to 10 mm and an angle of 30 to 60 degrees with the horizontal plane, or a stepped round chamfer with a step height d of 0.1 to 10 mm and a step surface angle of 90 to 120 degrees.

[0012] Preferably, the width L of the upper die is 55-2550 mm, the height H of the upper die is 2-25 mm, the width a of the rectangular groove is 50-2500 mm, the depth b of the rectangular groove is 0.1-20 mm, and the spacing w between adjacent rectangular grooves is 0.5-10 mm.

[0013] Based on the above solution, the bottom surface of the rectangular groove is provided with convex or concave patterns.

[0014] Preferably, the protrusion height of the lines is 0.05 to 15 mm, or the concave depth is 0.05 to 15 mm.

[0015] Preferably, the texture is a raised or concave imitation leather texture, an imitation wood texture, a vertical stripe or an irregular stripe.

[0016] Preferably, the width of the vertical stripes or irregular stripes is 0.5 to 50 mm.

[0017] Another object of the present invention is to provide a paint-free bamboo and wood flooring based on the above-mentioned bamboo and wood flooring hot pressing forming mold, wherein the upper surface edge of the bamboo and wood flooring is provided with a chamfer, and the upper surface and the edge chamfer are covered with a hot-pressed paint-free layer.

[0018] Based on the above solution, the chamfer is a round chamfer, an elliptical chamfer, an oblique chamfer or a stepped round chamfer.

[0019] Preferably, the length of the bamboo wood floor is 1500-18000 mm, the thickness T is 9-300 mm, the width A of the paint-free layer is 50-2500 mm, the height B is 0.1-20 mm, the chamfer is a circular chamfer with a radius R of 0.1-10 mm and a central angle of 30-90 degrees, or an oblique chamfer with a slope height C of 0.1-10 mm and an angle of 30-60 degrees with the horizontal plane, or a stepped circular chamfer with a step height D of 0.1-10 mm and a step surface angle of 90-120 degrees.

[0020] Based on the above solution, the upper surface of the paint-free layer is provided with convex or concave textures.

[0021] Preferably, the protrusion height of the lines is 0.05 to 15 mm, or the concave depth is 0.05 to 15 mm.

[0022] Preferably, the texture is a raised or concave imitation leather texture, an imitation wood texture, a vertical stripe or an irregular stripe.

[0023] Preferably, the width of the vertical stripes or irregular stripes is 0.5 to 50 mm.

[0024] Based on the above solution, the bamboo wood floor is made of bamboo, wood or a mixture of bamboo and wood.

[0025] Another object of the present invention is to provide a preparation process of paint-free bamboo and wood flooring based on the above-mentioned bamboo and wood flooring hot pressing forming mold, including hot pressing and paint-free treatment, wherein the hot pressing and paint-free treatment refers to fixing the floor board with a coated paper on the upper surface on the lower mold of the bamboo and wood flooring hot pressing forming mold, fastening the upper mold to carry out the hot pressing procedure, and hot pressing and forming without paint and chamfering in one step.

[0026] On the basis of the above scheme, the temperature of the hot pressing process is 100-160° C. and the pressure is 15-28 MPa.

[0027] Preferably, the floor board material is a substrate that has not been subjected to a hot pressing process, and the hot pressing process time is 20-60 minutes.

[0028] Preferably, the floor board material is a substrate that has been subjected to a hot pressing process, and the hot pressing process time is 7-20 minutes.

[0029] Based on the above scheme, the floor board material is a substrate that can simultaneously hot-press and paint-free treat at least two bamboo wood floors, the spacing distance W between adjacent bamboo wood floors is 0.5 to 10 mm, and after the substrate is hot-pressed and paint-free treated, the spacing part between adjacent bamboo wood floors is cut off.

