Glue manufacturing process, glue, Bundy wire manufacturing process and Bundy wire

The glue made by stirring the polybutene adhesive and other ingredients in the production of Bondi line, and through multiple soaking and drying, the problem of low adhesion of Bondi line is solved, improving Bondi The mass and adhesion of the wire reduce the occurrence of looseness.

CN119242214APending Publication Date: 2025-01-03DONGGUAN ZEFENG WIRE IND CO LTD
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Patent Information

Application Number
CN202411338442.7
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-09-25
Publication Date
2025-01-03

AI Technical Summary

Technical Problem

The glue used in the production of existing Bondi lines has poor adhesion effect, which leads to the phenomenon of loose stocks and poor quality during use.

Method used

Using a process, the glue made by stirring a polybutene binder with purified water, ammonium hydroxide, coupling agent, phosphorus-free agent, emulsifier and polyacrylamide in a specific proportion, and through multiple soaking and Dry the process to increase the adhesion of the Bondi line.

Benefits of technology

It significantly improves the adhesion and quality of the Bondi line, reduces the probability of loosening, enhances the adhesion and surface gloss of the glue, and shortens the adhesion and curing time.

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Abstract

The invention discloses a glue manufacturing process, glue, a Bundy wire manufacturing process and a Bundy wire. Relates to the technical field of Bundy wire manufacturing. The glue manufacturing process comprises the following steps: pouring a polybutylene adhesive and purified water into a stirring container for first stirring, and after the first stirring is completed, pouring ammonium hydroxide into the stirring container for second stirring; after the second stirring is completed, a coupling agent and a degreasing agent are poured into the stirring container for third stirring; after the third stirring is completed, the non-phosphorus agent and the emulsifier are poured into the stirring container for fourth stirring, and after the fourth stirring is completed, polyacrylamide is poured into the stirring container for fifth stirring, and the glue is obtained. The glue manufactured by the glue manufacturing process can be applied to the Bundy line, the adhesion effect of the glue is relatively good, and the adhesion degree of the Bundy line can be improved, so that the quality of the Bundy line is improved, and the probability that the Bundy line is loose can be reduced.
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Description

Technical Field

[0001] The present application relates to the technical field of bond wire manufacturing, and in particular to a glue manufacturing process, glue, a bond wire manufacturing process and a bond wire. Background Art

[0002] Bondi thread usually refers to a specially treated sewing thread, which may be made of nylon, polyester or other synthetic fibers, and has the characteristics of high strength, wear resistance, water resistance, chemical corrosion resistance, etc. This thread is often used in sewing tasks that require high strength and durability, such as sewing car seats, airbags, parachutes, diving suits, etc. During the production process, the bondi thread needs to be attached with glue on the outer surface to prevent the bondi thread from becoming untied during use.

[0003] However, the glue used in the production of the Band-Aid wire in the related art has a poor adhesion effect, and the adhesion of the Band-Aid wire is poor. During use, the glue is easy to fall off, and the Band-Aid wire is easy to become loose, resulting in poor quality. Summary of the invention

[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a glue manufacturing process, glue, a bond wire manufacturing process and a bond wire, wherein the glue has a good bonding effect and can improve the bonding degree of the bond wire, thereby improving the quality of the bond wire.

[0005] The glue manufacturing process according to the first aspect of the present application includes:

[0006] Pour the polybutene adhesive and pure water into a stirring container for first stirring; wherein the weight ratio of the polybutene adhesive to the pure water is 1:2.7-2.9;

[0007] After the first stirring is completed, ammonium hydroxide is poured into the stirring container for a second stirring; wherein the weight ratio between the polybutene adhesive and the ammonium hydroxide is 1:0.003-0.005;

[0008] After the second stirring is completed, the coupling agent and the degreasing agent are poured into the stirring container for a third stirring; wherein the weight ratio of the polybutene adhesive, the coupling agent, and the degreasing agent is 1:0.21-0.23:0.06-0.08;

[0009] After the third stirring is completed, the phosphorus-free agent and the emulsifier are poured into the stirring container for the fourth stirring; wherein the weight ratio of the polybutene adhesive, the phosphorus-free agent and the emulsifier is 1:0.21-0.23:0.28-0.30;

[0010] After the fourth stirring is completed, polyacrylamide is poured into the stirring container for a fifth stirring to obtain the target glue; wherein the weight ratio between the polybutene adhesive and the polyacrylamide is 1:0.007-0.009.

