Vacuum device of sputter coating machine

Abstract

The invention provides a vacuum device of a sputter coating machine, which comprises a process cavity, a wafer lifting mechanism connected with the process cavity through a first through hole, a wafer jacking assembly connected with the process cavity through a second through hole, a wafer conveying port arranged on one side of the process cavity, and a vacuum pump water cooling mechanism arranged on the other side of the process cavity. A vacuum gate valve mechanism is arranged between the vacuum pump water cooling mechanism and the process cavity, a target opening and closing mechanism is arranged above the process cavity, and the target opening and closing mechanism is connected with the process cavity in a turnover mode through a turnover mechanism arranged on the side edge. An upper adapter plate is arranged between the top of the process cavity and the target opening and closing mechanism, the upper adapter plate is of a hollow annular structure, the annular structure is provided with a first step, the first step is connected with one end of an anti-adhesion plate, the other end of the anti-adhesion plate is provided with a clamping ring, and when the wafer jacking assembly jacks a wafer upwards to the clamping ring, the clamping ring is clamped by the clamping ring. And the wafer is clamped between the clamping ring and the tray through the clamping ring to be fixed, so that the wafer does not displace during film coating, and the film coating accuracy is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of sputtering coating, and more specifically, to a vacuum device of a sputtering coating machine. Background Art

[0002] Sputtering coating technology uses ions to bombard the surface of the target material. The phenomenon of atoms of the target material being knocked out is called sputtering. The atoms generated by sputtering are deposited on the surface of the substrate to form a film, which is called sputtering coating. In order to obtain high-quality thin films, a certain amount of working gas is filled in the magnetron sputtering device. By applying voltage to the two corresponding electrode plates, sufficient energy can be obtained under the electric field generated by the electrode plates, thereby colliding with the gas molecules between the electrode plates, ionizing, and generating ions. The ions collide with the target material under the action of the electric and magnetic fields, and the atoms of the target material are sputtered and deposited on the substrate to form a film. Accurately control the reaction gas pressure, the distance between the target material and the substrate, the sputtering power and other parameters to accurately control the deposition rate to obtain high-quality thin film materials.

[0003] The air pressure energy generated during sputtering coating in the prior art may cause the wafer to vibrate and displace, resulting in low coating accuracy. Therefore, it is necessary to provide a device that can fix the wafer when necessary. Summary of the invention

[0004] In view of this, in order to solve the above problems, the present invention proposes a vacuum device of a sputtering coating machine, comprising a process chamber 1, a first through hole 11 is opened at the bottom of the process chamber 1, a wafer lifting mechanism 2 is connected to the process chamber 1 through the first through hole 11, a second through hole 12 is opened at the bottom of the process chamber 1, the second through hole 12 is arranged on the side of the first through hole 11, a wafer lifting assembly 3 is connected to the process chamber 1 through the second through hole 12, a wafer conveying port 13 is arranged on one side of the process chamber 1, and a vacuum pump water cooling mechanism 4 is arranged on the other side, and a vacuum gate valve mechanism 5 is arranged between the vacuum pump water cooling mechanism 4 and the process chamber 1 for isolating the vacuum pump water cooling mechanism 4 from the process chamber 1. Structure 4 and process chamber 1, a target opening and closing mechanism 6 is provided above the process chamber 1, and the target opening and closing mechanism 6 is flipably connected to the process chamber 1 through a flip mechanism 9 arranged on the side; an upper adapter plate 8 is provided between the top of the process chamber 1 and the target opening and closing mechanism 6, and the upper adapter plate 8 is a hollow annular structure, and a first step 81 is provided on the annular structure, and the first step 81 is connected to one end of an anti-sticking plate 85, and a clamping ring 86 is provided at the other end of the anti-sticking plate 85. When the wafer lifting assembly 3 lifts the wafer upward to the clamping ring 86, the wafer is clamped between the clamping ring 86 and the tray by the clamping ring 86 to fix it, so that the wafer will not be displaced during coating, thereby improving the coating accuracy.