[0030] The beneficial effects of the present invention are as follows: the paint-free bamboo and wood floor products formed by the mold of the present invention are simultaneously subjected to paint-free processing and chamfering processing during the hot-pressing paint-free treatment, so that the paint-free surface and the chamfer are formed in one piece, which can avoid cracking, water absorption and mildew at the chamfer, is conducive to outdoor use, expands the scope of application, saves material costs, simplifies processing technology, reduces labor and equipment costs, improves molding efficiency, and has stable product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] The specific embodiments of the present invention are further described in detail below with reference to the accompanying drawings, wherein: Figure 1 It is a cross-sectional schematic diagram of an upper mold of an embodiment of the present invention; Figure 2 This is a schematic cross-sectional view of a substrate after hot pressing and paint-free treatment according to the first embodiment of the present invention; Figure 3 It is a cross-sectional schematic diagram of the upper mold of the second embodiment of the present invention; Figure 4 This is a schematic cross-sectional view of a substrate after hot pressing and paint-free treatment according to the second embodiment of the present invention; Figure 5 It is a cross-sectional schematic diagram of the upper mold of the third embodiment of the present invention; Figure 6 This is a schematic cross-sectional view of a substrate after hot pressing and paint-free treatment according to the third embodiment of the present invention; Figure 7 It is a schematic cross-sectional view of an upper mold of a fourth embodiment of the present invention; Figure 8 This is a schematic cross-sectional view of a substrate after hot pressing and paint-free treatment according to the fourth embodiment of the present invention; Fig. 9 This is a top view of the substrate after hot pressing and paint-free treatment according to the fourth embodiment of the present invention. DETAILED DESCRIPTION

[0032] The present invention is further described in detail below in conjunction with the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more apparent from the following description and claims. It should be noted that the drawings are all in a very simplified form and use non-precise ratios, which are only used to conveniently and clearly assist in explaining the purpose of the embodiments of the present invention.

[0033] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back, etc.) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0034] Embodiment 1 like Figure 1 As shown, this embodiment 1 provides a bamboo and wood floor hot pressing forming mold, including an upper mold and a lower mold, the upper mold is abutted against the top of the floor board, and the lower mold is abutted against the bottom of the floor board and fixes the floor board, wherein ten rectangular grooves are arranged on the bottom surface of the upper mold, the width L of the upper mold is 1550mm, the height H of the upper mold is 20mm, the width a of the rectangular groove is 140mm, the depth b of the rectangular groove is 10mm, the spacing distance w between adjacent rectangular grooves is 10mm, and the bottom edges on both sides of the rectangular groove are provided with inner chamfers, and the inner chamfers are round chamfers with a radius r of 2mm and a central angle of 90 degrees.

[0035] The preparation process of paint-free bamboo and wood flooring based on the hot pressing forming mold of bamboo and wood flooring in Example 1 includes a paint-free treatment process, wherein the hot pressing and paint-free treatment refers to fixing a floor board with a coated paper on the upper surface on the lower mold of the hot pressing forming mold of the bamboo and wood flooring, the floor board is a substrate that has been hot pressed and formed, and the upper mold is fastened to perform a hot pressing procedure. The temperature of the hot pressing procedure is 160°C, the pressure is 15MPa, and the time is 7 minutes. The paint-free and chamfering are hot pressed and formed in one step.

[0036] like Figure 2As shown, a paint-free bamboo and wood flooring is provided based on the hot-pressing forming mold of the bamboo and wood flooring in Example 1, wherein the floor board material is a substrate that can simultaneously perform hot-pressing and paint-free treatment on ten bamboo and wood floors, the spacing distance W between adjacent bamboo and wood floors is 10 mm, a chamfer is provided at the edge of the upper surface of the bamboo and wood flooring, and the upper surface and the edge chamfer are both covered with a hot-pressed paint-free layer, the length of the bamboo and wood flooring is 18000 mm, the thickness T is 300 mm, the width A of the paint-free layer is 140 mm, the height B is 10 mm, the spacing distance W between adjacent paint-free bamboo and wood floors is 10 mm, and the chamfer is a circular chamfer with a radius R of 2 mm and a central angle of 90 degrees.

[0037] Embodiment 2 like Figure 3 As shown, the second embodiment provides a bamboo wood floor hot pressing forming mold, wherein the inner chamfer is an oblique chamfer with a slope height c of 2 mm and an angle of 45 degrees with the horizontal plane, and other structures and methods are the same as those of the first embodiment.

[0038] like Figure 4 As shown, a paint-free bamboo wood flooring is produced based on the bamboo wood flooring hot pressing forming mold of the second embodiment, wherein the chamfer is an oblique chamfer with a slope height C of 2 mm and an angle of 45 degrees with the horizontal plane, and other structures and methods are the same as those of the first embodiment.

[0039] Embodiment 3 like Figure 5 As shown, the third embodiment provides a bamboo wood floor hot pressing forming mold, wherein the inner chamfer is a stepped round chamfer with a step height d of 2 mm and a step surface angle of 90 degrees, and other structures and methods are the same as those of the first embodiment.