[0011] According to the glue manufacturing process of the embodiment of the present application, at least the following beneficial effects are achieved: In the glue manufacturing process of the present application, the polybutene adhesive and the pure water are first poured into a stirring container for a first stirring. Polybutene is a high molecular weight inert polymer. As an adhesive for the bonded wire, it can make the strands adhere to each other, improve the adhesion of the bonded wire, and reduce the probability of the bonded wire becoming loose during use. Ammonium hydroxide has a cleaning effect, which acts on the surface of the wire to play a cleaning role, enhances the adhesion of polybutene on the surface of the wire, and makes it adhere better. The curing agent has the function of consolidating the surface, improving permeability and adhesion, and is fused with the main glue polybutene to improve the hardness, brightness, adhesion and chemical stability of the adhesive film, reduce the time required for the bottom layer to dry, so that the strands are completely penetrated, adhered together more quickly, and the curing speed of the wire adhesion is improved, the adhesion curing time of the bonded wire is shortened, and the drying speed of the water-based glue is accelerated, and the surface of the wire is consolidated and formed to achieve the effect of non-adhesion between the wires. Coupling agent is an organosilicon compound with a special structure. It is used as a surface modifier. When it is used to fill plastics with inorganic fillers, it can improve its dispersibility and adhesion, increase the internal bonding strength, consolidate the surface and prevent adhesion, and shorten the adhesion curing time. Degreasing agent can remove oil stains on the wire, improve the surface quality and glossiness of the Bundy wire, make the Bundy wire have good adhesion effect and more glossy surface. Phosphorus-free agent not only has water softening effect but also degreasing effect, which can further improve the adhesion effect of the Bundy wire. The role of emulsifier is to stabilize the emulsion. It can reduce the interfacial tension between droplets and form a firm emulsified film, thereby preventing droplets from aggregating and separating. This makes the formed emulsion more stable. In the production process, emulsifiers can improve plasticity and brittleness, prevent adhesion during production, and thus improve production efficiency. The solution of polyacrylamide has a certain viscosity, which can promote the adhesion of water-based glue and promote its use. Therefore, the glue manufactured by the glue manufacturing process of the embodiment of the present application can be used in the Band-Aid wire. The glue has a good adhesion effect, can improve the adhesion of the Band-Aid wire, thereby improving the quality of the Band-Aid wire, and can reduce the probability of the Band-Aid wire becoming loose.

[0012] According to some embodiments of the present application, the stirring time of the first stirring is 15 minutes; the stirring time of the second stirring is 10 minutes.

[0013] According to some embodiments of the present application, the third duration of the third stirring is 15 minutes; the stirring duration of the fourth stirring is 10 minutes; and the stirring duration of the fifth stirring is 60 minutes.

[0014] The second aspect embodiment of the present application provides a glue, including polybutene adhesive, pure water, ammonium hydroxide, curing agent, coupling agent, degreasing agent, phosphorus-free agent, emulsifier and polyacrylamide, and the weight ratio of the polybutene adhesive, pure water, ammonium hydroxide, curing agent, coupling agent, degreasing agent, phosphorus-free agent, emulsifier and polyacrylamide is 1:2.7~2.9:0.003~0.005:0.9~1.1:0.21~0.23:0.06~0.08:0.21~0.23:0.28~0.30:0.007~0.009.

[0015] The third aspect of the present application provides a glue, which is manufactured according to the glue manufacturing process described in any one of the first aspect embodiments.