[0005] A vacuum device of a sputtering coating machine includes a process chamber 1, characterized in that: a first through hole 11 is opened at the bottom of the process chamber 1, a wafer lifting mechanism 2 is connected to the process chamber 1 through the first through hole 11, a second through hole 12 is opened at the bottom of the process chamber 1, the second through hole 12 is arranged on the side of the first through hole 11, a wafer lifting assembly 3 is connected to the process chamber 1 through the second through hole 12, a wafer conveying port 13 is arranged on one side of the process chamber 1, a vacuum pump water cooling mechanism 4 is arranged on the other side, a vacuum gate valve mechanism 5 is arranged between the vacuum pump water cooling mechanism 4 and the process chamber 1, for isolating the vacuum A pump water cooling mechanism 4 and a process chamber 1, a target opening and closing mechanism 6 is provided above the process chamber 1, and the target opening and closing mechanism 6 is flippably connected to the process chamber 1 through a flip mechanism 9 arranged on the side; an upper adapter plate 8 is provided between the top of the process chamber 1 and the target opening and closing mechanism 6, and the upper adapter plate 8 is a hollow annular structure, and a first step 81 is provided on the annular structure, and the first step 81 is connected to one end of an anti-sticking plate 85, and a clamping ring 86 is provided at the other end of the anti-sticking plate 85, and when the wafer lifting assembly 3 lifts the wafer upward to the clamping ring 86, the wafer is clamped and fixed between the clamping ring 86 and the tray through the clamping ring 86.

[0006] Furthermore, the anti-scratch plate 85 is a hollow annular structure, and the anti-scratch plate 85 includes a first folded edge 851, a side wall 852, a bottom plate 853, and a second folded edge 854. A first folded edge 851 folded outward is provided above the side wall 852 of the anti-scratch plate 85, and a second folded edge 854 folded upward is provided on the inner edge of the bottom plate 853 of the anti-scratch plate 85. The first folded edge 851 is connected to the first step 81, and the second folded edge 854 is clamped with the clamping ring 86.

[0007] Furthermore, the clamping ring 86 is a hollow annular structure, and is provided with a third folded edge 861 folded outward for connecting with the bottom plate 853 of the anti-slip plate 85. The clamping ring 86 is provided with a circle of grooves 862, and the second folded edge 854 of the anti-slip plate 85 is clamped in the groove 862.

[0008] Furthermore, a downwardly bent clamping portion 863 is provided on the inner edge of the top of the clamping ring 86. The clamping portion 863 includes a plurality of clamping surfaces 8631. The clamping surfaces 8631 are arranged in sequence on the clamping portion 863 according to their sizes to accommodate wafers of different specifications.

[0009] Furthermore, a second step 82 is provided on the annular structure. The second step 82 is located on the outer circle of the first step 81 and is higher than the first step 81. A circle of ceramic rings 83 is provided on the second step 82 to ensure that the process chamber 1 is sealed when closed and resistant to high temperatures when the process chamber 1 is heated.

[0010] Furthermore, an anti-stick plate clamp 84 is provided above the first folded edge 851 of the anti-stick plate 85, one end of the anti-stick plate clamp 84 is clamped between the bottom surface of the ceramic ring 83 and the first folded edge 851, and the other end is placed on the inner side of the inner wall of the ceramic ring 83, so that the connection between the anti-stick plate 85 and the ceramic ring 83 is more stable.

[0011] Furthermore, a heating device is provided in the process chamber 1, and a temperature sensor assembly is provided on the outer wall 852 of the process chamber 1 for detecting the temperature of the heating in the chamber.

[0012] Furthermore, the side wall 852 of the process chamber 1 is also provided with an observation window 14, the inner side of the observation window 14 is a transparent window for easy observation of the situation in the chamber, and the outer side of the observation window 14 is hinged with a cover plate, which is closed during operation to shield the strong light generated during coating.

[0013] Furthermore, a magnet rotating mechanism is provided in the target opening and closing mechanism 6, and the magnet rotating mechanism includes a magnet and a rotating mechanism. The magnet is arranged below the rotating mechanism, and the rotating mechanism passes through the upper cover plate in the target opening and closing mechanism 6 to be connected with the magnet. The rotating mechanism drives the magnet to rotate so that the magnetic field generated by the magnet rotates, so that the ion distribution in the process chamber 1 is more uniform, thereby making the coating more uniform.