[0040] like Figure 6 As shown, a paint-free bamboo wood flooring is produced based on the bamboo wood flooring hot pressing forming mold of Example 3, wherein the chamfer is an oblique chamfer with a step height D of 2 mm and a step surface angle of 90 degrees, and other structures and methods are the same as those of Example 1.

[0041] Embodiment 4 like Figure 7As shown, the fourth embodiment provides a bamboo and wood floor hot pressing forming mold, wherein the upper mold is formed by horizontally splicing and fixing the first, second, third and fourth sub-upper molds, the bottom surface of the first sub-upper mold is provided with two rectangular grooves, the bottom surface of the second sub-upper mold is provided with two rectangular grooves, the bottom surface of the third sub-upper mold is provided with three rectangular grooves, and the bottom surface of the fourth sub-upper mold is provided with three rectangular grooves. The bottom surface of the rectangular groove of the first sub-upper mold is provided with raised imitation wood grain, the bottom surface of the rectangular groove of the second sub-upper mold is provided with raised imitation leather grain, the bottom surface of the rectangular groove of the third sub-upper mold is provided with raised vertical stripes, and the bottom surface of the rectangular groove of the fourth sub-upper mold is provided with raised irregular stripes, the raised height of the grain is 0.5 mm, and the stripe width of the vertical stripes and the irregular stripes is 0.5 mm. Other structures and methods are the same as those in the first embodiment.

[0042] like Figure 8 and Fig. 9 As shown, a paint-free bamboo and wood flooring based on the hot-pressing forming mold of the bamboo and wood flooring of Example 3, wherein there are ten bamboo and wood floors that are simultaneously subjected to hot-pressing and paint-free treatment, and the upper surfaces of the paint-free layers of the first and second bamboo and wood floors from top to bottom are provided with concave imitation wood grain, the upper surfaces of the paint-free layers of the third and fourth bamboo and wood floors are provided with concave imitation leather grain, the upper surfaces of the paint-free layers of the fifth, sixth and seventh bamboo and wood floors are provided with concave vertical stripes, the upper surfaces of the paint-free layers of the eighth, ninth and tenth bamboo and wood floors are provided with concave irregular stripes, the concave depth of the grain is 0.5 mm, the stripe width of the vertical stripes and the irregular stripes is 0.5 mm, and the other structures and methods are the same as those in Example 1.

[0043] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Even if various changes are made to the present invention, if these changes fall within the scope of the claims of the present invention and their equivalents, they still fall within the protection scope of the present invention.

Claims

1. A hot-pressing mold for bamboo and wood flooring, comprising an upper mold and a lower mold, wherein the upper mold abuts against the top of the floor board, and the lower mold abuts against the bottom of the floor board and fixes the floor board, characterized in that: The bottom surface of the upper mold is provided with at least one rectangular groove, the width of the rectangular groove is the same as the width of the bamboo wood floor, and the bottom edges on both sides of the rectangular groove are provided with inner chamfers.

2. The bamboo wood floor hot pressing forming mold according to claim 1, characterized in that: The bottom surface of the upper mold is provided with at least two rectangular grooves, and the spacing distances between adjacent rectangular grooves are the same.

3. The bamboo wood floor hot pressing forming mold according to claim 1, characterized in that: The upper mold is formed by transversely splicing and fixing at least two sub-upper molds, and the bottom surface of each sub-upper mold is provided with at least one rectangular groove, and the spacing distances between adjacent rectangular grooves are the same.

4. A bamboo wood floor hot pressing forming mold according to any one of claims 1 to 3, characterized in that: The inner chamfer is a round chamfer, an elliptical chamfer, an oblique chamfer or a stepped round chamfer.

5. The bamboo wood floor hot pressing forming mold according to claim 4, characterized in that: The width L of the upper die is 55 to 2550 mm, the height H of the upper die is 2 to 25 mm, the width a of the rectangular groove is 50 to 2500 mm, the depth b of the rectangular groove is 0.1 to 20 mm, and the inner chamfer is a round chamfer with a radius r of 0.1 to 10 mm and a central angle of 30 to 90 degrees, or an oblique chamfer with a slope height c of 0.1 to 10 mm and an angle of 30 to 60 degrees with the horizontal plane, or a stepped round chamfer with a step height d of 0.1 to 10 mm and a step surface angle of 90 to 120 degrees.