[0016] A fourth aspect of the present application provides a process for manufacturing a bondi wire, including:

[0017] Twisting multiple strands of fine wire to obtain semi-finished bonded wire;

[0018] Put the semi-finished bonded wire into glue for a first soaking;

[0019] Performing a first drying on the semi-finished product of the bondi line after the first soaking;

[0020] Putting the semi-finished bonded wire that has completed the first drying into glue for a second soaking; wherein the glue used for the first soaking and the second soaking are both the glue described in the embodiment of the third aspect;

[0021] Performing a second drying on the semi-finished product of the bondi line after the second soaking;

[0022] The semi-finished bonded wire that has completed the second drying is subjected to surface smoothing treatment to obtain a finished bonded wire.

[0023] According to some embodiments of the present application, the first drying of the semi-finished product of the bondi line after the first soaking includes:

[0024] The semi-finished bonded wire that has completed the first immersion is dried for a first period of time, so that the glue attached to the outer surface of the semi-finished bonded wire is in a semi-dry state;

[0025] The second drying of the semi-finished product of the bondi line after the second soaking comprises:

[0026] The semi-finished Bondi wire that has completed the second immersion is dried for a second period of time, so that the glue attached to the outer surface of the semi-finished Bondi wire is in a completely dry and solidified state; wherein the second period of time is greater than the first period of time.

[0027] According to some embodiments of the present application, the surface smoothing treatment is performed on the semi-finished bonded wire that has completed the second drying to obtain a finished bonded wire, including:

[0028] Performing a first surface smoothing treatment on the semi-finished bonded wire that has completed the second drying to remove attachments on the outer surface of the semi-finished bonded wire;

[0029] The semi-finished Bondi wire that has completed the second surface smoothing treatment is subjected to a second surface smoothing treatment so that a protective layer is formed on the outer surface of the semi-finished Bondi wire to obtain the finished Bondi wire.

[0030] According to some embodiments of the present application, after performing surface smoothing treatment on the semi-finished bonded wire that has completed the second drying to obtain a finished bonded wire, the method further includes:

[0031] The finished product bondi line is rolled up in a receiving shaft.

[0032] The fifth aspect embodiment of the present application provides a Bondi wire, which is manufactured according to the Bondi wire manufacturing process described in any one of the fourth aspect embodiments of the present application.

[0033] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] The present application is further described below with reference to the accompanying drawings and embodiments, wherein:

[0035] Figure 1 A schematic diagram of the steps of the glue manufacturing process according to an embodiment of the present application;

[0036] Figure 2 A schematic diagram of the steps of the manufacturing process of the bondi wire according to an embodiment of the present application;

[0037] Figure 3 for Figure 2 A specific flow chart of step S260 in FIG. DETAILED DESCRIPTION

[0038] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0039] In the description of the present application, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0040] In the description of this application, "several" means more than one, "more" means more than two, "greater than", "less than", "exceed", etc. are understood to exclude the number itself, and "above", "below", "within", etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0041] In the description of this application, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in this application based on the specific content of the technical solution.

[0042] In the description of the present application, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0043] The first aspect of the present application provides a glue manufacturing process, and the glue prepared by the glue manufacturing process is used in the production of bondi wire. Figure 1 , Figure 1 1 is a schematic diagram of the steps of the glue manufacturing process of the embodiment of the present application. The glue manufacturing process of the embodiment of the present application may include but is not limited to the following steps:

[0044] Step S110, pouring the polybutene adhesive and pure water into a stirring container for first stirring; wherein the weight ratio of the polybutene adhesive to the pure water is 1:2.7-2.9;

[0045] Step S120, after the first stirring is completed, pouring ammonium hydroxide into the stirring container for second stirring; wherein the weight ratio between the polybutene adhesive and the ammonium hydroxide is 1:0.003-0.005;

[0046] Step S130, after the second stirring is completed, pouring the coupling agent and the degreasing agent into the stirring container for a third stirring; wherein the weight ratio of the polybutene adhesive, the coupling agent, and the degreasing agent is 1:0.21-0.23:0.06-0.08;

[0047] Step S140, after the third stirring is completed, pouring the phosphorus-free agent and the emulsifier into the stirring container for a fourth stirring; wherein the weight ratio of the polybutene adhesive, the phosphorus-free agent and the emulsifier is 1:0.21-0.23:0.28-0.30;

[0048] Step S150, after the fourth stirring is completed, pouring polyacrylamide into the stirring container and performing the fifth stirring to obtain the target glue; wherein the weight ratio between the polybutene adhesive and the polyacrylamide is 1:0.007-0.009.