[0014] Beneficial effects of the present invention: The present invention proposes a vacuum device of a sputtering coating machine, comprising a process chamber 1, a first through hole 11 is provided at the bottom of the process chamber 1, a wafer lifting mechanism 2 is connected to the process chamber 1 through the first through hole 11, a second through hole 12 is also provided at the bottom of the process chamber 1, the second through hole 12 is provided on the side of the first through hole 11, a wafer lifting assembly 3 is connected to the process chamber 1 through the second through hole 12, a wafer conveying port 13 is provided on one side of the process chamber 1, a vacuum pump water cooling mechanism 4 is provided on the other side, a vacuum gate valve mechanism 5 is provided between the vacuum pump water cooling mechanism 4 and the process chamber 1, for isolating the vacuum pump water cooling mechanism 4 The process chamber 1 is provided with a target opening and closing mechanism 6 above the process chamber 1, and the target opening and closing mechanism 6 is flippably connected to the process chamber 1 through a flipping mechanism 9 arranged on the side; an upper adapter plate 8 is provided between the top of the process chamber 1 and the target opening and closing mechanism 6, and the upper adapter plate 8 is a hollow annular structure, and a first step 81 is provided on the annular structure, and the first step 81 is connected to one end of an anti-sticking plate 85, and a clamping ring 86 is provided at the other end of the anti-sticking plate 85. When the wafer lifting assembly 3 lifts the wafer upward to the clamping ring 86, the wafer is clamped between the clamping ring 86 and the tray through the clamping ring 86 to fix it, so that the wafer will not be displaced during coating, thereby improving the coating accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is an overall cross-sectional view of the vacuum device of the sputtering coating machine of the present invention.

[0016] Figure 2 It is an overall structural diagram of the vacuum device of the sputtering coating machine of the present invention.

[0017] Figure 3 This is a structural diagram of the heating chamber of the vacuum device of the sputtering coating machine of the present invention.

[0018] Figure 4 This is a structural diagram of the anti-attachment plate of the vacuum device of the sputtering coating machine of the present invention.

[0019] Figure 5 It is a partial cross-sectional view of the vacuum device of the sputtering coating machine of the present invention.

[0020] Figure 6 This is a cross-sectional view of the clamping ring of the vacuum device of the sputtering coating machine of the present invention.

[0021] Main component symbols

[0022] Process chamber 1, first through hole 11, second through hole 12, wafer conveying port 13, observation window 14, wafer lifting mechanism 2, wafer lifting assembly 3, vacuum pump water cooling mechanism 4, vacuum gate valve mechanism 5, target opening and closing mechanism 6, upper adapter plate 8, first step 81, second step 82, ceramic ring 83, anti-plate clamp 84, anti-plate 85, first folded edge 851, side wall 852, bottom plate 853, second folded edge 854, clamping ring 86, third folded edge 861, groove 862, clamping part 863, clamping surface 8631, flipping mechanism 9.

[0023] The following specific implementation manner will further illustrate the present invention in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0024] like Figure 1 As shown, it is an overall cross-sectional view of the vacuum device of the sputtering coating machine of the present invention; Figure 2 As shown, it is the overall structure diagram of the vacuum device of the sputtering coating machine of the present invention; Figure 3 As shown in FIG. 1 , it is a heating chamber structure diagram of the vacuum device of the sputtering coating machine of the present invention; Figure 4 As shown in FIG. 1 , it is a structural diagram of the anti-attachment plate of the vacuum device of the sputtering coating machine of the present invention; Figure 5 As shown, it is a partial cross-sectional view of the vacuum device of the sputtering coating machine of the present invention; Figure 6 The figure shows a cross-sectional view of the clamping ring of the vacuum device of the sputtering coating machine of the present invention. Embodiment 1:

[0025] A vacuum device of a sputtering coating machine includes a process chamber 1, characterized in that: a first through hole 11 is opened at the bottom of the process chamber 1, a wafer lifting mechanism 2 is connected to the process chamber 1 through the first through hole 11, a second through hole 12 is opened at the bottom of the process chamber 1, the second through hole 12 is arranged on the side of the first through hole 11, a wafer lifting assembly 3 is connected to the process chamber 1 through the second through hole 12, a wafer conveying port 13 is arranged on one side of the process chamber 1, a vacuum pump water cooling mechanism 4 is arranged on the other side, a vacuum gate valve mechanism 5 is arranged between the vacuum pump water cooling mechanism 4 and the process chamber 1, for isolating the vacuum A pump water cooling mechanism 4 and a process chamber 1, a target opening and closing mechanism 6 is provided above the process chamber 1, and the target opening and closing mechanism 6 is flippably connected to the process chamber 1 through a flip mechanism 9 arranged on the side; an upper adapter plate 8 is provided between the top of the process chamber 1 and the target opening and closing mechanism 6, and the upper adapter plate 8 is a hollow annular structure, and a first step 81 is provided on the annular structure, and the first step 81 is connected to one end of an anti-sticking plate 85, and a clamping ring 86 is provided at the other end of the anti-sticking plate 85, and when the wafer lifting assembly 3 lifts the wafer upward to the clamping ring 86, the wafer is clamped and fixed between the clamping ring 86 and the tray through the clamping ring 86.