6. A bamboo wood floor hot pressing forming mold according to claim 2 or 3, characterized in that: The width L of the upper die is 55-2550 mm, the height H of the upper die is 2-25 mm, the width a of the rectangular groove is 50-2500 mm, the depth b of the rectangular groove is 0.1-20 mm, and the spacing w between adjacent rectangular grooves is 0.5-10 mm.

7. The bamboo wood floor hot pressing forming mold according to claim 6, characterized in that: The bottom surface of the rectangular groove is provided with a protrusion with a height of 0.05 to 15 mm, or a concave pattern with a depth of 0.05 to 15 mm.

8. The bamboo wood floor hot pressing forming mold according to claim 7, characterized in that: The texture is a raised or concave imitation leather texture, imitation wood texture, vertical stripes or irregular stripes.

9. The bamboo wood floor hot pressing forming mold according to claim 8, characterized in that: The width of the vertical stripes or irregular stripes is 0.5 to 50 mm.

10. A paint-free bamboo wood flooring based on the bamboo wood flooring hot pressing forming mold according to any one of claims 1 to 9, characterized in that: The upper surface edge of the bamboo wood floor is provided with a chamfer, and the upper surface and the edge chamfer are both covered with a heat-pressed paint-free layer.

11. The paint-free bamboo wood floor according to claim 10, characterized in that: The chamfer is a round chamfer, an elliptical chamfer, an oblique chamfer or a stepped round chamfer.

12. The paint-free bamboo wood floor according to claim 11, characterized in that: The thickness T of the bamboo wood floor is 9 to 300 mm, the width A of the paint-free layer is 50 to 2500 mm, the height B is 0.1 to 20 mm, and the chamfer is a circular chamfer with a radius R of 0.1 to 10 mm and a central angle of 30 to 90 degrees, or an oblique chamfer with a slope height C of 0.1 to 10 mm and an angle of 30 to 60 degrees with the horizontal plane, or a stepped circular chamfer with a step height D of 0.1 to 10 mm and a step surface angle of 90 to 120 degrees.

13. The paint-free bamboo wood floor according to claim 10, characterized in that: The upper surface of the paint-free layer is provided with convex or concave textures.

14. The paint-free bamboo wood floor according to claim 13, characterized in that: The protrusion height of the lines is 0.05 to 15 mm, or the concave depth is 0.05 to 15 mm.

15. The paint-free bamboo wood floor according to claim 14, characterized in that: The texture is a raised or concave imitation leather texture, imitation wood texture, vertical stripes or irregular stripes.

16. The paint-free bamboo wood floor according to claim 15, characterized in that: The width of the vertical stripes or irregular stripes is 0.5 to 50 mm.

17. The paint-free bamboo wood floor according to any one of claims 10-16, characterized in that: The bamboo wood floor is made of bamboo, wood or a mixture of bamboo and wood.

18. A process for preparing paint-free bamboo wood flooring based on the bamboo wood flooring hot pressing forming mold according to any one of claims 1 to 9, comprising hot pressing paint-free treatment, characterized in that: The hot pressing and paint-free treatment refers to fixing the floor board with coated paper on the upper surface on the lower mold of the bamboo wood floor hot pressing molding mold, buckling the upper mold to perform the hot pressing procedure, and hot pressing and chamfering are performed in one step.

19. The process for preparing paint-free bamboo wood flooring according to claim 18, characterized in that: The temperature of the hot pressing process is 100-160° C. and the pressure is 15-28 MPa.

20. The process for preparing paint-free bamboo wood flooring according to claim 19, characterized in that: The floor board is a substrate that has not been subjected to a hot pressing process, and the hot pressing process lasts for 20-60 minutes.

21. The process for preparing paint-free bamboo wood flooring according to claim 19, characterized in that: The floor board material is a substrate that has been subjected to a hot pressing process, and the hot pressing process takes 7 to 20 minutes.

22. A process for preparing paint-free bamboo wood flooring according to any one of claims 18 to 21, characterized in that: The floor board is a substrate that can simultaneously heat-press and paint-free process at least two bamboo wood floors, the spacing distance W between adjacent bamboo wood floors is 0.5-10 mm, and after the substrate is heat-pressed and paint-free process, the spacing part between adjacent bamboo wood floors is cut off.

Citation Information

Cited By

  • Hot-press molding die for bamboo-wood floor and use thereof

    WO2026091998A1