[0049] Based on the above steps S110 to S150, in the glue manufacturing process of the present application, polybutene adhesive and pure water are first poured into a stirring container for the first stirring. Polybutene is a high molecular inert polymer. As an adhesive for a bonded line, it can make the strands adhere to each other, improve the adhesion of the bonded line, and reduce the probability of loosening of the bonded line during use. Ammonium hydroxide has a cleaning effect, acts on the surface of the line to play a cleaning role, enhances the adhesion of polybutene on the surface of the line, and makes it adhere better. The curing agent has the functions of consolidating the surface layer, improving permeability and adhesion, and merging with the main glue polybutene to improve the hardness, brightness, adhesion and chemical stability of the film, reduce the time required for the bottom layer to dry, and make the strands completely penetrated, adhere together more quickly, improve the curing speed of the line adhesion, shorten the adhesion curing time of the bonded line, speed up the drying speed of the water-based glue, and the surface of the line is consolidated and formed to achieve the effect of non-adhesion between the lines. Coupling agent is an organosilicon compound with a special structure. It is used as a surface modifier. When it is used to fill plastics with inorganic fillers, it can improve its dispersibility and adhesion, increase the internal bonding strength, consolidate the surface and prevent adhesion, and shorten the adhesion curing time. Degreasing agent can remove oil stains on the wire, improve the surface quality and glossiness of the Bundy wire, make the Bundy wire have good adhesion effect and more glossy surface. Phosphorus-free agent not only has water softening effect but also degreasing effect, which can further improve the adhesion effect of the Bundy wire. The role of emulsifier is to stabilize the emulsion. It can reduce the interfacial tension between droplets and form a firm emulsified film, thereby preventing droplets from aggregating and separating. This makes the formed emulsion more stable. In the production process, emulsifiers can improve plasticity and brittleness, prevent adhesion during production, and thus improve production efficiency. The solution of polyacrylamide has a certain viscosity, which can promote the adhesion of water-based glue and promote its use. Therefore, the glue manufactured by the glue manufacturing process of the embodiment of the present application can be used in the Band-Aid wire. The glue has a good adhesion effect, can improve the adhesion of the Band-Aid wire, thereby improving the quality of the Band-Aid wire, and can reduce the probability of the Band-Aid wire becoming loose.

[0050] Exemplarily, in step S110, the weight of the polybutene adhesive PB is 1, and the weight of the pure water H2O can be 2.7 or 2.8 or 2.9; in step S120, the weight of ammonium hydroxide NH40H is 0.003 or 0.004 or 0.005, and in step S130, the weight of the curing agent B49 is 0.9 or 1 or 1.1; in step S140, the weight of the coupling agent CLD is 0.21 or 0.22 or 0.23, and the weight of the degreasing agent R20 is 0.06 or 0.07 or 0.08; in step S150, the weight of the phosphorus-free agent DG is 0.21 or 0.22 or 0.23, and the weight of the emulsifier A6D is 0.28 or 0.29 or 0.30; in step S160, the weight of the polyacrylamide FM80 is 0.007 or 0.008 or 0.009.

[0051] It is worth noting that the stirring time of the first stirring is 15 minutes, the stirring time of the second stirring is 10 minutes, the stirring time of the third stirring is 15 minutes, the stirring time of the fourth stirring is 10 minutes, and the stirring time of the fifth stirring is 60 minutes.

[0052] It is worth noting that the first stirring, the second stirring, the third stirring, the fourth stirring and the fifth stirring are all carried out at room temperature.