[0026] The anti-scratch plate 85 is a hollow annular structure, and includes a first folded edge 851, a side wall 852, a bottom plate 853, and a second folded edge 854. A first folded edge 851 folded outward is provided above the side wall 852 of the anti-scratch plate 85, and a second folded edge 854 folded upward is provided on the inner edge of the bottom plate 853 of the anti-scratch plate 85. The first folded edge 851 is connected to the first step 81, and the second folded edge 854 is clamped with the clamping ring 86.

[0027] The clamping ring 86 is a hollow annular structure and is provided with a third folded edge 861 folded outward for connecting with the bottom plate 853 of the anti-slip plate 85 . The clamping ring 86 is provided with a circle of grooves 862 , and the second folded edge 854 of the anti-slip plate 85 is clamped in the grooves 862 .

[0028] The inner edge of the top of the clamping ring 86 is provided with a downwardly bent clamping portion 863, and the clamping portion 863 includes a plurality of clamping surfaces 8631, and the clamping surfaces 8631 are arranged in sequence around the clamping portion 863 according to their sizes to accommodate wafers of different specifications.

[0029] The annular structure is also provided with a second step 82, which is located on the outer circle of the first step 81 and is higher than the first step 81. The second step 82 is provided with a circle of ceramic rings 83, which is used to make the process chamber 1 sealed when closed and resistant to high temperature when heated.

[0030] An anti-stick plate clamp 84 is provided above the first folded edge 851 of the anti-stick plate 85, one end of the anti-stick plate clamp 84 is clamped between the bottom surface of the ceramic ring 83 and the first folded edge 851, and the other end is placed on the inner side of the inner wall of the ceramic ring 83, so that the connection between the anti-stick plate 85 and the ceramic ring 83 is more stable.

[0031] The process chamber 1 is also provided with a heating device, and the outer wall 852 of the process chamber 1 is provided with a temperature sensor assembly for detecting the heating temperature in the chamber.

[0032] The side wall 852 of the process chamber 1 is also provided with an observation window 14, the inner side of the observation window 14 is a transparent window for easy observation of the situation in the chamber, and the outer side of the observation window 14 is hinged with a cover plate, which is closed during operation to shield the strong light generated during coating.

[0033] A magnet rotating mechanism is provided in the target opening and closing mechanism 6, and the magnet rotating mechanism includes a magnet and a rotating mechanism. The magnet is provided below the rotating mechanism, and the rotating mechanism passes through the upper cover plate in the target opening and closing mechanism 6 to be connected with the magnet. The rotating mechanism drives the magnet to rotate so that the magnetic field generated by the magnet rotates, so that the ion distribution in the process chamber 1 is more uniform, thereby making the coating more uniform.

[0034] Beneficial effects of the present invention: The present invention proposes a vacuum device of a sputtering coating machine, comprising a process chamber 1, a first through hole 11 is provided at the bottom of the process chamber 1, a wafer lifting mechanism 2 is connected to the process chamber 1 through the first through hole 11, a second through hole 12 is also provided at the bottom of the process chamber 1, the second through hole 12 is provided on the side of the first through hole 11, a wafer lifting assembly 3 is connected to the process chamber 1 through the second through hole 12, a wafer conveying port 13 is provided on one side of the process chamber 1, a vacuum pump water cooling mechanism 4 is provided on the other side, a vacuum gate valve mechanism 5 is provided between the vacuum pump water cooling mechanism 4 and the process chamber 1, for isolating the vacuum pump water cooling mechanism 4 The process chamber 1 is provided with a target opening and closing mechanism 6 above the process chamber 1, and the target opening and closing mechanism 6 is flippably connected to the process chamber 1 through a flipping mechanism 9 arranged on the side; an upper adapter plate 8 is provided between the top of the process chamber 1 and the target opening and closing mechanism 6, and the upper adapter plate 8 is a hollow annular structure, and a first step 81 is provided on the annular structure, and the first step 81 is connected to one end of an anti-sticking plate 85, and a clamping ring 86 is provided at the other end of the anti-sticking plate 85. When the wafer lifting assembly 3 lifts the wafer upward to the clamping ring 86, the wafer is clamped between the clamping ring 86 and the tray through the clamping ring 86 to fix it, so that the wafer will not be displaced during coating, thereby improving the coating accuracy.