[0053] The second aspect embodiment of the present application provides a glue, including polybutene adhesive, pure water, ammonium hydroxide, a curing agent, a coupling agent, a degreasing agent, a phosphorus-free agent, an emulsifier and polyacrylamide, and the weight ratio of polybutene adhesive, pure water, ammonium hydroxide, a curing agent, a coupling agent, a degreasing agent, a phosphorus-free agent, an emulsifier and polyacrylamide is 1: 2.7~2.9: 0.003~0.005: 0.9~1.1: 0.21~0.23: 0.06~0.08: 0.21~0.23: 0.28~0.30: 0.007~0.009.

[0054] Exemplarily, in the glue of the embodiment of the second aspect, the weight of the polybutene adhesive PB is 1, the weight of the pure water H2O can be 2.7 or 2.8 or 2.9, the weight of ammonium hydroxide NH40H is 0.003 or 0.004 or 0.005, the weight of the curing agent B49 is 0.9 or 1 or 1.1, the weight of the coupling agent CLD is 0.21 or 0.22 or 0.23, the weight of the degreaser R20 is 0.06 or 0.07 or 0.08, the weight of the phosphorus-free agent DG is 0.21 or 0.22 or 0.23, the weight of the emulsifier A6D is 0.28 or 0.29 or 0.30, and the weight of the polyacrylamide FM80 is 0.007 or 0.008 or 0.009.

[0055] The third aspect embodiment of the present application provides a glue, which is manufactured according to the glue manufacturing process of the first aspect embodiment.

[0056] Since the glue is manufactured according to the glue manufacturing process of the embodiment of the first aspect, the corresponding content of the glue manufacturing process in the embodiment mentioned in the first aspect is also applicable to the glue in the embodiment mentioned in the third aspect, and has the same implementation principle and technical effect. In order to avoid redundant description, it will not be described in detail here.

[0057] The fourth aspect of the present application provides a process for manufacturing a bondi wire. Figure 2 , Figure 2 The process flow diagram of the manufacturing process of the bondi wire in the embodiment of the present application is as follows. The manufacturing process of the bondi wire may include but is not limited to the following steps:

[0058] Step S210, twisting the multiple strands of fine wire to obtain a semi-finished bonded wire;

[0059] Step S220, placing the semi-finished bond wire into glue for a first soaking;

[0060] Step S230, performing a first drying on the semi-finished bonded wire that has completed the first soaking;

[0061] Step S240, placing the semi-finished bonded wire that has completed the first drying into glue for a second soaking; wherein the glue used for the first soaking and the second soaking is the glue of the embodiment of the third aspect;

[0062] Step S250, performing a second drying on the semi-finished bonded wire that has completed the second soaking;

[0063] Step S260, performing surface smoothing treatment on the semi-finished bonded wire that has completed the second drying to obtain a finished bonded wire.

[0064] The manufacturing process of the bonded wire of the embodiment of the present application, through the above steps S210 to S260, after the semi-finished bonded wire is obtained by twisting, the semi-finished bonded wire is first immersed in glue for a first time, so that the semi-finished bonded wire is attached with glue, and then the first drying is performed. After the first drying is completed, the semi-finished bonded wire that has completed the first drying is placed in glue for a second immersion, so that the semi-finished bonded wire is attached with glue again, and then the second drying is performed. By immersing and drying twice, the glue on the semi-finished bonded wire can be made stronger and not easy to fall off, thereby improving the quality of the bonded wire. Then the semi-finished bonded wire that has completed the second immersion is dried for a second time, and the semi-finished bonded wire that has completed the second drying is subjected to a surface smoothing treatment to obtain a finished bonded wire.

[0065] In addition, since the glue used in the first immersion and the second immersion is the glue of the third aspect embodiment, and the glue of the third aspect embodiment is obtained by the glue manufacturing process of the first aspect embodiment, the quality of the bondi wire manufactured by the bondi wire manufacturing process of the embodiment of the present application is high, and the probability of loosening of the bondi wire can be reduced. And the corresponding content of the glue manufacturing process in the embodiment mentioned in the first aspect is also applicable to the bondi wire manufacturing process in the embodiment mentioned in the fourth aspect, and has the same implementation principle and technical effect. In order to avoid redundant description, it will not be described in detail here.

[0066] It is understandable that the semi-finished product of the first soaking is first dried, including:

[0067] The semi-finished bonded wire that has completed the first immersion is dried for a first period of time, so that the glue attached to the outer surface of the semi-finished bonded wire is in a semi-dry state;

[0068] The semi-finished product of the bondi line that has completed the second soaking is subjected to the second drying, including:

[0069] The semi-finished Bondi wire that has completed the second immersion is dried for a second period of time, so that the glue attached to the outer surface of the semi-finished Bondi wire is in a completely dry and solidified state; wherein the second period of time is greater than the first period of time.

[0070] Specifically, the semi-finished bonded wire is first soaked, and then dried for a short time. After the first drying, the glue on the semi-finished bonded wire is in a semi-dry state. Then the semi-finished bonded wire is soaked for a second time, so that the semi-finished bonded wire is attached with glue again. Then the semi-finished bonded wire is dried for a longer time, so that the glue on the semi-finished bonded wire is completely dried and solidified. In this way, after two soakings and the first and second dryings, the glue on the semi-finished bonded wire is firmer and less likely to fall off, thereby improving the quality of the bonded wire.

[0071] It is understandable that, referring to Figure 3 , Figure 3 for Figure 2 A specific flow diagram of step S260 in FIG. The surface of the semi-finished bonded wire that has completed the second drying is smoothed to obtain a finished bonded wire, including but not limited to the following steps:

[0072] Step S310, performing a first surface smoothing treatment on the semi-finished bonded wire that has completed the second drying to remove attachments on the outer surface of the semi-finished bonded wire;

[0073] Exemplarily, the semi-finished bond wire is polished by a polishing roller, and when the polishing roller rubs against the semi-finished bond wire, the attachments on the outer surface of the semi-finished bond wire can be removed, such as the lumps of bond glue on the outer surface of the semi-finished bond wire, so that the outer surface of the semi-finished bond wire is smooth. In one embodiment, the polishing material is polyurethane, and those skilled in the art can set a specific polishing material according to actual needs.

[0074] Step S320, performing a second surface smoothing treatment on the semi-finished Bondi wire that has completed the second surface smoothing treatment, so that a protective layer is formed on the outer surface of the semi-finished Bondi wire, thereby obtaining a finished Bondi wire.

[0075] Exemplarily, the semi-finished Bondi wire is first heated, and then brought into contact with wax, so that the wax melts and adheres to the outer surface of the semi-finished Bondi wire, forming a protective layer on the outer surface of the semi-finished Bondi wire.

[0076] After the semi-finished product of the second drying is subjected to surface smoothing treatment to obtain the finished product of the bonded line, the method further includes:

[0077] The finished bondi wire is rolled up on the take-up reel.

[0078] Specifically, the finished product bonded wire is wound on the receiving shaft, which is convenient for collecting and carrying the bonded wire.

[0079] The fifth aspect embodiment of the present application provides a Bondi wire, which is manufactured by the Bondi wire manufacturing process of the fourth aspect embodiment.

[0080] Since the Bondi wire is manufactured by the Bondi wire manufacturing process of the fourth aspect embodiment, the corresponding content of the Bondi wire manufacturing process in the embodiment mentioned in the fourth aspect is also applicable to the Bondi wire in the embodiment mentioned in the fifth aspect, and has the same implementation principle and technical effect. In order to avoid redundant description, it will not be described in detail here.