[0035] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A vacuum device for a sputtering coating machine, comprising a process chamber (1), characterized in that: The process chamber (1) has a first through hole (11) at the bottom, the wafer lifting mechanism (2) is connected to the process chamber (1) via the first through hole (11), the process chamber (1) has a second through hole (12) at the bottom, the second through hole (12) is arranged on the side of the first through hole (11), the wafer lifting assembly (3) is connected to the process chamber (1) via the second through hole (12), one side of the process chamber (1) has a wafer conveying port (13), the other side has a vacuum pump water cooling mechanism (4), a vacuum gate valve mechanism (5) is provided between the vacuum pump water cooling mechanism (4) and the process chamber (1), and is used to separate the vacuum pump water cooling mechanism (4) from the process chamber (1), the process chamber (1) A target opening and closing mechanism (6) is provided on the top, and the target opening and closing mechanism (6) is connected to the process chamber (1) in a flippable manner via a flip mechanism (9) provided on the side; an upper adapter plate (8) is provided between the top of the process chamber (1) and the target opening and closing mechanism (6); the upper adapter plate (8) is a hollow annular structure, and a first step (81) is provided on the annular structure, and the first step (81) is connected to one end of an anti-sticking plate (85); a clamping ring (86) is provided at the other end of the anti-sticking plate (85); when the wafer lifting assembly (3) lifts the wafer upward to the clamping ring (86), the clamping ring (86) clamps the wafer between the clamping ring (86) and the tray to fix the wafer, so that the wafer will not be displaced during coating, thereby improving the coating accuracy.

2. The vacuum device of the sputtering coating machine as claimed in claim 1, characterized in that: The anti-scratch plate (85) is a hollow annular structure, comprising a first folded edge (851), a side wall (852), a bottom plate (853), and a second folded edge (854); a first folded edge (851) folded outward is provided above the side wall (852) of the anti-scratch plate (85); an inner edge of the bottom plate (853) of the anti-scratch plate (85) is provided with a second folded edge (854) folded upward; the first folded edge (851) is connected to the first step (81), and the second folded edge (854) is clamped to the clamping ring (86).

3. The vacuum device of the sputtering coating machine according to claim 1, characterized in that: The clamping ring (86) is a hollow annular structure. The clamping ring (86) is provided with a third folded edge (861) folded outwards and used to connect with the bottom plate (853) of the anti-slip plate (85). The clamping ring (86) is provided with a circle of grooves (862). The second folded edge (854) of the anti-slip plate (85) is clamped in the groove (862).

4. The vacuum device of the sputtering coating machine according to claim 1, characterized in that: The inner edge of the top of the clamping ring (86) is provided with a downwardly bent clamping portion (863), and the clamping portion (863) includes a plurality of clamping surfaces (8631). The clamping surfaces (8631) are arranged in sequence on the clamping portion (863) according to their sizes, so as to be suitable for wafers of different specifications.

5. The vacuum device of the sputtering coating machine as claimed in claim 1, characterized in that: The annular structure is also provided with a second step (82), the second step (82) being located on the outer ring of the first step (81) and higher than the first step (81), and the second step (82) is provided with a circle of ceramic rings (83) for making the process chamber (1) sealed when closed and making the process chamber (1) resistant to high temperatures when heated.

6. The vacuum device of the sputtering coating machine as claimed in claim 1, characterized in that: An anti-stick plate clamp (84) is provided above the first folded edge (851) of the anti-stick plate (85); one end of the anti-stick plate clamp (84) is clamped between the bottom surface of the ceramic ring (83) and the first folded edge (851), and the other end is placed on the inner side of the inner wall of the ceramic ring (83), so that the connection between the anti-stick plate (85) and the ceramic ring (83) is more stable.

7. The vacuum device of the sputtering coating machine as claimed in claim 1, characterized in that: A heating device is also provided in the process chamber (1), and a temperature sensor assembly is provided on the outer wall (852) of the process chamber (1) for detecting the temperature of the heating in the chamber.

8. The vacuum device of the sputtering coating machine as claimed in claim 1, characterized in that: The side wall (852) of the process chamber (1) is also provided with an observation window (14); the inner side of the observation window (14) is a transparent window, and the outer side of the observation window (14) is hinged with a cover plate.

9. The vacuum device of the sputtering coating machine according to claim 1, characterized in that: A magnet rotating mechanism is provided in the target opening and closing mechanism (6), and the magnet rotating mechanism comprises a magnet and a rotating mechanism. The magnet is provided below the rotating mechanism, and the rotating mechanism passes through an upper cover plate in the target opening and closing mechanism (6) and is connected to the magnet. The rotating mechanism drives the magnet to rotate so that the magnetic field generated by the magnet rotates, so that the ion distribution in the process chamber (1) is more uniform, thereby making the coating more uniform.

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