[0081] The embodiments of the present application are described in detail above in conjunction with the accompanying drawings, but the present application is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the present application. In addition, the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

Claims

1. A glue manufacturing process, characterized in that: include: Pour the polybutene adhesive and pure water into a stirring container for first stirring; wherein the weight ratio of the polybutene adhesive to the pure water is 1:2.7-2.9; After the first stirring is completed, ammonium hydroxide is poured into the stirring container for a second stirring; wherein the weight ratio between the polybutene adhesive and the ammonium hydroxide is 1:0.003-0.005; After the second stirring is completed, the coupling agent and the degreasing agent are poured into the stirring container for a third stirring; wherein the weight ratio of the polybutene adhesive, the coupling agent, and the degreasing agent is 1:0.21-0.23:0.06-0.08; After the third stirring is completed, the phosphorus-free agent and the emulsifier are poured into the stirring container for the fourth stirring; wherein the weight ratio of the polybutene adhesive, the phosphorus-free agent and the emulsifier is 1:0.21-0.23:0.28-0.30; After the fourth stirring is completed, polyacrylamide is poured into the stirring container for a fifth stirring to obtain the target glue; wherein the weight ratio between the polybutene adhesive and the polyacrylamide is 1:0.007-0.

009.

2. The glue manufacturing process according to claim 1, characterized in that: The stirring time of the first stirring is 15 minutes; the stirring time of the second stirring is 10 minutes.

3. The glue manufacturing process according to claim 2, characterized in that: The third duration of the third stirring is 15 minutes; the stirring duration of the fourth stirring is 10 minutes; and the stirring duration of the fifth stirring is 60 minutes.

4. A glue, characterized in that: The invention comprises polybutene adhesive, purified water, ammonium hydroxide, curing agent, coupling agent, degreasing agent, phosphorus-free agent, emulsifier and polyacrylamide, and the weight ratio of the polybutene adhesive, purified water, ammonium hydroxide, curing agent, coupling agent, degreasing agent, phosphorus-free agent, emulsifier and polyacrylamide is 1: 2.7-2.9: 0.003-0.005: 0.9-1.1: 0.21-0.23: 0.06-0.08: 0.21-0.23: 0.28-0.30: 0.007-0.

009.

5. A glue, characterized in that: The method is manufactured according to the glue manufacturing process according to any one of claims 1 to 3.

6. A process for manufacturing a bondi wire, characterized in that: include: Twisting multiple strands of fine wire to obtain semi-finished bonded wire; Put the semi-finished bonded wire into glue for a first soaking; Performing a first drying on the semi-finished product of the bondi line after the first soaking; Putting the semi-finished bonded wire that has completed the first drying into glue for a second soaking; wherein the glue used for the first soaking and the second soaking is the glue described in claim 5; Performing a second drying on the semi-finished product of the bondi line after the second soaking; The semi-finished bonded wire that has completed the second drying is subjected to surface smoothing treatment to obtain a finished bonded wire.

7. The process for manufacturing the bondi wire according to claim 6, characterized in that: The first drying of the semi-finished product of the bondi line after the first soaking comprises: The semi-finished bonded wire that has completed the first immersion is dried for a first period of time, so that the glue attached to the outer surface of the semi-finished bonded wire is in a semi-dry state; The second drying of the semi-finished product of the bondi line after the second soaking comprises: The semi-finished Bondi wire that has completed the second immersion is dried for a second period of time, so that the glue attached to the outer surface of the semi-finished Bondi wire is in a completely dry and solidified state; wherein the second period of time is greater than the first period of time.

8. The process for manufacturing the bondi wire according to claim 6, characterized in that: The step of performing a surface smoothing treatment on the semi-finished bonded wire that has completed the second drying to obtain a finished bonded wire comprises: Performing a first surface smoothing treatment on the semi-finished bonded wire that has completed the second drying to remove attachments on the outer surface of the semi-finished bonded wire; The semi-finished Bondi wire that has completed the second surface smoothing treatment is subjected to a second surface smoothing treatment so that a protective layer is formed on the outer surface of the semi-finished Bondi wire to obtain the finished Bondi wire.

9. The process for manufacturing the bondi wire according to claim 6, characterized in that: After the surface of the semi-finished bonded wire that has completed the second drying is smoothed to obtain a finished bonded wire, the method further includes: The finished product bondi wire is rolled up in a receiving shaft.

10. A bondi line, characterized in that: It is manufactured according to the Bondi wire manufacturing process according to any one of claims 6 to 9.